28V Operation Voltage Regulator with Voltage Detector
■GENERAL DESCRIPTION
The XC6408 series is a positive voltage regulator IC manufactured using CMOS process with 28V operation voltage. The series
consists of a voltage reference, an error amplifier, a current limiter, a thermal shutdown circuit and a phase compensation circuit
plus a driver transistor. The output voltage and the detect voltage are user selectable in 0.1V increments. The over current
protection circuit and the thermal shutdown circuit are built-in. These two protection circuits will operate when the output current
reaches current limit level or the junction temperature reaches temperature limit level. The XC6408D series monitors its output
voltage and provides reset signal if its output voltage falls below the pre-set voltage. This reset time (release delay time) can be
set by an external capacitor. The XC6408E series monitors an external power supply and enables the output to be turned off
and the IC becomes a stand-by mode.
■APPLICATIONS
● Note book computers, PDAs
●
Car audio, Car navigation systems
Home appliances
●
●
Audio visuals, Digital cameras, Video cameras
Cordless phones, Wireless communication
●
■
TYPICAL APPLICATION CIRCUITS
■FEATURES
Max Output Current :150mA (VIN=V
Dropout Voltage :175mV @I
Input Voltage Range :2.0V~28.0V
Output Voltage Range :2.0V~18.0V (0.1V increments)
Detect Voltage Range :2.0V~16.0V (0.1V increments)
High Accuracy(Regulator) :±2%
(Detector)
Low Power Consumption :XC6408D 9.5μA (TYP.)(V
XC6408E 8μA (TYP.)(V
Operating Temperature :-40℃~+85℃
Packages :SOT-89-5, SOT-25, USP-6C
Environmentally Friendly
■TYPICAL PERFORMANCE
CHARACTERISTICS
±2.5%
:EU RoHS Compliant, Pb Free
OUT
+3.0V)
ROUT
=20mA(V
ROUT
ROUT
=12V)
ROUT
●Supply Current vs. Input Voltage
15
XC6408E (V
=12.0V, VDF=11.0V)
ROUT
=12V, VDF=11V)
=12V, VDF=11V)
(μA)
SS
10
XC6408D Series
XC6408E Series
(uA)
SS
I
5
Supply Current: I
0
0 4 8 1216202428
(V)
V
IN
Input Voltage: VIN (V)
1/34
XC6408 Series
■PIN CONFIGURATION
* The dissipation pad for the USP-6C package should be solder-plated in reference mount pattern and metal
masking to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should
be connected to the V
■PIN ASSIGNMENT
SOT-89-5 SOT-25 USP-6C
SS (No. 5) pin.
PIN NUMBER
1 5 1 V
2 2 5 VSS Ground
3 4 3
4 3 4 V
5 1 6 VIN Power Input
- - 2 NC
PIN NAMEFUNCTIONS
VR Output
ROUT
V
Sense(E series)
SEN
Cd Delay Capacitor(D series)
VD Output
DOUT
No connection
NC
2/34
■ PRODUCT CLASSIFICATION
●Selection Guide
XC6408
Series
XC6408D Series: V XC6408E Series: V
pin voltage detection, release delay capacitor
ROUT
pin for external voltage detection, auto power ON/OFF function
SEN
●Ordering Information
XC6408D①②③④⑤-⑥
DESIGNATOR ITEM SYMBOL DESCRIPTION
①
②③
④⑤-⑥
(*1)
The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.
DESIGNATOR②③ (No. 01~20 is standard voltage)
②③
01
02
03
04
05
06
07
08
09
10
For other voltage, please contact your local Torex sales office or representative.
(*1)
V
DOUT
Output Configuration
Output Voltage
Detect Voltage
Packages
(Oder Unit)
V
VDF
ROUT
N Open Drain
-
ER-G USP-6C (3,000/Reel)
MR-G SOT-25 (3,000/Reel)
PR-G SOT-89-5 (1,000/Reel)
2.50 2.10
3.00 2.50
3.30 2.70
3.30 2.80
5.00 4.10
5.00 4.20
8.00 6.80
9.00 5.00
9.00 7.50
12.00 10.00
Sequential number relating to output voltage and detect
voltage (refer to the chart below)
V
Output Voltage Range: 2.0V~18.0V
ROUT
Detect Voltage Range: 2.0V~16.0V
V
DF
Output voltage and detect voltage can be set in 0.1V increments
②③
11
12
13
14
15
16
17
18
19
20
V
ROUT
-
-
-
-
-
-
-
-
-
-
VDF
----------
3/34
XC6408 Series
■ PRODUCT CLASSIFICATION
●Ordering Information
XC6408E①②③④⑤-⑥
DESIGNATOR ITEM SYMBOL DESCRIPTION
①
②③
④⑤-⑥
(*1)
The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.
DESIGNATOR②③ (No. 01~20 is standard voltage)
②③
01
02
03
04
05
06
07
08
09
10
For other voltage, please contact your local Torex sales office or representative.
(*1)
V
DOUT
Output Configuration
Output Voltage
Detect Voltage
Packages
(Oder Unit)
V
VDF
ROUT
N Open Drain
-
ER-G USP-6C (3,000/Reel)
MR-G SOT-25 (3,000/Reel)
PR-G SOT-89-5 (1,000/Reel)
2.50 2.10
3.00 2.50
3.30 2.70
3.30 2.80
5.00 4.10
5.00 4.20
8.00 6.80
9.00 5.00
9.00 7.50
12.00 10.00
Sequential number relating to output voltage and detect
voltage (refer to the chart below)
V
Output Voltage Range: 2.0V~18.0V
ROUT
VDF Detect Voltage Range: 2.0V~16.0V
Output voltage and detect voltage can be set in 0.1V increments
②③
11
12
13
14
15
16
17
18
19
20
V
ROUT
2.50 2.70
2.50 2.80
3.00 4.10
3.00 4.20
3.30 4.10
3.30 4.20
5.00 5.60
5.00 6.80
9.00 10.00
12.00 15.00
VDF
4/34
■ BLOCK DIAGRAMS
XC6408 D Type
XC6408
Series
XC6408 E Type
*Diodes inside the circuit are an ESD protection diode and a parasitic diode.
5/34
XC6408 Series
■ABSOLUTE MAXIMUM RATINGS
●XC6408D Series
Power Dissipation
Operating Temperature Range Topr
PAR AMETER SYMBOLRATINGS UNITS
Input Voltage VIN
Delay Capacitor Voltage VCd
-0.3~+30
V
SS
-0.3~VIN+0.3
V
SS
V
V
Delay Capacitor Current ICd 5.0 mA
V
Output Current I
ROUT
V
Output Current I
DOUT
V
Output Voltage V
ROUT
V
Output Voltage V
DOUT
ROUT
DOUT
ROUT
DOUT
USP-6C
SOT-25
Pd
SOT-89-5
Storage Temperature Range Tstg
210
(*1)
20 mA
-0.3~VIN+0.3
V
SS
-0.3~+30
V
SS
120
(*2)
1000 (PCB mounted)
250
(*2)
600 (PCB mounted)
500
1300 (PCB mounted)
(*2)
-40~+85
-55~+125
mA
V
V
mW
o
C
oC
*1: I
≦Pd / (VIN-V
OUT
*2: The power dissipation figure shown is PCB mounted. Please refer to page 30~32 for details.
ROUT
)
●XC6408E
Power Dissipation
Operating Temperature Range Topr
*1: Pd>(V
*2: The power dissipation figure shown is PCB mounted. Please refer to page 30~32 for details.
PAR AMETER SYMBOLRATINGS UNITS
Input Voltage VIN
Sense Voltage V
V
Output Current I
ROUT
V
Output Current I
DOUT
V
Output Voltage V
ROUT
V
Output Voltage V
DOUT
USP-6C
SOT-25
SOT-89-5
SEN
ROUT
20 mA
DOUT
ROUT
DOUT
1000 (PCB mounted)
Pd
600 (PCB mounted)
1300 (PCB mounted)
-0.3~+30
V
SS
-0.3~+30
V
SS
(*1)
210
-0.3~VIN+0.3
V
SS
-0.3~+30
V
SS
120
250
500
(*2)
(*2)
(*2)
-40~+85
Storage Temperature Range Tstg
IN-VROUT
)×I
ROUT
-55~+125
V
V
mA
V
V
mW
o
C
oC
6/34
■ELECTRICAL CHARACTERISTICS
●XC6408D Series
PARAMETER SYMBOL CONDITIONS
2.0V≦V
ROUT(T)
Supply Current ISS
VR Output Voltage
VR
Maximum Output Current
V
ROUT(E)
I
ROUTMAX
Load Regulation ΔV
(*2)
ROUT
5.1V≦V
12.1V≦V
VIN=V
(V
ROUT (T)
V
IN=VROUT(T)
(V
1mA≦I
(2.0V≦V
1mA≦I
(5.0V<V
ROUT(T)
ROUT(T)
I
OUT
ROUT(T)
ROUT(T)
ROUT(T)
ROUT (T)
≦12.0V
=20mA
≧3.0V)
<3.0V)
≦50mA
ROUT
≦50mA
ROUT
≦12.0V)
≦5.0V
≦18.0V
+3.0V,
(*1)
+3.0V,
(*1)
≦5.0V)
MIN. TYP. MAX.
(*1)
1.5 9.6 20.5
(*1)
2.3 10 25.3
(*1)
2.5 14.3 28.1
V
×0.98
ROUT(T)
(*1)
(E-1)
(*1)
(*1)
150 - -
100 - -
-
-
V
V
ROUT(T)
(E-1)
(*1)
ROUT(T)
(E-1)
×1.02
(*1)
25 50
60 120
XC6408
UNITSCIRCUIT
μA ②
V ①
mA ①
mV ①
Series
Ta =2 5℃
≦50mA
ROUT
≦18.0V)
ROUT (T)
=20mA,
ROUT
=100mA
ROUT
+2.0V≦VIN≦28V
I
=5mA
ROUT
+2.0V≦VIN≦28V
I
=13mA
ROUT
(*1)-
(*1)
0.01 0.05 0.10 %/V ①
(*1)
0.03 0.15 0.30 %/V ①
90 160
-
-
E-4 mV ①
E-5 mV ①
Dropout Voltage1
Regulator Block
Dropout Voltage2
Line Regulation1
Line Regulation2
(*3)
Vdif1
(*3)
Vdif2
(ΔV
(ΔV
(12.0V<V
(*3)
I
(*3)
I
V
/
ΔV
ROUT
IN・VROUT
ΔV
ROUT
IN・VROUT
/
ROUT(T)
)
V
ROUT(T)
)
1mA≦I
Input Voltage VIN 2.0 - 28.0 V -
Output Voltage
Temperature Characteristics
Short Current I
VD Detect Voltage V
Hysteresis Width V
Output Current I
Output Leakage Current I
Detect Voltage
Detector Block
Temperature
Characteristics
/
ROUT
・
V
(ΔTopr
ΔV
(ΔTopr・V
)
ROUT
V
RSHORT
(*2)
DF(E)
E-3 V ③
HYS
DOUT
VIN=28V, Cd=0V ,VDS=28V- - 0.1 μA ④
DLEAK
/
DOUT
)
DOUT
I
=20mA,
ROUT
-40℃≦To pr ≦85℃
(*1)
V
IN
+2V
=3.0V,
DS
=0.5V
SEN=VDF(T)
Cd=0V ,V
-
- 30 - mA ①
V
×0.975
DF(T)
(*1)
(E-2)
0.3 0.5 - mA ④
±100 - ppm/℃①
V
V
DF(T)
(E-2)
(*1)
×1.025
DF(T)
(E-2)
(*1)
-40℃≦To pr ≦85℃ - ±100 - ppm/℃③
ΔV
Release Delay Time tDR Cap=1000pF 3.4 6.0 15.6 ms ⑤
V ③
Thermal Shutdown
Detect Temperature
Thermal Shutdown Release
Temperature
Hysteresis Width T
*1: V
*2: V
*3: Vdif={V
*4: V
*5: V
*6: Unless otherwise stated, V
: Nominal output voltage, V
ROUT(T)
: Effective output voltage , V
ROUT(E)
ROUT1
IN1
{*5}
-V
IN1
: In case of V
In case of V
:The input voltage when V
ROUT1
T
Junction Temperature - 150 - ℃ ①
TSD
T
Junction Temperature - 125 - ℃ ①
TSR
- T
TSR
{*4}
}
<3.0V, the VOUT1 is equal to 98% of the I
ROUT(T)
≧3.0V, the VOUT1 is equal to 98% of the I
ROUT(T)
IN=VROUT(T)
Junction Temperature - 25 - ℃ -
TSD
: Nominal detect voltage
DF(T)
: Effective detect voltage
DF(E)
appears as input voltage is gradually decreased.
ROUT1
+2.0V
when a stabilized input voltage is applied in V
ROUT(T)
when a stabilized input voltage is applied in V
ROUT(T)
ROUT(T)
ROUT(T)
+3.0V.
+2.0V.
7/34
XC6408 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XC6408E Series
PARAMETER SYMBOL CONDITIONS
(2.0V≦V
Supply Current ISS
VD Supply Current I
VR
Output Voltage
VR
Maximum Output Current
V
ROUT(E)
I
V
DSS
ROUTMAX
(*2)
(5.1V≦V
(
12.1V≦V
(2.0≦V
Load Regulation ΔV
ROUT
(5.0<V
(12.0<V
Dropout Voltage1
Dropout Voltage2
Regulator Block
Line Regulation1
Line Regulation2
(*3)
Vdif1
(*3)
Vdif2
(ΔV
(ΔV
(*3)
I
(*3)
I
/
ΔV
ROUT
IN・VROUT
ΔV
ROUT
IN・VROUT
V
ROUT(T)
)
/
V
ROUT (T)
)
Input Voltage VIN 2.0 - 28.0 V -
Output Voltage
Temperature
Characteristics
Short Current I
VD Detect Voltage V
Hysteresis Width V
Output Current I
Output Leakage Current
Detect Voltage
Detector Block
Temperature
Characteristics
SENSE
Input Current
Thermal Shutdown
Detect Temperature
Thermal Shutdown
Release Temperature
Hysteresis WidthT
ΔV
ROUT
・
(ΔTopr
RSHORT
DF(E)
HYS
DOUT
I
DLEAK
ΔV
DOUT
(ΔTopr・V
I
SENSE
T
TSD
T
TSR
- T
TSR
/
V
)
ROUT
V
(*2)
(E-3) V ③
V
VIN=3.0V, V
IN
/
)
DOUT
V
Junction Temperature - 150 - ℃ ①
Junction Temperature - 125 - ℃ ①
Junction Temperature - 25 - ℃ -
TSD
*1: V
*2: V
*3: Vdif={V
*4: V
*5: V
*6: Unless otherwise stated, V
: Nominal output voltage, V
ROUT(T)
: Effective output voltage , V
ROUT(E)
ROUT1
IN1
{*5}
-V
IN1
: In case of V
In case of V
:The input voltage when V
ROUT1
{*4}
ROUT(T)
ROUT(T)
}
: Nominal detect voltage
DF(T)
: Effective detect voltage
DF(E)
<3.0V, the VOUT1 is equal to 98% of the I
≧3.0V, the VOUT1 is equal to 98% of the I
appears as input voltage is gradually decreased.
ROUT1
IN=VROUT(T)
+2.0V
V
SEN=VDF(T)
V
SEN=VDF(T)
V
SEN=VDF(T)
V
SEN=VDF(T)
I
VIN=V
V
SEN=VDF(T)
(V
V
IN=VROUT(T)
V
SEN=VDF(T)
(V
ROUT(T)
V
SEN=VDF(T)
1mA≦I
V
SEN=VDF(T)
1mA≦I
V
SEN=VDF(T)
1mA≦I
ROUT
V
SEN=VDF(T)
+2.0V≦VIN≦28V
V
SEN=VDF(T)
+2.0V≦VIN≦28V
I
V
SEN=VDF(T)
I
-40℃≦Topr≦85℃
SEN=VDF(T)
=28V,V
ROUT(T)
ROUT(T)
ROUT(T)
SEN=VSS
ROUT
ROUT(T)
ROUT(T)
+2.0V
≦5.0V)
+2.0V
≦12.0V)
+2.0V
≦
+2.0V
=20mA
+3.0V
+2.0V
≧3.0V)
+3.0V
+2.0V
<3.0V)
18.0V
(*1)
(*1)
(*1)
(*1)
(*1)
(*1)
)
+2.0V
≦50mA
ROUT
ROUT(T)
≦5.0V)
(*1)
+2.0V
≦50mA
ROUT
ROUT(T)
≦12.0V)
(*1)
+2.0V
≦50mA
ROUT
≦18.0V)
ROUT(T)
=20mA - (E-4) mV ①
ROUT
(*1)
=100mA - (E-5) mV ①
+2.0V
I
=5mA
ROUT
+2.0V
=13mA
ROUT
+2.0V
=20mA
ROUT
+2.0V
SEN=VDF(T)
VDS=0.5V
=0V,VDS=28V- - 0.1 μA ④
SEN
(*1)
(*1)
(*1)
(*1)
- 30 - mA ①
(*1)
-0.4V
-40℃≦Topr≦85℃ -
(*1)
SEN=VDF(T)
+2.0V
(E-6) μA ⑥
when a stabilized input voltage is applied in V
ROUT(T)
when a stabilized input voltage is applied in V
ROUT(T)
MIN. TYP. MAX.
1.5 6.5 17.6
2.1 8 17.6
2.2 8.5 17.6
- 1.5 3.9 μA ②
V
×
0.98
ROUT(T)
(*1)
(E-1)
150 - -
100 - -
-
-
-
0.01 0.05 0.10 %/V ①
0.03 0.15 0.30 %/V ①
-
V
x 0.975
DF(T)
(*1)
(E-2)
0.3 0.5 - mA ④
V
ROUT(T)
(E-1)
(*1)
V
ROUT(T)
(E-1)
×
1.02
(*1)
25 50
60 120
90 160
±100-
V
V
×
DF(T)
(E-2)
(*1)
DF(T)
(E-2)
1.025
(*1)
±100-
UNITSCIRCUIT
μA ②
V ①
mA ①
mV ①
ppm
/℃
V ③
ppm
/℃
+3.0V.
ROUT(T)
+2.0V.
ROUT(T)
Ta =2 5℃
①
③
8/34
■ELECTRICAL CHARACTERISTICS (Continued)
●Voltage Chart
(*1)V
VR OUTPUT VOLTAGE
VD DETECT VOLTAGE
: Accuracy ±2%, VDF: Accuracy ±2.5%
ROUT
SYMBOL E-1 E-2 E-3 E-4 E-5 E-6
NOMINAL
(V)
V
ROUT(T)
V
DF(T)
2.0 1.960 2.040 1.950 2.050
2.1 2.058 2.142 2.048 2.153
2.2 2.156 2.244 2.145 2.255
2.3 2.254 2.346 2.243 2.358
2.4 2.352 2.448 2.340 2.460
2.5 2.450 2.550 2.438 2.563
2.6 2.548 2.652 2.535 2.665
2.7 2.646 2.754 2.633 2.768
2.8 2.744 2.856 2.730 2.870
2.9 2.842 2.958 2.828 2.973
3.0 2.940 3.060 2.925 3.075
3.1 3.038 3.162 3.023 3.178
3.2 3.136 3.264 3.120 3.280
3.3 3.234 3.366 3.218 3.383
3.4 3.332 3.468 3.315 3.485
3.5 3.430 3.570 3.413 3.588
3.6 3.528 3.672 3.510 3.690
3.7 3.626 3.774 3.608 3.793
3.8 3.724 3.876 3.705 3.895
3.9 3.822 3.978 3.803 3.998
4.0 3.920 4.080 3.900 4.100
4.1 4.018 4.182 3.998 4.203
4.2 4.116 4.284 4.095 4.305
4.3 4.214 4.386 4.193 4.408
4.4 4.312 4.488 4.290 4.510
4.5 4.410 4.590 4.388 4.613
4.6 4.508 4.692 4.485 4.715
4.7 4.606 4.794 4.583 4.818
4.8 4.704 4.896 4.680 4.920
4.9 4.802 4.998 4.778 5.023
5.0 4.900 5.100 4.875 5.125
5.1 4.998 5.202 4.973 5.228
5.2 5.096 5.304 5.070 5.330
5.3 5.194 5.406 5.168 5.433
5.4 5.292 5.508 5.265 5.535
5.5 5.390 5.610 5.363 5.638
5.6 5.488 5.712 5.460 5.740
5.7 5.586 5.814 5.558 5.843
5.8 5.684 5.916 5.655 5.945
5.9 5.782 6.018 5.753 6.048
VR
OUTPUT VOLTAGE
(V)
V
V
ROUT(E)
MIN. MAX. MIN. MAX.MIN. MAX. TYPMAX TYP MAX MINMAX
VD
DETECT VOLTAGE
(V)
V
DF(E)
HYSTERESIS WIDTH
(V)
Vdif1 Vdif2 Isense
HYS
V
×2%V
DF(E)
DF(E)
×8%
XC6408
Series
DROPOUT
VOLTAGE1
I
=20mA
ROUT
(mV)
5006802300 3300
4306001950 2950
3605301550 2550
2503801100 1800
230350850 1650
180300750 1350 0.1 4.1
DROPOUT
VOLTAGE2
I
=100mA
ROUT
(mV)
SENSE
INPUT CURRENT
(μA)
0.1 2.2
9/34
XC6408 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●Voltage Chart (Continued)
(*1)V
: Accuracy ±2%, VDF: Accuracy ±2.5%
ROUT
SYMBOL E-1 E-2 E-3 E-4 E-5 E-6
NOMINAL
VR OUTPUT VOLTAGE
VD DETECT VOLTAGE
(V)
V
ROUT(T)
V
DF(T)
VR
OUTPUT VOLTAGE
(V)
V
V
ROUT(E)
VD
DETECT VOLTAGE
(V)
V
DF(E)
HYSTERESIS WIDTH
(V)
Vdif1 Vdif2 Isense
HYS
MIN. MAX. MIN. MAX.MIN. MAX. TYPMAX TYP MAX MINMAX
6.0 5.880 6.120 5.850 6.150
6.1 5.978 6.222 5.948 6.253
6.2 6.076 6.324 6.045 6.355
6.3 6.174 6.426 6.143 6.458
6.4 6.272 6.528 6.240 6.560
6.5 6.370 6.630 6.338 6.663
6.6 6.468 6.732 6.435 6.765
6.7 6.566 6.834 6.533 6.868
6.8 6.664 6.936 6.630 6.970
6.9 6.762 7.038 6.728 7.073
7.0 6.860 7.140 6.825 7.175
7.1 6.958 7.242 6.923 7.278
7.2 7.056 7.344 7.020 7.380
7.3 7.154 7.446 7.118 7.483
7.4 7.252 7.548 7.215 7.585
7.5 7.350 7.650 7.313 7.688
7.6 7.448 7.752 7.410 7.790
7.7 7.546 7.854 7.508 7.893
7.8 7.644 7.956 7.605 7.995
7.9 7.742 8.058 7.703 8.098
8.0 7.840 8.160 7.800 8.200
DF(E)
×2%V
DF(E)
×8%
V
8.1 7.938 8.262 7.898 8.303
8.2 8.036 8.364 7.995 8.405
8.3 8.134 8.466 8.093 8.508
8.4 8.232 8.568 8.190 8.610
8.5 8.330 8.670 8.288 8.713
8.6 8.428 8.772 8.385 8.815
8.7 8.526 8.874 8.483 8.918
8.8 8.624 8.976 8.580 9.020
8.9 8.722 9.078 8.678 9.123
9.0 8.820 9.180 8.775 9.225
9.1 8.918 9.282 8.873 9.328
9.2 9.016 9.384 8.970 9.430
9.3 9.114 9.486 9.068 9.533
9.4 9.212 9.588 9.165 9.635
9.5 9.310 9.690 9.263 9.738
9.6 9.408 9.792 9.360 9.840
9.7 9.506 9.894 9.458 9.943
9.8 9.604 9.996 9.555 10.045
9.9 9.702 10.098 9.653 10.148
10.0 9.800 10.200 9.750 10.250
DROPOUT
VOLTAGE1
I
=20mA
ROUT
(mV)
DROPOUT
VOLTAGE2
I
=100mA
ROUT
(mV)
180300750 1350
160 260650 1150
160230 450 950
SENSE
INPUT
CURRENT
(μA)
0.1 4.1
10/34
)
■ELECTRICAL CHARACTERISTICS (Continued
(*1)V
: Accuracy ±2%, VDF: Accuracy ±2.5%
ROUT
SYMBOL E-1 E-2 E-3 E-4 E-5 E-6
NOMINAL
VR OUTPUT VOLTAGE
VD DETECT VOLTAGE
(V)
V
ROUT(T)
V
DF(T)
VR
OUTPUT VOLTAGE
(V)
V
V
ROUT(E)
VD
DETECT VOLTAGE
(V)
V
DF(E)
HYSTERESIS WIDTH
(V)
Vdif1 Vdif2 Isense
HYS
VOLTAGE1
I
=20mA
ROUT
(mV)
MIN. MAX. MIN. MIN. MIN. MIN. TYPMAX TYP MAX MINMAX
DROPOUT
DROPOUT
VOLTAGE2
I
=100mA
ROUT
(mV)
10.1 9.898 10.302 9.848 10.353
10.2 9.996 10.404 9.945 10.455
10.3 10.094 10.506 10.043 10.558
10.4 10.192 10.608 10.140 10.660
10.5 10.290 10.710 10.238 10.763
×2% V
DF(E)
DF(E)
×8%
V
10.6 10.388 10.812 10.335 10.865
10.7 10.486 10.914 10.433 10.968
10.8 10.584 11.016 10.530 11.070
10.9 10.682 11.118 10.628 11.173
11.0 10.780 11.220 10.725 11.275
11.1 10.878 11.322 10.823 11.378
150200 400 850 0.1 4.1
11.2 10.976 11.424 10.920 11.480
11.3 11.074 11.526 11.018 11.583
11.4 11.172 11.628 11.115 11.685
11.5 11.270 11.730 11.213 11.788
11.6 11.368 11.832 11.310 11.890
11.7 11.466 11.934 11.408 11.993
11.8 11.564 12.036 11.505 12.095
11.9 11.662 12.138 11.603 12.198
12.0 11.760 12.240 11.700 12.300
12.1 11.858 12.342 11.798 12.403
12.2 11.956 12.444 11.895 12.505
12.3 12.054 12.546 11.993 12.608
12.4 12.152 12.648 12.090 12.710
12.5 12.250 12.750 12.188 12.813
×1% V
V
DF(E)
DF(E)
×7%
12.6 12.348 12.852 12.285 12.915
12.7 12.446 12.954 12.383 13.018
12.8 12.544 13.056 12.480 13.120
12.9 12.642 13.158 12.578 13.223
13.0 12.740 13.260 12.675 13.325
13.1 12.838 13.362 12.773 13.428
120170 350 800 0.6 6.6
13.2 12.936 13.464 12.870 13.530
13.3 13.034 13.566 12.968 13.633
13.4 13.132 13.668 13.065 13.735
13.5 13.230 13.770 13.163 13.838
13.6 13.328 13.872 13.260 13.940
13.7 13.426 13.974 13.358 14.043
13.8 13.524 14.076 13.455 14.145
13.9 13.622 14.178 13.553 14.248
14.0 13.720 14.280 13.650 14.350
XC6408
Series
SENSE
INPUT CURRENT
(μA)
11/34
)
XC6408 Series
■ELECTRICAL CHARACTERISTICS (Continued
(*1)V
VR OUTPUT VOLTAGE
VD DETECT VOLTAGE
: Accuracy ±2%, VDF: Accuracy ±2.5%
ROUT
SYMBOL E-1 E-2 E-3 E-4 E-5 E-6
NOMINAL
(V)
V
ROUT(T)
V
DF(T)
14.1 13.818 14.382 13.748 14.453
14.2 13.916 14.484 13.845 14.555
14.3 14.014 14.586 13.943 14.658
14.4 14.112 14.688 14.040 14.760
14.5 14.210 14.790 14.138 14.863
14.6 14.308 14.892 14.235 14.965
14.7 14.406 14.994 14.333 15.068
14.8 14.504 15.096 14.430 15.170
14.9 14.602 15.198 14.528 15.273
15.0 14.700 15.300 14.625 15.375
15.1 14.798 15.402 14.723 15.478
15.2 14.896 15.504 14.820 15.580
15.3 14.994 15.606 14.918 15.683
15.4 15.092 15.708 15.015 15.785
15.5 15.190 15.810 15.113 15.888
15.6 15.288 15.912 15.210 15.990
15.7 15.386 16.014 15.308 16.093
15.8 15.484 16.116 15.405 16.195
15.9 15.582 16.218 15.503 16.298
16.0 15.680 16.320 15.600 16.400
16.1 15.778 16.422
16.2 15.876 16.524
16.3 15.974 16.626
16.4 16.072 16.728
16.5 16.170 16.830
16.6 16.268 16.932
16.7 16.366 17.034
16.8 16.464 17.136
16.9 16.562 17.238
17.0 16.660 17.340
17.1 16.758 17.442
17.2 16.856 17.544
17.3 16.954 17.646
17.4 17.052 17.748
17.5 17.150 17.850
17.6 17.248 17.952
17.7 17.346 18.054
17.8 17.444 18.156
17.9 17.542 18.258
18.0 17.640 18.360
VR
OUTPUT VOLTAGE
(V)
V
V
ROUT(E)
MIN. MAX. MIN. MAX.MIN. MAX. TYPMAX TYP MAX MINMAX
VD
DETECT VOLTAGE
(V)
V
DF(E)
HYSTERESIS WIDTH
(V)
Vdif1 Vdif2 Isense
HYS
×1%V
V
DF(E)
DF(E)
×7%
DROPOUT
VOLTAGE1
I
=20mA
ROUT
(mV)
120 170 350 800
I
ROUT
DROPOUT
VOLTAGE2
=100mA
(mV)
SENSE
INPUT
CURRENT
(μA)
0.6 6.6
12/34
XC6408
■ OPERATIONAL EXPLANATION
XC6408 D Series
<Voltage Regulator>
The voltage divided by resistors R11 & R12 is compared with the internal reference voltage by the error amplifier. The
P-channel MOSFET which is connected to the V
at the V
and thermal protection circuit operate in relation to the level of output current and heat generation. For the XC6408E,
regulator operation returns active state when V
is higher than VD detect voltage + hysteresis width).
<Limit Current, Short-Circuit Protection>
The XC6408 series includes a current fold-back circuit as a short circuit protection. When the load current reaches the
current limit, the current fold-back circuit starts to operate. As a result, the output voltage drops further and output current
decreases. When the V
<Thermal Protection>
When the junction temperature of the built-in driver transistor reaches the temperature limit, the thermal shutdown circuit
operates and the driver transistor will be set to OFF. The IC resumes its operation when the thermal shutdown function is
released and the IC’s operation is automatically restored because the junction temperature drops to the level of the thermal
shutdown release voltage.
<Minimum Operating Voltage>
For the stable operation of the IC, over 2.0V of input voltage is necessary. The output voltage may not be generated
pin is controlled and stabilized by a system of negative feedback. The current limit circuit, short protect circuit
ROUT
pin is short-circuited, a flow current minimizes to around 30mA.
ROUT
pin is then driven by the subsequent output signal. The output voltage
ROUT
pin voltage rises higher than the release voltage (*when V
SEN
normally if the input voltage is less than 2.0V.
XC6408 E Series
pin voltage
SEN
Series
13/34
XC6408 Series
■ OPERATIONAL EXPLANATION (Continued)
<Voltage detector>
The detector function of the XC6408 series has hysteresis, and when the VD detected voltage rises higher than the release
voltage (about 105% (TYP.) of the detect voltage), the output of the V
(D series)
The detector function of the XC6408D series is connected to the V
voltage.
The voltage divided by the detector’s internal resistance which is connected to the V
reference voltage, and if the voltage of the V
A capacitor (Cd) can be connected to the Cd pin to add a delay time to the output signal of the V
The delay time is determined by the constant current value determined by the internal current generator circuit, and the Cd
capacitance value. The relationship between the Cd capacitance value and the release delay time is shown below.
(E series)
The detector function of the XC6408E series detects the V
The voltage divided by the detector internal resistance that is connected to the V
reference voltage, and if the voltage of the V
pin falls below the threshold value, low level signal is output from V
ROUT
pin voltage.
SEN
pin falls below the threshold value, low level signal is output from V
SEN
●Release Delay Time vs. Cd connected Capacitance
XC6408D series
pin inverts.
DOUT
pin inside the IC and detects the V
ROUT
pin is compared to the IC internal
ROUT
DOUT
pin is compared to the IC internal
SEN
ROUT
DOUT
pin at voltage release.
DOUT
output
.
.
14/34
100000
10000
1000
100
Release Delay TIME(μs)
10
10100100010000
Cd connencted Capacitance (pF)
XC6408
Series
■ NOTES ON USE
1. Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising
phenomenon, the IC is liable to malfunction should the ratings be exceeded.
2. The power input pin voltage will falls down because of a resistance between power supply and power input pin and shoot
through current when IC operates. At this time, if the power input pin voltage is lower than operating voltage range, the IC
may cause device malfunction.
3. Please note if the power input pin voltage will fluctuated, the IC may cause device malfunction.
4. If assumed the power input pin voltage falls suddenly (e.g. falls from 28.0V to 0V) at release operation when VD delay
capacitor pin is connected to a capacitor, please connect a schottky barrier diode between the power input pin and delay
capacitance pin. Please refer below; (XC6408D).
5. The V
the output pin.
* When the pull-up resistor connects to another power supply, high level value will be equal to the voltage which the pull-up
resistor is connected.
6. If the input voltage fluctuates more than 1.5V in the speed higher than 100mV/μs, the output voltage may fluctuate widely.
In this case, one capacitor should be added between VIN-VSS to adjust the input fluctuation speed less than 100mV/μs.
7. For a delay capacitor pin of the XC6408D is designed in high impedance. When this pin is left open for use, the IC may
get noise. It is recommended that a capacitor more than 3pF is connected to the delay capacitor pin.
8. Phase compensation is performed in the XC6408 inside. Therefore, an abnormal oscillation does not occur even if there is
no output capacitor C
input stability. Also, the output voltage fluctuation such as under shoot or over shoot, which occurs because of the load
change can be controlled by placing the output capacitor C
The input capacitor (C
9. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
output is configured as N-ch open drain, so please use a pull-up resistance more than 100kΩ for connecting to
DOUT
. An input capacitor CIN around 0.1μF~1.0μF between the VIN pin and the VSS pin is required for
L
around 0.1μF~1.0μF between the V
L
) and the output capacitor (CL) should be placed to the IC as close as possible with a shorter wiring.
IN
V
IN
R=100kΩ
pin and VSS pin.
ROUT
V
V
IN
DOUT
Cd
V
Cap
e.g. A circuit which delay capacitance pin is connected to a schottky barrier diode.
(11) Cd Pin Current(12) VD N-ch Driver Output Current vs. N-ch Driver V
XC6408D
0.40
0.35
0.30
0.25
0.20
0.15
Cd Curre nt : Icd(u A)
0.10
0.05
0.00
0 4 8 121620 2428
Ta=-40℃
Ta=25℃
Ta=85℃
Input Voltage : V
(V)
IN
25
20
(mA)
DOUT
15
10
5
VD Output Cu rr ent : I
0
051015202530
XC6408D/E
VD Output Voltage : V
DOUT
VIN=2.0V
VIN=12 V
VIN=28 V
(V)
DS
26/34
■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
● XC6408 Series
(13) VD N-ch Driver Output Current vs. Input Voltage
XC6408
Series
XC6408D/E (VDF=2.0V, VDS=0.5V)
0.5
0.4
(mA)
DOUT
0.3
Ta=-40℃
Ta=25℃
Ta=85℃
0.2
0.1
VD Output Curren t : I
0.0
0.00.51.01.52.0
Input Voltage : V
(V)
IN
(14) Detect Voltage vs. Ambient Temperature
Release Voltage vs. Ambient Temperature
XC6408D/E (VDF=2.0V)
2.2
2.15
2.1
(V)
(V)
DR
DF
2.05
2
1.95
Detect Voltage : V
Release Vo ltage : V
1.9
1.85
1.8
-50-250255075100
Ambient Temperature : Ta(℃)
VDF
VDR
XC6408D/E (VDF=12.0V, VDS=0.5V)
1.5
Ta=-40 ℃
1.2
(mA)
DOUT
0.9
Ta=25℃
Ta=85℃
0.6
0.3
VD Output Curren t : I
0.0
024681012
Input Voltage : V
(V)
IN
XC6408D/E (VDF=4.5V)
4.95
4.85
4.75
(V)
(V)
DR
DF
4.65
VDF
VDR
4.55
4.45
4.35
Detect Vo ltage : V
Release Voltage : V
4.25
4.15
4.05
-50-250 255075100
Ambient Temperature : Ta(℃)
XC6408D/E (VDF=11V)
12.1
11.9
11.7
(V)
(V)
11.5
DR
DF
11.3
11.1
10.9
10.7
10.5
Detect Vo ltage : V
Release Voltage : V
10.3
10.1
9.9
-50-250255075100
Ambient Temperature : Ta(℃)
VDF
VDR
XC6408D/E (VDF=16V)
17.6
17.2
16.8
(V)
(V)
DR
DF
16.4
VDF
VDR
16
15.6
Detect Voltage : V
15.2
Re lease Vo ltage : V
14.8
14.4
-50-250255075100
Ambient Temperature : Ta(℃)
27/34
XC6408 Series
■PACKAGING INFORMATION
●USP-6C
●SOT-25
+0.2
-0.1
1.6
2.8±0.2
0.2MIN
●SOT-89-5
(unit : mm)
0.42±0.06
5
(0.4)
123
0.42±0.060.42±0.060.47±0.06
4.5±0.1
+0.15
1.6
-0.2
0.42±0.06
2
Φ1.0
4
0.42±0.06
1.3MAX
1.1±0.1
+0.03
0.4
-0.02
0.8 MIN
2.5±0.10.8 MIN
4.35 MAX
5°
5°
+0.03
0.4
-0.02
8°
28/34
8°
(0.1)
1.5±0.1
1.5±0.11. 5±0.1
)
■PACKAGING INFORMATION (Continued
●USP-6C Reference Pattern Layout ●USP-6C Reference Metal Mask Design
XC6408
Series
2.4
0.45
1
2
3
0.05
1.0
0.05
0.45
0.35
6
5
4
2
34
0.15
2.3
0.35
61
5
0.15
0.8
29/34
XC6408 Series
■PACKAGING INFORMATION (Continued)
● USP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2
in one side)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Evaluation Board (Unit: mm)
Ambient Temperature(℃) Power Dissipation Pd(mW)Thermal Resistance (℃/W)
25 1000
100.00
85 400
Pd-Ta特性グラフ
Pd vs. Ta
1200
1000
800
600
400
200
許容損失Pd(mW)
0
Power Dissipation Pd (mW)
25456585105125
Ambient Temperature Ta (℃)
周辺温度Ta(℃)
30/34
p
(
)
XC6408
Series
■PACKAGING INFORMATION (Continued)
● SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2
in one side)
Evaluation Board (Unit: mm)
評価基板レイアウト(単位:mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature(℃) Power Dissipation Pd(mW)Thermal Resistance (℃/W)
25 600
166.67
85 240
Pd-Ta特性グラフ
Pd vs. Ta
700
mW
600
500
400
ation Pd
300
200
100
許容損失Pd(mW)
Power Dissi
0
25456585105125
Ambient Temperature Ta (℃)
周辺温度Ta(℃)
31/34
XC6408 Series
■PACKAGING INFORMATION (Continued)
● SOT-89-5 Power Dissipation
Power dissipation data for the SOT-89-5 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 5 x 0.8 Diameter
2
in one side)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Evaluation Board (Unit: mm)
Ambient Temperature(℃) Power Dissipation Pd(mW)Thermal Resistance (℃/W)
25 1300
76.92
85 520
Pd-Ta特性グラフ
Pd vs. Ta
1400
1200
1000
800
600
400
200
許容損失Pd(mW)
0
Power Dissipation Pd (mW)
25456585105125
Ambient Temperature Ta (℃)
周辺温度Ta(℃)
32/34
q
■MARKING RULE
●SOT-25, SOT-89-5, USP-6C
① represents additional function.
②③ represents combination of output voltage and detect voltage for each IC.
Numbers are se
④⑤ represents production lot number.
01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order.
(G, I, J, O, Q, W excepted)
*No character inversion used.
MARK PRODUCT SERIES
D XC6408D*****-G
E XC6408E*****-G
uence.
MARK PRODUCT SERIES
01 XC6408**01**-G
SOT25
SOT89-5
USP6C
XC6408
Series
54
① ② ③ ④ ⑤
123
524
③①
②
123
④ ⑤
⑤
④
② ③①
33/34
XC6408 Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.