XC25BS6 Series
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Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit September 17, 2003 V1
Preliminary
CMOS Low Power Consumption APPLICATIONS
Low Operating Supply Voltage 2.3V (MIN.) z
Output Frequency 32.768kHz z Clocks for Micro-computers, DSPs, etc.
Oscillation Frequency 2MHz ~ 36MHz (fundamental) z Communication Equipment
Built-In Divider Circuit Selectable from divisions of z Various System Clocks
1024, 512, 256, 128 z Clock Time-Base
Output 3-State
Ultra Small Package SOT-26
Chip Form
GENERAL DESCRIPTION FEATURES
The XC25BS6 is a low operating voltage, low current consumption
series of CMOS ICs with built-in crystal oscillator and divider circuits
designed for clock generators. Oscillation capacitors Cg and Cd are
externally set up.
Output is selectable from any one of the following values for f0:f0/1024,
f0/512, f0/256, and f0/128.
With oscillation feedback resistors built-in, it is possible to configure a
stable fundamental oscillator using about 10pF of external oscillation
capacitor and an external crystal.
The series has a stand-by function. The oscillation completely stops in
the stand-by state and output will be one of high-impedance.
Crystal Oscillation Modules
Oscillation Frequency 2MHz ~ 36MHz (fundamental)
- Oscillation feedback resistor built-in
- External oscillation capacitor
Divider Ratio f0/1024, f0/ 512, f0/256, f0/128
Output 3-State
Operating Supply 2.3 ~ 4.0V
Voltage Range
Supply Current 0.5µA (MAX.) when stand-by mode
Chip Form Chip size 1.3 x 0.8mm
Package SOT-26 mini mold
PIN CONFIGURATION PIN ASSIGNMENT
PIN
NAME
FUNCTIONS
Crystal Oscillator
Connection (Output)
VSS Ground
Q0
CE
Clock Output
Stand-by Control *
Power Supply
Crystal Oscillator
Connection (Input)
VSS
Q0
PIN NUMBER
1/XT
XT
6
1 / XT
2
VDD
2
3
5
4
CE
3
4
5 VDD
6XT
* The stand-by control pin (pin #4) has a pull-down resistor built-in.
PAD LAYOUT FOR CHIP FORM PAD LOCATIONS (Unit:µm)
(0,0)
VSS
/XT
VDD
XT
Chip Size
Chip Thickness
Chip Back
Pad Aperture
(NC)
VSS
: 1300 x 800µm
: 280±20µm
: VDD level
: 88 x 88 µm
Q0
VDD
CE
(1300,800)
Note)
There are two VSS
pads and two VDD
pads. Please connect
both VSS pads to
GND, and connect
both VDD pads to a
power supply.
PIN NUMBER
1
2
PIN
NAME
/ XT
VSS
FUNCTIONS
Crystal Oscillator
Connection
Output
Ground
3 (NC) No Connection 741.0
4 VSS Ground 952.0
5
6
Q0
VDD
7
8
XT 128.0
Clock Output
Power Suppl
Stand-by Control *
Crystal Oscillator
Connection (Input)
9 VDD Power Suppl
* The stand-by control pin (pin #4) has a pull-down resistor built-in.
PAD DIMENSIONS
Y
128.0 610.0
328.0 672.0
672.0
672.0
1172.0
672.0
1172.0 430.0
1172.0CE
189.0
187.0
128.0
399.0
BLOCK DIAGRAM CE, Q0 PIN FUNCTION
VDD
/XT
Counter
XT
Q0
CE
VSS
Data Sheet 1
CE
'H'
'L' or Open High Impedance
Q0
Clock Output
Semi conductor Ltd.
XC25BS6 Series
K
K
Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit
Preliminary
ABSOLUTE MAXIMUM RATINGS
Ta=25OC
SYMBOL RATINGS UNITSPARAMETER
VDD VSS -0.3 ~ VSS +7.0 VSupply Voltage
CE Pin Voltage
Q0 Pin Voltage
Operating Temperature Range
** SOT-26 package, When implemented on a glass epoxy PCB.
PRODUCT CLASSIFICATION
Ordering Information
XC25BS6
12345
123
Divider Ratio: Package:
128 = 128 divider C : Chip Form
256 = 256 divider W : Wafer Form
512 = 512 divider M : SOT-26
A24 = 1024 divider Device Orientation:
VCE VSS -0.3 ~ VDD +0.3
VQ0 VSS -0.3 ~ VDD +0.3
IQ0
Pd 150 ** mWContinuous Power Dissipation
Topr - 40 ~ + 85
- 65 ~ + 150 (Chip Form)
- 55 ~ + 125 (SOT-26)
DESCRIPTIONDESIGNATOR DESIGNATOR
± 50
4
5
V
V
mAQ0 Output Current
O
C
O
CTstgStorage Temperature Range
DESCRIPTION
R : Embossed Tape : Standard Feed
L : Embossed Tape : Reverse Feed
T : Chip Tray
W : Wafer
MARKING RULE
654
1 2 3 4
3
21
PACKAGING INFORMATION
SOT-26
1 Represents XC25BS6 Series
MAR
Product Name
B XC25BS6
2 Represents XC25BS6 Series
MAR
Product Name
6 XC25BS6
3 Represents divider ratio
MARK
1
5
Divider Ratio
f0/128
f0/512
4 Represents the assembly lot no.
(Based on internal standards)
MARK Divider Ratio
2 f0/256
A f0/1024
Semi conductor Ltd.
Data Sheet 2
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