)
XC2165 Series
ETR1407_001
ICs for use with low voltage Crystal Oscillators
Preliminary
■GENERAL DESCRIPTION
The XC2165 series are CMOS ICs operates from supply voltage range from 1.5V to 3.6V with built-in crystal oscillator and
divider circuits.
Output is selectable from any one of the following values for f0: f0/1, f0/2, f0/4, f0/8.
With oscillation capacitors and a feedback resistor built-in, it is possible to configure a stable fundamental oscillator using only
an external crystal.
In stand-by mode, oscillation stops completely and output pin Q0 becomes in the state of high impedance.
The XC2165 series are integrated into SOT-26 packages.
The series is also available in chip form.
resistance and ultra high-speed switching characteristics.
Two FET devices are built into the one package.
Because high-speed switching is possible, the IC can be efficiently set thereby saving energy.
The small SOP-8 package makes high density mounting possible.
■APPLICATIONS
●Crystal oscillation modules
●Micro computers, DSP clocks
●Communication equipment
●Various system clocks
●Cellular and portable phones
■PIN CONFIGURATION
1
/INH
2
XT
VSS
SOT-26 (TOP VIEW
6
/XT
5
VDD
43
Q0
■FEATURES
Oscillation Frequency : C2xA series
8MHz ~ 70MHz (Fundamental)
: C2xB series
Divider Ratio :
16MHz ~ 120MHz (Fundamental)
Selectable from f0/1, f0/2, f0/4, f0/8
Output : 3-State
Operating Voltage Range : 1.5V ~ 3.6V
(C21B series: 1.8V ~ 3.6V)
Low Current Consumption
: Stand-by function included
30μA (MAX.) when stand-by
Chip Form (size) : 800×1200μm
Built-in Capacitors Cg, Cd
Built-in Feedback Resistor
Ultra Small Package : SOT-26
■PIN ASSIGNMENT
PIN NUMBER PIN NAME FUNCTION
1 / INH Stand-by Control *
2 XT
3 VSS Ground
4 Q0 Clock Output
5 VDD Power Supply
6 /XT
* Pull-up resistor is built-in to the stand-by control pin.
Crystal Oscillator Connection
(Input)
Crystal Oscillator Connection
(Output)
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X Y
p
XC2165 Series
■BLOCK DIAGRAM
VDD
■PRODUCT CLASSIFICATION
Rup
XT
XT
INH
●Ordering Information
XC2165 ①②③④⑤⑥
Rf
1/2
Cg
Cd
1/21/2
Q0
VSS
DESIGNATOR DESCRIPTION SYMBOL DESCRIPTION
① Duty Level C : CMOS
② Fixed Number 2 : -
③ Divider Ratio
④ Oscillation Frequency
⑤ Chip Form & Package Type
⑥ Device Orientation
■PAD LAYOUT
■PAD DIMENSIONS
Size (Chip)
Thickness (Chip)
Backside (Chip)
A
erture (Pad)
: 800×1200μm
: 200±20μm
: GND level
: 90×90μm
NUMBER
■/ INH, Q0 PIN FUNCTION
/ INH Q0
‘H’ or Open Clock Output
‘L’ High Impedance
1 : f0/1
2 : f0/2
4 : f0/4
8 : f0/8
A : 8MHz ~ 70MHz
B : 16MHz ~ 120MHz
C : Chip form
M : SOT-26 package
T : Chip tray
R : Embossed tape, standard feed
L : Embossed tape, reverse feed
W : Wafer
PIN
1 / INH
2 XT
3 / XT
4 VSS
5 Q0
6 (NC)
7 VDD
* Pull-up resistor is built-in to the stand-by control pin.
PIN
NAME
FUNCTION
Stand-by Control*
Crystal Oscillation
Connection (Input)
Crystal Oscillation
Connection (Output)
Ground
Clock Output
No Connection
Power Supply
Unit:μm
PAD DIMENSIONS
- 236 - 436
- 79 - 436
79 - 436
236 - 436
236 436
- 78 436
- 236 436
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X
■ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL RATINGS UNITS
Supply Voltage VDD VSS – 0.3 to VSS + 7.0 V
/ INH Pin Voltage VINH VSS – 0.3 to VDD + 0.3 V
Q0 Pin Voltage VQ0 VSS – 0.3 to VDD + 0.3 V
Q0 Output Current IQ0 ± 50 mA
Power Dissipation Pd 150 * mW
Operating Temperature Range Topr - 40 to + 85 ℃
Storage Temperature Range Tstg
* SOT-26 Package: When implemented on a glass epoxy PCB.
■ELECTRICAL CHARACTERISTICS
XC2165C2xAxx
1.8V Operation (Unless otherwise stated, VDD = 1.8V, f0=70MHz, No Load, Ta = - 40℃ ~ + 85℃)
PARAMETER SYMBOL FUNCTION MIN. TYP. MAX. UNIT
Operating Voltage VDD 1.5 1.8 3.6 V
Crystal Oscillation Frequency Fosc 8 - 70 MHz
‘H’ Level Input Voltage VIH /INH pin 0.7VDD - - V
‘L’ Level Input Voltage VIL /INH pin - - 0.3VDD V
‘H’ Level Output Voltage VOH Q0 pin, VDD=1.5V, IOH= - 2.0mA 1.0 1.1 - V
‘L’ Level Output Voltage VOL Q0 pin, VDD=1.5V, IOL= 2.0mA - 0.3 0.4 V
/INH =Open,
Supply Current 1 IDD1
Supply Current 2 IDD2 /INH = 'L', f0 = 70MHz, CL=15pF - 15 30 μA
Input Pull-Up Resistance 1 Rup1 /INH = ‘L’ 0.8 2.0 6.0 MΩ
Input Pull-Up Resistance 2 Rup2 /INH = 0.7VDD 20 50 150 kΩ
Internal Oscillation Capacity (*)
Internal Oscillation
Feedback Resistance
Output Off Leak Current Ioz VDD=3.6V, /INH = ‘L’ - - 1.0 μA
■SWITCHING CHARACTERISTICS
XC2165C2xAxx
1.8V Operation (Unless otherwise stated, V
PARAMETER SYMBOL FUNCTION MIN. TYP. MAX. UNIT
Output Rise Time (*) Tr VDD=1.8V, CL=15pF (10% to 90%) - - 6.5 ns
Output Fall Time (*) Tf VDD=1.8V, CL=15pF (10% to 90%) - - 6.5 ns
Output Duty Cycle DUTY CL=15pF @ 0.5VDD 40 - 60 %
Oscillation Start Time (*) Tosc_on f0=8MHz - - 4.0 ms
f0=70MHz,
C
L=15pF
Cg (*) - 10 - pF
Cd (*) - 10 - pF
Rf 1.2 3.0 5.5 MΩ
DD = 1.8V, f0=70MHz, CL=15pF, Ta = - 40℃ ~ + 85℃)
- 65 to + 150 (chip form)
- 55 to + 125 (SOT-26)
XC2165C21Axx - 5.0 10.0
XC2165C22Axx - 3.5 7.0
XC2165C24Axx - 3.0 6.0
XC2165C28Axx - 2.5 6.0
(*) Designed value
(*) Designed value
C2165
Series
Ta =2 5℃
℃
mA
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XC2165 Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC2165C2xBxx
2.5V Operation (Unless otherwise stated, VDD = 2.5V, f0=120MHz, No Load, Ta = - 4 0 ℃ ~ + 85℃)
PARAMETER SYMBOL FUNCTION MIN. TYP. MAX. UNIT
Operating Voltage VDD 1.8 2.5 3.6 V
Crystal Oscillation Frequency Fosc 16 - 120 MHz
‘H’ Level Input Voltage VIH /INH pin 0.7VDD - - V
‘L’ Level Input Voltage VIL /INH pin - - 0.3VDD V
‘H’ Level Output Voltage VOH Q0 pin, VDD=1.8V, IOH= - 2.0mA 1.3 1.4 - V
‘L’ Level Output Voltage VOL Q0 pin, VDD=1.8V, IOL= 2.0mA - 0.3 0.4 V
XC2165C21Bxx - 10.0 20.0
Supply Current 1 IDD1
Supply Current 2 IDD2 /INH = 'L', f0 = 120MHz, CL=5pF - 15.0 30.0 μA
Input Pull-Up Resistance 1 Rup1 /INH = ‘L’ 0.8 2.0 6.0 MΩ
Input Pull-Up Resistance 2 Rup2 /INH = 0.7VDD 20 50 150 kΩ
Internal Oscillation Capacity (*)
Internal Oscillation
Feedback Resistance
Output Off Leak Current Ioz VDD=3.6V, /INH = ‘L’ - - 1.0 μA
■SWITCHING CHARACTERISTICS (Continued)
XC2165C2xBxx
2.5V Operation (Unless otherwise stated, VDD = 2.5V, f0=120MHz, CL=5pF, Ta = - 40℃ ~ + 85℃)
PARAMETER SYMBOL FUNCTION MIN. TYP. MAX. UNIT
Output Rise Time (*) Tr VDD=2.5V, CL=5pF (10% to 90%) - - 4.0 ns
Output Fall Time (*) Tf VDD=2.5V, CL=5pF (10% to 90%) - - 4.0 ns
Output Duty Cycle DUTY CL=5pF @ 0.5VDD 40 - 60 %
Oscillation Start Time (*) Tosc_on f0=16MHz - - 3.0 ms
Cg (*) - 10 - pF
Cd (*) - 10 - pF
Rf 1.2 3.0 5.5 MΩ
/INH =Open,
f0=120MHz, CL=5pF
XC2165C22Bxx - T.B.D. T.B.D.
XC2165C24Bxx - T.B.D. T.B.D.
XC2165C28Bxx - T.B.D. T.B.D.
(*) Designed value
T.B.D.: To be determined
(*) Designed value
mA
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X
■SWITCHING CHARACTERISTICS MEASUREMENT WAVEFORMS
(1) Output Rise Time: Tr / Output Fall Time: Tf
0.9VDD
0.1VDD
tr tf
(2) Duty Cycle
DUTY Measurement Level
TW
T DUTY = (TW/T) x 100 [%]
(3) Oscillation Start Time: Tosc_on / Oscillation Stop Time: Tosc_off
0.9VDD
0.1VDD
0.5VDD
C2165
Series
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XC2165 Series
■PACKAGING INFORMATION
●SOT-26
■MARKING RULE
SOT-26 (TOP VIEW)
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① Represents product series (Fixed marking)
MARK PRODUCT SERIES
5 XC2165 series
② Represents oscillation frequency
MARK OSCILLATION FREQUENCY
A C2xA: 8MHz ~ 70MHz (Fundamental)
B C2xB: 16MHz ~ 120MHz (Fundamental)
③ Represents divider ratio
MARK DEVIDER RATIO MARK DEVIDER RATIO
A f0/1 B f0/2
C f0/4 D f0/8
④ Represents assembly lot number
(based on internal standards)
X
C2165
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this catalog is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this catalog.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this catalog.
4. The products in this catalog are not developed, designed, or approved for use with such
equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this catalog within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this catalog may be copied or reproduced without the
prior permission of Torex Semiconductor Ltd.
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