● USPQ-4B03 Power Dissipation
Power dissipation data for the USPQ-4B03 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board Dimensions: 40 x 40 mm (1600mm2)
Board Structure: 4 Copper Layers
Each layer is connected to the package heat-sink
and terminal pin No.1.
Each layer has approximately 800mm2 copper area.
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
25
85
600
500
400
300
（mW）
200
100
Power Dissipation Pd
0
25 45 65 85 105 125
Ampient Temperature Ta（℃）
Pd vs Ta
550
220
Thermal Resistance(℃/W)Power Dissipation Pd（mW）Ambient Temperature（℃）
181.82
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