TOREX USPN-4B02 User Manual

● USPN-4B02 Power Dissipation

Power dissipation data for the USPN-4B02 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.

1. Measurement Condition (Reference data)
Condition: Mount on a board

Ambient: Natural convection

Soldering: Lead (Pb) free

Board:

Material: Glass Epoxy (FR-4)

Thickness: 1.6 mm

Through-hole: 4 x 0.8 Diameter

Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the front and 50% of the back.
The copper area is divided into four block,
one block is 12.5% of total.
The USPN-4 package has for terminals.
Each terminal connects one copper block in the front
and one in the back.

2

in one side)

2. Power Dissipation vs. Ambient Temperature

Board Mount (Tj max = 125℃)

25
85

Pd vs Ta

600
500
400
300

（mW）

200
100

Power Dissipation Pd

0

25 45 65 85 105 125

Ambient Temperature Ta（℃）

550
220

Evaluation Board (Unit: mm)

Thermal Resistance(℃/W)Power Dissipation Pd（mW）Ambient Temperature（℃）

181.82