●USP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data t aken in the described condition.
1. Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
Board : Dimensions 40mm×40mm（1600mm
2
in one side）
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material : Glass Epoxy（FR-4）
Thickness : 1.6mm
Through-hole : 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature（85℃）
Board Mount ( Tjmax=125℃)
Ambient
Power
Thermal
Evaluation Board (Unit: mm)
Temperature
(℃)
Dissipation
Pd (mW)
25 1000
85 400
Resistance
(℃/W）
100.00
3. Power Dissipation vs. Ambient temperature（105℃）
Board Mount ( Tjmax=125℃)
Ambient
Temperature
(℃)
Power
Dissipation
Pd (mW)
25 1000
Thermal
Resistance
(℃/W）
100.00
105 200
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