●USP-6B04 Power Dissipation
Power dissipation data for the USP-6B04 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data t aken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board Dimensions: 40mm×40mm（1600mm
2
1st Inner Metal Layer about 50%
2nd Inner Metal Layer about 50%
3rd Inner Metal Layer about 50%
4th Inner Metal Layer about 50%
Each heat sink back metal is connected to the
Inner layers respectively.
Material: Glass Epoxy (FR-4)
Thickness: 1.0 mm
Through-hole: 4 x 0.4 Diameter
2. Power Dissipation vs. Ambient temperature
in one side）
Evaluation Board (Unit: mm)
Board Mount ( Tjmax=125℃)
Ambient Temperature (℃)
25 600
Power Dissipation Pd (mW)
Thermal Resistance (℃/W）
166.67
85 240
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