TOREX USP-3 User Manual

● USP-3 Power Dissipation

Power dissipation data for the USP-3 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.

1. Measurement Condition (Reference data)
Condition: Mount on a board

Ambient: Natural convection

Soldering: Lead (Pb) free

Board:

Material: Glass Epoxy (FR-4)

Thickness: 1.6 mm

Through-hole: 4 x 0.8 Diameter

Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces

2

in one side)

2. Power Dissipation vs. Ambient temperature

Board Mount (Tj max = 125℃)

25
85

Pd vs Ta

1200
1000

800
600
400
200

0

Power Dissipation Pd(mW)

25 45 65 85 105 125

Ambient Temperature Ta（℃）

1000

400

Evaluation Board (Unit: mm)

Thermal Resistance(℃/W)Power Dissipation Pd（mW）Ambient Temperature（℃）

100.00