TOREX SOT-89 Technical data
●SOT-89 Power Dissipation
Power dissipation data for the SOT-89 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data t aken in the described condition.
1. Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
Board : Dimensions 40×40mm（1600mm
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material : Glass Epoxy（FR-4）
Thickness : 1.6mm
Through-hole : 5 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature
Board Mount ( Tjmax=125℃)
Ambient Temperature (℃)
Power Dissipation Pd (mW)
2
in one side）
28.9
Evaluation Board (Unit: mm)
Thermal Resistance (℃/W）
40.0
2.5
25 1000
85 400
1200
1000
Pd vs Ta
100.00
800
600
400
200
Power Dissipation Pd（mW）
0
25 45 65 85 105 125
Ambient Temperature Ta（℃）
1/2
●SOT-89 Power Dissipation (Tj=150℃)
Power dissipation data for the SOT-89 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data t aken in the described condition.
MOSFET DATA
1. Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
Board : Dimensions 250mm
Material : Ceramic
Thickness : 0.8mm
2. Power Dissipation vs. Ambient temperature
Board Mount ( Tjmax=150℃)
2
Evaluation Board (Unit : mm)
Ambient Temperature (℃)
25 1000
105 540
1600
1400
1200
1000
Power Dissipation Pd（mW）
800
600
400
200
0
25 50 75 100 125 150
Power Dissipation Pd (mW)
Pd vs Ta
Ambient TemperatureTa（℃）
Thermal Resistance (℃/W）
83.33
2/2
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