TOREX SOP-8 Technical data

●SOP-8 Power Dissipation

Power dissipation data for the SOP-8 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data t aken in the described condition.

1. Measurement Condition (Reference data)
Condition : Mount on a board

Ambient : Natural convection

Soldering : Lead (Pb) free

Board : Dimensions 40mm×40mm（1600mm

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Material : Glass Epoxy（FR-4）

Thickness : 1.6mm

2. Power Dissipation vs. Ambient temperature

Board Mount ( Tjmax=125℃)

2

in one side）

Evaluation Board (Unit: mm)

Ambient Temperature (℃)

25 650

Power Dissipation Pd (mW)

Thermal Resistance (℃/W）

153.85

85 260