Page 1
Only for TPV.
正基科技股份有限公司
SPECIFICATION
SPEC. NO.： REV： 1.9
DATE： 07.20. 2012
PRODUCT NAME： WL-211
APPROVED CHECKED PREPARED DCC ISSUE
NAME
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
Page 2
Only for TPV.
AMPAK
WL-211
Wi-Fi SIP Module
Spec Sheet
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
Page 3
Only for TPV.
Revision History
Date Revision Content Revised By Version
2011/08/22 -Initial released Andy 1.0
2011/09/27 -Modify physical dimensions Andy 1.1
2011/10/19 -Modify block diagram Andy 1.2
2011/12/23 -Add Power Consumption Andy 1.3
2012/01/12 -Modify dimension Andy 1.4
2012/03/09 -Add packing information Andy 1.5
2012/03/19 -More info to recommended footprint Andy 1.6
2012/05/03 -Pin description revised Bart 1.7
2012/05/18
2012/07/20 -Modify Physical Dimensions Bart 1.9
-Modify Recommended Footprint
Bart 1.8
-Modify Physical Dimensions
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
1
Page 4
Only for TPV.
Contents
Revision History ......................................................................................................... 1
Contents..................................................................................................................... 2
1. Introduction........................................................................................................... 3
2. Features ............................................................................................................... 4
3. Deliverables.......................................................................................................... 5
3.1 Deliverables.................................................................................................... 5
3.2 Regulatory certifications ................................................................................. 5
4. General Specification............................................................................................ 6
4.1 Wi-Fi RF Specification .................................................................................... 6
4.2 Voltages.......................................................................................................... 7
4.2.1 Absolute Maximum Ratings.................................................................... 7
4.2.2 Recommended Operating Ratings ......................................................... 7
5. Pin Assignments ................................................................................................... 8
5.1 PCB Pin Outline.............................................................................................. 8
5.2 Pin Definition .................................................................................................. 8
6. Dimensions......................................................................................................... 11
6.1 Physical Dimensions..................................................................................... 11
6.2 Recommended Footprint .............................................................................. 12
7. External clock reference ..................................................................................... 13
7.1 SDIO Pin Description.................................................................................... 13
8. Host Interface Timing Diagram ........................................................................... 14
8.1 Power-up Sequence Timing Diagram ........................................................... 14
8.2 SDIO Default Mode Timing Diagram............................................................. 14
8.3 SDIO High Speed Mode Timing Diagram ..................................................... 15
9. Recommended Reflow Profile ............................................................................ 16
10. Packing Information............................................................................................ 17
10.1 Label........................................................................................................... 17
10.2 Dimension................................................................................................... 18
10.3 MSL Level / Storage Condition ................................................................... 20
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
2
Page 5
Only for TPV.
1. Introduction
AMPAK Technology would like to announce a low-cost and low-power consumption module
which has all of the Wi-Fi functionalities. The highly integrated WL-211 module makes the
possibilities of web browsing, VoIP, headsets and other applications. With seamless roaming
capabilities and advanced security, WL-211 can also interact with different vendors’
802.11b/g/n Access Points in the wireless LAN.
This wireless module complies with IEEE 802.11 b/g/n standard and it can achieve up to a
speed of 72.2Mbps with single stream in 802.11n draft, 54Mbps as specified in IEEE
802.11g, or 11Mbps for IEEE 802.11b to connect to the wireless LAN. The integrated
module provides SDIO interface for Wi-Fi.
This compact module is a total solution for Wi-Fi technologies. The module is specifically
developed for Smart phones and Portable devices.
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
3
Page 6
Only for TPV.
2. Features
Single-band 2.4GHz IEEE 802.11b/g/n
Supports standard interfaces SDIO v2.0(50MHz, 4-bit and 1-bit) and generic SPI(up to
50MHz)
Integrated ARM Cortex-M3TM CPU with on-chip memory enables running IEEE802.11
firmware that can be field-upgraded with future features.
Supports per packet Rx antenna diversity
Security:
i. Hardware WAPI acceleration engine
ii. AES and TKIP in hardware for faster data encryption and IEEE 802.11i
compatibility
iii. WPATM – and WPA2
authentication
TM
- (Personal) support for powerful encryption and
A simplified block diagram of the module is depicted in the figure below.
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
4
Page 7
Only for TPV.
3. Deliverables
3.1 Deliverables
The following products and software will be part of the product.
Module with packaging
Evaluation Kits
Software utility for integration, performance test.
Product Datasheet.
Agency certified pre-tested report with the adapter board.
3.2 Regulatory certifications
The product delivery is a pre-tested module, without the module level certification. For
module approval, the platform’s antennas are required for the certification.
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
5
Page 8
Only for TPV.
4. General Specification
4.1 Wi-Fi RF Specification
Conditions : VBAT=3.6V ; VDDIO=3.3V ; Temp:25°C
Feature Description
Product Name
WLAN Standard
Host Interface SDIO
Dimension L x W x H: 9.5 x 9.5 x 1.5 (typical) mm
Frequency Range 2.412 GHz ~ 2.4835 GHz (2.4 GHz ISM Band)
Number of Channels 11 for North America, 13 for Europe, and 14 for Japan
Modulation
Output Power
Receive Sensitivity
(11n,20MHz)
@10% PER
WL-211 Wi-Fi SIP Module
IEEE 802.11b/g/n, WiFi compliant
802.11b : DQPSK, DBPSK, CCK
802.11g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK
802.11b /11Mbps : 16 dBm ± 1.5 dB @ EVM -9dB
802.11g /54Mbps : 15 dBm ± 1.5 dB @ EVM -25dB
802.11n /65Mbps : 14 dBm ± 1.5 dB @ EVM -28dB
- MCS=0 PER @ -85 ± 1dBm, typical
- MCS=1 PER @ -84 ± 1dBm, typical
- MCS=2 PER @ -82 ± 1dBm, typical
- MCS=3 PER @ -80 ± 1dBm, typical
- MCS=4 PER @ -77 ± 1dBm, typical
- MCS=5 PER @ -73 ± 1dBm, typical
- MCS=6 PER @ -71 ± 1dBm, typical
- MCS=7 PER @ -69 ± 1dBm, typical
- 6Mbps PER @ -87 ± 1dBm, typical
- 9Mbps PER @ -86 ± 1dBm, typical
- 12Mbps PER @ -85 ± 1dBm, typical
Receive Sensitivity (11g)
@10% PER
Receive Sensitivity (11b)
@8% PER
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
- 18Mbps PER @ -83 ± 1dBm, typical
- 24Mbps PER @ -81 ± 1dBm, typical
- 36Mbps PER @ -78 ± 1dBm, typical
- 48Mbps PER @ -74 ± 1dBm, typical
- 54Mbps PER @ -72 ± 1dBm, typical
- 1Mbps PER @ -90 ± 1dBm, typical
- 2Mbps PER @ -89 ± 1dBm, typical
- 5.5Mbps PER @ -87 ± 1dBm, typical
- 11Mbps PER @ -84 ± 1dBm, typical
6
Page 9
Only for TPV.
Data Rate
802.11b : 1, 2, 5.5, 11Mbps
802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps
Data Rate
(20MHz ,Long GI,800ns)
Data Rate
(20MHz ,short GI,400ns)
Maximum Input Level
Operating temperature -30°C to 85°C
Storage temperature -40°C to 85°C
Humidity
802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps
802.11b : -10 dBm
802.11g/n : -20 dBm
Operating Humidity 10% to 95% Non-Condensing
Storage Humidity 5% to 95% Non-Condensing
4.2 Voltages
4.2.1 Absolute Maximum Ratings
Symbol Description Min. Max. Unit
VBAT Input supply Voltage -0.5 6.5 V
VDDIO Digital/Bluetooth/SDIO/SPI I/O Voltage -0.5 4.1 V
4.2.2 Recommended Operating Ratings
Test conditions: At room temperature 25°C
Symbol Min. Typ. Max. Unit
VBAT 3.0 3.6 4.8 V
VDDIO
Note: The voltage of VDDIO is depended on system I/O voltage.
Test conditions: At operating temperature -10°C ~65°C
Symbol Min. Typ. Max. Unit
VBAT 3.0 3.6 4.8 V
1.7 1.8 1.92 V
2.97 3.3 3.6 V
VDDIO 1.7
Note: VDDIO operating voltage range from 1.7V to 3.35V at operating temperature is guaranteed.
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
-
3.35 V
7
Page 10
JTAG interface, if JTAG not used unconnected (NC)
nterface, if JTAG not used unconnected (NC)
Only for TPV.
5. Pin Assignments
5.1 PCB Pin Outline
< TOP VIEW >
5.2 Pin Definition
NO
1 WLAN_ANT I/O
2 GND
3 JTAG_TRST_L I JTAG interface, if JTAG not used unconnected (NC)
4 JTAG_TDO_UART_TX O
5 JTAG_TDI_UART_RX I
6 JTAG_TCK I JTAG interface, if JTAG not used unconnected (NC)
7 JTAG_TMS I JTAG interface, if JTAG not used unconnected (NC)
Name Type
－
Description
RF signal I/O port
Ground
this pin. This pin is also muxed with UART_TX,
which can be enabled by software
JTAG i
this pin. This pin is also muxed with UART_RX,
which can be enabled by software
8 GND
9 OSC_IN I XTAL oscillator input
10
11
12
13
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
OSC_OUT I/O
GND
RF_SW_CTRL0
RF_SW_CTRL3
－
－
－
－
Ground
XTAL oscillator output
Ground
Floating (Don’t connected to ground)
Floating (Don’t connected to ground)
8
Page 11
Only for TPV.
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
GND
GND
GND
GND
VIO I Digital I/O Voltage input
CLK_32K I Sleep clock (32.768KHz) input
SDIO_DATA_2 I/O
SDIO_DATA_0 I/O
SDIO_CLK I SDIO clock
SDIO_CMD I/O
SDIO_DATA_1 I/O
SDIO_DATA_3 I/O
VIN_LDO I Internal DC-DC regulator input
GND
SR_VLX O Internal DC-DC regulator output
GND
－
－
－
－
－
－
Ground
Ground
Ground
Ground
SDIO data line 2
SDIO data line 0
SDIO command line
SDIO data line 1
SDIO data line 3
Ground
Ground
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
VBAT I DC voltage input
WL_RST_N I Active low WLAN reset signal
GND
GND
GND
GND
XTAL_PU O Floating (Don’t connected to ground)
GND
GND
GND
GND
GND
GND
VDD_TCXO
GND
TCXO_IN
－
－
－
－
－
－
－
－
－
－
－
－
－
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Floating (Don’t connected to ground)
Ground
Floating (Don’t connected to ground)
46
47
48
49
50
51
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
GPIO_5
GPIO_4
GPIO_3
GPIO_1
GPIO_0
WRF_GPIO_OUT
－
－
－
O
－
－
Floating (Don’t connected to ground)
Floating (Don’t connected to ground)
Floating (Don’t connected to ground)
WL_Host Wake,
Mode selection, Low for SDIO, High for SPI mode
Floating (Don’t connected to ground)
9
Page 12
Only for TPV.
52
53
54
55
56
57
58
59
60
61
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
－
－
－
－
－
－
－
－
－
－
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
10
Page 13
Only for TPV.
6. Dimensions
6.1 Physical Dimensions
(Unit: mm)
< TOP VIEW > < Side View >
1.7 (MAX)
< TOP VIEW >
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
11
Page 14
Only for TPV.
6.2 Recommended Footprint
(Unit: mm)
< TOP VIEW >
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
12
Page 15
Only for TPV.
7. External clock reference
External LPO signal characteristics
Parameter LPO Clock Units
Nominal input frequency 32.768 kHz
Frequency accuracy
Duty cycle 30 - 70 %
Input signal amplitude 1600 to 3300
30
mV, p-p
ppm
Signal type Square-wave or sine-wave
>100k
Input impedance
<5
Clock jitter (integrated over 300Hz – 15KHz) <1 Hz
-
pF
7.1 SDIO Pin Description
The WL-211 supports SDIO version 1.2 for both 1-bit (25 Mbps), 4-bit modes (100 Mbps),
and high speed 4-bit (50 MHz clocks – 200 Mbps). It has the ability to stop the SDIO clock
and map the interrupt signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the
host when the WLAN device wants to turn on the SDIO interface. The ability to force the
control of the gated clocks from within the WLAN chip is also provided.
※ Function 0 Standard SDIO function (Max BlockSize / ByteCount = 32B)
※ Function 1 Backplane Function to access the internal System On Chip (SOC)
address space (Max BlockSize / ByteCount = 64B)
※ Function 2 WLAN Function for efficient WLAN packet transfer through DMA (Max
BlockSize / ByteCount = 512B)
SDIO Pin Description
SD 4-Bit Mode SD 1-Bit Mode SPI Mode
DATA0 Data Line 0 DATA Data Line DO Data Output
DATA1
DATA2
DATA3 Data Line 3 NC Not Used CS Card Select
CLK Clock CLK Clock SCLK Clock
CMD Command Line CMD Command Line DI Data Input
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
Data Line 1 or
IRQ Interrupt IRQ Interrupt
Interrupt
Data Line 2 or
RW Read Wait NC Not Used
Read Wait
13
Page 16
Only for TPV.
8. Host Interface Timing Diagram
8.1 Power-up Sequence Timing Diagram
※ WL_RST_N: Low asserting Reset for WLAN Core. This pin must be driven high or
low (not left floating).
8.2 SDIO Default Mode Timing Diagram
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
14
Page 17
Only for TPV.
8.3 SDIO High Speed Mode Timing Diagram
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
15
Page 18
2.5 /sec℃
2.5°C
/sec
40~70 sec
250
℃
Only for TPV.
9. Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : 2 times
10
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
16
Page 19
Only for TPV.
10. Packing Information
10.1 Label
Label A Anti-static and humidity notice
Label B MSL caution / Storage Condition
Label C Inner box label .
Label D Carton box label .
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
17
Page 20
Only for TPV.
10.2 Dimension
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
18
Page 21
Only for TPV.
B
Humidity indicator
A
Desiccant
C
C
D
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
19
Page 22
Only for TPV.
10.3 MSL Level / Storage Condition
※NOTE : Accumulated baking time should not exceed 96hrs
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
20
Page 23
F
e
l
r
n
q
B
i
t
n
t
e
t
o
,
n
r
e
n
h
s
e
m
a
n
o
l
w
a
o
t
a
e
t
h
o
o
s
n
e
c
u
l
y
f
m
a
i
a
n
d
n
a
s
u
n
e
o
a
e
e
c
e
w
o
n
p
o
n
h
h
s
d
o
c
d
e
r
a
r
n
q
o
a
a
v
r
a
r
m
F
s
u
d
o
i
u
n
d
c
e
n
t
o
r
t
a
d
o
r
n
e
o
p
y
n
m
i
f
i
e
r
h
i
c
i
f
ppr
y
e
h
ederal C
mmunicat
ion Comm
ssion Inte
ference S
atement
This d
the fo
interfe
includi
This e
Class
are des
residen
freque
instruc
Howev
installa
televisi
and on
followi
vice comp
lowing t
ence, and
g interfere
uipment h
digital de
gned to pr
ial install
cy energy
ions, may
r, there is
ion. If t
n recepti
the user i
g measur
ies with P
o conditio
(2) this
ce that m
s been te
vice, purs
vide reaso
tion. This
and, if n
cause h
no guarant
is equipm
n, which
encourag
s:
rt 15 of t
ns: (1) T
evice mu
y cause un
ted and f
ant to Part
able prote
quipment
t installe
rmful int
e that inte
nt does c
an be dete
d to try to
e FCC Rul
is device
t accept
esired ope
und to co
15 of the
tion again
generates,
and use
rference t
ference w
use harmf
mined by
correct the
es. Operati
may not
ny interfe
ation.
ply with
CC Rules
t harmful i
ses and c
in accor
radio c
ll not occu
l interfere
turning th
interferenc
on is subje
cause har
ence rece
he limits
. These l
nterferenc
n radiate
ance wit
mmunicat
in a parti
ce to rad
equipmen
e by one o
t to
ful
ved,
or a
mits
in a
adio
the
ons.
ular
o or
off
the
- Reo
- Incr
- Con
to w
- Con
FCC C
party r
equip
This tr
other a
ient or relo
ase the sep
ect the eq
ich the rec
ult the dea
aution: An
sponsible
ent.
nsmitter
tenna or tr
ate the rec
ration bet
ipment int
eiver is co
er or an ex
changes
or complia
ust not be
nsmitter.
eiving ante
een the e
an outlet
nected.
erienced r
or modific
ce could
co-located
na.
uipment a
n a circuit
dio/TV te
tions not
oid the use
or operati
d receiver.
ifferent fr
hnician for
xpressly a
's authorit
g in conju
m that
help.
oved b
to operat
ction wit
the
this
any
21
Page 24
This devi
c
e
e
e
a
g
d
o
e
R
e
u
t
o
M
a
T
n
d
m
r
i
r
n
O
p
o
e
p
o
u
d
l
O
a
e
e
d
u
l
g
S
t
m
p
a
h
o
u
c
c
0
l
e
u
s
w
m
m
i
n
v
n
w
n
d
r
n
d
e
w
n
e
e
h
h
E
g
h
h
i
n
h
t
f
t
c
o
m
e
a
e is intende
only for
EM integr
tors under
the followi
g conditio
s:
1) Th
ant
2) Th
or
As lon
require
end-pr
modul
IMPO
exampl
then th
not be
will be
and ob
antenna
nna and us
transmitte
ntenna.
as 2 cond
. Howeve
duct for a
installed
TANT N
e certain la
FCC auth
sed on the
responsibl
aining a se
ust be inst
ers, and
module m
tions abov
, the OEM
y additiona
TE: In th
top config
rization is
final pro
for re-eva
arate FCC
lled such t
ay not be c
are met, f
integrator i
l complian
event that
urations or
no longer
ct. In these
uating the
authorizati
at 20 cm i
-located
rther trans
still respo
e require
these cond
co-locatio
onsidered
circumsta
end produc
on.
maintaine
ith any oth
itter test
sible for t
ents requir
tions can n
with anot
alid and t
ces, the O
(includin
between t
r transmit
ill not be
sting their
d with this
ot be met (
er transmit
e FCC ID
M integrat
the trans
e
er
or
er),
an
r
itter)
End Pr
FOR
This tr
may be
users.
followin
used o
duct
Labe
OBILE D
nsmitter m
installed s
he final en
ng: “Contai
ly when al
in
EVICE U
dule is au
ch that 20
product
ins FCC ID
FCC com
AGE (>2
horized on
cm may be
ust be lab
:ARS-WL211
liance req
Manuaal Informattion To the End User
The OE
regardinng how to i
end prooduct whic
The endd
as showw
EM integrat
oor has to b
nnstall or re
hh integrates
user manuual shall in
in this mannual.
ee aware not to provide
mmove this RRF module i
tthis modulee.
cclude all reqquired regul
cm/low po
y for use i
maintaine
led in a vis
”. The
irements a
er)
device w
between t
ble area w
grantee's
ere the ant
e antenna
th the
FCC ID can
e met.
iinformationn to the end
nn the user’ss manual of
atory informm
ation/warnning
nna
nd
be
user
the
22
Loading...