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CONTENTS
1. Product Overview............................................................................................................................
2. Module Hardware Overview...........................................................................................................
2.1 Block Diagram......................................................................................................................
2.2 Features.................................................................................................................................
2.3 Interface................................................................................................................................
3. Electrical Specification...................................................................................................................
3.1 Recommendedoperatingrating..........................................................................................
3.2 DC Characteristics..............................................................................................................
3.3 EnvironmentStorageCondition.........................................................................................
4. RF Specification..............................................................................................................................
4.1 IEEE802.11b......................................................................................................................
4.2 IEEE802.11g......................................................................................................................
4.3 IEEE802.11n HT20(2.4G).................................................................................................
4.4 IEEE802.11n HT40(2.4G).................................................................................................
4.5 IEEE802.11a.......................................................................................................................
4.6 IEEE802.11n HT20(5G)..................................................................................................
4.7 IEEE802.11n HT40(5G)..................................................................................................
5. Mechanical Specifications............................................................................................................
6. Ordering Information....................................................................................................................
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The module
The module is based on Qualcomm Atheros AR1021X which is highly integrated,system-on-a
2.
Module Hardware Overview
utilizing direct sequence spread spectrum and OFDM/CCK technology. The module supports
IEEE 802.11a/b/g/n protocol. Data rate of up to 54Mbps for 802.11a/g and 144.4Mbps for 802.11n
HT20,300Mbps for HT40.The module integrates all wifi functionality in a package friendly to
low-cost PCB design, requiring only a external 3.3V power supply and connection to antenna.
-chip solution for 2.4/5GHz IEEE 802.11n 2x2 MIMO WLAN with internal PA and LNA.
The general Hardware architecture is shown below Figure:
AR1021XNV5
provides wireless modem functionality for CE
applications
Module Block Diagram
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IEEE802.11a/ b/g/n (2X2) based on Qualcomm Atheros AR1021X solution
USB 2.0 Interface, High and Full Speeds supported
Module is powered by the host with a 3.3V +/- 10% supply.
Internal OTP memory for calibration data
Advanced power management to minimize standby,sleep and active power
Security support for WPS,WPA2,WPA,WAP and protected management frames
Full 802.11e QoS support including WMM and U-APSD
Support for the IEEE 802.11e,h,i,j
WEP,TKIP,and AES hardware encryption
Support Ad hoc and infrastructure mode
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Antenna: IPEX connector
3.3VPAnalog 3.3V power supply
Note:
Red pin--On the bottom side
From Module TOP View