
CONTENTS
1. Product Overview............................................................................................................................
2. Module Hardware Overview...........................................................................................................
2.1 Block Diagram......................................................................................................................
2.2 Features.................................................................................................................................
2.3 Interface................................................................................................................................
3. Electrical Specification...................................................................................................................
3.1 Recommendedoperatingrating..........................................................................................
3.2 DC Characteristics..............................................................................................................
3.3 EnvironmentStorageCondition.........................................................................................
4. RF Specification..............................................................................................................................
4.1 IEEE802.11b......................................................................................................................
4.2 IEEE802.11g......................................................................................................................
4.3 IEEE802.11n HT20(2.4G).................................................................................................
4.4 IEEE802.11n HT40(2.4G).................................................................................................
4.5 IEEE802.11a.......................................................................................................................
4.6 IEEE802.11n HT20(5G)..................................................................................................
4.7 IEEE802.11n HT40(5G)..................................................................................................
5. Mechanical Specifications............................................................................................................
6. Ordering Information....................................................................................................................

The module
The module is based on Qualcomm Atheros AR1021X which is highly integrated,system-on-a
2.
Module Hardware Overview
utilizing direct sequence spread spectrum and OFDM/CCK technology. The module supports
IEEE 802.11a/b/g/n protocol. Data rate of up to 54Mbps for 802.11a/g and 144.4Mbps for 802.11n
HT20,300Mbps for HT40.The module integrates all wifi functionality in a package friendly to
low-cost PCB design, requiring only a external 3.3V power supply and connection to antenna.
-chip solution for 2.4/5GHz IEEE 802.11n 2x2 MIMO WLAN with internal PA and LNA.
The general Hardware architecture is shown below Figure:
AR1021XNV5
provides wireless modem functionality for CE
applications
Module Block Diagram

IEEE802.11a/ b/g/n (2X2) based on Qualcomm Atheros AR1021X solution
USB 2.0 Interface, High and Full Speeds supported
Module is powered by the host with a 3.3V +/- 10% supply.
Internal OTP memory for calibration data
Advanced power management to minimize standby,sleep and active power
Security support for WPS,WPA2,WPA,WAP and protected management frames
Full 802.11e QoS support including WMM and U-APSD
Support for the IEEE 802.11e,h,i,j
WEP,TKIP,and AES hardware encryption
Support Ad hoc and infrastructure mode

Antenna: IPEX connector
3.3VPAnalog 3.3V power supply
Note:
Red pin--On the bottom side
From Module TOP View

3.
Electrical Specification
3.1
Recommended operating rating
Continuous Tx Current 2.4GHz(Dual Chain)
Continuous Rx Current 2.4GHz(Dual Chain)
Continuous Tx Current 5GHz(Dual Chain)
Continuous Rx Current 5GHz(Dual Chain)
3.3
Environment Storage Condition
Operating Temperature: -10 deg.C ~70 deg.C
Storage Temperature: -40 deg.C ~80 deg.C
Operating Humidity: 5% ~95% (Non-condensing)
Storage Humidity: 5% ~95% (Non-condensing)

4.1 IEEE 802.11b
2. Spectrum Mask@Target Power
1) fc-33MHz < f < fc-22MHz
2) fc-22MHz < f < fc-11MHz
4. Modulation Accuracy(EVM)@Target Power
5. Minimum Input Level Sensitivity
6. Maximum Input Level (PER ≤ 8%)

4.2
6,9,12,18,24,36,48,54Mbps
2. Spectrum Mask@Target Power
4. Modulation Accuracy(EVM)@Target Power
5. Minimum Input Level Sensitivity
6. Maximum Input Level (PER < 10%)
IEEE 802.11g
CH1 ~ CH1

4.3
4. Modulation Accuracy(EVM)@Target Power
5. Minimum Input Level Sensitivity
6. Maximum Input Level (PER < 10%)
IEEE 802.11n HT20(2.4G)
CH1 ~ CH1
19 23
19 23
19 23
19 23
17 20
16 19
15 18
13 16

4.4
4. Modulation Accuracy(EVM)@Target Power
5. Minimum Input Level Sensitivity
6. Maximum Input Level (PER < 10%)
IEEE 802.11n HT40(2.4G)
CH3 ~ CH
18 22
18 22
18 22
18 22
16 19
15 18
14 17
13 16

4.5
6,9,12,18,24,36,48,54Mbps
2. Spectrum Mask@Target Power
4. Modulation Accuracy(EVM)@Target Power
5. Minimum Input Level Sensitivity
6. Maximum Input Level (PER < 10%)
IEEE 802.11a
5180 5MHz0+]

4.6
4. Modulation Accuracy(EVM)@Target Power
5. Minimum Input Level Sensitivity
6. Maximum Input Level (PER < 10%)
IEEE 802.11n HT20(5G)
5180 5MHz0+]
18 22
16 20
16 20
16 20
15 18
14 17
13 16
11 14

4.7
4. Modulation Accuracy(EVM)@Target Power
5. Minimum Input Level Sensitivity
6. Maximum Input Level (PER < 10%)
IEEE 802.11n HT40(5G)
5190 5MHz0+]
14 18 22
12 15 18
12 15 18
12 15 18
12 15 18
11 13 16
12 14

5.
Mechanical Specifications
PCB Assembly Dimension:
Dimension (L x W x H): L:19.0mm* W:27.0mm * H:2.3 mm

proved antenna
Ap
Manufacturer: TOPLINKST TECHNOLOGY COMPANY LIMITED
An
tenna type: &WAntenna : 2*TX 2*RX
An
tenna gain: 3dBi

FCC Statement
This d
evice complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, a
nd (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipmen
t.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
These
limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates,
and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference
uses
t
o radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does
mful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is
cause har
encouraged t
measures:
-
- Reorient or relocate the receiving antenna.
-- I
-- Connect the
--
FCC Radiatio
The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device, for example,
U
T
his modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located
or o
cm
If the
module is i
“Contain
when
1. This d
(1) T
(2) T
2. Changes o
equipmen
o try to correct the interference by o ne or more of the following
ncrease the separation between the equipment and receiver.
equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
n Exposure Statement
SB dongle like transmitters is forbidden.
perating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20
between the radiator and user body.
FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the
nstalled must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
s Transmitter Module FCC ID: ZLJ-AR1021X-NV5-NV5 Or Contains FCC ID: ZLJ-AR1021X-NV5-NV5”
the module is installed inside another device, the user manual of this device must contain below warning statements;
evice complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
his device may not cause harmful interference.
his device must accept any in terference received, including interference that may cause undesired operation.
r modifications not expressly approved by the party responsible for compliance could void the u ser's authority to operate the
t.
The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that
come
s with the product
The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter
grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end user manual shall include all required regulatory information/warning as shown in this manual, include:
This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.