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RATINGS AT 25°C AMBIENT TEMPERATURE UNLESS OTHERWISE SPECIFIED.
MAXIMUM POWER DISSIPATION DERATING @ TA = 25°C
ADVANCED TRENCH PROCESS TECHNOLOGY
HIGH DENSITY CELL DESIGN FOR ULTRA LOW ON-RESISTANCE
FULLY CHARACTERIZED AVALANCHE VOLTAGE AN D
CURRENT
IMPROVED SHOOT-THROUGH FOM
BOTH NORMAL AND PB FREE PRODUCT
ARE AVAILABLE :NORMAL : 80~95% SN, 5~20% PB
PB FREE: 99% SN ABOVE
WE DECLARE THAT THE MATERIAL OF PRODUCT
COMPLIANCE WITH ROHS REUIREMENTS.
Pb Free: BSS123
Halogen Free: BSS123-H
CASE:SOT-23
DIMENSIONS IN MILLIMETERS AND (INCHES)
ABSOLUTE MAXIM UM RATINGS
PATING SYMBOL BSS123 UNITS
MAXIMUM DRAIN CURRENT-CONTINUE ID 170 mA
OPERATING AND STORAGE JUNCTION TEMP
THERMAL RESISTANCE, JUNCTION−TO−AMBIENT (NOTE1)
NOTE:1. 1-in
2
2oz Cu PCB board
TJ;T
R
- 55 TO +150
STG
θJA
±
556
℃
℃/W
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ELECTRICAL CHARACTE RISTICS (AT TA =25°C UNLESS OTHERWISE NOTED)
Gate-Body Leakage Current (VDS=0, VGS =20V)
ELECTRICAL CHARACTERISTICS
CHARACTERISTIC SYMBOL MIN TYP MAX UITS
Drain-Source Breakdown
Voltage
Zero Gate Voltage Dr ain Current
GS =0V, ID =250µA V
V
DS =100V, VGS =0V, TJ =25°C
V
VDS =100V, VGS =0V, TJ =125°C 60
100 − − V
(BR)DSS
I
− −
DSS
15
ON CHARACTERISTICS (NOTE 1)
Gate Threshold Voltage(VDS = VGS, ID =1.0mA) VGS(th) 0.8 − 2.8 V
Static Drain-Source On-
Resistance
Transfer Admittance (V
=25V, I
DS
VGS=10V, ID=100mA r
=100 mA) ∣gfs∣
D
DS(ON)
− 5.0 6.0
80 − −
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance C
V
=25V, VGS=0V, f=1.0MHz
DS
Transfer Capacitance C
− 20 − pF
C
ISS
− 9.0 − pF
oss
− 4.0 − pF
RSS
SWITCHING CHARACTERISTICS (NOTE 2)
Turn-On Time
Turn-Off Time T
V
cc=30V,IC=0.28A,VGS=10V,
R
GS=50Ω
− 20 − ns
T
ON
− 40 − ns
OFF
REVERSE DIODE
Forward Voltage (ID=0.34A , VGS=0V) VSD − − 1.3 V
NOTE: 1. Pulse Test: Pulse Width <300 us, Duty Cycle <2.0%.
µA
Ω
mmhos