Timex Group USA TMXM05L User Manual

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M05L User muanal
1. General Description
1.1. Overview
The RTL8762CK (hereafter referred to as the RTL8762C except where differences exist) is an ultra-low-power system on-chip solution for Bluetooth 5.0 low energy applications that combines the excellent performance of a leading RF transceiver with a low-power ARM Cortex-M4F and rich powerful supporting features and peripherals. The RTL8762C supports an analog MIC interface that integrates a sigma-delta ADC, programmable gain amplifier, 5-Band equalizer and microphone bias circuit for voice command application. The RTL8762C embeds IR transceiver, hardware key-scan, and Quad-decoder on a single IC, and is provided in a QFN package.
1.2. MCU Platform
The embedded ARM Cortex-M4F 32-bit CPU features a 16-bit instruction set with 32-bit extensions (Thumb-2® technology) t hat delive rs high-dens ity code w ith a small memory footpr int. By using a single-cycle 32-bit multiplier, a 3-stage pipeline, and a Nested Vector Interrupt Controller (NVIC), the ARMCortex-M4F makes program execution simple and highly efficient. Serial Wire Debug (SWD) interface provided as part of the Debug Access Port (DAP), in conjunction with the Basic Branch Buffer (BBB). This offers a flexible and powerful mechanism for non-intrusive program code debugging. Developers can easily add breakpoints in the code and perform single-step debugging. The RTL8762C memory architecture includes ROM, 160kByte RAM and 8MByte Flash Address Space. The 160kByte RAM consists of RAM1 (112kByte Data RAM), RAM2 (8kByte Cache Shared RAM), RAM3 (8kByte Cache Shared RAM), an d RAM4 (32kByte Buffer RAM). All the RAM regions can be used to execute code and hold data. Flash Address Space is a virtual space which is mapped to external Flash to extend th e code space in XIP (eXecute In Place) mode.
2. Features
General
Ultra low power consumption with intelligent PMUSupports Bluetooth 5.0 core specificati
Supports 2Mbps LE
LE advertising ExtensionsLE Long Range
on
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 Additional Adv channel  Channel Selection #2  High Duty Cycle Non-Connectable Adv  Direction Find – Connection mode AoA/AoD  Integrated MCU to execute Bluetooth protocol stack  Supports multiple level Low Energy states  Supports LE L2CAP Connection Oriented Channel Support  Supports LE low duty directed advertising  Supports LE data length extension feature  Supports OTA (Over-the-Air) programming mechanism for firmware upgrade  Supports GAP, ATT/GATT, SMP, L2CAP  Generic Applications for GAP Central, Peripheral, Observer and Broadcaster Roles
Platform
ARM Cortex-M4 with floating-point unit (Maximum 40MHz) Serial flash controller (One and Qual-bits mode) with 16kB 4-way cache. Total 160kB SRAM 4Kbits eFUSE for manufacturer use Supports AES128/192/256 encrypt/decrypt engine
Bluetooth Transceiver
RX sensitivity: -97dBm BLE(min) Fast AGC control to improve receiving dynamic range Supports Bluetooth Low Energy PHY
Peripheral Interfaces
Flexible General Purpose IOs
RTL8762CK: 32GPIOs (max)
Hardware Keyscan and Quad-decoder Embedded IR transceiver
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Real-Time Counters (RTC)
Cortex-M4F 32-bit
1.3 Inch TFT BOE IPS 240*240
FPC external expansion
Mechanical specifications
 Supports generic 4-wire SPI master/slave  Supports 8 channel Low power comparator  400ksps, 12bit, 8channel AUXADC  Timers x 8  I2C x 2  PWM x 8  UART x 2  I2S/PCM interface for external audio codec  Supports I8080 interface for LCD
Supports external 40MHz XTAL without capacitor (in limited condition) Supports external 32.768kHz XTAL without capacitor (in limited condition) Support embedded internal 32K RCOSC to keep BLE link (in limited condition) Embedded PGA and audio ADC with 5-band EQ for analog MIC interface
Package
RTL8762CK: 48-pin 6x6mm QFN
2.Electrical specifications
Core module MCU core
Flash 128Kb+128Mb LCD G- sensor STK8321 TP All touch BT Bluetooth 5. 0 (Bluetoot h L o w E ne rgy or Bluetooth Smart) Motor Wire bonding
function
Material PCB Module
RTL8762CK
ARM
Heart rate + charging
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Size 34.8*28*0.6MM
Opening SMD
Protection Upon system
Flammability FR4
Environmental specifications
Operating temperature -20°C to +60°C Storage temperature -20°C to +60°C
3:Interface definition description
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FCC Regulatory notices
Modification statement
Timex Group USA, Inc. has not approved any changes or modifications to this device by the user.
Any changes or modifications could void the user’s authority to operate the equipment. Interference
statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS
standard(s). Operation is subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference that may cause
undesired operation of the device.
RF exposure
This equipment complies with FCC and ISED radiation exposure limits set forth for an uncontrolled
environment. The antenna should be installed and operated with minimum distance of 20 cm
between the radiator and your body. Antenna gain must be below 3 dBi.
This transmitter must not be co-loc
The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to above, a separate approval is required to satisfy the SAR
requirements of FCC Part 2.1093.
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
ated or operating in conjunction with any other antenna or transmitter.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Labelling Requirements for the Host device
The host device shall be properly labelled to identify the modules within the host device. The certification
label of the module shall be clearly visible at all times when installed in the host device, otherwise the
host device must be labelled to display the FCC ID and ISED of the module, preceded by the words
"Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning,
as follows:
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Model: WIFI module
Contains FCC IDEP
The host OEM user manual must also contain clear instructions on how end users canfind and/or access
the module and the FCC ID and ISED.
Model: WIFI module
Contains FCC IDEP9-TMXM05L
9-TMXM05L
OEM Statement
a. The module manufacturer must show how compliance can be demonstrated only for specific host or hosts
b. The module manufacturer must limit the applicable operating conditions in which t transmitter will be used, and
c. The module manufacturer must disclose that only the module grantee can make the te evaluation that the module is compliant in the host. When the module grantee either refuses to make this evaluation, or does not think it is necessary, the module certification is rendered invalid for use in the host, and the host manufacturer has no choice other than to use a different module, or take responsibility (§ 2.929) and obtain a new FCC ID for the product.
d. The module manufacturer must provide the host manufacturer with the followi requirements:
i. The host manufacturer is responsible for additional testing to verify compliance as composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (i.e. fundamental and out of band emissions).
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Part 15 Subpart C Section 15.249
The EUT uses external antenna, antenna gain: 0 dBi. There is no restriction on the installation method.
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The EUT uses external antenna, antenna gain: 0 dBi.
EP9-TMXM05L
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EP9-TMXM05L
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