Thundercomm Technology TURBOXSOMD845 User Manual

Thundercomm TurboX D845 System on Module

Thundercomm TurboX

A high performance embedded platform based on Qualcomm® Snapdragon

D845 System on Module

845

™

processor

Description

Thundercomm TurboXTMD845 System on Module(SOM) is a high performance intelligent module, integrating

Android or Linux system, based on Qualcomm SDA845 processor. It integrates the advanced 10 nm Fin FET

process, a customized 64-bit ARM v8-compliant Octacore Qualcomm Kryo 385 applications processor.

TurboX D845 SOM supports short-range wireless communication through Wi-Fi 802.11 a/b/g/n/ac and BT5.0.

This SOM supports 3840*2400@60fps display, it can connect 4 x camera modules, and integrating multiple

audio and video input/output interfaces. This SOM provides a variety of GPIO, I2C, UART and SPI standard

interfaces. In addition, it supports two MIPI-DSI, four MIPI-CSI and SOM common standard protocol

interfaces such as USB3.1, PCIE2.1/3.0, I2S and SLIMBUS.

TurboX D845 SOM provides convenient and stable system solution for IOT field, it can be embedded into the

device on VR/AR, Drone, Robot, Smart Camera, AI devices, and any other connecting fields. The size of

module is 37mm x 60mm x 7.1mm, weight 10.3g, with 336PINs.

Features

The following table shows the detailed features and performance on TurboX D845 SOM.

Processors

64-bit applications processor (Kryo 385) with 2 MB L3 cache

Applications

Processor

Quad high-performance Kryo cores at 2.649 GHz - Kryo Gold cluster with 256 kB L2

cache per core

Quad low-power Kryo cores at 1.766 GHz - Kyro Silver cluster with 128 kB L2 cache

per core

Digital signal

Compute DSP with Qualcomm Hexagon Vector Extensions (dual-HVX512) processor

processing

Thundercomm TurboX D845 System on Module

Sensor core

Operating System Android OS 8

Memory

Snapdragon™ sensor core with dedicated sensor DSP and 1.0 MB memory (512 kB

TCM + 512 kB L2) to support always-on low-power use cases

64GB UFS + LPDDR4x 4GB

Four-channel PoP high-speed memory – LPDDR4x SDRAM (4 x 16-bit) designed for a

1866 MHz clock.

Multimedia

2 x 4-lane DSI DPHY 1.2 and DisplayPort 1.4 data concurrency over USB

Maximum concurrency configurations

Display support

3840x2400 at 60Hz primary + 3840 x 2160 or 4096 x 2160 at 60Hz DP

2 x 2560 x 1600 at 60 fps primary + 3840 x 2160 or 4096 x 2160 at 60fps DP

Support 3 x 4-lane MIPI_CSI + 1 x 2-lane MIPI_CSI

Dual 14-bit ISP + one Lite ISP

Camera support

Real-time sensor input resolution: 16 + 16 +2 MP

32 MP 30 fps ZSL with a dual ISP

16 MP 30 ZSL with single ISP

Video

4K60 encode for H.264 High Profile, H265 Main 10 Profile

Encode

4K30 encode for VP8

Decode 4K60 decode for H.264 High Profile, H265 Main 10 Profile and VP9 Profile 2

Graphics Adreno 630 - 4K 60 fps UI or 2x 2k x 2k 90 fps UI

Thundercomm TurboX D845 System on Module

OpenGL ES 3.2 + AEP, DX next, Vulkan 2

OpenCL 2.0 full profile, RenderScript

Audio (build in TurboX D845 Carrier Board)

Five DACs, five outputs

five differential analog inputs; four ADCs

Six digital microphones

Codec

Open DSP CPE voice activation subsystem for ultra low-power voice wake-up

Native DSD (WCD9341 only), MBHC, and ANC

130 dB dynamic range, 32-bit DAC

Low-power audio

Voice codec

support

Enhanced audio

Low-power, low-complexity; 7.1 surround sound

QCELP, EVS, EVRC, EVRC-B, EVRC-WB; G.7 Gen, G.729A/AB;

GSM-FR, GSM-EFR and GSM-HR; AMR-NB and AMR-WB

Surround sound: advanced multichannel

FluenceTMPro noise cancellation; enhanced speaker protection

Qualcomm enhance 3D audio solution, Qualcomm stereo audio expansion feature, and Qualcomm intelligent mixing algorithm

Wireless connectivity

2.4G/5G, support 802.11 a/b/g/n/ac, 2 X 2 MIMO

WLAN

Support Bluetooth 5.0 + HS

Bluetooth

BLE

Connectivity

Thundercomm TurboX D845 System on Module

USB

PCIe 2x PCIe, one Gen 2 1-lane with PHY 2.1 and one Gen 3 1-lane with PHY 3.0

SDIO SD V3.0 4-bit for SD card

QUP 4 bit each; Multiplexed serial interface functions, can be configured as UART, I2C, SPI

SLIMbus One, highly multiplexed, high-speed, baseline WCD9340/WCD9341

MI2S

GPIO

2x USB 3.1, one can support Type-C with DisplayPort

Full duplex stereo or up to quad channel Tx/Rx MI2S (x3)

Up to eight channels for multi-channel Tx/Rx audio applications (x1)

12+ GPIO ports

Others

Support ADC interfaces

ADC Interface

Touchscreen

support

Physical size

Operating

temperature

RoHS All hardware components are fully compliant with EU RoHS directive

used for input voltage sense, battery temperature detection and general purpose

ADC

Capacitive panels via ext IC (I2C, and interrupts)

Size: 37mm x 60mm x7.1mm

Weight: approx. 10.3g

Interface: Connector

-20~50℃

Thundercomm TurboX D845 System on Module

Applications

TurboX D845 SOM is ideal for many applications including (but not limited to): AI, Robotics, Virtual Reality

(VR), Augmented Reality (AR),Drones and Medical Devices.

Revision History:

Version Date Description

V1.0 July 31, 2018 Revised Release

V1.1 Sep 28, 2018 Update the pin definition description

V1.2 Oct 8, 2018 Update format

Thundercomm TurboX D845 System on Module

Table of Contents

1 Physical Description............................................................................................................................................ 9

1.1 Major Components Location................................................................................................................9

1.2 Connectors Function and Part Number................................................................................................ 10

1.3 Package Drawing and Dimensions.......................................................................................................11

2 Functional Overview..........................................................................................................................................12

2.1 DSP(Hexagon v65)...............................................................................................................................12

2.2 Visual Processing Subsystem...............................................................................................................12

2.3 Secure Processing Unit (SPU)..............................................................................................................13

2.4 ISP(ISP280).......................................................................................................................................... 14

2.5 Connection............................................................................................................................................14

3 Interfaces Description........................................................................................................................................15

3.1 Interfaces Parameter Definitions..........................................................................................................15

3.2 Interfaces Detail Description................................................................................................................16

3.2.1 Power Supply Interface................................................................................................................ 16

3.2.2 Touchscreen Interface...................................................................................................................17

3.2.3 Display Interface.......................................................................................................................... 17

3.2.4 Camera Interfaces.........................................................................................................................18

3.2.5 Audio Interface.............................................................................................................................20

3.2.6 USB & DisplayPort Interface.......................................................................................................21

3.2.7 PCIe Interface...............................................................................................................................22

3.2.8 SSC Interface................................................................................................................................23

3.2.9 SDIO Interface..............................................................................................................................24

3.2.10 QUP Interface............................................................................................................................... 24

3.2.11 Power on Interface........................................................................................................................25

3.2.12 Reset Interface.............................................................................................................................. 26

Thundercomm TurboX D845 System on Module

3.2.13 Keys Interface...............................................................................................................................27

3.2.14 Sensor Interrupt Interface.............................................................................................................27

3.2.15 Debug UART Interface.................................................................................................................27

3.2.16 Battery Interface...........................................................................................................................28

3.2.17 ADCs Interface.............................................................................................................................28

3.2.18 PWMs and LED Current Driver Interface................................................................................... 28

3.2.19 Antenna Interface......................................................................................................................... 29

4 Connector PIN Summary......................................................................................................................................30

4.1 CON2401 BTB Connector................................................................................................................... 30

4.2 CON2402 BTB Connector................................................................................................................... 33

4.3 J2 BTB Connector................................................................................................................................ 36

5 Electrical Characteristics.................................................................................................................................. 37

5.1 Absolute Maximum Ratings.................................................................................................................37

5.2 Operating Conditions............................................................................................................................37

5.3 Digital-logic characteristics..................................................................................................................38

5.3.1 Digital GPIO characteristics.....................................................................................................38

5.3.2 SD card digital I/O characteristics............................................................................................... 39

5.4 MIPI......................................................................................................................................................40

5.5 USB.......................................................................................................................................................40

5.6 PCIe...................................................................................................................................................... 40

5.7 DisplayPort........................................................................................................................................... 41

5.8 SLIMbus............................................................................................................................................... 41

5.9 SDIO.....................................................................................................................................................41

5.10 I2S.........................................................................................................................................................41

5.11 I2C........................................................................................................................................................ 43

5.12 SPI.........................................................................................................................................................43

5.13 Fuel gauge.............................................................................................................................................44

Thundercomm TurboX D845 System on Module

5.14 LED Current Driver..............................................................................................................................44

5.15 ADC......................................................................................................................................................45

5.16 Power Consumption............................................................................................................................. 46

5.17 Thermal.................................................................................................................................................46

Thundercomm TurboX D845 System on Module

1.1 Major Components Location

1 Physical Description

TurboX D845 SOM’s major components as below map.

Figure 1.1- 1 TurboX D845 SOM Key component Location

Thundercomm TurboX D845 System on Module

1.2 Connectors Function and Part Number

Below table indicates connectors detail information.

Part Reference Description

BTB connectors, used for connecting to

CON2401,CON2402

Carrier Board.

J2 JTAG connector, used for JTAG Debug AXG7160J7 Panasonic

J3002,J5701,J5801 RF antenna connector, J3002 is for 818000500 ECT

Table 1.2- 1 Connector part number and information

Manufacturer Part

Manufacturer

Number

FX10A-168P-SV HIROSE

Thundercomm TurboX D845 System on Module

1.3 Package Drawing and Dimensions

Figure 1.3- 1 Top View

Figure 1.3- 2 Side View

Figure 1.3- 3 Bottom View

Thundercomm TurboX D845 System on Module

2 Functional Overview

2.1 DSP(Hexagon v65)

 Hexagon Coprocessor (HCP) and VMA1.0

 Universal Bandwidth Compression(UBWC) and DMA1.0

 Vector TCM (VTCM)

 Scatter-Gather support

 HVX contexts and concurrency

 Migrating to 128-byte mode for future forward compatibility

 dspCV_init is deprecated

 New HAP DCVS v2 APIs for clock and bus voting

 dspCV_concurrency is deprecated

 Session restart

 SDK 3.x

 Camera streaming – four tap points

 Dedicated bus for camera streaming on the cDSP

 Dedicated high-speed bus for data transfer from the DDR to the cDSP

 FastCV software development kit with HVX acceleration

2.2 Visual Processing Subsystem

 Improved GPGPU

 Enhanced image processing for GPGPU use cases

 Native MIPI and Bayer texture format support

 Enhanced mathematics for machine learning (matrix Mul)

 Architectural improvements for performance and power

 Efficient multiview rendering for VR/AR

Thundercomm TurboX D845 System on Module

 More efficient, wider Shader microarchitecture

 Significant resource (ALU) increase in Shader Processors

 Increased texture performance

 Memory bandwidth reduction and efficiency improvements

 Improved UI with updated 2D rasterization patterns

 Improved hidden surface removal to reduce work

 Better lossless compression to reduce memory bandwidth and power

 Improvements for Vulkan support

 Reduced overhead in hardware and driver

2.3 Secure Processing Unit (SPU)

 Qualcomm Trusted Execution Environment

 Isolates secure and non-secure software operations

 Small code base, rigorously reviewed

 Based on ARM’s TrustZone architecture

 Secure Boot

 Deters unauthorized code execution

 Tamper resistant root of trust in ROM or e-fuses

 Hardware Crypto

 FIPS certifiable cryptographic engines and HW keys for more robust and fast encrypt/decrypt

 Secure Storage and Key Provisioning

 OTP e-fuse memory for storage of keys and configurations

 Secure file system for encrypted storage of DRM keys and certificates

 Provisioning of Keys

 Secure Debug

 Prevents JTAG debugger connection in commercial products and reverse engineering

 Set by e-fuse, with support for secure RMA

operations

Thundercomm TurboX D845 System on Module

2.4 ISP(ISP280)

 IFE: Image front-end engine

 Bayer process for preview/video only

 Stats for 3A

 Muti-pass outputs feeding to IPE

 IPE: Image processing engine, consists of 2 parts

 NPS: Noise processing segment

 PPS: Post processing segment

 BPS: Bayer processing segment

 Bayer process and noise reduction for snapshot only

 Simple stats for special offline processing

 Muti-pass outputs feeding to IPE

2.5 Connection

 2 x 2 802.11ac with MU-MIMO

 160 MHz & DBS support

 Bluetooth 5.0  Optional dedicated BT antenna support concurrent operation for WLAN and BT with and without

 RF performance meets all carrier requirments

 Industry leading throughput

 Low power island on MSM for lowest Wi-Fi power consumption (up to 61% improvement)

 BT/BTLE integration within WCN3990 for lowest BT power consumption (up to 87% improvement)

dedicated BT antenna

Thundercomm TurboX D845 System on Module

3 Interfaces Description

3.1 Interfaces Parameter Definitions

This chapter introduces all the interfaces definition, purpose to guide developer easy to design and

verification on Thundercomm TurboXTMD845 SOM.

Symbol Description

AI Analog input

AO Analog output

B Bidirectional digital with CMOS input

CSI Supply voltage for MIPI_CSI circuits and I/O; (1.8 V only)

DI Digital input(CMOS)

DSI Supply voltage for MIPI_DSI I/O; (1.8 V only)

DO Digital output(CMOS)

H High-voltage tolerant

Programmable pull resistor. The default pull direction is indicated using capital letters

and is a prefix to other programmable options:

NP: pdpukp = default no-pull with programmable options following the colon (:)

nppdpukp

KP Contains an internal weak keeper device (keepers cannot drive external buses)

MIPI Mobile industry processor interface

PD: nppukp = default pull-down with programmable options following the colon (:)

PU: nppdkp = default pull-up with programmable options following the colon (:)

KP: nppdpu = default keeper with programmable options following the colon (:)

NP Contains no internal pull

OD Open drain

PD Contains an internal pull-down device

PI Power input

PO Power output

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Thundercomm Technology TURBOXSOMD845 User Manual

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