Themis RES-XR4-1U Installation Manual

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User Manual

Installation

Manual

RES-XR4-1U

1RU 19” Rack-Mount Rugged Enterprise Server

Supporting X9DRW, X9DBU and X9SCi Motherboards

Vers i o n 1. 5

Pa r t N u m b er: 1197 08 - 02 4

version

1.5

version

1.5

version

1.5

version

1.5

version

1.5

version

1.5

version

1.5

version

1.5

Supporting X9DRW, X9DBU and X9SCi Motherboards

RES-XR4-1U

Supporting X9DRW, X9DBU and X9SCi Motherboards

RES-XR4-1U

Supporting X9DRW, X9DBU and X9SCi Motherboards

RES-XR4-1U

Supporting X9DRW, X9DBU and X9SCi Motherboards

RES-XR4-1U

Supporting X9DRW, X9DBU and X9SCi Motherboards

RES-XR4-1U

Supporting X9DRW, X9DBU and X9SCi Motherboards

RES-XR4-1U

Supporting X9DRW, X9DBU and X9SCi Motherboards

RES-XR4-1U

Supporting X9DRW, X9DBU and X9SCi Motherboards

RES-XR4-1U

RES-XR4-1U Installation Manual*

Version 1.5— June 2014

* Supports SuperMicro X9DRW, X9DBU, and X9SCi Motherboards.

Themis Computer—Americas and Pacific Rim 47200 Bayside Parkway Fremont, CA 94538 Phone (510) 252-0870 Fax (510) 490-5529 World Wide Web http://www.themis.com

Themis Computer—Rest of World 5 Rue Irene Joliot-Curie 38320 Eybens, France Phone +33 476 14 77 80 Fax +33 476 14 77 89

photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without the prior written permission of Themis Computer.

The information in this publication has been carefully checked and is believed to be accurate. However, Themis Computer assumes no responsibility for inaccuracies. Themis Computer retains the right to make changes to this publication at any time without prior notice. Themis Computer does not assu me any liability arising from the application or use of this publicat ion or the product(s) described herein.

RESTRICTED RIGHTS LEGEND: Use, duplication, or disclosure by the United States Government is subject to the restrictions set forth in DFARS 252.227-7013 (c)(1)(ii) and FAR 52.227-19.

TRADEMARKS and SERVICEMARKS

Themis® is a registered trademark of Themis Computer, Inc.

Intel

and Xeon® are registered trademarks of Intel Corporation.

Red Hat Linux SuperMicro

All other trademarks, servicemarks, or registered trademarks used in this publication are the property of their respective owners.

is a registered trademark of Red Hat, Inc.

is a registered trademark of Linus Torvalds.

and SuperDoctor™ are registered trademarks of Super Micro Computer, Inc.

CE Marking

This product complies with the European EMC Directive (2004/108/EC) and the European Low Voltage Safety Directive (2006/95/EC)/.

Safety Precautions

Instructions regarding safety precautions during installation, operation, or maintenance of the equipment are given in the section entitled “Safety Instructions” on page v.

WARNINGS and CAUTIONS

The definitions of WARNINGS and CAUTIONS as used in this document are given in the Preface in the section entitled “Notes, Cautions, Warnings, and Sidebars”.

Themis Customer Support

North America, South America, and Pacific Rim

Telephone: 510-252-0870

Fax: 510-490-5529

E-mail: support@themis.com

Web Site: http://www.themis.com

RES-XR4-1U Installation Manual, Version 1.5

June 2014 Part Number: 119708-024

RES-XR4-1U Installation Manual

Version Revision History

Ve rs ion 1 .5 ....................................................................................... June 2014

• Added German translation to the safety section of this manual

• minor edits and changes throughout this manual

Ve rs ion 1 .4 .................................................................................. January 2014

• Updated the Safety section of the manual

• Updated shock specification to 30 g

• Corrected improper roman numeral page numbering

• Updated all Xeon™ specs to reflect the V2 series (where applicable)

• Updated specs in table 1-1

• Corrected information in table 1-2

• Corrected the front panel LED colors in figure 1-4

• Corrected the icon for the “off state” in table 1-4

• Corrected table 1-5 to properly correlate I/O to correct motherboard

• Corrected all references to 38-mm fans (proper size is 40-mm)

• Added complete BMC section detailing both Renesas and WPCM450R

• Updated table 1-6 to include missing specifications

• Updated electrical table 1-7

• Updated table 1-8 to include more RES-XR4 systems

• Updated table 2-1 to reflect new memory specifications for X9DRW

• Added notes throughout the manual regarding proper battery disposal

• Updated figure 2-16 to include drive/drive tray installation procedure

• Added section in Chapter 3 for BIOS Error Beep Codes

• Added section in Chapter 3 for BIOS Recovery

• Added section for UID in Appendix A

• Added torque spec (20-inch lbs) for the rack slides in Appendix B

• minor edits and updates throughout this manual

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Ve rs ion 1 .3.................................................................................. October 2013

• Added Power Supply Monitoring section in Chapter 1.

Ve rs ion 1 .2.................................................................................. October 2013

• Updated Specs and DC power supply information, and added version 2 CPU information.

Ve rs ion 1 .1....................................................................................August 2013

• Added all available and planned motherboard configurations as of this date.

Ve rs ion 1 .0.....................................................................................March 2013

• Initial Release

Themis Computer

Safety Instructions

To maximize user safety and ensure correct device operation, all instructions contained in this section should be read carefully.

Caution: It is important that the user observe all warnings and instructions that are on the device and contained in this manual.

Caution: The protection of the building serves as protection for the equipment.

RES-XR4-1U Installation Manual

Safety Instructions

Caution: When rack mounted, never lean on the server . It is prohibited to lean on the server while it is pulled on slide rails (telescopic rails) outside of the rack (bay). Personal injury and equipment damage can occur.

WARNING: All equipment connected to the product must conform to their standards WARNING: This Themis PRODUCT must be used in sheltered environments only, and

at an altitude of less than 3048 meters (10,000 ft).

• The device must be used in accordance with the instructions for use.

• Electrical installations in the room must correspond to the requirements of respective regulations.

• Take care that there are no cables, particularly mains cables, in areas where persons can trip over them.

• Do not use a mains connection in sockets shared by a number of other power consumers. Do not use an extension cable.

• Only use the mains cable supplied.

• Power cord requirements: Europe: A power supply unit operating at a nominal voltage of 240V must use a power cord rated for a minimum operating voltage of 200V and is not to be used with an operational voltage below 200V USA: A power supply unit operating at a nominal voltage of 120V must use a power cord rated for a minimum operating voltage of 100V and is not to be used with an operational voltage below 100V

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RES-XR4-1U Installation Manual Version 1.5

• The AC input rating for the 750W (max) power supply units are as follows: 100-240 VAC, 12-6A, 47/63 Hz.

• The unit is completely disconnected from the power source only when all power cords are disconnected from the power source. Therefore the power cord(s) and its connectors must always remain easily accessible.

• Do not set up the device in the proximity of heat sources or in a damp location. Make sure the device has adequate ventilation.

• Manufacturer recommended ambient temperature is 21°C

• All connection cables must be screwed or locked to the chassis housing.

• The device is designed to be used in horizontal position only.

• The device is no longer safe to operate when — the device has visible damage or — the device no longer functions.

• In these cases, the device must be shut down and secured against unintentional operation.

• Repairs/service may only be carried out by a Themis Computer qualified service technician.

• Do not open the chassis, or perform services/repairs when the equipment is powered on, due to electrical shock hazard.

• The device may only be opened for the installation and removal of extension (PCI) cards, memory modules, storage drives, fan housings, power supplies, and the lithium battery—all in accordance with the instructions given in this manual.

• If extensions are made to the device, the legal stipulations and the device specifications must be observed.

• The device must be switched off when removing the top cover; for example, before installing extension (PCI) cards.

Operation of Laser Source Devices

DVD/CD-ROM drives contain laser light-emitting diodes (classified in accordance with IEC 825-1:1993: LASER CLASS 1) and, therefore, must not be opened.

If the enclosure of such a drive is opened, invisible laser radiation is emitted. Do

Themis Computer

not allow yourself to be exposed to this radiation. The laser system meets the code of Federal Regulations 21 CFR,1040 for the USA

and Canadian Radiation Emitting Devices Act, REDR C 1370.

Electrostatic Discharge (ESD)

A sudden discharge of electrostatic electricity can destroy static-sensitive devices or micro-circuitry. Proper packaging and grounding techniques are necessary precautions to prevent damage. Always take the following precautions:

1. Transport boards in static-safe containers such as boxes or bags.

2. Keep electrostatic-sensitive parts in their containers until they arrive at static-

free stations.

3. Always be properly grounded when touching a sensitive board, component, or

assembly.

RES-XR4-1U Installation Manual

Safety Instructions

4. Store electrostatic-sensitive boards in protective packaging or on conductive

foam.

Grounding Methods

Finnish: laite on liitettävä suoja maadoituskoskettimilla varustettuun pistorasiaan Norwegian: Apparatet må tilkoples jordet stikkontakt Swedish: Apparaten skall anslutas till jordat uttag

Guard against electrostatic damage at workstations by following these steps:

1. Cover workstations with approved anti-static material. Provide a wrist strap

connected to a work surface and properly grounded tools and equipment.

2. Use anti-static mats, heel straps, or air ionizers to give added protection.

3. Provide a wrist strap connected to a work surface and properly ground tools and

equipment.

4. Handle electrostatic-sensitive components, boards, and assemblies by the case

or the PCB edge.

5. Avoid contact with pins, leads, or circuitry.

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6. Turn off power and input signals before inserting and removing connectors or

test equipment. Power is not considered off until all power supplies have been disconnected.

7. Keep the work area free of non-conductive materials such as ordinary plastic as-

sembly aids and Styrofoam.

8. Use field service tools, such as cutters, screwdrivers, and vacuums that are con-

ductive.

9. Always place drives and boards PCB-assembly-side down on the foam.

10. Grounding wire size shall be no less than 16 AWG.

11. Overcurrent Protection relies on proper building installation and Earth connec-

tion (ground).

12. High Voltage; Earth connection is essential before connecting the power supply units

Instructions for the Lithium Battery

Systems are equipped with a lithium battery installed on the motherboard. To replace this battery, please observe the instructions that are described in this manual.

Follow all local guidelines and regulations for disposing of used batteries .

Warning: There is a danger of explosion when the wrong type of battery is used as a replacement.

Warning: There is a danger of explosion if attempting to recharge the lithium battery installed on the motherboard.

Note: Switzerland: Annex 4.10 of SR 814.013 applies to standard batteries.

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Safety Instructions

European Union Waste Disposal

This section is for waste disposal by users in private households in the European Union. For all others, please follow all local and government guidelines in accordance with waste disposal and the symbol seen below.

This symbol on the product or on its packaging indicates that this product must not be

disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it to a designated collection point for the recycling of electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal help to conserve natural resources and ensure recycling respectful of the environment and human health. For more information on the recycling center nearest your home, contact the town hall, the household waste disposal service or the shop where you purchased the product.

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RES-XR4-1U Betriebshandbuch Version 1.5

Sicherheitshinweise

Lesen Sie im Interesse Ihrer eigenen Sicherheit und des bestimmungsgemäßen Gebrauchs diesen Abschnitt sorgfältig durch.

Achtung: Die Warnungen und Hinweise auf dem Gerät und in dieser Anleitung sind unbedingt zu beachten.

Achtung: Der Schutz des Gebäudes dient zum Schutz der Ausrüstung.

Achtung: Wenn der Rahmen montiert ist, nie auf dem Server aufstützen. Es ist

untersagt, sich auf dem Server aufzustützen, während er auf Gleitschienen (Teleskopschienen) außerhalb des Rahmens (Gestells) gezogen wird. Dies kann zu Personenschäden und zur Beschädigung des Geräts führen.

Warnhinweis: Alle Geräte, die an das Produkt angeschlossen werden, müssen ihren Standards entsprechen. Warnhinweis: Dieses THEMIS-Produkt darf nur in geschützten Umgebungen und in einer Höhe von weniger als 3.048 Metern (10.000 ft) eingesetzt werden

• Das Gerät darf nur entsprechend der Gebrauchsanweisung verwendet werden.

• Die elektrische Installation im Raum muss den geltenden Vorschrif ten entsprechen.

• Kabel (insbesondere Netzkabel) dürfen nicht in Bereichen verlegt werden, in denen Personen darüber stolpern können.

• Für den Netzanschluss dürfen keine Verteilerdosen benutzt werden, an die noch andere Stromverbraucher angeschlossen sind. Verwenden Sie keine Verlängerungskabel.

• Verwenden Sie nur das mitgelieferte Netzkabel.

• Anforderungen an das Netzkabel: Europa: Ein Netzteil mit einer Nennspannung von 240 V muss ein Netzkabel für eine Mindestbetriebsspannung von 200 V benutzen und darf nicht mit einer Betriebsspannung unter 200 V verwendet werden.

Themis Computer

RES-XR4-1U Betriebshandbuch

Sicherheitshinweise

USA: Ein Netzteil mit einer Nennspannung von 120 V muss ein Netzkabel für eine Mindestbetriebsspannung von 100 V benutzen und darf nicht mit einer Betriebsspannung unter 100 V verwendet werden

• Die AC-Eingangleistungen für 750 W (max.) Netzteile lauten wie folgt:100240 VAC, 12-6 A, 47/63 Hz.

• Die vollständige Trennung des Gerätes von der Netzspannung ist nur gewährleistet, wenn das Netzkabel vom Netz getrennt wird. Aus diesem Grund muss das Netzkabel samt seinen Anschlüssen jederzeit leicht zugänglich sein.

• Das Gerät darf nicht in der Nähe von Wärmequellen oder an einem feuchten Ort aufgestellt werden. Achten Sie auf eine ausreichende Belüftung des Gerätes.

• Alle Stecker an den Verbindungskabeln müssen am Gehäuse festgeschraubt oder festgeklemmt sein.

• Das Gerät darf nur in horizontaler Lage betrieben werden.

• Die Betriebssicherheit des Gerätes ist nicht mehr gewährleistet, wenn

— das Gerät sichtbare Beschädigungen aufweist oder — das Gerät nicht mehr funktioniert.

• In diesen Fällen muss das Gerät ausgeschaltet und gegen unbeabsichtigte Inbetriebnahme gesichert werden.

• Reparaturen dürfen nur von Beauftragten der Firma Themis Computer durchgeführt werden.

• Das Öffnen des Gerätes ist nur zulässig für den Ein- und Ausbau von Erweiterungskarten (PCI), Speichermodulen, Festplatten, Lüftergehäusen, Netzteilen und der Lithiumbatterie – entsprechend den Anweisungen in dieser Anleitung.

• Bei einer Erweiterung des Gerätes sind die gesetzlichen Bestimmungen und die Gerätespezifikationen zu beachten.

• Vor Abnehmen des Deckels, z.B. für den Einbau von Erweiterungskarten (PCI), erst das Gerät ausschalten.

Betrieb von Lasergeräten

DVD/CD-ROM-Laufwerke enthalten Laserdioden (Klassifizierung gemäß IEC 825-1:1993: LASERKLASSE 1) und dürfen deshalb nicht geöffnet werden.

Beim Öffnen des Laufwerkgehäuses tritt unsichtbare Laserstrahlung aus. Setzen

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RES-XR4-1U Betriebshandbuch Version 1.5

Sie sich dieser Strahlung keinesfalls aus. Das Lasersystem erfüllt die Anforderungen des Code of Federal Regulations 21

CFR,1040 (für die USA) und des Canadian Radiation Emitting Devices Act, REDR C 1370 (für Kanada).

Elektrostatische Entladung (ESD)

Eine plötzliche elektrostatische Entladung kann empfindliche Geräte oder Mikroschaltungen zerstören. Dem ist durch ordnungsgemäße Verpackung und Erdung unbedingt vorzubeugen. Die folgenden Vorsichtsmaßnahmen sind jederzeit zu beachten:

1. Transportieren Sie Platinen in elektrostatisch sicheren Behältern oder T aschen.

2. Belassen Sie elektrostatisch empfindliche Bauteile bis zum Eintreffen an einem

antistatischen Ort in ihrem Behälter.

3. Achten Sie beim Berühren empfindlicher Platinen, Bauteile oder Baugruppen

stets auf eine gute Eigenerdung.

4. Lagern Sie elektrostatisch empfindliche Platinen in Schutzverpackungen oder

auf leitfähigem Schaumstoff.

Erdungsmethoden

Die folgenden Maßnahmen schützen vor elektrostatischen Schäden am Arbeitsplatz:

1. Legen Sie am Arbeitsplatz geeignete Antistatikmatten aus. Tragen Sie ein Er-

dungsarmband, das mit dem Arbeitsplatz verbunden ist, und verwenden Sie nur ausreichend geerdete Arbeitsmittel.

2. Verwenden Sie als zusätzlichen Schutz geeignete Antistatikfußmatten, Fersen-

bänder oder Luftionisatoren.

3. Fassen Sie elektrostatisch empfindliche Bauteile, Platinen und Baugruppen nur

am Gehäuse oder am Rand an.

4. Vermeiden Sie den Kontakt mit Stiften, Leitungen und Leiterbahnen.

5. Schalten Sie vor dem Anschließen und Trennen von Steckverbindern oder Prüf-

geräten alle Spannungs- und Signalquellen aus.

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Sicherheitshinweise

6. Verwenden Sie am Arbeitsplatz keine nichtleitenden Materialien, wie gewöhn-

liche Kunststoffmontagehilfen oder Styropor.

7. Benutzen Sie leitende W erkzeuge (z.B. Messer, Schraubendreher und S taubsau-

ger).

8. Legen Sie Laufwerke und Platinen immer mit der Bauteilseite nach unten auf

die Schaumstoffunterlage.

9. Die Größe der Erdungsleitung sollte nicht weniger als 16 AWG betragen.

10. Überstromschutz ist auf ordnungsgemäße Gebäudeinstallation und richtigen

Erdungsanschluss (Masse) angewiesen.

11. Hochspannung: Der Erdungsanschluss muss stimmen, bevor die Netzteile angeschlossen werden.

Hinweise zur Lithiumbatterie

Auf dem Motherboard von RES-Systemen befindet sich eine Lithiumbatterie. Beim Wechseln dieser Batterie sind die entsprechenden Hinweise in dieser Anleitung zu beachten.

Vorsicht: Beim Einbau einer Ersatzbatterie des falschen Typs besteht Explosionsgefahr.

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Table of Contents

Version Revision History ...................................................................................................... iii

Safety Instructions ...................................................................................................................v

Preface................................................................................................................................. xxix

1. Overview and Specifications ........................................................................................ 1-1

1.1 Overview ................................................................................................................ 1-1

1.1.1 External Features .......................................................................................1-3

1.2 Front Panel and System LEDs ............................................................................... 1-5

1.3 Rear Panel I/O ........................................................................................................1-8

1.4 Block Diagrams ...................................................................................................1-11

1.5 Internal Views ...................................................................................................... 1-14

1.6 Processor and Chipset Overview ......................................................................... 1-17

1.6.1 C602/C606 Chipset .................................................................................. 1-17

1.6.2 Main Features of the E5-2400/E5-2600 Series Processor and C602/

C606 Chipset ............................................................................................ 1-17

1.6.3 C204 Chipset ............................................................................................1-18

1.6.4 Main Features of the E3-1200 Series Processor and C204 Chipset ........ 1-19

1.7 Special Features ................................................................................................... 1-19

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1.7.1 Recovery from AC Power Loss ............................................................... 1-19

1.7.2 PC Health Monitoring .............................................................................. 1-19

1.7.2.1 Fan Status Monitor ....................................................................1-20

1.7.2.2 Environmental Temperature Control ........................................ 1-20

1.7.2.3 System Resource Alert ..............................................................1-20

1.7.3 Power Supply Monitoring ........................................................................ 1-20

1.7.3.1 I2C Notes .................................................................................. 1-21

1.7.3.2 Sample I2C Commands ............................................................1-21

1.7.4 ACPI Features ..........................................................................................1-22

1.7.5 Slow Blinking LED for Suspend-State Indicator .................................... 1-22

1.7.6 Super I/O .................................................................................................. 1-22

1.7.7 Overview of the Renesas SH7757 ...........................................................1-22

RES-XR4-1U Installation Manual Version 1.5

1.7.7.1 BMC Subsystem Features ......................................................... 1-23

1.7.8 Overview of the Nuvoton WPCM450 BMC ........................................... 1-23

1.7.8.1 WPCM450R DDR2 Memory Interface .................................... 1-24

1.7.8.2 WPCM450R PCI System Interface .......................................... 1-24

1.7.8.3 Other Features of the WPCM450 BMC Controller .................. 1-24

1.8 Specifications .......................................................................................................1-26

1.8.1 General .....................................................................................................1-26

1.8.2 Electrical .................................................................................................. 1-27

1.8.2.1 System Power ........................................................................... 1-27

1.8.2.2 Output Voltage .......................................................................... 1-28

1.8.3 Environmental ..........................................................................................1-28

1.8.3.1 Shock ........................................................................................1-28

1.8.3.2 Electrostatic Discharge ............................................................. 1-28

1.8.3.3 Noise ......................................................................................... 1-28

1.9 Packaging and Shipping .......................................................................................1-29

1.9.1 Accessory Kit ...........................................................................................1-29

1.10 Rack-Mount Slides (Optional) ............................................................................. 1-30

1.11 RES System ......................................................................................................... 1-31

2. Installation and Operation ........................................................................................... 2-1

2.1 Installation Procedures ...........................................................................................2-1

2.1.1 Remove Protective Top Cover ................................................................... 2-1

2.1.2 Memory Modules ....................................................................................... 2-3

2.1.2.1 Memory Module Location .......................................................... 2-6

2.1.2.2 Installation ..................................................................................2-9

2.1.3 PCI Cards .................................................................................................2-11

2.1.3.1 Installing Cards ......................................................................... 2-12

2.1.4 Lithium Battery ........................................................................................ 2-15

2.1.4.1 Removing the Lithium Battery .................................................2-15

2.1.4.2 Installing a Lithium Battery ......................................................2-16

2.1.5 Storage Drive ........................................................................................... 2-17

2.1.5.1 Opening the RES-XR4-1U Front Doors ...................................2-17

2.1.5.2 Storage-Drive Removal ............................................................ 2-18

2.1.5.3 Storage Drive Installation ......................................................... 2-20

2.1.6 Cooling Fans ............................................................................................ 2-20

2.1.6.1 Removing and Installing the 40-mm Fan Assembly ................ 2-20

2.2 Power Supply .......................................................................................................2-22

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2.2.1 DC Power Supply Option ........................................................................2-22

2.2.2 Removing a Power Supply ...................................................................... 2-23

2.2.2.1 Chassis Grounding Screw .........................................................2-25

2.2.3 Installing a Power Supply ........................................................................ 2-26

2.2.4 Installing a Power Cord Retention Bracket ............................................. 2-27

2.2.5 Installing a USB Cable Retention Bracket .............................................. 2-29

2.3 Rack Mounts ........................................................................................................ 2-30

2.3.1 Mounting Brackets ................................................................................... 2-30

2.3.2 Rack-Mount Slides (Optional) ................................................................. 2-30

2.4 Operation .............................................................................................................2-31

2.4.1 Plugging in the AC Power Cords ............................................................. 2-31

2.4.2 Turning the System On ............................................................................ 2-31

2.4.3 Getting Started ......................................................................................... 2-32

2.4.3.1 Configuration ............................................................................ 2-32

2.4.3.2 Linux Installation ......................................................................2-32

2.4.4 Turning the System Off ........................................................................... 2-32

3. BIOS Setup Utility ........................................................................................................ 3-1

3.1 Introduction ............................................................................................................ 3-1

3.1.1 Starting BIOS Setup Utility ....................................................................... 3-1

3.1.2 How To Change the Configuration Data ................................................... 3-2

3.1.3 Starting the Setup Utility ........................................................................... 3-2

3.2 Main BIOS Setup ...................................................................................................3-3

3.2.1 System Overview .......................................................................................3-3

3.2.1.1 System Time/System Date .......................................................... 3-3

3.2.1.2 AMI BIOS ................................................................................... 3-4

3.2.1.3 Processor .....................................................................................3-4

3.2.1.4 System Memory ..........................................................................3-4

3.3 Advanced Setup Configuration ..............................................................................3-4

3.3.1 BOOT Features .......................................................................................... 3-5

3.3.1.1 Quiet Boot ................................................................................... 3-5

3.3.1.2 AddOn ROM Display Mode ....................................................... 3-5

3.3.1.3 Bootup Num-Lock ...................................................................... 3-5

3.3.1.4 Wait For 'F1' If Error .................................................................. 3-6

3.3.1.5 Interrupt 19 Capture ....................................................................3-6

3.3.2 Power Configuration ..................................................................................3-6

3.3.2.1 Watch Dog Function ...................................................................3-6

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3.3.2.2 Power Button Function ............................................................... 3-6

3.3.2.3 Restore on AC Power Loss .........................................................3-6

3.3.3 CPU Configuration .................................................................................... 3-6

3.3.3.1 Socket 1 CPU Information/Socket 2 CPU Information .............. 3-7

3.3.3.2 CPU Speed ..................................................................................3-7

3.3.3.3 Clock Spread Spectrum .............................................................. 3-7

3.3.3.4 Hyper-threading .......................................................................... 3-7

3.3.3.5 Active Processor Cores ...............................................................3-7

3.3.3.6 Limit CPUID Maximum .............................................................3-8

3.3.3.7 Execute-Disable Bit Capability ................................................... 3-8

3.3.3.8 Intel® AES-NI ............................................................................. 3-8

3.3.3.9 Hardware Prefetcher....................................................................3-8

3.3.3.10 Adjacent Cache Line Prefetcher..................................................3-8

3.3.3.11 DCU Streamer Prefetcher............................................................ 3-8

3.3.3.12 DCU IP Prefetcher ...................................................................... 3-8

3.3.3.13 Intel Virtualization Technology................................................... 3-9

3.3.4 CPU Power Management Configuration ................................................... 3-9

3.3.4.1 Power Technology ...................................................................... 3-9

3.3.5 Chipset Configuration .............................................................................. 3-11

3.3.5.1 NorthBridge Configuration .......................................................3-11

3.3.5.2 QPI (Quick Path Interconnect) Configuration .......................... 3-12

3.3.5.3 DIMM Configuration ................................................................3-13

3.3.5.4 DIMM Information ................................................................... 3-13

3.3.5.5 SouthBridge Configuration .......................................................3-15

3.3.6 SATA Configuration ................................................................................3-16

3.3.6.1 SATA Port0~SATA Port5 ........................................................ 3-16

3.3.6.2 SATA Mode .............................................................................. 3-16

3.3.7 SCU (Storage Control Unit) Configuration ............................................. 3-17

3.3.7.1 Storage Controller Unit ............................................................. 3-17

3.3.7.2 OnChip SCU Option ROM ....................................................... 3-18

3.3.7.3 SCU Port 0-SCU Port 7 ............................................................3-18

3.3.8 PCIe/PCI/PnP Configuration ................................................................... 3-18

3.3.8.1 PCI ROM Priority .....................................................................3-18

3.3.8.2 PCI Latency Timer ....................................................................3-18

3.3.8.3 Above 4G Decoding.................................................................. 3-18

3.3.8.4 PERR# Generation .................................................................... 3-18

3.3.8.5 SERR# Generation .................................................................... 3-18

3.3.8.6 Maximum Payload ....................................................................3-19

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3.3.8.7 Maximum Read Request ........................................................... 3-19

3.3.8.8 ASPM Support ..........................................................................3-19

3.3.8.9 CPU1 SXB 1A OPROM/CPU1 SXB 1B OPROM/CPU1

SXB 1C OPROM/CPU2 SXB2 PCI-E 3.0 x16 OPROM ......... 3-19

3.3.8.10 Onboard LAN Option ROM Select ..........................................3-19

3.3.8.11 Load Onboard LAN1 Option ROM/Load Onboard LAN2

Option ROM ............................................................................. 3-20

3.3.8.12 VGA Priority .............................................................................3-20

3.3.8.13 Network Stack ........................................................................... 3-20

3.3.9 Super IO Configuration ........................................................................... 3-20

3.3.10 Serial Port 1 Configuration ...................................................................... 3-20

3.3.10.1 Serial Port ................................................................................. 3-20

3.3.10.2 Device Settings .........................................................................3-20

3.3.10.3 Change Settings ........................................................................ 3-20

3.3.10.4 Device Mode ............................................................................. 3-21

3.3.11 Serial Port 2 Configuration ...................................................................... 3-21

3.3.11.1 Serial Port ................................................................................. 3-21

3.3.11.2 Device Settings .........................................................................3-21

3.3.11.3 Change Settings ........................................................................ 3-21

3.3.11.4 Device Mode ............................................................................. 3-21

3.3.11.5 Serial Port 2 Attribute ............................................................... 3-21

3.3.12 Serial Port Console Redirection ...............................................................3-21

3.3.12.1 Console Redirection Settings ....................................................3-22

3.3.13 Serial Port for Out-of-Band Management/Windows Emergency

Management Services (EMS) ..................................................................3-23

3.3.13.1 Console Redirection Settings (for EMS) ..................................3-23

3.3.14 ACPI Settings ..........................................................................................3-24

3.3.14.1 ACPI Sleep State ......................................................................3-24

3.3.14.2 NUMA (NON-Uniform Memory Access) ................................ 3-25

3.3.14.3 High Precision Event Timer ..................................................... 3-25

3.3.15 Trusted Computing...................................................................................3-25

3.3.15.1 Configuration ............................................................................ 3-25

3.3.15.2 Current Status Information ....................................................... 3-26

3.3.16 Intel® TXT (LT-SX) Configuration ........................................................ 3-26

3.3.16.1 Intel

3.3.16.2 Intel

3.3.16.3 Intel

3.3.17 Intel

Themis Computer

ME Subsystem .............................................................................. 3-27

TXT (LT-SX) Hardware Support .................................. 3-26

TXT (LT-SX) Configuration Settings ............................ 3-26

TXT (LT-SX) Dependencies ......................................... 3-27

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3.3.18 iSCSI Configuration ................................................................................3-27

3.3.18.1 iSCSI Initiator Name ................................................................ 3-27

3.3.19 NIC Configuration ................................................................................... 3-28

3.3.19.1 Link Speed ................................................................................ 3-28

3.3.19.2 Wake On LAN (WOL) .............................................................3-28

3.3.19.3 Blink LEDs (Range 0~15 seconds) ...........................................3-28

3.3.19.4 Port Configuration Information ................................................ 3-28

3.4 Event Logs ........................................................................................................... 3-29

3.4.1 Change SMBIOS Event Log Settings ...................................................... 3-29

3.4.1.1 Enabling/Disabling Options ...................................................... 3-29

3.4.1.2 Erasing Settings ........................................................................3-30

3.4.2 SMBIOS Event Log Standard Settings .................................................... 3-30

3.4.2.1 Log System Boot Event ............................................................ 3-30

3.4.2.2 MECI (Multiple Event Count Increment) ................................. 3-30

3.4.2.3 METW (Multiple Event Count Time Window) ....................... 3-30

3.4.2.4 View SMBIOS Event Log ........................................................ 3-31

3.4.2.5 View System Event Log ...........................................................3-31

3.5 IPMI ..................................................................................................................... 3-32

3.5.1 System Event Log ....................................................................................3-32

3.5.1.1 Enabling/Disabling Options ...................................................... 3-32

3.5.1.2 Erasing Settings ........................................................................3-33

3.5.1.3 Custom EFI Logging Options ................................................... 3-33

3.5.2 BMC Network Configuration .................................................................. 3-33

3.5.2.1 LAN Channel 1 .........................................................................3-33

3.6 Boot Configuration .............................................................................................. 3-35

3.6.1 CSM Support ........................................................................................... 3-35

3.6.2 Boot Option Priorities ..............................................................................3-35

3.6.2.1 Boot Option #1~ Boot Option #4 ..............................................3-35

3.6.3 USB Device BBS Priorities ..................................................................... 3-36

3.6.3.1 Hard Disk Drives ...................................................................... 3-36

3.6.3.2 Network Drives ......................................................................... 3-36

3.6.4 Delete Boot Options .................................................................................3-36

3.6.4.1 Delete Boot Option ................................................................... 3-36

3.7 Security Settings ..................................................................................................3-37

3.7.1 Administrator Password ...........................................................................3-37

3.7.2 User Password ..........................................................................................3-37

3.8 Save and Exit .......................................................................................................3-38

Themis Computer

Table of Contents

3.8.1 Discard Changes and Exit ........................................................................ 3-38

3.8.2 Save Changes and Reset ..........................................................................3-38

3.8.3 Save Options ............................................................................................ 3-39

3.8.3.1 Save Changes ............................................................................3-39

3.8.3.2 Discard Changes .......................................................................3-39

3.8.3.3 Restore Optimized Defaults ...................................................... 3-39

3.8.3.4 Save as User Defaults ............................................................... 3-39

3.8.3.5 Restore User Defaults ............................................................... 3-39

3.8.3.6 Boot Override ........................................................................... 3-39

3.9 BIOS Error Beep Codes ....................................................................................... 3-40

3.10 BIOS Recovery .................................................................................................... 3-41

3.10.1 How to Recover the AMIBIOS Image (the Main BIOS Block) .............. 3-41

3.10.2 Boot Sector Recovery from a USB Device ............................................. 3-41

3.10.3 Boot Sector Recovery from an IDE CD-ROM ........................................3-42

3.10.4 Boot Sector Recovery from a Serial Port (“Serial Flash”) ...................... 3-42

Appendix A. Connector Pinouts ...................................................................................... A-1

A.1 PS/2 Keyboard and Mouse ................................................................................... A-1

A.2 USB Ports ............................................................................................................. A-2

A.3 Serial Ports ............................................................................................................ A-2

A.4 Gigabit Ethernet LAN Ports ................................................................................. A-3

A.5 VGA Display Port ................................................................................................. A-4

A.6 Unit Identifier Switch ........................................................................................... A-5

Appendix B. Rack-Mount Slide Installation ...................................................................B-1

Appendix C. Red Hat Enterprise Linux 5 Installation ..................................................C-1

C.1 Introduction ............................................................................................................C-1

C.2 Installation .............................................................................................................C-1

Appendix D. Optional RES Audio/USB/Serial Port Module ....................................... D-1

D.1 RES Audio/USB/Serial Port Custom Module ...................................................... D-1

D.1.1 Attach I/O Cables ...................................................................................... D-3

D.1.2 Connector Pinouts ..................................................................................... D-4

D.1.2.1 USB Ports A and B .................................................................... D-4

D.1.2.2 Serial Port COM1 ...................................................................... D-5

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D.1.2.3 Stereo Audio Ports (Optional) ................................................... D-6

D.2 Ordering the RES Audio/USB/Serial Port Custom Module ................................. D-7

Appendix E. Repackaging Instructions ...........................................................................E-1

E.1 Repackaging for Shipment ..................................................................................... E-1

E.2 Packaging Components ..........................................................................................E-2

E.3 Instructions for Repackaging .................................................................................E-3

Index ..............................................................................................................................Index-1

Reader Comment Card

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List of Figures

Figure 1 Rugged Enterprise Server RES-XR4-1U....................................................... xxix

Figure 1-1 RES-XR4-1U (with Front Doors installed) ..................................................... 1-1

Figure 1-2 RES-XR4-1U Front Panel Features................................................................. 1-3

Figure 1-3 RES-XR4-1U Motherboard I/O Options......................................................... 1-4

Figure 1-4 Front Panel LEDs and Indicators..................................................................... 1-5

Figure 1-5 Rear Panel I/O for X9DRW Motherboard....................................................... 1-8

Figure 1-6 Rear Panel I/O for X9DBU Motherboard........................................................ 1-9

Figure 1-7 Rear Panel I/O for X9SCi-LN4F Motherboard ............................................... 1-9

Figure 1-8 X9DRW Motherboard Block Diagram.......................................................... 1-11

Figure 1-9 X9DBU Motherboard Block Diagram........................................................... 1-12

Figure 1-10 X9SCi Motherboard Block Diagram ............................................................. 1-13

Figure 1-11 Top View of RES-XR4-1U with X9DBU Motherboard ................................ 1-14

Figure 1-12 Top View of RES-XR4-1U with X9DRW Motherboard ............................... 1-15

Figure 1-13 Top View of RES-XR4-1U with X9SCi-LN4F Motherboard....................... 1-16

Figure 2-1 Remove the RES-XR4-1U Protective Access Cover ...................................... 2-2

Figure 2-2 Memory Module Slot Locations (X9DBU-3/iF Motherboard) ....................... 2-6

Figure 2-3 Memory Module Slot Locations (X9DRW-3/iF Motherboard) ...................... 2-7

Figure 2-4 Memory Module Slot Locations (X9SCi-LN4F Motherboard)....................... 2-8

Figure 2-5 Remove RES-XR4-1U Air-Flow Deflector..................................................... 2-9

Figure 2-6 Memory Module Removal............................................................................. 2-10

Figure 2-7 Positioning of the RES-XR4-1U PCI/UIO Riser Cards ................................ 2-11

Figure 2-8 PCI Riser Cards attached to Retainer Bracket............................................... 2-12

Figure 2-9 Riser Card Inserted into PCI slots.................................................................. 2-12

Figure 2-10 Three PCI Expansion Slots............................................................................ 2-13

Figure 2-11 Installation of the PCI Card Retainer Bracket ............................................... 2-14

Figure 2-12 Lithium Battery.............................................................................................. 2-15

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Figure 2-13 Lithium Battery and Socket........................................................................... 2-16

Figure 2-14 Opening the RES-XR4-1U Front Doors........................................................ 2-17

Figure 2-15 Unlocking the RES-XR4-1U Storage Drives ................................................ 2-18

Figure 2-16 RES-XR4-1U Storage Drive Removal .......................................................... 2-19

Figure 2-17 DC Power Supplies........................................................................................ 2-22

Figure 2-18 Remove each Power Cord from the RES-XR4-1U rear chassis.................... 2-23

Figure 2-19 Remove the Power Cord Retention Bracket.................................................. 2-24

Figure 2-20 The RES-XR4-1U Rear Grounding Screw and Kep Nut .............................. 2-25

Figure 2-21 The RES-XR4-1U Power Supply Locking Mechanism ................................ 2-26

Figure 2-22 Install the Power Cord Retention Bracket ..................................................... 2-27

Figure 2-23 The RES-XR4-1U Power Cord Retention Bracket........................................ 2-28

Figure 2-24 The RES-XR4-1U USB Cable Retention Bracket......................................... 2-29

Figure 2-25 Right Rack-Mount Bracket............................................................................ 2-30

Figure 2-26 AC Power Socket and LED on the RES-XR4-1U Rear ................................ 2-31

Figure 2-27 System Power Button and LED on the RES-XR4-1U Front......................... 2-31

Figure 3-1 Main BIOS Setup Screen................................................................................. 3-3

Figure 3-2 Advanced Setup Screen ................................................................................... 3-5

Figure 3-3 Event Log Screen........................................................................................... 3-29

Figure 3-4 IPMI Settings Screen ..................................................................................... 3-32

Figure 3-5 Boot Settings.................................................................................................. 3-35

Figure 3-6 Security Settings Screen ................................................................................ 3-37

Figure 3-7 Exit Setting Screen......................................................................................... 3-38

Figure 3-1 AMI_FLSH Hyperterminal............................................................................ 3-44

Figure 3-2 ROM File Extraction ..................................................................................... 3-44

Figure 3-3 FLASH Recovery .......................................................................................... 3-45

Figure A-1 USB Connector Pinout.................................................................................... A-2

Figure A-2 COM 1 Serial Connector Pinout..................................................................... A-2

Figure A-3 Ethernet Connector, Type RJ45...................................................................... A-3

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Figure A-4 VGA Connector Pinout................................................................................... A-4

Figure B-1 Screw Locations for Rack-Mount Slides ......................................................... B-1

Figure B-2 RES-XR4-1U Rack-Mount Slide Installation.................................................. B-3

Figure C-1 Power On after Linux DVD is Inserted into Drive.......................................... C-2

Figure C-2 Skip Key .......................................................................................................... C-2

Figure C-3 Welcome Screen .............................................................................................. C-3

Figure C-4 Language Selection.......................................................................................... C-4

Figure C-5 Selecting Layout Type..................................................................................... C-5

Figure C-6 Enter Installation Number................................................................................ C-6

Figure C-7 Partitioning....................................................................................................... C-7

Figure C-8 Reviewing Option............................................................................................ C-8

Figure C-9 Creating a Custom Layout............................................................................... C-9

Figure C-10 Setting Up Boot Loader................................................................................. C-10

Figure C-11 Master Boot Record (MBR) .......................................................................... C-11

Figure C-12 Network Devices List .................................................................................... C-12

Figure C-13 Edit Interface Pop-Up Screen ........................................................................ C-13

Figure C-14 Selecting Time Zone...................................................................................... C-14

Figure C-15 Setting Up Root Account and Password........................................................ C-15

Figure C-16 Package Installation Default Screen.............................................................. C-16

Figure C-17 Optional Packages.......................................................................................... C-17

Figure C-18 Option to Review or Continue....................................................................... C-18

Figure C-19 Installation Begins ......................................................................................... C-18

Figure C-20 Installation is Complete ................................................................................. C-19

Figure C-21 Login Screen.................................................................................................. C-20

Figure C-22 Ready to use the Desktop............................................................................... C-20

Figure D-1 RES Audio/USB/Serial Port Custom Module ................................................ D-1

Figure D-2 Install the RES Audio/USB/Serial Port Custom Module ............................... D-2

Figure D-3 Attach the Appropriate I/O Cables ................................................................. D-3

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Figure D-4 Dual USB Connector Pinouts ......................................................................... D-4

Figure D-5 COM1 Serial Connector Pinout...................................................................... D-5

Figure D-6 Stereo Audio Connector Pinout...................................................................... D-6

Figure E-1 Packaging Components.................................................................................... E-2

Figure E-2 Order of Assembly........................................................................................... E-4

List of Tables

Table 1-1 Major Features of RES-XR4-1U .................................................................... 1-2

Table 1-2 RES-XR4-1U Motherboard Specifications .................................................... 1-3

Table 1-3 System LEDs .................................................................................................. 1-6

Table 1-4 Power Supply LED Behavior ......................................................................... 1-7

Table 1-5 Rear-Panel I/O Connectors........................................................................... 1-10

Table 1-6 RES-XR4-1U General Specifications........................................................... 1-26

Table 1-7 RES-XR4-1U Electrical Specifications........................................................ 1-27

Table 1-8 Approximate Weights of the RES-XR4 Series............................................. 1-31

Table 2-1 RES-XR4-1U Memory Capacity.................................................................... 2-3

Table 2-2 X9DBU-3/iF MB Memory Population........................................................... 2-4

Table 2-3 X9DRW-3/iF MB Memory Population.......................................................... 2-4

Table 2-4 X9SCi-LN4F MB Memory Population .......................................................... 2-4

Table 2-5 X9DBU-3/iF Optimal Memory Population.................................................... 2-4

Table 2-6 X9DRW-3/iF Optimal Memory Population .................................................... 2-5

Table 2-7 X9SCi-LN4F Optimal Memory Population ................................................... 2-5

Table 3-1 BIOS Error Beep Codes................................................................................. 3-40

Table A-1 PS/2 Keyboard/Mouse Pinouts and Signal Definitions................................. A-1

Table A-2 USB Connector Signal Definitions................................................................ A-2

Table A-3 COM 1 Serial Connector Signal Definitions................................................. A-2

Table A-4 RJ45 Ethernet Pinout Signals ........................................................................ A-3

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Table A-5 VGA Connector Pinout Signal Descriptions ................................................. A-4

Table A-6 Unit Identifier Switch Status.......................................................................... A-5

Table D-1 Dual USB Connector Pinout Signal Descriptions (J10)................................ D-4

Table D-2 COM1 Serial Connector Pinout Signal Descriptions (J8 and J9).................. D-5

Table D-3 Stereo Audio Out Connector Pinout Signal Descriptions (J1) ...................... D-6

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Preface

This document, entitled RES-XR4-1U Installation Manual, provides instructions on how to install, configure, power up, and boot the Themis Rugged Enterprise Server RES-XR4-1U (see Figure 1 below).

Figure 1. Rugged Enterprise Server RES-XR4-1U

The RES-XR4-1U supports the following motherboards in a 20”-deep chassis:

• SuperMicro X9DRW-3F

• SuperMicro X9DRW-iF

• SuperMicro X9DBU-3F

• SuperMicro X9DBU-iF

The RES-XR4-1U supports the following motherboards in a 17”-deep chassis:

• SuperMicro X9SCi-LN4F

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The 1RU-high (1.75”) RES-XR4-1U has been designed to fit into a standard 19” rack and is provided with rack-mount brackets with handles. Optional rack-mount slides are also available. The RES-XR4-1U is rugged enough to withstand extreme shock (up to 30 g), temperature, and EMI as that associated with such demanding markets as the military, aerospace, and telecommunications industries.

An overview of RES-XR4-1U design and specifications is given in Chapter 1, "Overview and Specifications", of this manual.

This manual is intended for an experienced system administrator with a knowledge of both networking and high-speed server systems.

Website Information

Themis Computer corporate and product information may be accessed on the World Wide Web by browsing the website http://www.themis.com.

Your Comments are Welcome

We are interested in improving our documentation and welcome your comments and suggestions. You can email your comments to us at docfeedback@themis.com. Please include the document part number (119708-024) in the subject line of your email.

Notes, Cautions, Warnings, and Sidebars

The following icons and formatted text are included in this document for the reasons described:

Note: A note provides additional information concerning the procedure or action being described.

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Preface

Caution: A caution describes a procedure or action that may result in damage to the equipment. This may involve—but is not restricted to—heavy equipment or sharp objects. T o reduce the risk, follow the instructions accompanying this symbol.

Warning: A warning describes a procedure or action that may cause injury or death to the operator as a result of hazardous voltages. To reduce the risk, follow the instructions accompanying this symbol.

Sidebar: A “sidebar” adds detail to the section within which it is placed, but is not absolutely vital to the description or procedure of the section.

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General Section

1.1 Overview

Chapter

Overview and Specifications

The RES-XR4-1U (see Figure 1-1 below) is a rack-mounted high-performance sys- tem designed specifically for above-average shock and vibration environments. The

RES-XR4-1U supports single or dual Intel® Xeon™ processors, as indicated in Table 1-2 on page 1-3, and includes multiple GBs of 1866/1600/1333/1066/800MHz DDR3 ECC Registered memory modules. Its computer/graphics-intensive and diverse-I/O capabilities are ideal for military/aerospace and commercial telecommunications applications. Motherboards supported by the RES-XR4-1U are listed in Table 1-2.

Figure 1-1. RES-XR4-1U (with Front Doors installed)

The X9DRW Socket R motherboard is already pin-compatible with the E5-2600 ver sion 2 processors which offer up to 16-core capabilities.

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The RES-XR4-1U is designed within a 1RU-high (1.75”) form-factor, a rack depth either 20” (50.8 cm) or 17” (43.2 cm) deep, and 17” (43.2 cm) wide (which, with mounting brackets, fits a 19”-wide rack.

Table 1-1. Major Features of RES-XR4-1U

Feature

Motherboard

X9DRW-3F/iF X9DBU-3F/iF X9SCi-LN4F

CPU

Chipset

Memory Slots Exp. slots

I/O Panels Peripheral Support

Operating temperature

 Two Intel

CPUs with two QPI up to 8.0 GT/s each

 Intel  Intel

 Sixteen (16) supporting up to

1TB

 See Table 1-2 on page 1-3 for details  See See “Rear Panel I/O” on page 1-8. for details  3 Storage drives.

 1 combination CD-RW/DVD-ROM (SATA) slimline drive  0° to 50° C (32° to 122° F)

Xeon E5-2600 V2

602 (SATA)

606 (SAS)

 Two Intel

CPUs with one QPI up to 8.0 GT/s each

 Intel  Intel

 Twelve (12) supporting up to

384GB

602 (SATA)

606 (SAS)

Shock endurance  30 g @ 25-msec duration half sine pulse(3 axis)

Dimensions

 1.75” (1RU) high, 17” (43.2 cm) wide (19”/48.3 cm with mounting brackets),  20” (50.8 cm), or 17” (43.2 cm) deep

Xeon E5-2400

 One Intel

Xeon E3-1200 V2

Intel

C204 PCH

Four (4) supporting up to 32GB

Rack-mount brackets and slides

Dual power supplies

1-2

 Left and right rack-mount tabs are attached to the chassis  Left and right rack-mount slides are optional

 750 watts each, auto-ranging (100–240 VAC)  Load-sharing N+1 redundant, hot-pluggable  Optional—Choice of 750-watt (4 8V) or 450/500-watt (28V) DC Power supply

Motherboard specifications are listed in Table 1-2. All configurations offer the follow- ing features in common:

• GB Ethernet LAN ports.

• Dedicated IPMI Ethernet LAN port.

• SATA storage drive controllers.

• Onboard graphics display (VGA).

• USB 2.0 ports.

• COM1 port.

• PCI-e 3.0 card slots.

Themis Computer

1—Overview and Specifications

Front View (Doors Removed)

System Power

ON/OFF Switch

CD-RW/DVD-ROM Combo Slimline Drive

17” (42.7 cm), 19” with Rack Mounts

Storage Drive (SAS/SATA) - Total of 3

1.75”

(1RU)

Front LED Indicator Panel

Overview

The 1U chassis height restricts the motherboards from using full-height vertical PCIe cards. Riser cards are used to allow the use of horizontally mounted full-height PCI-e cards where indicated in Table 1-2. Details of horizontal PCI-e card mounting are found in Chapter 2, page 2-11.

Where there are differences in the features of the different motherboard configurations, those differences are shown in Table 1-2.

I/O panel views for each motherboard option begin on page 1-8. Block diagrams for each of the motherboard families are shown beginning on page 1-11

Table 1-2. RES-XR4-1U Motherboard Specifications

Motherboard

Xeon CPU

PS2

KBD/

USB

Ports

SAS

Mem

Slots

LAN

Ports

PCI-e (PCI

Express)

x24 x16 x8

Full

Height

PCIe Card

X9DRW-3F (2)E5-2600 V2 No 4 Yes 16 2 16 No X9DRW-iF (2)E5-2600 V2 No 4 No 16 2 X9DBU-3F (2)E5-2400 Yes 2 Yes 12 2 1 X9DBU-iF (2)E5-2400 Yes 2 No 12 2 X9SCi-LN4F (1)E3-1200 V2 Yes 2 No 4 4

a—SuperMicro Computer, Inc. b—Riser card support; Left Slot c—Riser card support; Right Slot d—One PCI-e x4 in x8 slot e—PCI-e 3.0, Riser card support with E3-1200 V2 series CPU

16 No

14dNo

Yes

1.1.1 External Features

The RES-XR4-1U front panel houses three removable storage drives.

Figure 1-2. RES-XR4-1U Front Panel Features

Storage drive requirements should be ordered at the time of purchase. Also included on the front panel is a combination CD-RW/DVD-ROM Slimline drive, an ON/OFF

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AC Power Socket

(3-prong NEMA 15)

Dual Power Supplies

Power Supply

Latch Lock

Rear I/O Panel (see Figure 1-5, page 1-10)

20” (50.8 cm) deep

Rear View

Slot Not Used

Upper Right PCI Slot,

Lower Right PCI Slot,

Right Riser

(as viewed from

rear of system)

AC Power Socket

(3-prong NEMA 15)

Dual Power Supplies

Power Supply

Latch Lock

Rear I/O Panel (see Figure 1-6, page 1-11)

20” (50.8 cm) deep

Rear View

Slot Not Used

Upper Right PCI Slot,

Lower Right PCI Slot,

Right Riser

(as viewed from

rear of system)

X9DRW Motherboard I/O Options

X9DBU Motherboard I/O Options

X9DRW I/O Panel

X9DBU I/O Panel

AC Power Socket

(3-prong NEMA 15)

Dual Power Supplies

Rear I/O Panel (see Figure 1-6, page 1-11)

17” (43.18 cm) deep

Rear View

Slot Not Used

Upper Right PCI Slot,

Lower Right PCI Slot,

Right Riser

(as viewed from

rear of system)

X9SCi I/O Panel

Power Supply

Latch Lock

X9SCi Motherboard I/O Options

power button, and system LEDs (see Figure 1-4 on page 1-5). The rear panel contains I/O faceplates for two PCI cards (graphics, RAID, NIC,

etc.)—a third PCI slot is not used, two AC power supplies with latch locks and power-cord sockets, and all I/O connectors.

1-4

Figure 1-3. RES-XR4-1U Motherboard I/O Options

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1.2 Front Panel and System LEDs

LEDs

NIC1 NIC2Storage

Drives

Power ON/OFF

Button

Power

Fail

(PS1)

Overheat/

Fan Fail

Power

Fail

(PS2)

ENET2

ENET1

Front Panel (Doors Removed)

All RES-XR4-1U system LEDs are located on the front panel. LEDs are described in Table 1-3. Power supply LED behavior is described by Table 1-4 on page 1-7.

1—Overview and Specifications

Figure 1-4. Front Panel LEDs and Indicators

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ENET1

ENET2

Table 1-3. System LEDs

Symbol LED Description

Power

Storage Drive

NIC1

(Gb Ethernet)  Indicates network activity on LAN 1.

NIC2 (Gb Ethernet)

Overheat/Fan Fail —Normally OFF —RED light when tem-

perature limits are exceeded

 Indicates that the system is turned on.

 Indicates storage-drive activity.

 Indicates network activity on LAN 2.

 Warns that the system is exceeding specified

temperature parameters. The CPU overheat warning function must be enabled in the BIOS, thus allowing the user to define an overheat temperature, which—when exceeded—triggers the overheat warning LED.

1-6

Symbol Rear Panel LED(s) Description

Each Ethernet port contains two LEDs:

 The color of the left LED (when facing the port)

indicates the LAN connection speed:

N/A LAN1 and LAN2

- Off = 10 MHz

- Green = 100 MHz

- Amber = 1 GHz

 The right LED, when lit, indicates LAN activity.

a—NIC = Network Interface Controller.

Themis Computer

1—Overview and Specifications

Front Panel and System LEDs

Table 1-4. Power Supply LED Behavior

Symbol LED Power System LED Description

(red LED)

Off

On (red LED)

Power Fail LED

(Left Power Supply)

Note: system is powered on

Power Fail LED

(Right Power Supply)

Note: system is powered on

Power Fail LED

(Left & Right Power supply)

Note: system is powered on

Power Fail LED

(Left or Right Power Supply)

Note: system is powered off

If system is powered on,

warns that the upper power supply has failed or has lost AC input.

If system is powered on,

warns that the lower power supply has failed or has lost AC input.

System is powered on and

power supply modules are functioning normally , or system has been shut down and there has been no interruption to the AC power.

AC power has been inter-

rupted to both power supply

modules. When power is restored but system is still off, one of the two indicator lights will be lit.

(green

Rear

LED)

Power Supply Modules

Off

a—This LED behavior indicates only that AC power has interrupted to both power supplies, and does not indicate which

power supply module lost power first, or regained power first.

b—This LED behavior indicates that DC power is not being used, and the system is off. It does not indicate a loss of AC

power to the power supply module.

Themis Computer

Green LED

(adjacent to AC input)

Note: system is powered on

Green LED

(adjacent to AC input)

Note: system is powered off

System is receiving DC

power (3.3V, 5V, 12V) from the power supply module

System is off and not re-

ceiving DC power from the Power Supply module.

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RES-XR4-1U Installation Manual Version 1.5

Left Power

Supply(PS1)

Right Power

Supply(PS2)

(Lower Right Side)

Rear Panel

Rear I/ O Pane l

USB 1 (top) USB 0 (bottom)

USB 3 (top) USB 2 (bottom)

IPMI_Dedicated LAN

COM Por t 1 (Turquoise)

VGA (Blue)

LAN 1 LAN 2

Gigabit Ethernet

UID Switch

is Not Used

PCI Expansion Card

(Upper Right Side)

PCI Expansion Card

Left Side Slot

X9DRW

Motherboard

1.3 Rear Panel I/O

The following illustrations depict the rear I/O panels for each motherboard option available. Table 1-5 on page 1-10 describes the I/O connectors.

Figure 1-5. Rear Panel I/O for X9DRW Motherboard

1-8

Themis Computer

1—Overview and Specifications

Left Power

Supply (PS1)

Right Power Supply(PS2)

(Lower Right Side)

Rear Panel

Rear I/ O Pane l

USB 1 (top) USB 0 (bottom)

Keyboard

Mouse

IPMI_Dedicated LAN

X9DBU

Motherboard

COM Por t 1 (Turquoise)

VGA (Blue)

LAN 1 LAN 2

Gigabit Ethernet

UID Switch

is Not Used

PCI Expansion Card

(Upper Right Side)

PCI Expansion Card

Left Side Slot

Left Power

Supply (PS1)

Right Power Supply(PS2)

(Lower Right Side)

Rear Panel

Rear I/ O Pane l

USB 1 (top) USB 0 (bottom)

Keyboard

Mouse

IPMI_Dedicated LAN

X9SCi

Motherboard

COM Por t 1 (Turquoise)

VGA (Blue)

LAN 1 LAN 2

Gigabit Ethernet

UID Switch

is Not Used

PCI Expansion Card

(Upper Right Side)

PCI Expansion Card

Left Side Slot

LAN 3 LAN 4

Rear Panel I/O

Figure 1-6. Rear Panel I/O for X9DBU Motherboard

Figure 1-7. Rear Panel I/O for X9SCi-LN4F Motherboard

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RES-XR4-1U Installation Manual Version 1.5

Table 1-5. Rear-Panel I/O Connectors

Connector Description

PS/2 Mouse

PS/2 Keyboard

Hi-Speed USB 2.0 Serial Ports

Serial Port

VGA Graphics Con-

nector

Ethernet LAN Ports

IPMI Dedicated

Ethernet LAN Port

 6-pin mini-DIN connector to attach a PS/2 mouse device (X9DBU / X9SCi-LN4F).

 6-pin mini-DIN connector to attach a PS/2 keyboard device (X9DBU / X9SCi-LN4F).

 Two 4-pin USB connectors to attach serial devices (X9DBU / X9SCi-LN4F).  Four 4-pin USB connectors to attach serial devices (X9DRW).

Note: Two additional USB ports can be accessed directly from the motherboard.

 9-pin RS-232 connectors COM1.

 One 17-pin VGA connector to provide a video display.

 Standard RJ45 connectors for gigabit Ethernet LAN line(s)—LAN 1 and LAN 2.

(plus LAN3 and LAN4 on X9SCi-LN4F)

 Standard RJ45 connector to attach a dedicated IPMI LAN line.

Unit Identifier (UID)

Switch

 A Unit Identifier Switch and two LED indicators are located on the motherboards.

When the UID switch is pressed, both LEDs are turned on (one LED is located at the rear edge of the motherboard, the other LED is at the front of the motherboard). Pressing the UID again turns off both LED indicators. The UID indicators provide an easy identification of a system unit that may be in need of service.

Note: The UID can also be triggered via IPMI.

1-10

Themis Computer

1.4 Block Diagrams

PROCESSOR

DDR3 DIMM

CPU Rear

DDR3 DIMM

Socket 00

Socket 01

x16

Right Slot

PCIE 3.0x16

DMI

PE3 PE2 PE1

QPI

CPU Front

DMI

PE1PE2PE3

P0PE3

Left Slot

PCIE 3.0x16+x16

x4 (Lane4~7)

UL1

I350AM2

JLAN1

RJ45

JLAN2

RJ45

Lane Reversal & Polarity Inversion

DMI: Lane Reversal

BIOS

SPI Flash

SPI

DMI PEG [0...3]

PET8 USB [10,11] LPC

SSB

PCH C602/C606

Gen 3 [1...7]

SATA [0...5]

USB [0...9]

SATA Gen3

SATA Gen2

SATA0

SATA1

SATA2

SATA3

SATA4

SATA5

DDR3 RAM

Renesas

VGA

BMC

TPM Chip

Super I/O

W83527

NCT7904D

HW Monitor

VGA

CONN

PHY

RTL8211E

IPMI LAN

RJ45

REAR

HDR 2X5

REAR

3Gbps

6Gbps

JSM2(SCU4~7)

(3F only)

JSM1(SCU0~3)

1—Overview and Specifications

Figure 1-8. X9DRW Motherboard Block Diagram

a—This represents a general block diagram of the X9DRW board and does not

necessarily depict specific system configurations

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RES-XR4-1U Installation Manual Version 1.5

CPU1

DDR3

QPI

3.0 Gb/S

6.0 Gb/S

#3A/B #3C/D #1B #1AP1DMI

PEG0 DMI

SAS [0:3]

SATA [2:5]

SATA [0:1]

USB [0:7]

USB [9,10] LPC

SAS [4:7]

PCI

Uplink DMI

4GB/sPCI-E

X4 G3

#2~#5

#0~#1

SPI

SAS I-PASS

SAS

MUX

COM1 External

COM2 Header

MUX

BMC

WPCM450

RJ45

I-PASS

GLAN I350-AM 2

PCH

SSB-A/D

PCI-E X8 G3

PCI-E X4 G3

CPU2

DDR3

#1A/B #3C/D

3.0 Gb/S

RJ45

SPI

VGA

RTL8201F

TPM Header

DDR2 RAM

SPI PCI USB

LPC

Serial

PortRMII

RMII

DDR CRT

#C-2

#C-1

#B-2

#B-1

#A-2

#A-1

DDR3

PCI-E X1

SLOT

LOWER

PCI-E X16

SLOT 2

UPPER

PCI-E X8

in x4 Slot

SLOT

PCI-E X8

SLOT

800/1066/1333/1600

#F-2

#F-1

#E-2

#E-1

#D-2

#D-1

DDR3

800/1066/1333/1600

I-SATA

REAR

HDR 2X 5

REAR

4,52,3

TYPE-A6TYPE-A

port 0,1

1-12

Figure 1-9. X9DBU Motherboard Block Diagram

a—This represents a general block diagram of the X9DBU board and does not nec-

essarily depict specific system configurations

Themis Computer

1—Overview and Specifications

Ch A

PCI-E 2.0 x16

LPC

SLOT 6

SPI

DMI II 5.0GB/S

4 SATA-II ports

Ch B

SATA-II 300MB/s

8 USB 2.0 ports

PCI-E x1

2.5 Gbps

PCI-E x1

2.5 Gbps

PCI-E x1

2.5 Gbps

PCI-E x1

2.5 Gbps

2 SATA-III ports

DDR3 800/1066/1333/1600

#A-1

#B-1

CPU

(Sandy Bridge)

DDR3

DMI

PCI-E x16

WPCM450 WINBOND

COM1,2

RTL 8201

PHY

TPM 1.2 Header

Cougar Point

PCH

(C204/C206)

FLASH SPI 32Mb

SATA-III 600MB/s

PCI-33MHz

SLOT 1

PCI-33M Hz

USB

USB2.0 480MB/s

NCT6776F

LPC I/O

VGA PORT

PS/2

#A-2

#B-2

GLAN 1 82574L

RJ-45

GLAN 2 82574L

RJ-45

GLAN 3 82574L

RJ-45

GLAN 4 82574L

RJ-45

PCI-33MHz

LPC

HEAL TH

INFO

Block Diagrams

Themis Computer

Figure 1-10. X9SCi Motherboard Block Diagram

a—This represents a general block diagram of the X9SCi board and does not nec-

essarily depict specific system configurations

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RES-XR4-1U Installation Manual Version 1.5

Front

CD/DVD Combo-Drive Housing

40-mm Fan

AC Power Supply

(Five Total)

Right Riser Card

CPU 2

CPU 1

6 DIMM Memory Modules (CPU 2)

6 DIMM Memory

PCI-Express Card (Upper Right Slot)

Lithium Battery

(Left)(Right)

Modules (CPU 1)

Storage Drive

(Total of 3)

1.5 Internal Views

Figure 1-11. Top View of RES-XR4-1U with X9DBU Motherboard—Air Diverter Removed

1-14

Themis Computer

1—Overview and Specifications

Front

CD/DVD Combo-Drive Housing

40-mm Fan

AC Power Supply

(Five Total)

Right Riser Card

CPU 2

CPU 1

4 DIMM Memory Modules (CPU 1)

4 DIMM Memory Modules (CPU 2)

PCI-Express Card (Upper Right Slot)

Lithium Battery

(Left)

(Right)

4 DIMM Memory Modules (CPU 2)

4 DIMM Memory Modules (CPU 1)

Storage Drive

(Total of 3)

Figure 1- 12. Top View of RES-XR4-1U with X9DRW Motherboard—Air Diverter Re-

Themis Computer

moved

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RES-XR4-1U Installation Manual Version 1.5

Front

CD/DVD Combo-Drive Housing

40-mm Fan

AC Power Supply

(Five Total)

Riser Card Slot

CPU

PCI-Express Card (Upper Right Slot)

Lithium Battery

(Left)

(Right)

4 DIMM Memory Modules

Storage Drive

(Total of 3)

Figure 1- 13. T op V iew of RES-XR4-1U with X9SCi-LN4F Motherboard—Air Diverter

1-16

Removed

Themis Computer

1.6 Processor and Chipset Overview

1.6.1 C602/C606 Chipset

Built upon the functionality and capability of the Intel® E5-2600 Series Processor and the PCH C602/C606 Chipset (X9DRW), or the Intel® E5-2400 (X9DBU) and

the PCH C602/C606 Chipset, the RES-XR4-1U provides the performance required for dual processor-based high-end systems, including optimal configuration options for communications, high-end CAD systems, or database applications. RES-XR4-

1U supports up to two E5-2600-series or two E5-2400-series Intel® 64-bit Xeon processors. Both processor families are of the Sandy Bridge micro architecture and support up to 12 cores per CPU, HT (Hyper-Threading), up to 3.3 GHz (E5-2600) and

2.4 GHz (E5-2400), up to 20 MB L3 cache, Virtualization, Turbo Boost, 2-way processing, and QPI (Quick Path Interconnect) of up to 8.0 GT/s.With the Intel® Quick-

Path Interconnect (QPI) controller built in the processor, the C602/C606 Series Processor platform offers point-to-point serial interconnect interface with CPU-toCPU transfer speeds of up to 8.0 GT/s, providing fast speeds, and excellent system

performance. The Intel® E5-2600 CPU has two QPI links, and the Intel® E5-2400 CPU has one QPI link.

1—Overview and Specifications

The C602/C606 chipsets support up to 8x1 PCI Express ports, single 32-bit 33 MHz PCI bus, and DMI for the processor(s). The PCH provides up to (total number represents chipset capability and does not necessarily represent actually motherboard specs) 14 USB 2.0, 2 SATA/SAS 1.5/3/6 Gbits + 6 SATA/SAS 1.5/3 Gbit/s connections, Integrated LAN, Integrated Graphics (C606), and Active Management Tech-

nology 7.1 (C606). In addition, the Intel® C602/C606 platforms also offer a wide range of RAS (Reliability, Availability and Serviceability) features. These features include memory interface ECC with double-bit error detection, Cyclic Redundancy Check (CRC), parity protection, out-of-band register access via SMBus, memory mirroring, memory sparing, and Hot-plug support on the PCI-Express Interface.

1.6.2 Main Features of the E5-2400/E5-2600 Series Processor and C602/C606 Chipset

This list includes the major features of the Intel® E5-2400/E5-2600 Series CPU and the Intel

• Up to 12 processor cores and 16 Threads in each CPU

C602/C606 chipset families

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RES-XR4-1U Installation Manual Version 1.5

• Up to 20MB of cache per CPU

• Enhanced Intel® SpeedStep Technology

• Two full-width Intel

QuickPath interconnect link(s), up to 8.0 GT/s of data trans-

fer rate in each direction

• Virtualization Technology, Integrated Management Engine supported

• Point-to-point cache coherent interconnect, Fast/narrow unidirectional links, and Concurrent bi-directional traffic

• Error detection via CRC and Error correction via Link level retry

• ACPI Power Management Logic Support for Rev. 3.0b or Rev 4.0

•Intel

Rapid Storage Technology

•Intel® Trusted Execution Technology

• Serial Peripheral Interface (SPI)

• Digital Media Interface (DMI)

1.6.3 C204 Chipset

The X9SCi-LN4F motherboard supports a single Intel® Xeon E3-1200 V2 series, 2nd and 3rd generation Intel® Core® i3, Pentium®, and Celeron® processor in an

LGA 1155 socket. Built upon the functionality and the capability of the C204 chipset, the motherboard provides substantial enhancement to system performance and storage capability in a sleek package.

The high-speed Direct Media Interface (DMI) featured in the Intel® C204 chipset supports high-speed Direct Media Interface (DMI) for chip-to-chip true isochronous communication, providing up to 10 Gb/s of software-transparent data transfer rate on each read/write direction. In addition, the X9SCi-LN4F motherboard also features the TCO timer which allows the system to recover from a software/hardware lock and perform tasks, including ECC Error Reporting, Function Disable and Intruder Detect.

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Themis Computer

1—Overview and Specifications

1.6.4 Main Features of the E3-1200 Series Processor and C204 Chipset

• Direct Media Interface (up 10 Gb/s transfer, Full Duplex)

•Intel®Matrix Storage Technology and Intel® Rapid Storage Technology

•Intel® I/O Virtualization (VT-d) Support

•Intel® Trusted Execution Technology Support

• PCI Express 2.0 Interface (up to 5.0 GT/s)

• SATA Controller (up to 3G/s)

• Advanced Host Controller Interface (AHCI)

• Two (2) SATA 3.0 ports (up to 6G/s)

1.7 Special Features

1.7.1 Recovery from AC Power Loss

The BIOS setup can be configured to allow the system, whenever AC power is lost,

• to remain off (power switch must be pressed to turn system back on) or

• return to a power-on state automatically when power is restored.

This setting can be accessed in the Advanced section of the BIOS Setup Appendix 3. The system default is “Last State”.

1.7.2 PC Health Monitoring

The following sections describe the PC health monitoring features of the motherboard. All have an onboard System Hardware Monitor chip that supports PC health monitoring. An onboard voltage monitor will scan these onboard voltages continuously: CPU cores, +1.8V, +3.3V, +5V, +12V, +3.3V Standby, +5V Standby, VBAT, Memory, Chipset Voltages. Once a voltage becomes unstable, a warning is given or an error message is sent to the screen. Users can adjust the voltage thresholds to define the sensitivity of the voltage monitor.

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RES-XR4-1U Installation Manual Version 1.5

1.7.2.1 Fan Status Monitor

The RES-XR4-1U has six 40-mm cooling fans for the motherboard components and one within each power supply. The PC health monitor utility can be used to check the RPM status of cooling fans. The onboard CPU and chassis fans are controlled by Thermal Management via BIOS.

1.7.2.2 Environmental Temperature Control

The thermal-control sensor monitors CPU temperature in real time and will activate the thermal fan when CPU temperature exceeds a user-defined threshold. Overheat circuitry operates independently from the CPU, and can continue to monitor overheat conditions even when the CPU is in sleep mode.

Once the thermal sensor detects a CPU temperature that is above the set threshold, it automatically turns on the thermal control fan to prevent overheat damage to the CPU. In addition, onboard chassis thermal circuitry can monitor overall system temperature and alert users when chassis temperature exceeds a user-defined threshold.

Caution: T o avoid possible system overheating, please be sure to provide adequate airflow to your system, and check for any possible blockages.

1.7.2.3 System Resource Alert

Available only through SuperDoctor III in the Windows OS environment or SuperDoctor II in Linux (an optional third-party product), this feature is used to notify the user of certain system events. For example, you can also configure Supero Doctor to provide you with warnings when the system temperature, CPU temperature, voltages and fan speeds go beyond a pre-defined range.

1.7.3 Power Supply Monitoring

The power supplies in the Themis RES servers support a feature allowing their status to be queried directly through software. The power supplies are connected to an I2C

bus used for system monitoring. This bus can be reached through the Baseboard Management Controller (BMC), (described in subsequent paragraphs), on the motherboard. Sample Linux commands to do this are included below.

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Themis Computer

1.7.3.1 I2C Notes

1. Bus Address Select function:

The address is 5A.

2. Temperature Measurement function:

The value can be obtained by reading CR14, 1LSB = 1 degree.

3. Voltage Monitor function:

The VIN value can be obtained by reading CR10, CR11, and CR12 which represents +3.3V, +5V and +12V bus inputs respectively, 1LSB = 0.008V.

Example: (Please note that the constant values of 2, 6 and 11 in the following examples were derived from component values.) If CR10= D1 then the +3.3V voltage = 0.008 * D1* 2 = 3.34V If CR11= 68 then the +5V voltage = 0.008 * 68 * 6 = 4.99V If CR12= 89 then the monitor +12V voltage = 0.008 * 89 * 11 = 12.05V

1—Overview and Specifications

4. PG Status Monitor

The value can be obtained by reading CR92 which represents PG status: If bit 2=1 then PG1 ok else PG1 fail. If bit 3=1 then PG2 ok else PG2 fail.

1.7.3.2 Sample I2C Commands

Example: PG Status Monitor

$ ipmitool -H <your-ip-address> -UADMIN -PADMIN \ i2c bus=3 chan=0 0x5a 1 0x92

0c = 00001100. Bits 2 and 3 are 1, so both power supplies are operating.

Where:

<your-ip-address> is the IP address of the BMC.

-UADMIN is the user name of the administrative user of the BMC.

-PADMIN is the password of the administrative user of the BMC.

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RES-XR4-1U Installation Manual Version 1.5

1.7.4 ACPI Features

Advanced Configuration and Power Interface (ACPI) defines a flexible and abstract hardware interface that provides a standard method of integrating power management features throughout the system. This includes the hardware, the operating system, and the application software. As a result, the system can automatically turn peripherals (CD-ROMs, NICs, storage drives, and printers, for example) on or off. This includes any consumer devices that may be connected to the system (VCRs, TVs, telephones, and stereo systems, for example).

In addition to providing operating-system power management, ACPI offers a generic system event mechanism for Plug and Play and an operating system-independent interface for configuration control. Plug-and-Play BIOS data structures are leveraged, while the implementation is processor architecture-independent and compatible with both Windows 7, Windows Vista, and Windows 2008 Operating Systems.

1.7.5 Slow Blinking LED for Suspend-State Indicator

When the CPU enters a suspend state, the Power LED will start blinking to indicate that the CPU is in suspend mode. Pressing any key on the keyboard will awaken the CPU, at which time the power LED will stop blinking and remain on.

1.7.6 Super I/O

The Super I/O supports two high-speed,16550 compatible serial communication ports (UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable baud rate generator, complete modem control capability and a processor interrupt system. Both UARTs provide legacy speed with baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which support higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Configuration and Power Interface), which includes support of legacy and ACPI power management through an SMI or SCI function pin. It also features auto power management to reduce power consumption.

1.7.7 Overview of the Renesas SH7757

The X9DRW motherboard family uses the Renesas SH7757 baseboard management controller (BMC).

The Renesas IPMI Controller which integrates a RISC (Reduced

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Themis Computer

1—Overview and Specifications

_Instruction_Set_Computing) CPU Core with peripheral capabilities required for a Baseboard Management Controller (BMC). The Renesas IPMI Controller offers the user a superb solution to manage PC server systems with great efficiency.

The BMC controller supports a 32Kb_instruction cache and a 32Kb_operand cache, which can be switched between write-back and write-through. The instruction cache offers a 4-way full-associative instruction TBL (T ranslation Lookaside Buf fer) and a 64-way full-associative shared TBL. The memory management unit, which is embedded on the chip, provides access to 4 Gb virtual address space. In addition, this controller also supports 32 Kb on-chip SRAM, allowing for faster access which is especially critical to time-sensitive, high-density/high-performance server platforms.

The BMC supports VGA Graphic Cores for remote video displaying and editing. It also provides a video data compressor for Keyboard/V ideo/Mouse (KVM) support if keyboard/mouse are installed in the system. With two Ethernet controllers built in, the BMC controller supports USB media hosting, an LPC bus interface, an I2C bus interface, a NAND Flash Timer Interface and serial communication interfaces. The BMC controller offers great system enhancement at a low cost.

1.7.7.1 BMC Subsystem Features

• CPU speed: 576MHz

• System Memory: 256MB

• Flash Memory: 32MB

• Network connections: Two Gigabit connections (one dedicated LAN connection

and one shared LAN with an on-board LAN controller)

• Resolutions:

• Supports 1680 x 1200 resolution at 32 bpp and 75 Hz

• Supports 1680 x 1050 wide screen resolution at 32 bpp and 60 Hz

1.7.8 Overview of the Nuvoton WPCM450 BMC

The X9DBU and X9SCi-LN4F motherboard families use the Nuvoton WPCM450R baseboard management controller (BMC).

The Nuvoton WPCM450R Controller, a Baseboard Management Controller (BMC), supports 2D/VGA-compatible Graphic Cores with PCI interface, creating multimedia virtualization via Keyboard/Video/Mouse Redirection (KVMR). The WPCM450R Controller is ideal for remote system management.

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RES-XR4-1U Installation Manual Version 1.5

The WPCM450R Controller interfaces with the host system via PCI connections to communicate with the graphics cores. It supports USB 2.0 and 1.1 for remote keyboard/mouse/virtual media emulation. It also provides LPC interface support to control Super IO functions. The WPCM450R Controller is connected to the network via an external Ethernet PHY module or shared NCSI connections.

The WPCM450R communicates with onboard components via six SMBus interfaces, PECI (Platform Environment Control Interface) buses, and General Purpose I/O ports.

1.7.8.1 WPCM450R DDR2 Memory Interface

The WPCM450R supports a 16-bit DDR2 memory module with a speed of up to 220 MHz. For best signal integrity, the WPCM provides point-to-point connection.

1.7.8.2 WPCM450R PCI System Interface

The WPCM450R provides 32-bit, 33 MHz 3.3V PCI interface, which is compliant with the PCI Local Bus Specification Rev. 2.3. The PCI system interface connects to the onboard PCI Bridge used by the graphics controller.

1.7.8.3 Other Features of the WPCM450 BMC Controller

The WPCM450R supports the following features:

• IPMI 2.0

• Serial over LAN

• KVM over LAN

• LAN Alerting-SNMP Trap

• Event Log

• X-Bus parallel interface for I/O expansion

• Multiple ADC inputs, Analog and Digital Video outputs

• SPI Flash Host BIOS and firmware bootstrap program supported

• Reduced Media Independent Interface (RMII)

• Operating System independent

• Remote hardware health monitoring via IPMI

• Provides Network Management Security via remote access/console redirection

• supports the following management tools: IPMIView, CLI (Command Line

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Themis Computer

1—Overview and Specifications

Special Features

Interface)

• RMCP+ protocol supported

Note: For more information regardin g IPMI configuration, refer to the IPMI User’s guide on SuperMicro’ s website at, http://www.supermicro.com/support/manuals/

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1.8 Specifications

1.8.1 General

Table 1-6. RES-XR4-1U General Specifications

Parameter Description

Dimensions

Weight

19” Rack-Mountable

with Slide capability

Temperature

Operating: Non-Operating:

Relative Humidity

Operating: Non-Operating:

Shock

Operating: Non-Operating:

Vibration

Operating: Non-Operating

Relative Humidity

Operating: Non-Operating:

Maximum Wet Bulb

Operating: Non-Operating:

Altitude

Operating: Non-Operating

1.75” (44.45mm)(1RU) high

17.06” (433.3 mm) wide (19” rack-mountable) 20” (508 mm) deep

19.5 lb (8.9 kg) Left and right rack-mount tabs attached to chassis

Left and right rack-mount slides are optional

0°C to 50° C (32°F up to 122°F) –40°C to 70° C (–40°F to 158° F)

8% to 90% (non-condensing) 5% to 95% (non-condensing)

3 axis, 25 g, 25ms half sine pulse 3 axis, 25 g, 25ms half sine pulse

3.0 Grms, 8Hz to 2000Hz

3.0 Grms, 8Hz to 2000Hz 8% to 95% (non-condensing)

5% to 95% (non-condensing)

55°C, non-condensing 70°C, non-condensing

0 to 10,000 feet above sea level 0 to 40,000 feet above sea level

MIL-SPEC

Shock and Vibration High Impact Shock Vibration

a—Specifications are dependent on the configurations in this manual.

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MIL-STD-810G MIL-STD-901D MIL-STD-167-1

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1.8.2 Electrical

Table 1-7 lists the electrical specifications for the RES-XR4-1U.

Table 1-7. RES-XR4-1U Electrical Specifications

Parameter

AC (120 volts, 750W) DC (48 volts, 750W) DC (28 volts, 500W)

1—Overview and Specifications

Specifications

Description

Input Power (typical)

Input Current

Input Frequency

Input Voltage

Input VA Rating

BTU Rating

Power Factor

Input Leakage Current

Plug Type

 420 watts (typical)

 3.5 amps @ 120 VAC

(12-6A @ 100-240 VAC)

 47-63 Hertz NA

 100–240 VAC,

internally fused

 425 VA NA

 1447 BTU/hour  1447 BTU/hour  1447 BTU/hour

 0.99 NA

 3.5 mA NA

 IEC standard socket

 420 watts (typical)

 8.75 amps @ 48 VDC

(20-12A @ 40-72 VDC)

 40–72 VDC,

internally fused

 Positronics PLB06M, mating with included PLB06F

cable connector, lea ds with Y -T ype Lugs, (SVS5-4 or equivalent) (see Section 2.2.1, “DC Power Supply

 450 watts (typical)

 16 amps @ 28 VDC

(30-18A @ 23-36 VDC

 23–36 VDC,

internally fused

Option,” on page 2-22).

a—Does not include plug-in PCI cards. b—NA = Not Applicable.

1.8.2.1 System Power

The RES-XR4-1U operates with two N+1 redundant power supplies of 750-watts capacity each that auto-range single-phase AC input from 100 to 240 Vac (47 to 63 Hertz) sources. Filtered and fused (internal) AC is supplied to each power supply from a rear-mounted power connection. In the event the system is ordered with a single power supply, a dummy/blank power supply will occupy the other bay, and in such configuration, there is no redundancy in the power supply subsystem.

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RES-XR4-1U Installation Manual Version 1.5

Two optional N+1 redundant DC power supplies of 750 watts (48 volts) or 500 watts (28 volts) each may be substituted for the AC power supplies (see Table 1-7). These power supplies have the same form factor as the AC supply, except that the power supply spec’ed as MIL-STD-461 is double wide, and occupies both power supply bays. In this case there is no redundancy in the power supply subsystem.

Power supply options should be specified at the time of your order.

Note: Some AC RES systems may be installed with 650-watt instead of 750- watt power supplies, which should not effect the performance of the system.

1.8.2.2 Output Voltage

The RES-XR4-1U power supply provides output voltages that are split between +3.3V, +5V, +5Vsb, +12V, and -12V rails.

1.8.3 Environmental

1.8.3.1 Shock

The RES-XR4-1U is designed to survive an elevated shock environment. All structural components are welded together, enabling the system to survive a maximum 3-axis shock load of 25 g at 25-ms duration, half sine pulse.

1.8.3.2 Electrostatic Discharge

The RES-XR4-1U is designed to tolerate electrostatic pulses up to 15 kilovo lts (KV) with no impact on system operation.

1.8.3.3 Noise

The RES-XR4-1U conforms to the 54-db noise specification

Note: All RES systems are shipped with BIOS fan speed set to the quietest mode. The default fan speed control mode of the RES-XR4-1U is Energy Saving/ES.

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1.9 Packaging and Shipping

The RES-XR4-1U is packaged in a reusable shipping container. Approximate weight of an empty container and two AC power cords is 8.8 pounds (4 kg).

The approximate weight of a RES-XR4-1U (loaded with two storage drives, two PCI cards, a CD-RW/DVD-ROM drive, two CPUs, 6 DIMMs, and two power supplies) is approximately 19.5 pounds (8.9 kg).

The approximate weight of a manual and associated shipping paperwork is one pound (0.5 kg).

Therefore, both the shipping container and a fully installed RES-XR4-1U including power cords, manual, and associated paperwork, weigh under 30 pounds (13.5 kg).

1—Overview and Specifications

Caution: Do not discard the original packaging that your system was shipped in.

When sending the RES-XR4-1U back to Themis for any reason, the original shipping container must be used, packed exactly as described in Appendix E, “Repackaging Instructions”. To ship the RES-XR4-1U without following the procedures outlined in Appendix E may invalidate the warranty.

1.9.1 Accessory Kit

Each RES-XR4-1U is packaged with an Accessory Kit, consisting of the following items:

A. A Power-cord Retainer Bracket B. Two AC Power Cords C. Two Front-Bezel Barrel Keys D. Any applicable paperwork

When you unpack the RES-XR4-1U, please verify that all of these items are included. If any of these items are missing or not as pictured, please call Themis Technical Support at 510-252-0870, or send an email to support@themis.com.

To learn how to secure the AC power cords and the power-cord retainer bracket, refer to Section 2.4.1, “Plugging in the AC Power Cords,” on page 2-31.

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1.10 Rack-Mount Slides (Optional)

Rack-Mount Slides can be mounted on each side of the RES-XR4-1U for the purpose of sliding the unit in and out of a rack. Mounting slides are optional and can be ordered at the time of purchase.

To learn how to install rack-mount slides, refer to Appendix B, “Rack-Mount Slide Installation”.

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Themis Computer

1.11 RES System

Table Table 1-8 below lists the approximate weights of typical RES systems.

Table 1-8. Approximate Weightsa of the RES-XR4 Series

1—Overview and Specifications

Model

RES-XR4-1U

RES-XR4-2U

RES-XR4-2U/FIO

RES-XR4-3U

RES-XR4-3U/FIO

Weight

(Approximate)

CPU

Sockets

Depth Description

19.5 lbs (8.9 kg) 2 20” Includes:

 All CPU sockets filled  6 DIMMs  2 storage drives

17 lbs (7.7 kg) 2 17”

25 lbs (11.4 kg) 2 20”

23 lbs (10.4 kg) 2 17”

22 lbs (10.0 kg) 2 13.5”

28.5 lbs (12.9 kg) 2 20”

26.5 lbs (12 kg) 2 17”

29 lbs (13.2 kg) 2 17”

25.5 lbs (11.6 kg) 2 13.5”

 2 PCI cards  1 CD-RW/DVD-ROM drive  2 power supplies

Includes:

 All CPU sockets filled  6 DIMMs  2 storage drives  2 PCI cards  1 CD-RW/DVD-ROM drive  2 power supplies

Includes:

 All CPU sockets filled  6 DIMMs  2 storage drives  2 PCI cards  1 CD-RW/DVD-ROM drive  2 power supplies

RES-XR4-HD 45 lbs (20.4 kg) 8

Themis Computer

Includes:

20”

 Four Compute Modules  All CPU sockets filled  All DIMM slots filled

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RES-XR4-1U Installation Manual Version 1.5

Table 1-8. Approximate Weightsa of the RES-XR4 Series (Continued)

Model

Weight

(Approximate)

CPU

Sockets

RES-XR4-HDS 45 lbs (20.4 kg) 4

RES-XR4-HDS8 42.22 lbs (19.15 kg) 4

RES-XR4-HDS-F 36.5 lbs (16.56 kg) 4

Depth Description

Includes:

 Two Compute Modules  All CPU sockets filled

20”

 All DIMM slots filled  Two Storage Canisters  Four 3.5” drives per canister  Total of eight drives pe r syste m

Includes:

 Two Compute Modules

20”

 All CPU sockets filled  All DIMM slots filled  Two Storage Canisters  Eight 2.5” drive s pe r ca nist er  Tot al of sixteen drives per system

Includes:

 Two Compute Modules  All CPU sockets filled

20”

 All DIMM slots filled  Two PCI-E Storage Canisters  Four PCI-E flash-based storage

cards

 Tot al of eight PCI-E storage cards

per system

Includes:

 All CPU sockets filled

RES-XR4-1U (1U)

23.72 lbs (10.76) 2 24”

 8 DIMMs  2 storage dr ives  1 Tesla/GRID card  2 power supplies

Includes:

 All CPU sockets filled

RES-XR4-1U (3U)

a—These are “typical” weights for a RES system. Please contact Themis for the exact weight of your configured system. b—Number represents total possible CPU sockets per system. Total of two CPU sockets per compute module.

38.38 lbs (17.41 kg) 2 21”

 16 DIMMs  8 storage dr ives  3 Tesla/GRID cards  1 CD-RW/DVD-ROM drive  2 power supplies

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1—Overview and Specifications

RES System

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Installation Section

This chapter describes:

• How to install a memory module, storage drive, PCI card, 40-mm-fan, power supply, and lithium battery

Chapter

Installation and Operation

• Rack-mount brackets

• How to turn the RES-XR4-1U on and off

2.1 Installation Procedures

Caution: Use industry-standard ESD grounding techniques when handling all components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. Handle all IC cards by the front panel or edges only.

T o install or replace a storage drive, fan, or power supply, skip the next section and proceed directly to page 2-17, or page 2-20, respectively. Replacement of motherboard components requires removal of the protective cover.

2.1.1 Remove Protective Top Cover

To access interior components, open the RES-XR4-1U as follows:

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RES-XR4-1U Installation Manual Version 1.5

Loosen the 2 captive access-cover screws

…

Rear View

…

and slide the top cover toward the rear until the top hooks and tabs clear all chassis slots

Chassis slot

Left-side top edge

1. Loosen the two captive Phillips screws holding the protective top access cover to the rear of the RES-XR4-1U chassis (see A, Figure 2-1).

2. Both the front and sides of the cover have flat hooks or tabs underneath that fit under slots on the chassis top edges (see B, Figur e 2-1). Remove the cover by sliding it toward the rear until it is free of these chassis slots.

3. Store the cover in a safe place until it is replaced.

Figure 2-1.

4. Proceed to the appropriate section to install or replace a memory module (page 2-3), PCI card (page 2-11), or lithium battery (page 2-15).

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Remove the RES-XR4-1U Protective Access Cover

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5. When installation or replacement activity is completed, reinstall the protective

top cover . Refit the top hooks and tabs into their respective receptacle points, and slide the top cover forward on the chassis until the captive access screws can be engaged and tighten.

6. Tighten the captive screws until the protective top cover is fully closed.

7. Reinstall the power cords into their receptacles in the power supplies, and

repower the unit.

2.1.2 Memory Modules

The RES-XR4-1U supports memory according to Table 2-1. Note the total memory capacity varies according to the motherboard installed in the RES-XR4-1U. Memory location is as depicted in Figures 2-2 and 2-3.

Table 2-1. RES-XR4-1U Memory Capacity

2—Installation and Operation

Installation Procedures

Memory Parameters

Motherboard

Capacity

X9DBU-3/iF 384 GB Yes 1600/1333/1066/800 12 240

X9DRW-3/iF 1 TB Yes

X9SCi-LN4F 32 GB Yes 1333/1066 4 240

DDR3

Registered

ECC

Speed (MHz)

1866/1600/1333/106

6/800

Number

of DIMMS

16 240

Pins per

DIMM

Caution: For memory to work properly , follow the tables below for memory installation. Install DIMM modules of the same type, same speed and same operating frequency . Mixing of RDIMMs, UDIMMs or LRDIMMs is not allowed. Do not install both ECC and Non-ECC memory modules on the same motherboard. Using DDR3 DIMMs with different operating frequencies is not allowed. All channels in a system will run at the lowest common frequency.

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Table 2-2. X9DBU-3/iF MB Memory Population

CPU# X9DBU Motherboard

CPU 1 P1-DIMMA1 P1-DIMMA2 P1-DIMMB1 P1-DIMMB2 P1-DIMMC1 P1-DIMMC2 CPU 2 P2-DIMMD1 P2-DIMMD2 P2-DIMME1 P2-DIMME2 P2-DIMMF1 P2-DIMMF2

Table 2-3. X9DRW-3/iF MB Memory Population

CPU # X9DRW Motherboard

CPU 1

P1-

DIMMA1

P1-

DIMMA2

P1-

DIMMB1

P1-

DIMMB2

P1-

DIMMC1

P1-

DIMMC2

P1-

DIMMD1

P1-

DIMMD2

CPU 2

P2-

DIMME1

P2-

DIMME2

P2-

DIMMF1

P2-

DIMMF2

P2-

DIMMG1

Table 2-4. X9SCi-LN4F MB Memory Population

CPU# X9DBU Motherboard

CPU 1

DIMM 1A

DIMM 1B

DIMM 2A

DIMM 2B

Table 2-5. X9DBU-3/iF Optimal Memory Population

CPUs +

DIMMs

1 CPU 2 DIMMs 1 CPU 4 DIMMs 1 CPU 6 DIMMs 2 CPUs 4 DIMMs 2 CPUs 6 DIMMs 2 CPUs 8 DIMMs 2 CPUs 10 DIMMs

A1 B1

A1 A2 B1 B2

A1 A2 B1 B2 C1 C2

A1 B1 D1 E1

A1 B1 C1 D1 E1 F1

A1 A2 B1 C1 D1 D2 E1 F1

A1 A2 B1 B2 C1 D1 D2 E1 E2 F1

CPU 1

(P1 slots)

P2-

DIMMG2

P2-

DIMMH1

CPU 2

(P2 slots)

P2-

DIMMH2

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2—Installation and Operation

Installation Procedures

Table 2-5. X9DBU-3/iF Optimal Memory Population (Continued)

CPUs +

DIMMS

1 CPU 2 DIMMs

1 CPU 4 DIMMs

1 CPU 6-8 DIMMs

2 CPUs 4 DIMMs

2 CPUs 6 DIMMs

CPUs +

DIMMs

2 CPUs 12 DIMMs

A1 A2 B1 B2 C1 C2 D1 D2 E1 E2 F1 F2

CPU 1

(P1 slots)

Table 2-6. X9DRW-3/iF Optimal Memory Population

CPU1

(P1 slots)

A1 B1

A1 B1 C1 D1

A1 *

B1 *aC1 *aD1 *

A1 B1 E1 F1

A1 B1 C1 D1 E1 F1

CPU 2

(P2 slots)

CPU2

(P2 slots)

2 CPUs 8 DIMMs

2 CPUs 10-16 DIMMs

a—Any additional pairs in A2/B2, then C2/D2 b—Any additional pairs in P1, then P2 slots

Number of

CPUs + DIMMs

1 CPU & 2 DIMMs

1 CPU & 4 DIMMs

A1 B1 C1 D1 E1 F1 G1 H1

A1 *

B1 *bC1 *bD1 *bE1 *bF1 *bG1 *bH1 *

Table 2-7. X9SCi-LN4F Optimal Memory Population

CPU and Memory Population

(For memory to work properly, follow the Instructions below.)

(For best performance, populate the memory in pairs)

CPU 1

P1-DIMM 1(A or B), P1-DIMM 2(A or B)

CPU 1

P1-DIMM 1A, P1-DIMM 1B, P1-DIMM 2A, P1-DIMM 2B

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P2 DIMM D1 P2 DIMM D2

P2 DIMM E1 P2 DIMM E2 P2 DIMM F1

P2 DIMM F2

P1 DIMM A1

P1 DIMM A2

P1 DIMM B1

P1 DIMM B2

P1 DIMM C1

P1 DIMM C2

2.1.2.1 Memory Module Location

2-6

Figure 2-2. Memory Module Slot Locations (X9DBU-3/iF Motherboard)

Themis Computer

P2 DIMM D1

P2 DIMM D2

P2 DIMM H2 P2 DIMM H1 P2 DIMM G2

P2 DIMM G1

P1 DIMM A1

P1 DIMM A2

P1 DIMM B1

P1 DIMM B2

P1 DIMM C1

P1 DIMM C2

P2 DIMM E1 P2 DIMM E2 P2 DIMM F1

P2 DIMM F2

2—Installation and Operation

Installation Procedures

Themis Computer

Figure 2-3. Memory Module Slot Locations (X9DRW-3/iF Motherboard)

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RES-XR4-1U Installation Manual Version 1.5

Channel 2 Slot 2B

Channel 2 Slot 2A

Channel 1 Slot 1B

Channel 1 Slot 1A

Figure 2-4. Memory Module Slot Locations (X9SCi-LN4F Motherboard)

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2.1.2.2 Installation

The following procedure explains how to install the DDR3 FBD Memory Modules.

1. Loosen and remove the seven screws securing the air-flow deflector (see Fig-

ure 2-5).

2—Installation and Operation

Installation Procedures

Themis Computer

Figure 2-5. Remove RES-XR4-1U Air-Flow Deflector

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RES-XR4-1U Installation Manual Version 1.5

downward & outward at each end

Press latch

2. After the air-flow deflector is removed the memory modules will be exposed (see Figure 2-2 on page 2-6 and Figure 2-3 on page 2-7).

The following procedure explains how to install the Memory Modules...

3. If a module is already seated in the slot you have selected for installation, remove it by gently pressing down and outward on the latches at both ends of the slot (see Figure 2-6), then pulling the old module directly up from the slot until it is free of the connector (see Figure 2-6).

2-10

Figure 2-6. Memory Module Removal

4. Before inserting a new memory module into the vacant slot, make sure that the two latches are pulled outward away from the center of the slot.

With the latches in the outward position, gently insert the new module vertically into its slot and press firmly downward until it snaps into place.

Note: Make sure the memory module has the proper orientation by aligning the alignment notch at the bottom edge with its counterpart ridge at the bottom of the slot.

5. When module replacements are finished, replace the air flow diverter and secure it with the eight screws previously removed.

6. Replace the PCI card retainer bracket and secure it with the single screw removed in Step 1 on page 2-12.

Themis Computer

2.1.3 PCI Cards

PCI Riser-Card

UIO slot

PCI-E 2.0 x8

PCI-E 2.0 x8 (in x4 slot)

PCI-E 2.0 x16

Retainer Bracket

PCI Slots on Motherboard

(Top View)

Retainer Bracket with Right Riser Card (Left not used)

(Reverse view of right riser card)

PCI-E 2.0 x8(lower right)

PCI-E 2.0 x8 slot (upper right)

SXB2 (J1)

SXB1 (J2)

SXB3 (J3)

UIOP (J10)

(installed on right riser card)

not used

Right Riser Card

Since the RES-XR4-1U is only 1RU (1.75”) high, PCI cards must be installed horizontally through the use of PCI Riser Cards (see Figure 2-7 on page 2-11).

The upper-right PCI slot supports cards up to 12.28-inches long; the lower-right and left PCI slot supports shorter cards. PCI Riser Cards that are installed on the motherboard depend on the type of PCI card that will be supported.

2—Installation and Operation

Installation Procedures

Figure 2-7.

Positioning of the RES-XR4-1U PCI/UIO Riser Cards

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RES-XR4-1U Installation Manual Version 1.5

Retainer Bracket

Right Riser Card

PCI-Express 2.0 x16

Universal I/O (UIO)

Note: P/N of Riser Card shown = RSC-R1UU-UE16

Retainer Bracket Screws

Retainer Bracket

Figure 2-8.

2.1.3.1 Installing Cards

Right PCI Riser Card: Perform the following steps to install a right-hand PCI card:

1. Locate the slot on the riser card (see Figure 2-7 on page 2-11) within which a card will be installed and remove the Phillips screw or tape holding the blank I/O faceplate corresponding to the slot (see Figure 2-10).

PCI Riser Cards attached to Retainer Bracket

Figure 2-9. Riser Card Inserted into PCI slots

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2—Installation and Operation

Left PCI Expansion Slot (not used)

Upper-Right PCI Expansion Slot

Lower-Right PCI Expansion Slot

Installation Procedures

2. Remove the blank I/O faceplate corresponding to the slot.

Note: Call Themis Technical Support if there is a question on how to secure the PCI I/O faceplate to the rear I/O panel.

3. Carefully install each PCI card (lower-right card first) into the appropriate slot

until all expansion cards have been installed. securing its I/O faceplate to the rear I/O panel—if permitted—with the Phillips screw or tape removed in Step

1. Secure the side edge of each card according to the following instructions:

Themis Computer

Figure 2-10. Three PCI Expansion Slots

Lower-Right PCI Expansion Slot—Themis has provided a pair of threaded standoffs to secure the card installed in the lower-right PCI expansion slot to the motherboard. Remove the standoff screws, install the PCI card into the lower-right slot, and secure the PCI card with the standoff screws.

Upper-Right PCI Expansion Slot—After installing the upper-right PCI expansion card, install a PCI Retainer Bracket that was shipped with your order onto the edge of the PCI card (see Figure 2-11 on page 2-14).

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RES-XR4-1U Installation Manual Version 1.5

Figure 2-11. Installation of the PCI Card Retainer Bracket

4. Attach any internal I/O cables to the installed PCI cards, and carefully fold and tuck any exposed ribbon cables into the cabinet.

5. If you have no further installations to perform, close the RES-XR4-1U chassis by refastening the top cover removed in Step 1 on page 2-2.

6. Attach all external cables to the I/O faceplates of the installed PCI/UIO cards.

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2.1.4 Lithium Battery

Lithium Battery

Exposed Battery

Note: Switzerland: Annex 4.10 of SR 814.013 applies to standard batteries.

2.1.4.1 Removing the Lithium Battery

Perform the following steps to remove the lithium battery:

1. Make sure the system is powered off (see “Operation” on page 2-31).

2—Installation and Operation

Installation Procedures

2. If you cannot access the lithium battery directly , you must move and/or detach

the multiple wire cable routed over the battery.

3. Locate the lithium battery socket and squeeze the latch (see A, Figure 2-13 on

page 2-16) together until the battery lifts out of its socket.

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Figure 2-12. Lithium Battery

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RES-XR4-1U Installation Manual Version 1.5

To release, squeeze the battery latch together

…

Battery

Latch

…

and remove the battery from socket

4. Remove the old battery and replace with a new battery (see Figure 2-13).

Figure 2-13. Lithium Battery and Socket

Note: Always dispose of used batteries in accordance with local guidelines and

regulations.

2.1.4.2 Installing a Lithium Battery

Perform the following steps to insert a new lithium battery:

1. Tilt the replacement battery into the empty socket so that it is angled under the battery latch (see B, Figure 2-13).

2. Carefully press down on the battery until it clicks firmly into place.

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2.1.5 Storage Drive

Knurled

Screw

Perform the following steps to remove and install a storage drive.

Note: For SATA II drives, the left-hand removable storage drive (SATA II ID0) is designated as the boot drive.

The front bezel (door) of the RES-XR4-1U must be unlocked and opened to access the storage drives.

2.1.5.1 Opening the RES-XR4-1U Front Doors

To access the removable storage drives, you must first open the front doors (see Figure 2-14, page 2-17). The knurled captive screw on the front of the RES-XR4-1U

allows the doors to lock without a key. To unlock the front doors, turn the screw counterclockwise and pull both bezel doors away from the chassis.

2—Installation and Operation

Installation Procedures

The accessory kit shipped with your RES-XR4-1U contains two barrel lock keys. This provides you the option of unlocking/locking the storage drives.

Figure 2-14.

Opening the RES-XR4-1U Front Doors

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RES-XR4-1U Installation Manual Version 1.5

Drive Lock

(one per drive)

Drive Release

Button

Drive 0

Drive 1

Drive 2

Figure 2-15. Unlocking the RES-XR4-1U Storage Drives (Front Doors Removed)

2.1.5.2 Storage-Drive Removal

After opening the front doors, perform the following steps to remove and install a storage drive:

Note: Since RES-XR4-1U storage drives are “hot-swappable”, it is not necessary to turn off system power in order to remove and replace a drive (except the operating system drive). However, after a warning has been broadcast to all users, the drive being replaced should be dismounted before being removed.

Consult your operating system manual for specific details.

1. Make sure the necessary precautions have been observed as per the previous Note (see “Operation” on page 2-31).

2. Locate the drive to be removed.

3. Insert the barrel lock key into the storage drive you want to remove, and turn

it 45 degrees clockwise (presuming the storage drive is locked).

4. Firmly push in the latch lock until the latch handle releases from the drive.

5. Grab the latch handle and pull the drive completely away from its slot.

Caution: When pulling the storage drive from the chassis, hold it at the bottom to prevent it from falling and damaging the drive.

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Insert key into barrel lock and turn A

…

push the latch lock,

…

Latch Lock

Latch Handle

…

and pull drive out with the latch handle.

45 degrees clockwise,

…

Barrel Key

Remove the four screws securing

Place the four screws in a plastic

Drive Holder

Storage Drive

Remove drive from drive holder.

Screw (1 of 4)

the drive to the drive tray using a

envelope for safe keeping.

phillips head screwdriver.

2—Installation and Operation

Installation Procedures

Themis Computer

Figure 2-16. RES-XR4-1U Storage Drive Removal

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2.1.5.3 Storage Drive Installation

To install a storage drive,

1. Make sure the latch handle of the drive to be installed is in the open position.

2. Properly orient the new drive and insert it into the vacant drive slot. If the

drive cannot be inserted into the slot, rotate it 180 degrees.

3. Push the drive toward the rear (DO NOT CLOSE the latch handle while pushing) until the drive is flush with the front of the chassis. The handle will swing closed when it comes into contact with the RES-XR4-1U chassis.

4. When the drive is fully inserted in its slot, insert the key into the barrel lock and turn it 45 degrees counter-clockwise. The drive is now locked.

Caution: When in the closed position, the latch handle secures the drive to the chassis. If the handle is closed before the drive is fully inserted, the latch mechanism may not fully engage to secure the drive.

5. If you are installing another storage drive, repeat Steps 1–4 for each additional drive.

2.1.6 Cooling Fans

The RES-XR4-1U contains six high-speed 40-mm cooling fans. Each fan is an integral part of the entire fan assembly, therefore if any fan needs to be replaced, the entire assembly must be replaced. The system must be powered down to replace the fan assembly. The fan assembly is held in place by two screws, located at each end of the assembly.

2.1.6.1 Removing and Installing the 40-mm Fan Assembly

Perform the following steps to remove and install the cooling fan assembly:

1. Power down the unit, and remove power cords from the power supply units.

2. After ensuring that power is completely disconnected from the unit, remove

the protective top cover as shown in Section 2.1.1, “Remove Protective Top Cover,” on page 2-1.

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2—Installation and Operation

Installation Procedures

3. Locate and remove the two mounting screws, one at each end of the assembly .

4. Disconnect the wiring header from each fan.

5. Remove the fan assembly.

6. T o replace the fan assembly , align the mounting holes in the fan assembly with

the mounting holes on the chassis.

7. Insert and tighten the mounting screws in the mounting holes.

8. Connect each fan wiring header.

9. Replace the protective top cover as indicated in Section 2.1.1, “Remove Pro-

tective Top Cover,” on page 2-1.

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2.2 Power Supply

Power supplies may be ordered in pairs to provide N+1 load-sharing redundancy. Systems ordered with only one power supply module are supplied with a dummy/blank module installed in the other power supply bay. In such configuration there is no redundancy in the power supply subsystem. This also applies to the MILSTD-461 spec’ed power supplies, both AC and DC, because a single power supply is double wide, and occupies both power supply bays.

Each load-sharing (N+1 redundant) power supply can be hot-swapped while the system is still on and operational.

2.2.1 DC Power Supply Option

The optional DC power supplies are available in 28VDC and 48VDC. They have the same configuration and physical size as the AC power supplies, except that the MILSTD-461 spec’ed power supply is double wide, occupying both power supply bays. The MIL-STD-461 power supply therefore does not offer redundancy. (See Figure 2-1 on page 2-2).

Each DC power supply is fitted with a Positronics PLB06M socket which mates with a PLB06F cable connector on the supplied cable. The supplied cable has three leads, each 80cm long, and is terminated with Y-type lugs, SVS5-4 or equivalent.

Figure 2-17.

DC Power Supplies

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2.2.2 Removing a Power Supply

Tie Wrap

Cut and remove the cable tie wrap securing each AC power cord

to the Power Cord Retention Bracket.

Power Cord Retention Bracket

Perform the following steps to remove a power supply:

1. Remove each AC power cord by cutting the cable tie wrap securing it to the Power Cord Retention Bracket (see A, Figure 2-18).

2. Loosen the two captive screws holding the Power Cord Retention Bracket to the chassis (see B, Figure 2-19 on page 2-24).

2—Installation and Operation

Power Supply

Figure 2-18.

Themis Computer

Remove each Power Cord from the RES-XR4-1U rear chassis

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Remove

Place Bracket in a safe place for future use.B

Screw

Remove Screw

3. Place the Bracket in a safe place for future use.

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Figure 2-19.

Remove the Power Cord Retention Bracket

Themis Computer

2.2.2.1 Chassis Grounding Screw

10-32 Grounding Screw

Single Hex Kep Nut

Single Kep Nut (top and bottom views)

10-32 Hex Kep Nut (both sides shown)D

Note: Two Kep Nuts are required

Installed 10-32 Screw and Hex Kep Nut.

to secure a RES-XR4 ground wire to a chassis

A chassis grounding screw is provided for chassis grounding. (See Figure 2-20). Important—Do not remove the ground wire, Kep Nuts, or grounding screw.

2—Installation and Operation

Power Supply

Figure 2-20. The RES-XR4-1U Rear Grounding Screw and Kep Nut

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Extraction

Handle

Pow er Supply

Locking Lever

System-Power LED

AC Ou tlet

Phillips Screw Hole

for knurled captive screw

ush locking lever to

Phillips Screw Hole for knurled captive screw on power supply locking bracket

Power Supply

Locking Lever

the right and remove power supply

4. Put the right index finger on the power supply extraction handle and the right

thumb on the left side of the power supply locking lever (see Figure 2-21).

5. Squeeze the locking lever toward the extraction handle and firmly pull the

power supply from the chassis.

Caution: When pulling the power supply from the chassis, hold it at the bottom to prevent it from falling and damaging the unit.

Figure 2-21. The RES-XR4-1U Power Supply Locking Mechanism

2.2.3 Installing a Power Supply

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Perform the following steps to install a power supply:

1. Insert the replacement power supply into an empty slot with the power LED

at the top (see Figure 2-21).

2. Push the power supply carefully into its slot until it is firmly seated (a click

will be heard when the locking lever is securely fastened to the chassis).

3. Re-install a Power Cord Retention Bracket to securely hold the power sup-

plies in place.

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2—Installation and Operation

Captive

screws should be

tightened to 5-inch lbs.

Note: When re-securing,

Screw

Captive Screw

2.2.4 Installing a Power Cord Retention Bracket

Note: Your RES-XR4-1U is shipped with a Power Cord Retention Bracket installed (see Figure 2-22). If it has been removed, follow the steps of this section to properly re-install a Power Cord Retention Bracket.

Perform the following steps to install a Power Cord Retention Bracket:

1. Secure the Retention Bracket to the rear of the RES-XR4-1U chassis with its two captive screws (see Figure 2-22).

Power Supply

Themis Computer

Figure 2-22.

Install the Power Cord Retention Bracket

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Plug in one of the AC power cords A … then secure it with a tie wrap.B

Connect AC Cord

Attach Tie Wrap

Repeat Steps A and B to connect a second AC power cord.

2. Plug in one of the AC power cords (see A, Figure 2-23), then secure it with a tie wrap (see B, Figure 2-23).

Repeat Step 2 to install a second AC power cord (see C, Figure 2-23).

Figure 2-23.

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The RES-XR4-1U Power Cord Retention Bracket

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2—Installation and Operation

USB Port

USB Cable

Cable Tie

(1 of 4)

Tie-Down Bar

USB Cable Retention Bracket

A B

1 Phillips Screw

2 Phillips Screws in top

(underneath)

2.2.5 Installing a USB Cable Retention Bracket

Note: Your RES-XR4-1U is shipped without a USB Cable Retention Bracket installed (see Figure 2-24). Follow the steps of this section to properly install a USB Cable Retention Bracket.

1. The USB Cable Retention Bracket is attached to the chassis with three Phillips head screws, which are shipped with your order (see A, Figure 2-24). Screw in and firmly tighten each screw.

2. After connecting a USB cable to one of the rear USB ports, secure it with a cable tie wrap through one of the tie-down bars of the USB Cable Retention Bracket (see Figure 2-24).

3. If necessary, attach a second USB cable to a USB port on either side of the Retention Bracket and secure it with a cable tie wrap.

Power Supply

Figure 2-24. The RES-XR4-1U USB Cable Retention Bracket

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Right Mounting Bracket

Right Handle

2.3 Rack Mounts

2.3.1 Mounting Brackets

The rack-mount brackets (flanges) are used to secure the chassis to the 19” rack (see Figure 2-25). Handles are used to pull the RES-XR4-1U from the rack when rackmount slides have been installed on the sides of the chassis (see following section).

Figure 2-25. Right Rack-Mount Bracket

2.3.2 Rack-Mount Slides (Optional)

Rack-Mount Slides can be mounted on each side of the RES-XR4-1U, for the purpose of sliding the unit in and out of a rack. Mounting slides are optional and should be ordered at the time your system is purchased.

To learn how to install rack-mount slides, refer to Appendix B, “Rack-Mount Slide Installation”.

Caution: Any screws used to mount a slide to a RES-XR4-1U chassis must not exceed a length of 6mm to prevent excessive penetration of the chassis.

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2.4 Operation

AC Power Socket

System Power LED

Locking Lever

System Power

On/Off Button

Power LED

2.4.1 Plugging in the AC Power Cords

Before powering on the RES-XR4-1U, plug in the AC power cords as follows:

1. On the rear of the RES-XR4-1U, plug an AC power cord (shipped with unit) into the AC power socket on each power supply (see Figure 2-26).

2—Installation and Operation

Themis Computer

Figure 2-26. AC Power Socket and LED on the RES-XR4-1U Rear

2.4.2 Turning the System On

1. Plug the AC power cord from each of the RES -XR4-1 U power supplies into a “live” AC outlet.

2. On the front of the RES-XR4-1U push the system power on/off button (see Figure 2-27). This will cause the system POWER LED to light (green) as well as the rear power supply module LED to light (green).

Figure 2-27. System Power Button and LED on the RES-XR4-1U Front

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2.4.3 Getting Started

2.4.3.1 Configuration

1. Make sure all storage drives are installed (see “Storage Drive” on page 2-17).

Drive ID numbers are shown in Figure 2-15 on page 2-18, Chapter 2. Changes may be made through the BIOS.

2. Make sure a multiscan monitor is connected to the VGA connector , or graphic

card video port (if a graphics card has been added to the system).

3. Attach a PS/2 keyboard and mouse to the appropriate connectors on the rear

I/O panel of the RES-XR4-1U (see See “Rear Panel I/O” on page 1-8.)

4. Turn the system on (see previous section).

2.4.3.2 Linux Installation

The subject of installing the Linux operating system onto the RES-XR4-1U is detailed in Appendix C, “Red Hat Enterprise Linux 5 Installation”.

2.4.4 Turning the System Off

Caution: Before turning your system off, make sure to save all open files, properly close applications, and broadcast a warning to all users on any active networks.

1. To turn the RES-XR4-1U power off, press and hold the system power on/off

button (see Figure 2-27, page 2-31) for at least four (4) seconds. This will shut down the system and turn off the POWER LED as well as the LED on the power supply unit(s).

As an alternative, a modern operating system (Windows 9x or newer and Linux, for example) can turn off the system after a graceful OS software shutdown.

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Specifications and Main Features

Frequently Asked Questions

User Manual