Themis RES-32XR3/FIO Installation Manual

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M a n u a l

RES-32XR3/FIO

Front I/O Chassis

3RU 19” Rack-Mount Rugged Enterprise Server

with X8DAH+-F Motherboard Configuration

/ Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs

Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs

RES-32XR3/FIO - Front I/O

RES-32XR3/FIO Installation

* SuperMicro Motherboard X8DAH+-F

Manual*

Version 1.0— July 2010

Themis Computer—Americas and Pacific Rim 47200 Bayside Parkway Fremont, CA 94538 Phone (510) 252-0870 Fax (510) 490-5529 World Wide Web http://www.themis.com

Themis Computer—Rest of World 5 Rue Irene Joliot-Curie 38320 Eybens, France Phone +33 476 14 77 80 Fax +33 476 14 77 89

photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without the prior written permission of Themis Computer.

The information in this publication has been carefully checked and is believed to be accurate. However, Themis Computer assumes no responsibility for inaccuracies. Themis Computer retains the right to make changes to this publication at any time without prior notice. Themis Computer does not assume any liability arising from the application or use of this publicat ion or the product(s) described herein.

RESTRICTED RIGHTS LEGEND: Use, duplication, or disclosure by the United States Government is subject to the restrictions set forth in DFARS 252.227-7013 (c)(1)(ii) and FAR 52.227-19.

TRADEMARKS and SERVICEMARKS

Themis® is a registered trademark of Themis Computer, Inc.

Intel

is a registered trademark of Intel Corporation.

™

Xeon

is a trademark of Intel Corporation. Red Hat Linux

All other trademarks, servicemarks, or registered trademarks used in this publication are the property of their respective owners.

is a registered trademark of Red Hat, Inc.

is a registered trademark of Linus Torvalds.

CE Marking

This product complies with the European EMC Directive (2004/108/EC) and the European Low Voltage Safety Directive (2006/95/EC)/.

Safety Precautions

Instructions regarding safety precautions during installation, operation, or maintenance of the equipment are given in the section entitled “Safety Instructions” on page iv.

WARNINGS and CAUTIONS

The definitions of WARNINGS and CAUTIONS as used in this document are given in the Preface in the section entitled “Notes, Cautions, Warnings, and Sidebars”.

Themis Customer Support

North America, South America, and Pacific Rim

Telephone: 510-252-0870

Fax: 510-490-5529

E-mail: support@themis.com

Web Site: http://www.themis.com

RES-32XR3/FIO Installation Manual, Version 1.0

July 2010 Part Number: 117611-024

RES-32XR3/FIO Installation Manual

Version Revision History

Ve rsi on 1 .0..............................................................................................July 2010

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Safety Instructions

To maximize user safety and ensure correct device operation, all instructions contained in this section should be read carefully.

Caution: It is important that the user observe all warnings and instructions that are on the device and contained in this manual.

• The device must be used in accordance with the instructions for use.

• Electrical installations in the room must correspond to the requirements of respective regulations.

• Take care that there are no cables, particularly mains cables, in areas where persons can trip over them.

• Do not use a mains connection in sockets shared by a number of other power consumers. Do not use an extension cable.

• Only use the mains cable supplied.

• The unit is completely disconnected from the power source only when the power cord is disconnected from the power source. Therefore the power cord and its connectors must always remain easily accessible.

• Do not set up the device in the proximity of heat sources or in a damp location. Make sure the device has adequate ventilation.

• All connection cables must be screwed or locked to the chassis housing.

• The device is designed to be used in horizontal position only.

• The device is no longer safe to operate when — the device has visible damage or — the device no longer functions.

• In these cases, the device must be shut down and secured against unintentional operation.

• Repairs may only be carried out by a person authorized by Themis Computer.

• The device may only be opened for the installation and removal of extension (PCI) cards, memory modules, storage drives, fan housings, power supplies,

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and the lithium battery—all in accordance with the instructions given in this manual.

• If extensions are made to the device, the legal stipulations and the device specifications must be observed.

• The device must be switched off when removing the top cover; for example, before installing extension (PCI) cards.

Operation of Laser Source Devices

DVD/CD-ROM drives contain laser light-emitting diodes (classified in accordance with IEC 825-1:1993: LASER CLASS 1) and, therefore, must not be opened.

If the enclosure of such a drive is opened, invisible laser radiation is emitted. Do not allow yourself to be exposed to this radiation.

The laser system meets the code of Federal Regulations 21 CFR,1040 for the USA and Canadian Radiation Emitting Devices Act, REDR C 1370.

RES-32XR3/FIO Installation Manual

Electrostatic Discharge (ESD)

A sudden discharge of electrostatic electricity can destroy static-sensitive devices or micro-circuitry. Proper packaging and grounding techniques are necessary precautions to prevent damage. Always take the following precautions:

1. Transport boards in static-safe containers such as boxes or bags.

2. Keep electrostatic-sensitive parts in their containers until they arrive at static-

free stations.

3. Always be properly grounded when touching a sensitive board, component, or

assembly.

4. Store electrostatic-sensitive boards in protective packaging or on conductive

foam.

Grounding Methods

Guard against electrostatic damage at workstations by following these steps:

1. Cover workstations with approved anti-static material. Provide a wrist strap

connected to a work surface and properly grounded tools and equipment.

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RES-32XR3/FIO Installation Manual

2. Use anti-static mats, heel straps, or air ionizers to give added protection.

3. Handle electrostatic-sensitive components, boards, and assemblies by the case

or the PCB edge.

4. Avoid contact with pins, leads, or circuitry.

5. Turn off power and input signals before inserting and removing connectors or

test equipment.

6. Keep the work area free of non-conductive materials such as ordinary plastic as-

sembly aids and Styrofoam.

7. Use field service tools, such as cutters, screwdrivers, and vacuums that are con-

ductive.

8. Always place drives and boards PCB-assembly-side down on the foam.

Instructions for the Lithium Battery

Systems are equipped with a lithium battery installed on the motherboard. To replace this battery, please observe the instructions that are described in this manual.

Warning: There is a danger of explosion when the wrong type of battery is used as a replacement.

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Table of Contents

.Preface ............................................................................................................................ xix

1. Overview and Specifications ........................................................................................ 1-1

1.1 Overview ................................................................................................................ 1-1

1.2 System LEDs and I/O Connectors ......................................................................... 1-5

1.3 Chipset Overview ................................................................................................ 1-10

1.3.1 Features of the 5500/5600 Processor and the 5520 Chipset .................... 1-10

1.4 Special Features ................................................................................................... 1-11

1.4.1 Recovery from AC Power Loss ............................................................... 1-11

1.5 PC Health Monitoring .......................................................................................... 1-11

1.5.1 Fan Status Monitor with Firmware Control ............................................. 1-11

1.5.2 Environmental Temperature Control ....................................................... 1-11

1.5.3 CPU Fan Auto-Off in Sleep Mode .......................................................... 1-12

1.5.4 System Resource Alert ............................................................................. 1-12

1.6 ACPI Features ...................................................................................................... 1-12

1.6.1 Slow Blinking LED for Suspend-State Indicator .................................... 1-13

1.6.2 Main Switch Override Mechanism .......................................................... 1-13

1.7 Power Supply ....................................................................................................... 1-13

1.8 Super I/O .............................................................................................................. 1-14

1.9 Overview of the Winbond WPCM450 Controller ...............................................1-14

1.10 Specifications ....................................................................................................... 1-15

1.10.1 General ..................................................................................................... 1-15

1.10.2 Electrical .................................................................................................. 1-16

1.10.2.1 System Power ........................................................................... 1-16

1.10.2.2 Output Voltage .......................................................................... 1-17

1.10.3 Environmental .......................................................................................... 1-17

1.10.3.1 Shock ........................................................................................ 1-17

1.10.3.2 Electrostatic Discharge ............................................................. 1-17

1.11 Packaging and Shipping ....................................................................................... 1-18

1.11.1 Accessory Kit ........................................................................................... 1-18

1.11.2 Rack-Mount Slides (Optional) ................................................................. 1-19

2. Installation and Operation ........................................................................................... 2-1

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2.1 Installation Procedures ........................................................................................... 2-1

2.1.1 Remove Protective Top Cover ................................................................... 2-1

2.1.2 Memory Modules ....................................................................................... 2-3

2.1.2.1 Installation ..................................................................................2-4

2.1.3 PCI Cards ................................................................................................... 2-7

2.1.3.1 Installing Cards ........................................................................... 2-7

2.1.4 Lithium Battery .......................................................................................... 2-8

2.1.4.1 Removing the Lithium Battery ................................................... 2-8

2.1.4.2 Installing a Lithium Battery ........................................................ 2-9

2.1.5 SATA Storage Drive .................................................................................. 2-9

2.1.5.1 Storage Drive Removal ............................................................... 2-9

2.1.5.2 Storage Drive Installation ......................................................... 2-10

2.1.6 Removable 120-mm Fan .......................................................................... 2-11

2.1.6.1 Removing and Installing a 120-mm Fan ................................... 2-11

2.1.7 Power Supply ........................................................................................... 2-12

2.1.7.1 Removing a Power Supply ....................................................... 2-12

2.1.7.2 Installing a Power Supply ......................................................... 2-13

2.2 Rack Mounts ........................................................................................................ 2-14

2.2.1 Mounting Brackets ................................................................................... 2-14

2.2.2 Rack-Mount Slides (Optional) ................................................................. 2-15

2.3 Operation ............................................................................................................. 2-15

2.3.1 Plugging in the AC Power Cords ............................................................. 2-15

2.3.2 Getting Started ......................................................................................... 2-16

2.3.2.1 Configuration ............................................................................ 2-16

2.3.2.2 Turning The System On ............................................................ 2-16

2.3.2.3 Linux Installation ...................................................................... 2-16

2.3.3 Turning the System Off ........................................................................... 2-17

3. BIOS Setup Utility ........................................................................................................ 3-1

3.1 Introduction ............................................................................................................ 3-1

3.1.1 Starting BIOS Setup Utility ....................................................................... 3-1

3.1.2 How To Change the Configuration Data ................................................... 3-2

3.1.3 Starting the Setup Utility ...........................................................................3-2

3.2 Main Setup ............................................................................................................. 3-3

3.2.1 System Time/System Date ......................................................................... 3-3

3.2.2 Supermicro X8DAH ..................................................................................3-4

3.2.3 Processor .................................................................................................... 3-4

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3.2.4 System Memory ......................................................................................... 3-4

3.3 Advanced Setup Configurations ............................................................................ 3-5

3.3.1 Boot Features ............................................................................................. 3-5

3.3.1.1 Quick Boot .................................................................................. 3-5

3.3.1.2 Quiet Boot ................................................................................... 3-5

3.3.1.3 AddOn ROM Display Mode ....................................................... 3-6

3.3.1.4 Bootup Num-Lock ...................................................................... 3-6

3.3.1.5 PS/2 Mouse Support ................................................................... 3-6

3.3.1.6 Wait For 'F1' If Error .................................................................. 3-6

3.3.1.7 Hit 'Del' Message Display ........................................................... 3-6

3.3.1.8 Watch Dog Function ................................................................... 3-6

3.3.1.9 Restore on AC Power Loss ......................................................... 3-6

3.3.1.10 Interrupt 19 Capture .................................................................... 3-6

3.3.2 Processor and Clock Options ..................................................................... 3-7

3.3.2.1 CPU Ratio ................................................................................... 3-7

3.3.2.2 Ratio CMOS Setting

(Available when the item-CPU Ratio is set to Manual) ............. 3-7

3.3.2.3 Clock Spread Spectrum .............................................................. 3-7

3.3.2.4 Hardware Prefetcher (Available when supported by the CPU) .. 3-7

3.3.2.5 Adjacent Cache Line Prefetch

(Available when supported by the CPU) .................................... 3-7

3.3.2.6 Intel® Virtualization Technology

(Available when supported by the CPU) .................................... 3-8

3.3.2.7 Execute-Disable Bit Capability

(Available when supported by the OS and the CPU) ................. 3-8

3.3.2.8 Simultaneous Multi-Threading

(Available when supported by the CPU) .................................... 3-8

3.3.2.9 Active Processor Cores ............................................................... 3-8

3.3.2.10 Intel® EIST Technology ............................................................. 3-8

3.3.2.11 C1E Support ................................................................................ 3-9

3.3.2.12 Intel® C-STATE Tech ................................................................ 3-9

3.3.2.13 C-State package limit setting

(Available when Intel® C-State Tech is enabled) ...................... 3-9

3.3.2.14 C1 Auto Demotion ...................................................................... 3-9

3.3.2.15 C3 Auto Demotion ...................................................................... 3-9

3.3.3 DCA Technology ....................................................................................... 3-9

3.3.3.1 DCA Prefetch Delay ................................................................... 3-9

3.3.4 Advanced Chipset Control ....................................................................... 3-10

3.3.4.1 QPI Links Speed ....................................................................... 3-10

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RES-32XR3/FIO Installation Manual

3.3.4.2 QPI Frequency .......................................................................... 3-10

3.3.4.3 QPI L0s and L1 ......................................................................... 3-10

3.3.4.4 Memory Frequency ................................................................... 3-10

3.3.4.5 Memory Mode ..........................................................................3-10

3.3.4.6 Demand Scrubbing ................................................................... 3-11

3.3.4.7 Patrol Scrubbing ....................................................................... 3-11

3.3.4.8 Throttling - Closed Loop / Throttling - Open Loop .................. 3-11

3.3.4.9 HDA Controller ........................................................................3-12

3.3.4.10 Intel VT-d ................................................................................. 3-12

3.3.4.11 SR-IOV Support ....................................................................... 3-12

3.3.4.12 NUMA Support ......................................................................... 3-13

3.3.4.13 Intel I/OAT ............................................................................... 3-13

3.3.4.14 Active State Power Management .............................................. 3-13

3.3.4.15 Route Port 80h Cycles to .......................................................... 3-13

3.3.4.16 USB Functions .......................................................................... 3-13

3.3.4.17 USB 2.0 Controller ................................................................... 3-13

3.3.4.18 Legacy USB Support ................................................................ 3-13

3.3.5 IDE/Floppy Configuration ....................................................................... 3-13

3.3.5.1 Floppy A ................................................................................... 3-14

3.3.5.2 SATA#1 Configuration ............................................................. 3-14

3.3.5.3 IDE Detect Timeout (sec) ......................................................... 3-14

3.3.5.4 Primary IDE Master/Slave, Secondary IDE Master/Slave,

3.3.6 PCI/PnP Configuration ............................................................................3-17

3.3.6.1 Clear NVRAM .......................................................................... 3-17

3.3.6.2 Plug & Play OS ......................................................................... 3-17

3.3.6.3 PCI Latency Timer .................................................................... 3-17

3.3.6.4 PCI IDE BusMaster .................................................................. 3-17

3.3.6.5 PCI-E I/O Performance ............................................................. 3-17

3.3.6.6 PCI-E Slot 1 x8, PCI-E Slot 2 x16, PCI-E Slot 3 x8,

3.3.6.7 Onboard LAN Option ROM Select ..........................................3-18

3.3.6.8 Load Onboard LAN1 Option ROM/Load Onboard LAN2

3.3.6.9 Boot Graphics Adapter Priority ................................................ 3-18

3.3.7 Super IO Device Configuration ............................................................... 3-18

3.3.7.1 Serial Port1 Address/Serial Port2 Address ............................... 3-18

3.3.7.2 Onboard Floppy Controller ....................................................... 3-19

Third IDE Master, and Fourth IDE Master ............................... 3-14

PCI-E Slot 4 x8 (in x16 slot), PCI-E Slot 5 PCI-E x4

(in x8 slot), PCI-E Slot 6 x16, PCI-E Slot 7 x8. .......................3-18

Option ROM ............................................................................. 3-18

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Table of Contents

3.3.8 Remote Access Configuration ................................................................. 3-19

3.3.8.1 Remote Access .......................................................................... 3-19

3.3.8.2 Serial Port Number ................................................................... 3-19

3.3.8.3 Serial Port Mode ....................................................................... 3-19

3.3.8.4 Flow Control ............................................................................. 3-19

3.3.8.5 Redirection After BIOS POST ................................................. 3-19

3.3.8.6 Terminal Type ........................................................................... 3-20

3.3.8.7 VT-UTF8 Combo Key Support ................................................ 3-20

3.3.8.8 Sredir Memory Display Delay .................................................. 3-20

3.3.9 Hardware Health Monitor ........................................................................ 3-20

3.3.9.1 CPU Overheat Alarm ................................................................ 3-20

3.3.9.2 CPU 1 Temperature/CPU 2 Temperature/System Temperature 3-21

3.3.9.3 Voltage Readings ...................................................................... 3-23

3.3.10 ACPI Configuration ................................................................................. 3-23

3.3.10.1 High Performance Event Timer ................................................ 3-23

3.3.10.2 USB Device Wakeup ................................................................ 3-23

3.3.10.3 PS2 KB/MS Wake Up .............................................................. 3-23

3.3.10.4 ACPI Aware O/S ...................................................................... 3-24

3.3.10.5 Suspend Mode ........................................................................... 3-24

3.3.10.6 ACPI APIC Support .................................................................. 3-24

3.3.10.7 APIC ACPI SCI IRQ ................................................................ 3-24

3.3.10.8 Headless Mode .......................................................................... 3-24

3.3.10.9 ACPI Version Features ............................................................. 3-24

3.3.11 Trusted Computing .................................................................................. 3-24

3.3.11.1 TCG/TPM (Trusted Platform Module) Support ....................... 3-24

3.3.12 IPMI Configuration .................................................................................. 3-25

3.3.12.1 IPMI Firmware Revision .......................................................... 3-25

3.3.12.2 Status of BMC .......................................................................... 3-26

3.3.13 View BMC System Event Log ................................................................ 3-26

3.3.13.1 Clear BMC System Event Log ................................................. 3-26

3.3.14 Set LAN Configuration ............................................................................ 3-26

3.3.14.1 Channel Number ....................................................................... 3-27

3.3.14.2 Channel Number Status ............................................................ 3-27

3.3.15 IP Address Source .................................................................................... 3-27

3.3.16 Mac Address ............................................................................................ 3-27

3.3.17 SET PEF Configuration ........................................................................... 3-28

3.3.17.1 PEF Support .............................................................................. 3-28

3.3.17.2 BMC Watch Dog Timer Action ................................................ 3-28

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3.3.18 Event Log Configuration ......................................................................... 3-29

3.3.18.1 View Event Log ........................................................................ 3-29

3.3.18.2 Mark all events as read .............................................................3-29

3.3.18.3 Clear event log .......................................................................... 3-29

3.3.18.4 PCI Error Log ...........................................................................3-29

3.4 Security Settings ..................................................................................................3-30

3.4.1 Supervisor Password ................................................................................ 3-30

3.4.2 User Password .......................................................................................... 3-30

3.4.3 Change Supervisor Password ................................................................... 3-30

3.4.4 User Access Level

(Available when Supervisor Password is set as above) ........................... 3-31

3.4.5 Change User Password (Available when a User Password is installed) .. 3-31

3.4.6 Clear User Password (Available only when User Password is installed) 3-31

3.4.7 Password Check (Available when a password is installed) ..................... 3-31

3.4.8 Boot Sector Virus Protection ................................................................... 3-31

3.5 Boot Configuration .............................................................................................. 3-32

3.5.1 Boot Device Priority ................................................................................ 3-32

3.5.2 Storage Drives .......................................................................................... 3-32

3.5.3 Removable Drives .................................................................................... 3-33

3.5.4 CD/DVD Drives ...................................................................................... 3-33

3.6 Exit Options ......................................................................................................... 3-34

3.6.1 Save Changes and Exit ............................................................................ 3-34

3.6.2 Discard Changes and Exit ........................................................................ 3-34

3.6.3 Discard Changes ...................................................................................... 3-35

3.6.4 Load Optimal Defaults ............................................................................. 3-35

3.6.5 Load Fail-Safe Defaults ........................................................................... 3-35

3.7 BIOS Recovery .................................................................................................... 3-35

3.7.1 Boot Sector Recovery from a USB Device ............................................. 3-36

3.7.2 Boot Sector Recovery from an IDE CD-ROM ........................................ 3-36

3.7.3 Boot Sector Recovery from a Serial Port (“Serial Flash”) ...................... 3-36

3.7.3.1 Requirements ............................................................................ 3-36

3.8 BIOS Error Beep Codes ....................................................................................... 3-40

Appendix A. Connector Pinouts ...................................................................................... A-1

A.1 PS/2 Keyboard and Mouse ................................................................................... A-1

A.2 USB Ports ............................................................................................................. A-2

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A.3 Serial Port ............................................................................................................. A-2

A.4 VGA Display Port ................................................................................................. A-3

A.5 Gigabit Ethernet LAN Ports ................................................................................. A-4

A.6 IPMI Dedicated LAN Port .................................................................................... A-4

Appendix B. Rack-Mount Slide Installation ...................................................................B-1

Appendix C. Red Hat Enterprise Linux 5 Installation ..................................................C-1

C.1 Introduction ............................................................................................................C-1

C.2 Installation .............................................................................................................C-2

C.2.1 Step 1. ........................................................................................................C-2

C.2.2 Step 2. ........................................................................................................C-2

C.2.3 Step 3 .........................................................................................................C-3

C.2.4 Step 4 .........................................................................................................C-3

C.2.5 Step 5 .........................................................................................................C-4

C.2.6 Step 6 ........................................................................................................C-4

C.2.7 Step 7 ........................................................................................................C-5

C.2.8 Step 8 ........................................................................................................C-6

C.2.9 Step 9 ........................................................................................................C-7

C.2.10 Step 10 ......................................................................................................C-8

C.2.11 Step 11 .......................................................................................................C-9

C.2.12 Step 12 ....................................................................................................C-10

C.2.13 Step 13 ....................................................................................................C-11

C.2.14 Step 14 .....................................................................................................C-12

C.2.15 Step 15 ....................................................................................................C-13

C.2.16 Step 16 ....................................................................................................C-14

C.2.17 Step 17 ....................................................................................................C-15

C.2.18 Step 18 ....................................................................................................C-16

C.2.19 Step 19 ....................................................................................................C-16

C.2.20 Step 20 .....................................................................................................C-17

C.2.21 .Step 21 ....................................................................................................C-18

C.2.22 Step 22 ....................................................................................................C-18

Appendix D. Optional Remote On/Off Switch .............................................................. D-1

D.1 Remote On/Off Configuration .............................................................................. D-1

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D.2 Remote Only Configuration .................................................................................. D-2

D.3 Ordering the Remote On/Off Switch .................................................................... D-2

Appendix E. Re-Packing Instructions ............................................................................. E-1

E.1 Re-Packaging for Shipment ................................................................................... E-1

E.2 Packing Components .............................................................................................E-1

E.3 Instructions for Re-Packing ...................................................................................E-2

Index ................................................................................................................Index-1

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List of Figures

Figure 1 Rugged Enterprise Server Model RES-32XR3/FIO......................................... xix

Figure 1-1 RES-32XR3/FIO.............................................................................................. 1-1

Figure 1-2 X8DAH+-F Motherboard Block Diagram....................................................... 1-3

Figure 1-3 External Features of RES-32XR3/FIO (Front)................................................ 1-4

Figure 1-4 Major Components of RES-32XR3/FIO (Open Top View)............................ 1-6

Figure 1-5 RES-32XR3/FIO System LEDs and I/O Connectors1 .................................... 1-7

Figure 2-1 Remove the RES-32XR3/FIO Protective Access Cover................................. 2-2

Figure 2-2 Remove the Air-Flow Deflector Screws.......................................................... 2-4

Figure 2-3 Memory Module Slot Locations...................................................................... 2-5

Figure 2-4 Memory Module Removal............................................................................... 2-6

Figure 2-5 PCI Card Installation ....................................................................................... 2-7

Figure 2-6 PCI Card Clamp............................................................................................... 2-7

Figure 2-7 The RES-32XR3/FIO Lithium Battery and Socket......................................... 2-8

Figure 2-8 Unlocking the RES-32XR3/FIO Storage Drives (Front Doors Removed)...... 2-9

Figure 2-9 RES-32XR3/FIO Storage Drive Removal..................................................... 2-10

Figure 2-10 The RES-32XR3/FIO 120-mm Fans ............................................................. 2-11

Figure 2-11 The RES-32XR3/FIO Power Supply Locking Mechanism........................... 2-13

Figure 2-12 Right Rack-Mount Bracket............................................................................ 2-14

Figure 2-13 AC Power Socket and LED on the RES-32XR3/FIO.................................... 2-15

Figure 2-14 System Power Button and LED on the RES-32XR3/FIO Front.................... 2-16

Figure 3-1 Main BIOS Setup Screen................................................................................. 3-3

Figure 3-2 Advanced Settings ........................................................................................... 3-5

Figure 3-3 Security Settings ............................................................................................ 3-30

Figure 3-4 Boot Settings.................................................................................................. 3-32

Figure 3-5 Exit Options................................................................................................... 3-34

Figure 3-6 AMI_FLSH HyperTerminal .......................................................................... 3-38

Figure 3-7 ROM File Extraction ..................................................................................... 3-39

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Figure 3-8 Flash Recovery .............................................................................................. 3-39

Figure A-1 USB Connector Pinout.................................................................................... A-2

Figure A-2 COM 1 Serial Connector Pinout..................................................................... A-2

Figure A-3 RES-32XR3/FIO VGA Connector Pinout...................................................... A-3

Figure A-4 Ethernet Connector, Type RJ45...................................................................... A-4

Figure B-1 Screw Locations for Rack-Mount Slides ......................................................... B-1

Figure B-2 RES-32XR3/FIO Rack-Mount Slide Installation ............................................ B-3

Figure C-1 Power On after Linux DVD is Inserted into Drive.......................................... C-2

Figure C-2 Skip Key .......................................................................................................... C-2

Figure C-3 Welcome Screen .............................................................................................. C-3

Figure C-4 Language Selection.......................................................................................... C-3

Figure C-5 Selecting Layout Type..................................................................................... C-4

Figure C-6 Enter Installation Number................................................................................ C-4

Figure C-7 Partitioning....................................................................................................... C-5

Figure C-8 Reviewing Option............................................................................................ C-6

Figure C-9 Creating a Custom Layout............................................................................... C-7

Figure C-10 Setting Up Boot Loader................................................................................... C-8

Figure C-11 Master Boot Record (MBR) ............................................................................ C-9

Figure C-12 Network Devices List .................................................................................... C-10

Figure C-13 Edit Interface Pop-Up Screen ........................................................................ C-11

Figure C-14 Selecting Time Zone...................................................................................... C-12

Figure C-15 Setting Up Root Account and Password........................................................ C-13

Figure C-16 Package Installation Default Screen.............................................................. C-14

Figure C-17 Optional Packages.......................................................................................... C-15

Figure C-18 Option to Review or Continue....................................................................... C-16

Figure C-19 Installation Begins ......................................................................................... C-16

Figure C-20 Installation is Complete ................................................................................. C-17

Figure C-21 Login Screen.................................................................................................. C-18

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Table of Contents

Figure C-22 Ready to use the Desktop............................................................................... C-18

Figure D-1 Remote On/Off Switch Module...................................................................... D-1

Figure E-1 Packaging Components.................................................................................... E-2

Figure E-2 Order of Assembly........................................................................................... E-3

List of Tables

Table 1 RES-x2XR3 Manual Matrix (AC and DC Power Supplies) ..............................xx

Table 2 RES-x2XR3S / RES-x1XR3 17” Chassis Manual Matrix

(AC and DC Power Supplies) .......................................................................... xxi

Table 3 RES-x2XR3/FIO 16” Chassis Manual Matrix (AC and DC Power Supplies) xxii

Table 1-1 RES-32XR3/FIO Motherboard Options......................................................... 1-2

Table 1-2 RES-32XR3/FIO Major Features ................................................................... 1-2

Table 1-3 Specifications of the RES-32XR3/FIO........................................................... 1-5

Table 1-4 System LEDs .................................................................................................. 1-8

Table 1-5 I/O Connectors................................................................................................ 1-9

Table 1-6 RES-32XR3/FIO General Specifications ..................................................... 1-15

Table 1-7 RES-32XR3/FIO Electrical Specifications................................................... 1-16

Table 1-8 Approximate Weights of the RES Series...................................................... 1-19

Table 2-1 RES-32XR3/FIO Memory Capacity............................................................... 2-3

Table 2-2 RES-32XR3/FIO Optimal Memory Population—Two CPUs Installed......... 2-3

Table A-1 PS/2 Keyboard/Mouse Pinout and Signal Descriptions ................................ A-1

Table A-2 USB Connector Pinout Signal Descriptions.................................................. A-2

Table A-3 COM 1 Serial Connector Pinout Signal Descriptions ................................... A-2

Table A-4 RES-32XR3/FIO VGA Connector-Pin Signals............................................. A-3

Table A-5 RJ45 Ethernet Pinout Signals ........................................................................ A-4

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RES-32XR3/FIO Installation Manual

xviii

Themis Computer

Preface

This document, entitled RES-32XR3/FIO Installation Manual, provides instructions on how to install, configure, power up, boot, and perform diagnostics on the Themis Rugged Enterprise Server RES-32XR3/FIO (see photo), based on two 64-bit Intel 5520 Series Xeon

RES-32XR3/FIO supports the SuperMicro X8DAH+-F motherboard in a 16” chas-

Quad/Dual-Core CPUs with up to 6.4 GT/s each.

sis. (A matrix describing 16” chassis configurations is given in Table 3, page xxii; for a matrix describing 17” chassis configurations, see Table 2, page xxi; a matrix describing 20” chassis configurations is in Table 1, page xx.)

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Figure 1. Rugged Enterprise Server Model RES-32XR3/FIO

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RES-32XR3/FIO Installation Manual

Table 1. RES-x2XR3 Manual Matrix (AC and DC Power Supplies)

Manual Motherboard

Configuration 1

X8DTH-iF X8DTH-6F

RES-32XR3

Manual

Part Number

116790-024 1176789-024

RES-22XR3

Manual

Part Number

RES-12XR3

Manual

Part Number

X8DTi

Configuration 2

X8DTi-F

117022-024 117017-024

X8DTi-LN4F X8DT3

Configuration 3

X8DT3-F

117023-024 117018-024

X8DT3-LN4F

Configuration 4 X8DTN+ 117024-024 117019-024

Configuration 5

X8DAi X8DA3

117025-024 117020-024

Configuration 6* X8DAH+F 117026-024 117021-024 Configuration 7 X8DTU-F 117280-024 116970-024

Naming Key: X8Dvwxyz z System RES-x2XR3, where x =3, 2, or 1

v: A = Sound chip; no graphics chip

T = Graphics chip; no sound chip *Configuration 6 motherboard X8DAH+-F supports both audio and video; however, the naming key does not contain a “T” in the title.

w: H = Two Tylersburg Northbridge chips

blank = One Tylersburg Northbridge chip U = Motherboard with cutout

x: i=SATA only

3 = SAS 1.0 6 = SAS 2.0

y: LN4 = Extra gigabit Ethernet controller for two extra ports z: F=IPMI

blank = No IPMI

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Preface

Table 2. RES-x2XR3S / RES-x1XR3 17” Chassis Manual Matrix (AC and DC Power Supplies)

Mother-

board

X8DTL-6F X8DTL-6

X8DTL-3F X8DTL-3

X8DTL-iF X8DTL-i

X8DAL-3 X8DAL-i

CPU

Soc

kets

2 117408-024 117412-024 117416-024

2 117409-024 117413-024 117417-024

2 117410-024 117414-024 117418-024

2 117411-024 117415-024 117419-024

RES-

32XR3S

Manual P/N

RES-

22XR3S

Manual P/N

RES-

12XR3S

Manual P/N

RES-

31XR3

Manual P/N

RES-

21XR3

Manual P/N

X8SAX 1 117420-024 117421-024 X8ST3-F

X8STE

117385-024 117422-024

X8STi X8STi-F X8STi-LN4

X8STi-3F

RES-

11XR3

Manual P/N

117423-024

Naming Key: X8uvwxyz z System RES-x2XR3S and RES-x1XR3, where x =3, 2, or 1

u: D = Double CPU sockets

S = Single CPU socket

v: A = Sound chip; no graphics chip

T = Graphics chip; no sound chip

w: Not applicable x: i=SATA only

3 = SAS 1.0 6 = SAS 2.0

y: LN4 = Extra gigabit Ethernet controller for two extra ports z: F=IPMI

blank = No IPMI

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RES-32XR3/FIO Installation Manual

Table 3. RES-x2XR3/FIO 16” Chassis Manual Matrix (AC and DC Power Supplies)

Mother-

board

X8DAH+-F*2 X8DTU-F 2 117664-024

Naming Key: X8uvwxyz z System RES-x2XR3S and RES-x1XR3, where x = 3, 2, or 1

*RES-32XR3/FIO motherboard X8DAH+-F supports both audio and video;

however, the naming key does not contain a “T” in the title.

u: D = Double CPU sockets

S = Single CPU socket

v: A = Sound chip; no graphics chip

T = Graphics chip; no sound chip

w: Not applicable x: i=SATA only

3 = SAS 1.0 6 = SAS 2.0

y: LN4 = Extra gigabit Ethernet controller for two extra ports z: F=IPMI

blank = No IPMI

CPU

Soc

kets

RES-32XR3/FIO Manual P/N RES-22XR3/FIO Manual P/N

117611-024

xxii

The 3RU-high (5.25”) RES-32XR3/FIO has been designed to fit into a standard 19” rack and is provided with rack-mount brackets with handles. Optional rack-mount slides are also available. The RES-32XR3/FIO is rugged enough to withstand extreme shock (up to 35G), temperature, and EMI as that associated with such demanding markets as the military, aerospace, and telecommunications industries.

The two quad-core/dual-core Intel Xeon CPUs operate up to 6.4 GT/s (with a 1333MHz front-side system bus) and support up to 192 GigaBytes of DDR3 ECC FBDIMM memory modules. The RES-32XR3/FIO is based on the functionality and capability of the following Intel chipset:

• Intel 5520 (Tylersburg) chipset

• ICH10R + 2x IOH-36D (Southbridge)

An overview of RES-32XR3/FIO design and specifications is given in Chapter 1, "Overview and Specifications", of this manual.

Themis Computer

Preface

Website Information

This manual is intended for an experienced system administrator with a knowledge of both networking and high-speed server systems.

Website Information

Themis Computer corporate and product information may be accessed on the World Wide Web by browsing the website http://www.themis.com

Your Comments are Welcome

We are interested in improving our documentation and welcome your comments and suggestions. You can email your comments to us at docfeedback@themis.com. Please include the document part number in the subject line of your email.

Themis Computer

Notes, Cautions, Warnings, and Sidebars

The following icons and formatted text are included in this document for the reasons described:

Note: A note provides additional information concerning the procedure or action being described.

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RES-32XR3/FIO Installation Manual

Caution: A caution describes a procedure or action that may result in damage to the equipment. This may involve—but is not restricted to—heavy equipment or sharp objects. To reduce the risk, follow the instructions accompanying this symbol.

Warning: A warning describes a procedure or action that may cause injury or death to the operator. To reduce the risk, follow the instructions accompanying this symbol.

Sidebar: A “sidebar” adds detail to the section within which it is placed, but is not absolutely vital to the description or procedure of the section.

xxiv

Themis Computer

General Section

1.1 Overview

The RES-32XR3/FIO, (see Figure 1-1 below), is a rack-mounted system designed for above-average shock and vibration environments. The RES-32XR3/FIO supports

single or dual Intel® 1366-pin LGA XeonTM 64-bit processors (each up to 2.33 GHz with a 1333-MHz system bus), and has many computer- and graphics-intensive and diverse-I/O capabilities, ideal for a variety of military/aerospace and commercial telecommunications applications. Motherboard options supported by RES-32XR3/FIO are listed in Table 1-1 on page 1-2.

Chapter

1RES-32XR3/FIO

Overview and Specifications

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Figure 1-1. RES-32XR3/FIO

1-1

RES-32XR3/FIO Installation Manual

(A block diagram is given in Figure 1-2, page 1-2).

Mother-

board

X8DAH+-F Yes Yes — 18 Yes Yes 3 4

a—SuperMicro Computer, Inc.

IPMI SATA SAS

The RES-32XR3/FIO is designed within a 3RU-high (5.25”) form-factor 16” (40.6 cm) deep and 17.07” (43.4 cm) wide (which, with mounting brackets, fits a 19”-wide rack). Major features of the RES-32XR3/FIO motherboard are listed in Table 1-2.

Table 1-1. RES-32XR3/FIO Motherboard Options

Memory

Slots

Graphics Audio

Table 1-2. RES-32XR3/FIO Major Features

PCI-e Slots

PCI-e

x16

PCI-e

Processors • Two Quad Core Intel® 5600/5500 Series Xeon Proce ssors

• Intel® 5520 (Tylersburg) chipset

Chipset

• ICH10R + 2x IOH-36D

• 18 DIMMs

Memory

• up to 192 GB

• 1333/1066/800 MHz DDR3 ECC Registered Memory

Expansion Slots • 3 (x16) PCI-E 2.0, 4 (x8) PCI-E 2.0

Disk Drive Options

• 6 SATA slots: RAID 0, 1, 5, 10 support (Win), RAID 0,1,10 support (Linux)

• PS/2 Keyboard/Mouse Ports

• 6 USB 2.0 front ports (USB 0 thru USB 5) plus 1 on motherboard, plus 2 internal headers (3ports) Total of 10 USB 2.0 compliant ports.

• 1 Serial port (COM 1)

Front I/O

• 2 RJ45 LAN ports (Gigabit Ethernet)—LAN 1 and LAN 2

•VGA port

• Audio: 7.1 HD Audio, mike in, line in, side- and back-surround, CEN/LFE, front.

• IPMI 2.0 with virtual media over LAN and KVM-over-LAN support via dedicated RJ45 IPMI LAN port

1-2

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Overview and Specifications

Overview

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Figure 1-2. X8DAH+-F Motherboard Block Diagram

1-3

RES-32XR3/FIO Installation Manual

16” (40.6 cm) deep

Dual Power Supplies

Power Supply

Latch Lock

AC Power Socket

(3-prong NEMA 15)

CD-RW/DVD-ROM Combo Drive

PS1

System Power

ON/OFF Switch

PCI-Express 2.0 x8 slot

PCI-Express 2.0 x16 slot

PCI-Express 2.0 x8 slot

Slot 1

5.25”

(3RU)

PS2

Slot 7

I/O Panel (see Figure 1-5, page 1-7

Storage Drives

17.07” (43.4 cm), 19” with Rack Mounts

PCI-Express 2.0 x8 (in x16 slot)

PCI-Express 2.0 x4 (in x8 slot)

PCI-Express 2.0 x16 slot

Figure 1-3. External Features of RES-32XR3/FIO (Front)

The RES-32XR3/FIO front panel houses three removable storage drive bays (see Figure 1-3). Six SATA drives are supported by the X8DAH+-F motherboard. Additional drives may be supported by an installed PCI-E card.

Drive requirements should be specified at the time the system is purchased. Also included on the front panel is a reset switch and the system power button and

LEDs (see Figure 1-5 on page 1-7), I/O faceplates for seven PCI cards (graphics, RAID, NIC, etc.), two AC power supplies with latch locks and power-cord sockets, and all I/O connectors (see Figure 1-5 on page 1-7).

Major features of the RES-32XR3/FIO are described in Table 1-3. Major internal components can be seen in the open top view (cover removed) of Figure 1-4 on page 1-6.

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Table 1-3. Specifications of the RES-32XR3/FIO

Feature Details

Overview and Specifications

System LEDs and I/O Connectors

Operating temperature Shock endurance Dimensions

z 0° up to 65° C (32° up to 149°F) z 35G @ 25-msec duration (3 axis) z 5.25” (3RU) high, 17.07” (43.4 cm) wide (19”/48.3 cm with mounting brack-

ets), 16” (40.6 cm) deep (including clearance for the rear thumb screws)

Rack-mount brackets and slides

Dual power supplies

z Left and right rack-mount tabs are attached to the chassis z Left and right rack-mount slides are optional

z 750 watts each, auto-ranging (100–240 VAC) z Load-sharing N+1 redundant, hot-pluggable z (Optional) 750 Watts DC power supply (48V and 28V)

a—Specifications are dependent on the configurations specified in this manual.

1.2 System LEDs and I/O Connectors

All RES-32XR3/FIO system LEDs and all I/O connectors are located on the front panel (see A, Figure 1-5, page 1-7).

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LEDs are described in Table 1-4 on page 1-8; I/O connectors are described in Table 1-5, page 1-9.

1-5

RES-32XR3/FIO Installation Manual

12 DIMM Memory Modules and 2 CPUs underneath

PCI Slot 1

I/O Slots 1 to 7

(PCI-Express 2.0 x8) (PCI-Express 2.0 x16)

(PCI-Express 2.0 x8)

(PCI-E 2.0 x8 in x16 slot)

(PCI-E x4 in an x8 slot)

5 6

(PCI-Express 2.0 x16)

(PCI-Express 2.0 x8)

Power Supply (1 of 2)

Front

CD/DVD Combo-Drive Housing

Lithium Battery (under cabling)

120-mm Fan (1 of 3)

Figure 1-4. Major Components of RES-32XR3/FIO (Open Top View)

1-6

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Overview and Specifications

System LEDs and I/O Connectors

LEDs

PS2 Mouse

Drives

IPMI Dedicated LAN

COM 1 Port

Fail

(PS1)

Powe r

Fail

(PS2)

ENET1

NIC1 NIC2Storage

ENET2

Overheat/

Fan Fail

Knockout slot

LAN2

Powe rPowe r

CEN/LFE

Back-surround

Line-in

PS2 Keyboard

Figure 1-5. RES-32XR3/FIO System LEDs and I/O Connectors1

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VGA Port

USB0 (top)

USB1 (btm)

USB 2-5

LAN1

Front

Side-surround

Microphone-in

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RES-32XR3/FIO Installation Manual

ENET

Symbol LED Description

Table 1-4. System LEDs

ENET1

Power

Storage Drive (SD)

NIC1

(Gb Ethernet) z Indicates network activity on LAN 1.

NIC2 (Gb Ethernet)

Power Fail

(Lower Power Supply)

Power Fail

(Upper Power Supply)

Overheat/Fan Fail —Normally OFF —RED light when tem-

perature limits are exceeded

z Indicates that the system is turned on.

z Indicates SATA storage drive activity.

z Indicates network activity on LAN 2.

z Warns that there is a fa ilure in the lower power

supply.

z Warns that there is a failure in the upper power

supply.

z Warns that the system is exceeding specified

temperature parameters. The CPU overheat warning function must be enabled in the BIOS, thus allowing the user to define an overheat temperature, which—when exceeded—triggers the overheat warning LED.

N/A LAN1 and LAN2

a—NIC = Network Interface Controller.

1-8

Each Ethernet port contains two LEDs:

z The color of the left LED (when facing the port)

indicates the LAN connection speed:

- Off = 10 MHz

- Green = 100 MHz

- Amber = 1 GHz

z The right LED, when lit, indicates LAN activity.

Themis Computer

Table 1-5. I/O Connectors

Connector Description

Overview and Specifications

System LEDs and I/O Connectors

PS/2 Mouse PS/2 Keyboard

USB 0 thru USB 5

Hi-Speed USB 2.0 Serial Ports

COM 1 Serial Port VGA Port

Ethernet LAN Ports

IPMI Dedicated LAN

Port

z 6-pin mini-DIN (female) connector to attach a PS/2 mouse device. z 6-pin mini-DIN (female) connector to attach a PS/2 keyboard device. z Six 4-pin USB connectors to attach seri al devices to USB Port 0 th ru

USB Port 5.

Note: Four additional USB ports can be accessed directly from the

motherboard.

z One DB9 (male) connector to attach a serial device to the COM 1 port z 15-pin VGA connector to attach a monitor device. z Stan dard RJ45 connectors to attach o ne or two gigabit Etherne t LAN

line(s)—LAN 1 and LAN 2.

z Standard RJ45 connector to attach a dedicated IPMI LAN line.

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RES-32XR3/FIO Installation Manual

1.3 Chipset Overview

Built upon the functionality and capability of the Intel 5500/5600 series processor platform, the RES-32XR3/FIO motherboard provides the performance and feature sets required for dual-processor/IOH-based high-end systems optimized for High Performance Computing (HPC)/Cluster platforms. The 5520 chipset consists of the IOH 36D (I/O Hub), and the ICH10R (South Bridge). With the Intel QuickPath Interconnect (QPI) controller built in, the 5520 platform offers the next generation point-to-point system interconnect interface that replaces the current Front Side Bus Technology, substantially enhancing system performance and scalability.

The IOH-36D connects to each processor through an independent QPI link. Each link consists of 20 pairs of unidirectional differential lanes for transmission and receiving in addition to a differential forwarded clock. A full-width QPI link pair provides 84 signals.

The 5520 chipset supports up to 36 PCI Express Gen2 lanes, peer-to-peer read and write transactions. The ICH10R provides up to seven PCI-Express ports, six SATA ports and 10 USB connections. In addition, the 5520 platform also offers a wide range of RAS (Reliability, Availability and Serviceability) features. These features include memory interface ECC, x4/x8 Single Device Data Correction (SDDC), Cyclic Redundancy Check (CRC), parity protection, out-of-band register access via SMBus, memory mirroring, memory sparing, and Hot-plug support on the PCIExpress Interface.

1.3.1 Features of the 5500/5600 Processor and the 5520 Chipset

• Four processor cores in each processor with 8MB shared cache among cores

• Two full-width Intel QuickPath interconnect links, up to 6.4 GT/s of data transfer

rate in each direction

• Virtualization Technology, Integrated Management Engine supported

• Point-to-point cache coherent interconnect, Fast/narrow unidirectional links, and

Concurrent bi-directional traffic

• Error detection via CRC and Error correction via Link level retry

1-10

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1.4 Special Features

1.4.1 Recovery from AC Power Loss

BIOS provides a setting for you to determine how the system will respond when AC power is lost and then restored to the system. You can choose for the system to remain powered off (in which case you must press the power switch to turn it back on) or for it to automatically return to a power- on state. See the Advanced BIOS Setup section to change this setting. The default setting is Last State.

1.5 PC Health Monitoring

Overview and Specifications

Special Features

This section describes the PC health monitoring features of the RES-32XR3/FIO motherboard. All have an onboard System Hardware Monitor chip that supports PC health monitoring. An onboard voltage monitor will scan these onboard voltages continuously:

CPU1 Vcore, CPU2 Vcore, CPU1 Vtt, CPU2 Vtt, CPU1 DIMM, CPU2 DIMM,

1.1V, 1.5V, 1.8V, 3.3V, 12V, 5V, 3.3 Vsb, and VBAT. Once a voltage becomes unstable, a warning is given or an error message is sent to

the screen. Users can adjust the voltage thresholds to define the sensitivity of the voltage monitor.

1.5.1 Fan Status Monitor with Firmware Control

The PC health monitor can check the RPM status of the cooling fans. The onboard CPU and chassis fans are controlled by Thermal Management in the BIOS (under Hardware Monitoring in the Advanced section).

1.5.2 Environmental Temperature Control

The thermal control sensor monitors the CPU temperature in real time and will turn on the thermal control fan whenever the CPU temperature exceeds a user-defined threshold. The overheat circuitry runs independently from the CPU. Once it detects that the CPU temperature is too high, it will automatically turn on the thermal fan control to prevent any overheat damage to the CPU. The onboard chassis thermal

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RES-32XR3/FIO Installation Manual

circuitry can monitor the overall system temperature and alert users when the chassis temperature is too high.

Caution: T o avoid possible system overheating, please be sure to provide adequate airflow to your system.

1.5.3 CPU Fan Auto-Off in Sleep Mode

The CPU fan becomes active when the power is turned on. It continues to operate when the system enters the Standby mode. When in the sleep mode, the CPU will not run at full power, thereby generating less heat.

1.5.4 System Resource Alert

This feature is available when used with Supero Doctor III in the Windows OS environment or used with the Supero Doctor II in Linux. Supero Doctor is used to notify the user of certain system events. For example, you can also configure Supero Doctor to provide you with warnings when the system temperature, CPU temperatures, voltages and fan speeds go beyond a pre-defined range.

1.6 ACPI Features

ACPI stands for Advanced Configuration and Power Interface. The ACPI specification defines a flexible and abstract hardware interface that provides a standard way to integrate power management features throughout a PC system, including its hardware, operating system and application software. This enables the system to automatically turn on and off peripherals such as CD-ROMs, network cards, storage drives and printers.

In addition to enabling operating system-directed power management, ACPI provides a generic system event mechanism for Plug and Play and an operating systemindependent interface for configuration control. ACPI leverages the Plug and Play BIOS data structures while providing a processor architecture-independent implementation that is compatible with both Windows 2003 and Windows 2008 Operating Systems.

1-12

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Overview and Specifications

1.6.1 Slow Blinking LED for Suspend-State Indicator

When the CPU goes into a suspend state, the chassis power LED will start blinking to indicate that the CPU is in suspend mode. When the user presses any key, the CPU will wake-up and the LED will automatically stop blinking and remain on.

1.6.2 Main Switch Override Mechanism

When an ATX power supply is used, the power button can function as a system suspend button to make the system enter a SoftOff state. The monitor will be suspended and the storage drive will spin down. Pressing the power button again will cause the whole system to wake-up. During the SoftOff state, the ATX power supply provides power to keep the required circuitry in the system “alive.” In case the system malfunctions and you want to turn off the power, just press and hold the power button for 4 seconds. This option can be set in the Power section of the BIOS Setup routine.

Power Supply

1.7 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable operation. It is even more important for processors that have high CPU clock rates.

The RES-32XR3/FIO motherboard can accommodate 24-pin ATX power supplies. Although most power supplies generally meet the specifications required by the CPU, some are inadequate. In addition, the 12V 8-pin power connections are also required to ensure adequate power supply to the system. Also your power supply must supply 1.5A for the Ethernet ports.

Caution: To prevent damage to your power supply or motherboard, please use a power supply that contains a 24-pin and two 8-pin power connectors. Be sure to connect these power connectors to the 24-pin and the two 8-pin power connectors on your motherboard for adequate power supply to your system. Failure to do so will void the manufacturer warranty on your power supply and motherboard.

It is strongly recommended that you use a high quality power supply that meets ATX power supply Specification 2.02 or above. It must also be SSI compliant (for more information, please refer to the web site at http://www.ssiforum.org/). Additionally, in areas where noisy power transmission is present, you may choose to install a line

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RES-32XR3/FIO Installation Manual

filter to shield the computer from noise. It is recommended that you also install a power surge protector to help avoid problems caused by power surges.

1.8 Super I/O

The disk drive adapter functions of the Super I/O chip include a floppy disk drive controller that is compatible with industry standard 82077/765, a data separator, write pre-compensation circuitry, decode logic, data rate selection, a clock generator, drive interface control logic and interrupt and DMA logic. The wide range of functions integrated onto the Super I/O greatly reduces the number of components required for interfacing with floppy disk drives. The Super I/O supports 360 K, 720 K, 1.2 M, 1.44 M or 2.88 M disk drives and data transfer rates of 250 Kb/s, 500 Kb/s or 1 Mb/s. It also provides two high-speed, 16550 compatible serial communication ports (UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable baud rate generator, complete modem control capability and a processor interrupt system. Both UARTs provide legacy spee d with baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which support higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Configuration and Power Interface), which includes support of legacy and ACPI power management through an SMI or SCI function pin. It also features auto power management to reduce power consumption.Specifications.

1.9 Overview of the Winbond WPCM450 Controller

The Winbond WPCM450 Controller is a Baseboard Management Controller (BMC) that supports the 2D/VGA-compatible Graphics Core with the PCI interface, Virtual Media, and Keyboard/Video/Mouse Redirection (KVMR) modules. With blade-oriented Super I/O capability built-in, the WPCM450 Controller is ideal for legacyreduced server platforms.

The WPCM450 interfaces with the host system via a PCI interface to communicate with the Graphics core. It supports USB 2.0 and 1.1 for remote keyboard/mouse/virtual media emulation. It also provides LPC interface to control Super IO functions. The WPCM450 is connected to the network via an external Ethernet PHY module.

The WPCM450 communicates with onboard components via six SMBus interfaces, fan control, and Platform Environment Control Interface (PECI) buses.

1-14

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1.10 Specifications

1.10.1 General

Table 1-6 lists general specifications for the RES-32XR3/FIO.

Table 1-6. RES-32XR3/FIO General Specifications

Parameter Description

Overview and Specifications

Specifications

Dimensions

Weight

19” Rack-Mountable

with Slide capability

Temperature

Operating: Non-Operating:

Relative Humidity

Operating: Non-Operating:

z 5.25” (3RU) high z 17.07” (43.4 cm) wide (19” rack-mountable) z 16” (40.6 cm) deep (including clearance for the rear thumb

screws)

z Under 27 pounds (12.3 kg), includes 2 full-length (up to

12.25”) PCI cards, 1 CD-RW/DVD-ROM drive, 2 SATA storage drives, and 2 power supplies

z Add 8.8 pounds (4 kg) for the shipping container and two AC

power cords

z The manual and associated shipping paperwork weighs ap-

proximately 1 lb (0.5 kg)

z Left and right rack-mount tabs attached to chassis z Left and right rack-mount slides are optional

z 0° up to 65° C (32° up to 149°F) z -40° to 70° C (-40° to 158° F)

z 8% to 95% (non-condensing) z 5 to 95% (non-condensing)

Maximum Wet Bulb

Operating: Non-Operating:

Altitude

Operating: Non-Operating

a—Specifications are dependent upon the configuration in this manual.

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z 55°C, non-condensing z 70°C, non-condensing

z 0 to 10,000 feet above sea level z 0 to 40,000 feet above sea level

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RES-32XR3/FIO Installation Manual

1.10.2 Electrical

Table 1-7 lists the electrical specifications for the RES-32XR3/FIO.

Parameter

Table 1-7. RES-32XR3/FIO Electrical Specifications

Description

AC (120 volts, 750W) DC (48 volts, 750W) DC (28 volts, 500W)

Input Power (typical)

Input Current

Input Frequency

Input Voltage

Input VA Rating BTU Rating Power Factor Input Leakage Cur-

rent

Plug Type

a—Does not include plug-in PCI cards. b—NA = Not Applicable.

z 420 watts (typical) z 3.5 amperes @120

z 47–63 Hertz NA z 100–265 Vac,

z 425 VA NA NA z 1447 BTU/hour z 1447 BTU/hour z 1447 BTU/hour z 0.99 NA NA

z 3.5 mA NA NA

z IEC

Vac

internally fused

z 420 watts (typical) z 13.5 amperes @48

Vdc

z 40–72 Vdc,

internally fused

z Y-Type

(SVS5-4 or equivalent)

z 450 watts (typical)

z 16 amperes @28 Vdc

z 18–36 Vdc,

internally fused

z Y-Type

(SVS5-4 or equivalent)

1.10.2.1 System Power

The RES-32XR3/FIO operates with two N+1 redundant AC power supplies of 750watts capacity each that auto-range single-phase AC input from 100 to 240 VAC (47 to 63 Hertz) sources. Filtered and fused (internal) AC is supplied to each power supply from a front-mounted power connection.

Two optional N+1 redundant DC power supplies of 750-watts each may be substituted for the AC power supplies. This should be specified at the time of your order.

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1.10.2.2 Output Voltage

The RES-32XR3/FIO power supply provides output voltages that are split between +3.3V, +5V, +5Vsb, +12V, and -12V rails.

1.10.3 Environmental

1.10.3.1 Shock

The RES-32XR3/FIO is designed to survive an elevated shock environment. All structural components are welded together, enabling the system to survive a maximum 3-axis shock load of 35G at 25-ms duration.

1.10.3.2 Electrostatic Discharge

The RES-32XR3/FIO is designed to tolerate electrostatic pulses up to 15 kilovolts (KV) with no impact on system operation.

Overview and Specifications

Specifications

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RES-32XR3/FIO Installation Manual

1.11 Packaging and Shipping

The RES-32XR3/FIO is packaged in a reusable shipping container. Approximate weight of an empty container and two AC power cords is 8.8 pounds (4 kg).

The approximate weight of a RES-32XR3/FIO (loaded with 2 storage drives, two PCI cards, a CD-R W/DVD-ROM drive, and two power supplies) is under 27 pounds (12.3 kg).

The approximate weight of a manual and associated shipping paperwork is one pound (0.5 kg).

Therefore, both the shipping container and a fully installed RES-32XR3/FIO including power cords, manual, and associated paperwork, weigh under 37 pounds (16.5 kg).

Caution: Do not discard the original packaging in which your system was shipped.

The original packaging was designed specifically to withstand the stress and rigors of today’s shipping environment. It will be needed in the event the system must be shipped back to Themis Computer. For re-packing instructions, see “Re-Packing Instructions” on page E-1

1.11.1 Accessory Kit

Each RES-32XR3/FIO is packaged with an Accessory Kit, consisting of the following items:

A. A Power-cord Retainer Bracket

B. Two AC Power Cords

C. Two Storage Drive Barrel Keys

When you unpack the RES-32XR3/FIO, please verify that all of these items are included. If any of these items are missing or not as pictured, please call Themis Technical Support at 510-252-0870, or send an email to support@themis.com.

To learn how to secure the AC power cords and the power-cord retainer bracket, refer to Section 2.3.1, “Plugging in the AC Power Cords,” on page 2-15.

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1.11.2 Rack-Mount Slides (Optional)

Rack-Mount Slides can be mounted on each side of the RES-32XR3/FIO for the purpose of sliding the unit in and out of a rack. Mounting slides are optional and can be ordered at the time of purchase.

To learn how to install rack-mount slides, refer to Appendix B, “Rack-Mount Slide Installation”.

Table 1-8. Approximate Weights of the RES Series

Overview and Specifications

Packaging and Shipping

Model

Weight

(Approximate)

CPU

Sockets

Depth Description

RES-12XR3 19.5 lbs (8.9 kg) 2 20” Includes:

z All CPU sockets filled z 6 DIMMs

RES-12XR3-S 17 lbs (7.7 kg) 2 17”

RES-11XR3 16.5 lbs (7.5 kg) 1 17”

z 2 storage drives z 2 PCI cards z 1 CD-RW/DVD-ROM drive z 2 power supplies

RES-22XR3 25 lbs (11.4 kg) 2 20”

Includes:

RES-22XR3-S 23 lbs (10.4kg) 2 17”

RES-22XR3/FIO 25.3 lbs (11.5kg) 2 16”

z All CPU sockets filled z 6 DIMMs z 2 storage drives z 2 PCI cards z 1 CD-RW/DVD-ROM drive z 2 power supplies

RES-21XR3 22.5 lbs (10.2 kg) 1 17”

RES-32XR3 28.5 lbs (12.9 kg) 2 20”

RES-32XR3-S 26.5 lbs (12 kg) 2 17”

RES-32XR3/FIO 29 lbs (13.2 kg) 2 16”

RES-31XR3 26 lbs (11.8 kg) 1 17”

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Includes:

z All CPU sockets filled z 6 DIMMs z 2 storage drives z 2 PCI cards z 1 CD-RW/DVD-ROM drive z 2 power supplies

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2StorageRES-32XR3/FIO

Installation Section

This chapter describes:

• How to install a memory module, storage drive, PCI card, 120-mm-fan, power supply, and lithium battery.

Chapter

Installation and Operation

• Rack-mount brackets and slides

• How to turn the RES-32XR3/FIO on and off

2.1 Installation Procedures

Caution: Use industry-standard ESD grounding techniques when handling all components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. Handle all IC cards by the front panel or edges only.

To install or replace a storage drive, fan, or power supply, skip the next section and proceed directly to page 2-9, page 2-11, or page 2-12, respectively. Replacement of motherboard components requires removal of the protective cover.

2.1.1 Remove Protective Top Cover

To access a motherboard component, open the RES-32XR3/FIO as follows:

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RES-32XR3/FIO Installation Manual

1. Loosen the four captive Phillips screws holding the protective top access

2. Both the front and sides of the cover have flat hooks or tabs underneath that

3. Store the cover in a safe place until it is replaced.

cover to the rear of the RES-32XR3/FIO chassis (see A, Figure 2-1).

fit under slots on the chassis top edges (see B, Figur e 2-1). Remove the cover by sliding it toward the rear until it is free of these chassis slots.

Rear View

2-2

Loosen the 4 captive access-cover screws...

Chassis slot

Left-side top edge

... and slide the top cover toward the rear until the top hooks and tabs clear all chassis slots

Figure 2-1.

Remove the RES-32XR3/FIO Protective Access Cover

4. Proceed to the appropriate section to install or replace a memory module (page 2-3), PCI card (page 2-7), or lithium battery (page 2-8).

Chassis slot

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2.1.2 Memory Modules

The RES-32XR3/FIO supports memory according to Table 2-1.

Installation and Operation

Installation Procedures

Table 2-1.

Motherboard

Capacity

X8DAH+-F 144 GB Yes 1333/1066/800 18 240

RES-32XR3/FIO Memory Capacity

Memory Parameters

DDR3

Registered

ECC

Speed (MHz)

Number

of DIMMS

Pins per

DIMM

Caution: Exercise extreme caution when installing or removing FBD Memory Modules to prevent any possible damage.

Table 2-2. RES-32XR3/FIO Optimal Memory Population—Two CPUs Installed

DIMMs

6 DIMMs1A1B1C 1A1B1C 12 DIMMs1A2A 1B2B 1C2C 1A2A 1B2B 1C2C 18 DIMMs1A2A3A1B2B3B1C2C3C1A2A3A1B2B3B1C2C3C

CPU 1 (To populate P1-DIMMs) CPU 2 (to populate P2-DIMMs)

Branch 0 Branch 1 Branch 2 Branch 0 Branch 1 Branch 2

When installing memory, follow these rules for best memory performance:

• It is strongly recommended that you do not mix memory modules of different speeds and sizes. If DIMMs of different speeds have been installed, verify that the BIOS setup is configured for the fastest speed of RAM used.

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2.1.2.1 Installation

The following procedure explains how to install the DDR3 Memory Modules.

1. Loosen and remove the screws securing the air-flow deflector and PCI card

retainer bracket in the following manner: (see Figure 2-2).

• Screw A—Unscrew the captive screw marked “A” from it’s socket,

remove the PCI card retainer bracket and store it in a safe place.

PCI Card Retainer Brackets

Figure 2-2.

Remove the Air-Flow Deflector Screws

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P2 DIMM 1A

Installation and Operation

Installation Procedures

• Screw B—Remove the eight screws marked “B” in Figure 2-2 on

page 2-4, which will free the air-flow diverter so that it can be removed from the system. After the air-flow diverter has been removed, the memory module slots will be exposed (see Figure 2-3).

Branch 0

Branch 1

Branch 2

Branch 0

Branch 1

P2 DIMM 2A P2 DIMM 3A P2 DIMM 1B P2 DIMM 2B P2 DIMM 3B P2 DIMM 1C P2 DIMM 2C P2 DIMM 3C

P1 DIMM 1A P1 DIMM 2A P1 DIMM 3A P1 DIMM 1B P1 DIMM 2B P1 DIMM 3B

Branch 2

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P1 DIMM 1C P1 DIMM 2C P1 DIMM 3C

Figure 2-3. Memory Module Slot Locations

2. If a module is already seated in the slot you have selected for installation,

remove it by gently pressing down and outward on the latches at both ends of the slot (see Figure 2-4 on page 2-6), then pulling the old module directly up from the slot until it is free of the connector (see Figure 2-4 on page 2-6).

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RES-32XR3/FIO Installation Manual

Press latch downward & outward at each end

Figure 2-4. Memory Module Removal

3. Before inserting a new memory module into the vacant slot, make sure that

the two latches are pulled outward away from the center of the slot. With the latches in the outward position, gently insert the new module verti-

cally into its slot and press firmly downward until it snaps into place.

Note: Make sure the memory module has the proper orientation by aligning the alignment notch at the bottom edge with its counterpart ridge at the bottom of the slot.

4. When finished replacing memory modules, replace the air flow diverter and

secure it with the seven screws previously removed.

5. Replace the PCI card retainer bracket and secure it with the single captive

screw loosened in Step 1 on page 2-4.

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2.1.3 PCI Cards

The RES-32XR3/FIO supports seven PCI-Express slots. (see Figure 2-5).

Installation and Operation

Installation Procedures

Slot 1

Slots 1, 3, 5 and 7 are PCI-Express 2.0 x8

Slots 2,4 and 6 are PCI-Express 2.0 x16

2.1.3.1 Installing Cards

Perform the following steps to install a PCI card:

1. Locate the empty slot within which a card will be installed (see Figure 2-5).

467

Figure 2-5. PCI Card Installation

Captive knurled screw PCI card I/O panels (7 total)

Loosen the captive knurled screw...

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. and lift the PCI slot covers clear.

Figure 2-6. PCI Card Clamp

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RES-32XR3/FIO Installation Manual

2. Loosen the captive knurled screw on the chosen PCI slot covers and remove

the slot covers. (see Figure 2-6).

3. Install the new card, making sure the I/O panel is aligned with the chassis

opening.

4. Repeat Step 1 and Step 3 until all additional cards have been installed.

5. Attach any internal I/O cables to the installed PCI cards, and carefully fold

and tuck any exposed ribbon cables into the cabinet.

6. If you have no further installations to perform, close the RES-32XR3/FIO

chassis by refastening the top cover removed in Section 2.1.1, “Remove Protective Top Cover,” on page 2-1.

2.1.4 Lithium Battery

2.1.4.1 Removing the Lithium Battery

Battery Latch

Perform the following steps to remove the lithium battery:

1. Make sure the system is powered off (see “Operation” on page 2-15).

2. Locate the lithium battery socket and squeeze the latch (see A, Figure 2-7)

together until the battery lifts out of its socket.

To release, squeeze battery latch together...

... and remove battery from socket

Figure 2-7. The RES-32XR3/FIO Lithium Battery and Socket

3. Remove the old battery and replace with a new battery (see next section).

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2.1.4.2 Installing a Lithium Battery

Perform the following steps to insert a new lithium battery:

1. T ilt the replacement battery into the empty socket so that it is angled under the battery latch (see B, Figure 2-7).

2. Carefully press down on the battery until it clicks firmly into place.

2.1.5 SATA Storage Drive

The accessory kit shipped with your RES-32XR3/FIO contains two barrel lock keys. This provides you the option of unlocking/locking the storage drives (see Figure 2-8).

Installation and Operation

Installation Procedures

Drive 0

Drive 2

Latch Lock Button

Figure 2-8.

Unlocking the RES-32XR3/FIO S torage Drives (Front Doors Removed)

2.1.5.1 Storage Drive Removal

Perform the following steps to remove and install a storage drive: (see Figure 2-8).

1. Make sure the system is powered off (see “Operation” on page 2-15).

2. Locate the drive to be removed.

3. Insert the barrel lock key into the storage drive you want to remove, and turn it 45 degrees clockwise (presuming the storage drive is locked; see A in

Figure 2-9 on page 2-10).

Drive 1

Drive Lock

(one per drive)

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RES-32XR3/FIO Installation Manual

4. Firmly push in the latch lock until the latch handle releases away from the

5. Grab the latch handle and pull the drive completely away from its slot (see C

Insert key into barrel lock and turn A 45 degrees clockwise,...

drive (see B in Figure 2-9).

in Figure 2-9).

Caution: When pulling the storage drive from the chassis, hold it at the bottom to prevent it from falling and damaging the drive.

... push the latch lock,...

... and pull drive out with the latch handle

Figure 2-9. RES-32XR3/FIO Storage Drive Removal

2.1.5.2 Storage Drive Installation

To install a storage drive,

1. Make sure the latch handle of the drive to be installed is in the open position.

2. Properly orient the new drive and insert it into the vacant drive slot. If the

drive cannot be inserted into the slot, rotate it 180 degrees.

3. Push the drive toward the rear (DO NOT CLOSE the latch handle while push-

ing) until the drive is flush with the front of the chassis. The handle will swing closed when it comes into contact with the RES-32XR3/FIO chassis.

Latch Lock

Latch Handle

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4. When the drive is fully inserted in its slot, insert the key into the barrel lock and turn it 45 degrees counter-clockwise. The drive is now locked.

Caution: When in the closed position, the latch handle secures the drive to the chassis. If the handle is closed before the drive is fully inserted, the latch mechanism may not fully engage to secure the drive.

2.1.6 Removable 120-mm Fan

The RES-32XR3/FIO contains three high-speed 120-mm fans. All fans are removable for replacement in case of a fan failure.

Note: Since RES-32XR3/FIO fans are “hot-swappable”, it is not necessary to turn off system power in order to remove and replace a fan, however it may be necessary to pull the unit from the rack to obtain access to the fans. This may affect a decision whether or not to turn off system power.

Installation and Operation

Installation Procedures

2.1.6.1 Removing and Installing a 120-mm Fan

Perform the following steps to remove and install a 120-mm fan:

1. On the rear of the chassis, locate the four captive thumb screws for the fan to be replaced. (see Figure 2-10).

2. Unscrew the four captive thumb screws and pull the fan out of the chassis.

120-mm Fan

Captive thumb screws

120-mm Fan

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Figure 2-10. The RES-32XR3/FIO 120-mm Fans

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3. When the fan is removed, its 4-wire connector will automatically disconnect

from the chassis. Insert the replacement fan carefully into the empty fan slot until it is flush with the second fan. The 4-wire connector will automatically engage its counterpart connector successfully.

2.1.7 Power Supply

Each 750-watt load-sharing (N+1 redundant) power supply can be hot-swapped while the system is still on and operational.

2.1.7.1 Removing a Power Supply

Perform the following steps to remove a power supply:

1. Remove the two captive Phillips screws holding the power supply locking bracket to the chassis. Store the bracket for later use (see A in Figure 2-11).

2. Put the right index finger on the power supply extraction handle and the right thumb on the bottom side of the power supply locking lever.

3. Squeeze the locking lever toward the pull handle and firmly pull the power supply from the chassis.

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Installation and Operation

Installation Procedures

Knurled captive Phillips screw

Power supply locking bracket

sign to C

Knurled captive Phillips screw

Remove power supply locking bracket

... then disengage locking lever and remove power supply

New De

Phillips Screw Hole

for knurled captive screw on power supply locking bracket

Power LED

Push up to release power supply

Power Supply

Locking Lever

Extraction

Handle

AC Receptacle

Figure 2-11. The RES-32XR3/FIO Power Supply Locking Mechanism

Caution: When pulling the power supply from the chassis, hold it at the bot-

tom to prevent it from falling and damaging the unit.

2.1.7.2 Installing a Power Supply

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Perform the following steps to install a power supply:

1. Insert the replacement power supply into an empty slot with the extraction handle horizontal, (see Figure 2-11 on page 2-13).

2. Push the power supply carefully into its slot until it is firmly seated (a click will be heard when the locking lever is securely fastened to the chassis).

3. Replace the power supply locking bracket and tighten the two captive Phillips screws (see Figure 2-11) to secure both power supplies

2.2 Rack Mounts

2.2.1 Mounting Brackets

The rack-mount brackets (flanges) are used to secure the chassis to the 19” rack (see Figure 2-12). Handles are used to pull the RES-32XR3/FIO from the rack when rack-mount slides have been installed on the sides of the chassis (see following section).

Right Mounting Bracket

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Figure 2-12.

Right Rack-Mount Bracket

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2.2.2 Rack-Mount Slides (Optional)

Rack-Mount Slides can be mounted on each side of the RES-32XR3/FIO for the purpose of sliding the unit in and out of a rack. Mounting slides are optional and should be ordered at the time your system is purchased.

To learn how to install rack-mount slides, refer to Appendix B, “Rack-Mount Slide Installation”.

Caution: Any screws used to mount a slide to a RES-32XR3/FIO chassis must not exceed a length of 3/8” to prevent excessive penetration of the chassis.

2.3 Operation

Installation and Operation

Operation

2.3.1 Plugging in the AC Power Cords

Before powering on the RES-32XR3/FIO, plug in the AC power cords as follows:

• Plug an AC power cord (shipped with unit) into the AC power socket on each power supply on the front of the RES-32XR3/FIO, (see Figure 2-13).

Power LED

Locking Lever

AC Power Socket

Figure 2-13. AC Power Socket and LED on the RES-32XR3/FIO

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2.3.2 Getting Started

2.3.2.1 Configuration

1. Make sure all storage drives are installed (see “SATA Storage Drive”, page 2-

9). Drive ID numbers are shown in Figure 2-8 on page 2-9. Changes may be made through the BIOS.

2. Connect a multiscan monitor to the VGA connector.

3. Attach a PS/2 keyboard and mouse to the appropriate connectors on the front

I/O panel of the RES-32XR3/FIO (see Figure 1-5 on page 1-7)

2.3.2.2 Turning The System On

1. Plug the AC power cord from each of the RES-32XR3/FIO power supplies

into a “live” AC outlet.The LED on each power supply will turn on when AC power is enabled.

2. On the front of the RES-32XR3/FIO push the system power on/off button (see

Figure 2-14). This will cause the system POWER LED to light (green).

Figure 2-14. System Power Button and LED on the RES-32XR3/FIO Front

2.3.2.3 Linux Installation

Power LED

System Power

On/Off Button

The subject of installing the Linux operating system onto the RES-32XR3/FIO is detailed in Appendix C, “Red Hat Enterprise Linux 5 Installation”.

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2.3.3 Turning the System Off

Caution: Before turning your system off, make sure to save all open files, properly close applications, and broadcast a warning to all users on any active networks.

1. To turn the RES-32XR3/FIO power off, press and hold the system power

on/off button (see Figure 2-14, page 2-16) for at least four (4) seconds. This will shut down the system and turn off the POWER LED.

As an alternative, a modern operating system (Windows 9x or newer and Linux, for example) can turn off the system after a graceful OS software shutdown.

Installation and Operation

Operation

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3RES-32XR3/FIO

Installation Section

3.1 Introduction

This chapter describes the AMI BIOS Setup Utility for the RES-32XR3/FIO motherboard.

3.1.1 Starting BIOS Setup Utility

Chapter

BIOS Setup Utility

Themis Computer

To enter the AMI BIOS Setup Utility screens, press the <Delete> key while the system is booting up.

Note: In most cases, the <Delete> key is used to invoke the AMI BIOSsetup screen. There are a few cases when other keys are used, such as <F1>, <F2>, etc.

Each main BIOS menu option is described in this manual. The Main BIOS setup menu screen has two main frames. The left frame displays all the options that can be configured. Grayed-out options cannot be configured. Options in blue can be configured by the user. The right frame displays the key legend. Above the key legend is an area reserved for a text message. When an option is selected in the left frame, it is highlighted in white. Often a text message will accompany it.

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Note: The AMI BIOS has default text messages built in. Themis retains the option to include, omit, or change any of these text messages.

The AMI BIOS Setup Utility uses a key-based navigation system called “hot keys”. Most of the AMI BIOS setup utility “hot keys” can be used at any time during the setup navigation process. These keys include <F1>, <F10>, <Enter>, <ESC>, arrow keys, etc.

Note: Options printed in Bold are default settings.

3.1.2 How To Change the Configuration Data

The configuration data that determines the system parameters may be changed by entering the AMI BIOS Setup utility. This Setup utility can be accessed by pressing <Del> at the appropriate time during system boot.

3.1.3 Starting the Setup Utility

Normally, the only visible Power-On Self-Test (POST) routine is the memory test. As the memory is being tested, press the <Delete> key to enter the main menu of the AMI BIOS Setup Utility. From the main menu, you can access the other setup screens. An AMI BIOS identification string is displayed at the left bottom corner of the screen below the copyright message.

Caution: Do not upgrade the BIOS unless your system has a BIOS-related issue. Flashing the wrong BIOS can cause irreparable damage to the system. In no event shall Themis be liable for direct, indirect, special, incidental, or consequential damages arising from a BIOS update. If you have to update the BIOS, do not shut down or reset the system while the BIOS is updating. This is to avoid possible boot failure.

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3.2 Main Setup

When you first enter the AMI BIOS Setup Utility, you will enter the Main setup screen.You can always return to the Main setup screen by selecting the Main tab on the top of the screen. The Main BIOS Setup screen is shown below.

BIOS Setup Utility

Main Setup

3.2.1 System Time/System Date

Use this option to change the system time and date. Highlight System T ime or System Date using the arrow keys. Key in new values through the keyboard and press

<Enter>. Press the <Tab> key to move between fields. The date must be entered in Day MM/DD/YY format. The time is entered in HH:MM:SS format.

Note: The time is in the 24-hour format. For example, 5:30 P.M. appears as 17:30:00.

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Figure 3-1. Main BIOS Setup Screen

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RES-32XR3/FIO Installation Manual

3.2.2 Supermicro X8DAH

• Version: This item displays the BIOS revision used in your system.

• Build Date: This item displays the date when this BIOS was completed.

3.2.3 Processor

The AMI BIOS will automatically display the status of the processor used in your system:

• CPU Type: This item displays the type of CPU used in the motherboard.

• Speed: This item displays the speed of the CPU detected by the BIOS.

• Physical Count: This item displays the number of processors installed in your system as detected by the BIOS.

• Logical Count: This item displays the number of CPU Cores installed in your system as detected by the BIOS.

3.2.4 System Memory

This displays the size of memory available in the system:

• Populated Size: This item displays the installed memory size detected by the BIOS.

• Available Size: This item d isplays the available memory detected by the BIOS.

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3.3 Advanced Setup Configurations

Use the arrow keys to select Advanced Setup and hit <Enter> to access the submenu items:

BIOS Setup Utility

Advanced Setup Configurations

3.3.1 Boot Features

3.3.1.1 Quick Boot

If Enabled, this option will skip certain tests during POST to reduce the time needed for system boot. The options are Enabled and Disabled.

3.3.1.2 Quiet Boot

This option allows the bootup screen options to be modified between POST messages or the OEM logo. Select Disabled to display the POST messages. Select Enabled to display the OEM logo instead of the normal POST messages. The options are Enabled and Disabled.

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Figure 3-2.

Advanced Settings

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RES-32XR3/FIO Installation Manual

3.3.1.3 AddOn ROM Display Mode

This sets the display mode for Option ROM. The options are Force BIOS and Keep Current.

3.3.1.4 Bootup Num-Lock

This feature selects the Power-on state for the Numlock key. The options are Off and On.

3.3.1.5 PS/2 Mouse Support

This feature enables support for the PS/2 mouse. The options are Disabled, Enabled, and Auto.

3.3.1.6 Wait For 'F1' If Error

This forces the system to wait until the 'F1' key is pressed if an error occurs. The options are Disabled and Enabled.

3.3.1.7 Hit 'Del' Message Display

This feature displays “Press DEL to run Setup” during POST. The options are Enabled and Disabled.

3.3.1.8 Watch Dog Function

If enabled, the Watch Dog Timer will allow the system to reboot when it is inactive for more than 5 minutes. The options are Enabled and Disabled.

3.3.1.9 Restore on AC Power Loss

Use this feature to set the power state after a power outage. Select Power-Off for the power to remain off after a power loss. Select Power-On for the power to be turned on after a power loss. Select Last State to allow the system to resume its last state before a power loss. The options are Power-On, Power-Off and Last State.

3.3.1.10 Interrupt 19 Capture

Interrupt 19 is the software interrupt that handles the boot drive function. When this item is set to Enabled, the ROM BIOS of the host adaptors will “capture” Interrupt 19 at boot and allow the drives that are attached to these host adaptors to function as bootable drives. If this item is set to Disabled, the ROM BIOS of the host adaptors

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will not capture Interrupt 19, and the drives attached to these adaptors will not function as bootable devices. The options are Enabled and Disabled.

3.3.2 Processor and Clock Options

This submenu allows the user to configure the Processor and Clock settings.

3.3.2.1 CPU Ratio

If set to Manual, this option allows the user to set the ratio between the CPU Core Clock and the FSB Frequency. The options are Auto and Manual.

Note: If an invalid ratio is entered, the AMI BIOS will restore the setting to the previous state.

BIOS Setup Utility

Advanced Setup Configurations

3.3.2.2 Ratio CMOS Setting (Available when the item-CPU Ratio is set to Manual)

If CPU Ratio is set to Manual (above), this option allows the user to set the ratio between the CPU Core Clock and the FSB Frequency .The default setting depends on the type of CPU installed on the motherboard. The default setting for the CPU installed in your motherboard is [21]. Press “+” or “-” on your keyboard to change this value.

3.3.2.3 Clock Spread Spectrum

Select Enable to use the feature of Clock Spectrum, which will allow the BIOS to monitor and attempt to reduce the level of Electromagnetic Interference caused by the components whenever needed. The options are Disabled and Enabled.

3.3.2.4 Hardware Prefetcher (Available when supported by the CPU)

If set to Enabled, the hardware prefetcher will prefetch streams of data and instructions from the main memory to the L2 cache in the forward or backward manner to improve CPU performance. The options are Disabled and Enabled.

3.3.2.5 Adjacent Cache Line Prefetch (Available when supported by the CPU)

The CPU fetches the cache line for 64 bytes if this option is set to Disabled. The

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CPU fetches both cache lines for 128 bytes as comprised if Enabled.

3.3.2.6 Intel® Virtualization Technology (Available when supported by the CPU)

Select Enabled to use the feature of Virtualization Technology to allow one platform to run multiple operating systems and applications in independent partitions, creating multiple “virtual” systems in one physical computer. The options are Enabled and Disabled.

Note: If there is any change to this setting, you will need to power off and restart the system for the change to take effect. Please refer to Intel’s website for detailed information.

3.3.2.7 Execute-Disable Bit Capability (Available when supported by the OS and the CPU)

Set to Enabled to enable the Execute Disable Bit which will allow the processor to designate areas in the system memory where an application code can execute and where it cannot, thus preventing a worm or a virus from flooding illegal codes to overwhelm the processor or damage the system during an attack. The default is Enabled. (Refer to Intel and Microsoft Web Sites for more information.)

3.3.2.8 Simultaneous Multi-Threading (Available when supported by the CPU)

Set to Enabled to use the Simultaneous Multi-Threading Technology, which will result in increased CPU performance. The options are Disabled and Enabled.

3.3.2.9 Active Processor Cores

Set to Enabled to use a processor's Second Core and beyond. (Please refer to Intel's web site for more information.) The options are All, 1 and 2.

3.3.2.10 Intel® EIST Technology

EIST (Enhanced Intel SpeedStep Technology) allows the system to automatically adjust processor voltage and core frequency in an effort to reduce power consumption and heat dissipation. (Please refer to Intel’s web site for detailed information.) The options are Disabled and Enabled.

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BIOS Setup Utility

Advanced Setup Configurations

3.3.2.11 C1E Support

Select Enabled to use the feature of Enhanced Halt State. C1E significantly reduces the CPU's power consumption by reducing the CPU's clock cycle and voltage during a “Halt State.” The options are Disabled and Enabled.

3.3.2.12 Intel® C-STATE Tech

If enabled, C-State is set by the system automatically to either C2, C3 or C4 state. The options are Disabled and Enabled.

3.3.2.13 C-State package limit setting (Available when Intel® C-State Tech is enabled)

If set to Auto, the AMI BIOS will automatically set the limit on the C-State package register. The options are Auto, C1, C3, C6 and C7.

3.3.2.14 C1 Auto Demotion

When enabled, the CPU will conditionally demote C3, C6 or C7 requests to C1 based on un-core auto-demote information. The options are Disabled and Enabled.

3.3.2.15 C3 Auto Demotion

When enabled, the CPU will conditionally demote C6 or C7 requests to C3 based on un-core auto-demote information. The options are Disabled and Enabled.

3.3.3 DCA Technology

This feature accelerates the performance of TOE devices. For this motherboard,

Note: A TOE device is a specialized, dedicated processor that is installed on an add-on card or a network card to handle some or all packet processing of this addon card.

the TOE device is built inside the ESB 2 South Bridge chip. This feature is supported only by some types of processors (i.e., Intel Nehalem-WS 1S). The options are Enabled and Disabled.

3.3.3.1 DCA Prefetch Delay

A DCA Prefetch is used with TOE components to prefetch data in order to shorten

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execution cycles and maximize data processing efficiency. Prefetching too frequently can saturate the cache directory and delay necessary cache accesses. This feature reduces or increases the frequency the system prefetches data. The options are [8], [16], [32], [40], [48], [56], [64], [72], [80], [88], [96], [104], [112], [120]

3.3.4 Advanced Chipset Control

The items included in the Advanced Settings submenu are listed below:

QPI & IMC Configuration

3.3.4.1 QPI Links Speed

This feature selects QPI's data tr ansfer speed. The options are Slow-mode, and Full Speed.

3.3.4.2 QPI Frequency

This selects the desired QPI frequency. The options are Auto, 4.800 GT, 5.866GT,

6.400 GT.

3.3.4.3 QPI L0s and L1

This enables the QPI power state to low power. L0s and L1 are automatically selected by the motherboard. The options are Disabled and Enabled.

3.3.4.4 Memory Frequency

This feature forces a DDR3 frequency slower than what the system has detected. The available options are Auto, Force DDR-800, Force DDR-1066, and Force DDR-1333.

3.3.4.5 Memory Mode

The options are Independent, Channel Mirror, and Lockstep.and Sparing.

• Independent - All DIMMs are available to the operating system.

• Channel Mirror - The motherboard maintains two identical copies of all data in memory for redundancy.

• Lockstep - The motherboard uses two areas of memory to run the same set of

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operations in parallel.

• Sparing - A preset threshold of correctable errors is used to tr igger fail-over.

The spare memory is put online and used as active memory in place of the failed memory.

3.3.4.6 Demand Scrubbing

A memory error-correction scheme where the Processor writes corrected data back into the memory block from where it was read by the Processor. The options are Enabled and Disabled.

3.3.4.7 Patrol Scrubbing

A memory error-correction scheme that works in the background looking for and correcting resident errors. The options are Enabled and Disabled.

BIOS Setup Utility

Advanced Setup Configurations

3.3.4.8 Throttling - Closed Loop / Throttling - Open Loop

Throttling improves reliability and reduces power in the processor by automatic voltage control during processor idle states. Available options are Disabled and Enabled. If Enabled, the following items will appear:

Hysteresis Temperature (Closed Loop only)

Temperature Hysteresis is the temperature lag (in degrees Celsius) after the set DIMM temperature threshold is reached before Closed Loop Throttling begins. The options are Disabled, 1.5°C, 3.0°C, and 6.0°C.

Guardband Temperature (Closed Loop only)

This is the temperature which applies to the DIMM temperature threshold. Each step is in 0.5°C increment. The default is [006]. Press “+” or “-” on your keyboard to change this value.

Inlet Temperature

This is the temperature detected at the chassis inlet. Each step is in 0.5°C increment. The default is [070]. Press “+” or “-” on your keyboard to change this value.

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Temperature Rise

This is the temperature rise to the DIMM thermal zone. Each step is in 0.5°C increment. The default is [020]. Press “+” or “-” on your keyboard to change this value.

Air Flow

This is the air flow speed to the DIMM modules. Each step is one mm/sec. The default is [1500]. Press “+” or “-” on your keyboard to change this value.

Altitude

This feature defines how many meters above or below sea level the system is located. Options are Sea Level or Below, 1~300, 301~600, 601~900, 901~1200, 1201~1500, 1501~1800, 1801~2100, 2101~2400, 2401~2700, and 2701~3000.

DIMM Pitch

This is the physical space between each DIMM module. Each step is in 1/1000 of an inch. The default is [400]. Press “+” or “-” on your keyboard to change this value.

3.3.4.9 HDA Controller

Select Enabled to activate the onboard High-Definition Audio controller. The options are Enabled and Disabled.

3.3.4.10 Intel VT -d

Select Enabled to enable Intel's Virtualization Technology support for Direct I/O VT-d by reporting the I/O device assignments to VMM through the DMAR ACPI Tables. This feature offers fully-protected I/O resource-sharing across the Intel platforms, providing the user with greater reliability, security and availability in networking and data-sharing. The settings are Enabled and Disabled.

3.3.4.11 SR-IOV Support

Single Root I/O Virtualization is an industry-standard mechanism that allow devices to advertise their capability to be simultaneously shared among several virtual machines. SR-IOV is capable of partitioning a PCI function into several virtual interfaces for sharing the resources of a PCI Express (PCI-E) device under a virtual environment. The options are Disabled and Enabled.

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3.3.4.12 NUMA Support

Select Enabled to use the feature of Non-Uniform Memory Access to improve CPU performance. The options are Enabled and Disabled.

3.3.4.13 Intel I/OAT

The Intel I/OAT (I/O Acceleration Technology) significantly reduces CPU overhead by leveraging CPU architectural improvements, freeing resources for other tasks. The options are Disabled and Enabled.

3.3.4.14 Active State Power Management

Select Enabled to start Active-State Power Management for signal transactions between L0 and L1 Links on the PCI Express Bus. This maximizes power-saving and transaction speed. The options are Enabled and Disabled.

BIOS Setup Utility

Advanced Setup Configurations

3.3.4.15 Route Port 80h Cycles to

This feature allows the user to decide which bus to send debug information to. The options are LPC and PCI.

3.3.4.16 USB Functions

This feature allows the user to decide the number of onboard USB ports to be enabled. The Options are: Disabled, 2 USB ports, 4 USB ports, 6 USB ports, 8 USB ports, 10 USB ports and 12 USB ports.

3.3.4.17 USB 2.0 Controller

Select Enabled to activate the onboard USB 2.0 controller. The options are Enabled and Disabled.

3.3.4.18 Legacy USB Support

Select Enabled to use Legacy USB devices. If this item is set to Auto, Legacy USB support will be automatically enabled if a legacy USB device is installed on the motherboard, and vise versa. The settings are Disabled, Enabled and Auto.

3.3.5 IDE/Floppy Configuration

When this submenu is selected, the AMI BIOS automatically detects the presence of the IDE devices and displays the following items:

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3.3.5.1 Floppy A

This feature allows the user to select the type of floppy drive connected to the system as specified. The options are Disabled, 360KB 5 1/4”, 1.2MB 5 1/4”, 720KB 3 1/2”,

1.44MB 3 1/2” and 2.88MB 3 1/2”. The default setting for Floppy A is 1.44MB 3 1/2”, and for Floppy B is Disabled.

3.3.5.2 SATA#1 Configuration

If Compatible is selected, it sets SATA#1 to legacy compatibility mode, while selecting Enhanced sets SATA#1 to nati ve SATA mode. The options are Disabled, Compatible and Enhanced.

Configure SATA#1

This feature allows the user to select the drive type for SATA#1. The options are IDE, RAID and AHCI. (When the option-RAID is selected, the item-ICH RAID Code Base will appear.

ICH RAID Code Base (This feature is available when the option-RAID is selected)

Select Intel to enable Intel's SATA RAID firmware to configure Intel's SATA RAID settings. Select Adaptec to enable Adaptec's SATA RAID firmware to configure Adaptec's SATA RAID settings. The options are Intel and Adaptec.

SATA#2 Configuration (This feature is available when the option-IDE is selected for SATA#1)

Selecting Enhanced will set SATA#2 to native SATA mode. The options are Disabled, and Enhanced.

3.3.5.3 IDE Detect Timeout (sec)

Use this feature to set the time-out value for the BIOS to detect the ATA, ATAPI devices installed in the system. The options are 0 (sec), 5, 10, 15, 20, 25, 30, and 35.

3.3.5.4 Primary IDE Master/Slave, Secondary IDE Master/Slave, Third IDE Master, and Fourth IDE Master

These settings allow the user to set the parameters of Primary IDE Master/Slave,

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BIOS Setup Utility

Advanced Setup Configurations

Secondary IDE Master/Slave, Third and Fourth IDE Master slots. Hit <Enter> to activate the following submenu screen for detailed options of these items. Set the correct configurations accordingly. The items included in the submenu are:

Type

Select the type of device connected to the system. The options are Not Installed, Auto, CD/DVD and ARMD.

LBA/Large Mode

LBA (Logical Block Addressing) is a method of addressing data on a storage drive. In the LBA mode, the maximum drive capacity is 137 GB. For drive capacities over 137 GB, your system must be equipped with a 48-bit LBA mode addressing. If not, contact your manufacturer or install an ATA/133 IDE controller card that supports 48-bit LBA mode. The options are Disabled and Auto.

Block (Multi-Sector Transfer)

Block Mode boosts the IDE drive performance by increasing the amount of data transferred. Only 512 bytes of data can be transferred per interrupt if Block Mode is not used. Block Mode allows transfers of up to 64 KB per interrupt. Select Disabled to allow data to be transferred from and to the device one sector at a time. Select Auto to allow data transfer from and to the device occur multiple sectors at a time if the device supports it. The options are Auto and Disabled.

PIO Mode

The IDE PIO (Programmable I/O) Mode programs timing cycles between the IDE drive and the programmable IDE controller. As the PIO mode increases, the cycle time decreases. The options are Auto 0, 1, 2, 3, and 4.

Select Auto to allow the AMI BIOS to automatically detect the PIO mode. Use this value if the IDE storage drive support cannot be determined.

Select 0 to allow the AMI BIOS to use PIO mode 0. It has a data transfer rate of 3.3 MBs.

Select 1 to allow the AMI BIOS to use PIO mode 1. It has a data transfer rate of 5.2 MBs.

Select 2 to allow the AMI BIOS to use PIO mode 2. It has a data transfer rate of 8.3 MBs.

Select 3 to allow the AMI BIOS to use PIO mode 3. It has a data transfer rate of 11.1 MBs.

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Select 4 to allow the AMI BIOS to use PIO mode 4. It has a data transfer bandwidth of 32-Bits. Select Enabled to enable 32-Bit data transfer.

DMA Mode

Select Auto to allow the BIOS to automatically detect IDE DMA mode when the IDE storage drive support cannot be determined.

Select SWDMA0 to allow the BIOS to use Single Word DMA mode 0. It has a data transfer rate of 2.1 MBs.

Select SWDMA1 to allow the BIOS to use Single Word DMA mode 1. It has a data transfer rate of 4.2 MBs.

Select SWDMA2 to allow the BIOS to use Single Word DMA mode 2. It has a data transfer rate of 8.3 MBs.

Select MWDMA0 to allow the BIOS to use Multi Word DMA mode 0. It has a data transfer rate of 4.2 MBs.

Select MWDMA1 to allow the BIOS to use Multi Word DMA mode 1. It has a data transfer rate of 13.3 MBs.

Select MWDMA2 to allow the BIOS to use Multi-Word DMA mode 2. It has a data transfer rate of 16.6 MBs.

Select UDMA0 to allow the BIOS to use Ultra DMA mode 0. It has a data transfer rate of 16.6 MBs. It has the same transfer rate as PIO mode 4 and Multi Word DMA mode 2.

Select UDMA1 to allow the BIOS to use Ultra DMA mode 1. It has a data transfer rate of 25 MBs.

Select UDMA2 to allow the BIOS to use Ultra DMA mode 2. It has a data transfer rate of 33.3 MBs.

Select UDMA3 to allow the BIOS to use Ultra DMA mode 3. It has a data transfer rate of 66.6 MBs.

Select UDMA4 to allow the BIOS to use Ultra DMA mode 4. It has a data transfer rate of 100 MBs.

Select UDMA5 to allow the BIOS to use Ultra DMA mode 5. It has a data transfer rate of 133 MBs.

Select UDMA6 to allow the BIOS to use Ultra DMA mode 6. It has a data transfer rate of 133 MBs. The options are Auto, SWDMAn, MWDMAn, and UDMAn.

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S.M.A.R.T. For Storage drives

Self-Monitoring Analysis and Reporting Technology (SMART) can help predict impending drive failures. Select Auto to allow the AMI BIOS to automatically detect storage drive support. Select Disabled to prevent the AMI BIOS from using the S.M.A.R.T. Select Enabled to allow the AMI BIOS to use the S.M.A.R.T. to support storage drives. The options are Disabled, Enabled, and Auto.

32-Bit Data Transfer

Select Enable to enable the function of 32-bit IDE data transfer. The options are Enabled and Disabled.

3.3.6 PCI/PnP Configuration

3.3.6.1 Clear NVRAM

BIOS Setup Utility

Advanced Setup Configurations

This feature clears the NVRAM during system boot. The options are No and Yes.

3.3.6.2 Plug & Play OS

Selecting Yes allows the OS to configure Plug & Play devices. (This is not required for system boot if your system has an OS that supports Plug & Play.) Select No to allow the AMI BIOS to configure all devices in the system.

3.3.6.3 PCI Latency Timer

This feature sets the latency Timer of each PCI device installed on a PCI bus. Select 64 to set the PCI latency to 64 PCI clock cycles. The options are 32, 64, 96, 128, 160, 192, 224 and 248.

3.3.6.4 PCI IDE BusMaster

When enabled, the BIOS uses PCI bus mastering for reading/writing to IDE drives. The options are Disabled and Enabled.

3.3.6.5 PCI-E I/O Performance

This feature sets the PCI-E maximum payload size. The options are 128B and 256B.

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3.3.6.6 PCI-E Slot 1 x8, PCI-E Slot 2 x16, PCI-E Slot 3 x8, PCI-E Slot 4 x8 (in x16 slot), PCI-E Slot 5 PCI-E x4 (in x8 slot), PCI-E Slot 6 x16, PCI-E Slot 7 x8.

This feature allows you to Enable or Disable any of the PCI slots. The options are Enable and Disable.

3.3.6.7 Onboard LAN Option ROM Select

Select the onboard LAN option ROM type. The options are iSCSI and PXE.

3.3.6.8 Load Onboard LAN1 Option ROM/Load Onboard LAN2 Option ROM

Select Enabled to enable the onboard LAN1 or LAN2 Option ROM. This is to boot computer using a network interface. The options are Enabled and Disabled.

3.3.6.9 Boot Graphics Adapter Priority

This feature allows the user to select the priority graphics adapter for system boot. The options are Auto and Onboard VGA.

3.3.7 Super IO Device Configuration

3.3.7.1 Serial Port1 Address/Serial Port2 Address

This option specifies the base I/O port address and the Interrupt Request address of Serial Port 1 and Serial Port 2. Select Disabled to prevent the serial port from accessing any system resources. When this option is set to Disabled, the serial port physically becomes unavailable. Select 3F8/IRQ4 to allow the serial port to use 3F8 as its I/O port address and IRQ 4 for the interrupt address. The options for Serial Port 1 are Disabled, 3F8/IRQ4, 3E8/IRQ4, 2E8/IRQ3. The options for Serial Port 2 are Disabled, 2F8/IRQ3, 3E8/IRQ4, and 2E8 IRQ3.

Serial Port 2 Mode

This feature allows the user to set the mode for Serial Port B. The options are Normal, IR (Infra-Red) and ASK-IR.

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3.3.7.2 Onboard Floppy Controller

Select Enabled to enable the onboard floppy controller. The options are Disabled and Enabled.

3.3.8 Remote Access Configuration

3.3.8.1 Remote Access

This allows the user to enable the Remote Access feature. The options are Disabled and Enabled.

If Remote Access is set to Enabled, the following items will display:

3.3.8.2 Serial Port Number

BIOS Setup Utility

Advanced Setup Configurations

This feature allows the user to decide which serial port to be used for Console Redirection. The options are COM 1 and COM 2.

Base Address, IRQ

This item displays the based address and IRQ of the serial port specified above.

3.3.8.3 Serial Port Mode

This feature allows the user to set the serial port mode for Console Redirection. The options are 115200 8, n 1; 57600 8, n, 1; 38400 8, n, 1; 19200 8, n, 1; and 9600 8, n,

3.3.8.4 Flow Control

This feature allows the user to set the flow control for Console Redirection. The options are None, Hardware, and Software.

3.3.8.5 Redirection After BIOS POST

Select Disabled to turn off Console Redirection after Power-On Self-Test (POST).

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Select Always to keep Console Redirection active all the time after POST.

Note: This setting may not be supported by some operating systems.

Select Boot Loader to keep Console Redirection active during POST and Boot Loader. The options are Disabled, Boot Loader, and Always.

3.3.8.6 Terminal Type

This feature allows the user to select the target terminal type for Console Redirection. The options are ANSI, VT100, and VT-UTF8.

3.3.8.7 VT-UTF8 Combo Key Support

A terminal keyboard definition that provides a way to send commands from a remote console. Available options are Enabled and Disabled.

3.3.8.8 Sredir Memory Display Delay

This feature defines the length of time in seconds to display memory information. The options are No Delay, Delay 1 Sec, Delay 2 Sec, and Delay 4 Sec.

3.3.9 Hardware Health Monitor

This feature allows the user to monitor system health and review the status of each item as displayed.

3.3.9.1 CPU Overheat Alarm

This option allows the user to select the CPU Overheat Alarm setting which determines when the CPU OH alarm will be activated to provide warning of possible

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BIOS Setup Utility

Advanced Setup Configurations

CPU overheat.

Caution: 1. Any temperature that exceeds the CPU threshold temperature pre- defined by the CPU manufacturer may result in CPU overheat or system instability . When the CPU temperature reaches this predefined threshold, the CPU and system cooling fans will run at full speed.

2. T o avoid possible system overheating, please be sure to provide adequate airflow to your system.

The options are:

• The Early Alarm: Select this setting if you want the CPU overheat alarm (including the LED and the buzzer) to be triggered as soon as the CPU temperature reaches the CPU overheat threshold as predefined by the CPU manufacturer.

• The Default Alarm: Select this setting if you want the CPU overheat alarm (including the LED and the buzzer) to be triggered when the CPU temperature

reaches about 5oC above the threshold temperature as predefined by the CPU manufacturer to give the CPU and system fans additional time needed for CPU and system cooling. In both the alarms above, please take immediate action as shown below.

3.3.9.2 CPU 1 Temperature/CPU 2 Temperature/System Temperature

This feature displays current temperature readings for the CPUs and the System. The following items will be displayed for your reference only:

CPU 1 Temperature/ CPU 2 Temperature

The CPU Temperature feature will display the CPU temperature status as detected by the BIOS:

• Low – This level is considered as the ‘normal’ operating state. The CPU temperature is well below the CPU ‘Temperature Tolerance’. The motherboard fans and CPU will run normally as configured in the BIOS (Fan Speed Control). User intervention: No action required.

• Medium – The processor is running warmer. This is a ‘precautionary’ level and generally means that there may be factors contributing to this condition, but the CPU is still within its normal operating state and below the CPU ‘Temperature Tolerance’. The motherboard fans and CPU will run normally as configured in the BIOS. The fans may adjust to a faster speed depending on the

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Fan Speed Control settings. User intervention: No action is required. However, consider checking the fans and the chassis ventilation for blockage.

• High – The processor is running hot. This is a ‘caution’ level since the CPU’s

‘Temperature Tolerance’ has been reached (or has been exceeded) and may activate an overheat alarm. The system may shut down if it continues for a long period to prevent damage to the CPU.

User intervention: If the system buzzer and Overheat LED has activated, take action immediately by checking the system fans, chassis ventilation and room temperature to correct any problems.

Notes:

1. The CPU thermal technology that reports absolute temperatures (Cel-

sius/Fahrenheit) has been upgraded to a more advanced feature by Intel in its newer processors. The basic concept is each CPU is embedded by unique temperature information that the motherboard can read. This ‘Temperature Threshold’ or ‘Temperature Tolerance’ has been assigned at the factory and is the baseline on which the motherboard takes action during different CPU temperature conditions (i.e., by increasing Fan speed, triggering the Overheat Alarm, etc.). Since CPUs can have different ‘Temperature Tolerances’, the installed CPU can now send information to the motherboard what its ‘Temperature Tolerance’ is, and not the other way around. This results in better CPU thermal management.

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Supermicro has leveraged this feature by assigning a temperature status to certain thermal conditions in the processor (Low, Medium and High). This makes it easier for the user to understand the CPU’s temperature status, rather than by just simply seeing a temperature reading (i.e., 25°C). The information provided above is for your reference only. For more information on thermal management, please refer to Intel’s Web site at www.Intel.com.

System Temperature:

The system temperature will be displayed (in degrees in Celsius and Fahrenheit) as it is detected by the BIOS.

Fan Speed Readings

This feature displays the fan speed readings from Fan1 through Fan8.

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Fan Speed Control Modes

This feature allows the user to decide how the system controls the speeds of the onboard fans. The CPU temperature and the fan speed are correlative. When the CPU on-die temperature increases, the fan speed will also increase, and vice versa. Select Workstation if your system is used as a Workstation. Select Server if your system is used as a Server. Select Full Speed to disable the fan speed control function and allow the onboard fans to constantly run at full speed. The Options are: Full Speed, Server, Workstation/Desktop, and Super Quiet.

3.3.9.3 Voltage Readings

The following voltage readings will be displayed. CPU0 Vcore, CPU1 Vcore, 1.5V, 5V, 5VSB, 12V, 3.3Vcc, 3.3Vsb, and VBAT and

Vtt.

BIOS Setup Utility

Advanced Setup Configurations

3.3.10 ACPI Configuration

Use this feature to configure Advanced Configuration and Power Interface (ACPI) power management settings for your system.

3.3.10.1 High Performance Event Timer

Select Enabled to activate the High Performance Event Timer (HPET) that produces periodic interrupts at a much higher frequency than a Real-time Clock (R TC) does in synchronizing multimedia streams, providing smooth playback and reducing the dependency on other timestamp calculation devices, such as an x86 RDTSC Instruction embedded in the CPU. The High Performance Event Timer is used to replace the 8254 Programmable Interval Timer. The options are Enabled and Disabled.

3.3.10.2 USB Device Wakeup

Select Enable to “wake-up” the system via a USB device when the system is in S3 (Sleep) or S4 (Hibernate) State. The options are Enabled and Disabled.

3.3.10.3 PS2 KB/MS Wake Up

Select Enable to “wake-up” the system using either the PS2 keyboard or mouse (if equipped) when the system is in S3 or S4 state. The options are Enabled and Dis- abled.

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3.3.10.4 ACPI Aware O/S

Enable ACPI support if it is supported by the OS to control ACPI through the Operating System. Otherwise, disable this feature. The options are Yes and No.

3.3.10.5 Suspend Mode

This option is used to select the ACPI State that is used for system suspend. The options are S1 (POS), S3 (STR) and Auto.

S1 (POS) - All processor caches are erased, and stops executing instructions. Power to the CPU(s) and RAM is maintained, but RAM is refreshed.

S3 (STR) - The CPU has no power and the power supply goes on reduced power mode. However, main memory (RAM) is still powered.

3.3.10.6 ACPI APIC Support

Select Enabled to include the ACPI APIC Table Pointer in the RSDT (Root System Description Table) pointer list. The options are Enabled and Disabled.

3.3.10.7 APIC ACPI SCI IRQ

When this item is set to Enabled, APIC ACPI SCI IRQ is supported by the system. The options are Enabled and Disabled.

3.3.10.8 Headless Mode

This feature is used to enable the system to function without a keyboard, monitor and/or mouse attached The options are Enabled and Disabled.

3.3.10.9 ACPI Version Features

The options are ACPI v1.0, ACPI v2.0 and ACPI v3.0. Please refer to ACPI's website for further explanation: http://www.acpi.info/.

3.3.11 Trusted Computing

3.3.11.1 TCG/TPM (Trusted Platform Module) Support

Select Yes on this item and enable the TPM jumper on the motherboard to enable TCG (TPM 1.1/1.2)/TPM support in order to improve data integrity and network

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BIOS Setup Utility

Advanced Setup Configurations

security. The options are No and Yes. If this feature is set to Yes, the following items will display:

Indicate Physical

Enables indication of physic al presence to TPM device each time the system starts. The options are Yes and No.

TPM Deactivated

Use this feature to Set or Clear the TPM device. The options are Set, Clear and Don't Change.

TPM Owner

Use this feature to Install or Clear the TPM ownership. The options are Don't Change, Enable Install, Disable Install and Clear.

Execute TPM Command

Select Enabled to allow the user to change executable TPM commands and TPM settings. Select Don't Change to keep the current TPM settings. The options are Don't

Change, Enabled, and Disabled.

• TPM Enable/Disable Status

This item displays the status of TPM Enabled/Disabled state.

• TPM Owner Status

This item displays the status of TPM Ownership

3.3.12 IPMI Configuration

Intelligent Platform Management Interface (IPMI) is a set of common interfaces that IT administrators can use to monitor system health and to manage the system as a whole. For more information on the IPMI specifications, please visit Intel's website at www.intel.com.

3.3.12.1 IPMI Firmware Revision

This item displays the current IPMI firmware revision.

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3.3.12.2 Status of BMC

Baseboard Management Controller (BMC) manages the interface between system management software and platform hardware. This is an informational feature which returns the status code of the BMC micro controller.

3.3.13 View BMC System Event Log

This feature displays the BMC System Event Log (SEL). It shows the total number of entries of BMC System Events. To view an event, select an Entry Number and press <Enter> to display the information as shown in the screen.

• Total Number of Entries

• SEL Entry Number

• SEL Record ID

• SEL Record Type

• Timestamp, Generator ID

• Event Message Format User

• Event Sensor Type

• Event Sensor Number

• Event Dir Type

• Event Data

3.3.13.1 Clear BMC System Event Log

Select OK and press the <Enter> key to clear the BMC system log. Select Cancel to keep the BMC System log. The options are OK and Cancel.

Caution: Any cleared information is unrecoverable. Make absolutely sure that you no longer need any data stored in the log before clearing the BMC Event Log.

3.3.14 Set LAN Configuration

Set this feature to configure the IPMI LAN adapter with a network address as shown in the following graphics.

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3.3.14.1 Channel Number

Enter the channel number for the SET LAN Config command. This is initially set to [01]. Press “+” or “-” on your keyboard to change the Channel Number.

3.3.14.2 Channel Number Status

This feature returns the channel status for the Channel Number selected above: Channel Number is “OK” or “Wrong Channel Number”.

3.3.15 IP Address Source

Select the source of this machine's IP address. If Static is selected, you will need to know and enter manually the IP address of this machine below. If DHCP is selected, the BIOS will search for a DHCP (Dynamic Host Configuration Protocol) server in the network it is attached to, and request the next available IP address. The options are DHCP and Static.

BIOS Setup Utility

Advanced Setup Configurations

The following items are assigned IP addresses automatically if DHCP is selected under IP Address Source above:

IP Address

Enter the IP address for this machine. This should be in decimal and in dotted quad form, (i.e., 192.168.10.253). The value of each three-digit number separated by dots should not exceed 255 as shown in the screen below.

Subnet Mask

Subnet masks tell the network which subnet this machine belongs to. The value of each three-digit number separated by dots should not exceed 255.

Gateway Address

This is the IP address of the gateway in the network. This is usually a router.

3.3.16 Mac Address

The BIOS will automatically enter the Mac address of this machine; however it may be over-ridden. Mac addresses are 6 two-digit hexadecimal numbers (Base 16, 0 ~ 9, A, B, C, D, E, F) separated by dots. (i.e., 00.30.48.D0.D4.60).

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3.3.17 SET PEF Configuration

3.3.17.1 PEF Support

Select Enabled to enable the function of Platform Event Filter (PEF) which will interpret BMC events and perform actions based on pre-determined settings or events, and performs actions based on pre-determined settings or 'traps' under IPMI

1.5 specifications. For example, powering the system down or sending an alert when a triggering event is detected. The default is Disabled.

The following items will display if this item is set to Enabled.

PEF Action Global Control (Available if PEF Support is enabled)

These are the different actions based on BMC events. The options are Alert, Power Down, Reset System, Power Cycle, OEM Action, Diagnostic Interface.

Alert Startup Delay (Available if PEF Support is enabled)

This feature inserts a delay during startup for PEF alerts. The options are Enabled and Disabled.

Startup Delay (Available if PEF Support is enabled)

This feature enables or disables startup delay. The options are Enabled and Disabled.

Event Message for PEF Action (Available if PEF Support is enabled)

This enables or disables Event Messages for PEF action. Refer to Table 24.6 of the IPMI 1.5 Specification for more information at www.intel.com. The options are Dis-

abled and Enabled.

3.3.17.2 BMC Watch Dog Timer Action

This feature allows the BMC to reset or power down the system if the OS hangs or crashes. The options are Disabled, Reset System, Power Down, Power Cycle.

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BMC Watch Dog TimeOut [Min:Sec]

This option appears if BMC Watch Dog Timer Action (above) is enabled. This is a timed delay in minutes or seconds, before a system power down or reset after an operating system failure is detected. The options are [5 Min.], [1 Min.], [30 Sec], and

[10 Sec].

3.3.18 Event Log Configuration

3.3.18.1 View Event Log

Use this option to view the System Event Log.

3.3.18.2 Mark all events as read

This option marks all events as read. The options are OK and Cancel.

BIOS Setup Utility

Advanced Setup Configurations

3.3.18.3 Clear event log

This option clears the Event Log memory of all messages. The options are OK and Cancel.

3.3.18.4 PCI Error Log

Use this option to enable PCI error (PERR) logging. The options are Yes and No.

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3.4 Security Settings

The AMI BIOS provides a Supervisor and a User password. If you use both passwords, the Supervisor password must be set first.

Figure 3-3.

3.4.1 Supervisor Password

This item indicates if a Supervisor password has been entered for the system. “Not Installed” means a Supervisor password has not been used.

3.4.2 User Password

This item indicates if a user password has been entered for the system. “Not Installed” means that a user password has not been used.

3.4.3 Change Supervisor Password

Select this feature and press <Enter> to access the submenu, and then type in a new

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BIOS Setup Utility

Security Settings

Supervisor Password.

3.4.4 User Access Level (Available when Supervisor Password is set as above)

Available options are Full Access: grants full User read and write access to the Setup Utility, View Only: allows access to the Setup Utility but the fields cannot be changed, Limited: allows only limited fields to be changed such as Date and Time, No Access: prevents User access to the Setup Utility.

3.4.5 Change User Password (Available when a User Password is installed)

Select this feature and press <Enter> to access the submenu, and then type in a new User Password.

3.4.6 Clear User Password (Available only when User Password is installed)

This item allows you to clear a user password after it has been entered.

3.4.7 Password Check (Available when a password is installed)

This item forces the system to prompt for a password only when entering BIOS setup or during each bootup. The options are Setup and Always.

3.4.8 Boot Sector Virus Protection

When Enabled, the AMI BIOS displays a warning when any program (or virus) issues a Disk Format command or attempts to write to the boot sector of the storage drive. The options are Enabled and Disabled.

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3.5 Boot Configuration

Figure 3-4. Boot Settings

Use this feature to configure boot settings.

3.5.1 Boot Device Priority

This feature allows the user to specify the sequence of priority for the Boot Device. The settings are 1st boot device, 2nd boot device, 3rd boot device, 4th boot device, 5th boot device and Disabled.

• 1st Boot Device - [USB: XXXXXXXXX]

• 2nd Boot Device - [CD/DVD: XXXXXXXXX]

3.5.2 Storage Drives

This feature allows the user to specify the boot sequence from all available storage drives. The settings are Disabled and a list of all storage drives that have been

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detected (i.e., 1st Drive, 2nd Drive, 3rd Drive, etc).

• 1st Drive - [SATA: XXXXXXXXX]

3.5.3 Removable Drives

This feature allows the user to specify the boot sequence from available Removable Drives. The settings are 1st boot device, 2nd boot device, and Disabled.

• 1st Drive - [USB: XXXXXXXXX]

• 2nd Drive

3.5.4 CD/DVD Drives

This feature allows the user to specify the boot sequence from available CD/DVD Drives (i.e., 1st Drive, 2nd Drive, etc.).

BIOS Setup Utility

Boot Configuration

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3.6 Exit Options

Select the Exit tab from the AMI BIOS Setup Utility screen to enter the Exit BIOS Setup screen.

Figure 3-5.

3.6.1 Save Changes and Exit

When you have completed the system configuration changes, select this option to leave the BIOS Setup Utility and reboot the computer, so the new system configuration parameters can take effect. Select Save Changes and Exit from the Exit menu and press <Enter>.

3.6.2 Discard Changes and Exit

Select this option to quit the BIOS Setup without making any permanent changes to the system configuration, and reboot the computer. Select Discard Changes and Exit from the Exit menu and press <Enter>.

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3.6.3 Discard Changes

Select this option and press <Enter> to discard all the changes and return to the AMI BIOS Utility Program.

3.6.4 Load Optimal Defaults

To set this feature, select Load Optimal Defaults from the Exit menu and press <Enter>. Then, select OK to allow the AMI BIOS to automatically load Optimal Defaults to the BIOS Settings. The Optimal settings are designed for maximum system performance, but may not work best for all computer applications.

3.6.5 Load Fail-Safe Defaults

To set this feature, select Load Fail-Safe Defaults from the Exit menu and press <Enter>. The Fail-Safe settings are designed for maximum system stability, but not for maximum performance.

BIOS Setup Utility

BIOS Recovery

3.7 BIOS Recovery

Caution: Do not upgrade the BIOS unless your system has a BIOS-related issue. Flashing the wrong BIOS can cause irreparable damage to the system. In no event shall Themis be liable for direct, indirect, special, incidental, or consequential damages arising from a BIOS update. If you need to update the BIOS, do not shut down or reset the system while the BIOS is updating. This is to avoid possible boot failure.

How to Recover the AMIBIOS Image (Main BIOS Block)

An AMIBIOS flash chip consists of a boot sector block, and a main BIOS code block (a main BIOS image). The boot sector block contains critical BIOS code, including memory detection and recovery code to be used to flash a new BIOS image if the original BIOS Image is corrupted. When the system is powered on, the boot sector code executes first. Once it is completed, the main BIOS code will continue with system initialization and complete the bootup process.

Note: BIOS Recovery described below is used when the main BIOS block crashes. However, when the BIOS Boot sector crashes, you will need to send the motherboard back to Supermicro for RMA repairs.

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3.7.1 Boot Sector Recovery from a USB Device

This feature allows the user to recover a BIOS image using a USB device without additional utilities needed. A user can download the BIOS image into a USB flash device, and name the file “SUPER.ROM” for the recovery process to load the file. A USB flash device such as a USB Flash Drive, a USB CDROM or a USB CDRW device can be used for this purpose:

1. Insert the USB device that contains the new BIOS image (the ROM files)

saved in a root directory into your USB drive.

2. While turning the power on, press and hold <Ctrl> and <Home> at the same

time until the USB Access LED Indicator comes on. This might take a few seconds.

3. Once the USB drive LED is on, release the <Ctrl> and <Home> keys. AMI-

BIOS will issue beep codes to indicate that the BIOS ROM file is being updated.

4. When BIOS flashing is completed, the computer will reboot. Do not interrupt

the flashing process until it is completed.

3.7.2 Boot Sector Recovery from an IDE CD-ROM

This process is almost identical to the process of Boot Sector Recovery from a USB device, except that the BIOS image file is loaded from a CD-ROM. Use a CD-R or CD-RW drive to burn a CD with the BIOS image file in it, and name the file “SUPER.ROM” for the recovery process to load the file.

3.7.3 Boot Sector Recovery from a Serial Port (“Serial Flash”)

This process, also known as “Serial Flash,” allows the user to use a serial port to load a BIOS image for Boot Sector recovery. This feature is usually used for embedded systems that rely on a serial port for remote access and debugging.

3.7.3.1 Requirements

In order to use Serial Flash for Boot Sector Recovery, you will need to meet the following requirements.

• The “Target system,” the system that needs BIOS updates, must have a serial

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Specifications and Main Features

Frequently Asked Questions

User Manual