U s e r M a n u a l
U s e r M a n u a l
I n s t a l l a t i o n
I n s t a l l a t i o n
M a n u a l
M a n u a l
RES-32XR3
RES-32XR3
Configuration 2
Configuration 2
3RU 19” Rack-Mount Rugged Enterprise Server
with X8DTi/X8DTi-F/X8DTi-LN4F Motherboard Configuration
/ Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
Tw o Qu ad -Cor e 55 00 o r Quad / S ix -Co r e 56 00 X e o n CP U s
RE S-32X R3 - Co nfigu ra tion 2
RE S-32X R3 - Co nfigu ra tion 2
Tw o Qua d - C ore 5 5 00 or Q u ad/S i x -C ore 5 6 00 Xe o n CPUs
RE S-32X R3 - Co nfigu ra tion 2
RE S-32X R3 - Co nfigu ra tion 2
Tw o Qua d - C ore 5 5 00 or Q u ad/S i x -C ore 5 6 00 Xe o n CPUs
RE S-32X R3 - Co nfigu ra tion 2
RE S-32X R3 - Co nfigu ra tion 2
Tw o Qua d - C ore 5 5 00 or Q u ad/S i x -C ore 5 6 00 Xe o n CPUs
RE S-32X R3 - Co nfigu ra tion 2
RE S-32X R3 - Co nfigu ra tion 2
Tw o Qua d - C ore 5 5 00 or Q u ad/S i x -C ore 5 6 00 Xe o n CPUs
RE S-32X R3 - Co nfigu ra tion 2
RE S-32X R3 - Co nfigu ra tion 2
Tw o Qua d - C ore 5 5 00 or Q u ad/S i x -C ore 5 6 00 Xe o n CPUs
RE S-32X R3 - Co nfigu ra tion 2
RE S-32X R3 - Co nfigu ra tion 2
Tw o Qua d - C ore 5 5 00 or Q u ad/S i x -C ore 5 6 00 Xe o n CPUs
RE S-32X R3 - Co nfigu ra tion 2
RE S-32X R3 - Co nfigu ra tion 2
RES-32XR3 Installation Manual
- Configuration 2*
* SuperMicro Motherboards X8DTi / X8DTi-F / X8DTi-LN4F
Version 1.0— July 2010
Themis Computer—Americas and Pacific Rim
47200 Bayside Parkway
Fremont, CA 94538
Phone (510) 252-0870
Fax (510) 490-5529
World Wide Web http://www.themis.com
Themis Computer—Rest of World
5 Rue Irene Joliot-Curie
38320 Eybens, France
Phone +33 476 14 77 80
Fax +33 476 14 77 89
Copyright © 2010 Themis Computer, Inc.
ALL RIGHTS RESERVED. No part of this publication may be reproduced in any form, by
photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without
the prior written permission of Themis Computer.
The information in this publication has been carefully checked and is believed to be accurate. However,
Themis Computer assumes no responsibility for inaccuracies. Themis Computer retains the right to
make changes to this publication at any time without prior notice. Themis Computer does not assu me
any liability arising from the application or use of this publicat ion or the product(s) described herein.
RESTRICTED RIGHTS LEGEND: Use, duplication, or disclosure by the United States Government
is subject to the restrictions set forth in DFARS 252.227-7013 (c)(1)(ii) and FAR 52.227-19.
TRADEMARKS and SERVICEMARKS
Themis® is a registered trademark of Themis Computer, Inc.
®
Intel
and Xeon® are registered trademarks of Intel Corporation.
®
Red Hat
Linux
SuperMicro
All other trademarks, servicemarks, or registered trademarks used in this publication are the property of
their respective owners.
is a registered trademark of Red Hat, Inc.
®
is a registered trademark of Linus Torvalds.
®
is a registered trademark of Super Micro Computer, Inc.
CE Marking
This product complies with the European EMC Directive (2004/108/EC) and the European Low Voltage
Safety Directive (2006/95/EC)/.
Safety Precautions
Instructions regarding safety precautions during installation, operation, or maintenance of the equipment
are given in the section entitled “Safety Instructions” on page iv.
WARNINGS and CAUTIONS
The definitions of WARNINGS and CAUTIONS as used in this document are given in the Preface in
the section entitled “Notes, Cautions, Warnings, and Sidebars”.
Themis Customer Support
North America, South America, and Pacific Rim
Telephone: 510-252-0870
Fax: 510-490-5529
E-mail: support@themis.com
Web Site: http://www.themis.com
RES-32XR3 Installation Manual - Configuration 2, Version 1.0
July 2010
Part Number: 117022-024
RES-32XR3 Installation Manual - Configuration 2
Version Revision History
Ve rsi on 1 .0............................................................................................. July 2010
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RES-32XR3 Installation Manual - Configuration 2
Safety Instructions
To maximize user safety and ensure correct device operation, all instructions contained in this section should be read carefully.
Caution: It is important that the user observe all warnings and instructions
that are on the device and contained in this manual.
• The device must be used in accordance with the instructions for use.
• Electrical installations in the room must correspond to the requirements of
respective regulations.
• Take care that there are no cables, particularly mains cables, in areas where
persons can trip over them.
• Do not use a mains connection in sockets shared by a number of other power
consumers. Do not use an extension cable.
• Only use the mains cable supplied.
• The unit is completely disconnected from the power source only when the
power cord is disconnected from the power source. Therefore the power cord
and its connectors must always remain easily accessible.
• Do not set up the device in the proximity of heat sources or in a damp location.
Make sure the device has adequate ventilation.
• All connection cables must be screwed or locked to the chassis housing.
• The device is designed to be used in horizontal position only.
• The device is no longer safe to operate when
— the device has visible damage or
— the device no longer functions.
• In these cases, the device must be shut down and secured against unintentional
operation.
• Repairs may only be carried out by a person authorized by Themis Computer.
• The device may only be opened for the installation and removal of extension
(PCI) cards, memory modules, storage drives, fan housings, power supplies,
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and the lithium battery—all in accordance with the instructions given in this
manual.
• If extensions are made to the device, the legal stipulations and the device specifications must be observed.
• The device must be switched off when removing the top cover; for example,
before installing extension (PCI) cards.
Operation of Laser Source Devices
DVD/CD-ROM drives contain laser light-emitting diodes (classified in accordance
with IEC 825-1:1993: LASER CLASS 1) and, therefore, must not be opened.
If the enclosure of such a drive is opened, invisible laser radiation is emitted. Do
not allow yourself to be exposed to this radiation.
The laser system meets the code of Federal Regulations 21 CFR,1040 for the USA
and Canadian Radiation Emitting Devices Act, REDR C 1370.
RES-32XR3 Installation Manual - Configuration 2
Electrostatic Discharge (ESD)
A sudden discharge of electrostatic electricity can destroy static-sensitive devices
or micro-circuitry. Proper packaging and grounding techniques are necessary precautions to prevent damage. Always take the following precautions:
1. Transport boards in static-safe containers such as boxes or bags.
2. Keep electrostatic-sensitive parts in their containers until they arrive at static-
free stations.
3. Always be properly grounded when touching a sensitive board, component, or
assembly.
4. Store electrostatic-sensitive boards in protective packaging or on conductive
foam.
Grounding Methods
Guard against electrostatic damage at workstations by following these steps:
1. Cover workstations with approved anti-static material. Provide a wrist strap
connected to a work surface and properly grounded tools and equipment.
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RES-32XR3 Installation Manual - Configuration 2
2. Use anti-static mats, heel straps, or air ionizers to give added protection.
3. Handle electrostatic-sensitive components, boards, and assemblies by the case
or the PCB edge.
4. Avoid contact with pins, leads, or circuitry.
5. Turn off power and input signals before inserting and removing connectors or
test equipment.
6. Keep the work area free of non-conductive materials such as ordinary plastic as-
sembly aids and Styrofoam.
7. Use field service tools, such as cutters, screwdrivers, and vacuums that are con-
ductive.
8. Always place drives and boards PCB-assembly-side down on the foam.
Instructions for the Lithium Battery
Systems are equipped with a lithium battery installed on the motherboard. To
replace this battery, please observe the instructions that are described in this manual.
Warning: There is a danger of explosion when the wrong type of battery is used
as a replacement.
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Table of Contents
Preface .................................................................................................................................. xix
1. Overview and Specifications ........................................................................................ 1-1
1.1 Overview ................................................................................................................ 1-1
1.2 System LEDs and I/O Connectors ......................................................................... 1-6
1.3 Chipset Overview .................................................................................................. 1-9
1.3.1 The 5500/5600 Series CPU and the 5520 Chipset ..................................... 1-9
1.4 Special Features ................................................................................................... 1-10
1.4.1 Recovery from AC Power Loss ............................................................... 1-10
1.5 PC Health Monitoring .......................................................................................... 1-10
1.5.1 Fan Status Monitor with Firmware Control ............................................. 1-10
1.5.2 Environmental Temperature Control ....................................................... 1-10
1.5.3 System Resource Alert ............................................................................. 1-11
1.6 ACPI Features ...................................................................................................... 1-11
1.6.1 Slow Blinking LED for Suspend-State Indicator .................................... 1-11
1.6.2 Main Switch Override Mechanism .......................................................... 1-12
1.6.3 Wake-On-LAN (WOL) ............................................................................ 1-12
1.7 Power Supply ....................................................................................................... 1-13
1.8 Super I/O Controller ............................................................................................ 1-14
1.9 Specifications ....................................................................................................... 1-15
1.10 Packaging and Shipping .......................................................................................1-19
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1.9.1 General ..................................................................................................... 1-15
1.9.2 Electrical .................................................................................................. 1-16
1.9.2.1 System Power ........................................................................... 1-16
1.9.2.2 Output Voltage .......................................................................... 1-16
1.9.3 Environmental .......................................................................................... 1-17
1.9.3.1 Shock ........................................................................................ 1-17
1.9.3.2 Electrostatic Discharge ............................................................. 1-17
1.9.3.3 Noise ......................................................................................... 1-17
1.10.1 Accessory Kit ...........................................................................................1-19
1.10.2 Rack-Mount Slides (Optional) ................................................................. 1-20
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RES-32XR3 Installation Manual - Configuration 2
2. Installation and Operation ........................................................................................... 2-1
2.1 Installation Procedures ........................................................................................... 2-1
2.1.1 Remove Protective Top Cover ................................................................... 2-1
2.1.2 Memory Modules ....................................................................................... 2-3
2.1.2.1 Installation ..................................................................................2-4
2.1.3 PCI Cards ................................................................................................... 2-7
2.1.3.1 Installing Cards ........................................................................... 2-7
2.1.4 Lithium Battery .......................................................................................... 2-8
2.1.4.1 Removing the Lithium Battery ................................................... 2-8
2.1.4.2 Installing a Lithium Battery ........................................................ 2-9
2.1.5 SATA II Storage Drive .............................................................................. 2-9
2.1.5.1 Opening the RES-32XR3 Front Doors ..................................... 2-10
2.1.5.2 Storage-Drive Removal ............................................................2-10
2.1.5.3 Storage-Drive Installation ......................................................... 2-11
2.1.6 Removable 120-mm Fan .......................................................................... 2-12
2.1.6.1 Removing and Installing a 120-mm Fan ................................... 2-12
2.1.7 Power Supply ........................................................................................... 2-13
2.1.7.1 Removing a Power Supply ....................................................... 2-13
2.1.7.2 Installing a Power Supply ......................................................... 2-14
2.2 Rack Mounts ........................................................................................................ 2-15
2.2.1 Mounting Brackets ................................................................................... 2-15
2.2.2 Rack-Mount Slides (Optional) ................................................................. 2-15
2.3 Operation ............................................................................................................. 2-16
2.3.1 Plugging in the AC Power Cords ............................................................. 2-16
2.3.2 Turning the System On ............................................................................ 2-16
2.3.3 Getting Started ......................................................................................... 2-17
2.3.3.1 Configuration ............................................................................ 2-17
2.3.3.2 Linux Installation ...................................................................... 2-17
2.3.4 Turning the System Off ...........................................................................2-17
3. BIOS Setup Utility ........................................................................................................ 3-1
3.1 Introduction ............................................................................................................ 3-1
3.1.1 Starting BIOS Setup Utility ....................................................................... 3-1
3.1.2 How To Change the Configuration Data ................................................... 3-2
3.1.3 Starting the Setup Utility ...........................................................................3-2
3.2 Main Setup ............................................................................................................. 3-3
3.2.1 System Overview ....................................................................................... 3-3
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3.2.1.1 System Time/System Date .......................................................... 3-3
3.2.1.2 Supermicro X8DT3 ..................................................................... 3-4
3.2.1.3 Processor ..................................................................................... 3-4
3.2.1.4 System Memory .......................................................................... 3-4
3.3 Advanced Setup Configurations ............................................................................ 3-5
3.3.1 BOOT Features .......................................................................................... 3-5
3.3.1.1 Quick Boot .................................................................................. 3-5
3.3.1.2 Quiet Boot ................................................................................... 3-5
3.3.1.3 AddOn ROM Display Mode ....................................................... 3-6
3.3.1.4 Bootup Num-Lock ...................................................................... 3-6
3.3.1.5 Wait For 'F1' If Error ..................................................................3-6
3.3.1.6 Hit 'Del' Message Display ........................................................... 3-6
3.3.1.7 Interrupt 19 Capture .................................................................... 3-6
3.3.2 Power Configuration .................................................................................. 3-6
3.3.2.1 Power Button Function ............................................................... 3-6
3.3.2.2 Restore on AC Power Loss ......................................................... 3-7
3.3.2.3 Watch Dog Timer .......................................................................3-7
3.3.3 Processor and Clock Options ..................................................................... 3-7
3.3.3.1 C1E Support ................................................................................ 3-7
3.3.3.2 Hardware Prefetcher (Available when supported by the CPU) .. 3-7
3.3.3.3 Adjacent Cache Line Prefetch
(Available when supported by the CPU) .................................... 3-7
3.3.3.4 Intel® Virtualization Technology
(Available when supported by the CPU) .................................... 3-7
3.3.3.5 Execute-Disable Bit Capability
(Available when supported by the OS and the CPU) .................3-8
3.3.3.6 Simultaneous Multi-Threading
(Available when supported by the CPU) .................................... 3-8
3.3.3.7 Active Processor Cores ............................................................... 3-8
3.3.3.8 Intel® Speed_Step™ Technology .............................................. 3-8
3.3.3.9 Intel® C-STATE Tech ................................................................ 3-8
3.3.3.10 Clock Spread Spectrum ..............................................................3-9
3.3.4 Advanced Chipset Control ......................................................................... 3-9
3.3.5 QPI Links Speed ........................................................................................ 3-9
3.3.5.1 QPI Frequency ............................................................................ 3-9
3.3.5.2 QPI L0s and L1 ........................................................................... 3-9
3.3.5.3 Memory Frequency ..................................................................... 3-9
3.3.5.4 Memory Mode ............................................................................3-9
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RES-32XR3 Installation Manual - Configuration 2
3.3.5.5 Demand Scrubbing ................................................................... 3-10
3.3.5.6 Patrol Scrubbing ....................................................................... 3-10
3.3.5.7 Throttling - Closed Loop / Throttling - Open Loop .................. 3-10
3.3.6 Northbridge Configuration ...................................................................... 3-11
3.3.6.1 Crystal Beach / DMA (Direct Memory Access) ....................... 3-11
3.3.6.2 Crystal Beach / DCA (Direct Cache Access) ...........................3-12
3.3.6.3 NUMA Support ......................................................................... 3-12
3.3.6.4 Intel VT-d ................................................................................. 3-12
3.3.7 Southbridge Configuration ...................................................................... 3-12
3.3.7.1 USB Functions .......................................................................... 3-12
3.3.7.2 Legacy USB Support ................................................................ 3-12
3.3.7.3 USB 2.0 Controller ................................................................... 3-12
3.3.7.4 USB 2.0 Controller Mode ......................................................... 3-13
3.3.7.5 BIOS EHCI Hand-Off .............................................................. 3-13
3.3.7.6 HDA Controller ........................................................................3-13
3.3.7.7 Reserved Page Rout .................................................................. 3-13
3.3.8 IDE/SATA Configuration ........................................................................ 3-13
3.3.8.1 SATA#1 Configuration ............................................................. 3-13
3.3.8.2 Configure SATA#1 as .............................................................. 3-13
3.3.8.3 SATA#2 Configuration ............................................................. 3-14
3.3.8.4 Primary IDE Master / Slave, Secondary IDE Master
/ Slave, Third IDE Master, and Fourth IDE Master .................. 3-14
3.3.8.5 Block (Multi-Sector Transfer) ..................................................3-14
3.3.8.6 PIO Mode .................................................................................. 3-15
3.3.8.7 DMA Mode ............................................................................... 3-15
3.3.8.8 S.M.A.R.T. For Storage drives ................................................. 3-16
3.3.8.9 32 Bit Data Transfer ................................................................. 3-16
3.3.8.10 Hot Plug .................................................................................... 3-16
3.3.8.11 IDE Detect Timeout (sec) ......................................................... 3-16
3.3.9 PCI/PnP Configuration ............................................................................3-17
3.3.9.1 Clear NVRAM .......................................................................... 3-17
3.3.9.2 Plug & Play OS ......................................................................... 3-17
3.3.9.3 PCI Latency Timer .................................................................... 3-17
3.3.9.4 PCI IDE Bus Master ................................................................. 3-17
3.3.9.5 Slot 1 Option ROM~Slot 6 Option ROM ................................. 3-17
3.3.9.6 LAN1 PXE/LAN2 PXE/LAN3 PXE/LAN4 PXE
(-LN3 PXE/-LN4 PXE: for LN4 models only) ........................ 3-17
3.3.10 Super IO Device Configuration ............................................................... 3-18
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3.3.10.1 Onboard Floppy Controller ....................................................... 3-18
3.3.10.2 Floppy A/Floppy B ................................................................... 3-18
3.3.10.3 Serial Port1 Address/ Serial Port2 Address .............................. 3-18
3.3.10.4 Watch Dog Timer ..................................................................... 3-18
3.3.11 Remote Access Configuration ................................................................. 3-18
3.3.11.1 Remote Access .......................................................................... 3-18
3.3.11.2 Serial Port Mode ....................................................................... 3-19
3.3.11.3 Flow Control ............................................................................. 3-19
3.3.11.4 Redirection After BIOS POST .................................................3-19
3.3.11.5 Terminal Type ........................................................................... 3-19
3.3.11.6 VT-UTF8 Combo Key Support ................................................ 3-19
3.3.11.7 Sredir Memory Display Delay .................................................. 3-19
3.3.12 System Health Monitor ............................................................................3-20
3.3.12.1 CPU Overheat Alarm ................................................................3-20
3.3.12.2 CPU Temperature/System Temperature ................................... 3-20
3.3.12.3 System Temperature ................................................................. 3-21
3.3.12.4 Voltage Monitoring ...................................................................3-22
3.3.12.5 System Fan Monitor ..................................................................3-22
3.3.12.6 Fan1—Fan 8 Reading ............................................................... 3-22
3.3.13 ACPI Configuration ................................................................................. 3-22
3.3.13.1 ACPI Version Features ............................................................. 3-22
3.3.13.2 ACPI APIC Support ..................................................................3-22
3.3.13.3 APIC ACPI SCI IRQ ................................................................ 3-22
3.3.13.4 Headless Mode .......................................................................... 3-23
3.3.13.5 High Performance Event Timer ................................................ 3-23
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3.3.14 Trusted Computing .................................................................................. 3-23
3.3.14.1 TCG/TPM (Trusted Platform Module) Support ....................... 3-23
3.3.15 IPMI Configuration ..................................................................................3-23
3.3.15.1 Status of BMC ..........................................................................3-24
3.3.16 View BMC System Event Log ................................................................ 3-24
3.3.16.1 Clear BMC System Event Log ................................................. 3-24
3.3.17 Set LAN Configuration ............................................................................ 3-25
3.3.17.1 Channel Number ....................................................................... 3-25
3.3.17.2 Channel Number Status ............................................................ 3-25
3.3.17.3 IP Address Source ..................................................................... 3-25
3.3.18 IP Address Configuration ........................................................................ 3-25
3.3.18.1 Parameter Selector .................................................................... 3-25
3.3.18.2 IP Address ................................................................................. 3-26
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RES-32XR3 Installation Manual - Configuration 2
3.3.18.3 Current IP Address in BMC ......................................................3-26
3.3.19 MAC Address Configuration ................................................................... 3-26
3.3.19.1 Parameter Selector .................................................................... 3-26
3.3.19.2 MAC Address ........................................................................... 3-26
3.3.19.3 Current MAC Address in BMC ................................................ 3-26
3.3.20 Subnet Mask Configuration ..................................................................... 3-26
3.3.20.1 Parameter Selector .................................................................... 3-26
3.3.20.2 Subnet Mask .............................................................................3-26
3.3.20.3 VLAN Tagging ......................................................................... 3-27
3.3.21 SEL PEF Configuration ........................................................................... 3-27
3.3.21.1 PEF Configuration ....................................................................3-27
3.3.21.2 BMC Watch Dog Timer Action ................................................3-28
3.3.22 DMI Event Log ........................................................................................ 3-28
3.3.22.1 View Event Log ........................................................................ 3-28
3.3.22.2 Mark all events as read ............................................................. 3-28
3.3.22.3 Clear event log .......................................................................... 3-28
3.4 Security Settings ..................................................................................................3-29
3.4.1 Supervisor Password ................................................................................ 3-29
3.4.2 User Password .......................................................................................... 3-29
3.4.3 Change Supervisor Password ................................................................... 3-29
3.4.4 User Access Level (Available when
Supervisor Password is set as above) ...................................................... 3-30
3.4.5 Change User Password ............................................................................3-30
3.4.6 Clear User Password (Available only if User Password has been set) .... 3-30
3.4.7 Password Check ....................................................................................... 3-30
3.4.8 Boot Sector Virus Protection ................................................................... 3-30
3.5 Boot Configuration .............................................................................................. 3-31
3.5.1 Boot Device Priority ................................................................................ 3-31
3.5.2 Storage Drives .......................................................................................... 3-31
3.5.3 Removable Drives .................................................................................... 3-32
3.5.4 CD/DVD Drives ...................................................................................... 3-32
3.6 Exit Options ......................................................................................................... 3-32
3.6.1 Save Changes and Exit ............................................................................ 3-33
3.6.2 Discard Changes and Exit ........................................................................ 3-33
3.6.3 Discard Changes ...................................................................................... 3-33
3.6.4 Load Optimal Defaults ............................................................................. 3-33
3.6.5 Load Fail-Safe Defaults ........................................................................... 3-33
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3.7 BIOS Recovery .................................................................................................... 3-34
3.7.1 How to Recover the AMIBIOS Image (the Main BIOS Block) .............. 3-34
3.7.2 Boot Sector Recovery from a USB Device ............................................. 3-34
3.7.3 Boot Sector Recovery from an IDE CD-ROM ........................................ 3-35
3.7.4 Boot Sector Recovery from a Serial Port (“Serial Flash”) ...................... 3-35
Appendix A. Connector Pinouts ...................................................................................... A-1
A.1 PS/2 Keyboard and Mouse ................................................................................... A-1
A.2 USB Ports ............................................................................................................. A-2
A.3 Serial Ports ............................................................................................................ A-2
A.4 SVGA Monitor Port .............................................................................................. A-3
A.5 Gigabit Ethernet LAN Ports ................................................................................. A-4
A.6 IPMI Dedicated LAN Port .................................................................................... A-4
Appendix B. Rack-Mount Slide Installation ...................................................................B-1
Appendix C. Red Hat Enterprise Linux 5 Installation ..................................................C-1
C.1 Introduction ............................................................................................................C-1
C.2 Installation .............................................................................................................C-1
Appendix D. Optional Remote On/Off Switch ...............................................................B-1
D.1 Remote On/Off Configuration ...............................................................................B-1
D.2 Remote On-Only Configuration ............................................................................B-2
D.3 Ordering the Remote On/Off Switch .....................................................................B-2
Appendix E. Re-Packing Instructions ............................................................................. E-1
E.1 Re-Packaging for Shipment ...................................................................................E-1
E.2 Packing Components .............................................................................................E-1
E.3 Instructions for Re-Packing ...................................................................................E-2
Index ................................................................................................................Index-1
Reader Comment Card
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List of Figures
Figure 1-1 RES-32XR3 Configuration 2........................................................................... 1-1
Figure 1-2 X8DTi Motherboard Block Diagram............................................................... 1-3
Figure 1-3 External Features of RES-32XR3 Configuration 2 (Front and Rear).............. 1-4
Figure 1-4 Major Components of the RES-32XR3 Configuration 2 (Open Top View)... 1-5
Figure 1-5 RES-32XR3 Configuration 2 System LEDs and I/O Connectors ................... 1-6
Figure 1-6 RES-32XR3 with Front Sound Baffle Installed (Front View) ...................... 1-17
Figure 1-7 RES-32XR3 with Rear Sound Baffle Installed (Rear View)......................... 1-18
Figure 2-1 Remove the RES-32XR3 Protective Access Cover......................................... 2-2
Figure 2-2 Remove the Air-Flow Deflector Screws.......................................................... 2-4
Figure 2-3 Memory Module Slot Locations...................................................................... 2-5
Figure 2-4 Memory Module Removal............................................................................... 2-6
Figure 2-5 PCI Card Installation, RES-32XR3 Configuration 2....................................... 2-7
Figure 2-6 PCI Card Clamp............................................................................................... 2-7
Figure 2-7 The RES-32XR3 Configuration 2 Lithium Battery and Socket ...................... 2-8
Figure 2-8 Opening the RES-32XR3 Front Bezel Doors.................................................. 2-9
Figure 2-9 Unlocking the RES-32XR3 Configuration 2 Storage Drives
(Front Doors Removed) 2-10
Figure 2-10 RES-32XR3 Storage Drive Removal ............................................................ 2-11
Figure 2-11 The Dual RES-32XR3 Configuration 2 120-mm Fans.................................. 2-12
Figure 2-12 The RES-32XR3 Power Supply Locking Mechanism .................................. 2-13
Figure 2-13 Right Rack-Mount Bracket............................................................................ 2-15
Figure 2-14 AC Power Socket and LED on the RES-32XR3 Rear................................... 2-16
Figure 2-15 System Power Button and LED on the RES-32XR3 Front ........................... 2-16
Figure 3-1 Main BIOS Setup Screen................................................................................. 3-3
Figure 3-2 Advanced Settings Screen ............................................................................... 3-5
Figure 3-3 Security Settings ............................................................................................ 3-29
Figure 3-4 Boot Settings.................................................................................................. 3-31
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RES-32XR3 Installation Manual - Configuration 2
Figure 3-5 Exit Options................................................................................................... 3-32
Figure 3-6 AMI_FLSH Hyperterminal............................................................................ 3-37
Figure 3-7 ROM File Extraction ..................................................................................... 3-37
Figure 3-8 FLASH Recovery .......................................................................................... 3-38
Figure A-1 USB Connector Pinout.................................................................................... A-2
Figure A-2 COM 1 Serial Connector Pinout..................................................................... A-2
Figure A-3 RES-32XR3 SVGA Connector Pinout ........................................................... A-3
Figure A-4 Ethernet Connector, Type RJ45...................................................................... A-4
Figure B-1 Screw Locations for Rack-Mount Slides ......................................................... B-1
Figure B-2 RES-32XR3 Rack-Mount Slide Installation.................................................... B-3
Figure C-1 Power On after Linux DVD is Inserted into Drive.......................................... C-2
Figure C-2 Skip Key .......................................................................................................... C-2
Figure C-3 Welcome Screen .............................................................................................. C-3
Figure C-4 Language Selection.......................................................................................... C-4
Figure C-5 Selecting Layout Type..................................................................................... C-5
Figure C-6 Enter Installation Number................................................................................ C-6
Figure C-7 Partitioning....................................................................................................... C-7
Figure C-8 Reviewing Option............................................................................................ C-8
Figure C-9 Creating a Custom Layout............................................................................... C-9
Figure C-10 Setting Up Boot Loader................................................................................. C-10
Figure C-11 Master Boot Record (MBR) .......................................................................... C-11
Figure C-12 Network Devices List .................................................................................... C-12
Figure C-13 Edit Interface Pop-Up Screen ........................................................................ C-13
Figure C-14 Selecting Time Zone...................................................................................... C-14
Figure C-15 Setting Up Root Account and Password........................................................ C-15
Figure C-16 Package Installation Default Screen.............................................................. C-16
Figure C-17 Optional Packages.......................................................................................... C-17
Figure C-18 Option to Review or Continue....................................................................... C-18
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Table of Contents
Figure C-19 Installation Begins ......................................................................................... C-18
Figure C-20 Installation is Complete ................................................................................. C-19
Figure C-21 Login Screen.................................................................................................. C-20
Figure C-22 Ready to use the Desktop............................................................................... C-20
Figure D-1 Remote On/Off Switch Module....................................................................... B-1
Figure E-1 Packaging Components.................................................................................... E-2
Figure E-2 Order of Assembly........................................................................................... E-3
List of Tables
Table 1-1 RES-32XR3 Configuration 2 Motherboard Options ...................................... 1-2
Table 1-2 Major Features of the RES-32XR3 Configuration 2 ...................................... 1-2
Table 1-3 System LEDs .................................................................................................. 1-7
Table 1-4 I/O Connectors................................................................................................ 1-8
Table 1-5 RES-32XR3 Configuration 2 General Specifications .................................. 1-15
Table 1-6 RES-32XR3 Electrical Specifications .......................................................... 1-16
Table 1-7 Approximate Weights of the RES Series...................................................... 1-20
Table 2-1 RES-32XR3 Configuration 2 Memory Capacity............................................ 2-3
Table 2-2 RES-32XR3 Configuration 2 Memory Population......................................... 2-3
Table A-1 PS/2 Keyboard/Mouse Pinouts...................................................................... A-1
Table A-2 USB Connector Pinout Signal Descriptions.................................................. A-2
Table A-3 COM 1 Serial Connector Pinout Signal Descriptions ................................... A-2
Table A-4 RES-32XR3 SVGA Connector-Pin Signals.................................................. A-3
Table A-5 RJ45 Ethernet Pinout Signals ........................................................................ A-4
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RES-32XR3 Installation Manual - Configuration 2
xviii
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Preface
This document, entitled RES-32XR3 Installation Manual—Configuration 2, provides instructions on how to install, configure, power up, and boot the Themis Rugged Enterprise Server RES-32XR3 (see Figure 1), based on two 64-bit Intel 5500Series Xeon
Core processors.
RES-32XR3 Configuration 2 supports one of three motherboards in a 20” chassis (a
matrix describing 20” chassis configurations is given in Table 1, page xx). A matrix
describing 17.07” chassis configurations is given in Table 2 on page xxi):
• SuperMicro X8DTi
• SuperMicro X8DTi-F
• SuperMicro X8DTi-LN4F
TM
Quad-Core processors or two Intel 5600-Series Xeon Quad-to-Six-
Themis Computer
Figure 1. Rugged Enterprise Server Model RES-32XR3
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RES-32XR3 Installation Manual - Configuration 2
Table 1. RES-x2XR3 20” Chassis Manual Matrix (AC and DC Power Supplies)
RES-22XR3
with Riser
Manual
Part Number
RES-12XR3
Manual
Part Number
Category Motherboard
Configuration 1
X8DTH-iF
X8DTH-6F
CPU
a
Soc
kets
RES-32XR3
Manual
Part Number
2 116790-024 1176789-024
RES-22XR3
Manual
Part Number
X8DTi
Configuration 2
X8DTi-F
2 117022-024 117017-024
X8DTi-LN4F
X8DT3
Configuration 3
X8DT3-F
2 117023-024 117018-024
X8DT3-LN4F
Configuration 4 X8DTN+ 2 117024-024 117019-024
Configuration 5
X8DAi
X8DA3
2 117025-024 117020-024
Configuration 6* X8DAH+-F 2 117026-024 117021-024
Configuration 7 X8DTU-F 117280-024 116970-024
Naming Key: X8Dvwxyz z System RES-x2XR3, where x = 3, 2, or 1
v: A = Sound chip; no graphics chip
T = Graphics chip; no sound chip
* Configuration 6 motherboard X8DAH+-F supports both audio and video;
however, the naming key does not contain a “T” in the title.
w: H = Tw o Tylersberg Northbridge chips
blank = One Tylersberg Northbridge chip
U = Motherboard with cutout
x: i=SATA only
3 = SAS 1.0
6 = SAS 2.0
y: LN4 = Extra gigabit Ethernet controller for two extra ports
z: F=IPMI
blank = No IPMI
a—All motherboards measure 12”W x 13”L except X8DTN+ and X8DAH+-F, which are 13.68”W x 13” L.
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Preface
Table 2. RES-x2XR3S / RES-x1XR3 17.07” Chassis Manual Matrix (AC and DC Power Supplies)
Mother-
board
X8DTL-6F
X8DTL-6
X8DTL-3F
X8DTL-3
X8DTL-iF
X8DTL-i
X8DAL-3
X8DAL-i
CPU
Soc
kets
RES-32XR3S
Manual P/N
RES-22XR3S
Manual P/N
RES-12XR3S
Manual P/N
2 117408-024 117412-024 117416-024
2 117409-024 117413-024 117417-024
2 117410-024 117414-024 117418-024
2 117411-024 117415-024 117419-024
RES-31XR3
Manual P/N
RES-21XR3
Manual P/N
X8SAX 1 117420-024 117421-024
X8ST3-F
X8STE
1
117385-024 117422-024
X8STi
X8STi-F
X8STi-LN4
1
X8STi-3F
RES-11XR3
Manual P/N
117423-024
Naming Key: X8uvwxyz z System RES-x2XR3S and RES-x1XR3, where x = 3, 2, or 1
u: D = Double CPU sockets
S = Single CPU socket
v: A = Sound chip; no graphics chip
T = Graphics chip; no sound chip
w: Not applicable
x: i=SATA only
3 = SAS 1.0
6 = SAS 2.0
y: LN4 = Extra gigabit Ethernet controller for two extra ports
z: F=IPMI
blank = No IPMI
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RES-32XR3 Installation Manual - Configuration 2
A matrix describing RES chassis that are configured for front-I/O connector and
front-PCI card access in a 16” chassis is given in Table 3. This chassis design makes
it more convenient to install cables to the system and demands no access to the rear
of the chassis except to replace a fan. Figure 2 shows the front view of a standard
rear-I/O RES-32 chassis (Figure 3 on page xxiii shows the rear view); Figure 4
shows the front view of a front-I/O RES-32 chassis (Figure 5 shows the rear view).
Table 3. Front I/O 16” Chassis Manual Matrix (AC and DC Power Supplies)
Mother-
board
X8DAH+-F* 2 117611-024
X8DTU-F 2 117664-024
Naming Key: X8uvwxyz z System RES-x2XR3S and RES-x1XR3, where
x = 3, 2, or 1
*RES-32XR3/FIO motherboard X8DAH+-F supports both audio and video;
however, the naming key does not contain a “T” in the title.
u: D = Double CPU sockets
S = Single CPU socket
v: A = Sound chip; no graphics chip
T = Graphics chip; no sound chip
w: Not applicable
x: i=SATA only
3 = SAS 1.0
6 = SAS 2.0
y: LN4 = Extra gigabit Ethernet controller for two extra ports
z: F=IPMI
blank = No IPMI
CPU
Soc
kets
RES-32XR3/FIO Manual P/N RES-22XR3/FIO Manual P/N
Figure 2. Front View of a Standard Rear-I/O RES-32 Chassis (Doors Removed)
xxii
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Preface
Figure 3. Rear View of a Standard Rear-I/O RES-32 Chassis
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Figure 4. Front View of a Front-I/O RES-32 Chassis
Figure 5. Rear View of a Front-I/O RES-32 Chassis
xxiii
RES-32XR3 Installation Manual - Configuration 2
The 3RU-high (5.25”) RES-32XR3 Configuration 2 has been designed to fit into a
standard 19” rack and is provided with rack-mount brackets with handles. Optional
rack-mount slides are also available. The RES-32XR3 is rugged enough to withstand
extreme shock (up to 35G), temperature, and EMI as that associated with such
demanding markets as the military, aerospace, and telecommunications industries.
Intel processors supported by RES-32XR3 Configuration 2 include either
• Two Intel 5500-Series Xeon Quad-Core CPUs, or
• Two Intel 5600-Series Xeon Quad-to-Six-Core CPUs
which operate at a QPI (QuickPath Interconnect) up to 6.4 GT/s and support a total
memory capacity of 192 GigaBytes (12 16-GB DIMMs) using 1066-MHz DDR3
ECC Registered memory modules. Changing memory speeds—1333 MHz and 800
MHz—is supported by lower capacity DIMMs, hence lower total memory capacity.
RES-32XR3 Configuration 2 is based on the functionality and capability of the following Intel chipset:
• Intel 5520 (Tylersburg) chipset
• ICH1OR + IOH-36D
An overview of RES-32XR3 design and specifications is given in Chapter 1, "Overview and Specifications", of this manual.
This manual is intended for an experienced system administrator with a knowledge
of both networking and high-speed server systems.
Website Information
Themis Computer corporate and product information may be accessed on the World
Wide Web by browsing the website http://www.themis.com
.
Your Comments are Welcome
We are interested in improving our documentation and welcome your comments and
suggestions. You can email your comments to us at docfeedback@themis.com.
Please include the document part number in the subject line of your email.
xxiv
Themis Computer
Preface
Notes, Cautions, Warnings, and Sidebars
Notes, Cautions, Warnings, and Sidebars
The following icons and formatted text are included in this document for the reasons
described:
Note: A note provides additional information concerning the procedure or action
being described.
Caution: A caution describes a procedure or action that may result in damage to
the equipment. This may involve—but is not restricted to—heavy equipment or
sharp objects. T o reduce the risk, follow the instructions accompanying this symbol.
Warning: A warning describes a procedure or action that may cause injury or death
to the operator. To reduce the risk, follow the instructions accompanying this symbol.
Sidebar: A “sidebar” adds detail to the section within which it is placed,
but is not absolutely vital to the description or procedure of the section.
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RES-32XR3 Installation Manual - Configuration 2
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General
Section
1.1 Overview
The RES-32XR3 Configuration 2 (see Figure 1-1 below; a block diagram is given
in Figure 1-2, page 1-3) is a rack-mounted system designed for above-average shock
and vibe environments. The RES-32XR3 supports dual Intel® 64-bit XeonTM processors (with QPI up to 6.4 GT/s) with up to 192 GB of DDR3 ECC Registered memory, and has many computer- and graphics-intensive and diverse-I/O capabilities,
ideal for military/aerospace and commercial telecommunications applications.
Options supported by the RES-32XR3 are listed in Table 1-1 on page 1-2.
Chapter
1RES-32XR3 Configuration 2
Overview and Specifications
Themis Computer
Figure 1-1. RES-32 XR3 Confi gurati on 2
1-1
RES-32XR3 Installation Manual - Configuration 2
Table 1-1. RES-32XR3 Configuration 2 Motherboard Options
MotherboardaIPMI SATA SAS
Memory
Slots
Graphics Audio
PCI-e, PCI-X, and PCI Slots
PCI-e
x16
PCI-e x8PCI-e
x4
PCI-X PCI
X8DTi —Yes— 12 Yes — 1 2 1 —2
X8DTi-F Yes Yes — 12 Yes — 1 2 1 — 2
X8DTi-LN4F Yes Yes — 12 Yes — 1 2 1 — 2
a—Super Micro Computer, Inc.
b—Two 32-bit, 33-MHz PCI slots.
b
b
b
The RES-32XR3 is designed within a 3RU-high (5.25”) form-factor 20” (50.8 cm)
deep and 17.07” (43.2 cm) wide (which, with mounting brackets, fits a 19”-wide rack).
Major features are listed in Table 1-2.
Table 1-2. Major Features of the RES-32XR3 Configuration 2
Feature Details
Processor (CPU)
Chipset
Memory
z Two 1366- pin Intel quad-core 5500-Series o r quad/six-core 5600-Series Xeon
CPU @ up to 6.4 GT/s each
z Intel® 5520 (Tylersburg) chipset
z ICH10R (Southbridge) and IOH-36D
z Twelve (12) 24 0-pin DIMMs supporti ng up to 192GB ( 16GB DIMMs) of Reg is-
tered ECC DDR3 1333/1066/800-MHz 72-bit SDRAM
Expansion slots
Rear-Panel I/O
Peripheral Support
Operating temperature
z See Table 1-1 for details
z See Table 1-4 on page 1-8 for details
z Eight SATA2 storage drives (6 from the motherboard, 2 from a PCI card)
z 1 combination CD-RW/DVD-ROM slimline (IDE) drive
z 0° up to 65° C (32° up to 149°F)
Shock endurance z 35G @ 25-msec duration (3 axis)
Dimensions
z 5.25” (3RU) high, 17.07” (43.2 cm) wide (19”/48.3 cm with mounting brackets),
20” (43.2 cm) deep
Rack-mount brackets and
slides
Dual power supplies
z Left and right rack-mount tabs are attached to the chassis
z Left and right rack-mount slides are optional
z 750 watts each, auto-ranging (100–265 VAC)
z Load-sharing N+1 redundant, hot-pluggable
z (Optional)—Choice of 750-watt (48V) or 500-watt (28V) DC Power supply
1-2
Themis Computer
Overview and Specifications
QPI
SAS
LSI 1068
B3
Option
PROCESSOR#2
PROCESSOR#1
VRD
6PHASE
VRD
6PHASE
Six 240-pin DIMM Sockets
DDR3 1333/1066/800 MHz ECC
Up to 48 GB total DDR3 SDRAM per CPU
#1-1
#1-2
#1-3
#1-4
#1-5
#1-6
Six 240-pin DIMM Sockets
DDR3 1333/1066/800 MHz ECC
Up to 48 GB total DDR3 SDRAM per CPU
#0-1
#0-2
#0-3
#0-4
#0-5
#0-6
Ports #7 - 10
QPI
PCI-E X 16/8
X16 SLO
(Optional) PCI-F X16
PHY#1
PHY#2
LAN #2
82576EB
OPTION
Ports #0-3
Ports #4-7
Ports #1 - 2
LAN #1
PHY #1
PHY #2
INTEL 5520
PCI - E X4
Port #8
Port #7
Ports #3 - 4
Ports #5-6
PCI-E X8
#6
SPEC
PCI-E X8
#5
PCI-E X8
PCI-E X4
INTEL ICH10R
Ports #0
ESI
PCI-E X4
DMI
LANE 1/2/3/4
PCI - E X4
PCI-E X8
LANE 5
LANE 6
PCI 33MHz
BMC WPCM450
PCI-33
PCI-33
#3
#1
SPI
SIO
W83627
HG
TPM
MS
KB
COM 1
External
COM 2
External
3.0 Gb/S
USB 2.0
#0
#1
#2
#3
#4
#5
#1
#2
#3
#4
#5
#0
#6
#7
#8
#9
LPC
#4
#2
Overview
Themis Computer
Figure 1-2. X8DTi Motherboard Block Diagram
1-3
RES-32XR3 Installation Manual - Configuration 2
1 3.5” Floppy-Disk Drives (Optional)
or 2.88-MB DAT Drive (Optional)
(Remove Blank Cover Plate)
20” (50.8 cm) deep
Power Supply
Latch Lock
AC Power Socket
(3-prong NEMA 15)
Storage Drive (SATA II) - 8 Total
Dual Power Supplies
PS1
PS2
CD-RW/DVD-ROM
Combo Slimline Drive
Front View (Doors Removed)
17.07” (42.7 cm), 19” with Rack Mounts
Empty
Rear View
System Power
ON/OFF Switch
5.25”
(3RU)
Front LED Indicator Panel
(see Figure 1-5, page 1-6)
PCI Slot, 32-bit/33-MHz
PCI-Express x4 slot
PCI Slot, 32-bit/33-MHz
Slot 1
1-4
Slot 7
Rear I/O Panel (see Figure 1-5, page 1-6)
PCI-Express 2.0 x16 slot
PCI-Express 2.0 x8 (in x16) slot
PCI-Express 2.0 x8 slot
Figure 1-3. External Features of RES-32XR3 Configuration 2 (Front and Rear)
The RES-32XR3 front panel houses eight removable storage drives (see Figure 1-3).
In addition, the front panel supports a CD-RW/DVD-ROM combo slimline drive,
and a 1.44-MB 3.5" floppy-disk drive (optional) or a single 2.88-MB DAT drive
(optional). All motherboards support SATA II drives only.
Drive requirements should be specified at the time the system is purchased.
Also included on the front panel is a system power ON/OFF button and LEDs (see
Figure 1-5 on page 1-6). The rear panel contains I/O faceplates for seven PCI cards,
of which only six are used (graphics, RAID, NIC, etc.), two AC power supplies with
latch locks and power-cord sockets, and all I/O connectors (see Figure 1-5). Major
Themis Computer
Overview and Specifications
Overview
internal components of the RES-32XR3 Configuration 2 can be seen in the open top
view (cover removed) of Figure 1-4.
Lithium Battery
PCI Slot 1
(PCI, 32-bit/33-MHz)
2
(PCI-Express x4)
3
(PCI, 32-bit/33-MHz)
4
(PCI-Express 2.0 x16*
5
(PCI-Express 2.0 x8, in x16)
6
(PCI-Express 2.0 x8)
* X8DTi & X8DTi-F only.
PCI Card Retainer Bracket
120-mm Fan (1 of 2)
Air-Flow Deflector
Power Supply (1 of 2)
(12 DIMM Memory Modules and 2 CPUs underneath)
Front
Figure 1-4. Major Components of the RES-32XR3 Configuration 2 (Open Top View)
Themis Computer
Storage Drive (1 of 8)
CD/DVD
Combo-Drive
Housing
1-5
RES-32XR3 Installation Manual - Configuration 2
1.2 System LEDs and I/O Connectors
All RES-32XR3 system LEDs are located on the front panel (see A, Figure 1-5); all
I/O connectors are located on the rear panel (see B, Figure 1-5). LEDs are described
in Table 1-3 on page 1-7; I/O connectors are described in Table 1-4, page 1-8.
Front Panel (Doors Removed)
LEDs
A
B
PS1
Drives
Left Power
Supply
Right Power
Supply
PS2
I/O Connectors
PS/2 Mouse
Power
Fail
(PS1)
Power
Fail
(PS2)
ENET1
ENET2
<>
<>
NIC1 NIC2Hard-Disk
Rear Panel
IPMI Dedicated LAN*
C
Overheat/
Fan Fail
Power ON/OFF
Gigabit Ethernet
LAN 3 Port** LAN 4 Port**
Button
Figure 1-5. RES-32XR3 Configuration 2 System LEDs and I/O Connectors
1-6
PS/2 Keyboard
USB1 (top)
USB0 (bottom)
COM 1 Port
VGA Port
** X8DTi-LN4F motherboard only.* X8DTi-F / X8DTi-LN4F motherboards only.
LAN 2 PortLAN 1 Port
Gigabit Ethernet
Themis Computer
Overview and Specifications
ENET
System LEDs and I/O Connectors
Table 1-3. System LEDs
Symbol LED Description
ENET1
<>
2
C
Power
Storage Drive
a
NIC1
(Gb Ethernet) z Indicates network activity on LAN 1.
NIC2 (Gb Ethernet)
Power Fail
(Left Power Supply)
Power Fail
(Right Power Supply)
Overheat/Fan Fail
—Normally OFF
—RED light when tem-
perature limits are exceeded
z Indicates that the system is turned on.
z Indicates SATA II storage-drive activity.
z Indicates network activity on LAN 2.
z Warns that there is a failure in the left power
supply.
z Warns that there is a failure in the right power
supply.
z Warns that the system is exceeding specified
temperature parameters. The CPU overheat
warning function must be enabled in the BIOS,
thus allowing the user to define an overheat
temperature, which—when exceeded—triggers the overheat warning LED.
Symbol Rear Panel LED(s) Description
N/A LAN1 and LAN2
a—NIC = Network Interface Controller.
Themis Computer
Each Ethernet port contains two LEDs:
z The color of the left LED (when facing the port)
indicates the LAN connection speed:
- Off = 10 MHz
- Green = 100 MHz
- Amber = 1 GHz
z The right LED, when lit, indicates LAN activity.
1-7
RES-32XR3 Installation Manual - Configuration 2
Connector Description
Table 1-4. I/O Connectors
PS/2 Mouse
PS/2 Keyboard
USB 0 and USB 1
Hi-Speed USB 2.0
Serial Ports
COM 1 Serial Port
Super VGA Port
Ethernet LAN Ports
IPMI Dedicated LAN
Port
z 6-pin mini-DIN (female) connector to attach a PS/2 mouse device.
z 6-pin mini-DIN (female) connector to attach a PS/2 keyboard device.
z Two 4-pin USB conn ectors to attach serial devices to USB Port 0 and
USB Port 1.
Note: Two 2x5-pin USB type-A headers (2 ports each, USB4/USB5
and USB6/USB7) and 2 USB 4-pin headers (USB2 and USB3) can
be accessed directly from the motherboard.
z One DB9 (male) connector on rear panel to att ach a serial device to
COM 1 port.
Note: A second serial port (COM 2) can be accessed directly from the
motherboard.
z 15-pin SVGA connector to attach a monitor device.
z Sta nda rd RJ45 con nector to attach one or two gigabit Ethernet LAN
line(s)—LAN1 and LAN2.
Note: LAN 3 and LAN 4 are supported by the X8DT i-LN4F mother-
board only.
z Standard RJ45 connector to attach a dedicated IPMI LAN line.
(X8DTi-F and X8DTi-LN4F motherboards only).
1-8
Themis Computer
1.3 Chipset Overview
Built upon the functionality and the capability of the Intel 5520 platform,
RES-32XR3 Configuration 2 motherboards provide the performance and feature sets
required for dual processor-based high-end systems, including optimal configuration
options for communications, high-end CAD systems, presentation, storage, computation or database applications. The 5500 platform supports single or dual Xeon 64bit dual-core processors with front-side bus speeds of up to 1.333 GHz. The Intel
chipset consists of:
• the Intel 5520 (Tylersburg) chipset, and
• the ICH1 OR + IOH-36D
With the Intel QuickPath Interconnect (QPI) controller built in the processor, the
5500 Series Processor platform is the first dual-processing platform to offer the next
generation point-to-point system interconnect interface, replacing the current Front
Side Bus Technology, providing substantial system performance enhancement by
utilizing serial link interconnections, allowing for increased bandwidth and scalability. The IOH connects to each processor through an independent QuickPath Interconnect link. Each link consists of 20 pairs of unidirectional differential lanes for
transmission and receiving in addition to a differential forwarded clock. A full-width
QuickPath interconnect link pair provides 84 signals. Each processor supports two
QuickPath links, one going to the other processor and the other to the 5520 chip.
Overview and Specifications
Chipset Overview
The Intel 5520 platform supports up to 36 PCI Express Gen2 lanes, and the 5520
Northbridge supports peer-to-peer read and write transactions. The ICH10R provides up to 6 PCI-Express ports, six SATA ports and 10 USB connections. In addition, the Intel 5520 platform also offers a wide range of RAS (Reliability,
Availability and Serviceability) features. These features include memory interface
ECC, x4,/x8 Single Device Data Correction (SDDC), Cyclic Redundancy Check
(CRC), parity protection, out-of-band register access via SMBus, memory mirroring,
memory sparing, and Hot-plug support on the PCI-Express Interface.
1.3.1 The 5500/5600 Series CPU and the 5520 Chipset
• Four processor cores in each processor with 8MB shared cache among cores
• Two full-width Intel QuickPath interconnect links, up to 6.4 GT/s of data transfer
rate in each direction
• Virtualization Technology, Integrated Management Engine supported
• Point-to-point each coherent interconnect, Fast/narrow unidirectional links, and
Concurrent bi-directional traffic
• Error detection via CRC and Error correction via Link level retry
Themis Computer
1-9
RES-32XR3 Installation Manual - Configuration 2
1.4 Special Features
1.4.1 Recovery from AC Power Loss
BIOS provides a setting for you to determine how the system will respond when AC
power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back
on) or for it to automatically return to a power- on state. See the Advanced BIOS
Setup section to change this setting. The default setting is Last State.
1.5 PC Health Monitoring
This section describes the PC health monitoring features of the RES-32XR3 Configuration 2 motherboards. All have an onboard System Hardware Monitor chip that
supports PC health monitoring. An onboard voltage monitor will scan these onboard
voltages continuously:
• For the X8DTi motherboard Only: CPU1 Vcore/CPU2 Vcore, CPU1
DIMM/CPU2 DIMM, 1.5V, 3.3Vcc (V), 3.3 SB (V), 12Vcc (V), 5Vin, and Battery Voltage
Once a voltage becomes unstable, a warning is given or an error message is sent to
the screen. Users can adjust the voltage thresholds to define the sensitivity of the
voltage monitor.
1.5.1 Fan Status Monitor with Firmware Control
The PC health monitor can check the RPM status of the cooling fans. The onboard
chassis fans are controlled by Thermal Management in the BIOS (under Hardware
Monitoring in the Advanced section).
1.5.2 Environmental Temperature Control
The thermal control sensor monitors the CPU temperature in real time and will turn
on the thermal control fan whenever the CPU temperature exceeds a user-defined
threshold. The overheat circuitry runs independently from the CPU. Once it detects
that the CPU temperature is too high, it will automatically turn on the thermal fan
1-10
Themis Computer
control to prevent any overheat damage to the CPU. The onboard chassis thermal
circuitry can monitor the overall system temperature and alert users when the chassis
temperature is too high.
Caution: To avoid possible system overheating, please be sure to provide adequate
airflow to your system.
1.5.3 System Resource Alert
This feature is available when used with Supero Doctor III in the Windows OS environment or used with the Supero Doctor II in Linux. Supero Doctor is used to notify
the user of certain system events. For example, you can also configure Supero Doctor to provide you with warnings when the system temperature, CPU temperatures,
voltages and fan speeds go beyond a pre-defined range.
Overview and Specifications
ACPI Features
1.6 ACPI Features
ACPI stands for Advanced Configuration and Power Interface. The ACPI specification defines a flexible and abstract hardware interface that provides a standard way
to integrate power management features throughout a PC system, including its hardware, operating system and application software. This enables the system to automatically turn on and off peripherals such as CD-ROMs, network cards, storage
drives and printers.
In addition to enabling operating system-directed power management, ACPI provides a generic system event mechanism for Plug and Play and an operating systemindependent interface for configuration control. ACPI leverages the Plug and Play
BIOS data structures while providing a processor architecture-independent implementation that is compatible with Windows XP/Windows 2003/Windows 2008/
Windows Vista Operating Systems.
1.6.1 Slow Blinking LED for Suspend-State Indicator
When the CPU goes into a suspend state, the chassis power LED will start blinking
to indicate that the CPU is in suspend mode. When the user presses any key, the
CPU will wake-up and the LED will automatically stop blinking and remain on.
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RES-32XR3 Installation Manual - Configuration 2
1.6.2 Main Switch Override Mechanism
When an ATX power supply is used, the power button can function as a system suspend button to make the system enter a SoftOff state. The monitor will be suspended
and the hard drive (if used) will spin down. Pressing the power button again will
cause the whole system to wake-up. During the SoftOff state, the ATX power supply
provides power to keep the required circuitry in the system “alive.” In case the system malfunctions and you want to turn off the power, just press and hold the power
button for 4 seconds. This option can be set in the Power section of the BIOS Setup
routine.
1.6.3 Wake-On-LAN (WOL)
Wake-On-LAN is defined as the ability of a management application to remotely
power up a computer that is powered off. Remote PC setup, up-dates and asset tracking can occur after hours and on weekends so that daily LAN traffic is kept to a minimum and users are not interrupted. The motherboard has a 3-pin header (WOL) to
connect to the 3-pin header on a Network Interface Card (NIC) that has WOL capability. In addition, an onboard LAN controller can also support WOL without any
connection to the WOL header. The 3-pin WOL header is to be used with a LAN
add-on card only.
1-12
Note: Wake-On-LAN requires an ATX 2.01 (or above) compliant power supply.
Themis Computer
1.7 Power Supply
As with all computer products, a stable power source is necessary for proper and
reliable operation. It is even more important for processors that have high CPU clock
rates.
The RES-32XR3 Configuration 2 motherboards can accommodate 24-pin ATX
power supplies. Although most power supplies generally meet the specifications
required by the CPU, some are inadequate. In addition, the 12V 8-pin power connections are also required to ensure adequate power supply to the system. Also your
power supply must supply 1.5A for the Ethernet ports.
Caution: To prevent damage to your power supply or motherboard, please use a
power supply that contains a 24-pin and two 8-pin power connectors. Be sure to
connect these power connectors to the 24-pin and the two 8-pin power connectors
on your motherboard for adequate power supply to your system. Failure to do so
will void the manufacturer warranty on your power supply and motherboard.
Overview and Specifications
Power Supply
It is strongly recommended that you use a high quality power supply that meets ATX
power supply Specification 2.02 or above. It must also be SSI compliant (for more
information, please refer to the web site at http://www.ssiforum.org/). Additionally,
in areas where noisy power transmission is present, you may choose to install a line
filter to shield the computer from noise. It is recommended that you also install a
power surge protector to help avoid problems caused by power surges.
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RES-32XR3 Installation Manual - Configuration 2
1.8 Super I/O Controller
The Super I/O chip storage-drive adapter functions include:
• a floppy disk drive controller (industry standard 82077/765 compatible)
• a data separator
• write pre-compensation circuitry
• decode logic
• data rate selection
• clock generator
• drive interface control logic
• interrupt and DMA logic
The wide range of functions integrated onto the Super I/O greatly reduces the number of components required for interfacing with floppy disk drives. The Super I/O
supports 360K, 720K, 1.2M, 1.44M or 2.88M disk drives, and data transfer rates of
250 Kb/s, 500 Kb/s or 1 Mb/s.
It also provides two high-speed, 16550-compatible serial communication ports
(UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable baud
rate generator, complete modem control, and a processor interrupt system. Both
UARTs provide legacy speed with baud rate of up to 115.2 Kbps, and an advanced
speed with baud rates of 250 K, 500 K, or 1 Mb/s (for higher speed modems).
The Super I/O provides functions that comply with ACPI (Advanced Configuration
and Power Interface), which includes support of legacy and ACPI power management through an SMI or SCI function pin. It also features auto power management to
reduce power consumption.
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1.9 Specifications
1.9.1 General
Table 1-5 lists general specifications for the RES-32XR3 Configuration 2.
Table 1-5. RES-32XR3 Configuration 2 General Specifications
Parameter Description
Overview and Specifications
Specifications
Dimensions
Weight
19” Rack-Mountable
with Slide capability
Temperature
Operating:
Non-Operating:
Relative Humidity
Operating:
Non-Operating:
z 5.25” (3RU) high
z 17.07” (43.2 cm) wide (19” rack-mountable)
z 20” (50.8 cm) deep
z Approximately 28.5 pounds (12.9 kg), which include s all CPU
sockets filled, 6 DIMMs, 2 full-length (up to 12.25”) PCI cards,
1 CD-RW/DVD-ROM drive, 2 storage drives, and 2 power
supplies
z Add 8.8 pounds (4 kg) for the shipping container and two AC
power cords
z The manual and associated shipping paperwork weighs ap-
proximately 1 lb (0.5 kg)
z Left and right rack-mount tabs attached to chassis
z Left and right rack-mount slides are optional
z 0° up to 65° C (32° up to 149°F)
z -40° to 70° C (-40° to 158° F)
z 8% to 95% (non-condensing)
z 5 to 95% (non-condensing)
Maximum Wet Bulb
Operating:
Non-Operating:
Altitude
Operating:
Non-Operating
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z 55°C, non-condensing
z 70°C, non-condensing
z 0 to 10,000 feet above sea level
z 0 to 40,000 feet above sea level
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RES-32XR3 Installation Manual - Configuration 2
1.9.2 Electrical
Table 1-6 lists the electrical specifications for the RES-32XR3 Configuration 2.
Table 1-6. RES-32XR3 Electrical Specifications
Parameter
AC (120 volts, 750W) DC (48 volts, 750W) DC (28 volts, 500W)
Description
Input Power (typical)
z 420 watts (typical)
a
z 420 watts (typical)
a
z 450 watts (typical)
a
Input Current z 3.5 amperes @120 V ac z 13.5 amperes @48 Vdc z 16 amperes @28 Vdc
Input Frequency
Input Voltage
Input VA Rating
BTU Rating
Power Factor
Input Leakage Current
Plug Type
a—Does not include plug-in PCI cards.
b—NA = Not Applicable.
z 47–63 Hertz NA
z 100–265 Vac,
z 425 VA NA NA
z 1447 BTU/hour z 1447 BTU/hour z 1447 BTU/hour
z 0.99 NA NA
z 3.5 mA NA NA
z IEC
internally fused
b
z 40–72 Vdc,
internally fused
z Y-Type
(SVS5-4 or equivalent)
z 18–36 Vdc,
internally fused
z Y-Type
(SVS5-4 or equivalent)
NA
b
1.9.2.1 System Power
The RES-32XR3 operates with two N+1 redundant power supplies of 750-watts
capacity each that auto-range single-phase AC input from 100 to 265 VAC (47 to 63
Hertz) sources. Filtered and fused (internal) AC is supplied to each power supply
from a rear-mounted power connection.
1.9.2.2 Output Voltage
The RES-32XR3 power supply provides output voltages that are split between
+3.3V, +5V, +5Vsb, +12V, and -12V rails.
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1.9.3 Environmental
1.9.3.1 Shock
The RES-32XR3 Configuration 2 is designed to survive an elevated shock environment. All structural components are welded together, enabling the system to survive
a maximum 3-axis shock load of 35G at 25-ms duration.
1.9.3.2 Electrostatic Discharge
The RES-32XR3 is designed to tolerate electrostatic pulses up to 15 kilovolts (KV)
with no impact on system operation.
1.9.3.3 Noise
The RES-32XR3 conforms to the 54-db noise specification. It is possible to achieve
further noise reduction by installing a sound baffle (muffler) on both the front (see
Figure 1-6) and the rear (see Figure 1-7 on page 1-18) of the RES-32XR3 chassis.
Call your Themis representative for additional information.
Overview and Specifications
Specifications
Front Sound Baffle
Themis Computer
AA
Figure 1-6. RES-32XR3 with Front Sound Baffle Installed (Front View)
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RES-32XR3 Installation Manual - Configuration 2
Front Access—Opening the two front doors of the RES-32XR3 Configuration 2
requires removing the front sound baffle. To do this, loosen the two (2) captive
knurled Phillips screws holding the baffle to the chassis (see A in Figure 1-6, page
1-17) and remove the baffle.
Rear Sound Baffle
B
Left Side
B
B
RearRear
Right Side
B
B
AA AA
Figure 1-7. RES-32XR3 with Rear Sound Baffle Installed (Rear View)
Rear Access—Accessing the I/O connectors and PCI card I/O on the rear of the
RES-32XR3 Configuration 2 requires opening the rear sound baffle door. To do this,
loosen the four (4) captive knurled Phillips screws A holding the baffle door to the
chassis (see A in Figure 1-7) and swing the door downward away from the chassis,
exposing the rear connectors and PCI cards.
Removing the protective top cover for access to the interior requires that the rear
sound baffle be totally removed (this can be done with the baffle door closed). To do
this, five (5) M3x4 flathead Phillips screws B must be removed, two on each side of
the baffle and one (captive) in the middle on the top (see Figure 1-7).
After removing the rear baffle, the top cover can be removed as described in Section
2.1.1, “Remove Protective Top Cover,” on page 2-1 (Chapter 2, "Installation and
Operation").
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1.10 Packaging and Shipping
The RES-32XR3 is packaged in a reusable shipping container. Approximate weight
of an empty container and two AC power cords is 8.8 pounds (4 kg).
The approximate weight of a RES-32XR3 Configuration 2 (loaded with 2 CPUs, 6
DIMMs, 2 storage drives, 2 PCI cards, a CD-RW/DVD-ROM drive, and 2 power
supplies) is approximately 28.5 pounds (12.9 kg). [See Table 1-7 on page 1-20 for a
general weight table for all models of the RES Series of computers.]
The approximate weight of a manual and associated shipping paperwork is one
pound (0.45 kg).
Therefore, both the shipping container and a fully installed RES-32XR3 including
power cords, manual, and associated paperwork, weigh under 39 pounds (17.7 kg).
Overview and Specifications
Packaging and Shipping
Caution: Do not discard the original packaging that your system was shipped in.
The original packaging was designed specifically to withstand the stress and rigors
of today’s shipping environment. It will be needed in the event the system must be
shipped back to Themis Computer. See Appendix E, “Re-Packing Instructions”.
1.10.1 Accessory Kit
Each RES-32XR3 Configuration 2 is packaged with an Accessory Kit, consisting of
the following items:
A. A Power-cord Retainer Bracket
B. Two AC Power Cords
C. Two Storage Drive Barrel Keys
When you unpack the RES-32XR3 Configuration 2, please verify that all of these
items are included. If any of these items are missing or not as pictured, please call
Themis Technical Support at 510-252-0870, or send an email to support@themis.com.
To learn how to secure the AC power cords and the power-cord retainer bracket,
refer to Section 2.3.1, “Plugging in the AC Power Cords,” on page 2-16.
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RES-32XR3 Installation Manual - Configuration 2
1.10.2 Rack-Mount Slides (Optional)
Rack-Mount Slides can be mounted on each side of the RES-32XR3 Configuration 2
for the purpose of sliding the unit in and out of a rack. Mounting slides are optional
and can be ordered at the time of purchase. Approximate weights of models in the
RES series of computers are listed in Table 1-7.
To learn how to install rack-mount slides, refer to Appendix B, “Rack-Mount Slide
Installation”.
Table 1-7. Approximate Weights of the RES Series
Model
Weight
(Approximate)
CPU
Sockets
Depth Description
RES-12XR3 19.5 lbs (8.9 kg) 2 20” Includes:
z All CPU sockets filled
z 6 DIMMs
RES-12XR3-S 17 (7.7 kg) 2 17.07”
RES-11XR3 16.5 lbs (7.5 kg) 1 17.07”
z 2 storage drives
z 2 PCI cards
z 1 CD-RW/DVD-ROM drive
z 2 power supplies
RES-22XR3 25 lbs (11.4 kg) 2 20”
Includes:
RES-22XR3-S 23 lbs (10.4 kg) 2 17.07”
RES-22XR3/FIO 25.3 lbs (11.5 kg) 2 16”
z All CPU sockets filled
z 6 DIMMs
z 2 storage drives
z 2 PCI cards
z 1 CD-RW/DVD-ROM drive
z 2 power supplies
RES-21XR3 22.5 lbs (10.2 kg) 1 17.07”
RES-32XR3 28.5 lbs (12.9 kg) 2 20”
RES-32XR3-S 26.5 lbs (12.0 kg) 2 17.07”
RES-32XR3/FIO 29.0 lbs (13.2 kg) 2 16”
RES-31XR3 26 lbs (11.8 kg) 1 17.07”
1-20
Includes:
z All CPU sockets filled
z 6 DIMMs
z 2 storage drives
z 2 PCI cards
z 1 CD-RW/DVD-ROM drive
z 2 power supplies
Themis Computer
2RES-32XR3
Installation
Section
This chapter describes:
• How to install a memory module, storage drive, PCI card, 120-mm-fan, power
supply, and lithium battery.
Chapter
2
Installation and Operation
• Rack-mount slides
• How to turn the RES-32XR3 Configuration 2 on and off
2.1 Installation Procedures
Caution: Use industry-standard ESD grounding techniques when handling all
components. Wear an antistatic wrist strap and use an ESD-protected mat. Store
ESD-sensitive components in antistatic bags before placing them on any surface.
Handle all IC cards by the front panel or edges only.
To install or replace a storage drive, fan, or power supply, skip the next section
and proceed directly to page 2-9, page 2-12, or page 2-13, respectively. Replacement
of motherboard components require removal of the protective cover.
2.1.1 Remove Protective Top Cover
To access a motherboard component, open the RES-32XR3 as follows:
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RES-32XR3 Installation Manual - Configuration 2
1. Loosen the two captive Phillips screws holding the protective top access cover
to the rear of the RES-32XR3 Configuration 2 chassis (see A, Figure 2-1).
2. Both the front and sides of the cover have flat hooks or tabs underneath that
fit under slots on the chassis top edges (see B, Figur e 2-1). Remove the cover
by sliding it toward the rear until it is free of these chassis slots.
3. Store the cover in a safe place until it is replaced.
Rear View
2-2
Loosen the 2 captive access-cover screws . . .
A
Chassis slot
Left-side top edge
. . . and slide the top cover toward the rear until the top hooks and tabs clear all chassis slots
B
Figure 2-1.
Remove the RES-32XR3 Protective Access Cover
Chassis slot
4. Proceed to the appropriate section to install or replace a memory module
(page 2-3), PCI card (page 2-7), or lithium battery (page 2-8).
Themis Computer
2.1.2 Memory Modules
The RES-32XR3 Configuration 2 supports memory according to Table 2-1. Note the
total memory capacity varies according to the motherboard installed in the RES32XR3.
Table 2-1. RES-32XR3 Configuration 2 Memory Capacity
Installation and Operation
Installation Procedures
Memory Parameters
DIMMs
Motherboard
Capacity
X8DTi 192 GB Yes 1333/1066/800 12 240
X8DTi-F 192 GB Yes 1333/1066/800 12 240
X8DTi-LN4F 192 GB Yes 1333/1066/800 12 240
DDR3
Registered
ECC
Speed (MHz)
Number
of DIMMS
Pins per
DIMM
Caution: Exercise extreme caution when installing or removing Memory Modules
to prevent any possible damage.
Table 2-2. RES-32XR3 Configuration 2 Memory Population
CPU 1 CPU 2
Branch 0 Branch 1 Branch 3 Branch 0 Branch 1 Branch 3
6 DIMMs1A2A3A1A2A3A
12 DIMMs1A1B2A2B3A3B1A1B2A2B3A3B
When installing memory, follow these rules for best memory performance:
• It is strongly recommended that you do not mix memory modules of different
speeds, sizes, and vendors.
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RES-32XR3 Installation Manual - Configuration 2
2.1.2.1 Installation
The following procedure explains how to install the DDR3 Memory Modules.
1. Loosen and remove the seven screws securing the air-flow deflector and PCI
card retainer bracket in the following manner: (see Figure 2-2).
• Screw A—After removing Screw A, remove the PCI card retainer bracket
and store in a safe place.
• Screw B—The screw marked “B” in Figure 2-2 is recessed. Remove it
with a long-shank magnetic Phillips screwdriver.
C C
PCI Card Retainer Bracket
C
A
C
C
2-4
Figure 2-2.
B
Remove the Air-Flow Deflector Screws
Themis Computer
CPU 2 Socket
Installation and Operation
Installation Procedures
• Screw C—Remove the five screws marked “C” in Figure 2-2 on page 2-4,
which will loosen the air-flow diverter so that it can be removed from the
system. After the air-flow diverter has been removed, the memory module
slots will be exposed (see Figure 2-3).
Branch 0
Branch 1
Branch 2
Branch 0
Branch 1
Branch 2
P2 DIMM 1B
P2 DIMM 1A
P2 DIMM 2B
P2 DIMM 2A
P2 DIMM 3B
P2 DIMM 3A
P1 DIMM 1B
P1 DIMM 1A
P1 DIMM 2B
P1 DIMM 2A
P1 DIMM 3B
P1 DIMM 3A
CPU 1 Socket
2. If a module is already seated in the slot you have selected for installation,
remove it by gently pressing down and outward on the latches at both ends of
the slot (see Figure 2-4 on page 2-6), then pulling the old module directly up
from the slot until it is free of the connector (see Figure 2-4).
Themis Computer
Figure 2-3. Memory Module Slot Locations
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RES-32XR3 Installation Manual - Configuration 2
Press latch
downward &
outward at
each end
Figure 2-4. Memory Module Removal
3. Before inserting a new memory module into the vacant slot, make sure that
the two latches are pulled outward away from the center of the slot.
With the latches in the outward position, gently insert the new module verti-
cally into its slot and press firmly downward until it snaps into place.
Note: Make sure the memory module has the proper orientation by aligning the alignment notch at the bottom edge with its counterpart ridge at
the bottom of the slot.
4. If all the memory modules have been replaced in the system, replace the air
flow diverter and secure it with the six screws previously removed.
5. Replace the PCI card retainer bracket and secure it with the single screw
removed in Step 1 on page 2-4.
6. If installation of motherboard components is completed, close the
RES-32XR3 chassis by refastening the top cover removed in Section 2.1.1,
“Remove Protective Top Cover”, on page 2-1.
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2.1.3 PCI Cards
RES-32XR3 Configuration 2 supports two 32-bit/33-MHz PCI slots, one PCIExpress 2.0 x16 slot, two PCI-Express 2.0 x8 slots, and one PCI-Express x4 Slot. All
slots support cards up to 12.28-inches long.
Installation and Operation
Installation Procedures
Slot
Lithium Battery
PCI 32-bit/33-MHz Slot
PCI-Express x4 Slot
PCI 32-bit/33-MHz Slot
PCI Express 2.0 x16 Slot
PCI-Express 2.0 x8 Slot
PCI-Express 2.0 x8 Slot
(in x16 Slot)
Figure 2-5. PCI Card Installation, RES-32XR3 Configuration 2
2.1.3.1 Installing Cards
1
23456
Perform the following steps to install a PCI card:
1. Loosen the captive knurled screw on the PCI card clamp (see A, Figure 2-6).
Captive knurled screw
Loosen the captive knurled screw . . .
Themis Computer
PCI card clamp PCI card I/O panels (7 total)
. . . and swing the PCI card clamp upward.
BA
Figure 2-6. PCI Card Clamp
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RES-32XR3 Installation Manual - Configuration 2
2. Swing the PCI card clamp away from the top of the chassis, exposing the tops
of the PCI card I/O panels (see B, Figure 2-6)
3. Locate the empty slot within which a card will be installed (see Figure 2-5).
4. Install the new card, making sure the I/O panel is aligned with the chassis
opening.
5. Repeat Step 3 and Step 4 until all additional cards have been installed.
6. Swing the PCI card clamp back to its position over the PCI card I/O panels
and tighten the captive knurled screw on the PCI card clamp.
7. Attach any internal I/O cables to the installed PCI cards, and carefully fold
and tuck any exposed ribbon cables into the cabinet.
8. If you have no further installations to perform, close the RES-32XR3 chassis
by refastening the top cover removed in Section 2.1.1, “Remove Protective
Top Cover,” on page 2-1.
2.1.4 Lithium Battery
2.1.4.1 Removing the Lithium Battery
Perform the following steps to remove the lithium battery:
1. Make sure the system is powered off (see “Operation” on page 2-16).
2. Locate the lithium battery socket and squeeze the latch (see A, Figure 2-7)
together until the battery lifts out of its socket.
Battery
Latch
AB
To release, squeeze battery latch together . . .
Figure 2-7.
2-8
. . . and remove battery from socket
The RES-32XR3 Configuration 2 Lithium Battery and Socket
Themis Computer
3. Remove the old battery and replace with a new battery (see next section).
2.1.4.2 Installing a Lithium Battery
Perform the following steps to insert a new lithium battery:
1. Tilt the replacement battery into the empty socket so that it is angled under the
battery latch (see B, Figure 2-7).
2. Carefully press down on the battery until it clicks firmly into place.
2.1.5 SATA II Storage Drive
Perform the following steps to remove and install a SATA II storage drive. The front
doors of the RES-32XR3 Configuration 2 must be unlocked and opened to access
the storage drives (see Figure 2-8).
Installation and Operation
Installation Procedures
Knurled
Screw
Figure 2-8.
Opening the RES-32XR3 Front Bezel Doors
Note: SAS drives are not supported by Configuration 2 motherboards. For SA TA
II drives, the upper left-hand removable storage drive (SATA II ID0) is designated as the boot drive.
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RES-32XR3 Installation Manual - Configuration 2
2.1.5.1 Opening the RES-32XR3 Front Doors
The knurled captive screw on the front of the RES-32XR3 Configuration 2 allows
the doors to lock without a key. To unlock the doors, turn the screw counterclockwise and pull both doors away from the chassis.
The accessory kit shipped with your RES-32XR3 contains two barrel lock keys. This
provides you with the option of unlocking/locking the storage drives.
Drive 0
Drive 4
Drive Release
Button
Drive 1
Drive 5
Drive Lock
(one per drive)
Figure 2-9. Unlocking the RES-32XR3 Configuration 2 S torage Drives (Front Doors
2.1.5.2 Storage-Drive Removal
After opening the front doors, perform the following steps to remove and install a
storage drive:
1. Make sure the system is powered off (see “Operation” on page 2-16).
2. Locate the drive to be removed.
3. Insert the barrel lock key into the storage drive you want to remove, and turn
it 45 degrees clockwise (presuming the storage drive is locked); see A in
Figure 2-10 on page 2-11.
Drive 2
Drive 6
Removed)
Drive 3
Drive 7
4. Firmly push in the latch lock until the latch handle releases away from the
drive (see B in Figure 2-10).
2-10
Themis Computer
5. Grab the latch handle and pull the drive completely away from its slot (see C
Insert key into barrel lock and turn A
45 degrees clockwise, . . .
Installation and Operation
Installation Procedures
in Figure 2-10).
Caution: When pulling the storage drive from the chassis, hold it at the bottom to prevent it from falling and damaging the drive.
B
. . . push the latch lock, . . .
Latch
Lock
C
. . . and pull drive out with the latch handle
Figure 2-10. RES-32XR3 Storage Drive Removal
2.1.5.3 Storage-Drive Installation
To install a storage drive,
1. Make sure the latch handle of the drive to be installed is in the open position.
2. Properly orient the new drive and insert it into the vacant drive slot. If the
drive cannot be inserted into the slot, rotate it 180 degrees.
3. Push the drive toward the rear (DO NOT CLOSE the latch handle while push-
ing) until the drive is flush with the front of the chassis. The handle will swing
closed when it comes into contact with the RES-32XR3 chassis.
4. When the drive is fully inserted in its slot, insert the key into the barrel lock
and turn it 45 degrees counter-clockwise. The drive is now locked.
Caution: When in the closed position, the latch handle secures the drive to the
chassis. If the handle is closed before the drive is fully inserted, the latch mechanism
may not fully engage to secure the drive.
Latch Handle
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RES-32XR3 Installation Manual - Configuration 2
2.1.6 Removable 120-mm Fan
RES-32XR3 Configuration 2 contains two high-speed 120-mm fans. Both fans are
removable for replacement in case of a fan failure.
Note: Since RES-32XR3 fans are “hot-swappable”, it is not necessary to turn off
system power in order to remove and replace a fan,
2.1.6.1 Removing and Installing a 120-mm Fan
Perform the following steps to remove and install a 120-mm fan:
1. On the top cover of the chassis, push the fan lid lock left to unlock the fan lid
(see Figure 2-11). Pull the fan lid upward exposing the two 120-mm fans.
2. Each fan is secured by a locking latch on the left hand side. To remove a fan,
press the latch lock toward the center of the fan with the left hand index finger .
With the right hand index finger, press on the right hand side of the fan and
pull the fan directly upward from the RES-32XR3 chassis.
Hinged Fan Lid
120-mm Fan
Locking Stud (1 of 3)
Latch Lock
Fan Lid Lock
120-mm Fan
Figure 2-11. The Dual RES-32XR3 Configuration 2 120-mm Fans
3. When the fan is removed, its 4-wire connector will automatically disconnect
from the chassis. Insert the replacement fan carefully into the empty fan slot
until it is flush with the second fan. The 4-wire connector will automatically
engage its counterpart connector successfully.
2-12
Themis Computer
2.1.7 Power Supply
Each load-sharing (N+1 redundant) power supply can be hot-swapped while the system is still on and operational.
2.1.7.1 Removing a Power Supply
Perform the following steps to remove a power supply:
1. Remove the two captive Phillips screws holding the power supply locking
bracket to the chassis (see A in Figure 2-12). Store the bracket for later use.
Knurled captive Phillips screw
Installation and Operation
Installation Procedures
Knurled captive Phillips screw
Power supply locking bracket
Remove power supply locking bracketA
. . . then disengage locking lever and remove power supplyB
Power Supply
Locking Lever
Phillips Screw Hole
for knurled captive screw
on power supply
locking bracket
Extraction
Handle
Push right to release power supply
Power LED
AC Outlet
Phillips Screw Hole
(for power supply locking bracket)
Figure 2-12. The RES-32XR3 Power Supply Locking Mechanism
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RES-32XR3 Installation Manual - Configuration 2
2. Put the right index finger on the power supply extraction handle and the right
thumb on the left side of the power supply locking lever.
3. Squeeze the locking lever toward the extraction handle and firmly pull the
power supply from the chassis.
Caution: When pulling the power supply from the chassis, hold it at the bottom to prevent it from falling and damaging the unit.
2.1.7.2 Installing a Power Supply
Perform the following steps to install a power supply:
1. Insert the replacement power supply into an empty slot with the extraction
handle facing to the right and the power LED at the top (see Figure 2-12 on
page 2-13).
2. Push the power supply carefully into its slot until it is firmly seated (a click
will be heard when the locking lever is securely fastened to the chassis).
3. Replace the power supply locking bracket and tighten the two captive Phillips
screws (see Figure 2-12) to firmly secure both power supplies.
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2.2 Rack Mounts
2.2.1 Mounting Brackets
The rack-mount brackets (flanges) are used to secure the chassis to the 19” rack (see
Figure 2-13). Handles are used to pull the RES-32XR3 from the rack when rackmount slides have been installed on the sides of the chassis (see following section).
Installation and Operation
Rack Mounts
Figure 2-13.
Right Rack-Mount Bracket
2.2.2 Rack-Mount Slides (Optional)
Rack-Mount Slides can be mounted on each side of the RES-32XR3 Configuration 2
for the purpose of sliding the unit in and out of a rack. Mounting slides are optional
and should be ordered at the time your system is purchased.
To learn how to install rack-mount slides, refer to Appendix B, “Rack-Mount Slide
Installation”.
Caution: Any screws used to mount a slide to a RES-32XR3 chassis must not exceed a length of 3/8” to prevent excessive penetration of the chassis.
Right Mounting
Bracket
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2.3 Operation
2.3.1 Plugging in the AC Power Cords
Before powering on the RES-32XR3, plug in the AC power cords as follows:
1. On the rear of the RES-32XR3, plug an AC power cord (shipped with unit)
into the AC power socket on each power supply (see Figure 2-14).
Locking Lever
Power LED
AC Power Socket
Figure 2-14. AC Power Socket and LED on the RES-32XR3 Rear
2.3.2 Turning the System On
1. Plug the AC power cord from each of the RES-32XR3 Configuration 2 power
supplies into a “live” AC outlet.
The LED on each power supply will turn on when AC power is enabled.
2. On the front of the RES-32XR3, push the system power on/off button (see
Figure 2-15). This will cause the system POWER LED to light (green).
Power LED
System Power
On/Off Button
Figure 2-15. System Power Button and LED on the RES-32XR3 Front
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2.3.3 Getting Started
2.3.3.1 Configuration
1. Make sure all storage drives are installed (see “SATA II Storage Drive” on
page 2-9). Drive ID numbers are shown in Figure 1-3 on page 1-4, Chapter 1.
Changes may be made through the BIOS.
2. Make sure that a graphics card is installed in a PCI-Express slot; see
Figure 2-5 on page 2-7) and connect a multiscan monitor to the SVGA or DVI
connector.
3. Attach a PS/2 keyboard and mouse to the appropriate connectors on the rear
I/O panel of the RES-32XR3 Configuration 2 (see Figure 1-5 on page 1-6)
4. Turn the system on (see previous section).
Installation and Operation
Operation
2.3.3.2 Linux Installation
The process of installing the Linux operating system onto the RES-32XR3 is
detailed in Appendix C, “Red Hat Enterprise Linux 5 Installation”.
2.3.4 Turning the System Off
Caution: Before turning your system off, make sure to save all open files, properly
close applications, and broadcast a warning to all users on any active networks.
1. To turn the RES-32XR3 power off, press and hold the system power on/off
button (see Figure 2-15, page 2-16) for at least four (4) seconds. This will shut
down the system and turn off the POWER LED.
As an alternative, a modern operating system (Windows 9x or more recent
and Linux, for example) can turn off the system after a graceful OS software
shutdown.
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2RES-32XR3
Installation
Section
3.1 Introduction
This chapter describes the AMI BIOS Setup Utility for the RES-32XR3 motherboards. The AMI ROM BIOS is stored in a Flash EEPROM and can be easily
updated. This chapter describes the basic navigation of the AMI BIOS Setup Utility
setup screens.
Chapter
3
BIOS Setup Utility
3.1.1 Starting BIOS Setup Utility
To enter the AMI BIOS Setup Utility screens, press the <Delete> key while the system is booting up.
Note: In most cases, the <Delete> key is used to invoke the AMI BIOS setup
screen. There are a few cases when other keys are used, such as <F1>, <F2>, etc.
Each main BIOS menu option is described in this manual. The Main BIOS setup
menu screen has two main frames. The left frame displays all the options that can be
configured. Grayed-out options cannot be configured. Options in blue can be configured by the user. The right frame displays the key legend. Above the key legend is an
area reserved for a text message. When an option is selected in the left frame, it is
highlighted in white. Often a text message will accompany it
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.
Note: The AMI BIOS has default text messages built in. Supermicro retains the
option to include, omit, or change any of these text messages.
The AMI BIOS Setup Utility uses a key-based navigation system called “hot keys”.
Most of the AMI BIOS setup utility “hot keys” can be used at any time during the
setup navigation process. These keys include <F1>, <F10>, <Enter>, <ESC>, arrow
keys, etc.
Note: Options printed in Bold are default settings.
3.1.2 How To Change the Configuration Data
The configuration data that determines the system parameters may be changed by
entering the AMI BIOS Setup utility. This Setup utility can be accessed by pressing
<Del> at the appropriate time during system boot.
3.1.3 Starting the Setup Utility
Normally, the only visible Power-On Self-Test (POST) routine is the memory test.
As the memory is being tested, press the <Delete> key to enter the main menu of the
AMI BIOS Setup Utility. From the main menu, you can access the other setup
screens. An AMI BIOS identification string is displayed at the left bottom corner of
the screen below the copyright message.
Caution: Do not upgrade the BIOS unless your system has a BIOS-related issue.
Flashing the wrong BIOS can cause irreparable damage to the system. In no event
shall Supermicro be liable for direct, indirect, special, incidental, or consequential
damages arising from a BIOS update. If you have to update the BIOS, do not shut
down or reset the system while the BIOS is updating. This is to avoid possible boot
failure.
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3.2 Main Setup
When you first enter the AMI BIOS Setup Utility, you will enter the Main setup
screen. You can always return to the Main setup screen by selecting the Main tab on
the top of the screen. The Main BIOS Setup screen is shown below.
BIOS Setup Utility
Main Setup
3.2.1 System Overview
The following BIOS information will be displayed:
3.2.1.1 System Time/System Date
Use this option to change the system time and date. Highlight System T ime or System
Date using the arrow keys. Enter new values through the keyboard and press
<Enter>. Press the <Tab> key to move between fields. The date must be entered in
Day MM/DD/YY format. The time is entered in HH:MM:SS format.
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Figure 3-1. Main BIOS Setup Screen
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Note: The time is in the 24-hour format. For example, 5:30 P.M. appears as
17:30:00.).
3.2.1.2 Supermicro X8DT3
BIOS Build Version: This item displays the BIOS revision used in your system.
BIOS Build Date: This item displays the date when this BIOS was completed. AMI
BIOS Core Version: This item displays the revision number of the AMI BIOS Core
upon which your BIOS was built.
3.2.1.3 Processor
The AMI BIOS will automatically display the status of the processor used in your
system:
• CPU Type: This item displays the type of CPU used in the motherboard.
• Speed: This item displays the speed of the CPU detected by the BIOS.
• Physical Count: This item displays the number of processors installed in your
system as detected by the BIOS.
• Logical Count: This item displays the number of CPU Cores installed in your
system as detected by the BIOS.
• Micro_code Revision: This item displays the revision number of the BIOS
Micro_code used in your system.
3.2.1.4 System Memory
This displays the size of memory available in the system:
• Size: This item displays the memory size detected by the BIOS.
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3.3 Advanced Setup Configurations
Use the arrow keys to select Boot Setup and hit <Enter> to access the submenu
items:
BIOS Setup Utility
Advanced Setup Configurations
3.3.1 BOOT Features
3.3.1.1 Quick Boot
If Enabled, this option will skip certain tests during POST to reduce the time needed
for system boot. The options are Enabled (default) and Disabled.
3.3.1.2 Quiet Boot
This option allows the bootup screen options to be modified between POST messages or the OEM logo. Select Disabled to display the POST messages. Select
Enabled to display the OEM logo instead of the normal POST messages. The
options are Enabled (default) and Disabled.
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Figure 3-2.
Advanced Settings Screen
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3.3.1.3 AddOn ROM Display Mode
This sets the display mode for the Option ROM. Select Keep Current to use the current AddOn ROM Display setting. Select Force BIOS to use the Option ROM display mode set by the system BIOS. The options are Force BIOS (default) and Keep
Current.
3.3.1.4 Bootup Num-Lock
This feature selects the Power-on state for Numlock key. The options are Off and
On (default).
3.3.1.5 Wait For 'F1' If Error
This forces the system to wait until the 'F1' key is pressed if an error occurs. The
options are Disabled and Enabled (default).
3.3.1.6 Hit 'Del' Message Display
This feature displays “Press DEL to run Setup” during POST. The options are
Enabled (default) and Disabled.
3.3.1.7 Interrupt 19 Capture
Interrupt 19 is the software interrupt that handles the boot disk function. When this
item is set to Enabled, the ROM BIOS of the host adaptors will “capture” Interrupt
19 at boot and allow the drives that are attached to these host adaptors to function as
bootable disks. If this item is set to Disabled, the ROM BIOS of the host adaptors
will not capture Interrupt 19, and the drives attached to these adaptors will not function as bootable devices. The options are Enabled (default) and Disabled.
3.3.2 Power Configuration
3.3.2.1 Power Button Function
If set to Instant_Off, the system will power off immediately as soon as the user hits
the power button. If set to 4_Second_Override, the system will power off when the
user presses the power button for 4 seconds or longer. The options are Instant_Off
(default) and 4_Second_Override.
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3.3.2.2 Restore on AC Power Loss
Use this feature to set the power state after a power outage.
• Select Power-Off for the system power to remain off after a power loss.
• Select Power-On for the system power to be turned on after a power loss.
• Select Last State to allow the system to resume its last state before a power
loss. The options are Power-On, Power-Off and Last State (default).
3.3.2.3 Watch Dog Timer
If enabled, the Watch Dog Timer will allow the system to reboot when it is inactive
for more than 5 minutes. The options are Enabled and Disabled (default).
3.3.3 Processor and Clock Options
BIOS Setup Utility
Advanced Setup Configurations
This submenu allows the user to configure the Processor and Clock settings.
3.3.3.1 C1E Support
Select Enabled to use the feature of Enhanced Halt State. C1E significantly reduces
the CPU's power consumption by reducing the CPU's clock cycle and voltage during
a “Halt State.” The options are Disabled and Enabled (default).
3.3.3.2 Hardware Prefetcher (Available when supported by the CPU)
If set to Enabled, the hardware pre fetcher will pre fetch streams of data and instructions from the main memory to the L2 cache in the forward or backward manner to
improve CPU performance. The options are Disabled and Enabled (default).
3.3.3.3 Adjacent Cache Line Prefetch (Available when supported by
the CPU)
The CPU fetches the cache line for 64 bytes if this option is set to Disabled. The
CPU fetches both cache lines for 128 bytes as comprised if Enabled (default).
3.3.3.4 Intel® Virtualization Technology (Available when supported by
the CPU)
Select Enabled to use the feature of Virtualization Technology to allow one platform
to run multiple operating systems and applications in independent partitions, creat-
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ing multiple “virtual” systems in one physical computer. The options are Enabled
(default) and Disabled.
Note: If there is any change to this setting, you will need to power off and restart
the system for the change to take effect. Please refer to Intel’s website for detailed
information.
3.3.3.5 Execute-Disable Bit Capability (Available when supported by
the OS and the CPU)
Set to Enabled to enable the Execute Disable Bit which will allow the processor to
designate areas in the system memory where an application code can execute and
where it cannot, thus preventing a worm or a virus from flooding illegal codes to
overwhelm the processor or damage the system during an attack. The default is
Enabled (default). (Refer to Intel and Microsoft Web Sites for more information.)
3.3.3.6 Simultaneous Multi-Threading (Available when supported by
the CPU)
Set to Enabled to use the Simultaneous Multi-Threading Technology, which will
result in increased CPU performance. The options are Disabled and Enabled
(default).
3.3.3.7 Active Processor Cores
Set to Enabled to use a processor's Second Core and beyond. (Please refer to Intel's
web site for more information.) The options are All (default), 1 and 2.
3.3.3.8 Intel® Speed_Step™ Technology
EIST (Enhanced Intel SpeedStep Technology) allows the system to automatically
adjust processor voltage and core frequency in an effort to reduce power consumption and heat dissipation. Please refer to Intel’s web site for detailed information.
The options are Disable (Disable GV3) and Enable (Enable GV3) (default).
3.3.3.9 Intel® C-STATE Tech
If enabled, C-State is set by the system automatically to either C2, C3 or C4 state.
The options are Disabled (default) and Enabled.
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3.3.3.10 Clock Spread Spectrum
Select Enable to use the feature of Clock Spectrum, which will allow the BIOS to
monitor and attempt to reduce the level of Electromagnetic Interference caused by
the components whenever needed. The options are Disabled (default) and Enabled.
3.3.4 Advanced Chipset Control
The items included in the Advanced Settings submenu are listed below:
CPU Bridge Configuration
3.3.5 QPI Links Speed
This feature selects QPI's data tr ansfer speed. The options are Slow-mode, and Full
Speed (default).
BIOS Setup Utility
Advanced Setup Configurations
3.3.5.1 QPI Frequency
This selects the desired QPI frequency. The options are Auto (default), 4.800 GT,
5.866GT, 6.400 GT.
3.3.5.2 QPI L0s and L1
This enables the QPI power state to low power. L0s and L1 are automatically
selected by the motherboard. The options are Disabled (default) and Enabled.
3.3.5.3 Memory Frequency
This feature forces a DDR3 frequency slower than what the system has detected.
The available options are Auto (default), Force DDR-800, Force DDR-1066, Force
DDR-1333 and Force SPD.
3.3.5.4 Memory Mode
The options are Independent (default), Channel Mirror, Lockstep and Sparing.
• Independent - All DIMMs are available to the operating system.
• Channel Mirror - The motherboard maintains two identical copies of all data in
memory for redundancy.
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• Lockstep - The motherboard uses two areas of memory to run the same set of
operations in parallel.
• Sparing - A preset threshold of correctable errors is used to trigger fail-over.
The spare memory is put online and used as active memory in place of the
failed memory.
3.3.5.5 Demand Scrubbing
A memory error-correction scheme where the Processor writes corrected data back
into the memory block from where it was read by the Processor. The options are
Enabled and Disabled (default).
3.3.5.6 Patrol Scrubbing
A memory error-correction scheme that works in the background looking for and
correcting resident errors. The options are Enabled and Disabled (default).
3.3.5.7 Throttling - Closed Loop / Throttling - Open Loop
Throttling improves reliability and reduces power in the processor by automatic
voltage control during processor idle states. Available options are Disabled (default)
and Enabled. If Enabled, the following items will appear:
Hysteresis Temperature (Closed Loop Only)
Temperature Hysteresis is the temperature lag (in degrees Celsius) after the set
DIMM temperature threshold is reached before Closed Loop Throttling begins. The
options are Disabled, 1.5oC (default), 3.0oC, and 6.0oC.
Guardband Temperature (Closed Loop Only)
This is the temperature which applies to the DIMM temperature threshold. Each step
is in 0.5oC increment. The default is [006] (default). Press “+” or “-” on your keyboard to change this value.
Inlet Temperature
This is the temperature detected at the chassis inlet. Each step is in 0.5oC increment.
The default is [070]. Press “+” or “-” on your keyboard to change this value.
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BIOS Setup Utility
Advanced Setup Configurations
Temperature Rise
This is the temperature rise to the DIMM thermal zone. Each step is in 0.5oC increment. The default is [020] (default). Press “+” or “-” on your keyboard to change this
value.
Air Flow
This is the air flow speed to the DIMM modules. Each step is one mm/sec. The
default is [1500] (default). Press “+” or “-” on your keyboard to change this value.
Altitude
This feature defines how many meters above or below sea level the system is
located. The options are Sea Level or Below (default), 1~300, 301~600, 601~900,
901~1200, 1201~1500, 1501~1800, 1801~2100, 2101~2400, 2401~2700,
2701~3000.
DIMM Pitch
This is the physical space between each DIMM module. Each step is in 1/1000 of an
inch. The default is [400] (default). Press “+” or “-” on your keyboard to change this
value.
3.3.6 Northbridge Configuration
This feature allows the user to configure the settings for the Intel Northbridge chip.
3.3.6.1 Crystal Beach / DMA (Direct Memory Access)
This feature works in conjunction with the Intel I/O AT (Acceleration Technology)
to accelerate the performance of TOE devices.
Note: A TOE device is a specialized, dedicated processor that is installed on an
add-on card or a network card to handle some or all packet processing of this addon card.
When this feature is set to Enabled, it will enhance overall system performance by
providing direct memory access for data transferring. The options are Enabled and
Disabled (default).
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3.3.6.2 Crystal Beach / DCA (Direct Cache Access)
This feature works in conjunction with the Intel I/O AT (Acceleration Technology)
to accelerate the performance of the TOE device. When this feature set to Enabled, it
will enhance overall system performance by providing direct cache access for data
transferring. The options are Enabled and Disabled (default).
3.3.6.3 NUMA Support
Select Enabled to use the feature of Non-Uniform Memory Access to improve CPU
performance. The options are Enabled (default) and Disabled.
3.3.6.4 Intel VT-d
Select Enabled to enable Intel's Virtualization Technology support for Direct I/O
VT-d by reporting the I/O device assignments to VMM through the DMAR ACPI
Tables. This feature offers fully-protected I/O resource-sharing across the Intel platforms, providing the user with greater reliability, security and availability in networking and data-sharing. The settings are Enabled and Disabled (default).
3.3.7 Southbridge Configuration
This feature allows the user to configure the settings for the Intel ICH Southbridge
chipset.
3.3.7.1 USB Functions
Select the number of onboard USB ports to be enabled. The Options are: Disabled, 2
USB ports, 4 USB ports, 6 USB ports, 8 Ports, 10 Ports and 12 USB ports (default).
3.3.7.2 Legacy USB Support
Select Enabled to use Legacy USB devices. If this item is set to Auto, Legacy USB
support will be automatically enabled if a legacy USB device is installed on the
motherboard, and vise versa. The settings are Disabled, and Enabled (default).
3.3.7.3 USB 2.0 Controller
Select Enabled to activate the onboard USB 2.0 controller. The options are Enabled
(default) and Disabled. (The manufacturer's default setting is Enabled. This setting
cannot be changed by the user.)
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3.3.7.4 USB 2.0 Controller Mode
This setting allows you to select the USB 2.0 Controller mode. The options are HiSpeed (480 Mbps) (default) and Full Speed (12 Mbps).
3.3.7.5 BIOS EHCI Hand-Off
Select Enabled to enable BIOS Enhanced Host Controller Interface support to provide a workaround solution for an operating system that does not have EHCI HandOff support. When enabled, the EHCI Interface will be changed from the BIOS-controlled to the OS-controlled. The options are Disabled and Enabled (default).
3.3.7.6 HDA Controller
Select Enabled to activate the onboard High-Definition Audio controller. The
options are Enabled (default) and Disabled.
BIOS Setup Utility
Advanced Setup Configurations
3.3.7.7 Reserved Page Rout
Select PCI to use PCI communication mode for the USB connections. Select LPC to
use LPC mode for the USB connections. The options are PCI (default) and LPC.
3.3.8 IDE/SATA Configuration
When this submenu is selected, the AMI BIOS automatically detects the presence of
the IDE devices and displays the following items:
3.3.8.1 SATA#1 Configuration
If Compatible is selected, it sets SATA#1 to legacy compatibility mode, while
selecting Enhanced sets SATA#1 to nati ve SATA mode. The options are Disabled,
Compatible, and Enhanced (default).
3.3.8.2 Configure SATA#1 as
This feature allows the user to select the drive type for SAT A#1. Select RAID (Intel)
to enable Intel's SATA RAID firmware to configure Intel's SATA RAID settings.
Select RAID (Adaptec) to enable Adaptec's SATA RAID firmware to configure
Adaptec's SATA RAID settings. Select AHCI to enable SATA Advanced Host
Interface.
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Caution: Take caution when using this function. This feature is for advanced programmers only.
The options are IDE (default), RAID (Intel), RAID (Adaptec) and AHCI.
3.3.8.3 SATA#2 Configuration
Selecting Enhanced will set SATA#2 to native SATA mode. The options are Disabled, and Enhanced (default).
3.3.8.4 Primary IDE Master / Slave, Secondary IDE Master / Slave,
Third IDE Master, and Fourth IDE Master
These settings allow the user to set the parameters of Primary IDE Master/Slave,
Secondary IDE Master/Slave, Third and Fourth IDE Master slots. Hit <Enter> to
activate the following submenu screen for detailed options of these items. Set the
correct configurations accordingly. The items included in the submenu are:
Type
Select the type of device connected to the system. The options are Not Installed,
Auto (default), CD/DVD and ARMD.
LBA / Large Mode
LBA (Logical Block Addressing) is a method of addressing data on a storage drive.
In the LBA mode, the maximum drive capacity is 137 GB. For drive capacities over
137 GB, your system must be equipped with a 48-bit LBA mode addressing. If not,
contact your manufacturer or install an ATA/133 IDE controller card that supports
48-bit LBA mode. The options are Disabled and Auto (default).
3.3.8.5 Block (Multi-Sector Transfer)
Block Mode boosts the IDE drive performance by increasing the amount of data
transferred. Only 512 bytes of data can be transferred per interrupt if Block Mode is
not used. Block Mode allows transfers of up to 64 KB per interrupt. Select Disabled
to allow data to be transferred from and to the device one sector at a time. Select
Auto to allow data transfer from and to the device occur multiple sectors at a time if
the device supports it. The options are Auto (default) and Disabled.
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3.3.8.6 PIO Mode
The IDE PIO (Programmable I/O) Mode programs timing cycles between the IDE
drive and the programmable IDE controller. As the PIO mode increases, the cycle
time decreases. The options are Auto (default), 0, 1, 2, 3, and 4.
Select Auto to allow the AMI BIOS to automatically detect the PIO mode. Use this
value if the IDE storage drive support cannot be determined.
Select 0 to allow the AMI BIOS to use PIO mode 0. It has a data transfer rate of 3.3
MBs.
Select 1 to allow the AMI BIOS to use PIO mode 1. It has a data transfer rate of 5.2
MBs.
Select 2 to allow the AMI BIOS to use PIO mode 2. It has a data transfer rate of 8.3
MBs.
Select 3 to allow the AMI BIOS to use PIO mode 3. It has a data transfer rate of 11.1
MBs.
BIOS Setup Utility
Advanced Setup Configurations
Select 4 to allow the AMI BIOS to use PIO mode 4. It has a data transfer bandwidth
of 32-Bits. Select Enabled to enable 32-Bit data transfer.
3.3.8.7 DMA Mode
Select Auto to allow the BIOS to automatically detect IDE DMA mode when the
IDE storage drive support cannot be determined.
Select SWDMA0 to allow the BIOS to use Single Word DMA mode 0. It has a data
transfer rate of 2.1 MBs.
Select SWDMA1 to allow the BIOS to use Single Word DMA mode 1. It has a data
transfer rate of 4.2 MBs.
Select SWDMA2 to allow the BIOS to use Single Word DMA mode 2. It has a data
transfer rate of 8.3 MBs.
Select MWDMA0 to allow the BIOS to use Multi Word DMA mode 0. It has a data
transfer rate of 4.2 MBs.
Select MWDMA1 to allow the BIOS to use Multi Word DMA mode 1. It has a data
transfer rate of 13.3 MBs.
Select MWDMA2 to allow the BIOS to use Multi-Word DMA mode 2. It has a data
transfer rate of 16.6 MBs.
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Select UDMA0 to allow the BIOS to use Ultra DMA mode 0. It has a data transfer
rate of 16.6 MBs. It has the same transfer rate as PIO mode 4 and Multi Word DMA
mode 2.
Select UDMA1 to allow the BIOS to use Ultra DMA mode 1. It has a data transfer
rate of 25 MBs.
Select UDMA2 to allow the BIOS to use Ultra DMA mode 2. It has a data transfer
rate of 33.3 MBs.
Select UDMA3 to allow the BIOS to use Ultra DMA mode 3. It has a data transfer
rate of 66.6 MBs.
Select UDMA4 to allow the BIOS to use Ultra DMA mode 4. It has a data transfer
rate of 100 MBs.
Select UDMA5 to allow the BIOS to use Ultra DMA mode 5. It has a data transfer
rate of 133 MBs.
Select UDMA6 to allow the BIOS to use Ultra DMA mode 6. It has a data transfer
rate of 133 MBs. The options are Auto (default), SWDMAn, MWDMAn, and
UDMAn.
3.3.8.8 S.M.A.R.T. For Storage drives
Self-Monitoring Analysis and Reporting Technology (SMART) can help predict
impending drive failures. Select Auto to allow the AMI BIOS to automatically
detect storage drive support. Select Disabled to prevent the AMI BIOS from using
the S.M.A.R.T. Select Enabled to allow the AMI BIOS to use the S.M.A.R.T. to support storage drive disk. The options are Disabled, Enabled, and Auto (default).
3.3.8.9 32 Bit Data Transfer
Select Enable to enable the function of 32-bit IDE data transfer. The options are
Enabled (default) and Disabled.
3.3.8.10 Hot Plug
Select Enable to enable the hot plug function for the SATA devices. The options are
Enabled (default) and Disabled.
3.3.8.11 IDE Detect Timeout (sec)
Use this feature to set the time-out value for the BIOS to detect the ATA, ATAPI
devices installed in the system. The options are 0 (sec), 5, 10, 15, 20, 25, 30, and 35
(default).
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3.3.9 PCI/PnP Configuration
3.3.9.1 Clear NVRAM
This feature clears the NVRAM during system boot. The options are No (default)
and Yes.
3.3.9.2 Plug & Play OS
Selecting Yes allows the OS to configure Plug & Play devices. (This is not required
for system boot if your system has an OS that supports Plug & Play.) Select No to
allow the AMI BIOS to configure all devices in the system.
3.3.9.3 PCI Latency Timer
This feature sets the latency Timer of each PCI device installed on a PCI bus. Select
64 to set the PCI latency to 64 PCI clock cycles. The options are 32, 64 (default), 96,
128, 160, 192, 224 and 248.
BIOS Setup Utility
Advanced Setup Configurations
3.3.9.4 PCI IDE Bus Master
When enabled, the BIOS uses PCI bus mastering for reading/writing to IDE drives.
The options are Disabled and Enabled (default).
3.3.9.5 Slot 1 Option ROM~Slot 6 Option ROM
Select Enabled to enable Slot 1 Option ROM~Slot 6 Option ROM, which will allow
you to boot the computer from a PCI device installed on a PCI slot. The options are
Disabled and Enabled (default).
3.3.9.6 LAN1 PXE/LAN2 PXE/LAN3 PXE/LAN4 PXE (-LN3 PXE/-LN4
PXE: for LN4 models only)
Select Enabled to enable the onboard LAN1/LAN2 PXE Option ROMs. This is to
boot computers using a network interface. The options are Enabled and Disabled
(default).
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3.3.10 Super IO Device Configuration
3.3.10.1 Onboard Floppy Controller
Select Enable to enable the onboard Floppy Controller. The options are Enabled
(default) and Disabled.
3.3.10.2 Floppy A/Floppy B
This feature allows the user to select the type of floppy drive connected to the system
as specified. The options are Disabled, 360KB 5 1/4”, 1.2MB 5 1/4”, 720KB 3 1/2”,
1.44MB 3 1/2” and 2.88MB 3 1/2”. The default setting for Floppy A is 1.44MB 3
1/2” (default), and for Floppy B is Disabled (default).
3.3.10.3 Serial Port1 Address/ Serial Port2 Address
This option specifies the base I/O port address and the Interrupt Request address of
Serial Port 1 and Serial Port 2. Select Disabled to prevent the serial port from accessing any system resources. When this option is set to Disabled, the serial port physically becomes unavailable. Select 3F8/IRQ4 to allow the serial port to use 3F8 as its
I/O port address and IRQ 4 for the interrupt address. The options for Serial Port1 are
Disabled, 3F8/IRQ4 (default), 3E8/IRQ4, 2E8/IRQ3. The options for Serial Port2
are Disabled, 2F8/IRQ3 (default), 3E8/IRQ4, and 2E8/IRQ3.
Serial Port 2 Mode
Use this feature to configure Serial Port 2 mode. The options are Normal (default),
IrDA and ASK IR. IrDA (Infrared Data) is an industry standard for remote control
devices. ASK IR (Amplitude Shifted Keying Infrared) is a protocol compatible with
Sharp® branded PDAs and other infrared devices.
3.3.10.4 Watch Dog Timer
If enabled, the Watch Dog Timer will allow the system to reboot when it is inactive
for more than 5 minutes. The options are Enabled and Disabled (default).
3.3.11 Remote Access Configuration
3.3.11.1 Remote Access
This allows the user to enable the Remote Access feature. The options are Disabled
(default) and Enabled.
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If Remote Access is set to Enabled, the following items will display:
Serial Port Number
This feature allows the user decide which serial port to be used for Console Redirection. The options are COM 1, COM2, and Onboard IPMI (default).
• Base Address, IRQ: This item displays the base address and IRQ of the serial
port used for Console Redirection.
3.3.11.2 Serial Port Mode
This feature allows the user to set the serial port mode for Console Redirection. The
options are 115200 8, n 1 (default); 57600 8, n, 1; 38400 8, n, 1; 19200 8, n, 1; and
9600 8, n, 1.
3.3.11.3 Flow Control
BIOS Setup Utility
Advanced Setup Configurations
This feature allows the user to set the flow control for Console Redirection. The
options are None (default), Hardware, and Software.
3.3.11.4 Redirection After BIOS POST
Select Disabled to turn off Console Redirection after Power-On Self-Test (POST).
Select Always to keep Console Redirection active all the time after POST. (Note:
This setting may not be supported by some operating systems.) Select Boot Loader
to keep Console Redirection active during POST and Boot Loader. The options are
Disabled, Boot Loader, and Always (default).
3.3.11.5 Terminal Type
This feature allows the user to select the target terminal type for Console Redirection. The options are ANSI, VT100 (default), and VT-UTF8.
3.3.11.6 VT-UTF8 Combo Key Support
A terminal keyboard definition that provides a way to send commands from a remote
console. Available options are Enabled (default) and Disabled.
3.3.11.7 Sredir Memory Display Delay
This feature defines the length of time in seconds to display memory information.
The options are No Delay (default), Delay 1 Sec, Delay 2 Sec, and Delay 4 Sec.
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3.3.12 System Health Monitor
This feature allows the user to monitor system health and review the status of each
item as displayed.
3.3.12.1 CPU Overheat Alarm
This option allows the user to select the CPU Overheat Alarm setting which determines when the CPU OH alarm will be activated to provide warning of possible
CPU overheat.
Caution: 1. Any temperature that exceeds the CPU threshold temperature pre-
defined by the CPU manufacturer may result in CPU overheat or system instability .
When the CPU temperature reaches this predefined threshold, the CPU and system
cooling fans will run at full speed.
2. To avoid possible system overheating, please be sure to provide adequate airflow
to your system.
The options are:
• The Early Alarm: Select this setting if you want the CPU overheat alarm
(including the LED and the buzzer) to be triggered as soon as the CPU temperature reaches the CPU overheat threshold as predefined by the CPU manufacturer.
• The Default Alarm: Select this setting if you want the CPU overheat alarm
(including the LED and the buzzer) to be triggered when the CPU temperature
reaches about 5oC above the threshold temperature as predefined by the CPU
manufacturer to give the CPU and system fans additional time needed for CPU
and system cooling. In both the alarms above, please take immediate action as
shown below.
3.3.12.2 CPU Temperature/System Temperature
This feature displays current temperature readings for the CPU and the System.
The following items will be displayed for your reference only:
CPU Temperature
The CPU thermal technology that reports absolute temperatures (Celsius/Fahrenheit)
has been upgraded to a more advanced feature by Intel in its newer processors. The
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BIOS Setup Utility
Advanced Setup Configurations
basic concept is each CPU is embedded by unique temperature information that the
motherboard can read. This ‘Temperature Threshold’ or ‘Temperature Tolerance’
has been assigned at the factory and is the baseline on which the motherboard takes
action during different CPU temperature conditions (i.e., by increasing fan speed,
triggering the Overheat Alarm, etc). Since CPUs can have different ‘Temperature
Tolerances’, the installed CPU can now send information to the motherboard what
its ‘Temperature Tolerance’ is, and not the other way around. This results in better
CPU thermal management.
Supermicro has leveraged this feature by assigning a temperature status to certain
thermal conditions in the processor (Low, Medium and High). This makes it easier
for the user to understand the CPU’s temperature status, rather than by just simply
seeing a temperature reading (i.e., 25oC). The CPU Temperature feature will display
the CPU temperature status as detected by the BIOS:
• Low – This level is considered as the ‘normal’ operating state. The CPU tem-
perature is well below the CPU ‘Temperature Tolerance’. The motherboard
fans and CPU will run normally as configured in the BIOS (Fan Speed Control). User intervention: No action required.
• Medium – The processor is running warmer. This is a ‘precautionary’ level
and generally means that there may be factors contributing to this condition,
but the CPU is still within its normal operating state and below the CPU ‘Temperature Tolerance’. The motherboard fans and CPU will run normally as configured in the BIOS. The fans may adjust to a faster speed depending on the
Fan Speed Control settings. User intervention: No action is required. However,
consider checking the fans and the chassis ventilation for blockage.
• High – The processor is running hot. This is a ‘caution’ level since the CPU’s
‘Temperature Tolerance’ has been reached (or has been exceeded) and may
activate an overheat alarm. User intervention: If the system buzzer and Overheat LED has activated, take action immediately by checking the system fans,
chassis ventilation and room temperature to correct any problems.
Note: 1. The system may shut down if it continues for a long period to prevent
damage to the CPU. 2. The information provided above is for your reference only .
For more information on thermal management, please refer to Intel’s Web site
atwww.Intel.com.
3.3.12.3 System Temperature
The system temperature will be displayed (in degrees in Celsius and Fahrenheit) as it
is detected by the BIOS.
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3.3.12.4 Voltage Monitoring
CPU1 Vcore/CPU2 Vcore, CPU1 DIMM/CPU2 DIMM, 1.5V, 3.3Vcc (V), 3.3V SB
(V), 12Vcc (V), 5Vin, and Battery Voltage.
3.3.12.5 System Fan Monitor
This feature allows the user to decide how the system controls the speeds of the
onboard fans. The CPU temperature and the fan speed are correlative. When the
CPU on-die temperature increases, the fan speed will also increase, and vice versa.
Select Workstation if your system is used as a Workstation. Select Server if your
system is used as a Server. Select “Disabled, (Full Speed @12V)” to disable the fan
speed control function and allow the onboard fans to constantly run at the full speed
(12V). The Options are: Disabled (@full-speed) (default), 4-pin (Server), 4-pin
(Workstation), 4-pin (Quiet), and 4-pin (Super Quiet).
3.3.12.6 Fan1—Fan 8 Reading
This feature displays the fan speed readings from fan interfaces Fan1 through Fan8.
(Fan7 is CPU1 Fan and Fan8 is CPU2 Fan.)
3.3.13 ACPI Configuration
Use this feature to configure Advanced Configuration and Power Interface (ACPI)
power management settings for your system.
3.3.13.1 ACPI Version Features
The options are ACPI v1.0, ACPI v2.0 (default) and ACPI v3.0. Please refer to
ACPI's website for further explanation: http://www.acpi.info/.
3.3.13.2 ACPI APIC Support
Select Enabled to include the ACPI APIC Table Pointer in the RSDT (Root System
Description Table) pointer list. The options are Enabled (default) and Disabled.
3.3.13.3 APIC ACPI SCI IRQ
When this item is set to Enabled, APIC ACPI SCI IRQ is supported by the system.
The options are Enabled and Disabled (default).
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3.3.13.4 Headless Mode
This feature is used to enable system to function without a keyboard, monitor or
mouse attached The options are Enabled and Disabled (default).
3.3.13.5 High Performance Event Timer
Select Enabled to activate the High Performance Event Timer (HPET) that produces
periodic interrupts at a much higher frequency than a Real-time Clock (R TC) does in
synchronizing multimedia streams, providing smooth playback and reducing the
dependency on other timestamp calculation devices, such as an x86 RDTSC Instruction embedded in the CPU. The High Performance Event Timer is used to replace
the 8254 Programmable Interval Timer. The options are Enabled and Disabled
(default).
3.3.14 Trusted Computing
BIOS Setup Utility
Advanced Setup Configurations
3.3.14.1 TCG/TPM (Trusted Platform Module) Support
Select Yes on this item and enable the TPM jumper on the motherboard to enable
TCG (TPM 1.1/1.2)/TPM support in order to improve data integrity and network
security. The options are No (default) and Yes.
If this feature is set to Yes, the following items will display:
TPM Enable/Disable Status
This item displays the status of TPM Enabled/Disabled state.
TPM Owner Status
This item displays the status of TPM Ownership.
3.3.15 IPMI Configuration
Intelligent Platform Management Interface (IPMI) is a set of common interfaces that
IT administrators can use to monitor system health and to manage the system as a
whole. For more information on the IPMI specifications, please visit Intel's website
at www.intel.com.
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3.3.15.1 Status of BMC
Baseboard Management Controller (BMC) manages the interface between system
management software and platform hardware. This is an informational feature which
returns the status code of the BMC micro controller.
3.3.16 View BMC System Event Log
This feature displays the BMC System Event Log (SEL). It shows the total number
of entries of BMC System Events.
To view an event, select an Entry Number and pressing <Enter> to display the information as shown in the screen.
• SEL Entry Number
• SEL Record ID
• SEL Record Type
• Timestamp
• Generator ID
• Event Message Format User
• Event Sensor Type
• Event Sensor Number,
• Event Dir Type
• Event Data.
3.3.16.1 Clear BMC System Event Log
Select OK and press the <Enter> key to clear the BMC system log. Select Cancel to
keep the BMC System log. The options are OK (default) and Cancel.
Caution: Any cleared information is unrecoverable. Make absolutely sure that you
no longer need any data stored in the log before clearing the BMC Event Log.
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3.3.17 Set LAN Configuration
Set this feature to configure the IPMI LAN adapter with a network address as shown
in the following graphics.
3.3.17.1 Channel Number
Enter the channel number for the SET LAN Config command. This is initially set to
[1] (default). Press “+” or “-” on your keyboard to change the Channel Number.
3.3.17.2 Channel Number Status
This feature returns the channel status for the Channel Number selected above:
“Channel Number is OK” or “Wrong Channel Number”.
3.3.17.3 IP Address Source
BIOS Setup Utility
Advanced Setup Configurations
This features allows the user to select how an IP address is assigned to a client computer or network device. Select DHCP (Dynamic Host Configuration Protocol) to
allow a client (computer or device) obtains an IP address from a DHCP server that
manages a pool of IP addresses and network information on a “request and grant”
basis.
Upon time-out (or lease expiration), the IP address assigned to the client can be reassigned to a new client. Select Static (Static Allocation) (default) to allow the host
server to allocate an IP address based on a table containing MAC Address/IP
Address pairs that are manually entered (probably by a network administrator). Only
clients with a MAC address listed in the MAC/IP Address Table will be assigned an
IP address.
The IP Address allocated to the client is on a longer term basis than that assigned by
the DHCP mentioned in the other option. The options are DHCP and Static
(default).
3.3.18 IP Address Configuration
This submenu displays the following IP Address Configuration information.
3.3.18.1 Parameter Selector
This item displays the parameter of your IP Address configuration.
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3.3.18.2 IP Address
This item displays the IP address of this computer . IP addresses are 6 two-digit hexadecimal numbers (Base 16, 0 ~ 9, A, B, C, D, E, F) separated by dots. (i.e.,
00.30.48.D0.D4.60).
3.3.18.3 Current IP Address in BMC
This item displays the current IP address used for your IPMI connection.
3.3.19 MAC Address Configuration
This submenu displays the following MAC Address Configuration information.
3.3.19.1 Parameter Selector
Use this feature to select the parameter of your Mac Address configuration.
3.3.19.2 MAC Address
This item displays the MAC address of this computer. MAC addresses are 6 twodigit hexadecimal numbers (Base 16, 0 ~ 9, A, B, C, D, E, F) separated by dots. (i.e.,
00.30.48.D0.D4.60).
3.3.19.3 Current MAC Address in BMC
This item displays the current MAC address used for your IPMI connection.
3.3.20 Subnet Mask Configuration
Subnet masks tell the network which subnet this machine belongs to. The value of
each three-digit number separated by dots should not exceed 255.
3.3.20.1 Parameter Selector
Use this feature to select the parameter of your Subnet Masks configuration.
3.3.20.2 Subnet Mask
This item displays the current subnet mask setting for your IPMI connection.
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3.3.20.3 VLAN Tagging
Select Enabled to enable VLAN (V irtual LAN) Tagging support which allows multiple networks to transparently share the same physical network without leaking information between the bridged networks. VLAN Tagging complies with the IEEE
802.1Q Standards. The options are Enabled and Disabled (default).
3.3.21 SEL PEF Configuration
3.3.21.1 PEF Configuration
Set this feature to configure the Platform Event Filter (PEF). PEF interprets BMC
events and performs actions based on pre-determined settings or 'traps' under IPMI
1.5 specifications. Powering the system down or sending an alert when a triggering
event is detected. The default is Disabled (default).
The following will appear if PEF Support is set to Enabled.
BIOS Setup Utility
Advanced Setup Configurations
PEF Action Global Control
These are the different actions based on BMC events. The options are Alert
(default), Power Down, Reset System, Power Cycle, OEM Action, Diagnostic Interface.
Alert Startup Delay
This feature inserts a delay during startup for PEF alerts. The options are Enabled
and Disabled (default).
PEF Alert Startup Delay
This sets the pre-determined time to delay PEF alerts after system power-ups and
resets. Refer to Table 24.6 of the IPMI 1.5 Specification for more information at
www.intel.com. The options are No Delay, 30 sec, 60 sec, 1.5 min, 2.0 min.
Startup Delay
This feature enables or disables startup delay. The options are Enabled and Disabled
(default).
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PEF Startup Delay
This sets the pre-determined time to delay PEF after system power-ups and resets.
Refer to Table 24.6 of the IPMI 1.5 Specification for more information at
www.intel.com. The options are No Delay (default), 30 sec, 60 sec, 1.5 min, 2.0
min.
Event Message for PEF Action
This enables of disables Event Messages for PEF action. Refer to Table 24.6 of the
IPMI 1.5 Specification for more information at www.intel.com. The options are Dis-
abled (default) and Enabled.
3.3.21.2 BMC Watch Dog Timer Action
Allows the BMC to reset or power down the system if the operating system hangs or
crashes. The options are Disabled (default), Reset System, Power Down, Power
Cycle.
BMC Watch Dog TimeOut [Min:Sec]
This option appears if BMC Watch Dog Timer Action (above) is enabled. This is a
timed delay in minutes or seconds, before a system power down or reset after an
operating system failure is detected. The options are [5 Min] (default), [1 Min], [30
Sec], and [10 Sec].
3.3.22 DMI Event Log
3.3.22.1 View Event Log
Use this option to view the System Event Log.
3.3.22.2 Mark all events as read
This option marks all events as read. The options are OK and Cancel.
3.3.22.3 Clear event log
This option clears the Event Log memory of all messages. The options are OK and
Cancel.
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3.4 Security Settings
The AMI BIOS provides a Supervisor and a User password. If you use both passwords, the Supervisor password must be set first.
BIOS Setup Utility
Security Settings
Figure 3-3. Security Settings
3.4.1 Supervisor Password
This item indicates if a Supervisor password has been entered for the system. “Not
Installed” means a Supervisor password has not been used.
3.4.2 User Password
This item indicates if a user password has been entered for the system. “Not
Installed” means that a user password has not been used.
3.4.3 Change Supervisor Password
Select this feature and press <Enter> to access the submenu, and then enter a new
Supervisor Password.
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3.4.4 User Access Level (Available when Supervisor
Password is set as above)
Use this feature to set the user's access level. The options are:
• Full Access (default): grants full User read and write access to the Setup Util-
ity,
• View Only: allows access to the Setup Utility, but cannot change the fields,
• Limited: allows only limited fields to be changed such as Date and Time,
• No Access: prevents User access to the Setup Utility.
3.4.5 Change User Password
Select this feature and press <Enter> to access the submenu, and then enter a new
User Password.
3.4.6 Clear User Password (Available only if User Password has been set)
This item allows you to clear a user password after it has been entered.
3.4.7 Password Check
This item allows you to check a password after it has been entered. The options are
Setup (default) and Always.
3.4.8 Boot Sector Virus Protection
When Enabled, the AMI BIOS displays a warning when any program (or virus)
issues a Disk Format command or attempts to write to the boot sector of the storage
drive. The options are Enabled and Disabled (default).
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3.5 Boot Configuration
Use this feature to configure boot settings (see Figure 3-4).
BIOS Setup Utility
Boot Configuration
Figure 3-4. Boot Settings
3.5.1 Boot Device Priority
This feature allows the user to specify the sequence of priority for the Boot Device.
The settings are 1st boot device, 2nd boot device, 3rd boot device, 4th boot device,
5th boot device, and Disabled.
• 1st Boot Device - 1st Floppy Drive
• 2nd Boot Device - [USB: XXXXXXXXX]
3.5.2 Storage Drives
This feature allows the user to specify the boot sequence from all available storage
drives. The settings are Disabled and a list of all storage drives that have been
detected (i.e., 1st Drive, 2nd Drive, 3rd Drive, etc).
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3.5.3 Removable Drives
This feature allows the user to specify the boot sequence from available Removable
Drives. The settings are 1st boot device, 2nd boot device, and Disabled.
• 1st Drive - 1st Floppy Drive
• 2nd Drive - [USB: XXXXXXXXX]
3.5.4 CD/DVD Drives
This feature allows the user to specify the boot sequence from available CD/DVD
Drives (i.e., 1st Drive, 2nd Drive, etc).
3.6 Exit Options
Select the Exit tab from the AMI BIOS Setup Utility screen to enter the Exit BIOS
Setup screen.
Figure 3-5. Exit Options
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3.6.1 Save Changes and Exit
When you have completed the system configuration changes, select this option to
leave the BIOS Setup Utility and reboot the computer, so the new system configuration parameters can take effect. Select Save Changes and Exit from the Exit menu
and press <Enter>.
3.6.2 Discard Changes and Exit
Select this option to quit the BIOS Setup without making any permanent changes to
the system configuration, and reboot the computer. Select Discard Changes and Exit
from the Exit menu and press <Enter>.
3.6.3 Discard Changes
Select this option and press <Enter> to discard all the changes and return to the AMI
BIOS Utility Program.
BIOS Setup Utility
Exit Options
3.6.4 Load Optimal Defaults
To set this feature, select Load Optimal Defaults from the Exit menu and press
<Enter>. Then, select OK to allow the AMI BIOS to automatically load Optimal
Defaults to the BIOS Settings. The Optimal settings are designed for maximum system performance, but may not work best for all computer applications.
3.6.5 Load Fail-Safe Defaults
To set this feature, select Load Fail-Safe Defaults from the Exit menu and press
<Enter>. The Fail-Safe settings are designed for maximum system stability, but not
for maximum performance.
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3.7 BIOS Recovery
Caution: Do not upgrade the BIOS unless your system has a BIOS-related issue.
Flashing the wrong BIOS can cause irreparable damage to the system. In no event
shall Supermicro be liable for direct, indirect, special, incidental, or consequential
damages arising from a BIOS update. If you need to update the BIOS, do not shut
down or reset the system while the BIOS is updating. This is to avoid possible boot
failure.
3.7.1 How to Recover the AMIBIOS Image (the Main
BIOS Block)
An AMIBIOS flash chip consists of a boot sector block, and a main BIOS code
block (a main BIOS image). The boot sector block contains critical BIOS code,
including memory detection and recovery code to be used to flash a new BIOS
image if the original BIOS Image is corrupted. When the system is powered on, the
boot sector code executes first. Once it is completed, the main BIOS code will continue with system initialization and complete the bootup process.
Note: BIOS Recovery described below is used when the main BIOS block crashes. However, when the BIOS Boot sector crashes, you will need to send the motherboard back to Supermicro for RMA repairs.
3.7.2 Boot Sector Recovery from a USB Device
This feature allows the user to recover a BIOS image using a USB device without
additional utilities needed. A user can download the BIOS image into a USB flash
device, and name the file “SUPER.ROM” for the recovery process to load the file. A
USB flash device such as a USB Flash Drive, a USB CDROM or a USB CDRW
device can be used for this purpose:
1. Insert the USB device that contains the new BIOS image (the ROM files)
saved in a root directory into your USB drive.
2. While turning the power on, press and hold <Ctrl> and <Home> at the same
time until the USB Access LED Indicator comes on. This might take a few
seconds.
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