Themis RES-22XR3 Installation Manual

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I ns tallatio n

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Manual

RES-22XR3

Configuration 1

2RU 19” Rack-Mount Rugged Enterprise Server with

X8DTH-iF/X8DTH-6F Motherboard Configuration/

Two Quad/Dual-Core 5500 or Quad/Six-Core 5600 Xeon CPUs

RES-22XR3 - Configuration 1

Two Quad/Dual-Core 5500 or Quad/Six-Core 5600 Xeon CPUs

RES-22XR3 - Configuration 1

Two Quad/Dual-Core 5500 or Quad/Six-Core 5600 Xeon CPUs

RES-22XR3 - Configuration 1

Two Quad/Dual-Core 5500 or Quad/Six-Core 5600 Xeon CPUs

RES-22XR3 - Configuration 1

Two Quad/Dual-Core 5500 or Quad/Six-Core 5600 Xeon CPUs

RES-22XR3 - Configuration 1

Two Quad/Dual-Core 5500 or Quad/Six-Core 5600 Xeon CPUs

RES-22XR3 - Configuration 1

Two Quad/Dual-Core 5500 or Quad/Six-Core 5600 Xeon CPUs

RES-22XR3 - Configuration 1

Two Quad/Dual-Core 5500 or Quad/Six-Core 5600 Xeon CPUs

RES-22XR3 - Configuration 1

Two Quad/Dual-Core 5500 or Quad/Six-Core 5600 Xeon CPUs

RES-22XR3 Installation Manual

* SuperMicro Motherboards X8DTH-iF / X8DTH-6F

- Configuration 1*

Version 1.3— April 2012

Themis Computer—Americas and Pacific Rim 47200 Bayside Parkway Fremont, CA 94538 Phone (510) 252-0870 Fax (510) 490-5529 World Wide Web http://www.themis.com

Themis Computer—Rest of World 5 Rue Irene Joliot-Curie 38320 Eybens, France Phone +33 476 14 77 80 Fax +33 476 14 77 89

photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without the prior written permission of Themis Computer.

The information in this publication has been carefully checked and is believed to be accurate. However, Themis Computer assumes no responsibility for inaccuracies. Themis Computer retains the right to make changes to this publication at any time without prior notice. Themis Computer does not assume any liability arising from the application or use of this publicat ion or the product(s) described herein.

RESTRICTED RIGHTS LEGEND: Use, duplication, or disclosure by the United States Government is subject to the restrictions set forth in DFARS 252.227-7013 (c)(1)(ii) and FAR 52 .227-19.

TRADEMARKS and SERVICEMARKS

Themis® is a registered trademark of Themis Computer, Inc.

Intel

and Xeon® are registered trademarks of Intel Corporation.

Red Hat Linux SuperMicro

All other trademarks, service marks, or registered trademarks used in this publication are the property of their respective owners.

is a registered trademark of Red Hat, Inc.

is a registered trademark of Linus Torvalds.

is a registered trademark of Super Micro Computer, Inc.

CE Marking

This product complies with the European EMC Directive (2004/108/EC) and the European Low Voltage Safety Directive (2006/95/EC)/.

Safety Precautions

Instructions regarding safety precautions during installation, operation, or maintenance of the equipment are given in the section entitled “Safety Instructions” on page v.

WARNINGS and CAUTIONS

The definitions of WARNINGS and CAUTIONS as used in this document are given in the Preface in the section entitled “Notes, Cautions, Warnings, and Sidebars”.

Themis Customer Support

North America, South America, and Pacific Rim

Telephone: 510-252-0870

Fax: 510-490-5529

E-mail: support@themis.com

Web Site: http://www.themis.com

RES-22XR3 Installation Manual - Configuration 1, Version 1.3

April 2012 Part Number: 116789-024

RES-22XR3 Installation Manual - Configuration 1

Version Revision History

Ve rsi on 1. 3 ...................................................................................... April 2012

• Fixed page numbering error occurring in the appendices.

• Fixed page numbering error occurring in the roman numeral pages.

• Added the manual P/N throughout the manual for easier reference.

• Removed removed power cord retainer bracket from “Accessory Kit”, page 119, as this is an option item.

• Added “5600” to the CPU description in Figure 1-2, page 1-3.

• Added text regarding SAS/storage drive support in Figure 1-3, page 1-4.

• Corrected power fail LED color in Figure 1-4, page 1-5.

• Added slot locations to Table 1-1, page 1-2.

• Changed max operating temperature to 55°C in Table 1-2, page 1-2 and in Table 1-6, page 1-15.

• Added note regarding max storage drives per chassis in Figure 1-3, page 1-4.

• Updated text in “Chipset Overview”, page 1-10.

• Added information about SuperDoctor in “PC Health Monitoring”, page 1-11.

• Added additional text to note in “Environmental Te mperature Control”, page 111 regarding unobstructed airflow to the chassis.

• Added note to “Main Switch Override Mechanism”, page 1-13 stating all RES units leave the factory with ATX compliant power supplies installed.

• Added “Winbond WPCM450 Controller”, page 1-14.

• Adjusted the typical input power in Table 1-7, page 1-16 and added footnotes.

• Correct the symbol for the LED “off state” in Table 1-3, page 1-7.

• Added three new systems and weights to Table 1-8, page 1-20.

• Corrected all references to the fans being 60-mm (actual size is 80-mm).

• Updated section, “Removable 80-mm Fan”, page 2-12.

• Added text regarding proper order of DIMM installation.

• Corrected CPU socket description in Figure 2-3, page 2-5.

• Added clarifying text regarding proper drive orientation during installation in “Storage-Drive Installation”, page 2-11.

• Added note stating the X8DTH motherboards have onboard graphics capability in section, “Configuration”, page 2-19.

• Added text stating the chassis power button behavior can be adjusted in the BIOS settings (“Turning the System Off”, page 2-19).

• Assorted minor edits and changes throughout the manual.

• Updated “BIOS Setup Utility”, page 3-1 according to current SuperMicro rev.

• Updated Appendix F, “Re-packaging Instructions” with added packaging detail.

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RES-22XR3 Installation Manual - Configuration 1 Version 1.3

Ve rsi on 1. 2 .................................................................................... August 2011

• Added P/N 118188 to the manual matrix in Table 2 on page xxiii.

• Modified footnote for Table 1-2, page 1-2. Added clarity regarding SAS/SATA support.

•Added Table 1-3, page 1-7 describing LED behaviors related to the power sup- ply modules.

• Revised Chapter 1.3 on page 10 to reflect the current specs for the X8DTH-iF/6F motherboard.

• Updated Chapter 3, "BIOS Setup Utility" to reflect latest AMI BIOS Version.

• Updated figures in Appendix B, “Rack-Mount Slide Installation” to reflect cur- rent chassis design.

•Added Appendix E, “Optional RES Audio/USB/Serial Port Module” and moved existing Appendix E to Appendix F.

• Assorted minor edits and changes throughout the manual.

Ve rsi on 1. 1 .............................................................................. December 2010

• Added figures of both Standard and Front-I/O RES-32 Chassis in Preface.

•Added Table 2

• Added section on noise listed under 1.8.3 Environmental.

• Colorized block diagram for the X8DTH-iF/6F in Chapter 1.

• Added note in 1.8.2.1 System Power in regards to the wattage of pre installed power supplies.

• Included Caution note under Section 1.9 Packaging and Shipping.

•Added Table 1-8 ter 1.

• Added Appendices D and E.

• Added Version number to the header of all even pages.

• Assorted minor edits and changes throughout the manual.

• Added footnote in Ta ble 2 stating that the RES XR3 17.07”-Deep chassis models would be referred to as 17”-Deep.

and Table 3 in the Preface.

showing the Approximate Weights of the RES Series in Chap-

Ve rsi on 1. 0 ....................................................................................... March 2010

Themis Computer

Safety Instructions

To maximize user safety and ensure correct device operation, all instructions contained in this section should be read carefully.

Caution: It is important that the user observe all warnings and instructions that are on the device and contained in this manual.

• The device must be used in accordance with the instructions for use.

• Electrical installations in the room must correspond to the requirements of respective regulations.

• Take care that there are no cables, particularly mains cables, in areas where persons can trip over them.

RES-22XR3 Installation Manual - Configuration 1

• Do not use a mains connection in sockets shared by a number of other power consumers. Do not use an extension cable.

• Only use the mains cable supplied.

• The unit is completely disconnected from the power source only when the power cord is disconnected from the power source. Therefore the power cord and its connectors must always remain easily accessible.

• Do not set up the device in the proximity of heat sources or in a damp location. Make sure the device has adequate ventilation.

• All connection cables must be screwed or locked to the chassis housing.

• The device is designed to be used in horizontal position only.

• The device is no longer safe to operate when — the device has visible damage or — the device no longer functions.

• In these cases, the device must be shut down and secured against unintentional operation.

• Repairs may only be carried out by a person authorized by Themis Computer.

Themis Computer

• The device may only be opened for the installation and removal of extension (PCI) cards, memory modules, storage drives, fan housings, power supplies,

RES-22XR3 Installation Manual - Configuration 1 Version 1.3

and the lithium battery—all in accordance with the instructions given in this manual.

• If extensions are made to the device, the legal stipulations and the device specifications must be observed.

• The device must be switched off when removing the top cover; for example, before installing extension (PCI) cards.

Operation of Laser Source Devices

DVD/CD-ROM drives contain laser light-emitting diodes (classified in accordance with IEC 825-1:1993: LASER CLASS 1) and, therefore, must not be opened.

If the enclosure of such a drive is opened, invisible laser radiation is emitted. Do not allow yourself to be exposed to this radiation.

The laser system meets the code of Federal Regulations 21 CFR,1040 for the USA and Canadian Radiation Emitting Devices Act, REDR C 1370.

Electrostatic Discharge (ESD)

A sudden discharge of electrostatic electricity can destroy static-sensitive devices or micro-circuitry. Proper packaging and grounding techniques are necessary precautions to prevent damage. Always take the following precautions:

1. Transport boards in static-safe containers such as boxes or bags.

2. Keep electrostatic-sensitive parts in their containers until they arrive at static-

free stations.

3. Always be properly grounded when touching a sensitive board, component, or

assembly.

4. Store electrostatic-sensitive boards in protective packaging or on conductive

foam.

Grounding Methods

Guard against electrostatic damage at workstations by following these steps:

1. Cover workstations with approved anti-static material. Provide a wrist strap

connected to a work surface and properly grounded tools and equipment.

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RES-22XR3 Installation Manual - Configuration 1

2. Use anti-static mats, heel straps, or air ionizers to give added protection.

3. Handle electrostatic-sensitive components, boards, and assemblies by the case

or the PCB edge.

4. Avoid contact with pins, leads, or circuitry.

5. Turn off power and input signals before inserting and removing connectors or

test equipment.

6. Keep the work area free of non-conductive materials such as ordinary plastic as-

sembly aids and Styrofoam.

7. Use field service tools, such as cutters, screwdrivers, and vacuums that are con-

ductive.

8. Always place drives and boards PCB-assembly-side down on the foam.

Instructions for the Lithium Battery

Systems are equipped with a lithium battery installed on the motherboard. To replace this battery, please observe the instructions that are described in this manual.

Warning: There is a danger of explosion when the wrong type of battery is used as a replacement.

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RES-22XR3 Installation Manual - Configuration 1 Version 1.3

viii

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Version Revision History....................................................................................................... iii

Safety Instructions ...................................................................................................................v

Preface................................................................................................................................... xxi

1. Overview and Specifications ........................................................................................ 1-1

1.1 Overview ................................................................................................................ 1-1

1.2 System LEDs and I/O Connectors ......................................................................... 1-5

1.3 Chipset Overview ................................................................................................ 1-10

1.3.1 The 5500/5600 Series Processor and 5520 Chipset ................................. 1-10

1.4 Special Features ................................................................................................... 1-11

1.4.1 Recovery from AC Power Loss ............................................................... 1-11

1.5 PC Health Monitoring .......................................................................................... 1-11

1.5.1 Fan Status Monitor with Firmware Control ............................................. 1-11

1.5.2 Environmental Temperature Control ....................................................... 1-11

1.5.3 System Resource Alert ............................................................................. 1-12

1.6 ACPI Features ...................................................................................................... 1-12

1.7 Super I/O Controller ............................................................................................ 1-13

1.8 Winbond WPCM450 Controller .......................................................................... 1-14

1.9 Specifications ....................................................................................................... 1-15

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1.6.1 Slow Blinking LED for Suspend-State Indicator .................................... 1-12

1.6.2 Main Switch Override Mechanism .......................................................... 1-13

1.9.1 General ..................................................................................................... 1-15

1.9.2 Electrical .................................................................................................. 1-16

1.9.2.1 System Power ........................................................................... 1-16

1.9.2.2 Output Voltage .......................................................................... 1-16

1.9.3 Environmental .......................................................................................... 1-17

1.9.3.1 Shock ........................................................................................ 1-17

1.9.3.2 Electrostatic Discharge ............................................................. 1-17

1.9.3.3 Noise ......................................................................................... 1-17

RES-22XR3 Installation Manual - Configuration 1 Version 1.3

1.10 Packaging and Shipping ....................................................................................... 1-19

1.10.1 Accessory Kit ...........................................................................................1-19

1.10.2 Rack-Mount Slides (Optional) ................................................................. 1-20

2. Installation and Operation ........................................................................................... 2-1

2.1 Installation Procedures ........................................................................................... 2-1

2.1.1 Remove Protective Top Cover ................................................................... 2-1

2.1.2 Memory Modules ....................................................................................... 2-3

2.1.2.1 Installation ..................................................................................2-4

2.1.3 PCI Cards ................................................................................................... 2-7

2.1.3.1 Installing Cards ........................................................................... 2-7

2.1.4 Lithium Battery .......................................................................................... 2-8

2.1.4.1 Removing the Lithium Battery ................................................... 2-8

2.1.4.2 Installing a Lithium Battery ........................................................ 2-9

2.1.5 SAS/SATA II Storage Drive ...................................................................... 2-9

2.1.5.1 Opening the RES-22XR3 Front Doors ....................................... 2-9

2.1.5.2 Storage-Drive Removal ............................................................ 2-10

2.1.5.3 Storage-Drive Installation ......................................................... 2-11

2.1.6 Removable 80-mm Fan ............................................................................ 2-12

2.1.6.1 Removing and Installing a 80-mm Fan ..................................... 2-13

2.1.7 Power Supply ........................................................................................... 2-14

2.1.7.1 Removing a Power Supply ....................................................... 2-14

2.1.7.2 Installing a Power Supply ......................................................... 2-16

2.2 Rack Mounts ........................................................................................................ 2-17

2.2.1 Mounting Brackets ................................................................................... 2-17

2.2.2 Rack-Mount Slides (Optional) ................................................................. 2-17

2.3 Operation ............................................................................................................. 2-18

2.3.1 Plugging in the AC Power Cords ............................................................. 2-18

2.3.2 Turning the System On ............................................................................ 2-18

2.3.3 Getting Started ......................................................................................... 2-19

2.3.3.1 Configuration ............................................................................ 2-19

2.3.3.2 Linux Installation ...................................................................... 2-19

2.3.4 Turning the System Off ........................................................................... 2-19

3. BIOS Setup Utility ........................................................................................................ 3-1

3.1 Introduction ............................................................................................................ 3-1

3.1.1 Starting BIOS Setup Utility ....................................................................... 3-1

3.1.2 How To Change the Configuration Data ................................................... 3-2

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Table of Contents

3.1.3 Starting the Setup Utility ........................................................................... 3-2

3.2 Main Setup ............................................................................................................. 3-3

3.2.1 System Time/System Date ......................................................................... 3-3

3.2.2 Supermicro X8DTH ................................................................................... 3-4

3.2.3 Processor .................................................................................................... 3-4

3.2.4 System Memory ......................................................................................... 3-4

3.3 Advanced Setup Configurations ............................................................................ 3-5

3.3.1 Boot Features ............................................................................................. 3-5

3.3.1.1 Quick Boot .................................................................................. 3-5

3.3.1.2 Quiet Boot ................................................................................... 3-5

3.3.1.3 AddOn ROM Display Mode ....................................................... 3-6

3.3.1.4 Bootup Num-Lock ...................................................................... 3-6

3.3.1.5 Wait For 'F1' If Error .................................................................. 3-6

3.3.1.6 Hit 'Del' Message Display ........................................................... 3-6

3.3.1.7 Interrupt 19 Capture .................................................................... 3-6

3.3.1.8 Watch Dog Function ................................................................... 3-6

3.3.1.9 Power Button Function ............................................................... 3-6

3.3.1.10 Restore on AC Power Loss ......................................................... 3-7

3.3.2 Processor and Clock Options ..................................................................... 3-7

3.3.2.1 CPU Ratio ................................................................................... 3-7

3.3.2.2 Clock Spread Spectrum .............................................................. 3-7

3.3.2.3 Hardware Prefetcher ................................................................... 3-7

3.3.2.4 Adjacent Cache Line Prefetch .................................................... 3-7

3.3.2.5 MPS and ACPI MADT Ordering ............................................... 3-8

3.3.2.6 Machine Checking Feature ......................................................... 3-8

3.3.2.7 Intel® Virtualization Technology ............................................... 3-8

3.3.2.8 Execute-Disable Bit Capability .................................................. 3-8

3.3.2.9 Simultaneous Multi-Threading ................................................... 3-8

3.3.2.10 Active Processor Cores ............................................................... 3-9

3.3.2.11 Intel® EIST Technology ............................................................. 3-9

3.3.2.12 Intel® TurboMode Technology .................................................. 3-9

3.3.2.13 C1E Support ................................................................................ 3-9

3.3.2.14 Intel® C-STATE Tech ................................................................ 3-9

3.3.2.15 C-State package limit setting ...................................................... 3-9

3.3.2.16 C1 Auto Demotion ...................................................................... 3-9

3.3.2.17 C3 Auto Demotion .................................................................... 3-10

3.3.2.18 ACPI T State ............................................................................. 3-10

3.3.3 Advanced Chipset Control ....................................................................... 3-10

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RES-22XR3 Installation Manual - Configuration 1 Version 1.3

3.3.3.1 QPI Links Speed ....................................................................... 3-10

3.3.3.2 QPI Frequency .......................................................................... 3-10

3.3.3.3 QPI L0s and L1 ......................................................................... 3-10

3.3.3.4 Memory Frequency ................................................................... 3-10

3.3.3.5 Memory Mode .......................................................................... 3-11

3.3.3.6 Demand Scrubbing ................................................................... 3-11

3.3.3.7 Patrol Scrubbing ....................................................................... 3-11

3.3.3.8 Channel Interleave .................................................................... 3-11

3.3.3.9 Bank Interleave ......................................................................... 3-11

3.3.3.10 Throttling - Closed Loop .......................................................... 3-11

3.3.3.11 Intel I/OAT ............................................................................... 3-12

3.3.3.12 DCA Technology ...................................................................... 3-12

3.3.3.13 DCA Prefetch Delay ................................................................. 3-12

3.3.3.14 Intel VT-d ................................................................................. 3-12

3.3.3.15 Active State Power Management .............................................. 3-12

3.3.3.16 IOH PCI-E Max Payload Size .................................................. 3-12

3.3.3.17 USB Functions .......................................................................... 3-13

3.3.3.18 USB 2.0 Controller ................................................................... 3-13

3.3.3.19 Legacy USB Support ................................................................ 3-13

3.3.3.20 Port 64/60 Emulation ................................................................ 3-13

3.3.4 IDE/SATA Configuration ........................................................................ 3-13

3.3.4.1 SATA#1 Configuration ............................................................. 3-13

3.3.4.2 Configure SATA#1 as .............................................................. 3-13

3.3.4.3 ICH RAID Code Base ............................................................... 3-14

3.3.4.4 ICH AHCI Code Base ............................................................... 3-14

3.3.4.5 SATA#2 Configuration ............................................................. 3-14

3.3.4.6 IDE Detect Timeout (sec) ......................................................... 3-14

3.3.4.7 Primary IDE Master/Slave, Secondary IDE Master/Slave,

Third IDE Master, and Fourth IDE Master ............................... 3-14

3.3.5 PCI/PnP Configuration ............................................................................ 3-17

3.3.5.1 Clear NVRAM .......................................................................... 3-17

3.3.5.2 Plug & Play OS ......................................................................... 3-17

3.3.5.3 PCI Latency Timer .................................................................... 3-17

3.3.5.4 PCI Cache Size ......................................................................... 3-17

3.3.5.5 PCI IDE BusMaster .................................................................. 3-17

3.3.5.6 SR-IOV Supported .................................................................... 3-17

3.3.5.7 PCI-E Slots 1~7 x8 ................................................................... 3-18

3.3.5.8 Onboard LAN Options ROM Select ......................................... 3-18

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3.3.5.9 Load Onboard LAN1 Option ROM/Load Onboard

LAN2 Option ROM .................................................................. 3-18

3.3.5.10 Load Onboard SAS Option ROM ............................................. 3-18

3.3.5.11 Boot Graphics Adapter Priority ................................................ 3-18

3.3.6 Super IO Device Configuration ............................................................... 3-18

3.3.6.1 Serial Port1 Address/Serial Port2 Address ............................... 3-18

3.3.6.2 Serial Port 2 Attribute ............................................................... 3-19

3.3.7 Remote Access Configuration ................................................................. 3-19

3.3.7.1 Remote Access .......................................................................... 3-19

3.3.7.2 Serial Port Number ................................................................... 3-19

3.3.7.3 Serial Port Mode ....................................................................... 3-19

3.3.7.4 Flow Control ............................................................................. 3-19

3.3.7.5 Redirection After BIOS POST ................................................. 3-19

3.3.7.6 Terminal Type ........................................................................... 3-20

3.3.7.7 VT-UTF8 Combo Key Support ................................................ 3-20

3.3.7.8 Sredir Memory Display Delay .................................................. 3-20

3.3.8 Hardware Health Monitor ........................................................................ 3-20

3.3.8.1 CPU Overheat Alarm ................................................................ 3-20

3.3.8.2 CPU 1 Temperature/CPU 2 Temperature/

System Temperature ................................................................. 3-21

3.3.8.3 Voltage Readings ...................................................................... 3-23

3.3.9 ACPI Configuration ................................................................................. 3-23

3.3.9.1 ACPI Aware O/S ...................................................................... 3-23

3.3.9.2 ACPI Version Features ............................................................. 3-23

3.3.9.3 ACPI APIC Support .................................................................. 3-23

3.3.9.4 APIC ACPI SCI IRQ ................................................................ 3-23

3.3.9.5 Headless Mode .......................................................................... 3-23

3.3.9.6 High Performance Event Timer ................................................ 3-24

3.3.9.7 NUMA Support ......................................................................... 3-24

3.3.9.8 WHEA Support ......................................................................... 3-24

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3.3.10 Trusted Computing .................................................................................. 3-24

3.3.10.1 TCG/TPM (Trusted Platform Module) Support ....................... 3-24

3.3.11 IPMI Configuration .................................................................................. 3-25

3.3.11.1 IPMI Firmware Revision .......................................................... 3-25

3.3.11.2 Status of BMC .......................................................................... 3-25

3.3.12 View BMC System Event Log ................................................................ 3-26

3.3.12.1 Clear BMC System Event Log ................................................. 3-26

3.3.13 Set LAN Configuration ............................................................................ 3-26

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3.3.13.1 Channel Number ....................................................................... 3-26

3.3.13.2 Channel Number Status ............................................................ 3-27

3.3.13.3 IP Address Source ..................................................................... 3-27

3.3.13.4 BMC Watch Dog Timer Action ................................................ 3-27

3.3.14 Event Log Configuration ......................................................................... 3-28

3.3.14.1 View Event Log ........................................................................ 3-28

3.3.14.2 Mark all events as read ............................................................. 3-28

3.3.14.3 Clear event log .......................................................................... 3-28

3.3.14.4 PCI Error Log ........................................................................... 3-28

3.3.14.5 Memory ECC Error Log ........................................................... 3-28

3.4 Security Settings .................................................................................................. 3-29

3.4.1 Supervisor Password ................................................................................ 3-29

3.4.2 User Password .......................................................................................... 3-29

3.4.3 Change Supervisor Password ................................................................... 3-29

3.4.4 User Access Level ................................................................................... 3-30

3.4.5 Change User Password ............................................................................ 3-30

3.4.6 Clear User Password ................................................................................ 3-30

3.4.7 Password Check ....................................................................................... 3-30

3.4.8 Boot Sector Virus Protection ................................................................... 3-30

3.5 Boot Configuration .............................................................................................. 3-31

3.5.1 Boot Device Priority ................................................................................ 3-31

3.5.2 Storage Drives .......................................................................................... 3-31

3.5.3 Removable Drives .................................................................................... 3-32

3.5.4 CD/DVD Drives ...................................................................................... 3-32

3.5.4.1 Retry Boot Devices ................................................................... 3-32

3.6 Exit Options ......................................................................................................... 3-33

3.6.1 Save Changes and Exit ............................................................................ 3-33

3.6.2 Discard Changes and Exit ........................................................................ 3-33

3.6.3 Discard Changes ...................................................................................... 3-34

3.6.4 Load Optimal Defaults ............................................................................. 3-34

3.6.5 Load Fail-Safe Defaults ........................................................................... 3-34

3.7 BIOS Recovery .................................................................................................... 3-35

3.7.1 How to Recover the AMIBIOS Image (Main BIOS Block) .................... 3-35

3.7.2 Boot Sector Recovery from a USB Device ............................................. 3-35

3.7.3 Boot Sector Recovery from an IDE CD-ROM ........................................ 3-36

3.7.4 Boot Sector Recovery from a Serial Port (“Serial Flash”) ...................... 3-36

3.7.4.1 Requirements ............................................................................ 3-36

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Appendix A. Connector Pinouts ...................................................................................... A-1

A.1 PS/2 Keyboard and Mouse ................................................................................... A-1

A.2 USB Ports ............................................................................................................. A-2

A.3 Serial Ports ............................................................................................................ A-2

A.4 SVGA Monitor Port .............................................................................................. A-3

A.5 Gigabit Ethernet LAN Port ................................................................................... A-4

A.6 IPMI Dedicated LAN Port .................................................................................... A-4

Appendix B. Rack-Mount Slide Installation ...................................................................B-1

Appendix C. Red Hat Enterprise Linux 5 Installation ..................................................C-1

C.1 Introduction ............................................................................................................C-1

C.2 Installation .............................................................................................................C-1

Appendix D. Optional Remote On/Off Switch .............................................................. D-1

D.1 Remote On/Off Configuration .............................................................................. D-1

D.2 Remote On-Only Configuration ........................................................................... D-2

D.3 Ordering the Remote On/Off Switch .................................................................... D-2

Appendix E. Optional RES Audio/USB/Serial Port Module ........................................E-1

E.1 RES Audio/USB/Serial Port Custom Module .......................................................E-1

E.1.1 Attach I/O Cables .......................................................................................E-3

E.1.2 Connector Pinouts ......................................................................................E-4

E.1.2.1 USB Ports A and B .....................................................................E-4

E.1.2.2 Serial Port COM1 .......................................................................E-5

E.1.2.3 Stereo Audio Ports (Optional) ....................................................E-6

E.2 Ordering the RES Audio/USB/Serial Port Custom Module ..................................E-7

Appendix F. Re-packaging Instructions ......................................................................... F-1

F.1 Re-packaging for Shipment ................................................................................... F-1

F.2 Packaging Components ..........................................................................................F-2

F.3 Instructions for Re-packaging ................................................................................F-3

Index ..............................................................................................................................Index-1

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Table of Contents

List of Figures

Figure 1 Rugged Enterprise Server Model RES-22XR3 (Doors Removed)................... xxi

Figure 2 Front View of a Standard Rear-I/O RES-22 Chassis (Doors Removed)........ xxiv

Figure 3 Rear View of a Standard Rear-I/O RES-22 Chassis.........................................xxv

Figure 4 Front View of a Front-I/O RES-22 Chassis......................................................xxv

Figure 5 Rear View of a Front-I/O RES-22 Chassis.......................................................xxv

Figure 1-1 RES-22XR3 (Front Doors Installed) ............................................................... 1-1

Figure 1-2 X8DTH-iF/X8DTH-6F Motherboard Block Diagram .................................... 1-3

Figure 1-3 External Features of the RES-22 (Front and Rear).......................................... 1-4

Figure 1-4 RES-22 System LEDs and I/O Connectors (Configuration 1) ........................ 1-5

Figure 1-5 Major Components of the RES-22 (Open Top View)..................................... 1-6

Figure 1-6 RES-22XR3 with Front Sound Baffle Installed (Front View) ...................... 1-17

Figure 1-7 RES-22XR3 with Rear Sound Baffle Installed (Rear View)......................... 1-18

Figure 2-1 Remove the RES-22XR3 Protective Access Cover......................................... 2-2

Figure 2-2 Remove Air-Flow Deflector Screws................................................................ 2-4

Figure 2-3 Memory Module Slot Locations...................................................................... 2-5

Figure 2-4 Memory Module Removal............................................................................... 2-6

Figure 2-5 PCI Card Installation, Configuration 1............................................................ 2-7

Figure 2-6 PCI Card Clamp............................................................................................... 2-7

Figure 2-7 The RES-22XR3 Lithium Battery and Socket................................................. 2-8

Figure 2-8 Opening the RES-22XR3 Front Bezel Doors.................................................. 2-9

Figure 2-9 Unlocking the RES-22XR3 Storage Drives (Front Doors Removed)........... 2-10

Figure 2-10 RES-22XR3 Storage Drive Removal ............................................................ 2-11

Figure 2-11 The RES-22XR3 80-mm-Fans....................................................................... 2-12

Figure 2-12 Fan Lid Lock.................................................................................................. 2-13

Figure 2-13 Locking Contact area..................................................................................... 2-14

Figure 2-14 The RES-22XR3 Power Supply Locking Mechanism .................................. 2-15

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RES-22XR3 Installation Manual - Configuration 1 Version 1.3

Figure 2-15 Right Rack-Mount Bracket............................................................................ 2-17

Figure 2-16 AC Power Socket and LED on the RES-22XR3 Rear................................... 2-18

Figure 2-17 System Power Button and LED on the RES-22XR3 Front ........................... 2-18

Figure 3-1 Main BIOS Setup Screen................................................................................. 3-3

Figure 3-2 Advanced Settings ........................................................................................... 3-5

Figure 3-3 Security Settings ............................................................................................ 3-29

Figure 3-4 Boot Settings.................................................................................................. 3-31

Figure 3-5 Exit Options................................................................................................... 3-33

Figure 3-6 AMI_FLSH HyperTerminal .......................................................................... 3-38

Figure 3-7 ROM File Extraction ..................................................................................... 3-38

Figure 3-8 Flash Recovery .............................................................................................. 3-39

Figure A-1 USB Connector Pinout.................................................................................... A-2

Figure A-2 COM1 Serial Connector ................................................................................. A-2

Figure A-3 RES-22XR3 SVGA Connector Pinout ........................................................... A-3

Figure A-4 Ethernet Connector, Type RJ45...................................................................... A-4

Figure B-1 Screw Locations for Rack-Mount Slides ......................................................... B-1

Figure B-2 RES-22XR3 Rack-Mount Slide Installation.................................................... B-3

Figure C-1 Power On after Linux DVD is Inserted into Drive.......................................... C-2

Figure C-2 Skip Key .......................................................................................................... C-2

Figure C-3 Welcome Screen .............................................................................................. C-3

Figure C-4 Language Selection.......................................................................................... C-4

Figure C-5 Selecting Layout Type..................................................................................... C-5

Figure C-6 Enter Installation Number................................................................................ C-6

Figure C-7 Partitioning....................................................................................................... C-7

Figure C-8 Reviewing Option............................................................................................ C-8

Figure C-9 Creating a Custom Layout............................................................................... C-9

Figure C-10 Setting Up Boot Loader................................................................................. C-10

Figure C-11 Master Boot Record (MBR) .......................................................................... C-11

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Table of Contents

Figure C-12 Network Devices List .................................................................................... C-12

Figure C-13 Edit Interface Pop-Up Screen ........................................................................ C-13

Figure C-14 Selecting Time Zone...................................................................................... C-14

Figure C-15 Setting Up Root Account and Password........................................................ C-15

Figure C-16 Package Installation Default Screen.............................................................. C-16

Figure C-17 Optional Packages.......................................................................................... C-17

Figure C-18 Option to Review or Continue....................................................................... C-18

Figure C-19 Installation Begins ......................................................................................... C-18

Figure C-20 Installation is Complete ................................................................................. C-19

Figure C-21 Login Screen.................................................................................................. C-20

Figure C-22 Ready to use the Desktop............................................................................... C-20

Figure D-1 Remote On/Off Switch Module...................................................................... D-1

Figure E-1 RES Audio/USB/Serial Port Custom Module ................................................. E-1

Figure E-2 Install the RES Audio/USB/Serial Port Custom Module ................................ E-2

Figure E-3 Attach the Appropriate I/O Cables .................................................................. E-3

Figure E-4 Dual USB Connector Pinouts .......................................................................... E-4

Figure E-5 COM1 Serial Connector Pinout....................................................................... E-5

Figure E-6 Stereo Audio Connector Pinout....................................................................... E-6

Figure F-1 Packaging Components.................................................................................... F-2

Figure F-2 Order of Assembly........................................................................................... F-3

List of Tables

Table 1 RES-x2XR3 20”-Deep Chassis Manual Matrix ............................................ xxii

Table 2 RES-x2XR3S / RES-x1XR3 17”-Deep Chassis Manual Matrix.................. xxiii

Table 3 Front I/O 16”-Deep Chassis Manual Matrix................................................. xxiv

Table 1-1 RES-22XR3 Motherboard Options—Configuration 1 ................................... 1-2

Table 1-2 Major Features of the RES-22—Configuration 1........................................... 1-2

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RES-22XR3 Installation Manual - Configuration 1 Version 1.3

Table 1-3 Power Supply LED Behavior ......................................................................... 1-7

Table 1-4 System LEDs .................................................................................................. 1-8

Table 1-5 Rear-Panel I/O Connectors............................................................................. 1-9

Table 1-6 RES-22XR3 General Specifications............................................................. 1-15

Table 1-7 RES-22XR3 Electrical Specifications .......................................................... 1-16

Table 1-8 Approximate Weights of the RES Series...................................................... 1-20

Table 2-1 RES-22XR3 Memory Capacity...................................................................... 2-3

Table 2-2 RES-22XR3 Optimal Memory Population—Two CPUs Installed................. 2-3

Table 3-1 PIO Mode Select Options ............................................................................. 3-15

Table 3-2 DMA Mode Select Options .......................................................................... 3-16

Table A-1 PS/2 Keyboard/Mouse Pinouts and Signal Definitions................................. A-1

Table A-2 USB Connector Pinout Signal Descriptions.................................................. A-2

Table A-3 COM1 Serial Connector Pinouts ................................................................... A-2

Table A-4 RES-22XR3 SVGA Connector-Pin Signals .................................................. A-3

Table A-5 RJ45 Ethernet Pinout Signals ........................................................................ A-4

Table E-1 Dual USB Connector Pinout Signal Descriptions (J10)................................. E-4

Table E-2 COM1 Serial Connector Pinout Signal Descriptions (J8 and J9)................... E-5

Table E-3 Stereo Audio Out Connector Pinout Signal Descriptions (J1) ....................... E-6

Themis Computer

Preface

This document, entitled RES-22XR3 Installation Manual—Configuration 1, provides instructions on how to install, configure, power up, and boot the Themis Rugged Enterprise Server RES-22XR3 Configuration 1 (see Figure 1 below), which is

based on two 64-bit Intel® 5500-Series Xeon 5600-Series Xeon™ Quad/Six-Core CPUs.

RES-22XR3 Configuration 1 supports one of two motherboards in a 20” chassis:

• SuperMicro® X8DTH-iF

• SuperMicro® X8DTH-6F

(a matrix describing 20” chassis configurations is given in Table 1, page xxii. A matrix describing 17” chassis configurations is given in Table 2, page xxiii).

Quad/Dual-Core CPUs, or two Intel

Themis Computer

Figure 1. Rugged Enterprise Server Model RES-22XR3 (Doors Removed)

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RES-22XR3 Installation Manual - Configuration 1 Version 1.3

Table 1. RES-x2XR3 20”-Deep Chassis Manual Matrix

Category Motherboard

Configuration 1

X8DTH-iF X8DTH-6F

CPU

Soc kets

2 116790-024

RES-32XR3

Manual

Part Number

RES-22XR3

Manual

Part Number

116789-024

X8DTi

Configuration 2

X8DTi-F

2 117022-024 117017-024

X8DTi-LN4F

X8DT3

Configuration 3

X8DT3-F

2 117023-024 117018-024

X8DT3-LN4F

Configuration 4 X8DTN+ 2 117024-024 117019-024

Configuration 5

X8DAi X8DA3

2 117025-024 117020-024

Configuration 6* X8DAH+-F 2 117026-024 117021-024

RES-22XR3

with Riser

Manual

Part Number

RES-12XR3

Manual

Part Number

Configuration 7 X8DTU-F 117280-024 116970-024

Naming Key: X8Dvwxyz  System RES-x2XR3, where x = 3, 2, or 1

v: A = Sound chip; no graphics chip

T = Graphics chip; no sound chip * Configuration 6 motherboard X8DAH+-F supports both audio and video; however, the naming key does not contain a “T” in the title.

w: H = Two Tylersberg Northbridge chips

blank = One Tylersberg Northbridge chip U = Motherboard with cutout

x: i=SATA only

3 = SAS 1.0 6 = SAS 2.0

y: LN4 = Extra gigabit Ethernet controller for two extra ports z: F=IPMI

blank = No IPMI

a—All motherboards measure 12”W x 13”L except X8DTN+ and X8DAH+-F, which are 13.68”W x 13” L.

xxii

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Table 2. RES-x2XR3S / RES-x1XR3 17”-Deepa Chassis Manual Matrix

Preface

Mother-

board

X8DTL-6F X8DTL-6

X8DTL-3F X8DTL-3

X8DTL-iF X8DTL-i

X8DAL-3 X8DAL-i

CPU

Soc

kets

RES-32XR3S

Manual P/N

RES-22XR3S

Manual P/N

RES-12XR3S

Manual P/N

2 117408-024 117412-024 117416-024

2 117409-024 117413-024 117417-024

2 117410-024 117414-024 117418-024

2 117411-024 117415-024 117419-024

RES-31XR3 Manual P/N

RES-21XR3 Manual P/N

X8SAX 1 117420-024 117421-024

X8ST3-F X8STE

117385-024 117422-024

X8STi X8STi-F X8STi-LN4

118188-024 117423-024

X8STi-3F

RES-11XR3 Manual P/N

Naming Key: X8uvwxyz  System RES-x2XR3S and RES-x1XR3, where x = 3, 2, or 1 u: D = Double CPU sockets

S = Single CPU socket

v: A = Sound chip; no graphics chip

T = Graphics chip; no sound chip

w: Not applicable x: i=SATA only

3 = SAS 1.0 6 = SAS 2.0

y: LN4 = Extra gigabit Ethernet controller for two extra ports z: F=IPMI

blank = No IPMI

a—The 17”-deep RES XR3 chassis actually measures 17.07” deep, but for simplicity will continue to be referred to as being 17” deep throughout these manuals.

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RES-22XR3 Installation Manual - Configuration 1 Version 1.3

A matrix describing RES chassis that are configured for front-I/O connector and front-PCI card access in a 16” chassis is given in Table 3, page xxiv. This chassis design makes it more convenient to install cables to the system and demands no access to the rear of the chassis except to replace a fan. Figure 2 shows the front view of a standard rear-I/O RES-32 chassis (Figure 3 on page xxv shows the rear view); Figure 4 shows the front view of a front-I/O RES-32 chassis (Figure 5 shows the rear view).

Table 3. Front I/O 16”-Deep Chassis Manual Matrix

Mother-

board

X8DAH+-F* 2 117611-024 X8DTU-F 2 117664-024

Naming Key: X8uvwxyz  System RES-x2XR3S and RES-x1XR3, where x = 3, 2, or 1

*RES-32XR3/FIO motherboard X8DAH+-F supports both audio and video;

however, the naming key does not contain a “T” in the title.

u: D = Double CPU sockets

S = Single CPU socket

v: A = Sound chip; no graphics chip

T = Graphics chip; no sound chip

w: Not applicable x: i=SATA only

3 = SAS 1.0 6 = SAS 2.0

y: LN4 = Extra gigabit Ethernet controller for two extra ports z: F=IPMI

blank = No IPMI

CPU

Soc

kets

RES-32XR3/FIO Manual P/N RES-22XR3/FIO Manual P/N

xxiv

Figure 2. Front View of a Standard Rear-I/O RES-22 Chassis (Doors Removed)

Themis Computer

Figure 3. Rear View of a Standard Rear-I/O RES-22 Chassis

Preface

Themis Computer

Figure 4. Front View of a Front-I/O RES-22 Chassis

Figure 5. Rear View of a Front-I/O RES-22 Chassis

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RES-22XR3 Installation Manual - Configuration 1 Version 1.3

The 2RU-high (3.5”) RES-22XR3 has been designed to fit into a standard 19” rack and is provided with rack-mount brackets with handles. Optional rack-mount slides are also available. The RES-22XR3 is rugged enough to withstand extreme shock (up to 35G), vibration, temperature, and EMI associated with such demanding markets as the military, aerospace, and telecommunications industries.

The Intel Xeon CPUs operate with a QPI (Quick Path Interconnect) up to 6.4 GT/s and support up to 192 GigaBytes 1333/1066/800-MHz DDR3 ECC DIMM memory modules. The RES-22XR3 is based on the functionality and capability of the following Intel chipset:

• Intel 5520 (Tylersburg) chipset

• ICH10R + IOH-36D

An overview of RES-22XR3 design and specifications is given in Chapter 1, "Overview and Specifications", of this manual.

This manual is intended for an experienced system administrator with a knowledge of both networking and high-speed server systems.

Website Information

Themis Computer corporate and product information may be accessed on the World Wide Web by browsing the website http://www.themis.com .

Your Comments are Welcome

We are interested in improving our documentation and welcome your comments and suggestions. You can email your comments to us at docfeedback@themis.com. Please include the document part number (116789-024) in the subject line of your email.

xxvi

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Preface

Notes, Cautions, Warnings, and Sidebars

The following icons and formatted text are included in this document for the reasons described:

Note: A note provides additional information concerning the procedure or action being described.

Caution: A caution describes a procedure or action that may result in damage to the equipment. This may involve—but is not restricted to—heavy equipment or sharp objects. T o reduce the risk, follow the instructions accompanying this symbol.

Themis Computer

Warning: A warning describes a procedure or action that may cause injury or death to the operator as a result of hazardous voltages. To reduce the risk, follow the instructions accompanying this symbol.

Sidebar: A “sidebar” adds detail to the section within which it is placed, but is not absolutely vital to the description or procedure of the section.

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RES-22XR3 Installation Manual - Configuration 1 Version 1.3

xxviii

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General Section

1.1 Overview

Chapter

Overview and Specifications

The RES-22XR3 Configuration 1 (see Figure 1-1 below; a block diagram is given in Figure 1-2 on page 1-3) is a rack-mounted high-performance system designed specifically for above-average shock and vibration environments. The RES-22XR3

supports two Intel 1366-pin LGA 64-bit 5500/5600-Series Xeon™ processors, each with a QPI (Quick-Path Interconnect) up to 6.4 GT/s (Giga-Transfers per Second) supporting 192 GB of 1333/1066/800-MHz DDR3 ECC Registered memory modules. Its computer/graphics-intensive and diverse-I/O capabilities are ideal for military/aerospace and commercial telecommunications applications. Motherboards supported by Configuration 1 are listed in Table 1-1, page 1-2.

Themis Computer

Figure 1-1. RES-22XR3 (Front Doors Installed)

1-1

RES-22XR3 Installation Manual - Configuration 1 Version 1.3

Table 1-1. RES-22XR3 Motherboard Options—Configuration 1

Mother-

board

IPMI SATA SAS

Memory

Slots

Graphics Audio

PCI-e

x16

X8DTH-iF Yes Yes — 12 Yes — —

X8DTH-6F Yes Yes Yes 12 Yes — —

a—SuperMicro Computer, Inc. b—All PCI-e x8 are in x16 slots.

The RES-22 is designed within a 2RU-high (3.5”) form-factor 20” (50.8 cm) deep and 17” (43.2 cm) wide (which, with mounting brackets, fits a 19”-wide rack). Major f e a tures of Configuration 1 motherboards are listed in Table 1-2.

Table 1-2. Major Features of the RES-22—Configuration 1

Feature Details

Processor (CPU) Chipset

 Two Quad/Dual-Core 5500 or Quad/Six-Core 5600 Xeon CPUs  Dual Intel 5520 (Tylersburg) chipset

 ICH10R (Southbridge) + 2x IOH-36D

PCI-e, PCI-X, and PCI Slots

PCI-e x8PCI-e

Slots

1–7

Slots

1–7

———

PCI-X PCI

Memory

 Twelve (12) 240-pin DIMM sockets supporting up to 192GB (16GB DIMMs)

of 1333/1066/800 MHz DDR3 ECC Registered Memory

Expansion slots Rear-Panel I/O

Peripheral Support

Operating temperature

 7 PCI-Express 2.0 x8 (all in x16 slots)  See Table 1-5 on page 1-9 for details  Eight removable SAS

 1 combination SA TA CD-RW/DVD-ROM slimline (IDE) drive  0° up to 55° C (32° up to 149°F)

or five SATA II storage drives with three SAS

Shock endurance  35G @ 25-msec duration (3 axis) Dimensions

 3.5” (2RU) high, 17” (43.2 cm) wide (19”/48.3 cm with mounting brackets),

20” (50.8 cm) deep

Rack-mount brackets and slides

Dual power supplies

a—SAS is supported directly from the motherboard only on the X8DTH-6F. Additional SAS/SATA drives are supported by an

optional PCIe-card installation. Chassis supports a total of 8 storage drives.

 Left and right rack-mount tabs are attached to the chassis  Left and right rack-m o un t slide s ar e optional

 750 watts each, auto-ranging (100–265 VAC)  Load-sharing N+1 redundant, hot-pluggable  (Optional)—Choice of 750-watt (48V) or 500-watt (28V) DC Power supply

1-2

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1—Overview and Specifications

SATA

USB

LSI SAS2008 6Gb/s

Optional

0, 1, 2, 3

4, 5, 6, 7

SIO

U25

W83527HG

RTL8201N

Processor#2

Processor#1

(5500/5600 Series)

PCI-E X8 in X16 Slot

LAN3

Intel 82576

LAN

LAN1

LAN2

Intel 5520

IOH2-36D

Intel 5520

IOH1-36D

Ports 3&4

Ports 5&6

Ports 7&8

Ports 9&10

Ports 1&2

Ports 3&4

Ports 5&6

Ports 7&8

U3H1 ESI

Ports 1&2

Ports 9&10

Intel

ICH10R

DDR II

DDR3

800/1066/1333

#0-1

DDR3

800/1066/1333

#1-1

#1-2

#1-3

#1-4

#1-5

#1-6

#0-2

#0-3

#0-4

#0-5

#0-6

BMC

WPCM450

VGA

COM1

External

BIOS

QPI

QPI QPI

PCI-E X8

PCI-E X4

RMII_IPMI

SATA2

USB2.0

SPI

ESI X4

6 FRONT

2 REAR+4 FRONT+1 TYPE A

LPC BUS

USB

PCI 33MHz

IPMI_LAN

Note: SAS is supported directly from the

motherboard on the X8DTH-6F only.

Overview

Themis Computer

Figure 1-2. X8DTH-iF/X8DTH-6F Motherboard Block Diagram

1-3

RES-22XR3 Installation Manual - Configuration 1 Version 1.3

Front View (Doors Removed)

Power Socket

(3-prong NEMA 15)

Dual Power Supplies

System Power

Power Supply

Latch Lock

ON/OFF Switch

CD-RW/DVD-ROM Combo Slimline Drive

Rear I/O Panel (see Figure 1-4, page 1-5)

17” (42.7 cm), 19” with Rack Mounts

20” (50.8 cm) deep

Rear View

Slot 1

Slot 7

Front LED Indicator Panel

(see Figure 1-4 on page 1-5)

Storage Drive (SAS/SATA II) - 8 Total

3.5”

(2RU)

PCI-Express 2.0 x8 (in x16 slot)

PS1

PS2

* SAS is supported directly from the

motherboard on X8DTH-6F only.

PCI-Express 2.0 x8 (in x16 slot)

* Chassis supports a

total of 8 drives.

Figure 1-3. External Features of the RES-22 (Front and Rear)

The RES-22XR3 front panel houses eight removable storage drive bays (see Figure 1-3). Both motherboards support SATA II drives, but the X8DTH-6F motherboard

also supports SAS 2.0 drives, hence a combination of both SATA and SAS drives may be installed (up to five SATA II storage drives with three SAS drives/combinations can be achieved by installing a PCI-E add-on card. Storage drive requirements should be ordered at the time of purchase.

Also included on the front panel is a combination SATA CD-RW/DVD-ROM Slimline drive, an ON/OFF power button, and system LEDs (see Figure 1-4 on page 1-5). The rear panel contains I/O faceplates for seven PCI cards (graphics, RAID, NIC, etc.), two power supply modules with latch locks and power-cord sockets, and all I/O connectors (See Figure 1-4).

Major internal components of the RES-22XR3 can be seen in the open top view (cover removed) shown in Figure 1-5 on page 1-6.

). Additional

1-4

Themis Computer

1.2 System LEDs and I/O Connectors

I/O Connectors

PS/2 Keyboard

IPMI Dedicated LAN

COM 1 Port

PS/2 Mouse

VGA Por t LAN 1 Por t LAN 2 Port

USB1 (top) USB0 (bottom)

Gigabit Ethernet

LEDs

NIC1 NIC2Storage

Drives

Power ON/OFF

Button

Power

Fail

(PS1)

Overheat/

Fan Fail

Power

Fail

(PS2)

ENET1

ENET2

Left Power

Supply

Right Power

Supply

Rear Panel

Front Panel (Doors Removed)

All RES-22 system LEDs are located on the front panel (see A, Figure 1-4); all I/O connectors are located on the rear panel (see B, Figure 1-4).

1—Overview and Specifications

Figure 1-4. RES-22 System LEDs and I/O Connectors (Configuration 1)

Themis Computer

LEDs are described in Table 1-4 on page 1-8; I/O connectors are described in Table 1-5, page 1-9.

1-5

RES-22XR3 Installation Manual - Configuration 1 Version 1.3

Front

Storage Drive (Total of 8)

CD/DVD Combo-Drive Housing

80-mm Fan (Total of 3)

Air-Flow Deflector

AC Power Supply

(12 DIMM Memory Modules underneath)

AC Power Supply

Rear I/O Slots 1 to 7

PCI Slot 1

2 3 4

5 6

(PCI-Express 2.0 x8) (PCI-Express 2.0 x8)

(PCI-Express 2.0 x8)

Note: All x8 PCI-Express slots

are in x16 slots.

PCI Card Retainer Bracket

Lithium Battery (Underneath Air-Flow

Deflector)

Cutaway View

1-6

Figure 1-5. Major Components of the RES-22 (Open Top View)

Themis Computer

1—Overview and Specifications

System LEDs and I/O Connectors

Table 1-3. Power Supply LED Behavior

Symbol LED Power System LED Description

And

On (red LED)

Off

On (red LED)

Power Fail LED

(Left Power Supply)

Note: system is powered on

Power Fail LED

(Right Power Supply)

Note: system is powered on

Power Fail LED

(Left & Right Power supply)

Note: system is powered on

Power Fail LED

(Left or Right Power Supply)

Note: system is powered off

If system is powered on,

warns that the left power supply has failed or has lost AC input.

If system is powered on,

warns that the right power supply has failed or has lost AC input.

System is powered on and

power supply modules are functioning normally, or system has been shut down and there has been no interruption to the AC power.

AC power has been inter-

rupted to both power sup-

ply modules. When power is restored but system is still off, one of the two indicator lights will be lit.

Rear Power Supply Modules

a—This LED behavior indicates only that AC power has interrupted to both power supplies, and does not indicate which

b—This LED behavior indicates that DC power is not being used, and the system is off. It does not indicate a loss of AC

Themis Computer

On (green LED)

Green LED

(adjacent to AC input)

Note: system is powered on

Green LED

Off

(adjacent to AC input)

Note: system is powered off

power supply module lost power first, or regained power first.

power to the power supply module(s).

System is receiving DC

power (3.3V , 5V, 12V) from the power supply module

System is off and not re-

ceiving DC power from the Power Supply module.

1-7

RES-22XR3 Installation Manual - Configuration 1 Version 1.3

ENET1

ENET2

Table 1-4. System LEDs

Symbol LED Description

Power

Storage Drive

(Gb Ethernet)  Indicates network activity on LAN 1.

NIC1

NIC2 (Gb Ethernet)

Overheat/Fan Fail —Normally OFF —RED light when tem-

perature limits are exceeded

 Indicates that the system is turned on.

 Indicates SAS/SATA II storage-drive activity.

 Indicates network activity on LAN 2.

 Warns that the system is exceeding specified

temperature parameters. The CPU overheat warning function must be enabled in the BIOS, thus allowing the user to define an overheat temperature, which—when exceeded—triggers the overheat warning LED.

1-8

Symbol Rear Panel LED(s) Description

Each Ethernet port contains two LEDs:

 The color of the left LED indicates the LAN con-

nection speed:

- Off = 10 Mbps

- Green = 100 Mbps

N/A

LAN1 and LAN2 and IMPI Dedicated LAN Port

- Amber = 1 Gbps

 The right LED, when lit, indicates LAN activity.

a—NIC = Network Interface Controller.

Themis Computer

Table 1-5. Rear-Panel I/O Connectors

Connector Description

1—Overview and Specifications

System LEDs and I/O Connectors

PS/2 Mouse

PS/2 Keyboard

USB 0 and USB 1

Hi-Speed USB 2.0 Serial Ports

COM 1 Serial Port

Super VGA Port

Ethernet LAN Ports

IPMI Dedicated LAN

Port

 6-pin mini-DIN (female) connector to attach a PS/2 mouse device.

 6-pin mini-DIN (female) connector to attach a PS/2 keyboard device.

 Two 4-pin USB con nectors to attach seria l devices to USB Port 0 and

USB Port 1.

Note: Five additional USB ports can be accessed directly from the

motherboard.

 One DB9 (male) connector on rear panel to attach a serial device to

the COM 1 port

 15-pin VGA connector to attach a monitor device.

 St andard RJ45 connectors to attach o ne or two gigabit Etherne t LAN

line(s)—LAN 1 and LAN 2.

 Standard RJ45 connector to attach a dedicated IPMI LAN line.

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1.3 Chipset Overview

Built upon the functionality and capability of the Intel 5520 platform, RES-22XR3 motherboards provide the performance and features required for dual processorbased high-end systems, including optimal configuration options for communications, high-end CAD systems, presentation, computation or database applications. Two Intel 5500/5600 Series (LGA 1366) processors, each processor supporting two full-width Intel QuickPath Interconnect (QPI) @6.4 GT/s with a total of up to 51.2 GB/s Data Transfer Rate (6.4 GT/s per direction). The Intel chipset consists of:

• Dual Intel 5520 (Tylersburg) chipset, and

• the ICH10R + 2x IOH-36D

With the QPI controller built in the processor, the 5500/5600 Series Processor platform offers the next generation point-to-point system interconnect interface, replacing the current Front Side Bus Technology, providing substantial system performance enhancement by utilizing serial link interconnections, allowing increased bandwidth and scalability. The IOH connects to each processor through an independent QuickPath Interconnect link. Each link consists of 20 pairs of unidirectional differential lanes for transmission and receiving in addition to a differential forwarded clock. A full-width QuickPath interconnect link pair provides 84 signals. Each processor supports two QuickPath links, one going to the other processor and the other to the 5520 chip.

The Intel 5520 platform supports up to 36 PCI Express Gen2 lanes, and the 5520 Northbridge supports peer-to-peer read and write transactions. The ICH10R provides up to 7 PCI-Express ports, six SATA ports and 10 USB connections. In addition, the Intel 5520 platform also offers a wide range of RAS (Reliability, Availability and Serviceability) features. These features include memory interface ECC, x4,/x8 Single Device Data Correction (SDDC), Cyclic Redundancy Check (CRC), parity protection, out-of-band register access via SMBus, memory mirroring, memory sparing, and Hot-plug support on the PCI-Express Interface.

1.3.1 The 5500/5600 Series Processor and 5520 Chip set

• Four/six processor cores in each processor with 8MB shared cache among cores

• Two full-width Intel QuickPath interconnect links, up to 6.4 GT/s of data transfer rate in each direction

• Virtualization Technology, Integrated Management Engine supported

• Point-to-point each coherent interconnect, Fast/narrow unidirectional links, and Concurrent bi-directional traffic

• Error detection via CRC and Error correction via Link level retry

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1.4 Special Features

1.4.1 Recovery from AC Power Loss

BIOS provides a setting for you to determine how the system will respond when AC power is lost and then restored to the system. You can choose for the system to remain powered off (in which case you must press the power switch to turn it back on) or for it to automatically return to a power- on state. See the Advanced BIOS Setup section to change this setting. The default setting is Last State.

1.5 PC Health Monitoring

This section describes the PC health monitoring features of the RES-22XR3 motherboards. All have an onboard System Hardware Monitor chip that supports PC health monitoring. An onboard voltage monitor will scan these onboard voltages continuously:

1—Overview and Specifications

CPU1 Vcore, CPU2 Vcore, CPU1 Vtt, CPU2 Vtt, CPU1 DIMM, CPU2 DIMM,

1.1V, 1.5V, 1.8V, 3.3V, 12V, 5V, 3.3 Vsb, and VBAT. Once a voltage becomes unstable, a warning is given or an error message is sent to

the screen. Users can adjust the voltage thresholds to define the sensitivity of the voltage monitor. All threshol ds (high and low for voltage) can be set by using Super Micro’s SuperDoctor system monitoring software under the section “Monitoring Item”. Visit http://www.supermicro.com/products/accessories/software/SuperDocto-

rIII.cfm for more information on SuperDoctor

1.5.1 Fan Status Monitor with Firmware Control

The PC health monitor can check the RPM status of the cooling fans. The onboard chassis fans are controlled by Thermal Management in the BIOS (under Hardware Monitoring in the Advanced section). Fan status can also be monitored by using SuperMicro’s SuperDoctor software.

1.5.2 Environmental Temperature Control

The thermal control sensor monitors the CPU temperature in real time and will turn on the thermal control fan whenever the CPU temperature exceeds a user-defined

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threshold. The overheat circuitry runs independently from the CPU. Once it detects that the CPU temperature is too high, it will automatically turn on the thermal fan control to prevent any overheat damage to the CPU. The onboard chassis thermal circuitry can monitor the overall system temperature and alert users when the chassis temperature is too high.

Caution: T o avoid possible system overheating, please be sure to provide adequate airflow to your system, and ensure there is no debris blocking any of the airflow vents on the system chassis.

1.5.3 System Resource Alert

This feature is available when used with Supero Doctor III in the Windows OS environment or used with the Supero Doctor II in Linux. Supero Doctor is used to notify the user of certain system events. For example, you can also configure Supero Doctor to provide you with warnings when the system temperature, CPU temperatures, voltages and fan speeds go beyond a pre-defined range.

1.6 ACPI Features

ACPI stands for Advanced Configuration and Power Interface. The ACPI specification defines a flexible and abstract hardware interface that provides a standard way to integrate power management features throughout a PC system, including its hardware, operating system and application software. This enables the system to automatically turn on and off peripherals such as CD-ROMs, network cards, storage drives and printers.

In addition to enabling operating system-directed power management, ACPI provides a generic system event mechanism for Plug and Play and an operating systemindependent interface for configuration control. ACPI leverages the Plug and Play BIOS data structures while providing a processor architecture-independent implementation that is compatible with Windows 7/ XP/ 2003/ 2008/ Vista Operating Systems.

1.6.1 Slow Blinking LED for Suspend-State Indicator

When the CPU goes into a suspend state, the chassis power LED will start blinking to indicate that the CPU is in suspend mode. When the user presses any key , the CPU will wake-up and the LED will automatically stop blinking and remain on.

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1.6.2 Main Switch Override Mechanism

When an ATX power supply is used, the power button can function as a system suspend button to make the system enter a SoftOff state. The monitor will be suspended and the storage drive will spin down. Pressing the power button again will cause the whole system to wake-up. During the SoftOff state, the ATX power supply provides power to keep the required circuitry in the system “alive.” In case the system malfunctions and you want to turn off the power, just press and hold the power button for 4 seconds. This option can be set in the Power section of the BIOS Setup routine.

Note: All RES systems leave the factory with ATX compliant power supplies pre installed.

1—Overview and Specifications

1.7 Super I/O Controller

The Super I/O chip storage-drive adapter functions include:

• a floppy storage drive controller (industry standard 82077/765 compatible)

• a data separator

• write pre-compensation circuitry

• decode logic

• data rate selection

• clock generator

• drive interface control logic

• interrupt and DMA logic

The wide range of functions integrated onto the Super I/O greatly reduces the number of components required for interfacing with floppy storage drives. The Super I/O supports 360K, 720K, 1.2M, 1.44M or 2.88M storage drives, and data transfer rates of 250 Kb/s, 500 Kb/s or 1 Mb/s.

It also provides two high-speed, 16550-compatible serial communication ports (UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable baud rate generator, complete modem control, and a processor interrupt system. Both UARTs provide legacy speed with baud rate up to 115.2 Kbps, and an advanced speed with baud rates of 250K, 500K, or 1 Mb/s (for higher speed modems).

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The Super I/O provides functions that comply with ACPI (Advanced Configuration & Power Interface), which includes support of legacy and ACPI power management through an SMI or SCI function pin. It also features auto power management to reduce power consumption.

1.8 Winbond WPCM450 Controller

The Winbond WPCM450 Controller is a Baseboard Management Controller (BMC) that supports the 2D/VGA-compatible Graphics Core with the PCI interface, Virtual Media, and Keyboard/Video/Mouse Redirection (KVMR) modules. With blade-oriented Super I/O capability built-in, the WPCM450 Controller is ideal for legacyreduced server platforms.

The Winbond WPCM450 Controller interfaces with the host system via a PCI interface to communicate with the Graphics core. It supports USB 2.0 and 1.1 for remote Keyboard/mouse/virtual media emulation. It also provides LPC interface to control Super I/O functions. The Winbond WPCM450 BMC is connected to the network via an external Ethernet PHY module.

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1.9 Specifications

1.9.1 General

Table 1-6 lists general specifications for the RES-22.

1—Overview and Specifications

Parameter Description

Dimensions

Weight

19” Rack-Mountable

with Slide capability

Temperature

Operating: Non-Operating:

Relative Humidity

Operating: Non-Operating:

Table 1-6. RES-22XR3 General Specifications

 3.5” (2RU) high  17” (43.2 cm) wide (19” rack-mountable)  20” (50.8 cm) deep

 25 pounds (16 kg); includes 2 SAS/SATA II storage drives, 2

CPUs. 6 DIMMs, and 2 power supplies

 Add 8.8 pounds (4 kg) for the shipping container and two AC

power cords

 The manual and associated shipping paperwork weighs ap-

proximately 1 lb (0.5 kg)

 Left and right rack-mount tabs attached to chassis  Left and right rack-mount slides are optional

 0° up to 55° C (32° up to 149°F)—processor-dependent  –40° to 70° C (–40° to 158° F)

 8% to 95% (non-condensing)  5 to 95% (non-condensing)

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Maximum Wet Bulb

Operating: Non-Operating:

Altitude

Operating: Non-Operating

a—Specifications are dependent on the configurations in this manual. b—These are “typical” specifications for a RES system. Please contact Themis for the exact specifications

of your configured system.

 55°C, non-condensing  70°C, non-condensing

 0 to 10,000 feet above sea level  0 to 40,000 feet above sea level

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1.9.2 Electrical

Table 1-7 lists the electrical specifications for the RES-22XR3.

Table 1-7. RES-22XR3 Electrical Specifications

Description

Parameter

AC (120 volts, 750W) DC (48 volts, 750W) DC (28 volts, 500W)

Input Power (typical)

 370 watts (typical)

 450 watts (typical)

Input Current  3.5 amperes @120 Vac  13.5 amperes @48 Vdc  16 amperes @28 Vdc Input Frequency

Input Voltage Input VA Rating

BTU Rating Power Factor Input Leakage Cur-

rent

Plug Type

a—These are “typical” results from a RES system. Please contact Themis for information regarding your exact system configuration. b—Tested using a watt meter with a SuperMicro X8DA3 Motherboard, nVidia GeForce 9600 GT graphics card, Intel Dual/Quad-Core

X5550 CPU @ 2.66GHz, and 32GB of RAM. Used RHEL 5.3 running Version 2 Burn-in-Test.

c—Does not include plug-in PCI cards.

 47–63 Hertz N/A N/A  100–265 Vac,

internally fused

 425 VA NA NA  1447 BTU/hour  1447 BTU/hour  1447 BTU/hour  0.99 NA NA

 3.5 mA NA NA

 IEC

 40–72 Vdc,

internally fused

 Y-Type

(SVS5-4 or equivalent)

 18–36 Vdc,

internally fused

 Y-Type

(SVS5-4 or equivalent)

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1.9.2.1 System Power

The RES-22 operates with two N+1 redundant AC power supplies of 750-watts capacity each that auto-range single-phase AC input from 100 to 265 VAC (47 to 63 Hertz) sources. Filtered and fused (internal) AC is supplied to each power supply from a rear-mounted power connection.

Two optional N+1 redundant DC power supplies of 750 watts (48 volts) or 500 watts (28 volts) each may be substituted for the AC power supplies (see Table 1-7). These supplies should be specified at the time of your order.

Note: Some AC RES systems may be installed with 650-watt instead of 750- watt power supplies, which should not affect the performance of the system.

1.9.2.2 Output Voltage

The RES-22 power supply provides output voltages that are split between +3.3V, +5V, +5Vsb, +12V, and -12V rails.

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1.9.3 Environmental

Front Sound Baffle

1.9.3.1 Shock

The RES-22 is designed to survive an elevated shock environment. All structural components are welded together, enabling the system to survive a maximum 3-axis shock load of 35G at 25-ms duration.

1.9.3.2 Electrostatic Discharge

The RES-22 is designed to tolerate electrostatic pulses up to 15 kilovolts (KV) with no impact on system operation.

1.9.3.3 Noise

The RES-22 conforms to the 54-dB noise specification. It is possible to achieve further noise reduction by installing a sound baffle (muffler) on both the front (see Fig- ure 1-6) and the rear (see Figure 1-7 on page 1-18) of the RES-22 chassis. Call your Themis representative for additional information.

1—Overview and Specifications

Specifications

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Figure 1-6. RES-22XR3 with Front Sound Baffle Installed (Front View)

Note: All RES systems are shipped with BIOS fan speed set to the quietest mode. The default fan speed control mode of the RES-22XR3 is Energy Saving/ES.

Front Access—Opening the two front doors of the RES-22 requires removing the front sound baffle. To do this, loosen the two (2) captive knurled Phillips screws (A) holding the baffle to the chassis and remove the baffle.

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Rear Sound Baffle

AA AA

Right Side

Left Side

RearRear

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Figure 1-7. RES-22XR3 with Rear Sound Baffle Installed (Rear View)

Rear Access—Accessing the I/O connectors and PCI cards on the rear of the RES22 requires opening the rear sound baffle door. To do this, loosen the four (4) captive knurled Phillips screws A holding the baffle door to the chassis and swing the door downward away from the chassis, exposing the rear connectors and PCI cards.

Removing the protective top cover for access to the interior requires that the rear sound baffle be totally removed (this can be done with the baffle door closed). To do this, five (5) M3x4 flathead Phillips screws B must be removed, two on each side of the baffle and one (captive) in the middle on the top (see Figure 1-7).

After removing the rear baffle, the top cover can be removed as described in Section

2.1.1, “Remove Protective Top Cover,” on page 2-1 (Chapter 2, "Installation and

Operation").

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1.10 Packaging and Shipping

The RES-22 is packaged in a reusable shipping container. Approximate weight of an empty container and two AC power cords is 8.8 pounds (4 kg).

The approximate weight of a RES-22 (loaded with 2 storage drives, 2 CPUs, 6 DIMMs, and 2 power supplies) is approximately 25 pounds (11.4 kg). [See Table 1-8 on page 1-20 for a general weight table for all models of the RES Series.]

The approximate weight of a manual and associated shipping paperwork is one pound (0.5 kg).

Therefore, both the shipping container and a fully installed RES-22 including power cords, manual, and associated paperwork, weigh under 35 pounds (16 kg).

1—Overview and Specifications

Caution: Do not discard the original packaging in which your system was shipped.

The original packaging was designed specifically to withstand the stress and rigors of today’s shipping environment. It will be needed in the event the system must be shipped back to Themis Computer. For re-packing instructions, refer to Appendix E, “Re-Packaging for Shipment”

1.10.1 Accessory Kit

Each RES-22XR3 is packaged with an Accessory Kit, consisting of the following items:

A. Two AC Power Cords B. Two storage drive Barrel Keys

When you unpack the RES-22XR3, please verify that all of these items are included. If any of these items are missing or not as pictured, please call Themis Technical Support at 510-252-0870, or send an email to support@themis.com.

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To learn how to secure the AC power cords and the power-cord retainer bracket, refer to Section 2.3.1, “Plugging in the AC Power Cords,” on page 2-18.

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1.10.2 Rack-Mount Slides (Optional)

Rack-Mount Slides can be mounted on each side of the RES-22XR3 for the purpose of sliding the unit in and out of a rack. Mounting slides are optional and can be ordered at the time of purchase.

To learn how to install rack-mount slides, refer to Appendix B, “Rack-Mount Slide Installation”.

Table 1-8. Approximate Weightsa of the RES Series

Model

Weight

(Approximate)

CPU

Sockets

Depth Description

RES-12XR3 19.5 lbs (8.9 kg) 2 20” Includes:

 All CPU sockets filled

RES-12XR3-S 17 lbs (7.7 kg) 2 17”

RES-11XR3 16.5 lbs (7.5 kg) 1 17”

RES-22XR3 25 lbs (11.4 kg) 2 20”

RES-22XR3-S 23 lbs (10.4kg) 2 17”

RES-22XR3/FIO 25.3 lbs (11.5kg) 2 16”

RES-21XR3 22.5 lbs (10.2 kg) 1 17”

RES-32XR3 28.5 lbs (12.9 kg) 2 20”

RES-32XR3-S 26.5 lbs (12 kg) 2 17”

RES-32XR3/FIO 29 lbs (13.2 kg) 2 16”

RES-31XR3 26 lbs (11.8 kg) 1 17”

 6 DIMMs  2 storage drives  2 PCI cards  1 CD-RW/DVD-ROM drive  2 power supplies

Includes:

 All CPU sockets filled  6 DIMMs  2 storage drives  2 PCI cards  1 CD-RW/DVD-ROM drive  2 power supplies

Includes:

 All CPU sockets filled  6 DIMMs  2 storage drives  2 PCI cards  1 CD-RW/DVD-ROM drive  2 power supplies

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RES-12XR3Rear I/O

RES-22XR3/FIO 21 lbs (kg) 2 13.6”

17 lbs (kg) 2 15”

Includes:

 All CPU sockets filled  All storage drive bays filled  2 power supplies

RES-32XR3/FIO 25 lbs (kg) 2 13.6”

a—These are “typical” weights for a RES system. Please contact Themis for the exact weight of your configured system.

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2/RES-22XR3

Installation Section

This chapter describes:

• How to install a memory module, storage drive, PCI card, 80-mm-fan, power supply, and lithium battery.

Chapter

Installation and Operation

• Rack-mount brackets and slides

• How to turn the RES-22XR3 on and off

2.1 Installation Procedures

Caution: Use industry-standard ESD grounding techniques when handling all components. Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive components in antistatic bags before placing them on any surface. Handle all IC cards by the front panel or edges only.

T o install or replace a storage drive, fan, or power supply , skip the next section and proceed directly to page 2-9, page 2-12, or page 2-14, respectively. Replacement of motherboard components, however, requires removal of the protective cover.

2.1.1 Remove Protective Top Cover

To access a motherboard component, open the RES-22XR3 as follows:

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Loosen the 2 captive access-cover screws...

Rear View

... and slide the top cover toward the rear until the top hooks and tabs clear all chassis slots

Chassis slot

Left-side top edge

1. Loosen the two captive Phillips screws holding the protective top access cover to the rear of the RES-22XR3 chassis (see A, Figure 2-1).

2. Both the front and sides of the cover have flat hooks or tabs underneath that fit under slots on the chassis top edges (see B, Figur e 2-1). Remove the cover by sliding it toward the rear until it is free of these chassis slots.

3. Store the cover in a safe place until it is replaced.

4. Proceed to the appropriate section to install or replace a memory module (page 2-3), PCI card (page 2-7), or lithium battery (page 2-8).

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Figure 2-1.

Remove the RES-22XR3 Protective Access Cover

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2.1.2 Memory Modules

The RES-22XR3 supports memory according to Table 2-1. Note the total memory capacity varies according to the motherboard installed in the RES-22XR3.

Table 2-1. RES-22XR3 Memory Capacity

2—Installation and Operation

Installation Procedures

Memory Parameters

DIMMs

Motherboard

Capacity

X8DTH-iF 192GB Yes 1333/1066/800 12 240 X8DTH-6F 192GB Yes 1333/1066/800 12 240

a—Based on 16GB DIMM availability.

DDR3

Registered

ECC

Speed (MHz)

Number

of DIMMS

Pins per

DIMM

Caution: Exercise extreme caution when installing or removing FBD Memory Modules to prevent any possible damage.

Table 2-2. RES-22XR3 Optimal Memory Population—Two CPUs Installed

CPU 1 CPU 2

Branch 0 Branch 1 Branch 2 Branch 0 Branch 1 Branch 2

6 DIMMs1A2A3A1A2A3A 12 DIMMs1A1B2A2B3A3B1A1B2A2B3A3B

When installing memory, follow these rules for best memory performance:

• Always start with P1-DIMM1A, the system will not boot if this DIMM Slot is vacant. When populating DIMM modules always start with Channel 1 (P1DIMM1A and 1B) first. Always make sure total DIMM capacity meets the minimal requirements of your OS.

• It is strongly recommended that you do not mix memory modules of different speeds, sizes, voltages and vendors.

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PCI Card Retainer Bracket

2.1.2.1 Installation

The following procedure explains how to install the DDR3 FBD Memory Modules.

1. Loosen and remove the eight (8) screws securing the air-flow deflector and

PCI card retainer bracket to the RES-22XR3 chassis (see Figure 2-2).

• Screw A—After removing the single screw A, remove the PCI card

retainer bracket and store it in a safe place.

• Screw B—Remove the seven (7) M3x4 flathead screws marked “B” in

Figure 2-2 which will loosen the air -flow diverter so tha t it can be removed from the system. After the air-flow diverter has been removed, the memory module slots will be exposed (see Figure 2-3 on page 2-5).

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Figure 2-2. Remove Air-Flow Deflector Screws

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2—Installation and Operation

P1 DIMM 1B P1 DIMM 1A

P1 DIMM 2B

P1 DIMM 2A

P1 DIMM 3B

P1 DIMM 3A

P2 DIMM 3A

P2 DIMM 3B

P2 DIMM 2A

P2 DIMM 2B

P2 DIMM 1A

P2 DIMM 1B

Branch 0

Branch 1

Branch 2

Branch 1

Branch 2

Branch 0

CPU 1 Socket

CPU 2 Socket

Installation Procedures

2. Remove the air-flow deflector from the system, which will expose the mem-

ory module slots (see Figure 2-3).

Figure 2-3. Memory Module Slot Locations

3. If a module is already seated in the slot you have selected for installation,

remove it by gently pressing down and outward on the latches at both ends of the slot (see Figure 2-4 on page 2-6), then pulling the old module directly up from the slot until it is free of the connector.

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downward & outward at each end

Press latch

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Figure 2-4. Memory Module Removal

4. Before inserting a new memory module into the vacant slot, make sure that

the two latches are pulled outward away from the center of the slot. With the latches in the outward position, gently insert the new module verti-

cally into its slot and press firmly downward until it snaps into place.

Note: Make sure the memory module has the proper orientation by aligning the alignment notch at the bottom edge with its counterpart ridge at the bottom of the slot.

5. If all the memory modules have been replaced in the system, replace the air

flow diverter and secure it with the seven screws previously removed in Step 1 on page 2-4).

6. Next, replace the PCI card retainer bracket (removed in Step 1).

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2.1.3 PCI Cards

PCI-Express 2.0 x8

Slot 1

2345 6

(all in x16 slots)

Slots 1 through 7

Loosen the captive knurled screw…

Captive knurled screw

PCI card clamp PCI card I/O panels (7 total)

… and swing the PCI card clamp upward.

RES-22XR3 Configuration 1 supports seven PCI-Express 2.0 x8 slots (all in x16 slots). All slots support cards up to 12.28-inches long (see Figure 2-5).

2—Installation and Operation

Installation Procedures

Figure 2-5. PCI Card Installation, Configuration 1

2.1.3.1 Installing Cards

Perform the following steps to install a PCI card:

1. Loosen the captive knurled screw on the PCI card clamp (see A, Figur e 2-6).

Figure 2-6. PCI Card Clamp

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2. Swing the PCI card clamp away from the top of the chassis, exposing the tops of the PCI card I/O panels (see B, Figure 2-6).

3. Locate the empty slot within which a card will be installed (see Figure 2-5).

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To release, squeeze battery latch together...

Battery

Latch

... and remove battery from socket

4. Install the new card, making sure the I/O panel is aligned with the chassis

opening.

5. Repeat Step 3 and Step 4 until all additional cards have been installed.

6. Swing the PCI card clamp back to its position over the PCI card I/O panels

and tighten the captive knurled screw on the PCI card clamp.

7. Attach any internal I/O cables to the installed PCI cards, and carefully fold

and tuck any exposed ribbon cables into the cabinet.

8. If you have no further installations to perform, close the RES-22XR3 chassis

by refastening the top cover removed in Section 2.1.1, “Remove Protective Top Cover,” on page 2-1.

2.1.4 Lithium Battery

2.1.4.1 Removing the Lithium Battery

Perform the following steps to remove the lithium battery (CR2032):

1. Make sure the system is powered off (see “Operation” on page 2-18).

2. Use the cutaway view of Figure 1-5 on page 1-6 as an indication of where the

battery is located on the motherboard. Locate the lithium battery socket and squeeze the latch (see A, Figure 2-7)

together until the battery lifts out of its socket.

3. Remove the old battery and replace with a new battery (see next section).

Figure 2-7.

The RES-22XR3 Lithium Battery and Socket

Note: The battery location is dependent on which motherboard is installed in the chassis.

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2.1.4.2 Installing a Lithium Battery

Knurled

Screw

Perform the following steps to insert a new lithium battery (CR2032):

1. Tilt the replacement battery into the empty socket so that it is angled under the battery latch (see B, Figure 2-7).

2. Carefully press down on the battery until it clicks firmly into place.

2.1.5 SAS/SATA II Storage Drive

Perform the following steps to remove and install a storage drive, which may be either SAS (X8DTH-6F motherboard only) or SATA. The front doors of the RES22XR3 must be unlocked and opened to access the storage drives (see Figure 2-8).

2—Installation and Operation

Installation Procedures

2.1.5.1 Opening the RES-22XR3 Front Doors

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Figure 2-8. Opening the RES-22XR3 Front Bezel Doors

Note: The type and location of storage drives must be specified at the time of the

order to provide the internal cabling.

The knurled captive screw on the front of the RES-22XR3 allows the doors to lock without a key. To unlock the doors, turn the screw counterclockwise and pull both doors away from the chassis.

The accessory kit shipped with your RES-22XR3 contains two barrel lock keys. This

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RES-22XR3 Installation Manual - Configuration 1 Version 1.3

Drive Lock

(one per drive)

Drive Release Button

Drive 0

Drive 1

Drive 2

Drive 3

Drive 4

Drive 5

Drive 6

Drive 7

provides you the option of unlocking/locking the storage drives (see Figure 2-9).

Figure 2-9. Unlocking the RES-22XR3 Storage Drives (Front Doors Removed)

2.1.5.2 Storage-Drive Removal

After opening the front doors, perform the following steps to remove and install a storage drive:

Note: Since RES-22XR3 storage drives are “hot-swappable”, it is not necessary to electrically turn off system power in order to remove and replace a drive (except the operating system drive). However, after a warning has been broadcast to all users, the drive being replaced should be dismounted (eject drive) before being removed. Consult your operating system (OS) manual for specific details.

1. Make sure the necessary precautions have been observed as per the above

Note (see “Operation” on page 2-18).

2. Locate the drive to be removed.

3. Insert the barrel lock key into the storage drive you want to remove, and turn it 45 degrees clockwise (presuming the storage drive is locked; see A in

Figure 2-10 on page 2-11).

4. Firmly push in the latch lock until the latch handle releases away from the drive (see B in Figure 2-10).

5. Grab the latch handle and pull the drive completely away from its slot (see C in Figure 2-10).

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Caution: When pulling the storage drive from the chassis, hold it at the bottom to prevent it from falling and damaging the drive.

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2—Installation and Operation

Insert key into barrel lock and turn A

... push the latch lock,…

Latch Lock

Latch Handle

… and pull drive out with the latch handle

45 degrees clockwise,…

Barrel Key

Installation Procedures

Figure 2-10. RES-22XR3 Storage Drive Removal

2.1.5.3 Storage-Drive Installation

To install a storage drive,

1. Make sure the latch handle of the drive to be installed is in the open position.

2. Properly orient the new drive and insert it into the vacant drive slot. If the

drive cannot be inserted into the slot, make sure the latch handle is facing you with the latch hinge oriented to the left and latch lock to the right.

3. Push the drive toward the rear (DO NOT CLOSE the latch handle while push-

ing) until the drive is flush with the front of the chassis. The handle will swing closed when it comes into contact with the RES-22XR3 chassis.

4. When the drive is fully inserted in its slot, insert the key into the barrel lock

and turn it 45 degrees counter-clockwise. The drive is now locked.

Caution: When in the closed position, the latch handle secures the drive to the chassis. If the handle is closed before the drive is fully inserted, the latch mechanism may not fully engage to secure the drive.

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5. If you are installing another storage drive, repeat Steps 1-4 for each additional

drive.

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Hinged Fan Lid

80-mm Fan

Fan Lid Lock

Locking Stud (1 of 3)

Latch Lock

80-mm Fan

2.1.6 Removable 80-mm Fan

The RES-22XR3 contains three 4-wire high-speed 80-mm fans. All fans are hotswappable in case of a fan failure. See Figure 2-11 on page 2-12 for fan layout and descriptions.

Note: Since RES-22XR3 fans are “hot-swappable”, it is not necessary to turn off system power in order to remove and replace a fan.

Caution: When replacing the 80-mm fans, do not leave the fan lid open for more than 3 minutes, as this will cause an undesirable drop in chassis pressure (bad for temperature stability). In the event of a catastrophic fan failure (all fans cease to function) it is highly advised that the system be powered down, then take action to replace the fans. Only pull the chassis as far as needed to fully access the fan lid. Doing so will help prevent accidental removal of any cables attached to the rear I/O.

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Figure 2-11. The RES-22XR3 80-mm-Fans

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2.1.6.1 Removing and Installing a 80-mm Fan

Fan Lid Lock

Font of System

Rear of System

Perform the following steps to remove and install a 80-mm fan:

1. Each fan is removable by first opening the fan lid by pushing the fan lid lock

left (marked open, see Figure 2-11, page 2-12) to unlock the fan lid. Pull the fan lid upward exposing the three 80-mm fans.

2—Installation and Operation

Installation Procedures

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Figure 2-12. Fan Lid Lock

2. Each fan is secured by a locking latch on the left hand side. To remove a fan,

press the latch lock toward the center of the fan with the left hand index finger . With the right hand index finger, press on the right hand side of the fan and pull the fan directly upward from the RES-22XR3 chassis.

3. When the fan is removed, its 4-wire connector will be disconnected from the

chassis. Insert the replacement fan carefully into the empty fan slot until it is flush with the second fan. The 4-wire fan connection will automatically engage its mated connector successfully. Make sure the fan is firmly seated and operational before moving to step 4.

4. Once fan installation has been completed, close the fan lid by holding the fan

lid lock in the open position (to the left, see Figure 2-12 above) until the lid is firmly seated and flush with the top of the chassis. While applying downward pressure on the fan lid, slide the fan lid lock to the right (marked as closed, see

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Locking Contact

Font of System

Rear of System

Area

Figure 2-12 on page 2-13) to engage the Locking contact area (see Figure 2-13 below) onto the locking stud.

Figure 2-13. Locking Contact area

2.1.7 Power Supply

Each load-sharing (N+1 redundant) power supply can be hot-swapped while the system is still on and operational.

Note: At least one functional power supply must remain in the chassis at any given time for the system to remain operational.

2.1.7.1 Removing a Power Supply

Perform the following steps to remove a power supply:

1. Unplug the power cord(s) from the socket(s) in the power supply module(s).

2. Remove the two screws holding the power supply locking bracket to the chas- sis (see A, Figure 2-14). Put the locking bracket in a safe place for further use.

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2—Installation and Operation

Extraction

Handle

Power Supply Locking Lever

System Power LED

AC Outlet

Phillips Screw Hole

(for knurled captive screw)

Phillips Screw Hole

(for knurled captive screw)

Remove power supply locking bracketA

… then disengage locking lever and remove power supplyB

Power supply locking bracket

Knurled captive Phillips screw

Installation Procedures

3. Put the right index finger on the power supply extraction handle and the right thumb on the left side of the power supply locking lever (see B, Figure 2-14).

4. Squeeze the locking lever toward the pull handle and firmly pull the power supply from the chassis.

Caution: When pulling the power supply from the chassis, hold it at the bottom to prevent it from falling and damaging the unit.

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Figure 2-14. The RES-22XR3 Power Supply Locking Mechanism

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2.1.7.2 Installing a Power Supply

Perform the following steps to install a power supply:

1. Insert the replacement power supply into an empty slot with the extraction

handle and AC outlet facing to the right (see Figure 2-14).

2. Push the power supply carefully into its slot until it is firmly seated (a click

will be heard when the locking lever is securely fastened to the chassis).

3. Replace and tighten the two captive screws to hold the power supply locking

lever to the chassis (see Figure 2-14) to secure both power supplies.

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2.2 Rack Mounts

Right Mounting Bracket

2.2.1 Mounting Brackets

The rack-mount brackets (flanges) are used to secure the chassis to the 19” rack (see Figure 2-15). Handles are used to pull the RES-22XR3 from the rack when rackmount slides have been installed on the sides of the chassis (see following section).

2—Installation and Operation

Figure 2-15.

Right Rack-Mount Bracket

2.2.2 Rack-Mount Slides (Optional)

Rack-Mount Slides can be mounted on each side of the RES-22XR3, for the purpose of sliding the unit in and out of a rack. Mounting slides are optional and should be ordered at the time your system is purchased.

To learn how to install rack-mount slides, refer to Appendix B, “Rack-Mount Slide Installation”.

Caution: Any screws used to mount a slide to a RES-22XR3 chassis must not exceed a length of 3/8” to prevent excessive penetration of the chassis.

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AC Power Socket

Locking Lever

System Power LED

Power Supply Locking Bracket

System Power

On/Off Button

Power LED

2.3 Operation

2.3.1 Plugging in the AC Power Cords

Before powering on the RES-22XR3, plug in the AC power cords as follows:

1. On the rear of the RES-22XR3, plug an AC power cord (shipped with unit)

into the AC power socket on each power supply (see Figure 2-16).

Figure 2-16. AC Power Socket and LED on the RES-22XR3 Rear

2.3.2 Turning the System On

1. Plug the AC power cord from each of the RES-22XR3 power supplies into a

“live” AC outlet.

2. On the front of the RES-22XR3 push the system power On/Off button (see

Figure 2-17). This will cause the system POWER LED to light (green), as well as the power supply module LED to light (green).

Figure 2-17. System Power Button and LED on the RES-22XR3 Front

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2.3.3 Getting Started

2.3.3.1 Configuration

1. Make sure all storage drives are installed (see “SAS/SATA II Storage Drive” on page 2-9). Drive ID numbers are shown in Figure 1-3 on page 1-4, Chapter

1. Changes may be made through the BIOS.

2. Make sure that a graphics card is installed in a PCI-Express slot; see Figure 2-5 on page 2-7) and connect a multiscan monitor to the output con-

nector.

Note: The X8DTH Motherboard is equipped with an onboard graphics solution. A monitor can be connected to the VGA connector on the rear I/O panel. Installing a PCI-E graphics card in your RES-22XR3 is not necessary unless desired.

2—Installation and Operation

Operation

3. Attach a PS/2 keyboard and mouse to the appropriate connectors on the rear I/O panel of the RES-22XR3 (see Figure 1-5 on page 1-6)

4. Turn the system on (see previous section).

2.3.3.2 Linux Installation

The subject of installing the Linux operating system onto the RES-22XR3 is detailed in Appendix C, “Red Hat Enterprise Linux 5 Installation”.

2.3.4 Turning the System Off

Caution: Before turning your system off, make sure to save all open files, properly close applications, and broadcast a warning to all users on any active networks.

1. T o turn the RES-22XR3 power of f, press the system power on/of f button (see Figure 2-17, page 2-18). This will shut down the system and turn off the POWER LED, as well as the LED on the power supply modules. The power button behavior can be changed in the BIOS settings (see Chapter 3, "BIOS Setup Utility").

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As an alternative, a modern operating system (Windows 9x or newer and Linux, for example) can turn off the system after a graceful OS software shutdown.

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3RES-22XR3

Installation Section

3.1 Introduction

Chapter

BIOS Setup Utility

This chapter describes the AMI BIOS Setup Utility for the RES-22XR3 motherboards.

Note: For BIOS recovery, please refer to the AMI BIOS Recovery posted at

http://www.supermicro.com/support/manuals/.

3.1.1 Starting BIOS Setup Utility

To enter the AMI BIOS Setup Utility screens, press the <Delete> key while the system is booting up.

Note: In most cases, the <Delete> key is used to invoke the AMI BIOSsetup screen. There are a few cases when other keys are used, such as <F1>, <F2>, etc.

Each main BIOS menu option is described in this manual. The Main BIOS setup menu screen has two main frames. The left frame displays all the options that can be configured. Grayed-out options cannot be configured. Options in blue can be configured by the user. The right frame displays the key legend. Above the key legend is an area reserved for a text message. When an option is selected in the left frame, it is highlighted in white. Often a text message will accompany it.

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Note: The AMI BIOS has default text messages built in. Themis retains the option to include, omit, or change any of these text messages.

The AMI BIOS Setup Utility uses a key-based navigation system called “hot keys”. Most of the AMI BIOS setup utility “hot keys” can be used at any time during the setup navigation process. These keys include <F1>, <F10>, <Enter>, <ESC>, arrow keys, etc.

Note: Options printed in Bold are default settings.

3.1.2 How To Change the Configuration Data

The configuration data that determines the system parameters may be changed by entering the AMI BIOS Setup utility. This Setup utility can be accessed by pressing <Del> at the appropriate time during system boot.

3.1.3 Starting the Setup Utility

Normally, the only visible Power-On Self-Test (POST) routine is the memory test. As the memory is being tested, press the <Delete> key to enter the main menu of the AMI BIOS Setup Utility. From the main menu, you can access the other setup screens. An AMI BIOS identification string is displayed at the left bottom corner of the screen below the copyright message.

Caution: Do not upgrade the BIOS unless your system has a BIOS-related issue. Flashing the wrong BIOS can cause irreparable damage to the system. In no event shall Supermicro be liable for direct, indirect, special, incidental, or consequential damages arising from a BIOS update. If you have to update the BIOS, do not shut down or reset the system while the BIOS is updating. This is to avoid possible boot failure.

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3.2 Main Setup

When you first enter the AMI BIOS Setup Utility, you will enter the Main setup screen.You can always return to the Main setup screen by selecting the Main tab on the top of the screen. The Main BIOS Setup screen is shown below.

3—BIOS Setup Utility

Figure 3-1. Main BIOS Setup Screen

3.2.1 System Time/System Date

Use this option to change the system time and date. Highlight System T ime or System Date using the arrow keys. Key in new values through the keyboard and press

<Enter>. Press the <Tab> key to move between fields. The date must be entered in Day MM/DD/YY format. The time is entered in HH:MM:SS format.

Note: The time is in the 24-hour format. For example, 5:30 P.M. appears as 17:30:00.

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3.2.2 Supermicro X8DTH

• Version: This item displays the BIOS revision used in your system.

• Build Date: This item displays the date when this BIOS was completed.

3.2.3 Processor

The AMI BIOS will automatically display the status of the processor used in your system:

• CPU Type: This item displays the type of CPU used in the motherboard.

• Speed: This item displays the speed of the CPU detected by the BIOS.

• Physical Count: This item displays the number of processors installed in your system as detected by the BIOS.

• Logical Count: This item displays the number of CPU Cores installed in your system as detected by the BIOS.

3.2.4 System Memory

This displays the size of memory available in the system:

• Size: This item displays the installed memory size detected by the BIOS.

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3.3 Advanced Setup Configurations

Use the arrow keys to select Advanced Setup and hit <Enter> to access the submenu items:

3—BIOS Setup Utility

3.3.1 Boot Features

3.3.1.1 Quick Boot

If Enabled, this option will skip certain tests during POST to reduce the time needed for system boot. The options are Enabled (default) and Disabled.

3.3.1.2 Quiet Boot

This option allows the bootup screen options to be modified between POST messages or the OEM logo. Select Disabled to display the POST messages. Select Enabled to display the OEM logo instead of the normal POST messages. The options are Enabled (default) and Disabled.

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Figure 3-2.

Advanced Settings

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3.3.1.3 AddOn ROM Display Mode

This sets the display mode for Option ROM. The options are Force BIOS (default) and Keep Current.

3.3.1.4 Bootup Num-Lock

This feature selects the Power-on state for the Numlock key. The options are Off and On (default).

3.3.1.5 Wait For 'F1' If Error

This forces the system to wait until the 'F1' key is pressed if an error occurs. The options are Disabled and Enabled (default).

3.3.1.6 Hit 'Del' Message Display

This feature displays “Press DEL to run Setup” during POST. The options are Enabled (default) and Disabled.

3.3.1.7 Interrupt 19 Capture

Interrupt 19 is the software interrupt that handles the boot disk function. When this item is set to Enabled, the ROM BIOS of the host adaptors will “capture” Interrupt 19 at boot and allow the drives that are attached to these host adaptors to function as bootable disks. If this item is set to Disabled, the ROM BIOS of the host adaptors will not capture Interrupt 19, and the drives attached to these adaptors will not function as bootable devices. The options are Enabled (default) and Disabled.

3.3.1.8 Watch Dog Function

If enabled, the Watch Dog Timer will allow the system to reboot when it is inactive for more than 5 minutes. The options are Enabled and Disabled (default).

3.3.1.9 Power Button Function

If set to Instant_Off, the system will power off immediately when power button is pressed. If set to 4_Second_Override, the system will power off when the user presses the power button for 4 seconds or longer. The options are Instant_Off (default) and 4_Second_Override.

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3.3.1.10 Restore on AC Power Loss

Use this feature to set the power state after a power outage. Select Power-Off for the power to remain off after a power loss. Select Power-On for the power to be turned on after a power loss. Select Last State to allow the system to resume its last state before a power loss. The options are Power-On, Power-Off and Last State (default).

3.3.2 Processor and Clock Options

This submenu allows the user to configure the Processor and Clock settings.

3.3.2.1 CPU Ratio

If set to Manual, this option allows the user to set the ratio between the CPU Core Clock and the FSB Frequency. The options are Auto (default) and Manual.

3—BIOS Setup Utility

Advanced Setup Configurations

Note: If an invalid ratio is entered, the AMI BIOS will restore the setting to the previous state.

3.3.2.2 Clock Spread Spectrum

Select Enable to use the feature of Clock Spectrum, which will allow the BIOS to monitor and attempt to reduce the level of Electromagnetic Interference caused by the components whenever needed. The options are Disabled (default) and Enabled.

3.3.2.3 Hardware Prefetcher (Available when supported by the CPU)

If set to Enabled, the hardware prefetcher will prefetch streams of data and instructions from the main memory to the L2 cache in the forward or backward manner to improve CPU performance. The options are Disabled and Enabled (default).

3.3.2.4 Adjacent Cache Line Prefetch (Available when supported by the CPU)

The CPU fetches the cache line for 64 bytes if this option is set to Disabled. The CPU fetches both cache lines for 128 bytes as comprised if Enabled (default).

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3.3.2.5 MPS and ACPI MADT Ordering

This feature allows the user to decide how to order the Multiple APIC Description Table (MADT). Select Modern Ordering for Microsoft Windows XP or a newer version of the OS. Select Legacy Ordering for Microsoft Windows XP or an older version of OS. The Options are Modern Ordering (default) and Legacy Ordering.

3.3.2.6 Machine Checking Feature (Available when supported by the CPU)

Set to Enabled to activate the function of Machine Checking and allow the CPU to detect and report hardware (machine) errors via a set of model-specific registers (MSRs). The options are Disabled and Enabled (default).

3.3.2.7 Intel® Virtualization Technology (Available when supported by the CPU)

Select Enabled to use the feature of Virtualization Technology to allow one platform to run multiple operating systems and applications in independent partitions, creating multiple “virtual” systems in one physical computer. The options are Enabled (default) and Disabled.

Note: If there is any change to this setting, you will need to power off and restart the system for the change to take effect. Please refer to Intel’s website for detailed information, www.intel.com.

3.3.2.8 Execute-Disable Bit Capability (Available when supported by the OS and the CPU)

Set to Enabled to enable the Execute Disable Bit which will allow the processor to designate areas in the system memory where an application code can execute and where it cannot, thus preventing a worm or a virus from flooding illegal codes to overwhelm the processor or damage the system during an attack. The default is Enabled (default). (Refer to Intel and Microsoft Web Sites for more information.)

3.3.2.9 Simultaneous Multi-Threading (Available when supported by the CPU)

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Set to Enabled to use the Simultaneous Multi-Threading Technology, which will result in increased CPU performance. The options are Disabled and Enabled (default).

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3.3.2.10 Active Processor Cores

Set to Enabled to use a processor's Second Core and beyond. (Please refer to Intel's web site for more information.) The options are All (default), 1 and 2.

3.3.2.11 Intel® EIST Technology

EIST (Enhanced Intel SpeedStep Technology) allows the system to automatically adjust processor voltage and core frequency in an effort to reduce power consumption and heat dissipation. (Please refer to www.intel.com for detailed information.) The options are Disabled and Enabled (default).

3.3.2.12 Intel® TurboMode Technology

Select Enabled to use the Turbo Mode to boost system performance. The options are Enabled (default) and Disabled.

3—BIOS Setup Utility

Advanced Setup Configurations

3.3.2.13 C1E Support

Select Enabled to use the feature of Enhanced Halt State. C1E significantly reduces the CPU's power consumption by reducing the CPU's clock cycle and voltage during a “Halt State.” The options are Disabled and Enabled (default).

3.3.2.14 Intel® C-STATE Tech

If enabled, C-State is set by the system automatically to either C2, C3 or C4 state. The options are Disabled and Enabled (default).

3.3.2.15 C-State package limit setting (Available when Intel® C-State Tech is enabled)

If set to Auto, the AMI BIOS will automatically set the limit on the C-State package register. The options are Auto (default), C1, C3, C6 and C7.

3.3.2.16 C1 Auto Demotion

When enabled, the CPU will conditionally demote C3, C6 or C7 requests to C1 based on un-core auto-demote information. The options are Disabled and Enabled (default).

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3.3.2.17 C3 Auto Demotion

When enabled, the CPU will conditionally demote C6 or C7 requests to C3 based on un-core auto-demote information. The options are Disabled and Enabled (default).

3.3.2.18 ACPI T State

Select Enabled to report Processor throttling in the ACPI. The options are Disabled (default) and Enabled.

3.3.3 Advanced Chipset Control

The items included in the Advanced Settings submenu are listed below:

CPU Bridge Configuration

3.3.3.1 QPI Links Speed

This feature selects the QPI data transfer speeds and enables/disables QPI Frequency selection. If Slow-mode is selected, QPI Frequency will remain slow (safe mode), and cannot be selected by the user. If Full-speed is selected, the following item will be available for the user to select the QPI frequency. The options are Slow-Mode, and Full-Speed (default).

3.3.3.2 QPI Frequency (Available when QPI Links Speed is set to FullSpeed)

This selects the desired QPI frequency. The options are Auto (default), 4.800 GT,

5.866GT, 6.400 GT.

3.3.3.3 QPI L0s and L1

This enables the QPI power state to low power. L0s and L1 are automatically selected by the motherboard. The options are Disabled (default) and Enabled.

3.3.3.4 Memory Frequency

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This feature forces a DDR3 to run at a frequency other than what the system has detected. Select Force SPD (Serial Presence Detect) to force the memory to run at a frequency based on the SPD Standard (Table). The available options are Auto (default), Force DDR-800, Force DDR-1066, Force DDR-1333, and Force SPD.

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3.3.3.5 Memory Mode

The options are Independent (default), Channel Mirror, Lockstep, and Sparing.

• Independent - All DIMMs are available to the operating system.

• Channel Mirror - The motherboard maintains two identical copies of all data stored in channel 1 and 2 memory for redundancy.

• Lockstep - The motherboard uses two areas of memory to run the same set of operations in parallel.

3.3.3.6 Demand Scrubbing

A memory error-correction scheme where the Processor writes corrected data back into the memory block from where it was read by the Processor. The options are Enabled and Disabled (default).

3—BIOS Setup Utility

Advanced Setup Configurations

3.3.3.7 Patrol Scrubbing

A memory error-correction scheme that works in the background looking for and correcting resident errors. The options are Enabled (default) and Disabled.

3.3.3.8 Channel Interleave

This feature allows the user to configure the Memory Interleave setting for an onboard memory channel. The options are 1-way, 2-way, 3-way, 4-way, and 6-way (default).

3.3.3.9 Bank Interleave

This feature allows the user to configure the Memory Interleave setting for an onboard memory bank. The options are 1-way, 2-way, and 4-way (default).

3.3.3.10 Throttling - Closed Loop

Throttling improves reliability and reduces power in the processor by automatic voltage control during processor idle states. Available options are Disabled and Enabled (default).

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NorthBridge Configuration

3.3.3.11 Intel I/OAT

The Intel I/OAT (I/O Acceleration Technology) significantly reduces CPU overhead by leveraging CPU architectural improvements, freeing resources for more other tasks. The options are Disabled and Enabled (default).

3.3.3.12 DCA Technology

Select Enabled to use Intel’s DCA (Direct Cache Access) Technology to improve data transfer efficiency. The Options are Disabled and Enabled (default).

3.3.3.13 DCA Prefetch Delay

A DCA Prefetch is used with TOE components to prefetch data in order to shorten execution cycles and maximize data processing efficiency. Prefetching too frequently can saturate the cache directory and delay necessary cache accesses. This feature reduces or increases the frequency in which the system prefetches data. The options are [8], [16], [32] (default), [40], [48], [56], [64], [72], [80], [88], [96], [104], [112], and [120].

3.3.3.14 Intel VT-d

Select Enabled to enable Intel's Virtualization Technology support for Direct I/O VT-d by reporting the I/O device assignments to VMM through the DMAR ACPI Tables. This feature offers fully-protected I/O resource-sharing across the Intel platforms, providing the user with greater reliability, security and availability in networking and data-sharing. The settings are Enabled (default) and Disabled.

3.3.3.15 Active State Power Management

Select Enabled to start Active-State Power Management for signal transactions between L0 and L1 Links on the PCI Express Bus. This maximizes power-saving and transaction speed. The options are Enabled and Disabled (default).

3.3.3.16 IOH PCI-E Max Payload Size

Some add-on cards perform faster with the coalesce feature, which limits the payload size to 128B; while others, with a payload size of 256B which inhibits the coalesce feature. Please refer to your add-on card user guide for the desired setting. The options are 256B (default) and 128B

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3—BIOS Setup Utility

Advanced Setup Configurations

South Bridge Configuration

3.3.3.17 USB Functions

Select Enabled to use onboard USB connections. The Options are Disabled and Enabled (default).

3.3.3.18 USB 2.0 Controller (Available when the item: USB Functions is disabled)

This feature displays the current USB controller used in the motherboard.

3.3.3.19 Legacy USB Support

Select Enabled to use Legacy USB devices. If this item is set to Auto, Legacy USB support will be automatically enabled if a legacy USB device is installed on the motherboard, and vise versa. The settings are Disabled, Enabled and Auto (default).

3.3.3.20 Port 64/60 Emulation

Select Enabled to enable 60h/64h emulation for complete USB keyboard support for operating systems that are not compatible with USB devices. The options are Enabled and Disabled (default).

3.3.4 IDE/SATA Configuration

When this submenu is selected, the AMI BIOS automatically detects the presence of the IDE devices and displays the following items:

3.3.4.1 SATA#1 Configuration

If Compatible is selected, it sets SATA#1 to legacy compatibility mode, while selecting Enhanced sets SATA#1 to native SATA mode. The options are Disabled, Compatible and Enhanced (default).

3.3.4.2 Configure SATA#1 as

This feature allows the user to select the drive type for SATA#1. The options are IDE (default), RAID and AHCI. (When the option-RAID is selected, the item-ICH RAID Code Base will appear. When the option-AHCI is selected, the item-SATA AHCI will be available.)

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3.3.4.3 ICH RAID Code Base (This feature is available when the option-RAID is selected)

Select Intel to enable Intel's SATA RAID firmware to configure Intel's SATA RAID settings. Select Adaptec to enable Adaptec's SATA RAID firmware to configure Adaptec's SATA RAID settings. The options are Intel (default) and Adaptec.

3.3.4.4 ICH AHCI Code Base (Available when AHCI is selected for Configure SATA#1 as)

Select Intel AHCI ROM to configure SATA#1 to support Intel AHCI ROM. Select BIOS Native Module to configure SATA#1 to support BIOS Native Module mode. The options are Intel AHCI ROM (default) and BIOS Native Module.

3.3.4.5 SATA#2 Configuration (This feature is available when the option-IDE is selected for SATA#1)

Selecting Enhanced will set SATA#2 to native SATA mode. The options are Disabled, and Enhanced (default).

3.3.4.6 IDE Detect Timeout (sec)

Use this feature to set the time-out value for the BIOS to detect the ATA, ATAPI devices installed in the system. The options are 0 (sec), 5, 10, 15, 20, 25, 30, and 35 (default).

3.3.4.7 Primary IDE Master/Slave, Secondary IDE Master/Slave, Third IDE Master, and Fourth IDE Master

These settings allow the user to set the parameters of Primary IDE Master/Slave, Secondary IDE Master/Slave, Third and Fourth IDE Master slots. Hit <Enter> to activate the following submenu screen for detailed options of these items. Set the correct configurations accordingly. The items included in the submenu are:

Type

Select the type of device connected to the system. The options are Not Installed,

Auto (default), CD/DVD and ARMD.

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3—BIOS Setup Utility

Advanced Setup Configurations

LBA/Large Mode

LBA (Logical Block Addressing) is a method of addressing data on a storage drive. In the LBA mode, the maximum drive capacity is 137 GB. For drive capacities over 137 GB, your system must be equipped with a 48-bit LBA mode addressing. If not, contact your manufacturer or install an ATA/133 IDE controller card that supports 48-bit LBA mode. The options are Disabled and Auto.

Block (Multi-Sector Transfer)

Block Mode boosts the IDE drive performance by increasing the amount of data transferred. Only 512 bytes of data can be transferred per interrupt if Block Mode is not used. Block Mode allows transfers of up to 64 KB per interrupt. Select Disabled to allow data to be transferred from and to the device one sector at a time. Select Auto to allow data transfer from and to the device occur multiple sectors at a time if the device supports it. The options are Auto (default) and Disabled.

PIO Mode

The IDE PIO (Programmable I/O) Mode programs timing cycles between the IDE drive and the programmable IDE controller. As the PIO mode increases, the cycle time decreases. The options are Auto (default) 0, 1, 2, 3, and 4.

Select Auto to allow the AMI BIOS to automatically detect the PIO mode. Use this value if the IDE storage drive support cannot be determined.

Select 0~4 to allow the AMI BIOS to use PIO mode 0~4. It has a data transfer rate of

3.3 MB/s~16.6 MB/s. See Table 3-1, “PIO Mode Select Options” below.

Table 3-1.

Option Selected PIO Mode Max. Transfer Rate

0 PIO Mode 0 3.3 MB/s

1 PIO Mode 1 5.2 MB/s

2 PIO Mode 2 8.3 MB/s

PIO Mode Select Options

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3 PIO Mode 3 11.1 MB/s

4 PIO Mode 4 16.6 MB/s

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DMA Mode

Select Auto to allow the BIOS to automatically detect IDE DMA mode when the IDE disk drive support cannot be determined. The options are Auto (default), SWDMAn, MWDMAn, and UDMAn. See Table 3-2, “DMA Mode Select Options” below.

Table 3-2.

Option Selected DMA Mode Max. Transfer Rate

SWDMA 0 Single-Word DMA 0 2.1 MB/s

SWDMA 1 Single-Word DMA 1 4.2 MB/s

SWDMA 2 Single-Word DMA 2 8.3 MB/s

MWDMA 0 Multi-Word DMA 0 4.2 MB/s

MWDMA 1 Multi-Word DMA 1 13.3 MB/s

MWDMA 2 Multi-Word DMA 2 16.6 MB/s

UDMA 0 Ultra DMA 0 16.6 MB/s

UDMA 1 Ultra DMA 1 25 MB/s

UDMA 2 Ultra DMA 2 33.3 MB/s

UDMA 3 Ultra DMA 3 44.4 MB/s

DMA Mode Select Options

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UDMA 4 Ultra DMA 4 66.6 MB/s

UDMA 5 Ultra DMA 5 100 MB/s

UDMA 6 Ultra DMA 6 133 MB/s

S.M.A.R.T. For Storage Drives

Self-Monitoring Analysis and Reporting Technology (SMART) can help predict impending drive failures. Select Auto to allow the AMI BIOS to automatically detect Storage Drive support. Select Disabled to prevent the AMI BIOS from using the S.M.A.R.T. Select Enabled to allow the AMI BIOS to use the S.M.A.R.T. to support the storage drive. The options are Disabled, Enabled, and Auto (default).

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32-Bit Data Transfer

Select Enable to allow the function of 32-bit IDE data transfer. The options are Enabled (default) and Disabled.

3.3.5 PCI/PnP Configuration

3.3.5.1 Clear NVRAM

This feature clears the NVRAM (Non-Volatile Memory used for Flash ROM) during system boot. The options are No (default) and Yes.

3.3.5.2 Plug & Play OS

Selecting Yes allows the OS to configure Plug & Play devices. (This is not required for system boot if your system has an OS that supports Plug & Play.) Select No (default) to allow the AMI BIOS to configure all devices in the system.

3—BIOS Setup Utility

Advanced Setup Configurations

3.3.5.3 PCI Latency Timer

This feature sets the latency Timer of each PCI device installed on a PCI bus. Select 64 to set the PCI latency to 64 PCI clock cycles. The options are 32, 64 (default), 96, 128, 160, 192, 224 and 248.

3.3.5.4 PCI Cache Size

Use this feature to select PCI Cache size. The options are 16, 32, 64 (default), and

128.

3.3.5.5 PCI IDE BusMaster

When enabled, the BIOS uses PCI bus mastering for reading/writing to IDE drives. The options are Disabled and Enabled (default).

3.3.5.6 SR-IOV Supported

Select Enabled to allow Single Root I/O Virtualization (SR-IOV) support which works in conjunction with the Intel Virtualization Technology allowing multiple operating systems to run simultaneously within a single computer via native sharing of the PCI-Express devices in order to enhance network connectivity and performance. The options are Enabled and Disabled (default).

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3.3.5.7 PCI-E Slots 1~7 x8

This feature allows you to Enable or Disable any of the PCI slots. The options are Enable (default) and Disable.

3.3.5.8 Onboard LAN Options ROM Select

This feature allows the user to select the onboard LAN option ROM type. The options are iSCSI and PXE (default).

3.3.5.9 Load Onboard LAN1 Option ROM/Load Onboard LAN2 Option ROM

Select Enabled to enable the onboard LAN1 or LAN2 Option ROM. This is to boot the computer using a network interface. The options are Enabled and Disabled (default).

3.3.5.10 Load Onboard SAS Option ROM

Select Enabled to enable the onboard SAS Option ROM. This is to boot computer using a network interface. The options are Enabled (default) and Disabled.

3.3.5.11 Boot Graphics Adapter Priority

This feature allows the user to specify which graphics controller is to be used as the primary boot graphics controller. The options are Onboard VGA (default), Off- board VGA, and PCI-E Slot 7

3.3.6 Super IO Device Configuration

3.3.6.1 Serial Port1 Address/Serial Port2 Address

This option specifies the base I/O port address and the Interrupt Request address of Serial Port 1 and Serial Port 2. Select Disabled to prevent the serial port from accessing any system resources. When this option is set to Disabled, the serial port physically becomes unavailable. Select 3F8/IRQ4 to allow the serial port to use 3F8 as its I/O port address and IRQ 4 for the interrupt address. The options for Serial Port1 are Disabled, 3F8/IRQ4 (default), 3E8/IRQ4, 2F8/IRQ3, and 2E8/IRQ3. The options for Serial Port2 are Disabled, 2F8/IRQ3 (default), 3E8/IRQ4, 2E8/IRQ3, and 3F8/IRQ4.

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3.3.6.2 Serial Port 2 Attribute

This feature allows the user to set COM 2 as a normal serial port or a virtual COM port used for SOL (Serial Over LAN). The options are SOL (default), and COM.

3.3.7 Remote Access Configuration

3.3.7.1 Remote Access

This allows the user to enable the Remote Access feature. The options are Disabled and Enabled (default).

If Remote Access is set to Enabled, the following items will display:

3.3.7.2 Serial Port Number

3—BIOS Setup Utility

Advanced Setup Configurations

This feature allows the user decide which serial port to be used for Console Redirection. The options are COM 1 and COM 2 (default).

Base Address, IRQ

This item displays the based address and IRQ of the serial port specified above. The default setting for COM 1 is 3F8/IRQ4 (default), and for COM 2 is 2F8/IRQ3 (default).

3.3.7.3 Serial Port Mode

This feature allows the user to set the serial port mode for Console Redirection. The options are 115200 8, n 1 (default); 57600 8, n, 1; 38400 8, n, 1; 19200 8, n, 1; and 9600 8, n, 1.

3.3.7.4 Flow Control

This feature allows the user to set the flow control for Console Redirection. The options are None (default), Hardware, and Software.

3.3.7.5 Redirection After BIOS POST

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Select Disabled to turn off Console Redirection after Power-On Self-Test (POST). Select Always to keep Console Redirection active all the time after POST.

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Select Boot Loader to keep Console Redirection active during POST and Boot

Note: This setting may not be supported by some operating systems.

Loader. The options are Disabled, Boot Loader, and Always (default).

3.3.7.6 Terminal Type

This feature allows the user to select the target terminal type for Console Redirection. The options are ANSI, VT100 (default), and VT-UTF8.

3.3.7.7 VT-UTF8 Combo Key Support

A terminal keyboard definition that provides a way to send commands from a remote console. Available options are Enabled (default) and Disabled.

3.3.7.8 Sredir Memory Display Delay

This feature defines the length of time in seconds to display memory information. The options are No Delay (default), Delay 1 Sec, Delay 2 Sec, and Delay 4 Sec.

3.3.8 Hardware Health Monitor

This feature allows the user to monitor system health and review the status of each item as displayed.

3.3.8.1 CPU Overheat Alarm

This option allows the user to select the CPU Overheat Alarm setting which determines when the CPU OH alarm will be activated to provide warning of possible CPU overheat.

Caution: 1. Any temperature that exceeds the CPU threshold temperature pre- defined by the CPU manufacturer may result in CPU overheat or system instability . When the CPU temperature reaches this predefined threshold, the CPU and system cooling fans will run at full speed.

2. T o avoid possible system overheating, please be sure to provide adequate airflow to your system.

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3—BIOS Setup Utility

Advanced Setup Configurations

The options are:

• The Early Alarm: Select this setting if you want the CPU overheat alarm (including the LED and the buzzer) to be triggered as soon as the CPU temperature reaches the CPU overheat threshold as predefined by the CPU manufacturer.

• The Default Alarm: Select this setting if you want the CPU overheat alarm (including the LED and the buzzer) to be triggered when the CPU temperature

reaches about 5°C above the threshold temperature as predefined by the CPU manufacturer to give the CPU and system fans additional time needed for CPU and system cooling. In both the alarms above, please take immediate action as shown below.

3.3.8.2 CPU 1 Temperature/CPU 2 Temperature/System Temperature

This feature displays current temperature readings for the CPUs and the System. The following items will be displayed for your reference only:

CPU 1 Temperature/ CPU 2 Temperature

The CPU Temperature feature will display the CPU temperature status as detected by the BIOS:

• Low – This level is considered as the ‘normal’ operating state. The CPU temperature is well below the CPU ‘Temperature Tolerance’. The motherboard fans and CPU will run normally as configured in the BIOS (Fan Speed Control). User intervention: No action required.

• Medium – The processor is running warmer. This is a ‘precautionary’ level and generally means that there may be factors contributing to this condition, but the CPU is still within its normal operating state and below the CPU ‘Temperature Tolerance’. The motherboard fans and CPU will run normally as configured in the BIOS. The fans may adjust to a faster speed depending on the Fan Speed Control settings. User intervention: No action is required. However, consider checking the fans and the chassis ventilation for blockage.

• High – The processor is running hot. This is a ‘caution’ level since the CPU’s ‘Temperature Tolerance’ has been reached (or has been exceeded) and may activate an overheat alarm. The system may shut down if it continues for a long period to prevent damage to the CPU.

User intervention: If the system buzzer and Overheat LED has activated, take action immediately by checking the system fans, chassis ventilation and room temperature to correct any problems.

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Notes:

1. The CPU thermal technology that reports absolute temperatures (Cel-

sius/Fahrenheit) has been upgraded to a more advanced feature by Intel in its newer processors. The basic concept is each CPU is embedded by unique temperature information that the motherboard can read. This ‘Temperature Threshold’ or ‘T emperature Tolerance’ has been assigned at the factory and is the baseline on which the motherboard takes action during different CPU temperature conditions (i.e., by increasing Fan speed, triggering the Overheat Alarm, etc.). Since CPUs can have different ‘Temperature Tolerances’, the installed CPU can now send information to the motherboard what its ‘Temperature Tolerance’ is, and not the other way around. This results in better CPU thermal management.

Supermicro has leveraged this feature by assigning a temperature status to certain thermal conditions in the processor (Low, Medium and High). This makes it easier for the user to understand the CPU’s temperature status, rather than by just simply seeing a temperature reading (i.e., 25°C). The information provided above is for your reference only. For more information on thermal management, please refer to Intel’s Web site at www.Intel.com.

2. T o avoid possible overheating, be sure to provide adequate airflow to the sys-

tem and regularly check fans and chassis ventilation for blockage.

System Temperature:

The system temperature will be displayed (in degrees in Celsius and Fahrenheit) as it is detected by the BIOS.

Fan Speed Readings

This feature displays the fan speed readings from Fan1 through Fan8.

Fan Speed Control Modes

This feature allows the user to decide how the system controls the speeds of the onboard fans. The CPU temperature and the fan speed are correlative. When the CPU on-die temperature increases, the fan speed will also increase for effective system cooling. Select “Full Speed/FS” to allow the onboard fans to run at full speed for maximum cooling. The FS setting is recommended for special system configuration or debugging. Select “Performance/PF” for better system cooling. The PF setting is recommended for high-power-consuming and high-density systems. Select “Balanced/BL” for the onboard fans to run at a speed that will balance the needs between

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system cooling and power saving. The BL setting is recommended for regular systems with normal hardware configurations. Select “Energy Saving/ES” for best power efficiency and maximum quietness. The Options are: Full Speed/FS, Performance/PF, Balanced/BL, and Energy Saving/ES (default).

3.3.8.3 Voltage Readings

The following voltage readings will be displayed. CPU1 Vcore, CPU2 Vcore, CPU1 Vtt, CPU2 Vtt, CPU1 DIMM, CPU2 DIMM,

1.1V, 1.5V, 1.8V, 3.3V, 12V, 5V, 3.3 Vsb, and VBAT.

3.3.9 ACPI Configuration

Use this feature to configure Advanced Configuration and Power Interface (ACPI) power management settings for your system.

3—BIOS Setup Utility

Advanced Setup Configurations

3.3.9.1 ACPI Aware O/S

Enable ACPI support if it is supported by the OS to control ACPI through the Operating System. Otherwise, disable this feature. The options are Yes (default) and No.

3.3.9.2 ACPI Version Features

The options are ACPI v1.0, ACPI v2.0 (default) and ACPI v3.0. Please refer to ACPI's website for further explanation: http://www.acpi.info/.

3.3.9.3 ACPI APIC Support

Select Enabled to include the ACPI APIC Table Pointer in the RSDT (Root System Description Table) pointer list. The options are Enabled (default) and Disabled.

3.3.9.4 APIC ACPI SCI IRQ

When this item is set to Enabled, APIC ACPI SCI IRQ is supported by the system. The options are Enabled and Disabled (default).

3.3.9.5 Headless Mode

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This feature is used to enable system to function without a keyboard, monitor and/or mouse attached The options are Enabled and Disabled (default).

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3.3.9.6 High Performance Event Timer

Select Enabled to activate the High Performance Event Timer (HPET) that produces periodic interrupts at a much higher frequency than a Real-time Clock (R TC) does in synchronizing multimedia streams, providing smooth playback and reducing the dependency on other timestamp calculation devices, such as an x86 RDTSC Instruction embedded in the CPU. The High Performance Event Timer is used to replace the 8254 Programmable Interval Timer. The options are Enabled (default) and Disabled.

3.3.9.7 NUMA Support

Select Enabled to enable Non-Uniform Memory Access support for an “NUMAAware” OS to improve CPU performance. Select Disabled to provide better memory access for an “non-NUMA” OS. Select NUMA for SLES 11 for better CPU performance on a SUSE Linux Enterprise Server 11. The options are Enabled (default), Disabled and NUMA for SLES 11.

3.3.9.8 WHEA Support

Select Enabled to activate Windows Hardware Error Architecture (WHEA) support which will provide a common infrastructure for the system to handle hardware errors on Windows platforms in order to reduce system crashes and to enhance system recovery and health monitoring. The default setting is Enabled.

3.3.10 Trusted Computing (Available when a TPM device is detected)

3.3.10.1 TCG/TPM (Trusted Platform Module) Support

Select Yes on this item and enable the TPM jumper on the motherboard to enable TCG (TPM 1.1/1.2)/TPM support in order to improve data integrity and network security. The options are No (default) and Yes. If this feature is set to Yes, the following items will display:

Indicate Physical

Select Yes for a TPM device to be detected by the system at each system boot. The options are Yes and No (default).

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3—BIOS Setup Utility

Advanced Setup Configurations

TPM Deactivated

Select Set to activate a TPM device at bootup. Select Clear to deactivate a TPM device. The options are Set, Clear and Don’t Change (default).

TPM Owner

Select Enable Install to set up a TPM ownership. Select Clear to void a TPM ownership. Select Disable Install to disable TPM ownership setup support. The options are Don’t Change (default), Enable Install, Disable Install and Clear.

Execute TPM Command

Select Enabled to allow the user to change executable TPM commands and TPM settings. Select Don’t Change to keep the current TPM settings. The options are Don’t Change (default), Enabled, and Disabled.

TPM Enable/Disable Status

This item displays the status of TPM Enabled/Disabled state.

TPM Owner Status

This item displays the status of TPM Ownership.

3.3.11 IPMI Configuration

Intelligent Platform Management Interface (IPMI) is a set of common interfaces that IT administrators can use to monitor system health and to manage the system as a whole from a remote site. For more information on the IPMI specifications, please visit Intel's website at www.intel.com.

3.3.11.1 IPMI Firmware Revision

This item displays the current IPMI firmware revision.

3.3.11.2 Status of BMC

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Baseboard Management Controller (BMC) manages the interface between system management software and platform hardware. This is an informational feature which returns the status code of the BMC micro controller.

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3.3.12 View BMC System Event Log

This feature displays the BMC System Event Log (SEL). It shows the total number of entries of BMC System Events. To view an event, select an Entry Number and pressing <Enter> to display the information as shown in the screen.

• Total Number of Entries

• SEL Entry Number

• SEL Record ID

• SEL Record Type

• Timestamp

• Generator ID

• Event Message Format Version

• Event Sensor Type

• Event Sensor Number

• Event Dir Type

• Event Data

3.3.12.1 Clear BMC System Event Log

Select OK and press the <Enter> key to clear the BMC system log. Select Cancel to keep the BMC System log. The options are OK (default) and Cancel.

Caution: Any cleared information is unrecoverable. Make absolutely sure that you no longer need any data stored in the log before clearing the BMC Event Log.

3.3.13 Set LAN Configuration

This feature allows the user to configure the IPMI LAN settings.

3.3.13.1 Channel Number

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This feature allows the user to enter a channel number to be used for the IPMI LAN connection. This is initially set to [01] (default).

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3.3.13.2 Channel Number Status

This feature returns the channel status for the Channel Number selected above: Channel Number is “OK” or “Wrong Channel Number”.

3.3.13.3 IP Address Source

Select the source of this machine's IP address. If Static is selected, you will need to know and enter manually the IP address of this machine. If DHCP is selected, the BIOS will search for a DHCP (Dynamic Host Configuration Protocol) server in the network it is attached to, and request the next available IP address. The options are DHCP (default) and Static. If Static is selected, the following items will display:

IP Address

Enter the IP address for this machine. This should be in decimal and in dotted quad form (i.e., 192.168.10.253). The value of each three-digit number separated by dots should not exceed 255.

3—BIOS Setup Utility

Advanced Setup Configurations

Subnet Mask

Subnet masks tell the network which subnet this machine belongs to. The value of each three-digit number separated by dots should not exceed 255.

Gateway Address

This is the IP address of the gateway in the network. This is usually a router.

Mac Address

The BIOS will automatically enter the Mac address of this machine; however it may be over-ridden. Mac addresses are 6 two-digit hexadecimal numbers (Base 16, 0 ~ 9, A, B, C, D, E, F) separated by dots. (i.e., 00.30.48.D0.D4.60).

3.3.13.4 BMC Watch Dog Timer Action

This feature allows the BMC to reset or power down the system if the operating system hangs or crashes. The options are Disabled (default), Reset System, Power Down, Power Cycle. If this feature is not set to Disabled, the following item will display.

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BMC Watch Dog TimeOut [Min:Sec]

This feature sets a timed delay (in minutes or seconds before a system powers down or resets after an operating system failure is detected. The options are [5 Min] (default), [1 Min], [30 Sec], and [10 Sec].

3.3.14 Event Log Configuration

3.3.14.1 View Event Log

Use this option to view the System Event Log.

3.3.14.2 Mark all events as read

This option marks all events as read. The options are OK (default) and Cancel.

3.3.14.3 Clear event log

This option clears the Event Log memory of all messages. The options are OK (default) and Cancel.

3.3.14.4 PCI Error Log

Use this option to enable PCI-Express error (PERR) logging. The options are Yes and No (Default).

3.3.14.5 Memory ECC Error Log

Use this option to enable ECC Memory Error logging. The options are Yes (default) and No.

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3.4 Security Settings

The AMI BIOS provides a Supervisor and a User password. If you use both passwords, the Supervisor password must be set first.

3—BIOS Setup Utility

Figure 3-3.

3.4.1 Supervisor Password

This item indicates if a Supervisor password has been entered for the system. “Not Installed” means a Supervisor password has not been used.

3.4.2 User Password

This item indicates if a user password has been entered for the system. “Not Installed” means that a user password has not been used.

3.4.3 Change Supervisor Password

Select this feature and press <Enter> to access the submenu, and then type in a new Supervisor Password.

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Security Settings

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3.4.4 User Access Level (Available when Supervisor Password is set as above)

The Options are Full Access, View Only, Limited, and No Access

• Full Access (default): This feature grants full User read and write access to the

Setup Utility.

• View Only: This feature allows the user to access the Setup Utility, but the user is not allowed to change settings.

• Limited: This feature allows only limited fields to be viewed and changed by the user.

• No Access: This feature prevents User from accessing the Setup Utility.

3.4.5 Change User Password

Select this feature and press <Enter> to access the submenu, and then type in a new User Password.

3.4.6 Clear User Password (Available only when User Password has been set)

This item allows you to clear a user password after it has been entered. The options are OK and Cancel.

3.4.7 Password Check

Select Setup to allow the system to check for a password whenever it enters into the BIOS Setup. Select Always to allow the system to check for a user or supervisor password at each system boot. The options are Setup (default) and Always.

3.4.8 Boot Sector Virus Protection

When Enabled, the AMI BIOS displays a warning when any program (or virus) issues a Disk Format command or attempts to write to the boot sector of the Storage Drive. The options are Enabled and Disabled (default).

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Themis RES-22XR3 Installation Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Version Revision History

Safety Instructions

Table of Contents

List of Figures

List of Tables

Preface

1.1 Overview

1.2 System LEDs and I/O Connectors

1.3 Chipset Overview

1.3.1 The 5500/5600 Series Processor and 5520 Chip set

1.4 Special Features

1.4.1 Recovery from AC Power Loss

1.5 PC Health Monitoring

1.5.1 Fan Status Monitor with Firmware Control

1.5.2 Environmental Temperature Control

1.5.3 System Resource Alert

1.6 ACPI Features

1.6.1 Slow Blinking LED for Suspend-State Indicator

1.6.2 Main Switch Override Mechanism

1.7 Super I/O Controller

1.8 Winbond WPCM450 Controller

1.9 Specifications

1.9.1 General

1.9.2 Electrical

1.9.2.1 System Power

1.9.2.2 Output Voltage

1.9.3 Environmental

1.9.3.1 Shock

1.9.3.2 Electrostatic Discharge

1.9.3.3 Noise

1.10 Packaging and Shipping

1.10.1 Accessory Kit

1.10.2 Rack-Mount Slides (Optional)

2.1 Installation Procedures

2.1.1 Remove Protective Top Cover

2.1.2 Memory Modules

2.1.2.1 Installation

2.1.3 PCI Cards

2.1.3.1 Installing Cards

2.1.4 Lithium Battery

2.1.4.1 Removing the Lithium Battery

2.1.4.2 Installing a Lithium Battery

2.1.5 SAS/SATA II Storage Drive

2.1.5.1 Opening the RES-22XR3 Front Doors

2.1.5.2 Storage-Drive Removal

2.1.5.3 Storage-Drive Installation

2.1.6 Removable 80-mm Fan

2.1.6.1 Removing and Installing a 80-mm Fan

2.1.7 Power Supply

2.1.7.1 Removing a Power Supply

2.1.7.2 Installing a Power Supply

2.2 Rack Mounts

2.2.1 Mounting Brackets

2.2.2 Rack-Mount Slides (Optional)

2.3 Operation

2.3.1 Plugging in the AC Power Cords

2.3.2 Turning the System On

2.3.3 Getting Started

2.3.3.1 Configuration

2.3.3.2 Linux Installation

2.3.4 Turning the System Off

3.1 Introduction

3.1.1 Starting BIOS Setup Utility

3.1.2 How To Change the Configuration Data

3.1.3 Starting the Setup Utility

3.2 Main Setup

3.2.1 System Time/System Date

3.2.2 Supermicro X8DTH

3.2.3 Processor

3.2.4 System Memory

3.3 Advanced Setup Configurations

3.3.1 Boot Features

3.3.1.1 Quick Boot

3.3.1.2 Quiet Boot

3.3.1.3 AddOn ROM Display Mode

3.3.1.4 Bootup Num-Lock