I nstallatio n
I nstallatio n
Manual
Manual
RES-12XR3
RES-12XR3
Configuration 7
Configuration 7
1RU 19” Rack-Mount Rugged Enterprise Server
with X8DTU-F Motherboard Configuration/
Two Quad-Core 5500 or Quad /Six-Core 5600 Xeon CPUs
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-12XR3 - Configuration 7
RES-12XR3 - Configuration 7
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-12XR3 - Configuration 7
RES-12XR3 - Configuration 7
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-12XR3 - Configuration 7
RES-12XR3 - Configuration 7
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-12XR3 - Configuration 7
RES-12XR3 - Configuration 7
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-12XR3 - Configuration 7
RES-12XR3 - Configuration 7
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-12XR3 - Configuration 7
RES-12XR3 - Configuration 7
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-12XR3 - Configuration 7
RES-12XR3 - Configuration 7
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-12XR3 - Configuration 7
RES-12XR3 - Configuration 7
RES-12XR3 Installation Manual
* SuperMicro Motherboard X8DTU-F
- Configuration 7*
Version 1.1— March 2011
Themis Computer—Americas and Pacific Rim
47200 Bayside Parkway
Fremont, CA 94538
Phone (510) 252-0870
Fax (510) 490-5529
World Wide Web http://www.themis.com
Themis Computer—Rest of World
5 Rue Irene Joliot-Curie
38320 Eybens, France
Phone +33 476 14 77 80
Fax +33 476 14 77 89
Copyright © 2010 Themis Computer, Inc.
ALL RIGHTS RESERVED. No part of this publication may be reproduced in any form, by
photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without
the prior written permission of Themis Computer.
The information in this publication has been carefully checked and is believed to be accurate. However,
Themis Computer assumes no responsibility for inaccuracies. Themis Computer retains the right to
make changes to this publication at any time without prior notice. Themis Computer does not assu me
any liability arising from the application or use of this publicat ion or the product(s) described herein.
RESTRICTED RIGHTS LEGEND: Use, duplication, or disclosure by the United States Government
is subject to the restrictions set forth in DFARS 252.227-7013 (c)(1)(ii) and FAR 52.227-19.
TRADEMARKS and SERVICEMARKS
Themis® is a registered trademark of Themis Computer, Inc.
®
Intel
and Xeon™ are registered trademarks of Intel Corporation.
Red Hat
Linux
SuperMicro
All other trademarks, servicemarks, or registered trademarks used in this publication are the property of
their respective owners.
®
is a registered trademark of Red Hat, Inc.
®
is a registered trademark of Linus Torvalds.
®
is a registered trademark of Super Micro Computer, Inc.
CE Marking
This product complies with the European EMC Directive (2004/108/EC) and the European Low Voltage
Safety Directive (2006/95/EC)/.
Safety Precautions
Instructions regarding safety precautions during installation, operation, or maintenance of the equipment
are given in the section entitled “Safety Instructions” on page iv.
WARNINGS and CAUTIONS
The definitions of WARNINGS and CAUTIONS as used in this document are given in the Preface in
the section entitled “Notes, Cautions, Warnings, and Sidebars”.
Themis Customer Support
North America, South America, and Pacific Rim
Telephone: 510-252-0870
Fax: 510-490-5529
E-mail: support@themis.com
Web Site: http://www.themis.com
RES-12XR3 Installation Manual - Configuration 7, Version 1.1
March 2011
Part Number: 116970-024
RES-12XR3 Installation Manual - Configuration 7
Version Revision History
Ve rsion 1.1 .....................................................................................March 2011
• Added RES Matrix tables 2&3 to the Preface.
• Updated maxium memory capacity throughout the manual related to the current
revision of the X8DTU-F motherboard.
• Updated information in Table 1-2, page 1-2 & Table 1-7, page 1 -15.
• added remarks regarding power supply module LED behavior in Section 2.3.4,
“Turning the System Off,” on page 2-21.
•Updated Table 2-5, "1RU Riser Cards Available for the X8DTU-F Mother-
board," on page 2-8.
• Changed photos in Figure 2-5—Figure 2-7 to display different riser card option.
• Completely reworked Chapter 3, "BIOS Setup Utility" to the latest version used
on the X8DTU-F motherboard.
• Added Appendix D, “Optional Remote On/Off Switch”
• Added Appendix E, “Re-Packing Instructions”
• Added clarifying remarks stating that the left PCI slot is not used.
•Updated Figure 1-3, "X8DTU-F Motherboard Block Diagram," on page 1-3.
•Added Table 1-3, "Power Supply LED Behavior," on page 1-10
• Assorted minor edits and changes throughout the manual.
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Ve rsion 1.0......................................................................................February 2010
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
Safety Instructions
To maximize user safety and ensure correct device operation, all instructions contained in this section should be read carefully.
Caution: It is important that the user observe all warnings and instructions
that are on the device and contained in this manual.
• The device must be used in accordance with the instructions for use.
• Electrical installations in the room must correspond to the requirements of
respective regulations.
• Take care that there are no cables, particularly mains cables, in areas where
persons can trip over them.
• Do not use a mains connection in sockets shared by a number of other power
consumers. Do not use an extension cable.
• Only use the mains cable supplied.
• The unit is completely disconnected from the power source only when the
power cord is disconnected from the power source. Therefore the power cord
and its connectors must always remain easily accessible.
• Do not set up the device in the proximity of heat sources or in a damp location.
Make sure the device has adequate ventilation.
• All connection cables must be screwed or locked to the chassis housing.
• The device is designed to be used in horizontal position only.
• The device is no longer safe to operate when
— the device has visible damage or
— the device no longer functions.
• In these cases, the device must be shut down and secured against unintentional
operation.
• Repairs may only be carried out by a person authorized by Themis Computer.
• The device may only be opened for the installation and removal of extension
(PCI) cards, memory modules, storage drives, fan housings, power supplies,
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and the lithium battery—all in accordance with the instructions given in this
manual.
• If extensions are made to the device, the legal stipulations and the device specifications must be observed.
• The device must be switched off when removing the top cover; for example,
before installing extension (PCI) cards.
Operation of Laser Source Devices
DVD/CD-ROM drives contain laser light-emitting diodes (classified in accordance
with IEC 825-1:1993: LASER CLASS 1) and, therefore, must not be opened.
If the enclosure of such a drive is opened, invisible laser radiation is emitted. Do
not allow yourself to be exposed to this radiation.
The laser system meets the code of Federal Regulations 21 CFR,1040 for the USA
and Canadian Radiation Emitting Devices Act, REDR C 1370.
RES-12XR3 Installation Manual - Configuration 7
Safety Instructions
Electrostatic Discharge (ESD)
A sudden discharge of electrostatic electricity can destroy static-sensitive devices
or micro-circuitry. Proper packaging and grounding techniques are necessary precautions to prevent damage. Always take the following precautions:
1. Transport boards in static-safe containers such as boxes or bags.
2. Keep electrostatic-sensitive parts in their containers until they arrive at static-
free stations.
3. Always be properly grounded when touching a sensitive board, component, or
assembly.
4. Store electrostatic-sensitive boards in protective packaging or on conductive
foam.
Grounding Methods
Guard against electrostatic damage at workstations by following these steps:
1. Cover workstations with approved anti-static material. Provide a wrist strap
connected to a work surface and properly grounded tools and equipment.
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
2. Use anti-static mats, heel straps, or air ionizers to give added protection.
3. Handle electrostatic-sensitive components, boards, and assemblies by the case
or the PCB edge.
4. Avoid contact with pins, leads, or circuitry.
5. Turn off power and input signals before inserting and removing connectors or
test equipment.
6. Keep the work area free of non-conductive materials such as ordinary plastic as-
sembly aids and Styrofoam.
7. Use field service tools, such as cutters, screwdrivers, and vacuums that are con-
ductive.
8. Always place drives and boards PCB-assembly-side down on the foam.
Instructions for the Lithium Battery
Systems are equipped with a lithium battery installed on the motherboard. To
replace this battery, please observe the instructions that are described in this manual.
Warning: There is a danger of explosion when the wrong type of battery is used
as a replacement.
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Safety Instructions ................................................................................................................. iv
Preface.................................................................................................................................. xvii
1. Overview and Specifications ........................................................................................ 1-1
1.1 Overview ................................................................................................................ 1-1
1.2 Special Features ..................................................................................................... 1-6
1.2.1 Recovery from AC Power Loss ................................................................. 1-6
1.3 PC Health Monitoring ............................................................................................ 1-6
1.3.1 Fan Status Monitor ..................................................................................... 1-6
1.3.2 Environmental Temperature Control ......................................................... 1-6
1.3.3 System Resource Alert ............................................................................... 1-7
1.4 ACPI Features ........................................................................................................ 1-7
1.4.1 Slow Blinking LED for Suspend-State Indicator ...................................... 1-7
1.5 Super I/O ................................................................................................................ 1-8
1.5.1 Overview of the Winbond WPCM450 Controller ..................................... 1-8
1.6 System LEDs and I/O Connectors ......................................................................... 1-8
1.7 Chipset Overview ................................................................................................ 1-13
1.8 Specifications ....................................................................................................... 1-14
1.9 Packaging and Shipping ....................................................................................... 1-17
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1.7.0.1 Main Features of the 5500 Series Processor
and 5520 Chipset ...................................................................... 1-13
1.8.1 General ..................................................................................................... 1-14
1.8.2 Electrical .................................................................................................. 1-15
1.8.2.1 System Power ........................................................................... 1-15
1.8.2.2 Output Voltage .......................................................................... 1-16
1.8.3 Environmental .......................................................................................... 1-16
1.8.3.1 Shock ........................................................................................ 1-16
1.8.3.2 Electrostatic Discharge ............................................................. 1-16
1.8.3.3 Noise ......................................................................................... 1-16
1.9.1 Accessory Kit ........................................................................................... 1-17
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1.9.2 Rack-Mount Slides (Optional) ................................................................. 1-18
2. Installation and Operation ........................................................................................... 2-1
2.1 Installation Procedures ........................................................................................... 2-1
2.1.1 Remove Protective Top Cover ................................................................... 2-1
2.1.2 Memory Modules ....................................................................................... 2-3
2.1.2.1 Installation ..................................................................................2-4
2.1.3 PCI Cards ................................................................................................... 2-6
2.1.3.1 Installing Cards ........................................................................... 2-9
2.1.4 Lithium Battery ........................................................................................ 2-11
2.1.4.1 Removing the Lithium Battery ................................................. 2-11
2.1.4.2 Installing a Lithium Battery ...................................................... 2-12
2.1.5 SATA II Storage Drive ............................................................................ 2-12
2.1.5.1 Opening the RES-12XR3 Front Doors ..................................... 2-13
2.1.5.2 Storage-Drive Removal ............................................................ 2-13
2.1.5.3 Storage Drive Installation ......................................................... 2-14
2.1.6 Hot-Swappable 38-mm Fan ..................................................................... 2-15
2.1.6.1 Removing and Installing a 38-mm Fan ..................................... 2-15
2.1.7 Power Supply ........................................................................................... 2-17
2.1.7.1 Removing a Power Supply ....................................................... 2-17
2.1.7.2 Installing a Power Supply ......................................................... 2-18
2.2 Rack Mounts ........................................................................................................ 2-19
2.2.1 Mounting Brackets ................................................................................... 2-19
2.2.2 Rack-Mount Slides (Optional) ................................................................. 2-19
2.3 Operation ............................................................................................................. 2-20
2.3.1 Plugging in the AC Power Cords ............................................................. 2-20
2.3.2 Turning the System On ............................................................................ 2-20
2.3.3 Getting Started ......................................................................................... 2-21
2.3.3.1 Configuration ............................................................................ 2-21
2.3.3.2 Linux Installation ...................................................................... 2-21
2.3.4 Turning the System Off ........................................................................... 2-21
3. BIOS Setup Utility ........................................................................................................ 3-1
3.1 Introduction ............................................................................................................ 3-1
3.1.1 Starting BIOS Setup Utility ....................................................................... 3-1
3.1.2 How To Change the Configuration Data ...................................................3-2
3.1.3 Starting the Setup Utility ........................................................................... 3-2
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3.2 Main BIOS Setup ................................................................................................... 3-3
3.2.1 System Overview ....................................................................................... 3-3
3.2.1.1 System Time/System Date .......................................................... 3-3
3.2.1.2 AMI BIOS ................................................................................... 3-4
3.2.1.3 Processor ..................................................................................... 3-4
3.2.1.4 System Memory .......................................................................... 3-4
3.3 Advanced Setup Configurations ............................................................................ 3-5
3.3.1 BOOT Features .......................................................................................... 3-5
3.3.1.1 Quick Boot .................................................................................. 3-5
3.3.1.2 Quiet Boot ................................................................................... 3-5
3.3.1.3 AddOn ROM Display Mode ....................................................... 3-6
3.3.1.4 Bootup Num-Lock ...................................................................... 3-6
3.3.1.5 Wait For 'F1' If Error .................................................................. 3-6
3.3.1.6 Hit 'Del' Message Display ........................................................... 3-6
3.3.1.7 Interrupt 19 Capture .................................................................... 3-6
3.3.2 Power Configuration .................................................................................. 3-6
3.3.2.1 Watch Dog Function ................................................................... 3-6
3.3.2.2 Power Button Function ............................................................... 3-6
3.3.2.3 Restore on AC Power Loss ......................................................... 3-7
3.3.3 Processor and Clock Options ..................................................................... 3-7
3.3.3.1 Clock Spread Spectrum .............................................................. 3-7
3.3.3.2 Hardware Prefetcher
(Available when supported by the CPU) .................................... 3-7
3.3.3.3 Adjacent Cache Line Prefetch
(Available when supported by the CPU) .................................... 3-7
3.3.3.4 L1 Data Prefetch (Available when supported by the CPU) ........ 3-7
3.3.3.5 Data Reuse Optimization
(Available when supported by the CPU) .................................... 3-7
3.3.3.6 MPS and ACPI MADT Ordering ............................................... 3-8
3.3.3.7 Intel Virtualization Technology
(Available when supported by the CPU) .................................... 3-8
3.3.3.8 Execute-Disable Bit Capability
(Available when supported by the CPU) .................................... 3-8
3.3.3.9 Intel AES-NI ............................................................................... 3-8
3.3.3.10 Simultaneous Multi-Threading
(Available when supported by the CPU) .................................... 3-8
3.3.3.11 Active Processor Cores ............................................................... 3-9
3.3.3.12 Intel EIST Technology ................................................................3-9
3.3.3.13 Intel® TurboMode Technology .................................................. 3-9
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
3.3.3.14 C1E Support ................................................................................ 3-9
3.3.3.15 Intel® C-STATE Tech ................................................................ 3-9
3.3.3.16 C-State package limit setting ...................................................... 3-9
3.3.3.17 C1 Auto Demotion ...................................................................... 3-9
3.3.3.18 C3 Auto Demotion ...................................................................... 3-9
3.3.3.19 ACPI T State ............................................................................. 3-10
3.3.4 Advanced Chipset Control ....................................................................... 3-10
3.3.4.1 CPU Bridge Configuration ....................................................... 3-10
3.3.4.2 Request Transaction ID
(Available for the Intel Xeon 5600 platform only) ................... 3-10
3.3.4.3 QPI Links Speed ....................................................................... 3-10
3.3.4.4 QPI Frequency .......................................................................... 3-10
3.3.4.5 QPI L0s and L1 ......................................................................... 3-11
3.3.4.6 Memory Frequency ................................................................... 3-11
3.3.4.7 Memory Mode .......................................................................... 3-11
3.3.4.8 Demand Scrubbing ................................................................... 3-11
3.3.4.9 Patrol Scrubbing ....................................................................... 3-11
3.3.4.10 Throttling - Closed Loop/Throttling - Open Loop ....................3-11
3.3.4.11 Intel I/OAT ............................................................................... 3-12
3.3.4.12 DCA (Direct Cache Access)Technology .................................. 3-12
3.3.4.13 DCA Prefetch Delay ................................................................. 3-12
3.3.4.14 Intel VT-d ................................................................................. 3-12
3.3.4.15 Active State Power Management .............................................. 3-12
3.3.4.16 Slot SXB2/SXB3 Width ........................................................... 3-12
3.3.4.17 Slot SXB1 Width ...................................................................... 3-13
3.3.4.18 IOH PCI-E Max Payload Size .................................................. 3-13
3.3.4.19 USB Functions .......................................................................... 3-13
3.3.4.20 Legacy USB Support ................................................................ 3-13
3.3.4.21 Port 60h/64h Emulation ............................................................ 3-13
3.3.4.22 USB 2.0 Controller
(Available when USB Functions is Disabled) .......................... 3-13
3.3.4.23 USB 2.0 Controller Mode ......................................................... 3-13
3.3.4.24 BIOS EHCI Hand-Off .............................................................. 3-14
3.3.4.25 Route Port 80h Cycle to ............................................................ 3-14
3.3.5 IDE/SATA/Floppy Configuration ........................................................... 3-14
3.3.5.1 SATA#1 Configuration ............................................................. 3-14
3.3.5.2 IDE Detect Timeout (sec) ......................................................... 3-15
3.3.5.3 Primary IDE Master/Slave, Secondary IDE Master/Slave,
Third IDE Master, and Fourth IDE Master ............................... 3-15
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3.3.6 PCI/PnP Configuration ............................................................................ 3-17
3.3.6.1 Clear NVRAM .......................................................................... 3-17
3.3.6.2 Plug & Play OS ......................................................................... 3-17
3.3.6.3 PCI Latency Timer .................................................................... 3-18
3.3.6.4 PCI IDE BusMaster .................................................................. 3-18
3.3.6.5 SR-1OV Supported ................................................................... 3-18
3.3.6.6 PCI-E Slot from SXB1/PCI-E Slot from SXB2/PCI-E
Slot from SXB3 ........................................................................ 3-18
3.3.6.7 Onboard LAN Option ROM Select .......................................... 3-18
3.3.6.8 Load Onboard LAN1 Option ROM/Load Onboard LAN2
Option ROM ............................................................................. 3-18
3.3.6.9 Boots Graphics Adapter Priority ............................................... 3-18
3.3.7 Super IO Device Configuration ............................................................... 3-19
3.3.7.1 Serial Port1 Address/ Serial Port2 Address .............................. 3-19
3.3.7.2 Serial Port 2 Attribute ............................................................... 3-19
3.3.8 Remote Access Configuration ................................................................. 3-19
3.3.8.1 Remote Access .......................................................................... 3-19
3.3.9 Hardware Health Event Monitoring ........................................................ 3-20
3.3.9.1 CPU Overheat Alarm ................................................................ 3-20
3.3.9.2 CPU 1 Temperature/CPU 2 Temperature/
System Temperature ................................................................. 3-21
3.3.9.3 Fan 1—Fan 8 Reading .............................................................. 3-22
3.3.9.4 Fan Speed Control Modes ......................................................... 3-22
3.3.9.5 Voltage Monitoring ................................................................... 3-23
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3.3.10 ACPI Configuration ................................................................................. 3-23
3.3.10.1 High Performance Event Timer ................................................ 3-23
3.3.10.2 ACPI Aware O/S ...................................................................... 3-23
3.3.10.3 ACPI APIC Support ..................................................................3-23
3.3.10.4 APIC ACPI SCI IRQ ................................................................ 3-24
3.3.10.5 Headless Mode .......................................................................... 3-24
3.3.10.6 ACPI Version Features ............................................................. 3-24
3.3.10.7 NUMA Support .........................................................................3-24
3.3.10.8 WHEA Support ......................................................................... 3-24
3.3.11 IPMI Configuration ..................................................................................3-24
3.3.11.1 IPMI Firmware Version ............................................................ 3-24
3.3.11.2 Status of BMC Working ........................................................... 3-24
3.3.12 View BMC System Event Log ................................................................ 3-25
3.3.12.1 Clear BMC System Event Log ................................................. 3-25
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
3.3.13 Set LAN Configuration ............................................................................ 3-26
3.3.14 Event Log Configuration ......................................................................... 3-27
3.3.14.1 View Event Log ........................................................................ 3-27
3.3.14.2 Mark All Events as Read .......................................................... 3-27
3.3.14.3 Clear Event Log ........................................................................ 3-27
3.3.14.4 PCIE ErrorLog .......................................................................... 3-27
3.3.14.5 Memory Error Log .................................................................... 3-27
3.4 Security Settings .................................................................................................. 3-28
3.4.1 Supervisor Password ................................................................................ 3-28
3.4.2 User Password .......................................................................................... 3-28
3.4.3 Change Supervisor Password ................................................................... 3-28
3.4.4 User Access Level
(Available when Supervisor Password is set as above) ........................... 3-29
3.4.5 Change User Password ............................................................................ 3-29
3.4.6 Clear User Password
(Available only when User Password has been set) ................................ 3-29
3.4.7 Password Check ....................................................................................... 3-29
3.4.8 Boot Sector Virus Protection ................................................................... 3-29
3.5 Boot Configuration .............................................................................................. 3-30
3.5.1 Boot Device Priority ................................................................................ 3-30
3.5.2 Storage Drives .......................................................................................... 3-30
3.5.3 Removable Drives .................................................................................... 3-31
3.5.4 CD/DVD Drives ...................................................................................... 3-31
3.5.5 USB Drives .............................................................................................. 3-31
3.5.6 Network Drives ........................................................................................ 3-31
3.6 Exit Options ......................................................................................................... 3-32
3.6.1 Save Changes and Exit ............................................................................ 3-32
3.6.2 Discard Changes and Exit ........................................................................ 3-32
3.6.3 Discard Changes ...................................................................................... 3-32
3.6.4 Load Optimal Defaults ............................................................................. 3-33
3.6.5 Load Fail-Safe Defaults ........................................................................... 3-33
Appendix A. Connector Pinouts ......................................................................................A-1
A.1 PS/2 Keyboard and Mouse ................................................................................... A-1
A.2 USB Ports ............................................................................................................. A-2
A.3 Serial Ports ............................................................................................................ A-2
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A.4 Gigabit Ethernet LAN Ports ................................................................................. A-3
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A.5 VGA Display Port ................................................................................................. A-4
Appendix B. Rack-Mount Slide Installation ...................................................................B-1
Appendix C. Red Hat Enterprise Linux 5 Installation ..................................................C-1
C.1 Introduction ............................................................................................................C-1
C.2 Installation .............................................................................................................C-1
Appendix D. Optional Remote On/Off Switch .............................................................. D-1
D.1 Remote On/Off Configuration .............................................................................. D-1
D.2 Remote On-Only Configuration ........................................................................... D-2
D.3 Ordering the Remote On/Off Switch .................................................................... D-2
Appendix E. Re-Packing Instructions ............................................................................. E-1
E.1 Re-Packaging for Shipment ................................................................................... E-1
E.2 Packing Components .............................................................................................E-1
E.3 Instructions for Re-Packing ...................................................................................E-2
Index ................................................................................................................Index-1
Reader Comment Card
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List of Figures
Figure 1 Rugged Enterprise Server Model RES-12XR3............................................... xvii
Figure 2 Front View of a Standard Rear-I/O RES-32 Chassis (Doors Removed)........... xx
Figure 3 Rear View of a Standard Rear-I/O RES-32 Chassis........................................ xxi
Figure 4 Front View of a Front-I/O RES-32 Chassis..................................................... xxi
Figure 5 Rear View of a Front-I/O RES-32 Chassis...................................................... xxi
Figure 1-1 RES-12XR3 (with Front Doors installed) ....................................................... 1-1
Figure 1-2 External Features of the RES-12XR3 (X8DTU-F Motherboard).................... 1-2
Figure 1-3 X8DTU-F Motherboard Block Diagram ......................................................... 1-3
Figure 1-4 Open Top View of the RES-12XR3—Air Flow Diverter Removed............... 1-5
Figure 1-5 RES-12XR3 System LEDs and I/O Connectors (X8DTU-F Motherboard).... 1-9
Figure 2-1 Remove the RES-12XR3 Protective Access Cover......................................... 2-2
Figure 2-2 Remove RES-12XR3 Air-Flow Deflector....................................................... 2-4
Figure 2-3 Memory Module Slot Locations (X8DTU-F Motherboard)............................ 2-5
Figure 2-4 Memory Module Removal............................................................................... 2-6
Figure 2-5 Positioning of the RES-12XR3 PCI/UIO Riser Cards..................................... 2-7
Figure 2-6 PCI Riser Cards are attached to a Retainer Bracket... ..................................... 2-8
Figure 2-7
…
then inserted into the PCI slots of the Motherboard .................................. 2-9
Figure 2-8 The RES-12XR3 has Three PCI Expansion Slots ........................................... 2-9
Figure 2-9 Installation of the PCI Card Retainer Clip..................................................... 2-10
Figure 2-10 The RES-12XR3 Lithium Battery and Multiple Wire Cable ........................ 2-11
Figure 2-11 The RES-12XR3 Lithium Battery and Socket............................................... 2-12
Figure 2-12 Opening the RES-12XR3 Front Doors.......................................................... 2-13
Figure 2-13 Unlocking the RES-12XR3 Storage Drives (Front Doors Removed)........... 2-13
Figure 2-14 RES-12XR3 Storage Drive Removal ............................................................ 2-14
Figure 2-15 The RES-12XR3 Hot-Swappable 38-mm Fans............................................. 2-16
Figure 2-16 Removing One of the Five RES-12XR3 38-mm Fans .................................. 2-16
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Figure 2-17 The RES-12XR3 Power Supply Locking Mechanism .................................. 2-17
Figure 2-18 Right Rack-Mount Bracket............................................................................ 2-19
Figure 2-19 AC Power Socket and LED on the RES-12XR3 Rear................................... 2-20
Figure 2-20 System Power Button and LED on the RES-12XR3 Front ........................... 2-20
Figure 3-1 Main BIOS Setup Screen................................................................................. 3-3
Figure 3-2 Advanced Settings ........................................................................................... 3-5
Figure 3-3 Security Settings ............................................................................................ 3-28
Figure 3-4 Boot Settings.................................................................................................. 3-30
Figure 3-5 Exit Options................................................................................................... 3-32
Figure A-1 USB Connector Pinout.................................................................................... A-2
Figure A-2 COM 1 Serial Connector Pinout..................................................................... A-2
Figure A-3 Ethernet Connector, Type RJ45...................................................................... A-3
Figure A-4 VGA Connector Pinout................................................................................... A-4
Figure B-1 Screw Locations for Rack-Mount Slides ......................................................... B-1
Figure B-2 RES-12XR3 Rack-Mount Slide Installation.................................................... B-3
Figure C-1 Power On after Linux DVD is Inserted into Drive.......................................... C-2
Figure C-2 Skip Key .......................................................................................................... C-2
Figure C-3 Welcome Screen .............................................................................................. C-3
Figure C-4 Language Selection.......................................................................................... C-4
Figure C-5 Selecting Layout Type..................................................................................... C-5
Figure C-6 Enter Installation Number................................................................................ C-6
Figure C-7 Partitioning....................................................................................................... C-7
Figure C-8 Reviewing Option............................................................................................ C-8
Figure C-9 Creating a Custom Layout............................................................................... C-9
Figure C-10 Setting Up Boot Loader................................................................................. C-10
Figure C-11 Master Boot Record (MBR) .......................................................................... C-11
Figure C-12 Network Devices List .................................................................................... C-12
Figure C-13 Edit Interface Pop-Up Screen ........................................................................ C-13
xiv
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Table of Contents
Figure C-14 Selecting Time Zone...................................................................................... C-14
Figure C-15 Setting Up Root Account and Password........................................................ C-15
Figure C-16 Package Installation Default Screen.............................................................. C-16
Figure C-17 Optional Packages.......................................................................................... C-17
Figure C-18 Option to Review or Continue....................................................................... C-18
Figure C-19 Installation Begins ......................................................................................... C-18
Figure C-20 Installation is Complete ................................................................................. C-19
Figure C-21 Login Screen.................................................................................................. C-20
Figure C-22 Ready to use the Desktop............................................................................... C-20
Figure D-1 Remote On/Off Switch Module...................................................................... D-1
Figure E-1 Packaging Components.................................................................................... E-2
Figure E-2 Order of Assembly........................................................................................... E-3
List of Tables
Table 1 RES-x2XR3 20”-Deep Chassis Manual Matrix ............................................ xviii
Table 2 RES-x2XR3S / RES-x1XR3 17”-Deep Chassis Manual Matrix..................... xix
Table 3 Front I/O 16”-Deep Chassis Manual Matrix......................................................xx
Table 1-1 RES-12XR3 Motherboard Options—Configuration 7 ................................... 1-2
Table 1-2 Major Features of RES-12XR3—Configuration 7......................................... 1-4
Table 1-3 Power Supply LED behavior........................................................................ 1-10
Table 1-4 System LEDs ................................................................................................ 1-11
Table 1-5 Rear-Panel I/O Connectors........................................................................... 1-12
Table 1-6 RES-12XR3 General Specifications............................................................. 1-14
Table 1-7 RES-12XR3 Electrical Specifications .......................................................... 1-15
Table 1-8 Approximate Weights of the RES Series...................................................... 1-18
Table 2-1 RES-12XR3 Memory Capacity ...................................................................... 2-3
Table 2-2 RES-12XR3 Optimal Memory Population (CPU1 Installed)......................... 2-3
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
Table 2-3 RES-12XR3 Optimal Memory Population (CPU2 Installed)......................... 2-3
Table 2-4 RES-12XR3 Optimal Memory Population (CPU1/CPU2 Installed).............. 2-3
Table 2-5 1RU Riser Cards Available for the X8DTU-F Motherboard ......................... 2-8
Table 3-1 PIO Mode Select Options ............................................................................. 3-16
Table 3-2 DMA Mode Select Options .......................................................................... 3-16
Table A-1 PS/2 Keyboard/Mouse Pinouts and Signal Definitions................................. A-1
Table A-2 USB Connector Signal Definitions................................................................ A-2
Table A-3 COM 1 Serial Connector Signal Definitions................................................. A-2
Table A-4 RJ45 Ethernet Pinout Signals ........................................................................ A-3
Table A-5 VGA Connector Pinout Signal Descriptions ................................................. A-4
xvi
Themis Computer
Preface
This document, entitled RES-12XR3 Installation Manual—Configuration 7, provides instructions on how to install, configure, power up, and boot the Themis Rugged Enterprise Server RES-12XR3 Configuration 7 (see Figure 1 below), which is
based on two 64-bit Intel® 5500-Series Xeon™ Quad/Dual-Core CPUs or two Intel
5600-Series Xeon™ Quad/Six-Core CPUs.
RES-12XR3 Configuration 7 supports one motherboard in a 20”-deep chassis:
• SuperMicro X8DTU-F
(A matrix describing 20”-deep chassis configurations is given in Table 1, page xviii.
A matrix describing 17”-deep chassis configurations is given in Table 2 on page
xix).
®
Themis Computer
Figure 1. Rugged Enterprise Server Model RES-12XR3
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
Table 1. RES-x2XR3 20”-Deep Chassis Manual Matrix
RES-22XR3
with Riser
Manual
Part Number
RES-12XR3
Manual
Part Number
Category Motherboard
Configuration 1
X8DTH-iF
X8DTH-6F
CPU
a
Soc
kets
RES-32XR3
Manual
Part Number
2 116790-024 116789-024
RES-22XR3
Manual
Part Number
X8DTi
Configuration 2
X8DTi-F
2 117022-024 117017-024
X8DTi-LN4F
X8DT3
Configuration 3
X8DT3-F
2 117023-024 117018-024
X8DT3-LN4F
Configuration 4 X8DTN+ 2 117024-024 117019-024
Configuration 5
X8DAi
X8DA3
2 117025-024 117020-024
Configuration 6* X8DAH+-F 2 117026-024 117021-024
Configuration 7 X8DTU-F 117280-024 116970-024
Naming Key: X8Dvwxyz System RES-x2XR3, where x = 3, 2, or 1
v: A = Sound chip; no graphics chip
T = Graphics chip; no sound chip
* Configuration 6 motherboard X8DAH+-F supports both audio and video;
however, the naming key does not contain a “T” in the title.
w: H = Two Tylersberg Northbridge chips
blank = One Tylersberg Northbridge chip
U = Motherboard with cutout
x: i=SATA only
3 = SAS 1.0
6 = SAS 2.0
y: LN4 = Extra gigabit Ethernet controller for two extra ports
z: F=IPMI
blank = No IPMI
a—All motherboards measure 12”W x 13”L except X8DTN+ and X8DAH+-F, which are 13.68”W x 13” L.
xviii
Themis Computer
Table 2. RES-x2XR3S / RES-x1XR3 17”-Deepa Chassis Manual Matrix
Preface
Mother-
board
X8DTL-6F
X8DTL-6
X8DTL-3F
X8DTL-3
X8DTL-iF
X8DTL-i
X8DAL-3
X8DAL-i
CPU
Soc
kets
RES-32XR3S
Manual P/N
RES-22XR3S
Manual P/N
RES-12XR3S
Manual P/N
2 117408-024 117412-024 117416-024
2 117409-024 117413-024 117417-024
2 117410-024 117414-024 117418-024
2 117411-024 117415-024 117419-024
RES-31XR3
Manual P/N
RES-21XR3
Manual P/N
X8SAX 1 117420-024 117421-024
X8ST3-F
X8STE
1
117385-024 117422-024
X8STi
X8STi-F
X8STi-LN4
1
118188-024 117423-024
X8STi-3F
RES-11XR3
Manual P/N
Naming Key: X8uvwxyz System RES-x2XR3S and RES-x1XR3, where x = 3, 2, or 1
u: D = Double CPU sockets
S = Single CPU socket
v: A = Sound chip; no graphics chip
T = Graphics chip; no sound chip
w: Not applicable
x: i=SATA only
3 = SAS 1.0
6 = SAS 2.0
y: LN4 = Extra gigabit Ethernet controller for two extra ports
z: F=IPMI
blank = No IPMI
a—The 17”-deep RES XR3 chassis actually measures 17.07” deep, but for simplicity will continue to be referred to as being 17” deep throughout these manuals.
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
A matrix describing RES chassis configured for front-I/O connector and front-PCI
card access in a 16”-deep chassis is given in Table 3. This chassis design makes it
more convenient to install cables to the system and demands no access to the rear of
the chassis except to replace a fan. Figure 2 shows the front view of a standard rearI/O RES-32 chassis (Figure 3 on page xxi shows the rear view); Figure 4 shows the
front view of a front-I/O RES-32 chassis (Figure 5 shows the rear view).
Table 3. Front I/O 16”-Deep Chassis Manual Matrix
Mother-
board
X8DAH+-F* 2 117611-024
X8DTU-F 2 117664-024
Naming Key: X8uvwxyz System RES-x2XR3S and RES-x1XR3, where
x = 3, 2, or 1
*RES-32XR3/FIO motherboard X8DAH+-F supports both audio and video;
however, the naming key does not contain a “T” in the title.
u: D = Double CPU sockets
S = Single CPU socket
v: A = Sound chip; no graphics chip
T = Graphics chip; no sound chip
w: Not applicable
x: i = SATA only
3 = SAS 1.0
6 = SAS 2.0
y: LN4 = Extra gigabit Ethernet controller for two extra ports
z: F=IPMI
blank = No IPMI
CPU
Sockets
RES-32XR3/FIO Manual P/N RES-22XR3/FIO Manual P/N
xx
Figure 2. Front View of a Standard Rear-I/O RES-32 Chassis (Doors Removed)
Themis Computer
Preface
Figure 3. Rear View of a Standard Rear-I/O RES-32 Chassis
Themis Computer
Figure 4. Front View of a Front-I/O RES-32 Chassis
Figure 5. Rear View of a Front-I/O RES-32 Chassis
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
The 1RU-high (1.75”) RES-12XR3 has been designed to fit into a standard 19” rack
and is provided with rack-mount brackets with handles. Optional rack-mount slides
are also available. The RES-12XR3 is rugged enough to withstand extreme shock
(up to 35G), temperature, and EMI as that associated with such demanding markets
as the military, aerospace, and telecommunications industries.
Intel processors supported by RES-12XR3 include either
• Two Intel 5500-Series Xeon Quad-Core CPUs, or
• Two Intel 5600-Series Xeon Quad/Six-Core CPUs
which operate at a QPI (QuickPath Interconnect) up to 6.4 GT/s and support a total
memory capacity of 192 GigaBytes (12 16-GB DIMMs) using 1066-MHz DDR3
ECC Registered memory modules. Changing memory speeds—1333 MHz and 800
MHz—is supported by lower capacity DIMMs, hence lower total memory capacity.
RES-12XR3 is based on the functionality and capability of the following Intel chipset:
• Intel 5520 (Tylersburg) chipset
• ICH1OR + IOH-36D
An overview of RES-12XR3 design and specifications is given in Chapter 1, "Overview and Specifications", of this manual.
This manual is intended for an experienced system administrator with a knowledge
of both networking and high-speed server systems.
Website Information
Themis Computer corporate and product information may be accessed on the World
Wide Web by browsing the website http://www.themis.com
.
Your Comments are Welcome
xxii
We are interested in improving our documentation and welcome your comments and
suggestions. You can email your comments to us at docfeedback@themis.com.
Please include the document part number in the subject line of your email.
Themis Computer
Preface
Notes, Cautions, Warnings, and Sidebars
The following icons and formatted text are included in this document for the reasons
described:
Note: A note provides additional information concerning the procedure or action
being described.
Caution: A caution describes a procedure or action that may result in damage to
the equipment. This may involve—but is not restricted to—heavy equipment or
sharp objects. To reduce the risk, follow the instructions accompanying this symbol.
Themis Computer
Warning: A warning describes a procedure or action that may cause injury or death
to the operator as a result of hazardous voltages. To reduce the risk, follow the instructions accompanying this symbol.
Sidebar: A “sidebar” adds detail to the section within which it is placed,
but is not absolutely vital to the description or procedure of the section.
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
xxiv
Themis Computer
General
Section
1.1 Overview
The RES-12XR3 Configuration 7 (see Figure 1-1 below; a block diagram is given
in Figure 1-3, page 1-3) is a rack-mounted high-performance system designed specifically for above-average shock and vibration environments. The RES-12XR3 supports two Intel® 1366-pin LGA 64-bit 5500/5600-Series Xeon™ processors, each
with a QPI (Quick-Path Interconnect) up to 6.4 GT/s (Giga-Transfers per Second)
supporting 192 GB of 1333/1066/800-MHz DDR3 ECC Registered memory modules. Its computer/graphics-intensive and diverse-I/O capabilities are ideal for military/aerospace and commercial telecommunications applications. Motherboard
options supported by Configuration 7 are listed in Table 1-1 on page 1-2.
Chapter
Overview and Specifications
Themis Computer
Figure 1-1. RES-12XR3 (with Front Doors installed)
1-1
RES-12XR3 Installation Manual - Configuration 7 Version 1.1
Front View (Doors Removed)
AC Power Socket
(3-prong NEMA 15)
Dual Power Supplies
System Power
Power Supply
Latch Lock
ON/OFF Switch
CD-RW/DVD-ROM
Combo Slimline Drive
Rear I/O Panel (see Figure 1-5, page 1-10)
17” (42.7 cm), 19” with Rack Mounts
20” (50.8 cm) deep
Rear View
Not Used
Front LED Indicator Panel
(see Figure 1-5, page 1-10)
Storage Drive (SATA II) - Total of 3
1.75”
(1RU)
Upper Right PCI Slot,
Lower Right PCI Slot,
Right Riser
Right Riser
(as viewed from
rear of system)
Table 1-1. RES-12XR3 Motherboard Options—Configuration 7
PCI-e, PCI-X, and PCI or UIO Slots
Mother-
board
IPMI SATA SAS
a
Memory
Slots
Graphics Audio
PCI-e
x16
PCI-e x8PCI-e
x4
PCI-X UIO
X8DTU-F Yes Yes — 12 Yes — 1 2 — — —
a—SuperMicro Computer, Inc.
The RES-12XR3 is designed within a 1RU-high (1.75”) form-factor 20” (50.8 cm)
deep and 17” (43.2 cm) wide (which, with mounting brackets, fits a 19”-wide rack; see
Figure 1-2). Major features of the RES-12XR3 are described in Table 1-2, page 1-4.
1-2
Figure 1-2. External Features of the RES-12XR3 (X8DTU-F Motherboard)
Themis Computer
1—Overview and Specifications
SATA #0
SATA #1
SATA #2
SATA #3
SATA #4
SATA #5
USB
PCI
SATA
LPC
USB
SPI
(Lane Reve rsal)
(Lane Reve rsal)
Gen 2.0 x8
Gen 2.0 x8
Gen 2.0 x8
Gen 2.0 x16
QPI
QPI
QPI
A
BBC
C
D
EEF
F
In x4 Slot
Processor #0 Processor #1
DDR3 DIMM
DDR3 DIMM
DDR3 DIMM
DDR3 DIMM
DDR3 DIMM
DDR3 DIMM
Intel 82576
RJ45 RJ45
SST
25VF016
PCI-E x16PCI-E x8 PCI-E x8
USB 0/1
USB 2/3
USB 4/5
USB 6/7
BMC
VGA
RJ45
COM A
COM B
SIO
W83527HG
KB
MS
Intel ICH10R
ESI CLINK
Por ts
8,10
PCI-E Ports 1-6
Intel 5520
Port 1 Port 0
Por ts
7-10
Ports 5-6
Ports 3-4 ESI CLINK
Por ts
1-2
Overview
Themis Computer
Figure 1-3. X8DTU-F Motherboard Block Diagram
a—This represents a general block diagram of the X8DTU board and does not nec-
essarily depict specific system configurations
a
1-3
RES-12XR3 Installation Manual - Configuration 7 Version 1.1
The RES-12XR3 front panel houses three removable SATA II storage drives. Storage drive requirements should be ordered at the time of purchase. Also included on
the front panel is a combination CD-RW/DVD-ROM Slimline drive, an ON/OFF
power button, and system LEDs (see Figure 1-5 on page 1-9). The rear panel contains I/O faceplates for three PCI cards (graphics, RAID, NIC, etc.), two AC power
supplies with latch locks and power-cord sockets, and all I/O connectors (Figure 1-5
on page 1-9).
Major internal components can be seen in the open top view of Figure 1-4, page 1-5.
Table 1-2. Major Features of RES-12XR3—Configuration 7
Feature Details
Processor (CPU)
Chipset
Memory
Expansion slots
Rear-Panel I/O
Peripheral Support
Operating temperature
Two 1366-pin Intel Quad-Core 5500-Series or Quad/Six-Core 5600-Series
Xeon CPUs @ up to 6.4 GT/s each)
Intel® 5520 (Tylersburg) chipset
ICH10R + IOH-36D
Twelve (12) 240-pin DIMMs supporting up to 192GB (16GB DIMMs) of Reg-
istered ECC DDR3 1333/1066/800-MHz 72-bit SDRAM
See Table 1-1 on page 1-2 for details
See Table 1-5 on page 1-12 for details
Three SATA II storage drives
1 combination CD-RW/DVD-ROM slimline (IDE) drive
0° up to 65° C (32° up to 149°F)
Shock endurance 35G @ 25-msec duration (3 axis)
Dimensions
1.75” (1RU) high, 17” (43.2 cm) wide (19”/48.3 cm with mounting brackets),
20” (50.8 cm) deep
Rack-mount brackets
and slides
Dual power supplies
Left and right rack-mount tabs are attached to the chassis
Left and right rack-mount slides are optional
750 watts each, auto-ranging (100–265 Vac)
Load-sharing N+1 redundant, hot-pluggable
Optional—Choice of 750-watt (48V) or 450/500-watt (28V) DC Power supply
1-4
Themis Computer
1—Overview and Specifications
Front
Storage Drive (Total of 3)
CD/DVD
Combo-Drive
Housing
38-mm Fan
AC Power Supply
AC Power Supply
(Five Total)
Right Riser Card
CPU 2
CPU 1
6 DIMM Memory
Modules (CPU 1)
6 DIMM Memory
Modules (CPU 2)
PCI-Express Card
(Upper Right Slot)
Lithium Battery
(underneath wires)
(Left)(Right)
Overview
Themis Computer
Figure 1-4. Open Top View of the RES-12XR3—Air Flow Diverter Removed
1-5
RES-12XR3 Installation Manual - Configuration 7 Version 1.1
1.2 Special Features
1.2.1 Recovery from AC Power Loss
The BIOS setup can be configured to allow the system, whenever AC power is lost,
• to remain off (power switch must be pressed to turn system back on) or
• return to a power-on state automatically when power is restored.
The system default is “Last State”.
1.3 PC Health Monitoring
The following sections describe the PC health monitoring features of the X8DTU-F.
All have an onboard System Hardware Monitor chip that supports PC health monitoring. An onboard voltage monitor will scan these onboard voltages continuously:
CPU cores, +1.8V, +3.3V, +5V, +12V, +3.3V Standby, +5V Standby, VBAT, Memory, Chipset Voltages. Once a voltage becomes unstable, a warning is given or an
error message is sent to the screen. Users can adjust the voltage thresholds to define
the sensitivity of the voltage monitor.
1.3.1 Fan Status Monitor
The RES-12XR3 has five 38-mm cooling fans and one within each power supply.
The PC health-monitor utility can be used to check the RPM status of cooling fans.
The onboard CPU and chassis fans are controlled by Thermal Management via
BIOS.
1.3.2 Environmental Temperature Control
The thermal-control sensor monitors CPU temperature in real time and will activate
the thermal fan when CPU temperature exceeds a user-defined threshold. Overheat
circuitry operates independently from the CPU, and can continue to monitor overheat conditions even when the CPU is in sleep mode.
1-6
Once the thermal sensor detects a CPU temperature that is above the set threshold, it
automatically turns on the thermal control fan to prevent overheat damage to the
Themis Computer
CPU. In addition, onboard chassis thermal circuitry can monitor overall system temperature and alert users when chassis temperature exceeds a user-defined threshold.
Caution: To avoid possible system overheating, please be sure to provide adequate
airflow to your system.
1.3.3 System Resource Alert
Available only through Supero Doctor III in the Windows OS environment or
Supero Doctor II in Linux (an optional third-party product), this feature is used to
notify the user of certain system events. For example, you can also configure Supero
Doctor to provide you with warnings when the system temperature, CPU temperature, voltages and fan speeds go beyond a pre-defined range.
1—Overview and Specifications
1.4 ACPI Features
Advanced Configuration and Power Interface (ACPI) defines a flexible and abstract
hardware interface that provides a standard method of integrating power management features throughout the system. This includes the hardware, the operating system, and the application software. As a result, the system can automatically turn
peripherals (CD-ROMs, NICs, storage drives, and printers, for example) on or off.
This includes any consumer devices that may be connected to the system (VCRs,
TVs, telephones, and stereo systems, for example).
In addition to providing operating-system power management, ACPI offers a generic
system event mechanism for Plug and Play and an operating-system-independent
interface for configuration control. Plug-and-Play BIOS data structures are leveraged, while the implementation is processor-architecture-independent and compatible with both Windows 2003 and Windows 2008 Operating Systems.
1.4.1 Slow Blinking LED for Suspend-State Indicator
When the CPU enters a suspend state, the Power LED will start blinking to indicate
that the CPU is in suspend mode. Pressing any key on the keyboard will awaken the
CPU, at which time the power LED will stop blinking and remain on.
Themis Computer
1-7
RES-12XR3 Installation Manual - Configuration 7 Version 1.1
1.5 Super I/O
The Super I/O supports two high-speed,16550 compatible serial communication
ports (UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable
baud rate generator, complete modem control capability and a processor interrupt
system. Both UARTs provide legacy speed with baud rate of up to 115.2 Kbps as
well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which support higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Configuration
and Power Interface), which includes support of legacy and ACPI power management through an SMI or SCI function pin. It also features auto power management to
reduce power consumption.
1.5.1 Overview of the Winbond WPCM450 Controller
The Winbond WPCM450 Controller is a Baseboard management Controller (BMC)
that supports the 2D/VGA-compatible Graphics Core with the PCI interface, Virtual
media, and keyboard/Video/Mouse Redirection (KVMR) modules. With blade-oriented Super I/O capability built-in, the WPCM450 Controller is ideal for legacyreduced server platforms.
The WPCM450 interfaces with the host system via a PCI interface to communicate
with the Graphics core. It supports USB 2.0 and 1.1 for remote keyboard/mouse/virtual media emulation. It also provides LPC interface to control Super I/O functions.
The WPCM450 is connected to the network via n external Ethernet PHY module.
The WPCM450 communicates with onboard components via six SMBus interfaces,
fan control, and Platform Environment Control Interface (PECI) buses.
Note: For more information on IPMI configuration, please refer to the Embedded
IPMI User’s Guide posted @ http://www.supermicro.com/support/manuals/
1.6 System LEDs and I/O Connectors
1-8
All RES-12XR3 system LEDs are located on the front panel (see A, Figure 1-5,
page 1-9); all I/O connectors are located on the rear panel (see B, Figure 1-5). LEDs
are described in Table 1-4 on page 1-11; I/O connectors are described in Table 1-5,
page 1-12.
Themis Computer
LEDs
NIC1 NIC2Storage
Drives
Power ON/OFF
Button
Power
Fail
(PS1)
Overheat/
Fan Fail
Power
Fail
(PS2)
C
ENET2
<>
ENET1
<>
Left Power
Supply
Right Power
Supply
(Lower Right Side)
Rear Panel
Front Panel (Doors Removed)
Rear I/O Panel
PS/2 Mouse (green)
PS/2 Keyboard (purple)
USB Port 1 (top)
USB Port 0 (bottom)
IPMI_Dedicated LAN
COM Port 1 (Turquoise)
VGA (Blue)
LAN 1 LAN 2
Gigabit Ethernet
UID Switch
(Upper Left Side)
PCI Expansion Card
(as viewed from
rear of system)
(Upper Right Side)
PCI Expansion Card
Not Used
A
B
1—Overview and Specifications
System LEDs and I/O Connectors
Themis Computer
Figure 1-5. RES-12XR3 System LEDs and I/O Connecto rs (X8DTU-F Motherboard)
1-9
RES-12XR3 Installation Manual - Configuration 7 Version 1.1
Table 1-3. Power Supply LED Behavior
Symbol LED Power System LED Description
And
Or
On
(red LED)
On
(red LED)
Off
On
(red LED)
Power Fail LED
(Left Power Supply)
Note: system is powered on
Power Fail LED
(Right Power Supply)
Note: system is powered on
Power Fail LED
(Left & Right Power supply)
Note: system is powered on
Power Fail LED
(Left or Right Power Supply)
Note: system is powered off
If system is powered on,
warns that the upper power
supply has failed or has lost
AC input.
If system is powered on,
warns that the lower power
supply has failed or has lost
AC input.
System is powered on and
power supply modules are
functioning normally , or system has been shut down
and there has been no interruption to the AC power.
AC power has been inter-
rupted to both power supply
a
modules. When power is restored but system is still off,
one of the two indicator
lights will be lit.
1-10
Rear
On
(green LED)
Green LED
(adjacent to AC input)
Note: system is powered on
System is receiving DC
power (3.3V, 5V, 12V) from
the power supply module
Power Supply
Modules
b
Off
a—This LED behavior indicates only that AC power has interrupted to both power supplies, and does not indicate which
power supply module lost power first, or regained power first.
b—This LED behavior indicates that DC power is not being used, and the system is off. It does not indicate a loss of AC
power to the power supply module.
Green LED
(adjacent to AC input)
Note: system is powered off
System is off and not re-
ceiving DC power from the
Power Supply module.
Themis Computer
1—Overview and Specifications
ENET1
<>
ENET2
<>
C
System LEDs and I/O Connectors
Table 1-4. System LEDs
Symbol LED Description
Power
Storage Drive
a
(Gb Ethernet) Indicates network activity on LAN 1.
NIC1
NIC2 (Gb Ethernet)
Overheat/Fan Fail
—Normally OFF
—RED light when tem-
perature limits are exceeded
Indicates that the system is turned on.
Indicates SAS/SATA II storage-drive activity.
Indicates network activity on LAN 2.
Warns that the system is exceeding specified
temperature parameters. The CPU overheat
warning function must be enabled in the BIOS,
thus allowing the user to define an overheat
temperature, which—when exceeded—triggers the overheat warning LED.
Symbol Rear Panel LED(s) Description
Themis Computer
N/A LAN1 and LAN2
a—NIC = Network Interface Controller.
Each Ethernet port contains two LEDs:
The color of the left LED (when facing the p ort)
indicates the LAN connection speed:
- Off = 10 MHz
- Green = 100 MHz
- Amber = 1 GHz
The right LED, when lit, indicates LAN activity.
1-11
RES-12XR3 Installation Manual - Configuration 7 Version 1.1
Table 1-5. Rear-Panel I/O Connectors
Connector Description
PS/2 Mouse
PS/2 Keyboard
USB 0 and USB 1
Hi-Speed USB 2.0
Serial Ports
COM 1 Serial Port
VGA Graphics Con-
nector
Ethernet LAN Ports
IPMI Dedicated
Ethernet LAN Port
6-pin mini-DIN connector to attach a PS/2 mouse device.
6-pin mini-DIN connector to attach a PS/2 keyboard device.
Two 4-pin USB connectors to attach serial devices to USB por t 0 and
USB port 1.
Note: Six additional USB ports (USB 2 through USB 7) can be ac-
cessed directly from the motherboard.
One DB9 (male) connector on rear panel to attach a serial device to
COM 1port
A second serial port (COM 2) can be accessed directly from the
motherboard.
One 17-pin VGA connector to provide a video and CRT display
Standard RJ45 connector to attach one o r two gigabit Ether ne t LAN
line(s)—LAN 1 and LAN 2.
Standard RJ45 connector to attach a dedicated IPMI LAN line with
full KVM support.
1-12
Unit Identifier (UID)
Switch
A Unit Identifier Switch and two LED indicators are located on the
motherboard. When the UID switch is pressed, both LEDs are turned
on (one LED is located at the rear edge of the motherboard, the other
LED is at the front of the motherboard). Pr essing the UID again turns
off both LED indicators. The UID indicators provide an easy identification of a system unit that may be in need of service.
Note: The UID can also be triggered via IPMI.
Themis Computer
1.7 Chipset Overview
Built upon the functionality and capability of the Intel 5520 platform, RES-12XR3
Configuration 7 provides the performance required for dual processor-based highend systems, including optimal configuration options for communications, high-end
CAD systems, or database applications. Configuration 7 supports up to two
quad/six-core 5600-series or two quad-core 5500-series intel 64-bit Xeon processors
with a QPI up to 6.4 GT/s. The Intel chipset consists of:
• the Intel 5520 (Tylersburg) chipset, and
• the ICH1 OR + IOH-36D
With the Intel QuickPath Interconnect (QPI) controller built in the processor, the
5500 Series Processor platform is the first dual-processing platform to offer the nextgeneration point-to-point system interconnect interface, replacing current Front Side
Bus Technology and providing substantial system performance enhancement by utilizing serial link interconnections, allowing for increased bandwidth and scalability.The IOH connects to each processor through an independent QuickPath
Interconnect link. Each link consists of 20 pairs of unidirectional differential lanes
for transmission and receiving in addition to a differential forwarded clock. A fullwidth QuickPath interconnect link pair provides 84 signals. Each processor supports
two QuickPath links, one going to the other processor and the other to the 5520 chip.
1—Overview and Specifications
The 5520 chipset supports up to 36 PCI Express Gen2 lanes, peer-to-peer read and
write transactions. The ICH10R provides up to 6 PCI-Express ports, three SATA
ports and two USB connections. In addition, the Intel 5520 platform also offers a
wide range of RAS (Reliability, Availability and Serviceability) features. These features include memory interface ECC, x4,/x8 Single Device Data Correction
(SDDC), Cyclic Redundancy Check (CRC), parity protection, out-of-band register
access via SMBus, memory mirroring, memory sparing, and Hot-plug support on the
PCI-Express Interface.
1.7.0.1 Main Features of the 5500 Series Processor and 5520 Chipset
• Four (5500) to six (5600) processor cores in each CPU with 8MB shared cache
among cores
• Two full-width Intel QuickPath interconnect links, up to 6.4 GT/s of data transfer
rate in each direction
• Virtualization Technology, Integrated Management Engine supported
• Point-to-point cache coherent interconnect, Fast/narrow unidirectional links, and
Concurrent bi-directional traffic
• Error detection via CRC and Error correction via Link level retry
Themis Computer
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
1.8 Specifications
1.8.1 General
Table 1-6 lists general specifications for the RES-12XR3.
Table 1-6. RES-12XR3 General Specifications
Parameter Description
Dimensions
Weight
19” Rack-Mountable
with Slide capability
Temperature
a
Operating:
Non-Operating:
Relative Humidity
a
Operating:
Non-Operating:
1.75” (1RU) high
17” (43.2 cm) wide (19” rack-mountable)
20” (50.8 cm) deep
Approximately 19.5 pounds (8.9 kg); includes 2 full-length
(up to 12.25”) PCI cards, 1 CD-RW/DVD-ROM drive, 2
CPUs, 6 DIMMs, 2 SA T A storage drives, and 2 po wer supplies
Add 8.8 pounds (4 kg) for the shipping container and two
AC power cords
The manual and associated shipping paperwork weighs
approximately 1 lb (0.5 kg)
Left and right rack-mount tabs attached to chassis
Left and right rack-mount slides are optional
0° up to 65° C (32° up to 149°F)
–40° to 70° C (–40° to 158° F)
8% to 95% (non-condensing)
5% to 95% (non-condensing)
1-14
Maximum Wet Bulb
Operating:
Non-Operating:
a
Altitude
Operating:
Non-Operating
a—Specifications are dependent on the configurations in this manual.
a
163°C, non-condensing
180°C, non-condensing
0 to 10,000 feet above sea level
0 to 40,000 feet above sea level
Themis Computer
1.8.2 Electrical
Table 1-7 lists the electrical specifications for the RES-12XR3.
Table 1-7. RES-12XR3 Electrical Specifications
Parameter
AC (120 volts, 750W) DC (48 volts, 750W) DC (28 volts, 500W)
1—Overview and Specifications
Specifications
Description
Input Power (typical)
420 watts (typical)
a
420 watts (typical)
a
450 watts (typical)
a
Input Current 3.5 amperes @120 Vac 13.5 amperes @48 Vdc 16 amperes @28 Vdc
Input Frequency
Input Voltage
Input VA Rating
BTU Rating
Power Factor
Input Leakage Current
Plug Type
a—Does not include plug-in PCI cards.
b—NA = Not Applicable.
47-63 Hertz NA
100–265 Vac,
425 VA NA NA
1447 BTU/hour 1447 BTU/hour 1447 BTU/hour
0.99 NA NA
3.5 mA NA NA
IEC
internally fused
b
40–72 Vdc,
internally fused
Y-Type
(SVS5-4 or equivalent)
18–36 Vdc,
internally fused
Y-Type
(SVS5-4 or equivalent)
NA
b
1.8.2.1 System Power
The RES-12XR3 operates with two N+1 redundant power supplies of 750-watts
capacity each that auto-range single-phase AC input from 100 to 265 Vac (47 to 63
Hertz) sources. Filtered and fused (internal) AC is supplied to each power supply
from a rear-mounted power connection.
Themis Computer
Two optional N+1 redundant DC power supplies of 750 watts (48 volts) or 500 watts
(28 volts) each may be substituted for the AC power supplies (see Table 1-7). These
supplies should be specified at the time of your order.
Note: Some AC RES systems may be installed with 650-watt instead of 750-
watt power supplies, which should not effect the performance of the system.
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
1.8.2.2 Output Voltage
The RES-12XR3 power supply provides output voltages that are split between
+3.3V, +5V, +5Vsb, +12V, and -12V rails.
1.8.3 Environmental
1.8.3.1 Shock
The RES-12XR3 is designed to survive an elevated shock environment. All structural components are welded together, enabling the system to survive a maximum
3-axis shock load of 35G at 25-ms duration.
1.8.3.2 Electrostatic Discharge
The RES-12XR3 is designed to tolerate electrostatic pulses up to 15 kilovolts (KV)
with no impact on system operation.
1.8.3.3 Noise
The RES-12XR3 conforms to the 54-db noise specification
Note: All RES systems are shipped with BI OS fan speed set to the quietest mode.
The default fan speed control mode of the RES-12XR3 Configuration 7 is Energy
Saving/ES.
1-16
Themis Computer
1.9 Packaging and Shipping
The RES-12XR3 is packaged in a reusable shipping container. Approximate weight
of an empty container and two AC power cords is 8.8 pounds (4 kg).
The approximate weight of a RES-12XR3 (loaded with two storage drives, two PCI
cards, a CD-RW/DVD-ROM drive, two CPUs, 6 DIMMs, and two power supplies)
is approximately 19.5 pounds (8.9 kg).
The approximate weight of a manual and associated shipping paperwork is one
pound (0.5 kg).
Therefore, both the shipping container and a fully installed RES-12XR3 including
power cords, manual, and associated paperwork, weigh under 30 pounds (13.5 kg).
1—Overview and Specifications
Caution: Do not discard the original packaging that your system was shipped in.
The original packaging was designed specifically to withstand the stress and rigors
of today’s shipping environment. It will be needed in the event the system must be
shipped back to Themis Computer. See Appendix E, “Re-Packing Instructions”.
1.9.1 Accessory Kit
Each RES-12XR3 is packaged with an Accessory Kit, consisting of the following
items:
A. A Power-cord Retainer Bracket
B. Two AC Power Cords
C. Two Front-Bezel Barrel Keys
When you unpack the RES-12XR3, please verify that all of these items are included.
If any of these items are missing or not as pictured, please call Themis Technical
Support at 510-252-0870, or send an email to support@themis.com.
To learn how to secure the AC power cords and the power-cord retainer bracket,
refer to Section 2.3.1, “Plugging in the AC Power Cords,” on page 2-20.
Themis Computer
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
1.9.2 Rack-Mount Slides (Optional)
Rack-Mount Slides can be mounted on each side of the RES-12XR3 for the purpose
of sliding the unit in and out of a rack. Mounting slides are optional and can be
ordered at the time of purchase.
To learn how to install rack-mount slides, refer to Appendix B, “Rack-Mount Slide
Installation”.
Table 1-8. Approximate Weights of the RES Series
Model
Weight
(Approximate)
CPU
Sockets
Depth Description
RES-12XR3 19.5 lbs (8.9 kg) 2 20” Includes:
All CPU sockets filled
6 DIMMs
RES-12XR3-S 17 (7.7 kg) 2 17”
RES-11XR3 16.5 lbs (7.5 kg) 1 17”
2 storage drives
2 PCI cards
1 CD-RW/DVD-ROM drive
2 power supplies
RES-22XR3 25 lbs (11.4 kg) 2 20”
Includes:
RES-22XR3-S 23 lbs (10.4 kg) 2 17”
RES-22XR3/FIO 25.3 lbs (11.5 kg) 2 16”
All CPU sockets filled
6 DIMMs
2 storage drives
2 PCI cards
1 CD-RW/DVD-ROM drive
2 power supplies
RES-21XR3 22.5 lbs (10.2 kg) 1 17”
RES-32XR3 28.5 lbs (12.9 kg) 2 20”
RES-32XR3-S 26.5 lbs (12.0 kg) 2 17”
RES-32XR3/FIO 29.0 lbs (13.2 kg) 2 16”
RES-31XR3 26 lbs (11.8 kg) 1 17”
1-18
Includes:
All CPU sockets filled
6 DIMMs
2 storage drives
2 PCI cards
1 CD-RW/DVD-ROM drive
2 power supplies
Themis Computer
Installation
Section
This chapter describes:
• How to install a memory module, storage drive, PCI card, 38-mm-fan, power
supply, and lithium battery
• Rack-mount brackets
• How to turn the RES-12XR3 on and off
Chapter
Installation and Operation
2.1 Installation Procedures
Caution: Use industry-standard ESD grounding techniques when handling all
components. Wear an antistatic wrist strap and use an ESD-protected mat. Store
ESD-sensitive components in antistatic bags before placing them on any surface.
Handle all IC cards by the front panel or edges only.
To install or replace a SATA-II storage drive, fan, or power supply, skip the next
section and proceed directly to page 2-12, page 2-15, or page 2-17, respectively.
Replacement of motherboard components requires removal of the protective cover.
2.1.1 Remove Protective Top Cover
To access a motherboard component, open the RES-12XR3 as follows:
Themis Computer
2-1
RES-12XR3 Installation Manual - Configuration 7 Version 1.1
Loosen the 2 captive access-cover screws
…
A
B
Rear View
…
and slide the top cover toward the rear until the top hooks and tabs clear all chassis slots
Chassis slot
Chassis slot
Left-side top edge
1. Loosen the two captive Phillips screws holding the protective top access cover
to the rear of the RES-12XR3 chassis (see A, Figure 2-1).
2. Both the front and sides of the cover have flat hooks or tabs underneath that
fit under slots on the chassis top edges (see B, Figur e 2-1). Remove the cover
by sliding it toward the rear until it is free of these chassis slots.
3. Store the cover in a safe place until it is replaced.
Remove the RES-12XR3 Protective Access Cover
Figure 2-1.
4. Proceed to the appropriate section to install or replace a memory module
(page 2-3), PCI card (page 2-6), or lithium battery (page 2-11).
2-2
Themis Computer
2.1.2 Memory Modules
The RES-12XR3 supports memory according to Table 2-1. Note the total memory
capacity varies according to the motherboard installed in the RES-12XR3.
Table 2-1. RES-12XR3 Memory Capacity
2—Installation and Operation
Installation Procedures
Memory Parameters
Motherboard
Capacity
X8DTU-F 192 GB Yes 1333/1066/800 12 240
DDR3
Registered
ECC
Speed (MHz)
Number
of DIMMS
Pins per
DIMM
Caution: Exercise extreme caution when installing or removing FBD Memory
Modules to prevent any possible damage.
Table 2-2. RES-12XR3 Optimal Memory Population (CPU1 Installed)
DIMMs Branch 0 Branch 1 Branch 2
3 DIMMs P1 DIMM 1A P1 DIMM2A P1 DIMM3A
6 DIMMs P1DIMM1A P1 DIMM1B P1DIMM2A P1 DIMM2B P1 DIMM3A P1 DIMM3B
Table 2-3. RES-12XR3 Optimal Memory Population (CPU2 Installed)
DIMMs Branch 0 Branch 1 Branch 2
3 DIMMs P2 DIMM1A P2 DIMM2A P2 DIMM3A
6 DIMMs P2 DIMM1A P2 DIMM1B P2 DIMM2A P2 DIMM2B P2 DIMM3A P2 DIMM3B
Table 2-4. RES-12XR3 Optimal Memory Population (CPU1/CPU2 Installed)
CPU 1 CPU 2
DIMMs
Branch 0 Branch 1 Branch 2 Branch 0 Branch 1 Branch 2
6 DIMMs1A2A3A1A2A3A
12 DIMMs1A1B2A2B3A3B1A1B2A2B3A3B
When installing memory, follow these rules for best memory performance:
• It is strongly recommended that you do not mix memory modules of different
speeds and sizes. If DIMMs of different speeds have been installed, verify that
the BIOS setup is configured for the fastest speed of RAM used.
Themis Computer
2-3
RES-12XR3 Installation Manual - Configuration 7 Version 1.1
2.1.2.1 Installation
The following procedure explains how to install the DDR3 FBD Memory Modules.
1. Loosen and remove the seven screws securing the air-flow deflector (see Fig-
ure 2-2).
2-4
Figure 2-2.
Remove RES-12XR3 Air-Flow Deflector
2. After the air-flow deflector is removed the memory modules will be exposed
(see Figure 1-4 on page 1-5).
Themis Computer
2—Installation and Operation
P2 DIMM 1B
P2 DIMM 1A
P2 DIMM 2B
P2 DIMM 2A
P2 DIMM 3B
P2 DIMM 3A
P1 DIMM 3A
P1 DIMM 3B
P1 DIMM 2A
P1 DIMM 2B
P1 DIMM 1A
P1 DIMM 1B
Branch 0
Branch 1
Branch 2
Branch 1
Branch 2
Branch 0
Installation Procedures
The following procedure explains how to install the DDR3 FBD Memory Modules...
Themis Computer
Figure 2-3.
Memory Module Slot Locations (X8DTU-F Motherboard)
1. If a module is already seated in the slot you have selected for installation,
remove it by gently pressing down and outward on the latches at both ends of
the slot (see Figure 2-4 on page 2-6), then pulling the old module directly up
from the slot until it is free of the connector (see Figure 2-4).
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
downward &
outward at
each end
Press latch
Figure 2-4. Memory Module Removal
2. Before inserting a new memory module into the vacant slot, make sure that
the two latches are pulled outward away from the center of the slot.
With the latches in the outward position, gently insert the new module verti-
cally into its slot and press firmly downward until it snaps into place.
Note: Make sure the memory module has the proper orientation by aligning the alignment notch at the bottom edge with its counterpart ridge at
the bottom of the slot.
3. If all the memory modules have been replaced in the system, replace the air
flow diverter and secure it with the eight screws previously removed.
4. Replace the PCI card retainer bracket and secure it with the single screw
removed in Step 1 on page 2-9.
2.1.3 PCI Cards
2-6
Since the RES-12XR3 is only 1RU (1.75”) high, PCI cards must be installed horizontally through one of the two PCI Riser Cards (see Figure 2-5 on page 2-7).
Themis Computer
2—Installation and Operation
PCI Riser-Card
UIO slot
PCI-E 2.0 x8
PCI-E 2.0 x8
(in x4 slot)
PCI-E 2.0 x16
Retainer Bracket
PCI Slots on Motherboard
(Top View)
Retainer Bracket with Right Riser Card (Left not used)
A
B
(Reverse view of right riser card)
PCI-E 2.0 x8(lower right)
PCI-E 2.0 x8 slot (upper right)
Right Riser Card
SXB2 (J1)
SXB1 (J2)
SXB3 (J3)
UIOP (J10)
(installed on right riser card)
not used
Installation Procedures
Configurations include:
• Slot J1–SXB2: 1 PCI-Express 2.0 x8 (left PCI slot on left Riser Card)—
slot is not used, call Themis Customer Service for further information
• Slot J2–SXB1: 1 PCI-Express 2.0 x16 (upper-right PCI slot, right Riser)
• Slot J3–SXB3: 1 PCI-Express 2.0 x8 in x4 slot (lower-right PCI slot)
The upper-right PCI slot supports cards up to 12.28-inches long; the lower-right PCI
slot supports shorter cards (due to space constraints from the CPU and related heat
sink, the left PCI slot is not usable). A list of recommended PCI Riser Cards is
shown in Table 2-5, page 2-8. PCI Riser Cards that are installed on the RES-12XR3
motherboard depend on the type of PCI card that will be supported.
Themis Computer
Figure 2-5. Positioning of the RES-12XR3 PCI/UIO Riser Cards
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
Retainer Bracket
Right Riser Card
PCI-Express 2.0 x16
Universal I/O (UIO)
Note: P/N of Riser Card shown = RSC-R1UU-UE16
Retainer Bracket Screws
Table 2-5. 1RU Riser Cards Available for the X8DTU-F Motherboard
Riser Card Part Number XR3 Box
RSC-R1UU-E16
RSC-R1UU-2E8
RSC-R1UU-AXE8
RSC-R2UU-A4E8
RSC-R2UU-A3XE8
Themis Custom
RSC-RR1U-E16
RES-12XR3
RES-22XR3
RES-12XR3
RES-22XR3
RES-12XR3
RES-22XR3
RES-22XR3
RES-22XR3-FIO
RES-22XR3
RES-22XR3-FIO
RES-22XR3
RES-22XR3-FIO
RES-11XR3
RES-21XR3
a
Riser Card Output Slots
UIO PCI-E x8 PCI-E x16 PCI-X
—— 1 —
—2——
—1—1
—4
b
—1—3
——2
——
c
d
—
—— 1 —
a—This list includes the most popular Riser Cards. Call Themis Customer Service for a list of other Riser Cards that are available.
b—Can’t use top slot, therefore 3 x8
c—Can’t use top slot, therefore 2 PCI-X
d—One x16, one x16 in x8 slot
Figure 2-6. PCI Riser Cards are attached to a Retainer Bracket
…
2-8
Themis Computer
2—Installation and Operation
Retainer Bracket
Left PCI Expansion Slot (not used) Upper-Right PCI Expansion Slot
Lower-Right PCI Expansion Slot
Installation Procedures
Figure 2-7.
2.1.3.1 Installing Cards
Right PCI Riser Card: Perform the following steps to install a right-hand PCI
card:
1. Locate the slot on the riser card (see Figure 2-5 on page 2-7) within which a
card will be installed and remove the Phillips screw or tape holding the blank
I/O faceplate corresponding to the slot (see Figure 2-8).
2. Remove the blank I/O faceplate corresponding to the slot.
Note: Call Themis Technical Support if there is a question on how to secure the
PCI I/O faceplate to the rear I/O panel.
3. Carefully install each PCI card (lower-right card first) into the appropriate slot
until all expansion cards have been installed. securing its I/O faceplate to the
rear I/O panel—if permitted—with the Phillips screw or tape removed in Step
1. Secure the side edge of each card according to the following instructions:
…
then inserted into the PCI slots of the Motherboard
Figure 2-8.
Themis Computer
The RES-12XR3 has Three PCI Expansion Slots
2-9
RES-12XR3 Installation Manual - Configuration 7 Version 1.1
Install a PCI Retainer Clip on
A
the edge of the Top-Right PCI Card.
Slide the Retainer Clip along the edge of the Top-Right PCI Card until it is over a chassis slot, then press firmly into slot.
B
Lower-Right PCI Expansion Slot—Themis has provided a pair of threaded
standoffs to secure the card installed in the lower-right PCI expansion slot to
the motherboard. Remove the standoff screws, install the PCI card into the
lower-right slot, and secure the PCI card with the standoff screws.
Upper-Right PCI Expansion Slot—After installing the upper-right PCI
expansion card, install a PCI Retainer Clip—two if necessary—that was
shipped with your order onto the edge of the PCI card (see A, Figure 2-9 on
page 2-10), and slide it along the edge until it is positioned over one of the
several slots along the top edge of the RES-12XR3 chassis (see B, Figure
2-9). Press down firmly on the clip until it snaps into position.
Figure 2-9. Installation of the PCI Card Retainer Clip
Caution: Be careful not to install a PCI Retainer Clip into one of the longer chassis
slots used to secure the top cover of the RES-12XR3.
4. Attach any internal I/O cables to the installed PCI cards, and carefully fold
and tuck any exposed ribbon cables into the cabinet.
5. If you have no further installations to perform, close the RES-12XR3 chassis
by refastening the top cover removed in Step 1 on page 2-2.
6. Attach all external cables to the I/O faceplates of the installed PCI/UIO cards.
2-10
Themis Computer
2.1.4 Lithium Battery
Lithium
Battery
Multiple Wire Cable
Exposed
Battery
2.1.4.1 Removing the Lithium Battery
Perform the following steps to remove the lithium battery:
1. Make sure the system is powered off (see “Operation” on page 2-20).
2—Installation and Operation
Installation Procedures
Themis Computer
Figure 2-10.
2. If you cannot access the lithium battery directly , you must move and/or detach
The RES-12XR3 Lithium Battery and Multiple Wire Cable
the multiple wire cable routed over the battery (see Figure 2-10).
3. Locate the lithium battery socket and squeeze the latch (see A, Figure 2-11 on
page 2-12) together until the battery lifts out of its socket.
Note: The battery location is dependent on which motherboard is installed in the chassis. Figure 2-10 shows the location of the battery on the
X8DTU-F Motherboard.
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RES-12XR3 Installation Manual - Configuration 7 Version 1.1
To release, squeeze the battery latch together
…
Battery
AB
Latch
…
and remove the battery from socket
4. Remove the old battery and replace with a new battery (see Figure 2-11).
Figure 2-11. The RES-12XR3 Lithium Battery and Socket
2.1.4.2 Installing a Lithium Battery
Perform the following steps to insert a new lithium battery:
1. Tilt the replacement battery into the empty socket so that it is angled under the
battery latch (see B, Figure 2-11).
2. Carefully press down on the battery until it clicks firmly into place.
2.1.5 SATA II Storage Drive
Perform the following steps to remove and install a SATA II storage drive.
Note: For SATA II drives, the left-hand removable storage drive (SATA II ID0)
is designated as the boot drive.
The front bezel (door) of the RES-12XR3 must be unlocked and opened to access
the SATA II storage drives.
2-12
Themis Computer
2.1.5.1 Opening the RES-12XR3 Front Doors
Knurled
Screw
Drive Lock
(one per drive)
Drive Release
Button
Drive 0
Drive 1
Drive 2
To access the removable storage drives, you must first open the front doors (see Figure 2-12, page 2-13). The knurled captive screw on the front of the RES-12XR3
allows the doors to lock without a key. To unlock the front doors, turn the screw
counterclockwise and pull both bezel doors away from the chassis.
The accessory kit shipped with your RES-12XR3 contains two barrel lock keys. This
provides you the option of unlocking/locking the storage drives.
2—Installation and Operation
Installation Procedures
Figure 2-12.
Figure 2-13. Unlocking the RES-12XR3 Storage Drives (Front Doors Removed)
2.1.5.2 Storage-Drive Removal
After opening the front doors, perform the following steps to remove and install a
storage drive:
Note: Since RES-12XR3 storage drives are “hot-swappable”, it is not necessary
to turn off system power in order to remove and replace a drive (except the operating system drive). However, after a warning has been broadcast to all users, the
drive being replaced should be dismounted before being removed.
Opening the RES-12XR3 Front Doors
Themis Computer
Consult your operating system manual for specific details.
2-13
RES-12XR3 Installation Manual - Configuration 7 Version 1.1
Insert key into barrel lock and turn A
…
push the latch lock,
…
B
Latch
Lock
Latch Handle
…
and pull drive out with the latch handle
C
45 degrees clockwise,
…
Barrel
Key
1. Make sure the necessary precautions have been observed as per the previous
Note (see “Operation” on page 2-20).
2. Locate the drive to be removed.
3. Insert the barrel lock key into the hard drive you want to remove, and turn it
45 degrees clockwise (presuming the storage drive is locked).
4. Firmly push in the latch lock until the latch handle releases from the drive.
5. Grab the latch handle and pull the drive completely away from its slot.
Caution: When pulling the storage drive from the chassis, hold it at the bottom to prevent it from falling and damaging the drive.
2-14
2.1.5.3 Storage Drive Installation
Figure 2-14. RES-12XR3 Storage Drive Removal
To install a storage drive,
1. Make sure the latch handle of the drive to be installed is in the open position.
2. Properly orient the new drive and insert it into the vacant drive slot. If the
drive cannot be inserted into the slot, rotate it 180 degrees.
Themis Computer
3. Push the drive toward the rear (DO NOT CLOSE the latch handle while push-
ing) until the drive is flush with the front of the chassis. The handle will swing
closed when it comes into contact with the RES-12XR3 chassis.
4. When the drive is fully inserted in its slot, insert the key into the barrel lock
and turn it 45 degrees counter-clockwise. The drive is now locked.
Caution: When in the closed position, the latch handle secures the drive to the
chassis. If the handle is closed before the drive is fully inserted, the latch mechanism
may not fully engage to secure the drive.
5. If you are installing another storage drive, repeat Steps 1–4 for each additional
drive.
2.1.6 Hot-Swappable 38-mm Fan
2—Installation and Operation
Installation Procedures
The RES-12XR3 contains five high-speed 38-mm fans, each of which can be “hotswapped” in the field in the event of a fan failure.
2.1.6.1 Removing and Installing a 38-mm Fan
Perform the following steps to remove and install a 38-mm fan:
Note: Since RES-12XR3 fans are “hot-swappable”, it is not necessary to turn of f
system power in order to remove and replace a fan,
1. Push the fan lid lock left to unlock the fan lid (see Figure 2-15 on page 2-16).
Pull the fan lid upward exposing the five 38-mm fans.
2. Each fan is secured by a fan lock located on top of the fan. To remove a fan,
push the fan lock toward the front of the fan and pull the fan directly upward
(see Figure 2-16 on page 2-16).
3. When the fan is removed, its 3-wire connector will automatically be discon-
nected from the chassis. Insert the replacement fan carefully into the empty
fan slot until it is flush with the other fans. The 3-wire connector will automatically engage its counterpart successfully.
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Hinged Fan Lid
38-mm Fan
Fan Lid Lock
Locking Stud (1 of 3)
Fan Lock
38-mm Fan
Fan Lock
3-Wire Connector
Pull Up the
Fan Away
from Chassis
Push the Lock Toward the Front
Figure 2-15. The RES-12XR3 Hot-Swappable 38-mm Fans
Figure 2-16. Removing One of the Five RES-12XR3 38-mm Fans
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2.1.7 Power Supply
Extraction
Handle
Power Supply
Locking Lever
System-Power LED
AC Outlet
Phillips Screw Hole
for knurled captive screw
A
…
then push locking lever to the right and remove power supplyB
Power supply locking bracket
Knurled captive Phillips screw
Knurled captive Phillips screw
Push lever to the right to release power supply
Phillips Screw Hole
for knurled captive screw
on power supply
locking bracket
Remove power supply locking bracket
…
Power Supply
Locking Lever
Each load-sharing (N+1 redundant) power supply can be hot-swapped while the system is still on and operational.
2.1.7.1 Removing a Power Supply
Perform the following steps to remove a power supply:
1. Loosen the two screws holding the power supply locking bracket to the chassis (see A, Figure 2-17). Place the bracket in a safe place for further use.
2. Put the right index finger on the power supply extraction handle and the right
thumb on the left side of the power supply locking lever (see B, Figur e 2-17).
2—Installation and Operation
Installation Procedures
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Figure 2-17. The RES-12XR3 Power Supply Locking Mechanism
3. Squeeze the locking lever toward the extraction handle and firmly pull the
power supply from the chassis.
Caution: When pulling the power supply from the chassis, hold it at the bottom to prevent it from falling and damaging the unit.
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2.1.7.2 Installing a Power Supply
Perform the following steps to install a power supply:
1. Insert the replacement power supply into an empty slot with the power LED
at the top (see Figure 2-17 on page 2-17).
2. Push the power supply carefully into its slot until it is firmly seated (a click
will be heard when the locking lever is securely fastened to the chassis).
3. Replace and tighten the two captive screws to hold the power supply locking
lever to the chassis (see Figure 2-17) to secure both power supplies.
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2.2 Rack Mounts
Right Mounting
Bracket
Right Handle
2.2.1 Mounting Brackets
The rack-mount brackets (flanges) are used to secure the chassis to the 19” rack (see
Figure 2-18). Handles are used to pull the RES-12XR3 from the rack when rackmount slides have been installed on the sides of the chassis (see following section).
2—Installation and Operation
Rack Mounts
Figure 2-18. Right Rack-Mount Bracket
2.2.2 Rack-Mount Slides (Optional)
Rack-Mount Slides can be mounted on each side of the RES-12XR3, for the purpose
of sliding the unit in and out of a rack. Mounting slides are optional and should be
ordered at the time your system is purchased.
To learn how to install rack-mount slides, refer to Appendix B, “Rack-Mount Slide
Installation”.
Caution: Any screws used to mount a slide to a RES-12XR3 chassis must not exceed a length of 3/8” to prevent excessive penetration of the chassis.
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AC Power Socket
System Power LED
Locking Lever
System Power
On/Off Button
Power LED
2.3 Operation
2.3.1 Plugging in the AC Power Cords
Before powering on the RES-12XR3, plug in the AC power cords as follows:
1. On the rear of the RES-12XR3, plug an AC power cord (shipped with unit)
into the AC power socket on each power supply (see Figure 2-19).
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Figure 2-19. AC Power Socket and LED on the RES-12XR3 Rear
2.3.2 Turning the System On
1. Plug the AC power cord from each of the RES-12XR3 power supplies into a
“live” AC outlet.
2. On the front of the RES-12XR3 push the system power on/off button (see Fig-
ure 2-20). This will cause the system POWER LED to light (green) as well as
the rear power supply module LED to light (green).
Figure 2-20. System Power Button and LED on the RES-12XR3 Front
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2.3.3 Getting Started
2.3.3.1 Configuration
1. Make sure all SATA II drives are installed (see “SATA II Storage Drive” on
page 2-12). Drive ID numbers are shown in Figure 2-14 on page 2-14, Chapter 2. Changes may be made through the BIOS.
2. Make sure that a graphics card is installed in a PCI slot and connect a multiscan monitor to the SVGA or DVI connector.
3. Attach a PS/2 keyboard and mouse to the appropriate connectors on the rear
I/O panel of the RES-12XR3 (see Figure 1-5 on page 1-9)
4. Turn the system on (see previous section).
2.3.3.2 Linux Installation
2—Installation and Operation
Operation
The subject of installing the Linux operating system onto the RES-12XR3 is detailed
in Appendix C, “Red Hat Enterprise Linux 5 Installation”.
2.3.4 Turning the System Off
Caution: Before turning your system off, make sure to save all open files, properly
close applications, and broadcast a warning to all users on any active networks.
1. To turn the RES-12XR3 power off, press and hold the system power on/off
button (see Figure 2-20, page 2-20) for at least four (4) seconds. This will shut
down the system and turn off the POWER LED.
As an alternative, a modern operating system (Windows 9x or newer and
Linux, for example) can turn off the system after a graceful OS software
shutdown.
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Installation
Section
3.1 Introduction
Note: The information on this chapter is based on the Super Micro Computer,
Inc., User Manuals for the specific motherboard installed in the system.
Chapter
BIOS Setup Utility
This chapter describes the AMI BIOS Setup Utility for the X8DTU-F motherboard.
The AMI ROM BIOS is stored in a Flash EEPROM and can be easily updated. This
chapter explains the basic navigation of the AMI BIOS Setup Utility setup screens.
3.1.1 Starting BIOS Setup Utility
To view the AMI BIOS Setup Utility screens, press the <Delete> key while the system is booting up.
Note: In most cases, the <Delete> key is employed to view the AMI BIOS setup
screen. There are a couple of cases when other keys are used, including <F1>,
<F2>, etc.
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Each main BIOS menu option is explained in this manual. The Main BIOS setup
menu screen has two main frames. The left frame displays all the options that can be
configured. Grayed-out options cannot be configured. Options in blue can be configured by the user. The right frame displays the key legend. Above the key legend is an
area reserved for a text message. When an option is selected in the left frame, it is
highlighted in white. Often a text message will accompany it.
Note: The AMI BIOS has default text messages built in. Themis has the option
to include, omit, or alter any of these text messages.
The AMI BIOS Setup Utility employs a key-based navigation system called “hot
keys”. Most of the AMI BIOS setup utility “hot keys” can be employed at any time
during the setup navigation process. These keys include <F1>, <F10>, <Enter>,
<ESC>, arrow keys, etc.
Note: Options printed in Bold are default settings.
3.1.2 How To Change the Configuration Data
The configuration data that determines the system parameters may be altered by
entering the AMI BIOS Setup utility. This Setup utility can be accessed by pressing
<Del> at the appropriate time during system boot.
3.1.3 Starting the Setup Utility
Normally, the only visible Power-On Self-Test (POST) routine is the memory test.
While the memory is being tested, press the <Delete> key to enter the main menu of
the AMI BIOS Setup Utility. From the main menu, you can access the other setup
screens. An AMI BIOS identification string is displayed at the left bottom corner of
the screen below the copyright message.
Caution: Do not upgrade the BIOS unless your system has a BIOS-related issue.
Flashing the wrong BIOS can cause irreversible damage to the system. In no event
shall Themis be liable for direct, indirect, special, incidental, or consequential damages arising from a BIOS update. If you have to update the BIOS, do not shut down
or reset the system while the BIOS is updating. This is to avoid potential boot failure.
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3.2 Main BIOS Setup
When you first enter the AMI BIOS Setup Utility, you will enter the Main setup
screen. You can always return to the Main setup screen by selecting the Main tab on
the top of the screen. The Main BIOS Setup screen is shown in Figure 3-1.
3—BIOS Setup Utility
3.2.1 System Overview
The following BIOS information will be displayed:
3.2.1.1 System Time/System Date
Employ this option to alter the system time and date. Highlight System Time or Sys-
tem Date using the arrow keys. Key in new values through the keyboard and press
<Enter>. Press the <Tab> key to move between fields. The date has be entered in
Day MM/DD/YY format. The time is entered in HH:MM:SS format.
Note: The time is in the 24-hour format. For example, 5:30 P.M. appears as
17:30:00.
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Figure 3-1.
Main BIOS Setup Screen
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3.2.1.2 AMI BIOS
• Version: This item displays the BIOS revision employed in your system.
• Build Date: This item displays the date when this BIOS was finished.
3.2.1.3 Processor
The AMI BIOS will automatically display the status of the processor employed in
your system:
• CPU Type: This item displays the type of CPU used in the motherboard.
• Speed: This item displays the speed of the CPU detected by the BIOS.
• Physical Count: This item displays the number of processors installed in your
system as detected by the BIOS.
• Logical Count: This item displays the number of CPU Cores installed in your
system as detected by the BIOS.
3.2.1.4 System Memory
This displays the memory size available in the system.
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3.3 Advanced Setup Configurations
Use the arrow keys to select Advanced Settings and hit <Enter> to access the submenu items, then select Boot Features:
3—BIOS Setup Utility
3.3.1 BOOT Features
3.3.1.1 Quick Boot
If Enabled, this option will skip certain tests during POST to decrease the time
needed for system boot. The options are Enabled (default) and Disabled.
3.3.1.2 Quiet Boot
This option allows the bootup screen options to be modified between POST messages or the OEM logo. Select Disabled to display the POST messages. Select
Enabled to display the OEM logo instead of the normal POST messages. The
options are Enabled (default) and Disabled.
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Figure 3-2.
Advanced Settings
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3.3.1.3 AddOn ROM Display Mode
This sets the display mode for Option ROM. The options are Force BIOS (default)
and Keep Current.
3.3.1.4 Bootup Num-Lock
This feature selects the Power-on state for Numlock key. The options are Off and On
(default).
3.3.1.5 Wait For 'F1' If Error
This forces the system to wait until the 'F1' key is pressed if an error occurs. The
options are Disabled and Enabled (default)
3.3.1.6 Hit 'Del' Message Display
This feature displays “Press DEL to run Setup” during POST. The options are
Enabled (default) and Disabled.
3.3.1.7 Interrupt 19 Capture
Interrupt 19 is the software interrupt that controls the boot drive function. When this
item is set to Enabled, the ROM BIOS of the host adaptors will “capture” Interrupt
19 at boot and allow the drives that are attached to these host adaptors to function as
bootable drives. If this item is set to Disabled, the ROM BIOS of the host adaptors
will not capture Interrupt 19, and the drives attached to these adaptors will not function as bootable devices. The options are Enabled (default) and Disabled.
3.3.2 Power Configuration
3.3.2.1 Watch Dog Function
If enabled, the Watch Dog Timer will allow the system to reboot when it is inactive
for more than 5 minutes. The options are Enabled and Disabled (default).
3.3.2.2 Power Button Function
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If set to Instant_Off, the system will power off immediately upon pressing the power
button. If set to 4_Second_Override, the system will power off when the user presses
the power button for 4 seconds or longer. The options are Instant_Off (default) and
4_Second_override.
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3.3.2.3 Restore on AC Power Loss
Use this feature to set the power state after a power outage. Select Power-Off for the
system power to remain off after a power loss. Select Power-On for the system
power to be turned on after a power loss. Select Last State to allow the system to
resume its last state before a power loss. The options are Power-On, Power-Off and
Last State (default).
3.3.3 Processor and Clock Options
This submenu allows the user to configure the Processor and Clock settings.
3.3.3.1 Clock Spread Spectrum
Select Enable to use the feature of Clock Spectrum, which will allow the BIOS to
monitor and attempt to reduce the level of Electromagnetic interference caused by
the components whenever needed. The options are Disabled (default) and Enabled.
3—BIOS Setup Utility
Advanced Setup Configurations
3.3.3.2 Hardware Prefetcher (Available when supported by the CPU)
If set to Enabled, the hardware pre fetcher will pre fetch streams of data and instructions from the main memory to the L2 cache in the forward or backward manner to
improve CPU performance. The options are Disabled and Enabled (default).
3.3.3.3 Adjacent Cache Line Prefetch (Available when supported by the CPU)
The CPU fetches the cache line for 64 bytes if this option is set to Disabled. The
CPU fetches both cache lines for 128 bytes as comprised if Enabled (default).
3.3.3.4 L1 Data Prefetch (Available when supported by the CPU)
Select Enabled to enable Level 1 data prefetch support to enhance system performance for UP platforms. For DP/MP servers, use this feature to enhance system performance based on the specification of the application running in the system at the
time. the options are Disabled and Enabled (default).
3.3.3.5 Data Reuse Optimization (Available when supported by the CPU)
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For UP Platforms, select Enabled to maximize data reuse support to enhance system
performance. For DP/MP servers, enable or disable this feature based on application
specifications. the options are Enabled (default) and Disabled.
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3.3.3.6 MPS and ACPI MADT Ordering
This feature allows the user to configure the MPS (multiprocessor Specification) and
ACPI settings for your motherboard. Select Modern Ordering if Windows XP or a
newer version of Windows OS is used in the motherboard. Select Legacy Ordering if
2000 or an earlier version of Windows OS is used. The options are Modern Order-
ing (default) and Legacy Ordering.
3.3.3.7 Intel Virtualization Technology (Available when supported by the CPU)
Select Enabled to employ the feature of Vi rtualization Technology to allow one platform to run multiple operating systems and applications in independent partitions,
producing multiple “virtual” systems in one physical computer. The options are
Enabled (default) and Disabled.
Note: If there is any change to this setting, you must power of f and restart the system for the change to take effect. Please refer to Intel’s web site for detailed information.
3.3.3.8 Execute-Disable Bit Capability (Available when supported by the CPU)
Set to Enabled to enable the Execute Disable Bit which will allow the processor to
delegate areas in the system memory where an application code can execute and
where it cannot, thus preventing a worm or a virus from flooding illegal codes to
overwhelm the processor or damage the system during an attack. The default is
Enabled (default). (Refer to Intel and Microsoft Web Sites for more information.)
3.3.3.9 Intel AES-NI
Select Enable to use the Intel Advanced Encryption Standard (AES) New Instructions (NI) to ensure data security. The options are Disabled (default) and Enabled
3.3.3.10 Simultaneous Multi-Threading (Available when supported by the CPU)
Set to Enabled to employ the Simultaneous Multi-Threading T e chnology, which will
result in enhanced CPU performance. The options are Disabled and Enabled
(default).
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3.3.3.11 Active Processor Cores
Set to Enabled to employ a processor's Second Core and beyond. (Please refer to
Intel's web site for more information.) The options are All (default), 1 and 2.
3.3.3.12 Intel EIST Technology
EIST (Enhanced Intel SpeedStep Technology) allows the system to automatically
adjust processor voltage and core frequency in an effort to reduce power consumption and heat dissipation. Please refer to Intel’s web site for detailed information.
The options are Disable (Disable GV3) and Enable (Enable GV3) (default).
3.3.3.13 Intel® TurboMode Technology
Select Enabled to use the Turbo Mode to boost system performance. The options are
Enabled and Disabled.
3—BIOS Setup Utility
Advanced Setup Configurations
3.3.3.14 C1E Support
Select Enabled to use the feature of Enhanced Halt State. C1E significantly reduces
the CPU's power consumption by reducing the CPU's clock cycle and voltage during
a “Halt State.” The options are Disabled and Enabled.
3.3.3.15 Intel® C-STATE Tech
If enabled, C-State is set by the system automatically to either C2, C3, or C4 state.
The options are Disabled and Enabled (default).
3.3.3.16 C-State package limit setting
If set to Auto, the AMI BIOS will automatically set the limit on the C-State package
register. The options are Auto (default), C1, C3, C6, and C7.
3.3.3.17 C1 Auto Demotion
When enabled, the CPU will conditionally demote C3, C6 or C7 requests to C1
based on un-core auto-demote information. The options are Disabled and Enabled.
3.3.3.18 C3 Auto Demotion
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When enabled, the CPU will conditionally demote C6 or C7 requests to C3 based on
un-core auto-demote information. The options are Disabled and Enabled.
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3.3.3.19 ACPI T State
Select Enabled to report processor throttling in the ACPI. The options are Disabled
(default) and Enabled.
3.3.4 Advanced Chipset Control
The items included in the Advanced Settings submenu are listed below:
3.3.4.1 CPU Bridge Configuration
• CPU Revision: This item displays the CPU revision number.
• Current QPI Frequency: This item displays the current CPU memory frequency.
• Memory Reference Code: This item displays the memory reference code.
• QPI Reference Code: This item displays the QPI reference code for the mother-
board.
3.3.4.2 Request Transaction ID (Available for the Intel Xeon 5600 platform only)
QuickPath Interconnect (QPI) is the connection between the CPUs and the I/O hub
(IOH). For a transaction to be processed in the QPI, a “Transaction ID” is required,
and it is assigned by an agent (CPU1, CPU2, or the IOH). Each agent is allocated a
number of Transaction IDs based on the QPI IO Bandwidth and the Request Transaction ID (RTID) setting (32-24-32 or 32-16-40). Once Transaction IDs are allocated
to an agent, it will assign a Transaction ID to an event so that it can be processed in
the QPI. Select Balanced to allocate transactions IDs to an agent based on the setting
32-24-32. Select IO Bias to allocate RTIDs based on the setting 32-16-40. The
options are Balanced (default) and IO Bias
3.3.4.3 QPI Links Speed
This feature selects QPI’s data transfer speed. the option are Slow-mode, and Full
Speed (default).
3.3.4.4 QPI Frequency
This selects the desired QPI frequency. The options are Auto (default), 4.800 GT,
5.866GT, 6.400 GT.
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3.3.4.5 QPI L0s and L1
This enables the QPI power state to low power. L0s and L1 are automatically
selected by the motherboards. The options are Disabled (default) and Enabled.
3.3.4.6 Memory Frequency
This feature forces a DDR3 frequency slower than what the system has detected.
The available options are Auto (default), Force DDR-800, Force DDR-1066, and
Force DDR-1333.
3.3.4.7 Memory Mode
The options are Independent (default), Channel Mirror, Lockstep, and Sparing.
Independent—All DIMMs are available to the operating system.
Channel Mirror—The motherboard maintains two identical copies of all data in
memory for redundancy.
3—BIOS Setup Utility
Advanced Setup Configurations
Lockstep—The motherboard uses two areas of memory to run the same set of
operations in parallel.
Sparing—A preset threshold of correctable errors is used to trigger fail-over. The
spare memory is put online and used as active memory in place of the failed memory.
3.3.4.8 Demand Scrubbing
A memory error-correction scheme where the Processor writes corrected data back
into the memory block from where it was read by the Processor. The options are
Enabled and Disabled (default).
3.3.4.9 Patrol Scrubbing
A memory error-correction scheme that works in the background looking for and
correcting resident errors. The options are Enabled (default) and Disabled.
3.3.4.10 Throttling - Closed Loop/Throttling - Open Loop
Throttling improves reliability and reduces power in the processor by automatic
voltage control during processor idle states. Available options are Disabled and
Enabled (default).
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NorthBridge Configuration
3.3.4.11 Intel I/OAT
The Intel I/OAT (I/O Acceleration Technology) significantly reduces CPU overhead
by leveraging CPU architectural improvements, freeing resources for other tasks.
The options are Disabled and Enabled (default).
3.3.4.12 DCA (Direct Cache Access)Technology
This feature works in conjunction with the Intel I/O AT (Acceleration Technology)
to accelerate the performance of the TOE device. When this feature is set to Enabled,
it will enhance overall system performance by providing direct cache access for data
transferring. The options are Enabled (default) and Disabled.
3.3.4.13 DCA Prefetch Delay
A DCA Prefetch is used with TOE components to prefetch data in order to shorten
execution cycles and maximize data-processing efficiency. Prefetching frequently
can saturate the cache directory and delay necessary cache accesses. This feature
reduces or increases the frequency the system prefetches data. The options are [8],
[16], [32] (default), [40], [48], [56], [64], [72], [80], [88], [96], [104], [112], [120].
3.3.4.14 Intel VT-d
Select Enabled to enable Intel's V irtualization Technology support for Direct I/O VTd by reporting the I/O device assignments to VMM through the DMAR ACPI
Tables. This feature offers fully-protected I/O resource-sharing across the Intel platforms, providing the user with greater reliability, security and availability in networking and data-sharing. The settings are Enabled and Disabled (default).
3.3.4.15 Active State Power Management
Select Enabled to use the power management for signal transactions between the
PCI Express L0 and L1 Links. Select enabled to configure PCI-Exp. L0 and L1 Link
power states. The options are Disabled (default) and Enabled.
3.3.4.16 Slot SXB2/SXB3 Width
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This feature allows the user to change the link width of a PCI slot as specified in
order to support a riser or add-on card installed in the slot. The Options are x4x4, x8
(default) and auto.
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3.3.4.17 Slot SXB1 Width
This feature allows the user to change the link width of a PCI slot as specified in
order to support a riser or add-on card installed in the slot. The options are
x4x4x4x4, x4x4x8, x8x4x4, x8x8 (default), x16 and Auto, as seen in the table below.
3.3.4.18 IOH PCI-E Max Payload Size
Some add-on cards perform faster with the coalesce feature, which limits the payload size to 128B; while others, with a payload size of 256B which inhibits the
coalesce feature. Please refer to your add-on card user guide for the desired setting.
The options are 256B (default) and 128B
SouthBridge Configuration
3.3.4.19 USB Functions
3—BIOS Setup Utility
Advanced Setup Configurations
This feature allows the user to enable or disable on board USB Support. The options
are: Disabled, and Enabled (default).
3.3.4.20 Legacy USB Support
Select Enabled to use Legacy USB devices. If this item is set to Auto, Legacy USB
support will be automatically enabled if a legacy USB device is installed on the
motherboard, and vise versa. The settings are Disabled, and Enabled (default).
3.3.4.21 Port 60h/64h Emulation
Select Enabled to enable 60h/64h emulation for complete USB keyboard support for
operating systems that are not compatible with USB devices. The options are
Enabled and Disabled (default).
3.3.4.22 USB 2.0 Controller (Available when USB Functions is Disabled)
This feature displays the current USB controller used in the motherboard.
3.3.4.23 USB 2.0 Controller Mode
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This setting allows you to select the USB 2.0 Controller mode. The options are HiSpeed (480 Mbps) (default) and Full Speed (12 Mbps).
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3.3.4.24 BIOS EHCI Hand-Off
Select Enabled to enable BIOS Enhanced Host Controller Interface support to provide a workaround solution for an operating system that does not have EHCI HandOff support. When enabled, the EHCI Interface will be changed from the BIOS-controlled to the OS-controlled. The options are Disabled and Enabled (default).
3.3.4.25 Route Port 80h Cycle to
Use this item to decide where to route Port 80h Cycle to. The Options are LPC
(default) and PCI.
3.3.5 IDE/SATA/Floppy Configuration
When this submenu is selected, the AMI BIOS automatically detects the presence of
the IDE, SATA, and floppy devices and displays the following items:
3.3.5.1 SATA#1 Configuration
If Compatible is selected, it sets SATA#1 to legacy compatibility mode, while
selecting Enhanced sets SATA#1 to native SATA mode. The options are Disabled,
Compatible and Enhanced (default).
Configure SATA#1 as
This feature allows the user to select the drive type for SATA#1. The options are
IDE, RAID and AHCI. (When the option-RAID is selected, the item-ICH RAID
Code Base will appear. When the option-AHCI is selected, the item-SATA AHCI
will be available).
ICH RAID Code Base (Available when the option-RAID is selected)
Select Intel to enable Intel's SATA RAID firmware to configure Intel's SATA RAID
settings. Select Adaptec to enable Adaptec's SATA RAID firmware to configure
Adaptec's SATA RAID settings. The options are Intel (default) and Adaptec.
SATA AHCI (Available when the option-AHCI is selected)
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Select Enable to enable the function of Serial ATA Advanced Host Interface.
Caution: Take caution when using this function. This feature is for advanced programmers only.
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3—BIOS Setup Utility
Advanced Setup Configurations
SA T A#2 Configurati on (Available when the option-IDE is selected.)
Selecting Enhanced will set SATA#2 to native SATA mode. The options are Disabled, and Enhanced (default).
3.3.5.2 IDE Detect Timeout (sec)
Use this feature to set the time-out value for the BIOS to detect the ATA, ATAPI
devices installed in the system. The options are 0 (sec), 5, 10, 15, 20, 25, 30, and 35
(default).
3.3.5.3 Primary IDE Master/Slave, Secondary IDE Master/Slave, Third IDE Master, and Fourth IDE Master
These settings allow the user to set the parameters of the Primary IDE Master/Slave,
Secondary IDE Master/Slave, Third and Fourth IDE Master slots. Press <enter> to
activate the following submenu screen for detailed options of these items. Set the
correct configurations accordingly. The items included in the submenu are:
Type
Use this item to select the type of device connected to the system. The options are
Not Installed, Auto (default), CD/DVD and ARMD
LBA/Large Mode
LBA (Logical Block Addressing) is a method of addressing data on a storage drive.
In the LBA mode, the maximum dive capacity is 137 GB. For drive capacities over
137 GB, your system must be equipped with a 48-bit LBA mode addressing support.
If not, install a ATA/133 IDE controller card that supports 48-bit LBA mode. The
options are disabled and Auto (default)
Block (Multi-Sector Transfer)
Block Mode boosts the IDE drive performance by increasing the amount of data
transferred. Only 512 bytes of data can be transferred per interrupt if Block Mode is
not used. Block Mode allows transfers of up to 64 KB per interrupt. Select Disabled
to allow data to be transferred from and to the device on e sector at a time. Select
Auto to allow data transfer from and to the device occur multiple sectors at a time if
the device supports it. The options are Auto (default) and Disabled.
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PIO Mode
The IDE PIO (Programmable I/O) Mode programs timing cycles between the IDE
drive and the programmable IDE controller. As the PIO mode increases, the cycle
time decreases. The options are Auto (default), 0, 1, 2, 3, and 4.
Select Auto (default) to allow the AMI BIOS to automatically detect the PIO mode.
Use this value if the IDE storage drive support cannot be determined.
Select 0—4 to allow the AMI BIOS to use PIO mode 0—4. It has a data transfer rate
of 3.3 MB/s—16.6MB/s. See Table 3-1 below for PIO Mode Select options.
Table 3-1. PIO Mode Select Options
Option Selected PIO Mode Max. Transfer Rate
0 PIO Mode 0 3.3 MB/s
1 PIO Mode 1 5.2 MB/s
2 PIO Mode 2 8.3 MB/s
3 PIO Mode 3 11.1 MB/s
4 PIO Mode 4 16.6 MB/s
DMA Mode
Select Auto to allow the BIOS to automatically detect IDE DMA mode when the
IDE storage device support cannot be determined. The options are Auto (default),
SWDMAn, MWDMAn, and UDMAn. See Table 3-2 below for DMA Mode Select
Options.
Table 3-2. DMA Mode Select Options
Option Selected DMA Mode Max. Transfer Rate
SWDMA 0 Single-Word DMA 0 2.1 MB/s
SWDMA 1 Single-Word DMA 1 4.2 MB/s
SWDMA 2 Single-Word DMA 2 8.3 MB/s
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MWDMA 0 Multi-Word DMA 0 4.2 MB/s
MWDMA 1 Multi-Word DMA 1 13.3 MB/s
MWDMA 2 Multi-Word DMA 2 16.6 MB/s
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3—BIOS Setup Utility
Advanced Setup Configurations
Table 3-2. DMA Mode Select Options (Continued)
Option Selected DMA Mode Max. Transfer Rate
UDMA 0 Ultra DMA 0 16.6 MB/s
UDMA 1 Ultra DMA 1 25 MB/s
UDMA 2 Ultra DMA 2 33.3 MB/s
UDMA 3 Ultra DMA 3 44.4 MB/s
UDMA 4 Ultra DMA 4 66.6 MB/s
UDMA 5 Ultra DMA 5 100 MB/s
UDMA 6 Ultra DMA 6 133 MB/s
S.M.A.R.T. For Storage Drives
Self-Monitoring Analysis and Reporting Technology (SMART) can help predict
impending drive failures. Select Auto to allow the AMI BIOS to automatically
detect storage drive support. Select Disabled to prevent the AMI BIOS from using
S.M.A.R.T. Select Enabled to allow the AMI BIOS to use S.M.A.R.T. to support the
storage drives. The options are Disabled, Enabled, and Auto (default).
32Bit Data Transfer
Select Enable to enable the function of 32-bit IDE data transfer. The options are
Enabled (default) and Disabled.
3.3.6 PCI/PnP Configuration
3.3.6.1 Clear NVRAM
This feature clears the NVRAM during system boot. The options are No (default)
and Yes.
3.3.6.2 Plug & Play OS
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Selecting Yes allows the OS to configure Plug & Play devices. (This is not required
for system boot if your system has an OS that supports Plug & Play.) Select No
(default) to allow the AMI BIOS to configure all devices in the system.
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3.3.6.3 PCI Latency Timer
This feature sets the latency Timer of each PCI device installed on a PCI bus. Select
64 to set the PCI latency to 64 PCI clock cycles. The options are 32, 64 (default), 96,
128, 160, 192, 224, and 248.
3.3.6.4 PCI IDE BusMaster
When enabled, the BIOS uses PCI bus mastering for reading/writing to IDE drives.
The options are Disabled and Enabled (default).
3.3.6.5 SR-1OV Supported
Select Enabled to enable Single Root I/O Virtualization (SR-1OV) support which
works in conjunction with the Intel Virtualization Technology and allow multiple
operating systems running simultaneously within a single computer via natively
share PCI-Express devices in order to enhance network connectivity and performance. The options are Enabled and Disabled (default).
3.3.6.6 PCI-E Slot from SXB1/PCI-E Slot from SXB2/PCI-E Slot from SXB3
Select Enabled to enable PCI-E SXB1 slot, PCI-E SXB2 slot or PCI-E SXB3 slot. It
can also enable Option ROMs to boot computer using a network interface from these
slots. (SXB1, a x16 slot, can be configured into two x8 slots. SXB2, a x8 slot, can be
configured into two x4 slots.) The options are Enabled (default) and Disabled.
3.3.6.7 Onboard LAN Option ROM Select
Select iSCSI to use iSCSI Option ROMs to boot the computing using a network
device. Select iSCSI to use PXE Option ROMs to boot the computing using a network device. The options are iSCSI and PXE (default).
3.3.6.8 Load Onboard LAN1 Option ROM/Load Onboard LAN2 Option ROM
Select Enabled to enable the onboard LAN1 or LAN2 Option ROM. This is to boot
the computer using a network interface. The options are Enabled and Disabled
(default).
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3.3.6.9 Boots Graphics Adapter Priority
This feature allows the user to select the priority graphics adapter for system boot.
The options are Onboard VGA (default) and offboard VGA.
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3.3.7 Super IO Device Configuration
3.3.7.1 Serial Port1 Address/ Serial Port2 Address
This option specifies the base I/O port address and the Interrupt Request address of
Serial Port 1 and Serial Port 2. Select Disabled to prevent the serial port from accessing any system resources. When this option is set to Disabled, the serial port physically becomes unavailable. Select 3F8/IRQ4 to allow the serial port to use 3F8 as its
I/O port address and IRQ 4 for the interrupt address. The options for Serial Port1 are
Disabled, 3F8/IRQ4 (default) 3E8/IRQ4, 2E8/IRQ3. The options for Serial Port2
are Disabled, 2F8/IRQ3 (default), 3E8/IRQ4, and 2E8/IRQ3.
3.3.7.2 Serial Port 2 Attribute
This feature allows the user to set COM2 as a normal serial port, or a virtual COM
port used for SOL (Serial Over LAN). The options are SOL (default), and COM
3—BIOS Setup Utility
Advanced Setup Configurations
3.3.8 Remote Access Configuration
3.3.8.1 Remote Access
This allows the user to enable the Remote Access feature. The options are Enabled
(default) and Disabled. If Remote Access is set to Enabled (default), the following
items will be displayed:
Serial Port Number
This feature allows the user to decide which serial port to be used for Console Redirection. The options are COM 1 and COM 2 (default).
Serial Port Mode
This feature allows the user to set the serial port mode for Console Redirection. The
options are 115200 8, n 1 (default); 57600 8, n, 1; 38400 8, n, 1; 19200 8, n, 1; and
9600 8, n, 1.
Flow Control
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This feature allows the user to set the flow control for Console Redirection. The
options are None (default), Hardware, and Software.
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Redirection After BIOS POST
Select Disabled to turn off Console Redirection after Power-On Self-Test (POST).
Select Always to keep Console Redirection active all the time after POST.
Note: This setting may not be supported by some operating systems.
Select Boot Loader to keep Console Redirection active during POST and Boot
Loader. The options are Disabled, Boot Loader, and Always (default).
Terminal Type
This feature allows the user to select the target terminal type for Console Redirection. The options are ANSI, VT100 (default), and VT-UTF8.
VT-UTF8 Combo Key Support
A terminal keyboard definition that provides a way to send commands from a remote
console. Available options are Enabled (default) and Disabled.
Sredir Memory Display Delay
This feature defines the length of time in seconds to display memory information.
The options are No Delay (default), Delay 1 Sec, Delay 2 Sec, and Delay 4 Sec.
3.3.9 Hardware Health Event Monitoring
This feature allows the user to monitor system health and review the status of each
item as displayed.
3.3.9.1 CPU Overheat Alarm
This option allows the user to select the CPU Overheat Alarm setting which
determines when the CPU OH alarm will be activated to provide warning of possible
CPU overheat.
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3—BIOS Setup Utility
Advanced Setup Configurations
Caution: 1. Any temperature that exceeds the CPU threshold temperature pre-
defined by the CPU manufacturer may result in CPU overheat or system instability .
When the CPU temperature reaches this predefined threshold, the CPU and system
cooling fans will run at full speed.
2. T o avoid possible system overheating, please be sure to provide adequate airflow
to your system.
The options are:
• The Early Alarm: Select this setting if you want the CPU overheat alarm
(including the LED and the buzzer) to be triggered as soon as the CPU temperature reaches the CPU overheat threshold as predefined by the CPU manufacturer.
• The Default Alarm (default): Select this setting if you want the CPU overheat
alarm (including the LED and the buzzer) to be triggered when the CPU tem-
perature reaches about 5oC above the threshold temperature as predefined by
the CPU manufacturer to give the CPU and system fans additional time needed
for CPU and system cooling. In both the alarms above, please take immediate
action as shown below.
3.3.9.2 CPU 1 Temperature/CPU 2 Temperature/System Temperature
This feature displays current temperature readings for the CPU and the System.
The following items will be displayed for your reference only:
CPU1 Temperature/CPU2 Temperature
The CPU thermal technology that reports absolute temperatures (Celsius/Fahrenheit)
has been upgraded to a more advanced feature by Intel in its newer processors. The
basic concept is each CPU is embedded by unique temperature information that the
motherboard can read. This ‘Temperature Threshold’ or ‘Temperature Tolerance’
has been assigned at the factory and is the baseline on which the motherboard takes
action during different CPU temperature conditions (i.e., by increasing CPU Fan
speed, triggering the Overheat Alarm, etc). Since CPUs can have different ‘Temperature Tolerances’, the installed CPU can now send information to the motherboard
what its ‘Temperature Tolerance’ is, and not the other way around. This results in
better CPU thermal management. Supermicro has leveraged this feature by assigning a temperature status to certain thermal conditions in the processor (Low,
Medium and High). This makes it easier for the user to understand the CPU’s tem-
perature status, rather than by just simply seeing a temperature reading (i.e., 25
The CPU Temperature feature will display the CPU temperature status as detected
by the BIOS:
o
C).
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Low – This level is considered as the ‘normal’ operating state. The CPU temperature
is well below the CPU ‘Temperature Tolerance’. The motherboard fans and CPU
will run normally as configured in the BIOS (Fan Speed Control).
User intervention: No action required.
Medium – The processor is running warmer . This is a ‘precautionary’ level and gen-
erally means that there may be factors contributing to this condition, but the CPU is
still within its normal operating state and below the CPU ‘Temperature Tolerance’.
The motherboard fans and CPU will run normally as configured in the BIOS. The
fans may adjust to a faster speed depending on the Fan Speed Control settings.
User intervention: No action is required. However, consider checking the CPU fans
and the chassis ventilation for blockage.
High – The processor is running hot. This is a ‘caution’ level since the CPU’s ‘Temperature Tolerance’ has been reached (or has been exceeded) and may activate an
overheat alarm.
User intervention: If the system buzzer and Overheat LED has activated, take
action immediately by checking the system fans, chassis ventilation and room temperature to correct any problems.
Note: 1. The system may shut down if it continues for a long period to prevent
damage to the CPU.
2. The information provided above is for your reference only. For more information on thermal management, please refer to Intel’s Web site at www.Intel.com.
System Temperature:
The system temperature will be displayed (in degrees in Celsius and Fahrenheit) as it
is detected by the BIOS.
3.3.9.3 Fan 1—Fan 8 Reading
This feature displays the fan speed readings from fan interfaces Fan 1 through Fan 8.
3.3.9.4 Fan Speed Control Modes
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This feature allows the user to decide how the system controls the speeds of the
onboard fans. The CPU temperature and the fan speed are correlative. When the
CPU on-die temperature increases, the fan speed will also increase for effective system cooling. Select “Full Speed/FS” to allow the onboard fans to run at full speed for
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maximum cooling. The FS setting is recommended for special system configuration
or debugging. Select “Performance/PF” for better system cooling. The PF setting is
recommended for high-power-consuming and high density systems. Select “Balanced/BL” for the onboard fans to run at a speed that will balance the needs between
system cooling and power saving. The BL setting is recommended for regular systems with normal hardware configurations. Select “Energy Saving/ES” for best
power efficiency and maximum quietness. The Options are: Full Speed/FS, Performance/PF, Balanced/BL, and Energy Saving/ES (as set by the configurations in this
manual).
3.3.9.5 Voltage Monitoring
CPU1 Vcore, CPU2 Vcore, CPU1 DIMM, CPU2 DIMM, 5V, 5VSB, 12V, -12V,
3.3Vcc, 3.3VSB, VBAT, and Vtt.
3.3.10 ACPI Configuration
3—BIOS Setup Utility
Advanced Setup Configurations
Use this feature to configure Advanced Configuration and Power Interface (ACPI)
power management settings for your system.
3.3.10.1 High Performance Event Timer
Select Enabled to activate the High Performance Event Timer (HPET) that produces
periodic interrupts at a much higher frequency than a Real-time Clock (R TC) does in
synchronizing multimedia streams, providing smooth playback, and reducing the
dependency on other timestamp calculation devices such as an x86 RDTSC Instruction embedded in the CPU. The HPET is used to replace the 8254 Programmable
Interval Timer. Options are Enabled (default) and Disabled.
3.3.10.2 ACPI Aware O/S
Select Yes to enable ACPI support for an operating system that supports ACPI.
Select No to disable ACPI support for an OS that does not support ACPI. The
options are Yes (default) and No.
3.3.10.3 ACPI APIC Support
Select Enabled to include the ACPI APIC Table Pointer in the RSDT (Root System
Description Table) pointer list. The options are Enabled (default) and Disabled.
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3.3.10.4 APIC ACPI SCI IRQ
When this item is set to Enabled, APIC ACPI SCI IRQ is supported by the system.
The options are Enabled and Disabled (default).
3.3.10.5 Headless Mode
This feature is used to enable system to function without a keyboard, monitor, or
mouse attached. The options are Enabled and Disabled (default).
3.3.10.6 ACPI Version Features
The options are ACPI v1.0, ACPI v2.0 (default), and ACPI v3.0. Please refer to
ACPI's website for further explanation: http://www.acpi.info/.
3.3.10.7 NUMA Support
Select Enabled to use the feature of Non-Uniform Memory Access to improve CPU
performance. The options are Disabled, Enabled (default) and NUMA for SLES 11
(SUSE Linux Enterprise Server 11)
3.3.10.8 WHEA Support
Select Enabled to enable Windows Hardware Error Architecture (WHEA) support
which will provide a common infrastructure for the system to handle hardware errors
on Windows platforms in order to reduce system crashes due to hardware errors, and
to enhance system recovery and health monitoring. The default setting is Enabled.
3.3.11 IPMI Configuration
Intelligent Platform Management Interface (IPMI) is a set of common interfaces that
IT administrators can use to monitor system health and to manage the system as a
whole. For more information on the IPMI specifications, please visit Intel's website
at www.intel.com.
3.3.11.1 IPMI Firmware Version
This item displays the current IPMI Firmware Version.
3.3.11.2 Status of BMC Working
The Baseboard Management Controller (BMC) manages the interface between system management software and platform hardware. This item displays the status of
the current BMC controller.
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3.3.12 View BMC System Event Log
This feature displays the BMC System Event Log (SEL). It shows the total number
of entries of BMC System Events.
To view an event, select an Entry Number and pressing <Enter> to display the information as shown in the screen.
• Total Number of Entries
• SEL Entry Number
• SEL Record ID
• SEL Record Type
• Event Timestamp
• Generator ID
• Event Message Format User
3—BIOS Setup Utility
Advanced Setup Configurations
• Event Sensor Type
• Event Sensor Number,
• Event Dir Type
• Event Data.
3.3.12.1 Clear BMC System Event Log Clear BMC System Log
Select OK and press the <Enter> key to clear the BMC system log. Select Cancel to
keep the BMC System log. The options are OK (default) and Cancel.
Caution: Any cleared information is unrecoverable. Make absolutely s ure that you
no longer need any data stored in the log before clearing the BMC Event Log.
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3.3.13 Set LAN Configuration
Set this feature to configure the IPMI LAN adapter with a network address as shown
in the following graphics.
Channel Number
Enter the channel number for the SET LAN Config command. This is initially set to
[1] (default). Press “+” or “-” on your keyboard to change the Channel Number.
Channel Number Status
This feature returns the channel status for the Channel Number selected above:
“Channel Number is OK” or “Wrong Channel Number”.
IP Address Source
This features allows the user to select how an IP address is assigned to a client computer or network device. Select DHCP (Dynamic Host Configuration Protocol) to
allow a client (computer or device) obtains an IP address from a DHCP server that
manages a pool of IP addresses and network information on a “request and grant”
basis. Upon time-out (or lease expiration), the IP address assigned to the client can
be reassigned to a new client. Select Static (Static Allocation) (default) to allow the
host server to allocate an IP address based on a table containing MAC Address/IP
Address pairs that are manually entered (probably by a network administrator). Only
clients with a MAC address listed in the MAC/IP Address Table will be assigned an
IP address. The IP Address allocated to the client is on a longer term basis than that
assigned by the DHCP mentioned in the other option. The options are DHCP
(default) and Static.
IP Address
The BIOS will automatically enter the IP address of this machine; however it may be
over-ridden. IP addresses are 6 two-digit hexadecimal numbers (Base 16, 0—9, A,
B, C, D, E, F) separated by dots. (i.e., 00.30.48.D0.D4.60).
Subnet Mask
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This item displays the current subnet mask setting for your IPMI connection. The
value of each three-digit number separated by dots should not exceed 255.
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Gateway Address
The BIOS will automatically enter the Gateway address of this machine; however it
may be over-ridden. IP addresses are 6 two-digit hexadecimal numbers (Base 16,
0—9, A, B, C, D, E, F) separated by dots. (i.e., 00.30.48.D0.D4.60).
Mac Address
The BIOS will automatically enter the Mac address of this machine; however it may
be over-ridden. Mac addresses are 6 two-digit hexadecimal numbers (Base 16, 0—9,
A, B, C, D, E, F) separated by dots. (i.e., 00.30.48.D0.D4.60).
3.3.14 Event Log Configuration
3.3.14.1 View Event Log
3—BIOS Setup Utility
Advanced Setup Configurations
Use this option to view the System Event Log.
3.3.14.2 Mark All Events as Read
This option marks all events as read. The options are OK and Cancel.
3.3.14.3 Clear Event Log
This option clears the Event Log memory of all messages. The options are OK and
Cancel (default).
3.3.14.4 PCIE ErrorLog
Use this option to enable PCI-E error (PERR) logging. The options are Yes and No
(default).
3.3.14.5 Memory Error Log
Use this option to enable memory error logging. The options are Yes (default) and
No.
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3.4 Security Settings
The AMI BIOS provides a Supervisor and a User password. If you use both passwords, the Supervisor password must be set first.
Figure 3-3. Security Settings
3.4.1 Supervisor Password
This item indicates if a Supervisor password has been entered for the system. “Not
Installed” means a Supervisor password has not been used.
3.4.2 User Password
This item indicates if a user password has been entered for the system. “Not
Installed” means that a user password has not been used.
3.4.3 Change Supervisor Password
Select this feature and press <Enter> to access the submenu, and then type in a new
Supervisor Password.
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3—BIOS Setup Utility
Security Settings
3.4.4 User Access Level (Available when Supervisor Password is set as above)
Select Full Access (default) to grant the User full access to the Setup Utility, and
change Setup settings. Select View Only to allow the user access to the Setup Utility
and view the settings without making changes. Select Limited to allow the user to
change selected settings such as Date and Time. Select No Access to prevent the
User from accessing the Setup Utility.
3.4.5 Change User Password
Select this feature and press <Enter> to access the submenu, and then type in a new
User Password.
3.4.6 Clear User Password (Available only when User Password has been set)
This item allows you to clear a user password after it has been entered.
3.4.7 Password Check
This item allows you to check a password after it has been entered. The options are
Setup (default) and Always.
3.4.8 Boot Sector Virus Protection
When Enabled, the AMI BIOS displays a warning when any program (or virus)
issues a Disk Format command or attempts to write to the boot sector of the storage
drive. The options are Enabled and Disabled (default).
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3.5 Boot Configuration
Use this feature to configure boot settings.
3.5.1 Boot Device Priority
This feature allows the user to specify the priority sequence of boot devices, including the 1st boot device, 2nd boot device, etc. The options are Removable Devices,
Storage Drive, CD/DVD, USB, Network, and Disabled.
• 1st Boot Device
• 2nd Boot Device
3.5.2 Storage Drives
This feature allows the user to specify the boot sequence from all available storage
drives. The settings are Disabled and a list of all storage drives that have been
detected (i.e., 1st Drive, 2nd Drive, 3rd Drive, etc).
•1st Drive
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Figure 3-4.
Boot Settings
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3.5.3 Removable Drives
This feature allows the user to specify the boot sequence from available Removable
Drives. The settings are 1st boot device, 2nd boot device, and Disabled.
• 1st Drive/2nd Drive
3.5.4 CD/DVD Drives
This feature allows the user to specify the boot sequence from available CD/DVD
Drives (i.e., 1st Drive, 2nd Drive, etc).
• 1st Drive/2nd Drive
3.5.5 USB Drives
This feature allows the user to specify the boot sequence from available USB Drives.
3—BIOS Setup Utility
Boot Configuration
3.5.6 Network Drives
This feature allows the user to specify the boot sequence from available Network
Drives.
Retry Boot Devices
If this feature is enabled, the system will continue to search for the next boot device
if the current boot device is not available. The options are Enabled, and Disabled
(default).
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3.6 Exit Options
Select the Exit tab from the AMI BIOS Setup Utility screen to enter the Exit BIOS
Setup screen.
Figure 3-5. Exit Options
3.6.1 Save Changes and Exit
When you have completed the system configuration changes, select this option to
leave the BIOS Setup Utility and reboot the computer, so the new system configuration parameters can take effect. Select Save Changes and Exit from the Exit menu
and press <Enter>.
3.6.2 Discard Changes and Exit
Select this option to quit the BIOS Setup without making any permanent changes to
the system configuration, and reboot the computer. Select Discard Changes and Exit
from the Exit menu and press <Enter>.
3.6.3 Discard Changes
Select this option and press <Enter> to discard all the changes and return to the AMI
BIOS Utility Program.
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