Themis NanoPAK User Manual

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for Demanding Applications

Self Contained SBC in SFF Configuration

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NanoPAK® User Manual

Version 1.0— December 2012

Themis Computer—Americas and Pacific Rim 47200 Bayside Parkway Fremont, CA 94538 Phone (510) 252-0870 Fax (510) 490-5529 World Wide Web http://www.themis.com

Themis Computer—Rest of World 5 Rue Irene Joliot-Curie 38320 Eybens, France Phone +33 476 14 77 80 Fax +33 476 14 77 89

photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without the prior written permission of Themis Computer.

The information in this publication has been carefully checked and is believed to be accurate. However, Themis Computer assumes no responsibility for inaccuracies. Themis Computer retains the right to make changes to this publication at any time without prior notice. Themis Computer does not assume any liability arising from the application or use of this publicat ion or the product(s) described herein.

RESTRICTED RIGHTS LEGEND: Use, duplication, or disclosure by the United States Government is subject to the restrictions set forth in DFARS 252.227-7013 (c)(1)(ii) and FAR 52 .227-19.

TRADEMARKS and SERVICEMARKS

Themis® is a registered trademark of Themis Computer, Inc. All other trademarks, servicemarks, or registered trademarks used in this publication are the property of

their respective owners.

CE Marking

This product complies with the European EMC Directive (2004/108/EC) and the European Low Vol tage Safety Directive (2006/95/EC)/.

Safety Precautions

Instructions regarding safety precautions during installation, operation, or maintenance of the equipment are given in the section entitled “Safety Instructions” on page iv.

WARNINGS and CAUTIONS

The definitions of WARNINGS and CAUTIONS as used in this document are given in the Preface in the section entitled “Notes, Cautions, Warnings, and Sidebars”.

Themis Customer Support

North America, South America, and Pacific Rim

Telephone: 510-252-0870

Fax: 510-490-5529

E-mail: support@themis.com

Web Site: http://www.themis.com

NanoPAK

December 2012 Part Number: 118527-024

User Manual, Version 1.0

NanoPAK® User Manual

Version Revision History

Ve rs io n 1 .0 ....................................................................................December 2012

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NanoPAK® User Manual Version 1.0

Safety Instructions

To maximize user safety and ensure correct device operation, all instructions contained in this section should be read carefully.

Caution: It is important that the user observe all warnings and instructions that are on the device and contained in this manual.

• The device must be used in accordance with the instructions for use.

• The unit is completely disconnected from the power source only when the power cord is disconnected from the power source. Therefore the power cord and its connectors must always remain easily accessible.

• The device is no longer safe to operate when — the device has visible damage or — the device no longer functions.

• In these cases, the device must be shut down and secured against unintentional operation.

• Repairs may only be carried out by a person authorized by Themis Computer.

• If extensions are made to the device, the legal stipulations and the device specifications must be observed.

• The device must be switched off when removing the top cover.

Electrostatic Discharge (ESD)

A sudden discharge of electrostatic electricity can destroy static-sensitive devices or micro-circuitry. Proper packaging and grounding techniques are necessary precautions to prevent damage. Always take the following precautions:

1. Transport boards in static-safe containers such as boxes or bags.

2. Keep electrostatic-sensitive parts in their containers until they arrive at static-

free stations.

3. Always be properly grounded when touching a sensitive board, component, or

assembly.

Themis Computer

4. Store electrostatic-sensitive boards in protective packaging or on conductive

foam.

Grounding Methods

Guard against electrostatic damage at workstations by following these steps:

1. Cover workstations with approved anti-static material. Provide a wrist strap

connected to a work surface and properly grounded tools and equipment.

2. Use anti-static mats, heel straps, or air ionizers to give added protection.

3. Handle electrostatic-sensitive components, boards, and assemblies by the case

or the PCB edge.

4. Avoid contact with pins, leads, or circuitry.

5. Turn off power and input signals before inserting and removing connectors or

test equipment.

NanoPAK® User Manual

6. Keep the work area free of non-conductive materials such as ordinary plastic as-

sembly aids and Styrofoam.

7. Use field service tools, s uch as cutters, screwdrivers, and vacuums that are con-

ductive.

8. Always place drives and boards PCB-assembly-side down on the foam.

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NanoPAK® User Manual Version 1.0

Themis Computer

Table of Contents

Version Revision History ...................................................................................................... iii

Safety Instructions ................................................................................................................ iv

How to Use This Manual ................................................................................................... xvii

1. Overview and Specifications ........................................................................................ 1-1

1.1 Overview ................................................................................................................ 1-1

1.2 System Description ................................................................................................ 1-2

1.3 Configurations ....................................................................................................... 1-5

1.4 Specifications ......................................................................................................... 1-9

1.4.1 General Specifications ............................................................................... 1-9

1.4.2 Compliance ............................................................................................. 1-10

1.5 Packaging and Shipping ....................................................................................... 1-10

2. Installation and Operation ........................................................................................... 2-1

2.1 Applying Power ..................................................................................................... 2-1

2.1.1 Provide Adequate Cooling ......................................................................... 2-2

2.1.2 Configure Power ........................................................................................ 2-2

2.1.2.1 Power Button .............................................................................. 2-2

2.1.2.2 Sleep Mode Setting ..................................................................... 2-4

2.1.3 Useful Tools ............................................................................................... 2-5

2.2 Front Panel Indicators ............................................................................................ 2-6

2.2.1 Power LED ................................................................................................ 2-6

2.2.2 Disk Activity LED ..................................................................................... 2-7

2.2.3 Ethernet Activity LED ...............................................................................2-7

2.2.4 Ethernet Link Status LED .......................................................................... 2-7

2.3 Input and Output .................................................................................................... 2-9

2.3.1 USB Ports .................................................................................................. 2-9

2.3.2 Serial Ports ................................................................................................. 2-9

2.3.2.1 COM A ....................................................................................... 2-9

2.3.2.2 COM B ...................................................................................... 2-12

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2.3.3 General Purpose I/O ................................................................................. 2-12

2.3.4 Ethernet Port ............................................................................................ 2-13

2.3.5 Video Port (VGA) .................................................................................... 2-13

2.3.6 Storage ..................................................................................................... 2-13

2.3.7 HD Audio Interface ................................................................................. 2-14

2.4 Power Consumption ............................................................................................. 2-15

2.4.1 Current Protection ....................................................................................2-15

2.4.2 Standby Power/Battery ............................................................................ 2-15

2.4.3 Backup Battery Replacement ................................................................... 2-18

3. InsydeH2O® BIOS Setup Utility ................................................................................. 3-1

3.1 Introduction ............................................................................................................ 3-1

3.2 Starting the BIOS Setup Utility ............................................................................. 3-2

3.2.1 Navigating the Utility Screens ................................................................... 3-3

3.3 Main BIOS Setup ................................................................................................... 3-4

3.3.1 System Overview ....................................................................................... 3-4

3.3.2 System Time/System Date ......................................................................... 3-5

3.3.3 Language .................................................................................................... 3-5

3.4 Advanced Setup ..................................................................................................... 3-6

3.4.1 Boot Configuration .................................................................................... 3-7

3.4.2 Peripherals Configuration .......................................................................... 3-8

3.4.3 IDE Configuration ..................................................................................... 3-9

3.4.4 Video Configuration ................................................................................ 3-10

3.4.5 USB Configuration .................................................................................. 3-11

3.4.6 Chipset Configuration .............................................................................. 3-12

3.4.6.1 NorthBridge Configuration ....................................................... 3-13

3.4.6.2 NorthBridge PCIe Configuration .............................................. 3-14

3.4.6.3 APU GPP Features Configuration ............................................ 3-15

3.4.6.4 Hudson-1 FCH Configuration .................................................. 3-16

3.4.6.5 SouthBridge/GPP Configuration .............................................. 3-17

3.4.6.6 SouthBridge PCIe Configuration .............................................. 3-18

3.4.6.7 SouthBridge PCIe Port Features Configuration ........................ 3-19

3.4.7 ACPI Tables/Features Control ................................................................. 3-20

3.4.8 CPU Related Settings ............................................................................... 3-21

3.4.9 AMD PBS Option .................................................................................... 3-22

3.5 Security Configuration ......................................................................................... 3-23

3.6 Power Configuration ............................................................................................ 3-24

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3.6.1 Advanced CPU Control ........................................................................... 3-25

3.7 Boot Configuration .............................................................................................. 3-26

3.7.1 EFI Configuration .................................................................................... 3-27

3.7.2 Legacy Boot Device Configuration ......................................................... 3-28

3.8 Exit Menu ............................................................................................................ 3-29

4. AMI BIOS Setup Utility ............................................................................................... 4-1

4.1 Introduction ............................................................................................................ 4-1

4.1.1 Starting the BIOS Setup Utility ................................................................. 4-1

4.2 Main BIOS Setup ................................................................................................... 4-3

4.2.1 System Overview: ...................................................................................... 4-3

4.2.1.1 BIOS Information ....................................................................... 4-3

4.2.1.2 System Memory Information ...................................................... 4-4

4.2.1.3 System Time/System Date .......................................................... 4-4

4.3 Advanced Setup Configuration .............................................................................. 4-5

4.3.1 CPU Configuration .................................................................................... 4-6

4.3.2 IDE Configuration ..................................................................................... 4-7

4.3.3 Floppy Configuration ................................................................................. 4-9

4.3.4 ACPI Settings .......................................................................................... 4-10

4.3.4.1 General ACPI Configuration .................................................... 4-11

4.3.4.2 Advanced ACPI Configuration ................................................. 4-12

4.3.4.3 Chipset ACPI Configuration ..................................................... 4-13

4.3.5 AHCI Configuration ................................................................................ 4-14

4.3.6 Event Log Configuration ......................................................................... 4-15

4.3.7 Hardware Health Configuration ............................................................... 4-16

4.3.8 MPS Configuration .................................................................................. 4-17

4.3.9 SMBIOS Configuration ........................................................................... 4-18

4.3.10 USB Configuration .................................................................................. 4-19

4.3.10.1 USB Mass Storage Device Configuration ................................ 4-20

4.4 Advanced PCI/PnP Settings ................................................................................. 4-21

4.5 Boot Settings ........................................................................................................ 4-23

4.5.1 Boot Settings Configuration .................................................................... 4-24

4.6 Security Setup ......................................................................................................4-26

4.7 Advanced Chipset Settings .................................................................................. 4-27

4.7.1 North Bridge Chipset Configuration ........................................................ 4-28

4.7.2 South Bridge Chipset Configuration ........................................................ 4-30

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NanoPAK® User Manual Version 1.0

4.8 Exit Options ......................................................................................................... 4-32

4.8.1 Save Changes and Exit ............................................................................ 4-32

4.8.2 Discard Changes and Exit ........................................................................ 4-33

4.8.3 Load Optimal Defaults ............................................................................. 4-33

4.8.4 Load Fail-Safe Defaults ...........................................................................4-33

Appendix A. Connector Pinouts, Signals and Solder Beads ......................................... A-1

A.1 J1 Pinouts and Signals .......................................................................................... A-1

A.2 Signal Descriptions ............................................................................................... A-6

A.3 Solder Beads and Jumpers .................................................................................. A-10

A.3.1 Solder Bead Locations and Settings ....................................................... A-10

A.3.2 Jumpers ................................................................................................... A-15

A.3.2.1 Jumper JP1 ............................................................................... A-15

A.3.2.2 Jumper JP6 ............................................................................... A-15

Appendix B. Accessory Equipment .................................................................................B-1

B.1 NanoPAK® Development Kit ................................................................................B-1

B.2 Breakout Cable ......................................................................................................B-3

B.2.1 Serial Port Pinouts .....................................................................................B-7

B.2.2 Power Cable Pinouts ..................................................................................B-8

B.2.3 Power Button Pinout ..................................................................................B-9

B.2.4 Vbat (Standby Power) Cable Pinout. .......................................................B-10

B.2.5 Audio Cable Pinouts ................................................................................B-10

B.2.6 USB Cable Pinouts ..................................................................................B-10

B.2.7 Ethernet Cable Pinouts .............................................................................B-11

B.2.8 VGA Cable Pinouts .................................................................................B-12

B.2.9 GPIO Cable Pinouts .................................................................................B-13

Appendix C. Repackaging Instructions ...........................................................................C-1

C.1 Repackaging for Shipment .....................................................................................C-1

C.2 Packaging Components ..........................................................................................C-2

C.3 Instructions for Repackaging .................................................................................C-2

Index ................................................................................................................Index-1

Reader Comment Card

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Table of Contents

List of Figures

Figure 1 NanoPAK®..................................................................................................... xvii

Figure 1-1 NanoPAK® SBC.............................................................................................. 1-1

Figure 1-2 NanoPAK Ordering Information ..................................................................... 1-3

Figure 1-3 Block Diagram: NanoPAK®/AMD Processor with SATA Capability ........... 1-5

Figure 1-4 Block Diagram: NanoPAK®/AMD Processor without SATA Capability ...... 1-6

Figure 1-5 Block Diagram: NanoPAK®/Intel® Processor with SATA Capability........... 1-7

Figure 1-6 Block Diagram: NanoPAK®/Intel® Processor without SATA Capability...... 1-8

Figure 2-1 Power Options.................................................................................................. 2-2

Figure 2-2 Power Plan Selection ....................................................................................... 2-3

Figure 2-3 Power Button Setting....................................................................................... 2-3

Figure 2-4 Power Options Screen...................................................................................... 2-4

Figure 2-5 Sleep Setting .................................................................................................... 2-4

Figure 2-6 NanoPAK® Front Panel................................................................................... 2-6

Figure 2-7 Typical RS422 Interface Circuit.................................................................... 2-11

Figure 2-8 RS485 Full-Duplex Bus Configuration ......................................................... 2-11

Figure 2-9 RS485 Half-Duplex Bus Configuration......................................................... 2-12

Figure 2-10 GPIO diagram................................................................................................ 2-13

Figure 2-11 Power Consumption....................................................................................... 2-15

Figure 2-12 Standby Power Diagram................................................................................ 2-16

Figure 2-13 Jumper Locations........................................................................................... 2-17

Figure 2-14 Backup Battery Replacement......................................................................... 2-18

Figure 3-1 Splash Screen................................................................................................... 3-2

Figure 3-2 BIOS Information Screen ................................................................................ 3-2

Figure 3-3 Setup Screen Legend ....................................................................................... 3-3

Figure 3-4 Main Setup Screen........................................................................................... 3-4

Figure 3-5 Advanced Settings Screen ............................................................................... 3-6

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NanoPAK® User Manual Version 1.0

Figure 3-6 Boot Configuration Settings ............................................................................ 3-7

Figure 3-7 Peripheral Configuration Settings.................................................................... 3-8

Figure 3-8 IDE Configuration Settings ............................................................................. 3-9

Figure 3-9 Video Configuration Settings ........................................................................ 3-10

Figure 3-10 USB Configuration Settings .......................................................................... 3-11

Figure 3-11 Chipset Configuration Settings...................................................................... 3-12

Figure 3-12 NorthBridge Configuration............................................................................ 3-13

Figure 3-13 NorthBridge PCIe Configuration Settings..................................................... 3-14

Figure 3-14 APU GPP Features Configuration Screen ..................................................... 3-15

Figure 3-15 Hudson-1 FCH Configuration Settings.......................................................... 3-16

Figure 3-16 SouthBridge/GPP Configuration Settings ..................................................... 3-17

Figure 3-17 SouthBridge PCIe Configuration Settings..................................................... 3-18

Figure 3-18 SouthBridge PCIe Port Features Configuration Settings............................... 3-19

Figure 3-19 ACPI Tables/Features Control....................................................................... 3-20

Figure 3-20 CPU Related Settings..................................................................................... 3-21

Figure 3-21 AMD PBS Option.......................................................................................... 3-22

Figure 3-22 Security Configuration Settings..................................................................... 3-23

Figure 3-23 Power Configuration...................................................................................... 3-24

Figure 3-24 Advanced CPU Control ................................................................................. 3-25

Figure 3-25 Boot Configuration ........................................................................................ 3-26

Figure 3-26 EFI Configuration.......................................................................................... 3-27

Figure 3-27 Legacy Boot Device Configuration............................................................... 3-28

Figure 3-28 Exit Menu ...................................................................................................... 3-29

Figure 4-1 Main Setup Screen........................................................................................... 4-3

Figure 4-2 Advanced Settings ........................................................................................... 4-5

Figure 4-3 CPU Configuration Settings ............................................................................ 4-6

Figure 4-4 IDE Configuration Settings ............................................................................. 4-7

Figure 4-5 Floppy Configuration Settings......................................................................... 4-9

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Table of Contents

Figure 4-6 ACPI Settings ................................................................................................ 4-10

Figure 4-7 General ACPI Configuration Settings ........................................................... 4-11

Figure 4-8 Advanced ACPI Configuration Settings........................................................ 4-12

Figure 4-9 Chipset ACPI Configuration Settings............................................................ 4-13

Figure 4-10 AHCI Configuration Settings ........................................................................ 4-14

Figure 4-11 Event Log Configuration Settings ................................................................. 4-15

Figure 4-12 Hardware Health Configuration Settings....................................................... 4-16

Figure 4-13 MPS Configuration Settings.......................................................................... 4-17

Figure 4-14 SMBIOS Configuration Settings ................................................................... 4-18

Figure 4-15 USB Configuration Settings .......................................................................... 4-19

Figure 4-16 USB Mass Storage Device Configuration Settings ....................................... 4-20

Figure 4-17 PCI/PnP Configuration Settings .................................................................... 4-21

Figure 4-18 Boot Settings.................................................................................................. 4-23

Figure 4-19 Boot Settings Configuration .......................................................................... 4-24

Figure 4-20 Security Settings ............................................................................................ 4-26

Figure 4-21 Advanced Chipset Settings............................................................................ 4-27

Figure 4-22 North Bridge Configuration........................................................................... 4-28

Figure 4-23 South Bridge Configuration........................................................................... 4-30

Figure 4-24 Exit Options Screen ....................................................................................... 4-32

Figure A-1 NanoPAK

Front Panel.................................................................................. A-1

Figure A-2 69-pin Connector J1........................................................................................ A-2

Figure A-3 Carrier Board Solder Bead Locations........................................................... A-10

Figure A-4 Carrier Board Jumper Locations................................................................... A-15

Figure B-1 NanoPAK® Development Kit.......................................................................... B-1

Figure B-2 Baseboard (Cold Plate).................................................................................... B-2

Figure B-3 Non-SATA Breakout Cable............................................................................. B-3

Figure B-4 SATA Break Out Cable ................................................................................... B-5

Figure B-5 J1 Plug Pin Diagram ........................................................................................ B-7

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Figure B-6 COM A and COM B Serial Connectors .......................................................... B-7

Figure B-7 Power Connector.............................................................................................. B-9

Figure B-8 Vbat Connector .............................................................................................. B-10

Figure B-9 GBE Connector Pinout .................................................................................. B-11

Figure B-10 VGA Connector............................................................................................. B-12

Figure B-11 GPO Connector Pins...................................................................................... B-13

Figure B-12 GPI Connector Pins ....................................................................................... B-14

Figure C-1 Order of Assembly........................................................................................... C-3

List of Tables

Table 1-1 NanoPAK® Features........................................................................................ 1-4

Table 1-2 NanoPAK® Specifications............................................................................... 1-9

Table 1-3 NanoPAK® Compliance Specifications ....................................................... 1-10

Table 2-1 Power LED States............................................................................................ 2-6

Table 2-2 Ethernet Link Status LED States ..................................................................... 2-7

Table 2-3 COM A Modes and Signals.............................................................................2-9

Table 2-4 COM A Solder Bead Settings Matrix............................................................2-10

Table 2-5 Mode Terminations........................................................................................ 2-10

Table 2-6 MIC/LINE Audio Settings............................................................................. 2-14

Table 2-7 External Standby Voltage Settings ................................................................ 2-16

Table A-1 J1 Connector Pinouts ..................................................................................... A-2

Table A-2 Signal Descriptions........................................................................................ A-6

Table A-3 SATA Signal Descriptions............................................................................. A-8

Table A-4 NON-SATA Signal Descriptions................................................................... A-9

Table A-5 Solder Bead Settings.................................................................................... A-11

Table A-6 Battery/LED Card Solder Bead Settings ..................................................... A-14

Table A-7 Battery/LED Jumper Settings...................................................................... A-16

Table B-1 Breakout Cable Connectors, Non-SATA........................................................ B-4

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Table of Contents

Table B-2 Breakout Cable Connectors, SATA................................................................ B-5

Table B-3 Serial Port Pinouts .......................................................................................... B-8

Table B-4 Power Cable Pinouts....................................................................................... B-8

Table B-5 Power Button Pinouts ..................................................................................... B-9

Table B-6 Vbat (Standby Power) Cable Pinouts ........................................................... B-10

Table B-7 Audio Pinouts ............................................................................................... B-10

Table B-8 USB Cable Pinouts ....................................................................................... B-10

Table B-9 GBE Cable Pinouts ....................................................................................... B-11

Table B-10 VGA Cable Pinouts ...................................................................................... B-12

Table B-11 GPI and GPO Cable Pinouts......................................................................... B-14

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How to Use This Manual

Preface Section

This document, entitled NanoPAK® User Manual, provides instructions on how to install, configure, and power up the NanoPAK® (see Figure 1).

The NanoPAK® is a self-contained Single Board Computer (SBC) module based on the COMExpress® boards in an enclosure designed to withstand high temperature

and high vibration environments in applications requiring light weight and small size.

An overview of NanoPAK® design and specifications is given in Chapter 1, "Over-

Themis Computer

Figure 1. NanoPAK®

xvii

NanoPAK® User Manual Version 1.0

view and Specifications", of this manual. Themis Computer values its customer comments and opinions; therefore, a “Reader

Comment Card” is located at the end of this manual for your use. Please take the time to fill out this card with any comments concerning Themis products and services, and return it to Themis Computer. Your comments may also be forwarded to Themis by sending email to docfeedback@themis.com.

Before you begin, carefully read each of the procedures in this manual. Serious damage can be caused by improper handling of the equipment.

Intended Audience

This manual is written for system integrators and programmers. It contains all necessary information for installation and configuration of the NanoPAK® and assumes

the BIOS program code is installed in the system Flash memory. Although all specific hardware features are described in the installation manual, pro-

grammers wishing to write code for the NanoPAK® without the benefit of an operating system or real-time kernel will require additional data sheets.

Unpacking

Caution: The NanoPAK® contains statically sensitive components. Industry-stan- dard antistatic measures must be observed when removing the equipment from its shipping container and during any subsequent handling. A wrist strap provides grounding for static electricity between your body and the chassis of the system unit.

Remove the NanoPAK® and accessories from the shipping container and check the contents against the packing list. Be certain to observe industry-standard ESD protection procedures when handling static-sensitive components. The package should include all elements of your order.

Please report any shipping discrepancies to the Themis Computer Customer Support group immediately: support@themis.com or 1-510-252-0870.

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How to Use This Manual

Chapter Overview

The chapters and appendices of this manual are briefly outlined as follows:

• Chapter 1 provides a brief overview of the NanoPAK®, along with its System, Environmental, and Power specifications.

• Chapter 2 provides information helpful for installation and configuration of the NanoPAK® for your particular environment and application.

• Chapter 3 provides instructions for setting up and configuring the BIOS for those systems with InsydeH2O® BIOS installed, primarily those with AMD

CPUs.

• Chapter 4 provides instructions for setting up and configuring the BIOS for those systems with AMI BIOS installed, primarily those with Intel® CPUs.

• Appendix A provides pinouts and signal descriptions for the connector.

• Appendix B provides information about accessory equipment.

• Appendix C provides information about repackaging the equipment for return to the manufacturer.

Notes, Cautions, Warnings, and Sidebars

The following icons and formatted text are included in this document for the reasons described:

Note: A note provides additional information concerning the procedure or action being described.

Caution: A caution describes a procedure or action that may result in damage to the equipment. This may involve—but is not restricted to—heavy equipment or sharp objects. T o reduce the risk, follow the instructions accompanying this symbol.

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Warning: A warning describes a procedure or action that may cause injury or death to the operator as a result of hazardous voltages. To reduce the risk, follow the instructions accompanying this symbol.

Sidebar: A “sidebar” adds detail to the section within which it is placed, but is not absolutely vital to the description or procedure of the section.

Website Information

Themis Computer corporate and product information may be accessed on the World Wide Web by browsing the website http://www.themis.com.

Your Comments are Welcome

We are interested in improving our documentation and welcome your comments and suggestions. You can email your comments to us at docfeedback@themis.com. Please include the document part number in the subject line of your email: 118527-

024.

Themis Computer

General Section

Chapter

1.1 Overview

The NanoPAK® (see Figure 1-1 below) is a self-contained Single Board Computer (SBC) system designed for applications requiring small size and light weight in high temperature, high vibration environments. It is ideal for remote controlled air and ground vehicles employed in hazardous conditions.

1NanoPAK

Overview and Specifications

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Figure 1-1. NanoPAK® SBC

1-1

NanoPAK® User Manual Version 1.0

1.2 System Description

The NanoPAK® is a self-contained SBC module containing a carrier board and a CPU mezzanine card using the industry standard COMExpress® form factor and

Type 1 pin assignments. The CPU mezzanine card is mounted on the carrier board, which interfaces the processor module with the 69-pin external connector and provides support including additional I/O, buffering, FLASH, etc. The IO logic on the carrier board includes an HD Audio port provided by an ALC889 codec, two native serial ports, and a Solid-State Disk drive attached to one of the three SATA ports of the SBC, which can serve as a boot device for the system. The CPU mezzanine card uses one of the processors listed in Figure 1-2. For connectivity to I/O devices, the CPU will be paired with a PCH as listed in Figure 1-2. The BIOS is contained in a flash device connected to the PCH over the SPI interface. All power, control, management, and I/O signals go through the external 69-pin connector.

The system is described by its complete Part Number, as in the following example, according to the description in Figure 1-2, NanoPAK Ordering Information, on page 1-3. For instance, a system with a part number of TSY-215NP-322-NNANVN has components as follows, (the part number may often be shortened, as in TSY-215NP):

TSY- 2 xx NP-xxx-XXXXXX TSY- 2 15 NP-322-NNANVN

215 = AMD Fusion - T56N CPU / A55E 3 = 64GB flash on SBC Module 2 = 32GB flash on Carrier Board 2 = 2GB RAM on SBC Module N = Line In (Audio Input Option) N = Internal Removable Battery Holder A = RS232 Serial Port TTYA Option N = Non-sealed connectors V = SATA 2GPI/2GPO

N= DDC for VGA interface (I

Complete Part Number descriptions are given in Figure 1-2. These represent the standard configurations. Please consult the factory for other configurations.

C Bus Option)

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202 = Intel® At om - N 455 CP U / IC H8M

211 = AMD Fusion - T40R C PU / A55E

212 = AMD Fusion - T40E CPU / A55E 213 = AMD Fusion - T40N CPU / A55E 214 = AMD Fusion - T48N CPU / A55E 215 = AMD Fusion - T56N CPU / A55E

0 = No Flash 1 = 16GB flash 2 = 32GB flash 3 = 64GB flash 4 = 128GB flash 8 = 1GB flash 9 = 2GB flash

0 = No flash

3 - FLASH ON CARRIER BOARD

2 - FLASH ON SBC MODULE

1 = 16GB 2 = 32GB 3 = 64GB 4 = 128GB

4 - R

AM on SBC M O DULE

1 = 1GB 2 = 2GB 4 = 4GB

5 - AUDIO input O PTION

M = Microphone In N = Line In

6 - BATTERY O PTIO N

0 = No battery R = E xternal Vbat (wide ran ge 9V to 36V ) V = Exte rnal battery 3V N = In te rna l r emovab l e batt ery B = I nter nal soldered-do wn battery

7 - SERI AL P ORT T TY A

A = RS232 N = RS-422 B = R S -4 85 Ha l f-d up l ex en dp oi nt C = RS-485 Full-duple x endpoint D = RS-485 Half-duplex midpoint E = RS-48 5 Full-dupl

ex m i dp oin t

8 - SE AL I N G OPT I ON

N = no n- sea l e d S = seale d

9 - SATA II

N = No SATA V = SATA 2GPI/2GPO

10 - I

C BUS

N = DDC for VGA interface S = SM Bbus

U = Use r I

1 - CPU on SBC MODULE

TSY - 2 xx NP - x x x - x x x x x x

Themis Computer

Figure 1-2. NanoPAK Ordering Information

1—Overview and Specifications

System Description

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NanoPAK® User Manual Version 1.0

Table 1-1 lists major featur es of the Nan oPAK®

Table 1-1. NanoPAK® Features

Parameter Description

Processor  See Figure 1-2 Memory  See Figure 1-2 Ethernet port  Single 10/100/1000 MB Ethernet

 Power

LEDs

I/O Ports

 Disk Activity  GBe Link  GBe Activity

 4 USB 2.0 ports  2 Serial por ts  4 General Purpose Inputs (non-SATA ver.)  4 General Purpose Outputs (non-SATA ver.)  2 General Purpose Inputs (SAT A ver.)  2 General Purpose Outputs (SATA ver.)

Video  1 VGA port

 2MB BIOS Flash

BIOS

Audio

 InsydeH2O  AMI BIOS for Intel

 1 HD Audio port, ALC889 CODEC  Line In or MIC In  Line Out

I2C  I

C Interface

BIOS for AMD Processors

Temp  Over-Temp Monitor TPM  Standard

Battery backup

 Internal (BR1225/48mAh) or  External option

Processors

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1.3 Configurations

AMD

EMBEDDED

PROBE

test pads

for Debug

Hudson-E1 FCH

605 Ball BGA 23 x 23 mm

Connector A, B

2 GB DDR3

GIGABIT

ETHERNET

GPP1

SPI

ROM

SPI I/F

24-bit LVDS x2

x4 UMI

AMD TSI

APU FAN

Sandisk

iSSD

I2C

SMBus/

VGA I/F

PCIe Gen2

PCIe GEN2 4x1

AMD FT1 APU

Ontario, U1

413 Ball BGA

19 x19 mm

USB 2.0 x 5

SATA II, 4x

HD Audio I/F

GPIOs x8

LPC I/F

Processor Board

800-1066MT/s

SATAII, 1x

Display Port X2

Single Channel

DDR3

VGA DAC

4x1 PCIe

Gen2 GPP

SPI I/F

HW Monitor I/F

AZALIA HD Audio

JTAG

DX11 IGP

1 x4 UMI-LINK

Gen 1

PCIe Gen2 I/F Port 2 ,x1

USB 2.0 (12) + 1.1 (2)

SATA II (6 ports total)

INT. CLKGEN

LPC I/F

PCI I/F

VGA

XFER

SATA1

USB (x4)

DIO (x4)

10/100/1000 Ethernet

I2C

69-Pin External Connector

+12V

DC/DC

Converter

LT3845

Super

I/O

Carrier Board

CODEC

ALC889

SATA

iSSD

AUDIO

LINE I/O

DC/DC

Converters

SATAØ

Link

3.3V

18-36 VDC

Input

3.3V AUX

RS232

NanoETX-Express 220-Pin Connector

Battery BR1225

LPC

RS232 RS422 RS485

Buer

FRU

Ext. Sby

SATA2

SATA3

TPM

TEMP

+12V

3.3V

-12V

+5V

DC/DC

Converter

1v/2V

XFMR

There are basically four configurations of the NanoPAK®: The AMD processors with and without SATA capability, and the Intel bility . Figure 1-3 illustrates a representative block diagram of the NanoPAK® with

AMD processor and SATA capability. Figure 1-4 shows an AMD processor without SATA capability. Figure 1-5 and Figure 1-6 illustrate the NanoPAK® with Intel® pro-

cessors with and without SATA, respectively.

1—Overview and Specifications

processors with and without SATA capa-

Themis Computer

Figure 1-3. Block Diagram: NanoPAK®/AMD Processor with SATA Capability

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NanoPAK® User Manual Version 1.0

AMD

EMBEDDED

PROBE test pads for Debug

Hudson-E1 FCH

605 Ball BGA 23 x 23 mm

Connector A, B

2 GB DDR3

GIGABIT

ETHERNET

GPP1

SPI

ROM

SPI I/F

24-bit LVDS x2

x4 UMI

AMD TSI

APU FAN

Sandisk

iSSD

I2C

SMBus/

VGA I/F

PCIe Gen2

PCIe GEN2 4x1

AMD FT1 APU

Ontario, U1

413 Ball BGA

19 x19 mm

USB 2.0 x 5

SATA II, 4x

HD Audio I/F

GPIOs x8

LPC I/F

Processor Board

800-1066MT/s

SATAII, 1x

Display Port X2

Single Channel

DDR3

VGA DAC

4x1 PCIe

Gen2 GPP

SPI I/F

HW Monitor I/F

AZALIA HD Audio

JTAG

DX11 IGP

1 x4 UMI-LINK

Gen 1

PCIe Gen2 I/F Port 2 ,x1

USB 2.0 (12) + 1.1 (2)

SATA II (6 ports total)

INT. CLKGEN

LPC I/F

PCI I/F

VGA

USB (x4)

DIO (x8)

10/100/1000 Ethernet

I2C

69-Pin External Connector

+12V

DC/DC

Converter

LT3845

Super

I/O

Carrier Board

CODEC

ALC889

SATA iSSD

AUDIO

LINE I/O

DC/DC

Converter

SATAØ

Link

3.3V

18-36 VDC

Input

3.3V AUX

RS232

NanoETX-Express 220-Pin Connector

Battery

BR1225

LPC

RS232 RS422 RS485

Buer

FRU

Ext. Sby

TPM

TEMP

1v/2V

DC/DC

Converters

+12V

3.3V

-12V

+5V

XFMR

Figure 1-4. Block Diagram: NanoPAK®/AMD Processor without SATA Capability

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1—Overview and Specifications

LM96163CISD

(CPU Temp)

1 GB DDR3

onboard memory

ADI (H/W monitor)

AD7999-1

ICH8M

BGA 676 pin

31 x 31 mm

Intel® Atom N-455

BGA 559 pin

22x22 mm

SPI

BIOS

Connector A, B

18-bit LVDS

x4 DMI

I2C

Watchdog Timer/GPIO

Fintek

F75111

2 GB NAND

Flash on board

PATA

SMBus

CRT

667 MHz

LPC Bus

Giga LAN

82567V

LCI

GLCI (port 6)

Ethernet

PCIe 1x5

USB 2.0 x 8

3 SATA II

HD Audio Interface

CPU Board

VGA

XFER

SATA1

USB (x4)

DIO (x4)

10/100/1000 Ethernet

I2C

69-Pin External Connector

+12V

DC/DC

Converter

LT3845

Super

I/O

Carrier Board

CODEC

ALC889

SATA

iSSD

AUDIO

LINE I/O

DC/DC

Converters

SATAØ

Link

3.3V

18-36 VDC

Input

3.3V AUX

RS232

NanoETX-Express 220-Pin Connector

Battery BR1225

LPC

RS232 RS422 RS485

Buer

FRU

Ext. Sby

SATA2

SATA3

TPM

TEMP

+12V

3.3V

-12V

+5V

DC/DC

Converter

1v/2V

XFMR

Configurations

Figure 1-5. Block Diagram: NanoPAK®/Intel® Processor with SATA Capability

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NanoPAK® User Manual Version 1.0

LM96163CISD

(CPU Temp)

1 GB DDR3

onboard memory

ADI (H/W monitor)

AD7999-1

ICH8M

BGA 676 pin

31 x 31 mm

Intel® Atom N-455

BGA 559 pin

22x22 mm

SPI

BIOS

Connector A, B

18-bit LVDS

x4 DMI

I2C

Watchdog Timer/GPIO

Fintek

F75111

2 GB NAND

Flash on board

PATA

SMBus

CRT

667 MHz

LPC Bus

Giga LAN

82567V

LCI

GLCI (port 6)

Ethernet

PCIe 1x5

USB 2.0 x 8

3 SATA II

HD Audio Interface

CPU Board

VGA

USB (x4)

DIO (x8)

10/100/1000 Ethernet

I2C

69-Pin External Connector

+12V

DC/DC

Converter

LT3845

Super

I/O

Carrier Board

CODEC

ALC889

SATA

iSSD

AUDIO

LINE I/O

DC/DC

Converter

SATAØ

Link

3.3V

18-36 VDC

Input

3.3V AUX

RS232

NanoETX-Express 220-Pin Connector

Battery BR1225

LPC

RS232 RS422 RS485

Buer

FRU

Ext. Sby

TPM

TEMP

1v/2V

DC/DC

Converters

+12V

3.3V

-12V

+5V

XFMR

Figure 1-6. Block Diagram: NanoPAK®/Intel® Processor without SATA Capability

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1.4 Specifications

1.4.1 General Specifications

Table 1-2. NanoPAK® Specifications

Parameter Description

Dimensions

1—Overview and Specifications

 20mm (0.79”)deep  94mm (3.70”)long  90mm (3.54”)wide

Weight

w/Intel

Atom CPU

w/AMD Fusion CPU

Input Voltage

Power Consumption

w/Intel

Atom w/AMD T16R w/AMD T40R w/AMD T40N w/AMD T56N

External Battery Input Current

w/Intel

Atom CPU w/AMD Fusion CPU

Internal Battery Load Current

w/Intel

Atom CPU w/AMD Fusion CPU

Temperature

Operating: Non-Operating:

 290g (10.23oz)  310g (10.94oz)

 18V to 36V

 16w@24V/25°C running Memtest86  12.4@24V/25°C running Memtest86  13.6@24V/25°C running Memtest86  14.7@24V/25°C running Memtest86  20.6@24V/25°C running Memtest86

 60µA@25°C  90µA@25°C

 5µA@25°C  40µA@25°C

 -20° up to 71° C (-4° up to 160°F)  –40° to 85° C (–40° to 185° F)

Vibration

Operating: Non-Operating:

Shock

Operating: Non-Operating

Themis Computer

 .01G  .03G

 40G @25 msec  60G @25 msec

/Hz 10Hz to 2kHz

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NanoPAK® User Manual Version 1.0

1.4.2 Compliance

Table 1-3. NanoPAK® Compliance Specifications

Parameter Description

Electrical Power Vibration Shock

 Partial compliance MIL-STD-704  MIL-STD-810F  MIL-STD-901D

1.5 Packaging and Shipping

The NanoPAK® is packaged in a reusable shipping container. Please retain the shipping container in case it becomes necessary to return the unit to Themis.

In the event it becomes necessary to return the unit to Themis, repackaging instructions are provided in Appendix C, “Repackaging Instructions”.

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2RES-31XR3

Installation Section

This chapter provides detailed information about the NanoPAK® installation, operating status indications, and input/output ports.

Chapter

Installation and Operation

2.1 Applying Power

The NanoPAK® requires an input voltage between +18 and +36 VDC. Voltage is converted to +12VDC, -12VDC, +3.3VDC and +5VDC. These voltages are present on the power rails as long as input voltage is applied.

Caution: When the I/O cable is attached, if the power is already applied to the power contacts, power will be applied to the system. Before connecting the I/O Cable, insure that no power is applied to the power contacts. T ake care to apply power after the I/O Cable is attached. Attaching the cable with power on the contacts could cause damage to the system

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NanoPAK® User Manual Version 1.0

2.1.1 Provide Adequate Cooling

Caution: This product, physically small in form, has a very small surface area, making it difficult to dissipate the heat generated when in operation for some mod-

els, without using a heat sink. Operating the NanoPAK

without adequate cooling could result in exceeding temperature specifications, which may result in component failure. The many different configurations and applications for our product make it impracticable to supply one standard heat dissipating solution. The heat dissipation method employed should suit the intended application. When operating in temporary installations, such as a testing setup in a lab, avoid operation for more than a few minutes without a heat sink attached. For a suggested testing setup, see Appendix B, "Accessory Equipment".

2.1.2 Configure Power

It may be necessary to configure the power settings for the operating system in use, to configure the Power Button feature, and to either provide for, or avoid, the processor going into sleep mode. In either case, the user should check these settings to determine if they are correct for the use intended. Themis recommends the following settings.

2.1.2.1 Power Button

A Power Button feature provides for reboot/shutdown without removing all power from the system. To configure this feature in Windows 7, find the Power Options selection in Control Panel.

2-2

Figure 2-1. Power Options

Themis Computer

2—Installation and Operation

Applying Power

When the Power Options screen appears, select “High Performance,” and “Choose what the power buttons do.”

Figure 2-2. Power Plan Selection

When the system settings screen appears, for “When I press the power button,” select “Shut Down”. For “When I press the sleep button,” select “Do nothing.” Select “Save Changes.”

Figure 2-3. Power Button Setting

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NanoPAK® User Manual Version 1.0

2.1.2.2 Sleep Mode Setting

To configure the sleep mode setting, go back to the Power Options screen, and select “Choose when to turn off the display,” or “Change when the computer sleeps.”

Figure 2-4. Power Options Screen

When the Edit Plan Settings screen appears, for “Turn off the display,” select “Never.” For “Put the computer to sleep,” select “Never.” Select “Save Changes.”

Figure 2-5. Sleep Setting

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Themis Computer

2.1.3 Useful Tools

The following tools will be handy for securing the cable to the connector and for removing the front panel to replace the internal battery:

• One (1) .050 in., (H1.3 European), hex wrench for the 69-pin connector.

• One (1) 3.5 mm socket driver for the jack screws in the connector.

• One (1) No. 1 Phillips-head screwdriver.

2—Installation and Operation

Applying Power

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NanoPAK® User Manual Version 1.0

2.2 Front Panel Indicators

The front panel of the NanoPAK® has 4 LED indicators: Power LED (Green, Left), Disk LED (RED), Ethernet Link Activity LED (Yellow), and Ethernet Link Status LED (Green, right).

Figure 2-6. NanoPAK® Front Panel

2.2.1 Power LED

When power is ON and the unit is running in normal mode, the Power LED is ON (solid green), otherwise the Power LED is OFF if power is not applied, or blinking when in a sleep state, at a rate that depends on the type of sleep state (see Table 2-1).

Table 2-1. Power LED States

System State Blink Rate

Normal ON mode ON Steady Green

Normal OFF mode OFF

State S3 asserted, S5 deasserted Long blink (ON 1s, OFF 1s)(Green)

States S3 and S5 asserted

Long, Short blinks (ON 1s, OFF 1s, ON ½s, OFF 1s)(Green)

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Themis Computer

Table 2-1. Power LED States (Continued)

System State Blink Rate

2—Installation and Operation

Front Panel Indicators

State S3 deasserted, S5 asserted

Short blink (ON ½s, OFF 1s)(Green)

2.2.2 Disk Activity LED

The Disk Activity LED (RED) indicates activity, (read or write), to or from the carrier card SSD storage device (random length blinks).

2.2.3 Ethernet Activity LED

The Ethernet Activity LED (Yellow) indicates traffic on the Ethernet link (random length blinks).

2.2.4 Ethernet Link Status LED

The Ethernet Link Status LED (Green) is OFF when no Ethernet link is established, and blinks ON when a link is established at a rate that indicates the link speed. (The speeds available are dependent on the type of CPU installed). See Table 2-2.

Ethernet Link

10 Mbits/s

100Mbits/s

1000Mbits/s

Themis Computer

Speed

Table 2-2. Ethernet Link Status LED States

Blink Rate

Long, Short blinks (ON 1.2s, OFF 0.3s, ON 0.3s, OFF 0.3s)

Long, Short, Short blinks (ON 1.2s, OFF

0.3s, ON 0.3s, OFF 0.3s, ON 0.3s, OFF

0.3s)

Long, Short, Short, Short blinks (ON

1.2s, OFF 0.3s, ON 0.3s, OFF 0.3s, ON

0.3s, OFF 0.3s, ON 0.3s, OFF 0.3s)

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NanoPAK® User Manual Version 1.0

Table 2-2. Ethernet Link Status LED States (Continued)

Ethernet Link

Speed

No link OFF

Blink Rate

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Themis Computer

2.3 Input and Output

2.3.1 USB Ports

Four USB 2.0 ports are provided. USB0 and USB1 support a greater current load than allowed by the USB standard. The peripheral attached to these ports may draw a maximum 2A current instead of the usual 500mA, but only temporarily, and may not be sustained. USB2 and USB3 have standard current limitation of 500mA.

2.3.2 Serial Ports

Two native legacy serial ports from x86 architecture are available on the 69-pin IO connector.

2—Installation and Operation

2.3.2.1 COM A

COM A is configurable via solder bead setting for RS232, RS422, or RS485 mode. In RS232 mode, it supports modem control signals (RTS, CTS, DCD, DTR). (In this mode, the GPO/GPI ports share the same pins on the connector with the modem control signals to make connections available for the SAT A pairs. This is reflected in the following table. For systems with no SATA provisions, the GPI/O signals do not share pins.) In RS422 or full-duplex RS485 mode, only the transmit and receive differential pairs are provided. In RS485 half-duplex mode, one pair, (common for transmit and receive), is active. Six pins of J1, the 69-pin external connector, are assigned to attach a serial device to COM A. The following table shows how they are used in each mode. (See Table 2-3).

Sig.

Ser0 Ser1 Ser4 Ser5 Ser2 Ser3

Table 2-3. COM A Modes and Signals

14 16 15 17 39 62

RS232 RS422

RTS or GPO2

CTS or GPI2

TXD RXD

DTR or GPO3

DCD or GPI3

TXD+

RXD+

TXD(-)

RXD(-)

RS485

Full Duplex

(FDX)

TXD+

RXD+ TXD(-) RXD(-)

RS485

Half-Duplex

(HDX)

TX/RXD+

TX/RXD(-)

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NanoPAK® User Manual Version 1.0

The selection between RS232, RS422, and RS485 modes is done through a combination of solder bead settings, as indicated in Table 2-4.

Table 2-4. COM A Solder Bead Settings Matrix

Solder Beads Setting

Mode

SB2 SB3 SB7 SB8 SB9

RS232 2-3 2-3 ON OFF OFF RS422 2-3 2-3 OFF ON OFF

HALF-DUPLEX ENDPOINT 1-2 1-2 OFF OFF ON

RS485

FULL-DUPLEX ENDPOINT 2-3 2-3 OFF ON ON HALF-DUPLEX MIDPOINT 1-2 1-2 OFF OFF OFF FULL-DUPLEX MIDPOINT 2-3 2-3 OFF OFF OFF

When the differential mode is chosen, it is necessary to “insert” a parallel termination, as indicated in Table 2-5.

Table 2-5. Mode Terminations

Mode Termination

RS232 NONE RS422 One (RX)

HALF-DUPLEX ENDPOINT One (Common RX and TX)

RS485

FULL-DUPLEX ENDPOINT Two (RX and TX) MIDPOINT NONE

See Table A-5, "Solder Bead Settings," on page A-11 of Appendix A for further details.

RS485 mode is designed for multipoint communication and can run either in halfduplex or full-duplex mode. When the half-duplex mode is selected, the transmitter enable signal is controlled by the TXD TTL signal from the serial controller. The following figures illustrate the typical network topology for RS422 and RS485 com-

2-10

Themis Computer

munication links.

2—Installation and Operation

Input and Output

Figure 2-7. Typical RS422 Interface Circuit

Figure 2-8. RS485 Full-Duplex Bus Configuration

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NanoPAK® User Manual Version 1.0

Figure 2-9. RS485 Half-Duplex Bus Configuration

2.3.2.2 COM B

COM B only runs in RS232 mode, with no control signals, only TXD and RXD. The maximum baud rate is 115200 baud.

2.3.3 General Purpose I/O

There are 4 General Purpose Inputs and 4 General Purpose Outputs, (GPIO), available at the 69-pin connector J1. (On systems with SATA capability, 2 of each of these ports, GPI2/GPO2 and GPI3/GPIO3, share pins on J1 with the RS232 modem control signals in order to make connections available for the SATA pairs.) These

signals are at 3.3V logic level, routed to and from the COMExpress® connector on the carrier board through buffers. Refer to Table A-1 on page A-2 of Appendix A for

2-12

Themis Computer

pinout information.

74LVC125

3.3V

IO connector

COM-Express connector

69-pin

220 pin

CONN_GPI[n]

GPI[n]

4.7K

CONN_GPO[n]

GPO[n]

74LVC08

Figure 2-10. GPIO diagram

2.3.4 Ethernet Port

2—Installation and Operation

Input and Output

2.3.5 Video Port (VGA)

2.3.6 Storage

Themis Computer

The Ethernet port is routed from the SBC module to the IO connector through the COMExpress® connector on the carrier board. The carrier board supports 1Gb/s,

100Mb/s and 10Mb/s, but only the speeds supported by the SBC module will be available at the external connector. Link and Activity LEDs on the front panel indicate connection and link speed. The Activity LED blinks at different rates depending on the link speed.

The VGA port comes straight from the SBC module, with filtering and ESD protection provided on the carrier board. DDC interface and VGA power is provided. The DDC interface allows the CPU to probe the monitor and download its display capabilities. VGA power can be either 3.3V or 5V, set by factory solder bead setting, with fuse protection.

The carrier board hosts a 32GB Solid State Disk (SSD) attached to the SATA0 link of the CPU module. This device can sustain a 3GB/s speed rate. It complements the storage on the CPU module itself, (1GB DDR3 SDRAM and 2GB FLASH), and can be used as the boot device for the system. Storage access activity is indicated by an LED on the front panel.

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NanoPAK® User Manual Version 1.0

2.3.7 HD Audio Interface

The HD Audio interface is under the control of the ALC889 codec that communicates with the CPU through the AC97/HDA link available on the COMExpress

Type 1 interface. Only a subset of the codec is used, Line1/Mic1 In, and Line1 Out. Selection between Line In and Mic In is done by solder bead setting, which setting is readable by software. Table 2-6 lists these solder bead settings.

Table 2-6. MIC/LINE Audio Settings

Setting

Solder Beads

MIC 1 Line1

SB14 1-2 2-3 SB15 1-2 2-3

SB12 1-2 2-3 SB20 1-2 2-3

See Table A-5, "Solder Bead Settings," on page A-11 of Appendix A for further details.

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Themis Computer

2.4 Power Consumption

12W

15W

18W

21W

24W

Power (Pin)

Voltage (Vin)

16V

24V 36V

Atom (Idle)

Atom (Memtest)

13.5W

16W

Figure 2-11 shows an example of power consumption of the NanoPAK® at input voltage levels from 16V to 36V.

2—Installation and Operation

Figure 2-11. Power Consumption

2.4.1 Current Protection

The following peripherals have current protection as indicated:

• USB ports #0 and #1: 2A (transient)

• USB ports #2 and #3: 500mA (standard)

• VGA PWR (either 3.3V or 5V): 0.75A by fuse.

2.4.2 Standby Power/Battery

The CPU module has a real-time clock and system configuration data which need backup power if they are to be maintained when system main power is turned off.

The NanoPAK® supports two methods for implementing the backup voltage, an

Themis Computer

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NanoPAK® User Manual Version 1.0

VCC_RTC (2Vmin -3.3Vmax)

LDO

(on 69-pin connector)

External VBat

(Fixed range 2.5Vmin 3.3V max) (Wide range 9Vmin 36V max)

SB2

JP1

JP6

external battery or an internal battery.

Figure 2-12. Standby Power Diagram

• An external battery may have either the exact voltage required by COMExpress® specification, (fixed range mode), or a voltage between 9V and 36V,

(wide range mode). In the latter case, an LDO DC/DC converter steps down the external battery input to 3V. This condition is set by solder bead SB21 setting as indicated in Table 2-7 and in T able A-5, "Solder Bead Settings," on page A-11 of Appendix A.

2-16

Caution: When the “fixed range mode” is set, the LDO DC/DC converter is not present in the circuit. Therefore, a “wide range” voltage applied to the external battery circuit will cause excessively high voltages to be applied to the power rails and will cause damage to the components of the SBC. When the “fixed range mode” is set, ensure that only in-spec voltage is applied to the external battery circuit, (2.5V min to 3.3V max).

Solder Beads

SB21 1-2, 3-4 2-3

• When an internal battery is used, two options are offered depending on the design operating temperature. For the normal operating range between -20°C

Table 2-7. External Standby Voltage Settings

Setting

Wide Range

(9V to 36V)

Fixed Range

(3.3V)

Themis Computer

2—Installation and Operation

NanoPAK

JP1 Location

JP6 Location

Battery

Power Consumption

and 80°C, a removable battery BR1225 can be used. The removable battery can be accessed for replacement by removing the front bezel. The removable battery holder is located on the bottom of the LED/battery board. (Refer to Fig- ure 2-14 on page 2-18 for battery replacement). For an extended temperature range, the soldered type BR1225A battery is mandatory, and is not field replaceable.

• Jumper JP1 allows the user to disconnect the local battery from the load. JP1 is

located on the bottom of the LED/battery board, which is the top board of the

Themis Computer

Figure 2-13. Jumper Locations

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NanoPAK® User Manual Version 1.0

Battery

Two Jack Screws

stack, at the forward left edge. Access to this jumper is possible by removing the front bezel. (Refer to Figure 2-13 for location).

• Jumper JP6 is available to completely disconnect the external power source from the standby power circuit. JP6 is located on the top of the SBC carrier board, which is the bottom board of the stack, at the forward right edge. Access to this jumper is possible by removing the front bezel. (Refer to Figure 2-13 for location).

2.4.3 Backup Battery Replacement

Refer to Figure 2-14, and the steps following, (next page), for battery replacement. The replacement battery type is BR1225. Tools required are a 3.5mm socket driver, no. 1 Phillips screwdriver, and a .050in, (H1.3 European), hex wrench for the I/O cable connector.

2-18

Figure 2-14. Backup Battery Replacement

Themis Computer

2—Installation and Operation

Power Consumption

1. If the I/O cable is connected, remove it using the .050in, (H1.3 European), hex

wrench.

2. Remove two Phillips head screws on each side of the front of the module.

3. Remove the two jack screws at the connector with the 3.5mm socket driver.

4. Remove the front panel.

5. Remove the old battery from the battery holder. It may be necessary to use

tweezers or a needle nose pliers in order to grip the old battery . Note that if the tool does not have insulated surfaces, you will short the battery unless you grip only the rim of the battery.

6. Install the replacement battery, plus side down, by sliding it into the battery

holder.

7. Replace the front panel. Insert and tighten the two jack screws into the con-

nector holes.

8. Replace and tighten the two Phillips head screws in the sides.

9. Reinstall the I/O cable if desired, using the .050in, (H1.3 European), hex

wrench. Caution! Insure that power is removed from the power contacts to avoid possible damage to the system. Apply power only after the connector is secured in place.

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BIOS Setup Utility

InsydeH2O® BIOS Setup Utility

3.1 Introduction

This chapter describes the InsydeH2O® BIOS Setup Utility for the NanoPAK® Single Board Computer. The InsydeH2O® ROM BIOS is an UEFI-type BIOS stored in

a Flash EEPROM which is connected through SPI. This allows the BIOS configuration data to be retained when power is removed, and allows the BIOS to be easily updated. However, the system date and time is not retained when power is removed.

Chapter

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Caution: Do not upgrade the BIOS unless your system has a BIOS-related issue. Flashing the wrong BIOS can cause irreparable damage to the system. In no event shall Themis be liable for direct, indirect, special, incidental, or consequential damages arising from a BIOS update. If you have to update the BIOS, do not shut down or reset the system while the BIOS is updating. This is to avoid possible boot failure.

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3.2 Starting the BIOS Setup Utility

The BIOS Setup Utility may be access while the system is booting up after initial power application, or when rebooted by simultaneously pressing the <CTRL>, <ALT> and <DELETE> keys. An initial “splash” screen will appear, and while the “splash” screen is visible, pressing the <F2> key will bring up the BIOS Setup Utility (See Figure 3-1 on page 3-2). It may be necessary to press the <F2> key more than once to bring up the Setup screen. The first screen to appear is the BIOS Information Screen (Figure 3-2) which displays the BIOS version details. Use the leftright <arrow> keys to select the desired menu.

Figure 3-1. Splash Screen

Figure 3-2. BIOS Information Screen

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3.2.1 Navigating the Utility Screens

Selected item in White

Congurable item in Blue

Selected item explanation

Selection key legend

The InsydeH2O® BIOS Setup Utility screen has two frames. (See Figure 3-3). The left frame displays information items in black and the options that can be configured in blue. When an option is selected in the left frame, it is highlighted in white, and the right frame displays a text message for the highlighted configurable option.

The InsydeH2O® BIOS Setup Utility navigation keys are shown in the legend in Fig- ure 3-3. Most of these navigation keys can be used at any time during the setup navigation process. The left and right <arrow> keys select the menu at the top. The up and down <arrow> keys select the configurable item. Press <Enter > to bring up the sub menu to configure the item.

Note: Options printed in Bold are default settings.

3—InsydeH2O® BIOS Setup Utility

Starting the BIOS Setup Utility

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Figure 3-3. Setup Screen Legend

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3.3 Main BIOS Setup

To view the Main setup screen, use the left-right <arrow> keys to select the Main menu tab at the top.You can always return to the Main setup screen by selecting the Main tab on the top of the screen. The Main BIOS Setup screen is shown in Figure 3-4.

3.3.1 System Overview

System details such as Processor Type, Bus Speed, Memory Speed, Cache, and Memory details are listed, along with the BIOS version. The configurable items in this screen are Language, System Time and System Date.

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Figure 3-4. Main Setup Screen

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3.3.2 System Time/System Date

Use this option to change the system time and date. Highlight System Date or System Time using the <Arrow> keys. Key in new values through the keyboard and press

<Enter>. Press the <Tab> key to move between fields. The date must be entered in MM/DD/YY format. The time is entered in HH:MM:SS format.

Note: The time is in the 24-hour format. For example, 5:30 P.M. appears as 17:30:00.

3.3.3 Language

Use the <Arrow> keys to select the desired BIOS Menu language, and press <Enter> to select it.

3—InsydeH2O® BIOS Setup Utility

Main BIOS Setup

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3.4 Advanced Setup

Caution: It is advisable not to change from the default settings, as they are set according to the hardware design of this board. Options in Bold are the default set- tings.

Use the horizontal arrow keys to select the Advanced Settings screen. Use the vertical arrows to select the submenu items, and hit <Enter> to access them.

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Figure 3-5. Advanced Settings Screen

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3.4.1 Boot Configuration

Figure 3-6. Boot Configuration Settings

3—InsydeH2O® BIOS Setup Utility

Advanced Setup

• The Boot Configuration screen sets the power-on state for the Numlock key.

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3.4.2 Peripherals Configuration

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Figure 3-7. Peripheral Configuration Settings

• Enhanced Host Controller Interface (EHCI)

Sets the EHCI for USB ports 0, 1, and 2 to Auto detect or Disabled.

• Azalia

•SATA

• SATA Port(s) Power on

• Serial Port(s)

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3.4.3 IDE Configuration

3—InsydeH2O® BIOS Setup Utility

Advanced Setup

Figure 3-8. IDE Configuration Settings

• IDE Controller

Allows the IDE Controller to be Enabled or Disabled.

• Configure SATA

• SATA Port(s) 0 thru 4 connections

• Channel 4

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3.4.4 Video Configuration

Figure 3-9. Video Configuration Settings

• Enable or Disable Edid Support Option.

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3.4.5 USB Configuration

3—InsydeH2O® BIOS Setup Utility

Advanced Setup

Figure 3-10. USB Configuration Settings

• Enable or Disable USB 2.0 Controller.

• Enable or Disable USB Legacy support.

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3.4.6 Chipset Configuration

Figure 3-11. Chipset Configuration Settings

• Select NorthBridge/GNB Options Screen.

• Select Hudson-1 FCH Family Product Errata Screen.

• Select SouthBridge/GPP Options Screen.

• Set the PCI Latency Timer Setting

• Enable or Disable Spread Spectrum Operation.

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3.4.6.1 NorthBridge Configuration

3—InsydeH2O® BIOS Setup Utility

Advanced Setup

Figure 3-12. NorthBridge Configuration

• Select the PCI Express Configuration Screen.

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3.4.6.2 NorthBridge PCIe Configuration

Figure 3-13. NorthBridge PCIe Configuration Settings

• Enable dynamic link frequency changes.

• Configure the GPP Link

• Configure the processor GPP features.

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3.4.6.3 APU GPP Features Configuration

3—InsydeH2O® BIOS Setup Utility

Advanced Setup

Figure 3-14. APU GPP Features Configuration Screen

• Configure the PCIe port link Speed Mode to Gen1 or Gen2.

• Configure the Link ASPM.

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3.4.6.4 Hudson-1 FCH Configuration

Figure 3-15. Hudson-1 FCH Configuration Settings

• Enable or Disable various FCH fixes.

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3.4.6.5 SouthBridge/GPP Configuration

3—InsydeH2O® BIOS Setup Utility

Advanced Setup

Figure 3-16. SouthBridge/GPP Configuration Settings

• Select PCI Express Configurations Screen.

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3.4.6.6 SouthBridge PCIe Configuration

Figure 3-17. SouthBridge PCIe Configuration Settings

• Select an individual PCIe Port to configure.

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3.4.6.7 SouthBridge PCIe Port Features Configuration

3—InsydeH2O® BIOS Setup Utility

Advanced Setup

Figure 3-18. SouthBridge PCIe Port Features Configuration Settings

• Enable PCIe Port ASPM.

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3.4.7 ACPI Tables/Features Control

Figure 3-19. ACPI Tables/Features Control

• FACP - C2 Latency Value = Enabled

•

• FACP - C3 Latency Value = Enabled

•

• FACP - RTC s4 Wakeup = Enabled

•

• APIC - IO APIC Mode = Enabled

• HPET - HPET Support = Enabled

• _OCS Support = Enabled

• Fusion Utility = Disabled

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3.4.8 CPU Related Settings

3—InsydeH2O® BIOS Setup Utility

Advanced Setup

Figure 3-20. CPU Related Settings

• CPU P-State Setting = Auto

• SVM Support = Enabled

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3.4.9 AMD PBS Option

Figure 3-21. AMD PBS Option

• Travis Power Control = Enabled

• External LAN Controller = Auto

• PXE Boot to EXT_LAN = Disabled

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3.5 Security Configuration

3—InsydeH2O® BIOS Setup Utility

Figure 3-22. Security Configuration Settings

• Install or change Supervisor Password.

• Install or change User Password. Supervisor Password must be installed in order to install a User Password

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3.6 Power Configuration

Figure 3-23. Power Configuration

• Select the Advanced CPU Control screen to configure various CPU parameters.

•ACPI s3 = Enabled

• Thermal Fan Control = Auto

• Wake on PME = Enabled

• Auto Wake on s5 = Disabled

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3.6.1 Advanced CPU Control

3—InsydeH2O® BIOS Setup Utility

Power Configuration

Figure 3-24. Advanced CPU Control

• Cool N’ Quiet Support = Enabled Enable or Disable Cool and Quiet Support.

• Hardware Thermal Control = Auto

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3.7 Boot Configuration

Figure 3-25. Boot Configuration

• UEFI Boot = Enabled

• Quick Boot = Enabled

• Quiet Boot = Enabled

• PXE Boot to LAN = Disabled

• ACPI Selection = ACPI 3.0

• USB Boot = Enabled

• EFI Device First = Disabled

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• Select EFI to configure the Internal EFI shell.

• Select Legacy to configure Legacy Boot Device Priority.

•

3.7.1 EFI Configuration

3—InsydeH2O® BIOS Setup Utility

Boot Configuration

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Figure 3-26. EFI Configuration

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3.7.2 Legacy Boot Device Configuration

Figure 3-27. Legacy Boot Device Configuration

• Select Normal Boot Option Priority or Advanced Boot Option Priority.

• Select the Boot Device

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3.8 Exit Menu

3—InsydeH2O® BIOS Setup Utility

Figure 3-28. Exit Menu

• Exit Saving Changes When users have completed system configuration, select this option to save changes, exit BIOS setup menu and reboot the computer to take effect of all system configuration parameters.

• Save Change Without Exit Save changes and continue in the BIOS Setup Utility.

• Exit Discarding Changes Select this option to quit Setup without making any permanent changes to the system configuration.

• Load Optimal Defaults The BIOS automatically configures all setup items to optimal settings when users select this option. Optimal Defaults are designed for maximum system performance, but may not work best for all computer applications. In particular, do not use the Optimal Defaults if the user’s computer is experiencing system configuration problems.

• Load Custom Defaults Load previously saved Custom Defaults.

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• Save Custom Defaults Save the current settings as Custom Defaults.

• Discard Changes Discard any changes previously made and continue in the BIOS Setup Utility.

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BIOS Setup Utility

Chapter

AMI BIOS Setup Utility

4.1 Introduction

This chapter describes the AMI BIOS Setup Utility for the NanoPAK® Single Board Computer. The AMI ROM BIOS is stored in a Flash EEPROM and can be easily updated. This chapter explains the basic navigation of the AMI BIOS Setup Utility setup screens.

4.1.1 Starting the BIOS Setup Utility

Turn on the computer and check for the “patch code”. If there is a number assigned to the patch code, the on board CPU is supported by current BIOS. If there is no number assigned to the patch code, please contact a Themis application engineer to obtain an up-to-date patch code file, to ensure the system status of CPU is valid. Then press <DEL> to enter Setup menu.

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The first screen to appear is the Main Settings Screen. (See Figure 4-1). The Main BIOS setup menu screen has three frames. The left frame displays all the options that can be configured. Grayed-out options cannot be configured. Options in blue can be configured by the user. The bottom right frame displays the key legend. The frame above the key legend is an area reserved for a text message. When an option is selected in the left frame, it is highlighted in white. Often a text message will accompany it.

The AMI BIOS Setup Utility uses a key-based navigation system called “hot keys”. Most of the AMI BIOS setup utility “hot keys” can be used at any time during the setup navigation process. These keys include <F1>, <F10>, <Enter>, <ESC>, arrow keys, etc.

Note: Options printed in Bold are default settings.

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4.2 Main BIOS Setup

When you first enter the AMI BIOS Setup Utility, you will enter the Main setup screen.You can always return to the Main setup screen by selecting the Main tab on the top of the screen. The Main BIOS Setup screen is shown in Figure 4-1.

4—AMI BIOS Setup Utility

4.2.1 System Overview:

The following BIOS information will be displayed:

4.2.1.1 BIOS Information

This area displays the BIOS version, the build date, and ID of the BIOS.

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Figure 4-1. Main Setup Screen

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4.2.1.2 System Memory Information

This area displays the size of the system memory.

4.2.1.3 System Time/System Date

Use this option to change the system time and date. Highlight System Date or System Time using the <Arrow> keys. Key in new values through the keyboard and press

<Enter>. Press the <Tab> key to move between fields. The date must be entered in MM/DD/YY format. The time is entered in HH:MM:SS format.

Note: The time is in the 24-hour format. For example, 5:30 P.M. appears as 17:30:00.

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4.3 Advanced Setup Configuration

Caution: It is advisable not to change from the default settings, as they are set according to the hardware design of this board. Options in Bold are the default set- tings.

Use the horizontal arrow keys to select the Advanced Settings screen. Use the vertical arrows to select the submenu items, and hit <Enter> to access them.

4—AMI BIOS Setup Utility

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Figure 4-2. Advanced Settings

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4.3.1 CPU Configuration

Figure 4-3. CPU Configuration Settings

• Max CPUID Value Limit = Disabled This item allows users to limit the maximum value of CPUID.

• Execute-Disable Bit Capability = Enabled This item allows users to enable or disable the No-Execution page protection technology.

• Hyper Threading Technology = Enabled This item allows users to enable or disable Intel® Hyper Threading technology.

• Intel® Speed Step™ tech = Enabled CPU runs at its default speed if disabled; CPU speed is controlled by the operating system if enabled.

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• Intel® C-STATE tech = Enabled

This item allows the CPU to save more power in idle mode.

• Enhanced C-States = Enabled

Enable / Disable Intel® C-STATE technology

4.3.2 IDE Configuration

4—AMI BIOS Setup Utility

Advanced Setup Configuration

• ATA/IDE Configuration = Enhanced

This item allows users to select Disabled / Compatible / Enhanced modes. When set to Enhanced mode, users can select IDE or AHCI mode. When set to Compatible mode, users can select “SATA only,” “SATA Primary, PATA Secondary” or “PATA Only.”

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Figure 4-4. IDE Configuration Settings

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• Primary / Secondary / Third IDE Master / Slave BIOS auto detects the presence of an IDE device, and displays the status of auto detection of the IDE device.

— Type: Select the type of SATA driver; [Not Installed] [Auto] [CD/DVD]

[ARMD] — LBA/Large Mode: Enables or Disables the LBA Mode. — Block (Multi-Sector Transfer): Enables or Disables data multi-sectors

transfers. — PIO Mode: Select the operating mode of PIO. — DMA Mode: Select the operating mode of DMA — S.M.A.R.T.: Select the smart monitoring, analysis, and reporting

technology. — 32Bit Data Transfer: Enables or disables 32-bit data transfer.

• Hard Disk Write Protect = Disabled

Disable / Enable device write protection. This will be effective only if device is accessed through BIOS.

• IDE Detect Time Out (Sec) This item allows users to select the time out value for detecting ATA/ATAPI devices.

• ATA(PI) 80Pin Cable Detection This item allows users to select the way to detect IDE 80-pin cable.

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4.3.3 Floppy Configuration

4—AMI BIOS Setup Utility

Advanced Setup Configuration

• Floppy A/B

Select the type of floppy drive, if any are connected to the system. Disabling the floppy driver is recommended if no floppy drive is connected.

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Figure 4-5. Floppy Configuration Settings

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4.3.4 ACPI Settings

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Figure 4-6. ACPI Settings

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4.3.4.1 General ACPI Configuration

4—AMI BIOS Setup Utility

Advanced Setup Configuration

Figure 4-7. General ACPI Configuration Settings

• Suspend Mode = Auto

Select the ACPI state used for system suspend.

• RePOST Video on S3 Resume = NO

This item allows users to invoke VGA BIOS POST on S3/STR resume.

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4.3.4.2 Advanced ACPI Configuration

Figure 4-8. Advanced ACPI Configuration Settings

• ACPI Version Features This item allows users to enable RSDP pointers to 64-bit fixed system description tables.

• ACPI APIC support = Enabled Include APIC table pointer to RSDT pointer list.

• AMI OEMB table = Enable Include OEMB table pointer to R(x)SDT pointer lists.

• Headless Mode = Disable Enable / Disable headless operation mode through ACPI.

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4.3.4.3 Chipset ACPI Configuration

4—AMI BIOS Setup Utility

Advanced Setup Configuration

Figure 4-9. Chipset ACPI Configuration Settings

• Energy Lake Feature = Disabled

This item allows users to configure Intel’s® Energy Lake power management technology.

• APIC ACPI SCI IRQ = Disabled

Enable / Disable APIC ACPI SCI IRQ

• USB Device Wakeup From S3/S4 = Disabled

Enable / Disable USB Device Wakeup from S3/S4

• High Performance Event Timer = Disabled

Enable / Disable High Performance event timer.

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4.3.5 AHCI Configuration

Figure 4-10. AHCI Configuration Settings

• AHCI Port0 / Port1 / Port2 While entering setup, BIOS auto detects the presence of IDE devices and displays the status of detected IDE devices.

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4.3.6 Event Log Configuration

4—AMI BIOS Setup Utility

Advanced Setup Configuration

Figure 4-11. Event Log Configuration Settings

• View Event Log

View all unread events in the Event Log.

• Mark all events as read

Mark all unread events as read.

• Clear Event Log

Discard all events in the Event Log.

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4.3.7 Hardware Health Configuration

Figure 4-12. Hardware Health Configuration Settings

• Hardware Health Function = Enabled This item allows users to display or hide the status of a H/W monitor.

• ACPI Critical Shutdown Temp This item allows users to set the value of CPU shutdown temperature in ACPI OS.

• Temperature and Voltage Information Local (System) / Remote (CPU) Temperature. VBAT / VIN / +5VSB

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4.3.8 MPS Configuration

4—AMI BIOS Setup Utility

Advanced Setup Configuration

• MPS Revision

This item allows users to select MPS reversion.

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Figure 4-13. MPS Configuration Settings

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4.3.9 SMBIOS Configuration

Figure 4-14. SMBIOS Configuration Settings

• SMBIOS SMI Support = Enabled SMBIOS SMI wrapper support for PnP function 50h-54h.

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Themis NanoPAK User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual