User Manual
User Manual
Installation
Installation
Manual
Manual
CoolShell 3U
CoolShell 3U
Generation 2
Generation 2
Vers i o n 1.1
Pa r t Num b e r : 12 1286 - 024
Multiple-CPU, Multiple-Core 64-bit Scalable Server / Rugged 3U-High Subrack
Removable 1U-High Components, CPU & I/O Blades, Media Module, 2 Power Supplies
PCI-Express / SATA / Multiple Gigabit Ethernet, SFP Optical Transceiver, & USB Ports
™
version
1.1
version
1.1
version
1.1
version
1.1
version
1.1
version
1.1
version
1.1
version
1.1
CoolShell-3U Gen 2
High-Performance Scalable 64-bit Blade System
CoolShell-3U Gen 2
High-Performance Scalable 64-bit Blade System
CoolShell-3U Gen 2
High-Performance Scalable 64-bit Blade System
CoolShell-3U Gen 2
High-Performance Scalable 64-bit Blade System
CoolShell-3U Gen 2
High-Performance Scalable 64-bit Blade System
CoolShell-3U Gen 2
High-Performance Scalable 64-bit Blade System
CoolShell-3U Gen 2
High-Performance Scalable 64-bit Blade System
CoolShell-3U Gen 2
High-Performance Scalable 64-bit Blade System
CoolShell 3U Generation 2 Installation Manual
Version 1.1— June 2014
Themis Computer—Americas and Pacific Rim
47200 Bayside Parkway
Fremont, CA 94538
Phone (510) 252-0870
Fax (510) 490-5529
World Wide Web http://www.themis.com
Themis Computer—Rest of World
5 Rue Irene Joliot-Curie
38320 Eybens, France
Phone +33 476 14 77 80
Fax +33 476 14 77 89
Copyright © 2014 Themis Computer, Inc.
ALL RIGHTS RESERVED. No part of this publication may be reproduced in any form, by
photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without
the prior written permission of Themis Computer.
The information in this publication has been carefully checked and is believed to be accurate. However,
Themis Computer assumes no responsibility for inaccuracies. Themis Computer retains the right to
make changes to this publication at any time without prior notice. Themis Computer does not assu me
any liability arising from the application or use of this publicat ion or the product(s) described herein.
RESTRICTED RIGHTS LEGEND: Use, duplication, or disclosure by the United States Government
is subject to the restrictions set forth in DFARS 252.227-7013 (c)(1)(ii) and FAR 52 .227-19.
TRADEMARKS and SERVICEMARKS
Themis® is a registered trademark of Themis Computer, Inc.
Supermicro and SuperDoctor are trademarks or registered trademarks of Super Micro Computer, Inc.
®
Intel
and Xeon™ are registered trademarks of the Intel Corporation.
Red Hat
Linux
®
is a registered trademark of Red Hat, Inc.
®
is a registered trademark of Linus Torvalds.
All other trademarks, servicemarks, or registered trademarks used in this publication are the property of
their respective owners.
CE Marking
This product complies with the European EMC Directive (2004/108/EC) and the European Low Vol tage
Safety Directive (2006/95/EC)/.
Safety Precautions
Instructions regarding safety precautions during installation, operation, or maintenance of the equipment
are given in the section entitled “Safety Instructions” on page iv.
WARNINGS and CAUTIONS
The definitions of WARNINGS and CAUTIONS as used in this document are given in the Preface in
the section entitled “Notes, Cautions, Warnings, and Sidebars”.
Themis Customer Support
North America, South America, and Pacific Rim
Telephone: 510-252-0870
Fax: 510-490-5529
E-mail: support@themis.com
Web Site: http://www.themis.com
CoolShell 3U Generation 2 Installation Manual, Version 1.1
June 2014
Part Number: 121286-024
CoolShell 3U Generation 2 Installation Manual
Version Revision History
Ve rs io n 1 .1 ....................................................................................... June 2014
• Added instructions for battery removal and replacement
• Assorted minor changes and edits throughout this manual
Ve rs io n 1 .0 ....................................................................................... May 2014
• Initial release
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CoolShell 3U Generation 2 Installation Manual Version 1.1
Safety Instructions
To maximize user safety and ensure correct device operation, all instructions contained in this section should be read carefully.
Caution: It is important that the user observe all warnings and instructions
that are on the device and contained in this manual.
Caution: The protection of the building serves as protection for the equipment.
Caution: When rack mounted, never lean on the server . It is prohibited to lean
on the server while it is pulled on slide rails (telescopic rails) outside of the
rack (bay). Personal injury and equipment damage can occur.
WARNING: All equipment connected to the product must conform to their standards
WARNING: This Themis PRODUCT must be used in sheltered environments only, and
at an altitude of less than 3048 meters (10,000 ft).
• The device must be used in accordance with the instructions for use.
• Electrical installations in the room must correspond to the requirements of
respective regulations.
• Take care that there are no cables, particularly mains cables, in areas where
persons can trip over them.
• Do not use a mains connection in sockets shared by a number of other power
consumers. Do not use an extension cable.
• Only use the mains cable supplied.
• Power cord requirements:
Europe: A power supply unit operating at a nominal voltage of 240V must use
a power cord rated for a minimum operating voltage of 200V and is not to be
used with an operational voltage below 200V
USA: A power supply unit operating at a nominal voltage of 120V must use a
power cord rated for a minimum operating voltage of 100V and is not to be
used with an operational voltage below 100V
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• The AC input rating for the CS-3U, 850W (max) power supply units are as follows: 100-240VAC, 12 A max, 50/60 Hz.
• The unit is completely disconnected from the power source only when all
power cords are disconnected from the power source. Therefore the power
cords and its connectors must always remain easily accessible.
• Do not set up the device in the proximity of heat sources or in a damp location.
Make sure the device has adequate ventilation.
• Manufacturer recommended ambient temperature is 21°C
• All connection cables must be screwed or locked to the chassis housing.
• The device is designed to be used in horizontal position only.
• The device is no longer safe to operate when
— the device has visible damage or
— the device no longer functions.
• In these cases, the device must be shut down and secured against unintentional
operation.
• Repairs/service may only be carried out by a Themis Computer qualified service technician.
• Do not open the chassis, or perform services/repairs when the equipment is
powered on, due to electrical shock hazard.
• The device may only be opened for the installation and removal of extension
(PCI) cards, memory modules, storage drives, fan housings, power supplies,
and the lithium battery—all in accordance with the instructions given in this
manual.
• If extensions are made to the device, the legal stipulations and the device specifications must be observed.
• The device must be switched off when removing the top cover; for example,
before installing extension (PCI) cards.
Operation of Laser Source Devices
DVD/CD-ROM drives contain laser light-emitting diodes (classified in accordance
with IEC 825-1:1993: LASER CLASS 1) and, therefore, must not be opened.
If the enclosure of such a drive is opened, invisible laser radiation is emitted. Do
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CoolShell 3U Generation 2 Installation Manual Version 1.1
not allow yourself to be exposed to this radiation.
The laser system meets the code of Federal Regulations 21 CFR,1040 for the USA
and Canadian Radiation Emitting Devices Act, REDR C 1370.
Electrostatic Discharge (ESD)
A sudden discharge of electrostatic electricity can destroy static-sensitive devices
or micro-circuitry. Proper packaging and grounding techniques are necessary precautions to prevent damage. Always take the following precautions:
1. Transport boards in static-safe containers such as boxes or bags.
2. Keep electrostatic-sensitive parts in their containers until they arrive at static-
free stations.
3. Always be properly grounded when touching a sensitive board, component, or
assembly.
4. Store electrostatic-sensitive boards in protective packaging or on conductive
foam.
Grounding Methods
Finnish: laite on liitettävä suoja maadoituskoskettimilla varustettuun pistorasiaan
Norwegian: Apparatet må tilkoples jordet stikkontakt
Swedish: Apparaten skall anslutas till jordat uttag
Guard against electrostatic damage at workstations by following these steps:
1. Cover workstations with approved anti-static material. Provide a wrist strap
connected to a work surface and properly grounded tools and equipment.
2. Use anti-static mats, heel straps, or air ionizers to give added protection.
3. Provide a wrist strap connected to a work surface and properly ground tools and
equipment.
4. Handle electrostatic-sensitive components, boards, and assemblies by the case
or the PCB edge.
5. Avoid contact with pins, leads, or circuitry.
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6. Turn off power and input signals before inserting and removing connectors or
test equipment. Power is not considered off until all power supplies have been
disconnected.
7. Keep the work area free of non-conductive materials such as ordinary plastic as-
sembly aids and Styrofoam.
8. Use field service tools, s uch as cutters, screwdrivers, and vacuums that are con-
ductive.
9. Always place drives and boards PCB-assembly-side down on the foam.
10. Grounding wire size shall be no less than 16 AWG.
11. Overcurrent Protection relies on proper building installation and Earth connec-
tion (ground).
12. High Voltage; Earth connection is essential before connecting the power supply
units.
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Instructions for the Lithium Battery
Systems are equipped with a lithium battery installed on the motherboard. To
replace this battery, please observe the instructions that are described in this manual.
Follow all local guidelines and regulations for disposing of used batteries .
Warning: There is a danger of explosion when the wrong type of battery is used
as a replacement.
Warning: There is a danger of explosion if attempting to recharge the lithium
battery installed on the motherboard.
Note: Switzerland: Annex 4.10 of SR 814.013 applies to standard batteries.
European Union Waste Disposal
This section is for waste disposal by users in private households in the European Union.
For all others, please follow all local and government guidelines in accordance with waste disposal and
the symbol seen below.
This symbol on the product or on its packaging indicates that this product must not
be disposed of with your other household waste. Instead, it is your responsibility to
dispose of your waste equipment by handing it to a designated collection point for
the recycling of electrical and electronic equipment. The separate collection and
recycling of your waste equipment at the time of disposal help to conserve natural
resources and ensure recycling respectful of the environment and human health. For
more information on the recycling center nearest your home, contact the town hall,
the household waste disposal service or the shop where you purchased the product.
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Version Revision History....................................................................................................... iii
Safety Instructions ................................................................................................................. iv
Preface.....................................................................................................................................xv
1. Overview and Specifications ........................................................................................ 1-1
1.1 Overview—CoolShell 3U ...................................................................................... 1-1
1.2 CPU Blade ............................................................................................................. 1-5
1.2.1 DOM (Disk on Module) ............................................................................ 1-6
1.2.2 IPMI ........................................................................................................... 1-6
1.2.2.1 Remote On/Off ........................................................................... 1-7
1.2.2.2 COM Ports .................................................................................. 1-7
1.2.3 Lithium Battery .......................................................................................... 1-7
1.2.3.1 Removing the Lithium Battery ................................................... 1-7
1.2.3.2 Installing a Lithium Battery ........................................................ 1-9
1.3 I/O Blade .............................................................................................................. 1-10
1.3.1 Graphics ................................................................................................... 1-10
1.4 Storage Expansion Subsystem ............................................................................. 1-11
1.5 Specifications ....................................................................................................... 1-12
1.5.1 General ..................................................................................................... 1-12
1.5.2 Environmental .......................................................................................... 1-12
1.5.2.1 Shock ........................................................................................ 1-13
1.5.2.2 Electrostatic Discharge ............................................................. 1-13
1.5.2.3 Noise Level ............................................................................... 1-13
1.5.3 Regulatory Compliance ........................................................................... 1-13
1.5.4 RoHS Compliance ................................................................................... 1-14
1.5.5 Hazardous Materials ................................................................................ 1-14
1.5.6 CPU Blade ............................................................................................... 1-14
1.5.7 I/O Blade .................................................................................................. 1-14
1.6 Packaging and Shipping ....................................................................................... 1-16
2. Installation and Operation ........................................................................................... 2-1
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2.1 Installation Procedures ........................................................................................... 2-1
2.1.1 Subrack Installation ................................................................................... 2-1
2.1.2 CoolShell 3U Installation ........................................................................... 2-3
2.1.3 Multiple Video Displays ............................................................................ 2-5
2.1.4 Audio Connection ...................................................................................... 2-6
2.2 Operation ............................................................................................................... 2-7
2.2.1 Power ......................................................................................................... 2-7
2.2.1.1 Power Sequence .......................................................................... 2-7
2.2.1.2 Remote On/Off ........................................................................... 2-8
2.2.2 Operation with Factory-Installed Linux .................................................... 2-8
Appendix A. Connector Pinouts ...................................................................................... A-1
A.1 CPU Blade ............................................................................................................ A-1
A.1.1 Power & Reset Connector ......................................................................... A-1
A.1.2 PCI-Express Connector ............................................................................. A-3
A.1.3 Clock & I2C Bus Connector (Firewire 1394) ........................................... A-4
A.1.4 DVI Power Connector (DVI Transceiver) ................................................ A-5
A.1.5 Optical SFP Ports ...................................................................................... A-6
A.1.6 Stereo Audio Connectors .......................................................................... A-6
A.1.7 IPMI LAN Port ......................................................................................... A-7
A.2 I/O Blade ............................................................................................................... A-8
A.2.1 USB 2.0 Connectors ................................................................................. A-8
A.2.2 DVI Video Output Connector ................................................................... A-8
A.3 Media Module ..................................................................................................... A-10
A.3.1 Copper Gigabit Ethernet Ports ................................................................ A-10
A.3.2 Optical Gigabit Ethernet Ports ................................................................ A-11
A.3.3 USB 2.0 Connectors ............................................................................... A-12
A.4 Storage Expansion Subsystem ............................................................................ A-13
A.4.1 Power & Reset Connector ....................................................................... A-13
A.4.2 PCI-Express Connector ........................................................................... A-13
A.4.3 Clock & I2C Bus Connector (Firewire 1394) ......................................... A-13
B. BIOS Setup Utility ........................................................................................................B-1
B.1 Introduction ............................................................................................................B-1
B.1.1 Starting BIOS Setup Utility .......................................................................B-1
B.1.2 How To Change the Configuration Data ...................................................B-2
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B.1.3 Starting the Setup Utility ...........................................................................B-2
B.2 Main Setup .............................................................................................................B-3
B.2.1 System Overview .......................................................................................B-3
B.2.1.1 System Time/System Date ..........................................................B-3
B.2.1.2 Supermicro X9DRi .....................................................................B-4
B.3 Advanced Setup Configurations ............................................................................B-5
B.3.1 BOOT Features ..........................................................................................B-5
B.3.1.1 Quiet Boot ...................................................................................B-5
B.3.1.2 AddOn ROM Display Mode .......................................................B-6
B.3.1.3 Bootup Num-Lock ......................................................................B-6
B.3.1.4 Wait For 'F1' If Error ..................................................................B-6
B.3.1.5 Interrupt 19 Capture ....................................................................B-6
B.3.2 Power Configuration ..................................................................................B-6
B.3.2.1 Power Button Function ...............................................................B-6
B.3.2.2 Restore on AC Power Loss .........................................................B-6
B.3.3 CPU Configuration ....................................................................................B-7
B.3.3.1 Socket 1 CPU Information/Socket 2 CPU Information .............B-7
B.3.3.2 CPU Speed ..................................................................................B-7
B.3.3.3 64-bit ...........................................................................................B-7
B.3.3.4 Clock Spread Spectrum ..............................................................B-7
B.3.3.5 Hyper-threading ..........................................................................B-8
B.3.3.6 Active Processor Cores ...............................................................B-8
B.3.3.7 Limit CPIUID Maximum ............................................................B-8
B.3.3.8 Execute-Disable Bit Capability ..................................................B-8
B.3.3.9 Hardware Prefetcher ...................................................................B-8
B.3.3.10 Adjacent Cache Line Prefetch ....................................................B-8
B.3.3.11 DCU Streamer Prefetcher ...........................................................B-9
B.3.3.12 DCU IP Prefetcher ......................................................................B-9
B.3.3.13 Intel® Virtualization Technology ...............................................B-9
B.3.4 CPU Power Management Configuration ...................................................B-9
B.3.4.1 Power Technology ......................................................................B-9
B.3.4.2 Energy/Performance Bias .........................................................B-11
B.3.4.3 Factory Long Duration Power Limit ........................................B-11
B.3.4.4 Long Duration Maintained ........................................................B-11
B.3.4.5 Recommended Short Duration Power ......................................B-11
B.3.4.6 Short Duration Power Limit .....................................................B-11
B.3.5 Chipset Configuration ..............................................................................B-12
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B.3.5.1 Intel VT-d .................................................................................B-12
B.3.5.2 Intel® I/OAT ............................................................................B-12
B.3.5.3 DCA Support ............................................................................B-12
B.3.5.4 IIOH 0 PCIe Port Bifurcation Control ......................................B-12
B.3.5.5 IOU1-PCIe Port ........................................................................B-12
B.3.5.6 Port 1A Link Speed ...................................................................B-13
B.3.5.7 Port 1B Link Speed ...................................................................B-13
B.3.5.8 IOU2-PCIe Port ........................................................................B-13
B.3.5.9 Port 2A Link Speed ...................................................................B-13
B.3.5.10 IOU3-PCIe Port ........................................................................B-13
B.3.5.11 Port 3A Link Speed ...................................................................B-13
B.3.5.12 Port 3C Link Speed ...................................................................B-14
B.3.5.13 IOH 1 PCIe Port Bifurcation Control .......................................B-14
B.3.5.14 IOU1-PCIe Port ........................................................................B-14
B.3.5.15 Port 1A Link Speed ...................................................................B-14
B.3.5.16 IOU2-PCIe Port ........................................................................B-14
B.3.5.17 Port 2A Link Speed ...................................................................B-14
B.3.5.18 IOU3-PCIe Port ........................................................................B-14
B.3.5.19 Port 3A Link Speed ...................................................................B-15
B.3.5.20 Current QPI Link ......................................................................B-15
B.3.5.21 Current QPI Frequency ............................................................. B-15
B.3.5.22 QPI (Quick Path Interconnect) Link Speed Mode ....................B-15
B.3.5.23 QPI Link Frequency Select .......................................................B-15
B.3.5.24 Total Memory ...........................................................................B-15
B.3.5.25 Current Memory Mode .............................................................B-15
B.3.5.26 Current Memory Speed .............................................................B-15
B.3.5.27 Mirroring ................................................................................... B-16
B.3.5.28 Sparing ...................................................................................... B-16
B.3.5.29 CPU Socket 1 DIMM Information / CPU Socket 2 DIMM
Information ...............................................................................B-16
B.3.5.30 Memory Mode ..........................................................................B-16
B.3.5.31 DRAM RAPL BWLIMIT .........................................................B-16
B.3.5.32 Perfmom and DFX Devices ......................................................B-16
B.3.5.33 DRAM RAPL Mode .................................................................B-17
B.3.5.34 MPST Support ..........................................................................B-17
B.3.5.35 DDR Speed ...............................................................................B-17
B.3.5.36 Channel Interleaving .................................................................B-17
B.3.5.37 Rank Interleaving ......................................................................B-17
B.3.5.38 Patrol Scrub ............................................................................... B-17
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B.3.5.39 Demand Scrub ...........................................................................B-17
B.3.5.40 Data Scrambling .......................................................................B-18
B.3.5.41 DRAM RAPL ...........................................................................B-18
B.3.5.42 Device Tagging .........................................................................B-18
B.3.5.43 Thermal Throttling ....................................................................B-18
B.3.5.44 OLTT Peak BW % ....................................................................B-18
B.3.5.45 PCH Information .......................................................................B-18
B.3.5.46 All USB Devices .......................................................................B-19
B.3.5.47 Legacy USB Support ................................................................B-19
B.3.5.48 Port 60/64 Emulation ................................................................B-19
B.3.5.49 EHCI Hand-Off .........................................................................B-19
B.3.6 SATA Configuration ................................................................................B-19
B.3.6.1 SATA Port0~SATA Port5 ........................................................B-19
B.3.6.2 SATA Mode ..............................................................................B-20
B.3.7 SCU (Storage Control Unit) Configuration .............................................B-21
B.3.7.1 Storage Controller Unit Devices ...............................................B-21
B.3.7.2 OnChip SCU Option ROM .......................................................B-21
B.3.7.3 SCU Port 0~SCU Port 7 ...........................................................B-21
B.3.8 Thermal Configuration ............................................................................B-21
B.3.8.1 Thermal Management ...............................................................B-21
B.3.8.2 ME SMBus Thermal Reporting ................................................B-21
B.3.9 PCIe/PCI/PnP Configuration ...................................................................B-22
B.3.9.1 PCI ROM Priority .....................................................................B-22
B.3.9.2 PCI Latency Timer ....................................................................B-22
B.3.9.3 Above 4G Decoding .................................................................B-22
B.3.9.4 PERR# Generation ....................................................................B-22
B.3.9.5 SERR# Generation ....................................................................B-23
B.3.9.6 Maximum Payload ....................................................................B-23
B.3.9.7 Maximum Read Request ...........................................................B-23
B.3.9.8 ASPM Support ..........................................................................B-23
B.3.9.9 Onboard LAN Options ROM Select .........................................B-23
B.3.9.10 Load Onboard LAN 1 Option ROM/Load Onboard LAN 2
Option ROM .............................................................................B-23
B.3.9.11 VGA Priority .............................................................................B-24
B.3.9.12 Network Stack ...........................................................................B-24
B.3.10 Super IO Configuration (WPCM450) ......................................................B-24
B.3.10.1 Serial Port .................................................................................B-24
B.3.10.2 Serial Port Mode .......................................................................B-24
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B.3.10.3 Device Settings .........................................................................B-24
B.3.10.4 Change Settings ........................................................................B-24
B.3.11 Serial Port Console Redirection ...............................................................B-25
B.3.11.1 COM 0/COM 1 .........................................................................B-25
B.3.11.2 Console Redirection ..................................................................B-25
B.3.11.3 Terminal Type ...........................................................................B-25
B.3.11.4 Bits Per second ..........................................................................B-25
B.3.11.5 Data Bits ...................................................................................B-25
B.3.11.6 Parity ......................................................................................... B-26
0.0.0.1 Stop Bits ....................................................................................B-26
B.3.11.7 Flow Control .............................................................................B-26
B.3.11.8 VT-UTF8 Combo Key Support ................................................B-26
B.3.11.9 Recorder Mode .........................................................................B-26
B.3.11.10Resolution 100x31 ...................................................................B-26
B.3.11.11Legacy OS Redirection Resolution ..........................................B-26
B.3.11.12Putty KeyPad ............................................................................B-27
B.3.11.13Serial Port for Out-of-Band Management/Windows
Emergency Management Services (EMS) ................................B-27
B.3.11.14Console Redirection .................................................................B-27
B.3.11.15Out-of-Band Management Port ................................................B-27
B.3.11.16Terminal Type ..........................................................................B-27
B.3.11.17Bits Per Second ........................................................................B-27
B.3.11.18Flow Control ............................................................................B-28
B.3.12 ACPI Settings ..........................................................................................B-28
B.3.12.1 ACPI Sleep State ......................................................................B-28
B.3.12.2 NUMA ......................................................................................B-28
B.3.12.3 High Precision Event Timer .....................................................B-28
B.3.12.4 TPM Support .............................................................................B-29
B.3.12.5 Current Status Information .......................................................B-29
B.3.12.6 Intel TXT (LT-SX) Hardware Support .....................................B-29
B.3.13 ME (Management Engine) Subsystem ....................................................B-30
B.3.13.1 ME Subsystem ..........................................................................B-30
B.4 Event Logs ...........................................................................................................B-31
B.4.1 Change SMBIOS Event Log Settings ......................................................B-31
B.4.1.1 SMBIOS Event Log ..................................................................B-31
B.4.1.2 Erase Event Log ........................................................................B-32
B.4.1.3 When Log is Full ......................................................................B-32
B.4.1.4 Log System Boot Event ............................................................B-32
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B.4.1.5 MECI ........................................................................................B-32
B.4.1.6 METW ......................................................................................B-32
B.4.1.7 View SMBIOS Event Log ........................................................B-32
B.4.1.8 View System Event Log ...........................................................B-32
B.5 IPMI .....................................................................................................................B-33
B.5.1 System Event Log ....................................................................................B-34
B.5.1.1 SEL Components ......................................................................B-34
B.5.1.2 Erase SEL .................................................................................B-34
B.5.1.3 When SEL is Full ......................................................................B-34
B.5.1.4 Log EFI Status Codes ...............................................................B-34
B.5.2 BMC Network Configuration ..................................................................B-34
B.5.2.1 LAN Channel 1 .........................................................................B-34
B.5.2.2 Update IPMI LAN Configuration .............................................B-35
B.5.2.3 Configuration Address Source ..................................................B-35
B.5.2.4 Station IP Address ....................................................................B-35
B.5.2.5 Subnet Mask .............................................................................B-35
B.5.2.6 Station MAC Address ...............................................................B-35
B.5.2.7 Router IP Address .....................................................................B-35
B.5.2.8 Router MAC Address ...............................................................B-35
B.6 Boot Configuration ..............................................................................................B-36
B.6.1 Boot Option Priorities ..............................................................................B-36
B.6.1.1 Boot Option #1/ Boot Option #2/ Boot Options #3, etc. ..........B-36
B.6.1.2 Network Device BBS Priorities, Hard Drive BBS Priorities ....B-36
B.6.2 Delete Boot Option ..................................................................................B-37
B.6.3 Boot Option #1, Boot option #2, Boot Option #3 ....................................B-37
B.7 Security Settings ..................................................................................................B-38
B.7.1 Administrator Password ...........................................................................B-38
B.7.2 User Password ..........................................................................................B-38
B.8 Exit Options .........................................................................................................B-39
B.8.1 Discard Changes and Exit ........................................................................B-39
B.8.2 Save Changes and Reset ..........................................................................B-40
B.8.3 Save Changes ...........................................................................................B-40
B.8.4 Discard Changes ......................................................................................B-40
B.8.5 Restore Optimized Defaults .....................................................................B-40
B.8.6 Save as User Defaults ..............................................................................B-40
B.8.7 Restore User Defaults ..............................................................................B-41
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B.8.8 Boot Override ..........................................................................................B-41
B.9 BIOS Error Beep Codes .......................................................................................B-42
B.10 BIOS Recovery ....................................................................................................B-43
B.10.1 How to Recover the AMIBIOS Image (the Main BIOS Block) ..............B-43
B.10.2 Boot Sector Recovery from a USB Device .............................................B-43
B.10.3 Boot Sector Recovery from an IDE CD-ROM ........................................B-44
B.10.4 Boot Sector Recovery from a Serial Port (“Serial Flash”) ......................B-44
B.10.5 Requirements ...........................................................................................B-44
Appendix C. X9DRi-F Motherboard ............................................................................... C-1
C.1 Overview ................................................................................................................C-1
C.2 Chipset Overview ..................................................................................................C-6
C.2.1 Main Features of the E5-2600 V2 Series Processor and C602 Chipset .....C-6
C.3 Special Features .....................................................................................................C-8
C.3.1 Recovery from AC Power Loss .................................................................C-8
C.3.2 PC Health Monitoring ................................................................................C-8
C.3.2.1 Fan Status Monitor ......................................................................C-8
C.3.2.2 Environmental Temperature Control ..........................................C-8
C.3.2.3 System Resource Alert ................................................................C-9
C.3.3 ACPI Features ............................................................................................C-9
C.3.4 Slow Blinking LED for Suspend-State Indicator ......................................C-9
C.3.5 Super I/O ..................................................................................................C-10
C.3.6 Overview of the Nuvoton WPCM450 Controller ....................................C-10
C.3.6.1 Additional Supported features of the WPCM450 .....................C-10
Appendix D. Red Hat Enterprise Linux 5 Installation ................................................. D-1
D.1 Introduction ........................................................................................................... D-1
D.2 Installation ............................................................................................................ D-1
Index ..............................................................................................................................Index-1
Reader Comment Card
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Table of Contents
List of Figures
Figure 1-1 CoolShell 3U within Rugged 3RU Subrack .................................................... 1-2
Figure 1-2 CPU Blade Front Panel.................................................................................... 1-2
Figure 1-3 I/O Blade Front Panel ...................................................................................... 1-3
Figure 1-4 AC Power Supply Front Panel......................................................................... 1-3
Figure 1-5 Media Module Front Panel .............................................................................. 1-4
Figure 1-6 CoolShell 3U PCIe Topology.......................................................................... 1-5
Figure 1-7 X9DRi-F BMC Block Diagram....................................................................... 1-6
Figure 1-8 CPU Blade Lithium Battery............................................................................. 1-8
Figure 1-9 Storage Expansion Subsystem....................................................................... 1-11
Figure 2-1 Empty CoolShell 3U (3RU) Subrack (Front View)......................................... 2-1
Figure 2-2 Install Subrack Alignment Guide-Pins onto the 19” Rack .............................. 2-2
Figure 2-3 Mate Subrack Alignment Holes with Alignment Guide-Pins ......................... 2-2
Figure 2-4 CoolShell 3U 3RU Subrack Secured to the 19” Rack..................................... 2-3
Figure 2-5 I/O Blade Ports................................................................................................. 2-4
Figure 2-6 Cable the Storage Expansion Subsystem to the CPU Blade............................ 2-5
Figure 2-7 Connect the Power Cords to the AC Power Supplies...................................... 2-5
Figure 2-8 Connect the Audio Cable Adapter to Channel A or Channel B ...................... 2-6
Figure A-1 Power & Reset Connector Pinout................................................................... A-1
Figure A-2 PCI-Express Connector Pinout....................................................................... A-3
Figure A-3 Clock & I2C Connector Pinout....................................................................... A-4
Figure A-4 Power & Reset Connector Pinout................................................................... A-5
Figure A-5 Optical SFP Port–CPU Blade ......................................................................... A-6
Figure A-6 Stereo Audio Connector Pinout...................................................................... A-6
Figure A-7 Ethernet Connector, Type RJ45...................................................................... A-7
Figure A-8 USB 2.0 Connector Pinout.............................................................................. A-8
Figure A-9 Video Connector Pinout.................................................................................. A-9
Figure A-10 Copper Gigabit Ethernet Connector Pinout.................................................. A-10
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CoolShell 3U Generation 2 Installation Manual Version 1.1
Figure A-11 Optical Gigabit Ethernet Connector Pinout.................................................. A-12
Figure A-12 USB 2.0 Connector Pinout............................................................................ A-12
Figure A-13 Power & Reset Connector Pinout................................................................. A-13
Figure B-1 Main BIOS Setup Screen................................................................................. B-3
Figure B-2 Advanced Settings Screen ............................................................................... B-5
Figure B-3 Event Logs ..................................................................................................... B-31
Figure B-4 IPMI Settings ................................................................................................. B-33
Figure B-5 Boot Settings.................................................................................................. B-36
Figure B-6 Security Settings ............................................................................................ B-38
Figure B-7 Exit Options ................................................................................................... B-39
Figure B-8 AMI_FLSH Hyperterminal............................................................................ B-46
Figure B-9 ROM File Extraction ..................................................................................... B-46
Figure B-10 FLASH Recovery .......................................................................................... B-47
Figure C-1 X9DRi-F Motherboard .................................................................................... C-2
Figure C-2 X9DRi-F Block Diagram................................................................................. C-4
Figure C-3 X9DRi-F Motherboard .................................................................................... C-5
Figure D-1 Power On after Linux DVD is Inserted into Drive......................................... D-2
Figure D-2 Skip Key ......................................................................................................... D-2
Figure D-3 Welcome Screen ............................................................................................. D-3
Figure D-4 Language Selection......................................................................................... D-4
Figure D-5 Selecting Layout Type.................................................................................... D-5
Figure D-6 Enter Installation Number............................................................................... D-6
Figure D-7 Partitioning...................................................................................................... D-7
Figure D-8 Reviewing Option........................................................................................... D-8
Figure D-9 Creating a Custom Layout.............................................................................. D-9
Figure D-10 Setting Up Boot Loader................................................................................ D-10
Figure D-11 Master Boot Record (MBR) ......................................................................... D-11
Figure D-12 Network Devices List ................................................................................... D-12
Figure D-13 Edit Interface Pop-Up Screen ....................................................................... D-13
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Figure D-14 Selecting Time Zone..................................................................................... D-14
Figure D-15 Setting Up Root Account and Password....................................................... D-15
Figure D-16 Package Installation Default Screen............................................................. D-16
Figure D-17 Optional Packages......................................................................................... D-17
Figure D-18 Option to Review or Continue...................................................................... D-18
Figure D-19 Installation Begins ........................................................................................ D-18
Figure D-20 Installation is Complete ................................................................................ D-19
Figure D-21 Login Screen................................................................................................. D-20
Figure D-22 Ready to use the Desktop.............................................................................. D-20
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Table of Contents
List of Tables
Table 1-1 General Specifications.................................................................................. 1-12
Table 1-2 Environmental Specifications....................................................................... 1-12
Table 1-3 Typical Noise Levels of the CoolShell 3U................................................... 1-13
Table 1-4 Regulatory Compliance Specifications......................................................... 1-13
Table 1-5 I/O Blade Power Specifications.................................................................... 1-15
Table A-1 Power & Reset Connector Pinout Signal Descriptions.................................. A-2
Table A-2 PCI-Express Connector Pinout Signal Descriptions...................................... A-3
Table A-3 Clock & I2C Connector Pinout Signal Descriptions..................................... A-4
Table A-4 Power & Reset Connector Pinout Signal Descriptions.................................. A-5
Table A-5 Stereo Audio Connector Pinout Signal Descriptions..................................... A-6
Table A-6 RJ45 Ethernet Pinout Signals ........................................................................ A-7
Table A-7 USB 2.0 Connector Pinout Signal Descriptions............................................ A-8
Table A-8 Video Connector Pinout Signal Descriptions................................................ A-9
Table A-9 Copper Gigabit Ethernet Pinout Signals and LED Interpretation................ A-11
Table A-10 USB 2.0 Connector Pinout Signal Descriptions .......................................... A-12
Table A-11 Power & Reset Connector Pinout Signal Descriptions................................ A-13
Table B-21 BIOS Error Beep Codes................................................................................ B-42
Table C-1 X9DRi-F Motherboard Options...................................................................... C-2
Table C-2 Major Features of the X9DRi-F...................................................................... C-3
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Preface
This document—CoolShell 3U Installation Manual— is intended for an experienced
system administrator with a knowledge of both networking and high-speed server
systems. It provides instructions on how to install, configure, power up, and boot the
CoolShell 3U (see photo below), which consists of the following 1RU-high compo-
nents—all contained in a 3RU-high subrack mountable within a 19” RETMA (Radio
Electronics Television Manufacturers Association) rack:
Figure 1. CoolShell 3U Generation 2 (Rack-Mounted)
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CoolShell 3U Generation 2 Installation Manual Version 1.1
• One CPU (Pr ocessor) Blade based on two Intel® 64-bit Xeon™ E5-2600 V2-
series CPUs—supports PCI-Express, power/reset, clock/I2C, and two audio
channel connectors, as well as a reset button and two status LEDs
• One I/O Blade—supports three PCI-Express (x16) NVIDIA® Quadro®
2000D graphics cards and six USB 2.0 I/O ports (two of which are dedicated
for native KB/MS support)
• One Media Module—supports 8 copper Gigabit Ethernet ports (RJ45) and 7
optical-fiber ports (SFP), 6 USB 2.0 ports, one DVD/CD combo drive, and two
storage media (rotating disk drive or solid-state flash drive in any combination), one fixed and one removable from the front.
• Two load-sharing, hot-swappable AC Power Supplies, each providing 850
watts (max) of output power.
Expansion Modules for the CoolShell 3U include:
• Storage Expansion Subsystem—supports up to 5 additional SATA HDD/SSD
storage drives.
— or —
•RHMI—Remote Human-Machine Interface, is a fully contained system
designed to remotely interface a host system. Host-to-RHMI signals are routed
through optical links consisting of two LC-LC fiber-optic cables terminating at
SFP connectors.
Note: Additional information for the RHMI can be achieved by obtaining the
CoolShell 3U RHMI Installation Manual (P/N: 117538-024).
Each of the CoolShell 3U components is shown in the illustration on the following
page, with a generalized CoolShell 3U interconnection flow diagram shown on the
page after that.
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Preface
CPU (Processor) Blade
I/O Blade
Media Module
850W AC Power Supplies (max each)
Themis Computer
Figure 2. Individual CoolShell 3U Components
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CoolShell 3U Generation 2 Installation Manual Version 1.1
Motherboard
Auxiliary Signals
*SMB = System Management Bus
SMB* (I C Bus)
2
I C - A
2
I C - B
2
PCI-Express + Reset
PCI-Express + Reset
PCI-Express
PCI-Express + Reset
I/O Blade
Media Module
AC Power
Supplies
Processor Blade
CPU Carrier
Board
I C - A
2
I C - PS1
2
I C - PS2
2
I C - B
2
PS1 PS2
+12V to All Units
Figure 3. Generalized CoolShell 3U Flow Diagram
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Themis Computer
A mixture of SMBus (BMC and PCH), I2C bus, and PMBus technology reside
within the CoolShell 3U. Table 1 below shows the key differences between the bus
architectures found in the CoolShell 3U.
Table 1. System Bus Comparison
SMBus
Specification
I2C
High
Power
Low
Power
PMBus
Preface
Signaling
Timing
Packet Error Checking
(optional)
SMBALERT
(Optional)
Block Size Limit — 32 bytes 255 bytes
Data Rate
(Standard Mode)
Data Rate
(Fast Mode)
Data Rate
(Fast Mode Plus)
Data Rate
(High Speed Mode)
Clock Speed 0Hz to 3.4Hz 10kHz to 100kHz 10kHz to 400kHz
Bus Timeout — 25ms to 35ms
Bus Master Request Delay
(Min)
SCL Hold Time
(Max)
—
—
100kbps
400kbps — — 400kbps
1Mbps — — —
3.4Mbps — — —
—50µs
—2ms
Data Hold Time
(Min)
Themis Computer
— 300ns
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CoolShell 3U Generation 2 Installation Manual Version 1.1
Table 1. System Bus Comparison (Continued)
SMBus
Specification
Capacitance Load per Bus
Segment
(Max)
I2C
High
Power
Low
Power
400pF — 400pF
PMBus
Electrical
Rise Time
(Max)
Pull-Up Current at 0.4V
(Max)
Leakage Current per Device
(Max)
V
Input Logic Low Threshold
IL
(Max)
V
Input Logic High Threshold
IH
(Min)
V
Output Logic Low Thresh-
OL
old
(Max)
1µs @ 100kHz,
300ns @ 400kHz
3mA (Standard and
Fast Mode)
±10µA ±5µA ±10µA
0.3V
or 1.5V 0.8V
DD
0.7V
or 3V 2.1V
DD
1µs
1µs @ 100kHz,
300ns @ 400kHz
4mA 350µA 4mA
0.4V
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Themis Computer
Preface
Product Summation
The 3RU-high (5.25”) CoolShell 3U subrack has been designed to fit into a standard
19” rack and has all of the benefits of Themis scalable server systems based on Themis rugged enterprise server (RES) and “CoolShell” technology; namely:
• Minimum space, weight, and power consumption
• Modularity—easy to maintain and upgrade
• Environmentally robust
—withstands up to 35G shock and vibration
—operates at up to 55°C temperature
—CPU electronics protected from dust and dirt
—light-weight construction
—reduced electromagnetic radiation emission
Because the CoolShell 3U is rugged enough to withstand extreme shock (up to 35G),
temperature (up to 55°C), and EMI, it is highly suitable for such demanding markets
as the military, aerospace, and telecommunications industries.
An overview of CoolShell 3U design and specifications is given in Chapter 1,
"Overview and Specifications", of this manual.
Website Information
Themis Computer corporate and product information may be accessed on the World
Wide Web by browsing the website http://www.themis.com.
Your Comments are Welcome
We are interested in improving our documentation and welcome your comments and
suggestions. You can email your comments to us at docfeedback@themis.com.
Please include the document part number (121286-024) in the subject line of your
email.
Themis Computer
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Notes, Cautions, Warnings, and Sidebars
The following icons and formatted text are included in this document for the reasons
described:
Note: A note provides additional information concerning the procedure or action
being described.
Caution: A caution describes a procedure or action that may result in injury to the operator or equipment. This may involve—but is not restricted to—heavy equipment or
sharp objects. T o reduce the risk, follow the instructions accompanying this symbol.
Warning: A warning describes a procedure or action that may cause injury to the
operator or equipment as a result of hazardous voltages. To reduce the risk of electrical shock and danger, follow the instructions accompanying this symbol.
Sidebar: A “sidebar” adds detail to the section within which it is placed,
but is not absolutely vital to the description or procedure of the section.
xxii
Themis Computer
Overview
Section
This chapter gives a general overview of the Themis CoolShell 3U Generation 2 and
lists the important specifications associated with the system.
1
Chapter
Overview and Specifications
1.1 Overview—CoolShell 3U
The CoolShell 3U (see Figure 1-1 on page 1-2) consists of the following 1RU-high
components—all contained in a 3RU-high subrack mountable within a 19” RETMA
rack:
• One CPU (Pr ocessor) Blade based on two Intel® 64-bit Xeon™ E5-2600 V2series CPUs—supports PCI-Express, power/reset, clock/I2C, and two audio
channel connectors, as well as a reset button and two status LEDs
• One I/O Blade—supports three PCI-Express (x16) NVIDIA® Quadro®
K2000D graphics cards and six USB 2.0 I/O ports (two dedicated for native
KB/MS support)
• One Media Module—supports 8 copper Gigabit Ethernet ports (RJ45) and 7
optical-fiber ports (SFP), 6 USB 2.0 ports, one DVD/CD combo drive, and two
storage media (rotating disk drive or solid-state flash drive in any combination), one fixed and one removable from the front.
• Two load-sharing, hot-swappable AC Power Supplies, each providing 850
watts (max) of output power.
Themis Computer
1-1
CoolShell 3U Generation 2 Installation Manual Version 1.1
Audio Channel A
Audio Channel B
PCI-Express Link LED
Power LED
ON/OFF Switch
PCI-Express
x1 PCIe link
Firewire 1394
PCI-Express Clock & I2C Bus
Inside the CPU Blade is
the Disk-on-Module (DOM)
bootable drive
(Push 4 seconds for OFF)
Power & Reset
DVI Power
IPMI
4-wire I2C
The front-panel details each of the CoolShell 3U components are shown in Figure
1-2, page 1-2 (CPU Blade), Figure 1-3 (I/O Blade) and Figure 1-4 (AC Power Sup-
ply) on page 1-3, and Figure 1-5, page 1-4 (Media Module).
Figure 1-1. CoolShell 3U within Rugged 3RU Subrack
1-2
Figure 1-2. CPU Blade Front Panel
Themis Computer
1—Overview and Specifications
USB 2.0 Ports
Primary video used by
BIOS during boot
Native USB ports
and bootable USB ports
LEDs To CPU Blade
PCI-Express
Video Card Link
for keyboard/mouse
(DVD / disk / stick)
USB 2.0 Ports
LEDs
I/O Blade Power
Video Card Link
LED
LED
LED
On/Off Power Switch
AC OK
DC OK
O/T
850 Watts (max)
Overview—CoolShell 3U
Figure 1-3. I/O Blade Front Panel
Themis Computer
Figure 1-4. AC Power Supply Front Panel
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CoolShell 3U Generation 2 Installation Manual Version 1.1
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1342
Primary PXE port for network boot
Secondary PXE port for network boot
Copper Gbit-Ethernet Ports
Port 1 5 2 6 3 7 4 8
Optical GbE Ports
USB 2.0 Ports
(6 total)
Pluggable SATA Drive
Copper-to-Optical Ethernet Pairings
Port (Copper)
Port (Optical)
112233445566778
DVD-ROM Boot Drive
Digital I/O Port (Remote I2C)
AB
A
LED Notes:
B
PCI-Express
LED ON = Link OK
LED OFF = Link Failed
12V Power OK
2345671
Note: SFP (850 nm) transceiver ports
DVD Activity LED DVD Ejection Button
SFP Transceiver
Receive Transmit
are provided with the system.
Note: A fixed SA TA Drive
is located inside the
Media Module
1-4
Figure 1-5. Media Module Front Panel
Themis Computer
1.2 CPU Blade
x8
x1
x1
x1
x1
x1
x1
x8 x8
x8 x8
x8 x8
x8
x8
x8
x8
x8
x8
x8
x4
x4
I/O blade USBs
Media Module
I/O Blade (graphics)
I/O Blade (graphics)
PCIe x8 slot
(to storage expansion)
Backplane
PEX8649
PEX8606
QLX4600
RHMI
PCIe Link
PEX8112
+
Audio (x2)
PEX8624
Risers from
Motherboard
The CPU blade serves as the heart of the CoolShell 3U. The CPU blade comprises a
CPU Carrier Board and a X9DRi-F motherboard. Signals are carried from the
X9DRi-F PCIe ports to the CPU carrier, where they are then routed to the system
backplane and distributed to the various components throughout the system. The
block diagram in Figure 1-6 below shows the PCIe relationship between X9DRi-F
motherboard and CoolShell 3U system components. A DOM is located on the CPU
carrier for the purpose of booting an operating system.
1—Overview and Specifications
Themis Computer
Figure 1-6. CoolShell 3U PCIe Topology
1-5
CoolShell 3U Generation 2 Installation Manual Version 1.1
Processor
South Bridge
WPCM450
VGA
DDR2
PHY
RS232
RJ-45
Serial Port
RJ-45
Dedicated Lan
Ethernet CTRL
Onboard LAN1
NOR Flash
Sensors
PECI
PCI-E
SPI
RMII
RMII
Serial
Wake-up & CTRL
LPC
PCI
USB 1.1
USB 2.0
1.2.1 DOM (Disk on Module)
The CoolShell 3U has one mSATA module (DOM) that attaches to a dedicated
mSATA port on the CPU Carrier. The DOM functions as the boot drive for the system, freeing up the drives in the media module for other activities. OS (operating
System) requirements should be stated at the time of order
1.2.2 IPMI
Native IPMI access can be achieved by connecting to the RJ-45 port on the CPU
blade. This copper RJ-45 port allows access to the BMC on the motherboard. The
port resides next to the audio-1 mini-DB9 connector on the face of the CPU blade.
1-6
Figure 1-7. X9DRi-F BMC Block Diagram
Themis Computer
1.2.2.1 Remote On/Off
It is possible to remotely turn the CoolShell 3U on and off through the IPMI interface. This can be done by using a web browser to access the BMC on the motherboard. The IP address of the IPMI interface is set in BIOS. There is a RJ-45 port
located on the face of the CPU blade dedicated to IPMI access.
1.2.2.2 COM Ports
There are no physical serial ports available on the CoolShell 3U for COM access.
However, those seeking to access the onboard serial port may do so through the
IPMI connection. There is a RJ-45 port located on the face of the CPU blade dedicated to IPMI access.
1.2.3 Lithium Battery
The lithium battery (CR2032) resides on the CPU carrier board within the CPU
blade. The lithium battery serves to retain user configuration preferences and BIOS
settings.
1—Overview and Specifications
1.2.3.1 Removing the Lithium Battery
Perform the following steps to remove the lithium battery (CR2032):
1. Make sure the system is powered off.
2. Remove the CPU Blade from the CoolShell 3U subrack assembly.
3. Locate the battery access panel located on the top of the CPU blade. Remove
the two phillips head screws, and then remove the cover, thus exposing the
lithium battery.
4. Locate the lithium battery and carefully lift the battery out of the socket. Take
care when removing the battery as to not cause damage to the positive terminal, that also acts as a retention device for the lithium battery.
5. Dispose of the used battery in accordance with all local laws and regulations
regarding battery disposal.
Themis Computer
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CoolShell 3U Generation 2 Installation Manual Version 1.1
(view from underneath cover)
remove the two phillips head screws
lift the battery from the socket and remove
CPU Blade
1-8
Figure 1-8. CPU Blade Lithium Battery
Themis Computer
1.2.3.2 Installing a Lithium Battery
Perform the following steps to insert a new lithium battery (CR2032):
1. Tilt the replacement battery into the empty socket so that it is angled under the
positive terminal.
2. Carefully press down on the battery until it is firmly seated in the socket. The
battery is properly oriented in the socket when the negative side of the battery
faces down, towards the PCB, and the positive side is facing up, towards the
retention clip (positive terminal).
3. Replace the cover on the battery access opening. Replace the two phillips
head screws removed in the previous procedure, and hand tighten.
4. Slide the CPU blade back into the CoolShell 3U subrack assembly making
sure the CPU blade is properly secured to the CoolShell 3U subrack.
1—Overview and Specifications
CPU Blade
Themis Computer
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CoolShell 3U Generation 2 Installation Manual Version 1.1
1.3 I/O Blade
The I/O Blade houses three NVIDIA Quadro K2000D graphics cards along with two
USB 2.0 ports per installed graphics card.
1.3.1 Graphics
This I/O blade utilizes NVIDIA’s Quadro K2000D graphics card. The I/O blade will
hold up to 3 of the K2000D cards. The middle graphics card is routed through the
backplane to the motherboard to act as the primary video used by BIOS during boot
(see Figure 1-3, page 1-3). The motherboard has onboard 2D graphics that is han-
dled by the BMC. Listed below are some of the key specifications of the K2000D:
• 2GB of GDDR5 memory
• 64 GB/s memory bandwidth
• 384 CUDA cores
• Dual DVI-I display connectors
The K2000D graphics card also supports the key features listed below:
• OpenGL 4.4
• Shader Model 5.0
• DirectX 11
1-10
Themis Computer
1.4 Storage Expansion Subsystem
Disk Drive 2
Disk Drive 1 Disk Drive 3
Disk Drive 5
Disk Drive 4
Power & Reset Connector
PCI-Express Connector
PCI-Express Clock
Note: A slotted screw is mounted to the right of each disk drive
that serves as a locking mechanism.
Turn slot clockwise (to vertical) = Drive is un l o cke d
Turn slot counterclockwise (to horizontal) = Drive is locked
& I2C Bus Connector
Power
PCI-E
Link
Disk1Disk2Disk3Disk4Disk
5
LED Definitions
In addition to the CoolShell 3U and its 3RU subrack, Themis has introduced a Storage Expansion Module (see Figure 1-9, page 1-11)—used to provide increased
storage—and installed within the same 19” rack above the 3RU subrack. The
installer may locate the Subsystem below the 3RU subrack if necessary.
Installation procedures for connecting the CoolShell 3U to the Storage Expansion
Subsystem are given in Chapter 2, "Installation and Operation".
1—Overview and Specifications
Themis Computer
Figure 1-9. Storage Expansion Subsystem
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CoolShell 3U Generation 2 Installation Manual Version 1.1
1.5 Specifications
1.5.1 General
Table 1-1 lists the general specifications for the CoolShell 3U.
Table 1-1. General Specifications
CoolShell 3U Weight—Average
Storage Expansion Subsystem
a—All weight in this table is an approximation. Actual weight is dependent on specific
system configuration
b—Weighed with one power supply installed—system is capable of redundant power
supplies if desired
1.5.2 Environmental
The CoolShell 3U is designed to meet the environmental requirements listed in
Table 1-2.
Table 1-2. Environmental Specifications
Parameter Weight
34.26 pounds (1 PS
to 41.2 (2 PS) pounds
CPU Blade
I/O Blade
Media Module
Power Supply (PS)
Subrack
8.5 pounds
8.5 pounds
4.5 pounds
2.76 pounds
10 pounds
6.9 pounds
a
b
)
Parameter Operating Non-Operating
Temperature 0° to 55° C –40° to 80° C
Humidity (non-condensing) 0% to 95% 0% to 95%
Atmospheric Pressure 87.0 to 108.4 kPa 57.2 to 108.4 kPa
Altitude 0 to 10,000 feet above sea level 0 to 40,000 feet above sea level
Shock 35 g @ 25ms 35 g @ 25ms
Vibration 3G (rms), 4 Hz to 28 Hz (MIL167) 3G (rms), 4 Hz to 28 Hz (MIL167)
Airflow 280 CFM N/A
1-12
Themis Computer
1.5.2.1 Shock
The CoolShell 3U is designed to survive an elevated shock environment. All structural components are welded together, enabling the system to survive a maximum
3-axis shock load of 35G at 25-msec duration.
1.5.2.2 Electrostatic Discharge
The CoolShell 3U is designed to tolerate electrostatic pulses up to 15 kilovolts (KV)
with no impact on system operation.
1.5.2.3 Noise Level
T ypical noise levels emitted by the CoolShell 3U are outlined in Table 1-3. The chas-
sis is installed with four 38-mm fans contained side-by-side in a single fan assembly.
Table 1-3. Typical Noise Levels of the CoolShell 3U
1—Overview and Specifications
Specifications
Measured at: 1 Meter 2 Meters
Front 66.24 dB 57.57 dB
Rear 61.53 dB 57.93 dB
1.5.3 Regulatory Compliance
The CoolShell 3U is designed to comply with the MIL-STD-882D safety standard.
In addition, it meets MIL-461 and the regulatory requirements listed below in
Table 1-4.
Table 1-4. Regulatory Compliance Specifications
Parameter Specification
Radiated and Conducted Emissions FCC Class A
PCB FAB Material 94VO Rating
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1.5.4 RoHS Compliance
The CoolShell 3U is designed to be RoHS-compliant consistent with standards for
commercial computing equipment.
1.5.5 Hazardous Materials
Design of the CoolShell 3U is compliant with the standards IAW 29 CFR 1910, Subpart H and Z, FED STD 313, 40 CFR Chapter I, J, abd SD14. The CoolShell 3U
does not use ozone-depleting materials as defined in IAW SD 14 and 40 CFR Chapter I, Subchapter C.
As is the case with all commercial computer equipment, a lithium battery is used to
retain configuration information and support the real-time clock in the computer system. Some PVC is used for insulation material on internal components.
1.5.6 CPU Blade
The primary components of the CPU Blade consist of an X9DRi-F SuperMicro
motherboard, a CPU carrier board, and two PCI-Express daughter cards, depending
on the type of riser cards that are used. Total power specifications for the CPU Blade
for your specific configuration can be obtained by contacting Themis support, or by
requesting such information be included with your purchase at time of order.
1.5.7 I/O Blade
The I/O Blade is designed to carry three high-performance PCI-Express graphics
cards, in addition to providing power, cooling, management, and other vital functions.
Three 8-lane PCI-Express riser cards are used to accommodate the three high-power
(200W maximum), high-performance graphics cards. Based on the PCI-Express 2.0
specification, the maximum amount of current that each PCI-Express socket draws
is listed in Table 1-5 on page 1-15, which also lists the total maximum current draw
at +3.3V.
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1—Overview and Specifications
Table 1-5. I/O Blade Power Specifications
+3.3V Power +12V Power
PCI-Express graphics card 1 3.0A 4.4A
PCI-Express graphics card 2 3.0A 4.4A
PCI-Express graphics card 3 3.0A 4.4A
Total: 9.0A
Specifications
Carrier Board Less than 1A
Total maximum current draw: 10A
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1.6 Packaging and Shipping
The CoolShell 3U is packaged in a reusable shipping container. Approximate weight
of an empty container and one AC power cord is 8.5 pounds (4 kg).
The approximate weight of a CoolShell 3U with a subrack, component systems, and
power supplies is under 40 pounds (18.2 kg) (see Table 1-1 on page 1-12).
The approximate weight of a manual and associated shipping paperwork is one
pound (0.5 kg).
Therefore, both the shipping container and a fully installed CoolShell 3U including
power cord, manual, and associated paperwork, weigh from under 49.5 pounds (22.5
kg) to under 52.5 pounds (23.8 kg).
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2
Installation
Section
Installation and Operation
2.1 Installation Procedures
Chapter
2.1.1 Subrack Installation
Before the CoolShell 3U Generation 2 can be properly installed, follow these steps
to attach the empty 3RU subrack to a 19” RETMA rack:
1. Remove any Blades (CPU and I/O), power supplies, and the Media Module—
if installed—from the 3RU subrack (see Figure 2-1). An empty subrack
weights 10 pounds (4.5 kilograms), which is easier—and safer—to handle.
Figure 2-1. Empty CoolShell 3U (3RU) Subrack (Front View)
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Subrack Alignment Guide-Pins
2.5”
Front View
Note: The 19” rack shown in this
figure is customized.
Subrack Alignment Guide-Pin
2 per side, 4 total
Subrack Alignment Hole
2 per side, 4 total
Note: Alignment Guide-Pins are installed
directly on the rear uprights of the 19” rack.
Toward Rear
of Subrack
Caution: Use industry-standard ESD grounding techniques when handling
all electronic components.
2. Install subrack alignment guide-pins to the rear—2 per side—of the 19” rack
(see Figure 2-2) with two screws per guide-pin.
Rear View
Figure 2-2. Install Subrack Alignment Guide-Pins onto the 19” Rack
3. From the front, guide the 3RU subrack through the 19” rack and carefully in-
sert the alignment guide-pins into the alignment holes on the rear of the 3RU
subrack (see Figure 2-3).
Figure 2-3. Mate Subrack Alignment Holes with Alignment Guide-Pins
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2—Installation and Operation
19” RETMA Rack CS-3U 3RU Subrack
Screw
Placement
1.75”
1.75”
1.75”
1.75”
Screw
Placement
Note: Rear 19” rack uprights are not shown.
Installation Procedures
4. Firmly push the 3RU subrack into the rear alignment guide-pins until the sub-
rack is secure and the front of the subrack is flush with the front of the 19”
rack.
Note: The fully installed alignment guide-pins are strong enough to hold the 3RU
subrack until it is secured to the front of the 19” rack—see Step 5.
5. Secure the 3RU subrack to the front of the 19” rack with four to six 10-32”
round-head screws, two or three on each side (see Figure 2-4).
Figure 2-4. CoolShell 3U 3RU Subrack Secured to the 19” Rack
2.1.2 CoolShell 3U Installation
Follow these steps to properly install the CoolShell 3U after the 3RU subrack has
been firmly attached to the 19” rack:
1. Reinstall each of the CoolShell 3U components (CPU Blade, I/O Blade, Me-
dia Module, and power supplies) previously removed from the 3RU subrack.
2. Connect the video display cable to one of the two DVI connectors (third or
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fourth from the left or right) on the middle PCI-Express card of the I/O Blade
(see Figure 2-5 on page 2-4). Connect the other end of the cable to a video dis-
play . If you are connecting multiple video displays, see Section 2.1.3, “Multiple Video Displays”.
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To Video Display To Keyboard & Mouse
Figure 2-5. I/O Blade Ports
3. Connect the keyboard and mouse cables to the USB ports on the right-hand
PCI-Express card or the right of the I/O Blade (see Figure 2-5). These righthand USB ports are connected directly to the system motherboard.
Connect the other ends of the keyboard/mouse cables to a keyboard and
mouse, respectively.
4. Install the Storage Expansion Subsystem into the 19” rack above (or below)
the CoolShell 3U 3RU subrack.
Note: Step 4 and Step 5 are applicable only if the optional Storage Expansion
Subsystem is being installed.
5. Connect the three cables (Power & Reset, PCI-Express, and Clock/I2C Bus)
from the Storage Expansion Subsystem to the appropriate connectors of the
CPU Blade (see Figure 2-6 on page 2-5).
6. Connect the power cords to the AC outlets on the power supplies (see Figure
2-7, page 2-5) and the other ends to an isolated AC wall circuit. This will
cause the CoolShell 3U to power on automatically (see following Note).
Note: There is no master switch for turning power on or off. Instead, the system
becomes active when power supplies are connected to live power. Depending on
BIOS settings and the most recent state of the motherboard, it is possible that the
CPU Blade may immediately begin firmware boot followed by OS boot.
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2—Installation and Operation
Clock/I2C
PCI-Express
Power & Reset
Storage Expansion Subsystem
CPU Blade
314
25
To AC Power Sources (2)
Installation Procedures
Figure 2-6. Cable the Storage Expansion Subsystem to the CPU Blade
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Figure 2-7. Connect the Power Cords to the AC Power Supplies
2.1.3 Multiple Video Displays
Multiple video displays are supported by connecting each additional video cable to
an available video port. The I/O Blade shown in this manual supports up to six video
displays (two per PCI-Express video card); see the following Note.
Note: Any number of video displays from 1 to 6 are supported. However, note
that when the OS boots (for example, Red Hat Linux 5.2), the logical number for
each display will depend on how many displays are attached and which video
ports are used. The physical video port and the logical number assigned to it are
not a fixed relationship. Instead, this is controlled by the sequence of device discovery and enumeration during system boot.
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To Microphone
To Line In
To Line Out
To Audio Channe l A or B
2.1.4 Audio Connection
To establish an audio link, connect the stereo audio cable adapter (shipped with the
system, see Figure 2-8) to one of the two audio channels (Channel A or Channel B)
on the front panel of the CPU Blade (see Figure 1-2 on page 1-2):
2-6
Figure 2-8. Connect the Audio Cable Adapter to Channel A or Channel B
1. Plug the mini-DB9 end (male) of the audio cable adapter (P/N 116510-L01)
into Channel A or Channel B.
2. Connect a mini-stereo-phone plug (as needed) to each of the three stereo audio
connectors at the other end of the audio cable adapter as follows:
• Red Tag—Microphone (Stereo)
• Blue Tag—Line In (Stereo)
• Green Tag—Line Out (Stereo)
3. Repeat the previous two steps to establish a second audio connection.
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2.2 Operation
2.2.1 Power
The CoolShell 3U powers on automatically when AC power is supplied to any of the
two system power supplies. Once the system backplane and all other components
have received power, the motherboard will begin boot process and load the OS.
Note: If desired, the CoolShell 3U can be configured so the system will not pow-
er on automatically (full OS boot) when AC power is provided to any of the two
power supplies in the system. This configuration is done at the factory and should
be requested at the time of order.
2—Installation and Operation
2.2.1.1 Power Sequence
The CoolShell 3U has a specific power up sequence when AC power is provided to
the system. This sequence is as follows:
1. Shortly after AC is on, the +12V backplane will be present
2. This is immediately followed by the +12VSTBY and +5VSTBY rails. The
+5VSTBY power, the standby section in the PCH, as well as the BMC on the
motherboard in the CPU blade
3. After a 4s delay following the presence of +5VSTBY, a pulse is sent (PwrOn
signal) to the motherboard
4. This pulse is forwarded to the CPU carrier through the PCH and through the
ATX PSon assertion. This turns on the primary hotswap and powers on all
downstream DC converters (+12V, +5V, +3.3V, -12V)
5. If all power rails are within their nominal range, the ATX PwrOK signal is as-
serted and sent to the motherboard
6. With all power rails up and operating within their nominal range, the power
LED (green) will be lit on each component of the CoolShell 3U.
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2.2.1.2 Remote On/Off
It is possible to remotely turn the CoolShell 3U on and off through the IPMI interface. This can be done by using a web browser to access the BMC on the motherboard. The IP address of the IPMI interface is set in BIOS. When accessing the
BMC, the following options for remote power control include:
• Power cycle the server
• Power off the server (graceful shutdown of the OS and system)
• Power off the server (immediate shutdown)
2.2.2 Operation with Factory-Installed Linux
1. After the system boots (from Linux), login by entering the system ID [root]
followed by the password [root12].
2. From the screen that results after the system boots, perform the following
steps to activate all monitors, applications, system tools, and NVIDIA tools:
• Select System Tools under the Applications menu
• Select NVIDIA X Server Settings, then X Server Display Con-
figuration
• Select Monitor to activate
• Select Configure button
• Select Single Monitor
• Select Separate X Screen, then press OK
• Repeat for all monitors
• Press the Save button
• Save the xconfig file
• Press Quit
3. Log out of the system, then log back into the system, after which all monitors
should be active.
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A
Appendix
Connector Pinouts
This appendix provides connector pinouts and signal descriptions for the I/O connectors installed on the component front panels of the CoolShell 3U Generation 2.
A.1 CPU Blade
A.1.1 Power & Reset Connector
Pinouts are described in Figure A-1; signal descriptions are shown in Table A-1.
Figure A-1. Power & Reset Connector Pinout
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Table A-1. Power & Reset Connector Pinout Signal Descriptions
Pin Signal Definition Pin Signal Definition
1 Reset 4 12V
2 Ground 5 12V
3 Ground 6 12V
SEM = Storage Expansion Module
Note: The Power & Reset Connector is used to provide power and reset control
from the CPU Blade to the optional SEM (Storage Expansion Module), or other
optional subsystems to be developed in the future.
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A.1.2 PCI-Express Connector
A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13
B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13
Pinouts are described in Figure A-2; signal descriptions are shown in Table A-2.
Figure A-2. PCI-Express Connector Pinout
Table A-2. PCI-Express Connector Pinout Signal Descriptions
Pin Signal Definition Pin Signal Definition
A—Connector Pinouts
CPU Blade
B1 Ground A1 Ground
B2 SEM_PCIE_TX0_P A2 SEM_PCIE_RX0_P
B3 SEM_PCIE_TX0_N A3 SEM_PCIE_RX0_N
B4 Ground A4 Ground
B5 SEM_PCIE_TX1_P A5 SEM_PCIE_RX1_P
B6 SEM_PCIE_TX1_N A6 SEM_PCIE_RX1_N
B7 Ground A7 Ground
B8 SEM_PCIE_TX2_P A8 SEM_PCIE_RX2_P
B9 SEM_PCIE_TX2_N A9 SEM_PCIE_RX2_N
B10 Ground A10 Ground
B11 SEM_PCIE_TX3_P A11 SEM_PCIE_RX3_P
B12 SEM_PCIE_TX3_N A12 SEM_PCIE_RX3_N
B13 Ground A13 Ground
SEM = Storage Expansion Module
Note: The PCI-Express Connector is used to provide data transfer between and
the CPU Blade and the optional SEM (Storage Expansion Module), or other op-
tional subsystems to be developed in the future.
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8642
A.1.3 Clock & I2C Bus Connector (Firewire 1394)
Pinouts are described in Figure A-3; signal descriptions are shown in Table A-3.
Figure A-3. Clock & I2C Connector Pinout
Table A-3. Clock & I2C Connector Pinout Signal Descriptions
Pin Signal Pin Signal
1 SEM_SCL 2 SEM_PCIE_CLK_P
3GND 4GND
5 SDA 6 PCIE-CLK_N
7N/C 8N/C
SEM = Storage Expansion Module
Note: The Clock & I2C Connector is used to provide I2C bus and ancillary signaling for the PCI-Express bus between the CPU Blade to the optional Storage
Expansion Subsystem, or other optional subsystems to be developed in the future.
A-4
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A.1.4 DVI Power Connector (DVI Transceiver)
Pinouts are described in Figure A-1; signal descriptions are shown in Table A-1.
A—Connector Pinouts
CPU Blade
Figure A-4. Power & Reset Connector Pinout
Table A-4. Power & Reset Connector Pinout Signal Descriptions
Pin Signal Definition Pin Signal Definition
1 GND 2 GND
35V 45V
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Receive
Transmit
SFP Transceiver
CPU Blade
x1 PCIe link
I
2
C 4-wire interface
Channel A / Channel B
51
96
A.1.5 Optical SFP Ports
The CPU blade has two optical SFP ports on the front of the CPU blade for the purpose I2C 4-wire interface (100Mbits/s), and x1 PCIe link transfer. These ports are
intended for an expansion unit to be used in conjunction with the CoolShell 3U.
Figure A-5. Optical SFP Port–CPU Blade
A.1.6 Stereo Audio Connectors
The CPU Blade has two audio connectors: Stereo Channel A and Stereo Channel B.
Pinouts are described in Figure A-6; signal descriptions are shown in Table A-5. Use
the special audio cable adapter (male mini-DB9 to three stereo audio connectors) to
connect to microphone, line-in, and line-out cables (see Figure 2-8 on page 2-6).
Figure A-6. Stereo Audio Connector Pinout
Table A-5. Stereo Audio Connector Pinout Signal Descriptions
Pin Signal Definition Pin Signal Definition
1 Line-In_L 6 Ground—Line-In
2 Line-In_R 7 Line-Out_L
3 Ground—Line-Out 8 Line-Out_R
4 MIC_L 9 Ground—MIC
A-6
5MIC_R
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A.1.7 IPMI LAN Port
18
The CoolShell 3U supports one RJ45 Gigabit Ethernet LAN port connector on the
front of the CPU module for the purpose of accessing IPMI (see Figure A-7). Pinout
signal descriptions are listed in Table A-6.
Figure A-7. Ethernet Connector, Type RJ45
Table A-6. RJ45 Ethernet Pinout Signals
A—Connector Pinouts
CPU Blade
Pin Signal Name Pin Signal Name
1 IPMI_DA+ 5 IPMI_DC-
2IPMI-DA- 6IPMI_DB-
3 IPMI_DB+ 7 IPMI_DD+
4IPMI_DC+ 8IPMI_DD-
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USB Ports
Symbol
USB 1USB 0
A.2 I/O Blade
Up to three NVIDIA Quadro K2000D graphics cards are installed on an I/O Blade.
Each card supports two DVI video output connectors. In addition, associated with
each card is one pair of USB 2.0 connectors.
A.2.1 USB 2.0 Connectors
With three NVIDIA Quadro K2000D graphics cards installed, the I/O Blade can
support a total of six USB connectors (two per installed graphics card).
Pinouts are described in Figure A-8; signal descriptions are shown in Table A-7.
Figure A-8. USB 2.0 Connector Pinout
Table A-7. USB 2.0 Connector Pinout Signal Descriptions
Pin Signal Name Pin Signal Name
1+5V 3PO+
2PO– 4GND
A.2.2 DVI Video Output Connector
With three NVIDIA Quadro K2000D graphics cards installed, the I/O Blade supports up to six Dual Link DVI-I (digital/analog) video connectors (two per graphics
card).
A-8
Pinouts are described in Figure A-9 on page A-9; signal descriptions are shown in
Table A-8 on page A-9.
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A—Connector Pinouts
Figure A-9. Video Connector Pinout
Table A-8. Video Connector Pinout Signal Descriptions
I/O Blade
Pin Signal Definition Pin Signal Definition
1 TDMS Data2– 16 Hot Plug Detect
2 TDMS Data2+ 17 TDMS Data0–
3 TDMS Data2/4 Shield 18 TDMS Data0+
4 No Connection 19 TDMS Data0/5 Shield
5Ground 20No Connection
6 DDC clock 21 No Connectio n
7 DDC data 22 TDMS Clock Shield
8 Analog VSYNC 23 TDMS Clock+
9 TDMS Data1– 24 TDMS Clock–
10 TDMS Data1+ C1 Analog R
11 TDMS Data1/3 Shield C2 Analog G
12 No Connection C3 Analog B
13 No Connection C4 Analog HSYNC
14 +5V Power C5 Analog GND
15 Ground
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Symbol
1
8
5786
1342
Primary PXE port for network boot
Secondary PXE port for network boot
LED Port 1
52 63 74 8
Port
A.3 Media Module
Note: All Ethernet ports and all USB ports in the Media Module have independent controllers. This is significant for applications that require separate security
enclaves within a single computer system.
A.3.1 Copper Gigabit Ethernet Ports
The CoolShell 3U supports eight copper RJ45 Gigabit Ethernet connectors. Each of
the top four connectors contains two status LED indicators one (on the left) indicates
lower (primary) RJ45 port activity, and one (on the ri ght) indicates upper (secondary) RJ45 port activity.
Pinouts are described in Figure A-10 on page A-10; signal descriptions and LED
interpretations are given in Table A-9 on page A-11.
Pinout signal descriptions and LED interpretations are given in Table A-9 on page A-
11.
A-10
Figure A-10. Copper Gigabit Ethernet Connector Pinout
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A—Connector Pinouts
Media Module
Table A-9. Copper Gigabit Ethernet Connector Pinout Signals and LED Interpretation
Pin Signal Description LED Interpretation
1 TRD0+ Transmit/Receive Data 0 +
2 TRD0- Transmit/Receive Data 0 –
Upper
Left
3 TRD1+ Transmit/Receive Data 1 +
4 TRD2+ Transmit/Receive Data 2 +
5 TRD2- Transmit/Receive Data 2 –
Activity on indicated
lower (primary) port
6 TRD1- Transmit/Receive Data 1 –
7 TRD3+ Transmit/Receive Data 3 +
8 TRD3- Transmit/Receive Data 3 –
A.3.2 Optical Gigabit Ethernet Ports
The CoolShell 3U supports seven optical Gigabit Ethernet connectors.
Note: SFP (Small Form-Factor Pluggable) transceiver ports are provided with
optical Ethernet ports.
Port designations are described in Figure A-11 on page A-12.
Upper
Right
Activity on indicated
upper (secondary) port
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2345671
SFP Transceiver
Receive Transmit
Port
USB Port
Symbol
Figure A-11. Optical Gigabit Ethernet Connector Pinout
Note: The seven optical Ethernet ports are alternate connections for the first sev-
en copper Ethernet ports described in section “Copper Gigabit Ethernet Ports” on
page A-10. For example, if optical Ethernet port 3 is connected, then copper
Ethernet port 3 must not be connected, and vice versa.
A.3.3 USB 2.0 Connectors
The Media Module contains six USB 2.0 connectors. Pinouts are described in
Figure A-12; signal descriptions are shown in Table A-10.
Figure A-12.
Table A-10. USB 2.0 Connector Pinout Signal Descriptions
Pin Signal Name Pin Signal Name
1+5V 3PO+
2PO– 4GND
USB 2.0 Connector Pinout
A-12
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A.4 Storage Expansion Subsystem
654321
The three connectors of the Storage Expansion Subsystem (Module) front panel are
cabled directly to similar ports on the CPU Blade.
A.4.1 Power & Reset Connector
Pinouts are described in Figure A-13; signal descriptions are shown in Table A-11.
Figure A-13. Power & Reset Connector Pinout
A—Connector Pinouts
Table A-11. Power & Reset Connector Pinout Signal Descriptions
Pin Signal Definition Pin Signal Definition
1 +12V Short Pin 4 Ground
2 +12V 5 Ground
3 +12V In 6 Reset
A.4.2 PCI-Express Connector
The PCI-Express connector has the same pinout and signal descriptions as the SAS
connector on the CPU Blade (see Section A.1.2, “PCI-Express Connector,” on page
A-3).
A.4.3 Clock & I2C Bus Connector (Firewire 1394)
The Clock & I2C Bus connector has the same pinout and signal descriptions as the
Clock & I2C Bus connector on the CPU Blade (see Section A.1.3, “Clock & I2C
Bus Connector (Firewire 1394),” on page A-4).
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B
BIOS
Section
B.1 Introduction
Appendix
BIOS Setup Utility
This chapter describes the AMI BIOS Setup Utility for the CoolShell 3U Generation
2 motherboard X9DRi-F. The AMI ROM BIOS is stored in a Flash EEPROM and
can be easily updated. This chapter describes the basic navigation of the AMI BIOS
Setup Utility setup screens.
B.1.1 Starting BIOS Setup Utility
To enter the AMI BIOS Setup Utility screens, press the <Delete> key while the system is booting up.
Note: In most cases, the <Delete> key is used to invoke the AMI BIOS setup
screen. There are a few cases when other keys are used, such as <F3>, <F4>, etc.
Each main BIOS menu option is described in this manual. The Main BIOS setup
menu screen has two main frames. The left frame displays all the options that can be
configured. Grayed-out options cannot be configured. Options in blue can be configured by the user. The right frame displays the key legend. Above the key legend is an
area reserved for a text message. When an option is selected in the left frame, it is
highlighted in white. Often a text message will accompany it
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.
Note: The AMI BIOS has default text messages built in. Supermicro retains the
option to include, omit, or change any of these text messages.
The AMI BIOS Setup Utility uses a key-based navigation system called “hot keys”.
Most of the AMI BIOS setup utility “hot keys” can be used at any time during the
setup navigation process. These keys include <F3>, <F4>, <Enter>, <ESC>, arrow
keys, etc.
Note: <F3> is used to load optimal default settings. <F4> is used to save the current settings and exit the setup utility.
Note: Options printed in Bold are default settings.
B.1.2 How To Change the Configuration Data
The configuration data that determines the system parameters may be changed by
entering the AMI BIOS Setup utility. This Setup utility can be accessed by pressing
<F2> at the appropriate time during system boot.
B.1.3 Starting the Setup Utility
Normally, the only visible Power-On Self-Test (POST) routine is the memory test.
As the memory is being tested, press the <F2> key to enter the main menu of the
AMI BIOS Setup Utility. From the main menu, you can access the other setup
screens. An AMI BIOS identification string is displayed at the left bottom corner of
the screen below the copyright message.
Caution: Do not upgrade the BIOS unless your system has a BIOS-related issue.
Flashing the wrong BIOS can cause irreparable damage to the system. In no event
shall Supermicro be liable for direct, indirect, special, incidental, or consequential
damages arising from a BIOS update. If you have to update the BIOS, do not shut
down or reset the system while the BIOS is updating. This is to avoid possible boot
failure.
B-2
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B.2 Main Setup
When you first enter the AMI BIOS Setup Utility, you will enter the Main setup
screen. You can always return to the Main setup screen by selecting the Main tab on
the top of the screen. The Main BIOS Setup screen is shown below.
B—BIOS Setup Utility
B.2.1 System Overview
The following BIOS information will be displayed:
B.2.1.1 System Time/System Date
Use this option to change the system time and date. Highlight System T ime or System
Date using the arrow keys. Enter new values through the keyboard and press
<Enter>. Press the <Tab> key to move between fields. The date must be entered in
Day MM/DD/YY format. The time is entered in HH:MM:SS format.
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Figure B-1.
Main BIOS Setup Screen
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Note: The time is in the 24-hour format. For example, 5:30 P.M. appears as
17:30:00.).
B.2.1.2 Supermicro X9DRi
• BIOS Build Version: This item displays the BIOS revision used in your system.
• BIOS Build Date: This item displays the date when this BIOS was completed.
• Memory Information: This displays the amount of memory that is available in
the system.
B-4
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B.3 Advanced Setup Configurations
Use the arrow keys to select Boot Setup and hit <Enter> to access the submenu:
B—BIOS Setup Utility
B.3.1 BOOT Features
B.3.1.1 Quiet Boot
This option allows the bootup screen options to be modified between POST messages or the OEM logo. Select Disabled to display the POST messages. Select
Enabled to display the OEM logo instead of the normal POST messages. The
options are Enabled (default) and Disabled.
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Figure B-2.
Advanced Settings Screen
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B.3.1.2 AddOn ROM Display Mode
This sets the display mode for the Option ROM. Select Keep Current to use the current AddOn ROM Display setting. Select Force BIOS to use the Option ROM display mode set by the system BIOS. The options are Force BIOS (default) and Keep
Current.
B.3.1.3 Bootup Num-Lock
This feature selects the Power-on state for Numlock key. The options are Off and On
(default).
B.3.1.4 Wait For 'F1' If Error
This forces the system to wait until the 'F1' key is pressed if an error occurs. The
options are Disabled and Enabled (default).
B.3.1.5 Interrupt 19 Capture
Interrupt 19 is the software interrupt that handles the boot disk function. When this
item is set to Enabled, the ROM BIOS of the host adaptors will “capture” Interrupt
19 at boot and allow the drives that are attached to these host adaptors to function as
bootable disks. If this item is set to Disabled, the ROM BIOS of the host adaptors
will not capture Interrupt 19, and the drives attached to these adaptors will not function as bootable devices. The options are Enabled (default) and Disabled.
B.3.2 Power Configuration
B.3.2.1 Power Button Function
If set to Instant_Off, the system will power off immediately as soon as the user hits
the power button. If set to 4_Second_Override, the system will power off when the
user presses the power button for 4 seconds or longer. The options are Instant_Off
(default) and 4_Second_Override.
B.3.2.2 Restore on AC Power Loss
Use this feature to set the power state after a power outage. Select Power-Off for the
system power to remain off after a power loss. Select Power-On for the system
power to be turned on after a power loss. Select Last State to allow the system to
resume its last state before a power loss. The options are Power-On, Power-Off and
Last State (default).
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Advanced Setup Configurations
B.3.3 CPU Configuration
This submenu displays the information of the CPU as detected by the BIOS. It also
allows the user to configure CPU settings.
B.3.3.1 Socket 1 CPU Information/Socket 2 CPU Information
This submenu displays the following information regarding the CPUs installed in
Socket 1/Socket 2.
• Type of CPU
• CPU Signature
• Microcode Patch
• CPU Stepping
• Maximum CPU Speed
• Minimum CPU Speed
B—BIOS Setup Utility
• Processor Cores
• Intel HT (Hyper-Threading) Technology
• Intel VT-x Technology
• Intel SMX Technology
• L1 Data Cache
• L1 Code Cache
• L2 Cache
• L3 Cache
B.3.3.2 CPU Speed
This item displays the speed of the CPU installed in Socket 1/Socket 2.
B.3.3.3 64-bit
This item indicates if the CPU installed in Socket 1 or Socket 2 support 64-bit technology.
B.3.3.4 Clock Spread Spectrum
Select Enable to enable Clock Spectrum support, which will allow the BIOS to monitor and attempt to reduce the level of Electromagnetic Interference caused by the
components whenever needed. The options are Disabled (default) and Enabled.
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B.3.3.5 Hyper-threading
Select Enabled to support Intel Hyper-threading Technology to enhance CPU performance. The options are Enabled (default) and Disabled.
B.3.3.6 Active Processor Cores
Set to Enabled to use a processor’s second core and above. The options are All
(default), 1, 2, 4, and 6.
B.3.3.7 Limit CPIUID Maximum
This feature allows the user to set the maximum CPUID value. Enable this function
to boot legacy operating systems that cannot support processors with extended
CPUID functions. The options are Enabled and Disabled (default)(for Windows OS)
B.3.3.8 Execute-Disable Bit Capability
Available if supported by the OS & CPU.
Select Enabled to enable the Execute Diable Bit which will allow the processor to
designate areas in the system memory where an application code can execute and
where it cannot, thus preventing a worm or a virus from flooding illegal codes to
overwhelm the processor and damage the system during an attack. The default is
Enabled (Refer to Intel and Microsoft web sites for more information).
B.3.3.9 Hardware Prefetcher
Available when supported by the CPU.
If set to Enabled, the hardware prefetcher will prefetch streams of data and instruc-
tions from the main memory to the L2 cache to improve CPU performance. The
options are Disabled and Enabled (default).
B.3.3.10 Adjacent Cache Line Prefetch
Available when supported by the CPU.
If this feature is set to Disabled, The CPU prefetches the cache line for 64 bytes. If
this feature is set to Enabled the CPU fetches both cache lines for 128 bytes as comprised. The options are Disabled and Enabled (default).
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B.3.3.11 DCU Streamer Prefetcher
Available if supported by the CPU.
Select Enabled to support Data Cache Unite (DCU) prefetch of L1 data to speed up
data accessing and processing in the DCU to enhance CPU performance. The
options are Disabled and Enabled (default).
B.3.3.12 DCU IP Prefetcher
Select Enabled for DCU (Data Cache Unit) IP Prefetcher support, which will
prefetch IP addresses to improve network connectivity and system performance. The
options are Enabled (default) and Disabled.
B.3.3.13 Intel® Virtualization Technology
Available if supported by the CPU.
B—BIOS Setup Utility
Advanced Setup Configurations
Select Enabled to support Intel V irtualization Technology, which will allow one platform to run multiple operating systems and applications in independent partitions,
creating multiple “virtual” systems in one physical computer. The options are
Enabled (default) and Disabled.
Note: If there is any change to this setting, you will need to power off and restart
the system for the change to take effect. Please refer to Intel’s website for detailed
information.
B.3.4 CPU Power Management Configuration
This submenu allows the user to configure the following CPU Power Management
settings.
B.3.4.1 Power Technology
Select Energy Efficiency to support power-saving mode. Select Custom to customize system power settings. Select Disabled to disable power-saving settings. The
options are Disabled, Energy Efficient (default), and Custom. If the option is set to
Custom, the following items will display:
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B.3.4.1.1 EIST
Available when Power Technology is set to custom.
EIST (Enhanced Intel SpeedStep Technology) allows the system to automati-
cally adjust processor voltage and core frequency to reduce power consumption
and heat dissipation. The options are Disabled (GV3 Disabled), and Enabled
(GV3 Enabled) (default).
Note: GV3 is Intel SpeedStep support used on older platforms. Please refer to Intel’s website for detailed information.
B.3.4.1.2 Turbo Mode
Available when Power Technology is set to custom.
Select Enabled to use the Turbo Mode to boost system performance. The options
are Enabled (default) and Disabled.
B.3.4.1.3 P-STATE Coordination
Available when Power Technology is set to custom.
This feature selects the type of coordination for the P-State of the processor. P-
State is a processor operational state that reduces the processor's voltage and frequency. This makes the processor more energy efficient, resulting in further
gains. The options are HW_ALL (default), SW_ALL and SW-ANY.
B.3.4.1.4 CPU C3 Report
Available when Power Technology is set to custom.
Select Enabled to allow the BIOS to report the CPU C3 State (ACPI C2) to the
operating system. During the CPU C3 State, the CPU clock generator is turned
off. The options are Enabled and Disabled (default).
B.3.4.1.5 CPU C6 Report
Available when Power Technology is set to custom.
Select Enabled to allow the BIOS to report the CPU C6 State (ACPI C3) to the
operating system. During the CPU C6 State, the power to all cache is turned off.
The options are Enabled (default) and Disabled.
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B.3.4.1.6 CPU C7 Report
Available when Power Technology is set to custom.
Select Enabled to allow the BIOS to report the CPU C7 State (ACPI C3) to the
operating system. CPU C7 State is a processor-specific low C-St ate. The options
are Enabled and Disabled (default).
B.3.4.1.7 Package C-State Limit
Available when Power Technology is set to custom.
This feature allows the user to set the limit on the C-State package register. The
options are C0, C2, C6, C7, and No Limit (default).
B.3.4.2 Energy/Performance Bias
This setting allows the user to adjust the fan speed based on performance (maximum
cooling) or energy efficiency (quietest fan speed). The options are Performance, Balanced Performance, Balanced Energy, and Energy Efficient (default).
B—BIOS Setup Utility
Advanced Setup Configurations
B.3.4.3 Factory Long Duration Power Limit
This item displays the power limit set by the manufacturer during which long duration power is maintained.
B.3.4.4 Long Duration Maint ained
This item displays the period of time during which long duration power is maintained. The default setting is 0.
B.3.4.5 Recommended Short Duration Power
This item displays the short duration power settings recommended by the manufacturer.
B.3.4.6 Short Duration Power Limit
This item displays the time period during which short duration power is maintained.
The default setting is 0.
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B.3.5 Chipset Configuration
North Bridge
This feature allows the user to configure the settings for the Intel North Bridge.
Integrated IO Configuration
B.3.5.1 Intel VT-d
Select Enabled to enable Intel V irtualization Technology support for Direct I/O VT-d
by reporting the I/O device assignments to the VWM (Virtual Working Memory)
throughout the DMAR ACPI Tables. This feature offers fully-protected I/O resource
sharing across Intel platforms, providing greater reliability, security, and availability
in networking and data-sharing. The options are Enabled (default) and Disabled.
B.3.5.2 Intel® I/OAT
Select Enabled to enable Intel I/OAT (I/O Acceleration Technology), which significantly reduces CPU overhead by leveraging CPU architectural improvements and
freeing the system resource for other tasks. The options are Disabled and Enabled
(default).
B.3.5.3 DCA Support
When set to Enabled, this feature uses Intel’s DCA (Direct Cache Access) Technology to improve data transfer efficiency. The default is Enabled and can not be
changed.
B.3.5.4 IIOH 0 PCIe Port Bifurcation Control
This submenu allows the user to configure the following 8 PCIe Port Bifurcation
Control settings for the IOH 0 PCI-Exp port. This feature determines how to distribute the available PCI-Express lanes to the PCI-E Root Ports.
B.3.5.5 IOU1-PCIe Port
This feature allows the user to set the PCI-Exp bus speed between IOU1 and PCI-e
port. The options are x4x4 (default) and x8.
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B.3.5.6 Port 1A Link Speed
Select GEN1 to enable PCI-Exp Generation 1 support for Port 1A. Select GEN2 to
enable PCI-Exp Generation 2 support for Port 1A. Select GEN3 to enable PCI-Exp
Generation 3 support for Port 1A. The options are GEN1, GEN2 (default), and
GEN3.
B.3.5.7 Port 1B Link Speed
Select GEN1 to enable PCI-Exp Generation 1 support for Port 1B. Select GEN2 to
enable PCI-Exp Generation 2 support for Port 1B. Select GEN3 to enable PCI-Exp
Generation 3 support for Port 1B. The options are GEN1, GEN2 (default), and
GEN3.
B.3.5.8 IOU2-PCIe Port
This feature allows the user to set the PCI-Exp bus speed between IOU2 and PCIe
port. The options are x4x4x4x4, x4x4x8, x8x4x4, x8x8, and x16 (default), and Auto.
B—BIOS Setup Utility
Advanced Setup Configurations
B.3.5.9 Port 2A Link Speed
Select GEN1 to enable PCI-Exp Generation 1 support for Port 2A. Select GEN2 to
enable PCI-Exp Generation 2 support for Port 2A. Select GEN3 to enable PCI-Exp
Generation 3 support for Port 2A. The options are GEN1, GEN2 (default), and
GEN3.
B.3.5.10 IOU3-PCIe Port
This feature allows the user to set the PCI-Exp bus speed between IOU3 and PCIe
port. The options are x4x4x4x4, x4x4x8, x8x4x4, x8x8 (default), and x16, and Auto.
B.3.5.11 Port 3A Link Speed
Select GEN1 to enable PCI-Exp Generation 1 support for Port 3A. Select GEN2 to
enable PCI-Exp Generation 2 support for Port 3A. Select GEN3 to enable PCI-Exp
Generation 3 support for Port 3A. The options are GEN1, GEN2 (default), and
GEN3.
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B.3.5.12 Port 3C Link Speed
Select GEN1 to enable PCI-Exp Generation 1 support for Port 3C. Select GEN2 to
enable PCI-Exp Generation 2 support for Port 3C. Select GEN3 to enable PCI-Exp
Generation 3 support for Port 3C. The options are GEN1, GEN2 (default), and
GEN3.
B.3.5.13 IOH 1 PCIe Port Bifurcation Control
This submenu allows the user to configure the following 6 PCIe Port Bifurcation
Control settings for the IOH 1 PCI-Exp port. This feature determines how to distribute the available PCI-Express lanes to the PCI-E Root Ports.
B.3.5.14 IOU1-PCIe Port
This feature allows the user to set the PCI-Exp bus speed between IOU1 and PCI-e
port. The options are x4x4 and x8 (default).
B.3.5.15 Port 1A Link Speed
Select GEN1 to enable PCI-Exp Generation 1 support for Port 1A. Select GEN2 to
enable PCI-Exp Generation 2 support for Port 1A. Select GEN3 to enable PCI-Exp
Generation 3 support for Port 1A. The options are GEN1, GEN2 (default), and
GEN3.
B.3.5.16 IOU2-PCIe Port
This feature allows the user to set the PCI-Exp bus speed between IOU2 and PCIe
port. The options are x4x4x4x4, x4x4x8, x8x4x4, x8x8, and x16 (default), and Auto.
B.3.5.17 Port 2A Link Speed
Select GEN1 to enable PCI-Exp Generation 1 support for Port 2A. Select GEN2 to
enable PCI-Exp Generation 2 support for Port 2A. Select GEN3 to enable PCI-Exp
Generation 3 support for Port 2A. The options are GEN1, GEN2 (default), and
GEN3.
B.3.5.18 IOU3-PCIe Port
This feature allows the user to set the PCI-Exp bus speed between IOU3 and PCIe
port. The options are x4x4x4x4, x4x4x8, x8x4x4, x8x8, and x16 (default), and Auto.
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B.3.5.19 Port 3A Link Speed
Select GEN1 to enable PCI-Exp Generation 1 support for Port 3A. Select GEN2 to
enable PCI-Exp Generation 2 support for Port 3A. Select GEN3 to enable PCI-Exp
Generation 3 support for Port 3A. The options are GEN1, GEN2 (default), and
GEN3.
QPI Configuration
B.3.5.20 Current QPI Link
This item displays the current status of the QPI Link.
B.3.5.21 Current QPI Frequency
This item displays the frequency of the QPI Link.
B—BIOS Setup Utility
Advanced Setup Configurations
B.3.5.22 QPI (Quick Path Interconnect) Link Speed Mode
Use this feature to select the data transfer speed for the QPI Link connections. The
options are Fast (default) and Slow.
B.3.5.23 QPI Link Frequency Select
Use this feature to select the desired QPI frequency. The options are Auto (default),
6.4 GT/s, 7.2 GT/s, and 8.0 GT/s.
DIMM Configuration
This section displays the following DIMM information.
B.3.5.24 Total Memory
This item displays the total memory size available in the system.
B.3.5.25 Current Memory Mode
This item displays the current memory mode.
B.3.5.26 Current Memory Speed
This item displays the current memory speed.
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B.3.5.27 Mirroring
This item displays if memory mirroring is supported by the motherboard. Memory
mirroring creates a duplicate copy of the data stored in the memory to enhance data
security.
B.3.5.28 Sparing
This item displays if memory sparing is supported by the motherboard. Memory
sparing enhances system performance.
DIMM Information
B.3.5.29 CPU Socket 1 DIMM Information / CPU Socket 2 DIMM Infor-
mation
The status of the memory modules detected by the BIOS will be displayed as
detected by the BIOS.
B.3.5.30 Memory Mode
When Independent is selected, all DIMMs are available to the operating system.
When Mirroring is selected, the motherboard maintains two identical copies of all
data in memory for data backup. When Lockstep is selected, the motherboard uses
two areas of memory to run the same set of operations in parallel. The options are
Independent (default), Mirroring, and Lockstep.
B.3.5.31 DRAM RAPL BWLIMIT
This item sets the limits on the average power consumption and the bandwidth of a
DRAM module in operation so that the OS can manage power consumption and
energy budget of hardware more effectively within a certain window of time. The
options are 0, 1 (default), 8, and 16.
B.3.5.32 Perfmom and DFX Devices
A PerfMon device monitors the activities of a remote system such as disk usage,
memory consumption, and CPU load which will allow an IT administrator to maximize the performance of each computer within the network. A DFX device, usually
in the form of a USB adaptor, can be used to enhance audio performance. Select
Unhide to display the Perfmon and DXF devices installed in the system. The options
are HIDE (default) and UNHIDE.
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B.3.5.33 DRAM RAPL Mode
RAPL which stands for Running Average Power Limit is a feature that provides
mechanisms to enforce power consumption limits on supported processors The
options are DRAM RAPL MODE0, DRAM RAPL MODE1 (default), and Disabled.
B.3.5.34 MPST Support
Select Enabled to enable the Message Processing Subscriber Terminal which is used
to process short messages. The options are Disabled (default) and Enabled.
B.3.5.35 DDR Speed
Use this feature to force a DDR3 memory module to run at a frequency other than
what is specified in the specification. The options are Auto (default), Force DDR3800, Force DDR3-1066, Force DDR3-1333, Force DDR3-1600 and Force SPD.
B—BIOS Setup Utility
Advanced Setup Configurations
B.3.5.36 Channel Interleaving
This feature selects from the different channel interleaving methods. the options are
Auto (default), 1 Way, 2 Way, 3 Way, and 4 Way.
B.3.5.37 Rank Interleaving
This feature allows the user to select a rank memory interleaving method. The
options are Auto (default), 1 Way, 2 Way, 3 Way, 4 Way, and 8 Way.
B.3.5.38 Patrol Scrub
Patrol Scrubbing is a process that allows the CPU to correct correctable memory
errors detected on a memory module and send the correction to the requestor (the
original source). When this item is set to Enabled, the IO hub will read and write
back one cache line every 16K cycles, if there is no delay caused by internal processing. By using this method, roughly 64 GB of memory behind the IO hub will be
scrubbed every day. The options are Enabled (default) and Disabled.
B.3.5.39 Demand Scrub
Demand Scrubbing is a process that allows the CPU to correct correctable memory
errors found on a memory module. When the CPU or I/O issues a demand-read command, and the read data from memory turns out to be a correctable error, the error is
corrected and sent to the requestor (the original source). Memory is updated as well.
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Select Enabled to use Demand Scrubbing for ECC memory correction. The options
are Enabled and Disabled (default).
B.3.5.40 Data Scrambling
Select Enabled to enable data scrambling to ensure data security and integrity. The
options are Disabled (default) and Enabled.
B.3.5.41 DRAM RAPL
RAPL which stands for Running Average Power Limit is a feature that provides
mechanisms to enforce power consumption limits on supported processors The
options are Mode 0, MODE1 (default), and Disabled.
B.3.5.42 Device Tagging
Select Enabled to support device tagging. The options are Disabled (default) and
Enabled.
B.3.5.43 Thermal Throttling
Throttling improves reliability and reduces power consumption in the processor via
automatic voltage control during processor idle states. The options are Disabled and
CLTT (Closed Loop Thermal Throttling) (default).
B.3.5.44 OLTT Peak BW %
Use this feature to set a percentage of the peak bandwidth allowed for OLTT . Enter a
number between 25 to 100 (%).The default setting is 50 (default).
South Bridge Configuration
This feature allows the user to configure the settings for the Intel PCH chip.
B.3.5.45 PCH Information
This feature displays the following PCH information:
• Name: This item displays the name of the PCH chip.
• Stepping: This item displays the status of the PCH stepping.
• USB Devices: This item displays the USB devices detected by BIOS.
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B.3.5.46 All USB Devices
This feature enables all USB ports/devices. The options are Disabled and Enabled
(default). If set to Enabled, EHCI Controller 1 and Controller 2 will appear.
B.3.5.46.8 EHCI Controller 1/EHCI Controller 2
Select Enabled to enable EHCI (Enhanced Host Controller Interface) Controller
1 or Controller 2. The options are Disabled and Enabled (default).
B.3.5.47 Legacy USB Support
Available when USB Functions is not Disabled.
Select Enabled to support legacy USB devices. Select Auto to diable legacy support
if USB devices are not present. Select Disable to have USB devices available for EFI
(Extensive Firmware Interface) Applications only. The settings are Disabled,
Enabled (default), and Auto.
B—BIOS Setup Utility
Advanced Setup Configurations
B.3.5.48 Port 60/64 Emulation
Select Enabled to enable I/O port 60h/64h emulation support for legacy USB keyboard so that it can be fully supported by the operating system that does not recognize a USB device. The options are Disabled (default) and Enabled.
B.3.5.49 EHCI Hand-Off
This item is for operating systems that do not support Enhanced Host Controller
Interface (EHCI) hand-off. When enabled, EHCI ownership change will be claimed
by the EHCI driver. The options are Disabled (default) and Enabled.
B.3.6 SATA Configuration
When this submenu is selected, the AMI BIOS automatically detects the presence of
IDE or SATA devices and displays the following items:
B.3.6.1 SATA Port0~SATA Port5
The AMI BIOS displays the status of each SATA port as detected by the BIOS.
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B.3.6.2 SATA Mode
Use this feature to configure SATA mode for a selected SATA port. The options are
Disabled, IDE Mode, AHCI Mode (default), and RAID Mode. The following are
displayed depending on your selection:
IDE Mode
The following items are displayed when IDE Mode is selected:
B.3.6.2.9 Serial-ATA (SATA) Controller 0~1
Use this feature to activate or deactivate the SATA controller, and set the compatibility mode. The options for SATA Controller 0 or Disabled, Enhanced, and
Compatible (default). The options for SATA Controller 1 are Disabled and
Enhanced (default).
AHCI Mode
The following items are displayed when the AHCI Mode is selected:
B.3.6.2.10 Aggressive Link Power Management
Select Enabled to enable Aggressive Link Power Management support for Cougar Point B0 stepping and beyond. The options are Enabled (default) and Disabled.
B.3.6.2.11 Port 0~5 Hot Plug
Select Enabled to enable hot-plug support for a particular port, which will allow
the user to change a hardware component or device without shutting down the
system. The options are Enabled and Disabled (default).
B.3.6.2.12 Staggered Spin Up
Select Enabled to enable Staggered Spin-up support to prevent excessive power
consumption caused by multiple HDDs spinning-up simultaneously . The options
are Enabled and Disabled (default).
RAID Mode
The following items are displayed when RAID Mode is selected:
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Advanced Setup Configurations
B.3.6.2.13 PCH RAID CodeBase
Set this item to Intel or LSI to specify the codebase to be used for RAID support.
The options are Intel and LSI.
B.3.6.2.14 Port 0~5 Hot Plug
Select Enabled to enable hot-plug support for the particular port. The options are
Enabled and Disabled (default).
B.3.7 SCU (Storage Control Unit) Configuration
If a SCU is detected in the system, the following items will be displayed.
B.3.7.1 Storage Controller Unit Devices
Select Enabled to enable support for PCH SCU (System Configuration Utility)
devices. The options are Disabled and Enabled (default).
B—BIOS Setup Utility
B.3.7.2 OnChip SCU Option ROM
Select Enabled to support the onboard SCU Option ROM to boot up the system via a
storage device. The options are Disabled and Enabled (default).
B.3.7.3 SCU Port 0~SCU Port 7
The AMI BIOS will automatically detect the onboard SCU devices and display the
status of each SCU device as detected.
B.3.8 Thermal Configuration
B.3.8.1 Thermal Management
Select Enabled to initialize the PCH Thermal subsystem device. The options are
Enabled and Disabled (default).
B.3.8.2 ME SMBus Thermal Reporting
This feature appears when Thermal Management is set to Enabled. Select Enabled to
support ME SMBus (Management Engine System Management Bus) reporting. The
options are Enabled and Disabled (default). When Enabled, the following appear:
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B.3.8.2.15 PCH Temp Read, CPU Energy Read, CPU Temp Read
Set the above items to Enabled to activate these monitors. The options are
Enabled (default) and Disabled.
B.3.8.2.16 Alert Enable Lock
Set this item to Enabled to lock all Alert Enable settings. The options are
Enabled and Disabled (default). If set to Enabled, the following options appear.
B.3.8.2.17 PCH Alert, DIMM Alert
Set the above items to enabled to activate the corresponding pins. The options
are Enabled and Disabled (default).
B.3.9 PCIe/PCI/PnP Configuration
This submenu allows the user to configure the following PCIe/PCI/PnP settings.
B.3.9.1 PCI ROM Priority
Use this feature to select the Option ROM to boot the system when there are multiple
option ROMs available in the system. The options are EFI Compatible ROM and
Legacy ROM (default).
B.3.9.2 PCI Latency Timer
This feature sets the latency Timer of each PCI device installed on a PCI bus. Select
64 to set the PCI latency to 64 PCI clock cycles. The options are 32, 64 (default), 96,
128, 160, 192, 224 and 248.
B.3.9.3 Above 4G Decoding
Available if the system supports 64-bit PCI decoding
Select Enabled to decode a PCI device that supports 64-bit in the space above 4G
address. The options are Enabled and Disabled (default).
B.3.9.4 PERR# Generation
Select Enabled to allow a PCI device to generate a PERR number for a PCI Bus Signal Error Event. The options are Enabled (default) and Disabled.
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B.3.9.5 SERR# Generation
Select Enabled to allow a PCI device to generate a SERR number for a PCI Bus Signal Error Event. The options are Enabled (default) and Disabled.
B.3.9.6 Maximum Payload
Select Auto to allow the system BIOS to automatically set the maximum payload
value for a PCI-E device to enhance system performance. The options are Auto
(default), 128 bytes and 256 bytes.
B.3.9.7 Maximum Read Request
Select Auto to allow the system BIOS to automatically set the maximum Read
Request size for a PCI-E device to enhance system performance. The options are
Auto (default), 128 Bytes, 256 Bytes, 512 Bytes, 1024 Bytes, 2048 Bytes, and 4096
Bytes.
B—BIOS Setup Utility
Advanced Setup Configurations
B.3.9.8 ASPM Support
This feature allows the user to set the Active State Power Management (ASPM)
level for a PCI-E device. Select Force L0 to force all PCI-E links to operate a L0
state. Select Auto to allow the system BIOS to automatically set the ASPM level for
the system. Select Disabled to disable ASPM support. The options are Disabled
(default), Force L0, and Auto.
Caution: Enabling ASPM support may cause some PCI-E devices to fail.
B.3.9.9 Onboard LAN Options ROM Select
Select iSCSI to use the iSCSI Option ROM to boot the computer using a network
device. Select PXE (Preboot Execution Environment) to use a PXE Option ROM to
boot the computer using a network device. The options are iSCSI and PXE (default).
B.3.9.10 Load Onboard LAN 1 Option ROM/Load Onboard LAN 2 Option
ROM
Select Enabled to enable the onboard LAN1 Options ROM~LAN2 Option ROM.
This is to boot the computer using a network device. The default setting for LAN1
Option ROM is Enabled (default), and the default setting for LAN2 Option ROM is
Disabled (default).
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B.3.9.11 VGA Priority
This feature allows the user to select the graphics adapter to be used as the primary
boot device. The options are Onboard (default) and Offboard.
B.3.9.12 Network Stack
Select Enabled to enable PXE or UEFI (Unified Extensible Firmware Interface) for
network stack support. The options are Enabled and Disabled (default).
B.3.10 Super IO Configuration (WPCM450)
This item displays the Super IO chip used in the motherboard.
Serial Port 0 Configuration/Serial Port 1 Configuration
The submenus allow the user to configure the following settings for Serial Port 0 or
Serial Port 1
B.3.10.1 Serial Port
Select Enabled to enable a serial port specified by the user. The options are Enabled
(default) and Disabled.
B.3.10.2 Serial Port Mode
This feature allows the user to set the serial port mode for Console Redirection. The
options are SOL (default) and COM.
B.3.10.3 Device Settings
This item displays the settings of Serial Port 1.
B.3.10.4 Change Settings
This option specifies the base I/O port address and the Interrupt Request address of
Serial Port 1 and Serial Port 2. The options for Serial Port 1 and Port 2 are:
Auto (default), IO=3F8h; IRQ=4; IO=3F8h; IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;
IO=2F8h; IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12; IO=3E8h; IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12;
and IO=2E8h; IRQ=3, 4, 5, 6, 7, 9, 10, 11, 12.
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B.3.11 Serial Port Console Redirection
These submenus allow the user to configure the following Console Redirection settings for a COM Port 0 or COM Port 1 as specified by the user.
B.3.11.1 COM 0/COM 1
B.3.11.2 Console Redirection
Select Enabled to use a COM Port selected by the user for Console Redirection. The
options are Enabled and Disabled. (The default setting for COM0 is Disabled, and
for COM1 is Enabled.)
Console Redirection Settings
This feature allows the user to specify how the host computer will exchange data
with the client computer, which is the remote computer used by the user.
B—BIOS Setup Utility
Advanced Setup Configurations
B.3.11.3 Terminal Type
This feature allows the user to select the target terminal emulation type for Console
Redirection. Select VT100 to use the ASCII Character set. Select VT100+ to add
color and function key support. Select ANSI to use the Extended ASCII Character
set. Select VT-UTF8 to use UTF8 encoding to map Unicode characters into one or
more bytes. The options are ANSI, VT100, VT100+ (default), and VT-UTF8.
B.3.11.4 Bits Per second
Use this feature to set the transmission speed for a serial port used in Console Redirection. Make sure that the same speed is used in the host computer and the client
computer. A lower transmission speed may be required for long and busy lines. The
options are 9600, 19200, 38400, 57600, and 115200 (bits per second) (default).
B.3.11.5 Data Bits
Use this feature to set the data transmission size for Console Redirection. The
options are 7 Bits and 8 Bits (default).
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B.3.11.6 Parity
A parity bit can be sent along with regular data bits to detect data transmission
errors. Select Even if the parity bit is set to 0, and the number of 1’s in data bits is
even. Select Odd if the parity bit is set to 0, and the number of 1’s in data bits is odd.
Select None if you do not want to send a parity bit with your data bits in transmission. Select Mark to add a mark as a parity bit to be sent along with the data bits.
Select Space to add a Space as a parity bit to be sent with your data bits. The options
are None (default), Even, Odd, Mark, and Space.
0.0.0.1 Stop Bits
A stop bit indicates the end of a serial data packet. Select 1 Stop Bit for standard
serial data communication. Select 2 Stop Bits if slower devices are used. The options
are 1 (default) and 2.
B.3.11.7 Flow Control
This feature allows the user to set the flow control for Console Redirection to prevent data loss caused by buffer overflow. Send a “Stop” signal to stop sending data
when the receiving buffer is full. Send a “Start” signal to start sending data when the
receiving buffer is empty. The options are None (default) and Hardware RTS/CTS.
B.3.11.8 VT-UTF8 Combo Key Support
Select Enabled to enable VT-UTF8 Combination Key support for ANSI/VT100 terminals. The options are Enabled (default) and Disabled.
B.3.11.9 Recorder Mode
Select Enabled to capture the data displayed on a terminal and send it as text message to a remote server. The options are Disabled (default) and Enabled.
B.3.11.10 Resolution 100x31
Select Enabled for extended-terminal resolution support. The options are Disabled
and Enabled (default).
B.3.11.11 Legacy OS Redirection Resolution
Use this feature to select the number of rows and columns used in Console Redirection for legacy OS support. The options are 80x24 (default) and 80x25.
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B—BIOS Setup Utility
Advanced Setup Configurations
B.3.11.12 Putty KeyPad
This feature selects Function Keys and KeyPad settings for Putty, which is a terminal emulator designed for the Windows OS. The options are VT100 (default),
LINUX, XTERMR6, SC0, ESCN, and VT400.
B.3.1 1.13 Serial Port for Out-of-Band Management/Windows Emergency
Management Services (EMS)
This submenu allows the user to configure Console Redirection settings to support
Out-of-Band Serial Port management.
B.3.11.14 Console Redirection
Select Enabled to use a COM Port selected by the user for Console Redirection. The
options are Enabled (default) and Disabled.
Console Redirection Settings
This feature allows the user to specify how the host computer will exchange data
with the client computer, which is the remote computer used by the user.
B.3.11.15 Out-of-Band Management Port
This feature selects a serial port used by the Microsoft Windows Emergency Management services (EMS) to communicate with a remote server. The options are
COM0 (default), and COM1.
B.3.11.16 Terminal Type
This feature allows the user to select the target terminal emulation type for Console
Redirection. Select VT100 to use the ASCII Character set. Select VT100+ to add
color and function key support. Select ANSI to use the Extended ASCII Character
set. Select VT-UTF8 to use UTF8 encoding to map Unicode characters into one or
more bytes. The options are ANSI, VT100, VT100+ (default), and VT-UTF8.
B.3.11.17 Bits Per Second
Use this feature to set the transmission speed for a serial port used in Console Redirection. Make sure that the same speed is used in the host computer and the client
computer. A lower transmission speed may be required for long and busy lines. The
options are 9600, 19200, 38400, 57600, and 115200 (bits per second) (default).
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B.3.11.18 Flow Control
This feature allows the user to set the flow control for Console Redirection to prevent data loss caused by buffer overflow. Send a “Stop” signal to stop sending data
when the receiving buffer is full. Send a “Start” signal to start sending data when the
receiving buffer is empty. The options are None (default), Hardware RTS/CTS, and
Software Xon/Xoff.
B.3.12 ACPI Settings
Use this feature to configure Advanced Configuration and Power Interface (ACPI)
power management settings for your system.
B.3.12.1 ACPI Sleep State
Use this feature to select the ACPI State when the system is in sleep mode. Select S1
(CPU_Stop_Clock) to erase all CPU caches and stop executing instruction. Power to
the CPUs and RAM is maintained, but RAM is refreshed. Select Suspend Disabled
to use power-reduced mode. Power will only be supplied to limited components
(such as RAMs) to maintain the most critical functions of the system. The options
are S1 (CPU_Stop_Clock) (default), S3 (Suspend to RAM)(X9DRG-QF), and Suspend Disabled.
B.3.12.2 NUMA
This feature enables the Non-Uniform Memory Access ACPI support. The options
are Enabled (default), and Disabled.
B.3.12.3 High Precision Event Timer
Select Enabled to activate the High Precision Event Timer (HPET) that produces
periodic interrupts at a much higher frequency than a Real-time Clock (R TC) does in
synchronizing multimedia streams, providing smooth playback, reducing the dependency on other timestamp calculation devices, such as an x86 RDTSC Instruction
embedded in the CPU. The High Performance Event Timer is used to replace the
8254 Programmable Interval Timer. The options are Enabled (default) and Disabled.
Trusted Computing
Available when a TPM device is detected by the BIOS.
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Configuration
B.3.12.4 TPM Support
Select Enabled on this item and enable the TPM jumper on the motherboard to
enable TPM support to improve data integrity and network security. The options are
Enabled and Disabled (default).
B.3.12.5 Current Status Information
This item displays the information regarding the current TPM status.
B.3.12.5.18 TPM Enable Status
If a security device is detected by the BIOS, this item displays the status of TPM
Support to indicate if TPM is currently enabled or disabled.
B—BIOS Setup Utility
Advanced Setup Configurations
nt TPM status.
B.3.12.5.19 TPM Active Status
This item displays the status of TPM Support to indicate if TPM is currently
active or deactivated.
B.3.12.5.20 TPM Owner Status
This item displays the status of TPM Ownership.
Intel TXT (LT-SX) Configuration
B.3.12.6 Intel TXT (LT-SX) Hardware Support
This feature indicates if the following hardware components support the Intel TXT
(Trusted Execution Technology), which helps protect against software-based attacks
and ensures protection, confidentiality and integrity of data stored or created on the
system.
• CPU/Chipset TXT Featur e - Displays status of TXT Feature support.
• TXT Support - Indicates if TXT support is enabled or disabled. The default
setting is Disabled (default).
• Intel TXT Dependencies - Displays a list of features that must be supported
(and enabled) before Intel TXT(LT-SX) configuration can be enabled.
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B.3.13 ME (Management Engine) Subsystem
This feature displays the following Intel ME Subsystem Configuration settings.
B.3.13.1 ME Subsystem
Select Enabled to support Intel Management Engine (ME) Subsystem, a small power
computer subsystem that performs various tasks in the background. The options are
Enabled (default) and Disabled.
When ME Subsystem is enabled, the following items will display:
• ME BIOS interface
• ME version
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