Texas Instruments orporated CC3235MOD User Manual
TI Confidential – NDA Restrictions
CC3235MODSF SimpleLink™ Wi-Fi®and IoT Solution With MCU LaunchPad™ Hardware
User's Guide
Literature Number: SWRU548A
February 2019
TI Confidential – NDA Restrictions
Contents
1 Introduction......................................................................................................................... 6
1.1 CC3235MODSF LaunchPad™ ........................................................................................ 6
1.2 LAUNCHCC3235MOD Key Features ................................................................................. 7
1.3 What's Included .......................................................................................................... 7
1.4 REACH Compliance ..................................................................................................... 7
1.5 Regulatory Compliance ................................................................................................. 8
1.6 First Steps: Out-of-Box Experience ................................................................................... 8
1.7 Next Steps: Looking into the Provided Code ........................................................................ 8
1.8 Trademarks ............................................................................................................... 9
2 Hardware .......................................................................................................................... 10
2.1 Block Diagram........................................................................................................... 11
2.2 Hardware Features ..................................................................................................... 13
2.3 Electrical Characteristics .............................................................................................. 27
2.4 Antenna Characteristics ............................................................................................... 27
2.5 BoosterPack™ Header Pin Assignment ............................................................................ 28
3 Layout Guidelines .............................................................................................................. 29
3.1 LAUNCHCC3235MOD Board Layout ................................................................................ 29
3.2 General Layout Recommendations .................................................................................. 33
3.3 RF Layout Recommendations ........................................................................................ 33
3.4 Antenna Placement and Routing .................................................................................... 35
3.5 Transmission Line Considerations ................................................................................... 35
4 Operational Setup and Testing ............................................................................................ 37
4.1 Measuring the CC3235MOD Current Draw ........................................................................ 38
4.2 RF Connections ........................................................................................................ 39
4.3 Design Files ............................................................................................................ 40
4.4 Software ................................................................................................................. 40
5 Development Environment Requirements ............................................................................. 40
5.1 CCS ...................................................................................................................... 40
5.2 IAR........................................................................................................................ 40
6 Additional Resources ......................................................................................................... 41
6.1 CC3235MODx Product Page ......................................................................................... 41
6.2 Download CCS, IAR ................................................................................................... 41
6.3 SimpleLink™ Academy for CC3235 SDK .......................................................................... 41
6.4 TI E2E Community ..................................................................................................... 41
7 Assembly Drawing and Schematics ..................................................................................... 42
7.1 Assembly Drawing ..................................................................................................... 42
7.2 Schematics ............................................................................................................. 43
Revision History.......................................................................................................................... 48
1 ........................................................................................................................................ 49
2 RF Function and Frequency Range....................................................................................... 49
3 FCC and IC Certification and Statement ................................................................................ 49
2
Table of Contents
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3.1 FCC....................................................................................................................... 49
3.2 CAN ICES-3(B) and NMB-3(B) Certification and Statement...................................................... 50
3.3 End Product Labeling .................................................................................................. 51
3.4 Device Classifications.................................................................................................. 51
3.5 FCC Definitions ......................................................................................................... 51
3.6 Simultaneous Transmission Evaluation.............................................................................. 52
4 EU Certification and Statement ............................................................................................ 52
4.1 RF Exposure Information (MPE)...................................................................................... 52
4.2 Simplified DoC Statement ............................................................................................. 52
4.3 Waste Electrical and Electronic Equipment (WEEE)............................................................... 53
4.4 OEM and Host Manufacturer Responsibilities ...................................................................... 53
4.5 Antenna Specifications................................................................................................. 53
5 CC3235MODx Approved Antennas ....................................................................................... 53
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User's Guide
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CC3235MODSF LaunchPad™ Development Kit
(LAUNCHCC3235MOD)
Start your design with the industry's first programmable FCC, IC/ISED, ETSI/CE, and MIC Certified
SimpleLinkTMWi-Fi® CC3235MOD Dual-Band Wireless Microcontroller Module with built-in DualBand (2.4 GHz and 5 GHz) Wi-Fi®connectivity. Created for the Internet-of-Things (IoT), the SimpleLink™
CC3235MODx family of devices from Texas Instruments™ are wireless modules that integrate two
physically separated, on-chip MCUs:
• An application processor – Arm®Cortex®-M4 MCU with a user-dedicated 256KB of RAM and an
optional 1MB of Serial Flash.
• A network processor MCU to run all Wi-Fi and Internet logic layers. This ROM based subsystem
includes an 802.11 a/b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure
internet connections with 256-bit encryption.
The CC3235MODx comes in 2 variants:
• CC3235MODSM2MOB
– Requires an external antenna
• CC3235MODSF12MOB
– Requires an external antenna
– Contains 1MB of Serial Flash
The LAUNCHCC3235MOD is a low-cost evaluation platform for MCUs based on Arm®Cortex®-M4
devices. The LaunchPad™ design highlights the CC3235MODSF fully-integrated industrial module
solution and Dual-Band Wi-Fi capabilities. The LAUNCHCC3235MOD also features temperature and
accelerometer sensors, programmable user buttons, an RBG LED for custom applications, and onboard
emulation for debugging. The stackable headers interface demonstrates how easy it is to expand the
functionality of the LaunchPad when interfacing with other peripherals on existing BoosterPack™ add-on
boards, such as graphical displays, audio codec, antenna selection, environmental sensing, and more.
Figure 1 shows the CC3235MODSF LaunchPad development kit.
4
CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)
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Figure 1. CC3235MODSF SimpleLink™ Wi-Fi®LaunchPad™ Development Kit
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Introduction
1 Introduction
1.1 CC3235MODSF LaunchPad™
Created for the Internet of Things (IoT), the SimpleLink CC3235MODx is a wireless module with built-in
Dual-Band Wi-Fi connectivity for the LaunchPad ecosystem, which integrates a high-performance Arm
Cortex®-M4 MCU and lets customers develop an entire application with one device. With on-chip Wi-Fi,
Internet, and robust security protocols, no prior Wi-Fi experience is required for fast development.
The CC3235MODSF LaunchPad, referred to by its part number LAUNCHCC3235MOD, is a low-cost
evaluation platform for Arm®Cortex®-M4-based MCUs. The LaunchPad design highlights the
CC3235MODSF Internet-on-a chip solution and Dual-Band Wi-Fi capabilities. The CC3235MODSF
LaunchPad also features temperature and accelerometer sensors, programmable user buttons, an RGB
LED for custom applications, and onboard emulation for debugging. The stackable headers of the
CC3235MODSF LaunchPad XL interface demonstrate how easy it is to expand the functionality of the
LaunchPad when interfacing with other peripherals on many existing BoosterPack add-on boards, such as
graphical displays, audio codecs, antenna selection, environmental sensing, and more. Figure 1 shows
the CC3235MOD LaunchPad.
Multiple development environment tools are also available, including TI’s Eclipse-based Code Composer
Studio™ (CCS) integrated development environment (IDE) and IAR Embedded Workbench®. More
information about the LaunchPad, the supported BoosterPack modules, and the available resources can
be found at TI’s LaunchPad portal.
NOTE: The maximum RF power transmitted in each WLAN 2.4 GHz band is 19 dBm (EIRP power).
The maximum RF power transmitted in each WLAN 5 GHz band is 18.8 dBm (EIRP power).
www.ti.com
®
NOTE: The antennas used for this transmitter must be installed to provide a separation distance of
at least 20 cm from all persons, and must not be colocated or operating in conjunction with
any other antenna or transmitter.
6
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1.2 LAUNCHCC3235MOD Key Features
The LAUNCHCC3235MOD SimpleLink LaunchPad includes the following features:
• CC3235MODSF, SimpleLinkTMDual-Band Wi-Fi®module solution
– Integrated MCU
– 40.0-MHz Crystal
– 32.768-kHz Crystal (RTC)
– 32-Mbit SPI Serial Flash
– RF and Full Power-Management Components
• 40-pin LaunchPad standard that leverages the BoosterPack ecosystem
• TI standard, XDS110-based JTAG emulation with serial port for flash programming
• Supports 4-wire JTAG and 2-wire SWD
• Two buttons and one RGB LED for user interaction
• Back-channel universal asynchronous receiver/transmitter (UART) through USB to PC
• Onboard chip antenna with U.FL for conducted testing selectable using 0-Ω resistors
• Onboard accelerometer and temperature sensor for out-of-box demo with option to isolate the sensors
from the inter-integrated circuit (I2C) bus
• Micro-USB connector for power and debug connections
• Headers for current measurement and external JTAG connection (option to use the onboard XDS110
to debug customer platforms)
• Bus-powered device with no external power required for Wi-Fi
• Long-range transmission with highly optimized antenna (200 m typical in open air using an access
point with 6-dBi antenna AP)
• Can be powered externally, with two AA or two AAA alkaline batteries working down to 2.3-V typical
• Dimensions: 106.1 mm (L) × 58.42 mm (W)
Introduction
1.3 What's Included
1.3.1 Kit Contents
• CC3235MODSF LaunchPad development tool (LAUNCHCC3235MOD)
• Micro USB cable
• Quick start guide
1.3.2 Software Examples
• Out-of-Box Experience (OOBE) Software
1.4 REACH Compliance
In compliance with the Article 33 provision of the EU REACH regulation we are notifying you that this
EVM includes component(s) containing at least one Substance of Very High Concern (SVHC) above
0.1%. These uses from Texas Instruments do not exceed 1 ton per year. The SVHC’s are:
Component
Manufacturer
Abracon Crystal ABM3-16.000MHZ-D2Y-TDiboron Trioxide 1303-86-2
Abracon Crystal ABM3-16.000MHZ-D2Y-TLead Oxide 1317-36-8
Component type Component part
number
SVHC Substance SVHC CAS (when
available)
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Introduction
1.5 Regulatory Compliance
Certifications in Process
Indoor Usage Restrictions:
The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range.
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1.6 First Steps: Out-of-Box Experience
An easy way to get started with the EVM is by using its preprogrammed out-of-box experience code. It
demonstrates some key features of the EVM.
1.6.1 Connecting to the Computer
Connect the LaunchPad development kit by connecting the included USB cable to a computer. A red
power LED should illuminate. For proper operation, the SimpleLink drivers and Service Pack from the
CC3235 Software Development Kit (SDK) are needed. The SDK is available at
http://www.ti.com/tool/simplelink-cc32xx-sdk.
www.ti.com
1.6.2 Running the Out-of-Box Experience
The CC3235MODSF LaunchPad development kit's Out-of-Box Experience (OOBE) demonstrates and
highlights the following features:
• Easy connection to the CC3235MODSF LaunchPad:
– Using the SimpleLinkTMWi-Fi® Starter Pro application (available on iOS and Android™), users can
use Access Point (AP) provisioning or SmartConfig™ provisioning for a fast CC3235MOD
connection.
– Configuring the device in AP mode gives users a direct connection to the CC3235MODSF
LaunchPad.
Once the device is provisioned and connected to an AP in station mode, the profile is stored on the
local file system so that any reset to the CC3235MODSF automatically connects it to the AP.
• Easy access to the CC3235MODSF through its internal web server, using either:
– The SimpleLinkTMWi-Fi® Starter Pro application
– Any browser; web pages stored on the serial flash are loaded on the browser, to provide ease of
use.
This feature demonstrates configuring and reading onboard sensors.
• Over-The-Air (OTA) updates that demonstrate an update of a full image. OTA service enables insystem updates of the MCU application, CC3235 firmware releases (Service Pack) made available by
TI, and other vendor files. An update procedure executed in a full-system integrity fashion, such as
failure to upgrade any image components, results in rolling back to the previous valid version.
Visit the CC3235 LaunchPad Out-of-Box Experience Guide on SimpleLink Academy (see Section 6.3) for
more details.
1.7 Next Steps: Looking into the Provided Code
After the EVM features have been explored, the user can open an integrated development environment
and start editing the code examples from the SDK. See Section 6.2 for available IDEs and where to
download them. The Out-of-Box source code and more code examples are provided in the CC3235 SDK.
Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.
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With the onboard XDS110 debug probe, debugging and downloading new code is simple. A USB
connection between the EVM and a PC through the provided USB cable is all that is needed.
1.8 Trademarks
SimpleLink, Texas Instruments, LaunchPad, BoosterPack, Code Composer Studio are trademarks of
Texas Instruments.
Arm, Cortex are registered trademarks of Arm Limited.
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
WPA, WPA2 are trademarks of Wi-Fi Alliance.
Wi-Fi, Wi-Fi Direct are registered trademarks of Wi-Fi Alliance.
All other trademarks are the property of their respective owners.
Introduction
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Hardware
2 Hardware
Figure 2 shows the CC3235MODSF LaunchPad EVM.
www.ti.com
Figure 2. CC3235MODSF LaunchPad™ EVM Overview
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CC3235
MAC/PHY
WRF_BGN F
BGN
RF_ANT1
32-Mbit
SFlash
External SPI
Programming
40 MHz
32.768 kHz
UART
SPI
nReset
PM
2.3 V to 3.6 V
VBAT
User GPIOx
Aband
F
D
5 GHz
SPDT
WRF_A
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2.1 Block Diagram
Figure 3 shows a functional block diagram of the CC3235MODx module.
Hardware
Figure 3. CC3235MODx Functional Block Diagram
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CC3235MODSF12MOBR
Acc
BMA280
Temperature
Sensor
TMP116
Two 20-pin LaunchPad headers
(compatible with TI MCU standard)
INT (GPIO13)
I2C
FTDI
FT2232D
and
SWD Circuit
USB
Connector
LDO
3.3 V
VCC
Two AA
Battery
Connectors
Reverse
Protection
Push buttons
GPIO13, GPIO22
RGB LED
GPIO9, GPIO10, GPIO11
JTAG and SWD
UART (Flashing)
Hardware
Figure 4 shows a functional block diagram of the LAUNCHCC3235MOD SimpleLink LaunchPad.
www.ti.com
Figure 4. LAUNCHCC3235MOD Functional Block Diagram
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2.2 Hardware Features
• CC3235MODSF, SimpleLinkTMDual-Band Wi-Fi®module solution with integrated MCU
• 40-pin LaunchPad™ standard that leverages the BoosterPack™ ecosystem
• TI Standard XDS110-based JTAG emulation with serial port for flash programming
• Supports both 4-wire JTAG and 2-wire SWD
• Two buttons and a RGB LED for user interaction
• Virtual COM port UART through USB on PC
• Onboard chip antenna with U.FL or SMA for conducted testing, selectable using 0-Ω resistors
• Onboard accelerometer and temperature sensor for out-of-box demo, with the option to isolate them
from the inter-integrated circuit (I2C) bus
• Micro USB connector for power and debug connections
• Headers for current measurement and external JTAG connection, with an option to use the onboard
XDS110 to debug customer platforms
• Bus-powered device, with no external power required for Wi-Fi
• Long-range transmission with a highly optimized antenna (200-meter typical in open air with a 6-dBi
antenna AP)
• Can be powered externally, working down to 2.3 V
2.2.1 Key Benefits
The CC3235MODx modules offer the following benefits:
• Fully Integrated and Green/RoHS Modules Includes All Required Clocks, SPI Flash, and Passives
• 802.11 a/b/g/n: 2.4 GHz and 5 GHz
• FCC, IC/ISED, ETSI/CE, and MIC Certified
• FIPS 140-2 Level 1 Validated IC Inside
• Multilayered security features, help developers protect identities, data, and software IP
• Low-Power Modes for battery powered application
• Coexistence with 2.4 GHz Radios
• Industrial Temperature: –40°C to +85°C
• CC3235MODx Multiple-core architecture, system-on-chip (SoC)
• 1.27-mm Pitch QFM Package for Easy Assembly and Low-Cost PCB Design
• Transferrable Wi-Fi Alliance®Certification
• Application microcontroller subsystem:
– Arm®Cortex®-M4 core at 80 MHz
– User-dedicated memory
• 256 KB RAM
• Optional 1 MB executable Flash
– Rich set of peripherals and timers
– 26 I/O pins with flexible multiplexing options
• UART, I2S, I2C, SPI, SD, ADC, and 8-bit parallel interface
• 8-bit Synchronous Image Interface
• Timers and PWM
– Debug Interfaces: JTAG, cJTAG, and SWD
Hardware
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Hardware
• Wi-Fi network processor subsystem:
• Multilayered security features:
• Application Throughput
www.ti.com
– Wi-Fi®core:
• 802.11 a/b/g/n 2.4 GHz and 5 GHz
• Modes:
• Access Point (AP)
• Station (STA)
• Wi-Fi Direct®(only supported on 2.4 GHz)
• Security:
• WEP
• WPA™/WPA2™ PSK
• WPA2 Enterprise
– Internet and application protocols:
• HTTPs server, mDNS, DNS-SD, DHCP
• IPv4 and IPv6 TCP/IP stack
• 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
– Built-in power management subsystem:
• Configurable low-power profiles (always, intermittent, tag)
• Advanced low-power modes
• Integrated DC/DC regulators
– Separate execution environments
– Networking security
– Device identity and key
– Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
– Application-level security (encryption, authentication, access control)
– Initial secure programming
– Software tamper detection
– Secure boot
– Certificate signing request (CSR)
– Unique per device key pair
– UDP: 16 Mbps
– TCP: 13 Mbps
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• Power-Management Subsystem:
• Additional Integrated Components
• Footprint Compatible QFM Package
• Module Supports SimpleLink Developer's Ecosystem
Hardware
– Integrated DC/DC converters support a wide range of supply voltage:
• VBAT wide-voltage mode: 2.3 V to 3.6 V
• VIO is always tied with VBAT
– Advanced low-power modes:
• Shutdown: 1 µA, hibernate: 5.5 µA
• Low-power deep sleep (LPDS): 120 µA
• Idle connected (MCU in LPDS): 710 µA
• RX traffic (MCU active): 59 mA
• TX traffic (MCU active): 223 mA
– Wi-Fi TX Power
• 2.4 GHz: 16.5 dBm at 1 DSSS
• 5 GHz: 15.1 dBm at 6 OFDM
– Wi-Fi RX Sensitivity
• 2.4 GHz: –94.5 dBm at 1 DSSS
• 5 GHz: –89 dBm at 6 OFDM
– 40.0 MHz Crystal
– 32.768 kHz Crystal (RTC)
– 32 Mbit SPI Serial Flash
– RF Filters, Diplexer and Passive Components
– CC3235MODx: 1.27-mm Pitch,
63-Pin, 20.5-mm × 17.5-mm
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Hardware
2.2.2 XDS110-Based Onboard Debug Probe
To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard
debug probe, which eliminates the need for expensive programmers. The CC3235MODSF LaunchPad
has the XDS-110-based debug probe (see Figure 5), which is a simple and low-cost debugger that
supports nearly all TI Arm device derivatives.
Figure 5. XDS-110 Debug Probe
www.ti.com
16
The dotted line through J101 shown in Figure 5 divides the XDS110 debug probe from the target area.
The signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. More
details on the isolation jumper block are in Section 2.2.3.
The XDS110 debug probe also provides a "backchannel" UART-over-USB connection with the host, which
can be very useful during debugging and for easy communication with a PC. More details can be found in
Section 2.2.4.
The XDS110 debug probe hardware can be found in the schematics in Section 7.2 and in the
CC3235MOD LaunchPad hardware design files.
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2.2.3 Debug Probe Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from
the XDS110 domain into the CC3235MOD target domain. This includes JTAG signals, application UART
signals, and 3.3-V and 5-V power.
Reasons to open these connections:
• To remove any and all influence from the XDS110 debug probe for high accuracy target power
measurements
• To control 3-V and 5-V power flow between the XDS110 and target domains
• To expose the target MCU pins for other use than onboard debugging and application UART
communication
• To expose the programming and UART interface of the XDS110 so that it can be used for devices
other than the onboard MCU.
Table 1. Isolation Block Connections
Jumper Description
BRD Board Power. Supplies the board power from the onboard DC-DC converter. The board power
includes the sensors, LED, and the OPAMP used to drive the ADC input.
GND Ground reference
5V 5-V VBUS from USB
VBAT 3.3-V rail, derived from VBUS in the XDS110 domain. Can also be used to measure the current
flowing into the CC3235MOD.
RX Backchannel UART: The target CC3235MODSF receives data through this signal.
TX Backchannel UART: The target CC3235MODSF sends data through this signal.
RST This pin functions as the RST signal (active low).
TMS Serial wire data input (SWDIO) / JTAG test mode select (TMS)
TCK Serial wire clock input (SWCLK) / JTAG clock input (TCK)
TDO JTAG test data out
TDI JTAG test data in
VBUFFER Used to power the level shifters located on the emulator side of the board. The level shifters can
be powered by shorting this pin with a jumper. Removing the jumper enables low current
measurement.
Hardware
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