Texas Instruments orporated CC3235MOD User Manual

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CC3235MODSF SimpleLink™ Wi-Fi®and IoT Solution With MCU LaunchPad™ Hardware

User's Guide

Literature Number: SWRU548A

February 2019

TI Confidential – NDA Restrictions

Contents

1 Introduction......................................................................................................................... 6

1.1 CC3235MODSF LaunchPad™ ........................................................................................ 6

1.2 LAUNCHCC3235MOD Key Features ................................................................................. 7

1.3 What's Included .......................................................................................................... 7

1.4 REACH Compliance ..................................................................................................... 7

1.5 Regulatory Compliance ................................................................................................. 8

1.6 First Steps: Out-of-Box Experience ................................................................................... 8

1.7 Next Steps: Looking into the Provided Code ........................................................................ 8

1.8 Trademarks ............................................................................................................... 9

2 Hardware .......................................................................................................................... 10

2.1 Block Diagram........................................................................................................... 11

2.2 Hardware Features ..................................................................................................... 13

2.3 Electrical Characteristics .............................................................................................. 27

2.4 Antenna Characteristics ............................................................................................... 27

2.5 BoosterPack™ Header Pin Assignment ............................................................................ 28

3 Layout Guidelines .............................................................................................................. 29

3.1 LAUNCHCC3235MOD Board Layout ................................................................................ 29

3.2 General Layout Recommendations .................................................................................. 33

3.3 RF Layout Recommendations ........................................................................................ 33

3.4 Antenna Placement and Routing .................................................................................... 35

3.5 Transmission Line Considerations ................................................................................... 35

4 Operational Setup and Testing ............................................................................................ 37

4.1 Measuring the CC3235MOD Current Draw ........................................................................ 38

4.2 RF Connections ........................................................................................................ 39

4.3 Design Files ............................................................................................................ 40

4.4 Software ................................................................................................................. 40

5 Development Environment Requirements ............................................................................. 40

5.1 CCS ...................................................................................................................... 40

5.2 IAR........................................................................................................................ 40

6 Additional Resources ......................................................................................................... 41

6.1 CC3235MODx Product Page ......................................................................................... 41

6.2 Download CCS, IAR ................................................................................................... 41

6.3 SimpleLink™ Academy for CC3235 SDK .......................................................................... 41

6.4 TI E2E Community ..................................................................................................... 41

7 Assembly Drawing and Schematics ..................................................................................... 42

7.1 Assembly Drawing ..................................................................................................... 42

7.2 Schematics ............................................................................................................. 43

Revision History.......................................................................................................................... 48

1 ........................................................................................................................................ 49

2 RF Function and Frequency Range....................................................................................... 49

3 FCC and IC Certification and Statement ................................................................................ 49

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3.1 FCC....................................................................................................................... 49

3.2 CAN ICES-3(B) and NMB-3(B) Certification and Statement...................................................... 50

3.3 End Product Labeling .................................................................................................. 51

3.4 Device Classifications.................................................................................................. 51

3.5 FCC Definitions ......................................................................................................... 51

3.6 Simultaneous Transmission Evaluation.............................................................................. 52

4 EU Certification and Statement ............................................................................................ 52

4.1 RF Exposure Information (MPE)...................................................................................... 52

4.2 Simplified DoC Statement ............................................................................................. 52

4.3 Waste Electrical and Electronic Equipment (WEEE)............................................................... 53

4.4 OEM and Host Manufacturer Responsibilities ...................................................................... 53

4.5 Antenna Specifications................................................................................................. 53

5 CC3235MODx Approved Antennas ....................................................................................... 53

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User's Guide

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CC3235MODSF LaunchPad™ Development Kit

(LAUNCHCC3235MOD)

Start your design with the industry's first programmable FCC, IC/ISED, ETSI/CE, and MIC Certified SimpleLinkTMWi-Fi® CC3235MOD Dual-Band Wireless Microcontroller Module with built-in DualBand (2.4 GHz and 5 GHz) Wi-Fi®connectivity. Created for the Internet-of-Things (IoT), the SimpleLink™ CC3235MODx family of devices from Texas Instruments™ are wireless modules that integrate two physically separated, on-chip MCUs:

• An application processor – Arm®Cortex®-M4 MCU with a user-dedicated 256KB of RAM and an optional 1MB of Serial Flash.

• A network processor MCU to run all Wi-Fi and Internet logic layers. This ROM based subsystem includes an 802.11 a/b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure internet connections with 256-bit encryption.

The CC3235MODx comes in 2 variants:

• CC3235MODSM2MOB – Requires an external antenna

• CC3235MODSF12MOB – Requires an external antenna – Contains 1MB of Serial Flash

The LAUNCHCC3235MOD is a low-cost evaluation platform for MCUs based on Arm®Cortex®-M4 devices. The LaunchPad™ design highlights the CC3235MODSF fully-integrated industrial module solution and Dual-Band Wi-Fi capabilities. The LAUNCHCC3235MOD also features temperature and accelerometer sensors, programmable user buttons, an RBG LED for custom applications, and onboard emulation for debugging. The stackable headers interface demonstrates how easy it is to expand the functionality of the LaunchPad when interfacing with other peripherals on existing BoosterPack™ add-on boards, such as graphical displays, audio codec, antenna selection, environmental sensing, and more.

Figure 1 shows the CC3235MODSF LaunchPad development kit.

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Figure 1. CC3235MODSF SimpleLink™ Wi-Fi®LaunchPad™ Development Kit

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Introduction

1 Introduction

1.1 CC3235MODSF LaunchPad™

Created for the Internet of Things (IoT), the SimpleLink CC3235MODx is a wireless module with built-in Dual-Band Wi-Fi connectivity for the LaunchPad ecosystem, which integrates a high-performance Arm Cortex®-M4 MCU and lets customers develop an entire application with one device. With on-chip Wi-Fi, Internet, and robust security protocols, no prior Wi-Fi experience is required for fast development.

The CC3235MODSF LaunchPad, referred to by its part number LAUNCHCC3235MOD, is a low-cost evaluation platform for Arm®Cortex®-M4-based MCUs. The LaunchPad design highlights the CC3235MODSF Internet-on-a chip solution and Dual-Band Wi-Fi capabilities. The CC3235MODSF LaunchPad also features temperature and accelerometer sensors, programmable user buttons, an RGB LED for custom applications, and onboard emulation for debugging. The stackable headers of the CC3235MODSF LaunchPad XL interface demonstrate how easy it is to expand the functionality of the LaunchPad when interfacing with other peripherals on many existing BoosterPack add-on boards, such as graphical displays, audio codecs, antenna selection, environmental sensing, and more. Figure 1 shows the CC3235MOD LaunchPad.

Multiple development environment tools are also available, including TI’s Eclipse-based Code Composer

Studio™ (CCS) integrated development environment (IDE) and IAR Embedded Workbench®. More

information about the LaunchPad, the supported BoosterPack modules, and the available resources can be found at TI’s LaunchPad portal.

NOTE: The maximum RF power transmitted in each WLAN 2.4 GHz band is 19 dBm (EIRP power).

The maximum RF power transmitted in each WLAN 5 GHz band is 18.8 dBm (EIRP power).

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NOTE: The antennas used for this transmitter must be installed to provide a separation distance of

at least 20 cm from all persons, and must not be colocated or operating in conjunction with any other antenna or transmitter.

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1.2 LAUNCHCC3235MOD Key Features

The LAUNCHCC3235MOD SimpleLink LaunchPad includes the following features:

• CC3235MODSF, SimpleLinkTMDual-Band Wi-Fi®module solution – Integrated MCU – 40.0-MHz Crystal – 32.768-kHz Crystal (RTC) – 32-Mbit SPI Serial Flash – RF and Full Power-Management Components

• 40-pin LaunchPad standard that leverages the BoosterPack ecosystem

• TI standard, XDS110-based JTAG emulation with serial port for flash programming

• Supports 4-wire JTAG and 2-wire SWD

• Two buttons and one RGB LED for user interaction

• Back-channel universal asynchronous receiver/transmitter (UART) through USB to PC

• Onboard chip antenna with U.FL for conducted testing selectable using 0-Ω resistors

• Onboard accelerometer and temperature sensor for out-of-box demo with option to isolate the sensors from the inter-integrated circuit (I2C) bus

• Micro-USB connector for power and debug connections

• Headers for current measurement and external JTAG connection (option to use the onboard XDS110 to debug customer platforms)

• Bus-powered device with no external power required for Wi-Fi

• Long-range transmission with highly optimized antenna (200 m typical in open air using an access point with 6-dBi antenna AP)

• Can be powered externally, with two AA or two AAA alkaline batteries working down to 2.3-V typical

• Dimensions: 106.1 mm (L) × 58.42 mm (W)

Introduction

1.3 What's Included

1.3.1 Kit Contents

• CC3235MODSF LaunchPad development tool (LAUNCHCC3235MOD)

• Micro USB cable

• Quick start guide

1.3.2 Software Examples

• Out-of-Box Experience (OOBE) Software

1.4 REACH Compliance

In compliance with the Article 33 provision of the EU REACH regulation we are notifying you that this EVM includes component(s) containing at least one Substance of Very High Concern (SVHC) above

0.1%. These uses from Texas Instruments do not exceed 1 ton per year. The SVHC’s are:

Component Manufacturer

Abracon Crystal ABM3-16.000MHZ-D2Y-TDiboron Trioxide 1303-86-2

Abracon Crystal ABM3-16.000MHZ-D2Y-TLead Oxide 1317-36-8

Component type Component part

number

SVHC Substance SVHC CAS (when

available)

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Introduction

1.5 Regulatory Compliance

Certifications in Process Indoor Usage Restrictions: The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range.

AT BE BG HR CY CZ DK EE FI FR DE EL HU IE IT LV LT LU MT NL PL PT RO SK SI ES SE UK

1.6 First Steps: Out-of-Box Experience

An easy way to get started with the EVM is by using its preprogrammed out-of-box experience code. It demonstrates some key features of the EVM.

1.6.1 Connecting to the Computer

Connect the LaunchPad development kit by connecting the included USB cable to a computer. A red power LED should illuminate. For proper operation, the SimpleLink drivers and Service Pack from the CC3235 Software Development Kit (SDK) are needed. The SDK is available at

http://www.ti.com/tool/simplelink-cc32xx-sdk.

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1.6.2 Running the Out-of-Box Experience

The CC3235MODSF LaunchPad development kit's Out-of-Box Experience (OOBE) demonstrates and highlights the following features:

• Easy connection to the CC3235MODSF LaunchPad: – Using the SimpleLinkTMWi-Fi® Starter Pro application (available on iOS and Android™), users can

use Access Point (AP) provisioning or SmartConfig™ provisioning for a fast CC3235MOD connection.

– Configuring the device in AP mode gives users a direct connection to the CC3235MODSF

LaunchPad.

Once the device is provisioned and connected to an AP in station mode, the profile is stored on the local file system so that any reset to the CC3235MODSF automatically connects it to the AP.

• Easy access to the CC3235MODSF through its internal web server, using either: – The SimpleLinkTMWi-Fi® Starter Pro application – Any browser; web pages stored on the serial flash are loaded on the browser, to provide ease of

use.

This feature demonstrates configuring and reading onboard sensors.

• Over-The-Air (OTA) updates that demonstrate an update of a full image. OTA service enables insystem updates of the MCU application, CC3235 firmware releases (Service Pack) made available by TI, and other vendor files. An update procedure executed in a full-system integrity fashion, such as failure to upgrade any image components, results in rolling back to the previous valid version.

Visit the CC3235 LaunchPad Out-of-Box Experience Guide on SimpleLink Academy (see Section 6.3) for more details.

1.7 Next Steps: Looking into the Provided Code

After the EVM features have been explored, the user can open an integrated development environment and start editing the code examples from the SDK. See Section 6.2 for available IDEs and where to download them. The Out-of-Box source code and more code examples are provided in the CC3235 SDK. Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.

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With the onboard XDS110 debug probe, debugging and downloading new code is simple. A USB connection between the EVM and a PC through the provided USB cable is all that is needed.

1.8 Trademarks

SimpleLink, Texas Instruments, LaunchPad, BoosterPack, Code Composer Studio are trademarks of Texas Instruments. Arm, Cortex are registered trademarks of Arm Limited. IAR Embedded Workbench is a registered trademark of IAR Systems AB. WPA, WPA2 are trademarks of Wi-Fi Alliance. Wi-Fi, Wi-Fi Direct are registered trademarks of Wi-Fi Alliance. All other trademarks are the property of their respective owners.

Introduction

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2 Hardware

Figure 2 shows the CC3235MODSF LaunchPad EVM.

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Figure 2. CC3235MODSF LaunchPad™ EVM Overview

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CC3235

MAC/PHY

WRF_BGN F

BGN

RF_ANT1

32-Mbit

SFlash

External SPI

Programming

40 MHz

32.768 kHz

UART

SPI

nReset

2.3 V to 3.6 V VBAT

User GPIOx

Aband

5 GHz SPDT

WRF_A

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2.1 Block Diagram

Figure 3 shows a functional block diagram of the CC3235MODx module.

Hardware

Figure 3. CC3235MODx Functional Block Diagram

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CC3235MODSF12MOBR

Acc

BMA280

Temperature

Sensor

TMP116

Two 20-pin LaunchPad headers (compatible with TI MCU standard)

INT (GPIO13)

I2C

FTDI

FT2232D

and

SWD Circuit

USB

Connector

LDO

3.3 V

VCC

Two AA

Battery

Connectors

Reverse

Protection

Push buttons

GPIO13, GPIO22

RGB LED GPIO9, GPIO10, GPIO11

JTAG and SWD

UART (Flashing)

Hardware

Figure 4 shows a functional block diagram of the LAUNCHCC3235MOD SimpleLink LaunchPad.

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Figure 4. LAUNCHCC3235MOD Functional Block Diagram

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2.2 Hardware Features

• CC3235MODSF, SimpleLinkTMDual-Band Wi-Fi®module solution with integrated MCU

• 40-pin LaunchPad™ standard that leverages the BoosterPack™ ecosystem

• TI Standard XDS110-based JTAG emulation with serial port for flash programming

• Supports both 4-wire JTAG and 2-wire SWD

• Two buttons and a RGB LED for user interaction

• Virtual COM port UART through USB on PC

• Onboard chip antenna with U.FL or SMA for conducted testing, selectable using 0-Ω resistors

• Onboard accelerometer and temperature sensor for out-of-box demo, with the option to isolate them from the inter-integrated circuit (I2C) bus

• Micro USB connector for power and debug connections

• Headers for current measurement and external JTAG connection, with an option to use the onboard XDS110 to debug customer platforms

• Bus-powered device, with no external power required for Wi-Fi

• Long-range transmission with a highly optimized antenna (200-meter typical in open air with a 6-dBi antenna AP)

• Can be powered externally, working down to 2.3 V

2.2.1 Key Benefits

The CC3235MODx modules offer the following benefits:

• Fully Integrated and Green/RoHS Modules Includes All Required Clocks, SPI Flash, and Passives

• 802.11 a/b/g/n: 2.4 GHz and 5 GHz

• FCC, IC/ISED, ETSI/CE, and MIC Certified

• FIPS 140-2 Level 1 Validated IC Inside

• Multilayered security features, help developers protect identities, data, and software IP

• Low-Power Modes for battery powered application

• Coexistence with 2.4 GHz Radios

• Industrial Temperature: –40°C to +85°C

• CC3235MODx Multiple-core architecture, system-on-chip (SoC)

• 1.27-mm Pitch QFM Package for Easy Assembly and Low-Cost PCB Design

• Transferrable Wi-Fi Alliance®Certification

• Application microcontroller subsystem: – Arm®Cortex®-M4 core at 80 MHz – User-dedicated memory

• 256 KB RAM

• Optional 1 MB executable Flash – Rich set of peripherals and timers – 26 I/O pins with flexible multiplexing options

• UART, I2S, I2C, SPI, SD, ADC, and 8-bit parallel interface

• 8-bit Synchronous Image Interface

• Timers and PWM – Debug Interfaces: JTAG, cJTAG, and SWD

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• Wi-Fi network processor subsystem:

• Multilayered security features:

• Application Throughput

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– Wi-Fi®core:

• 802.11 a/b/g/n 2.4 GHz and 5 GHz

• Modes:

• Access Point (AP)

• Station (STA)

• Wi-Fi Direct®(only supported on 2.4 GHz)

• Security:

• WEP

• WPA™/WPA2™ PSK

• WPA2 Enterprise

– Internet and application protocols:

• HTTPs server, mDNS, DNS-SD, DHCP

• IPv4 and IPv6 TCP/IP stack

• 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0) – Built-in power management subsystem:

• Configurable low-power profiles (always, intermittent, tag)

• Advanced low-power modes

• Integrated DC/DC regulators

– Separate execution environments – Networking security – Device identity and key – Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC) – Application-level security (encryption, authentication, access control) – Initial secure programming – Software tamper detection – Secure boot – Certificate signing request (CSR) – Unique per device key pair

– UDP: 16 Mbps – TCP: 13 Mbps

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• Power-Management Subsystem:

• Additional Integrated Components

• Footprint Compatible QFM Package

• Module Supports SimpleLink Developer's Ecosystem

Hardware

– Integrated DC/DC converters support a wide range of supply voltage:

• VBAT wide-voltage mode: 2.3 V to 3.6 V

• VIO is always tied with VBAT – Advanced low-power modes:

• Shutdown: 1 µA, hibernate: 5.5 µA

• Low-power deep sleep (LPDS): 120 µA

• Idle connected (MCU in LPDS): 710 µA

• RX traffic (MCU active): 59 mA

• TX traffic (MCU active): 223 mA – Wi-Fi TX Power

• 2.4 GHz: 16.5 dBm at 1 DSSS

• 5 GHz: 15.1 dBm at 6 OFDM – Wi-Fi RX Sensitivity

• 2.4 GHz: –94.5 dBm at 1 DSSS

• 5 GHz: –89 dBm at 6 OFDM

– 40.0 MHz Crystal – 32.768 kHz Crystal (RTC) – 32 Mbit SPI Serial Flash – RF Filters, Diplexer and Passive Components

– CC3235MODx: 1.27-mm Pitch,

63-Pin, 20.5-mm × 17.5-mm

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2.2.2 XDS110-Based Onboard Debug Probe

To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard debug probe, which eliminates the need for expensive programmers. The CC3235MODSF LaunchPad has the XDS-110-based debug probe (see Figure 5), which is a simple and low-cost debugger that supports nearly all TI Arm device derivatives.

Figure 5. XDS-110 Debug Probe

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The dotted line through J101 shown in Figure 5 divides the XDS110 debug probe from the target area. The signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. More details on the isolation jumper block are in Section 2.2.3.

The XDS110 debug probe also provides a "backchannel" UART-over-USB connection with the host, which can be very useful during debugging and for easy communication with a PC. More details can be found in

Section 2.2.4.

The XDS110 debug probe hardware can be found in the schematics in Section 7.2 and in the

CC3235MOD LaunchPad hardware design files.

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2.2.3 Debug Probe Connection: Isolation Jumper Block

The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the XDS110 domain into the CC3235MOD target domain. This includes JTAG signals, application UART signals, and 3.3-V and 5-V power.

Reasons to open these connections:

• To remove any and all influence from the XDS110 debug probe for high accuracy target power measurements

• To control 3-V and 5-V power flow between the XDS110 and target domains

• To expose the target MCU pins for other use than onboard debugging and application UART communication

• To expose the programming and UART interface of the XDS110 so that it can be used for devices other than the onboard MCU.

Table 1. Isolation Block Connections

Jumper Description

BRD Board Power. Supplies the board power from the onboard DC-DC converter. The board power

includes the sensors, LED, and the OPAMP used to drive the ADC input. GND Ground reference 5V 5-V VBUS from USB VBAT 3.3-V rail, derived from VBUS in the XDS110 domain. Can also be used to measure the current

flowing into the CC3235MOD. RX Backchannel UART: The target CC3235MODSF receives data through this signal. TX Backchannel UART: The target CC3235MODSF sends data through this signal. RST This pin functions as the RST signal (active low). TMS Serial wire data input (SWDIO) / JTAG test mode select (TMS) TCK Serial wire clock input (SWCLK) / JTAG clock input (TCK) TDO JTAG test data out TDI JTAG test data in VBUFFER Used to power the level shifters located on the emulator side of the board. The level shifters can

be powered by shorting this pin with a jumper. Removing the jumper enables low current

measurement.

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2.2.4 Application (or "Backchannel") UART

The board supports a USB-based virtual COM port, using the Tiva™ Arm®MCU. The LaunchPad is shipped with the UART lines from the CC3235MODSF connected to the UART on the Tiva MCU. The CC3235MODSF's UART can also be routed to the 20-pin connector for use as a GPIO or external UART. The selection is performed using jumpers on the board.

Figure 6 shows the UART routed to USB COM port. Ensure that a jumper is also placed on the VBUFFER

header to power the level shifters located on the emulator side of the board. Figure 7 shows the UART routed to 20-pin header connector.

Figure 6. UART Routed to USB COM Port

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Figure 7. UART Routed to 20-Pin Header Connector

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2.2.5 JTAG Headers

The headers are provided on the board to isolate the CC3235MOD from the onboard XDS110-based JTAG emulator. These jumpers are shorted by default when the board is shipped from TI. Figure 5 and

Table 1 are for default configurations, and Figure 8 shows the external emulator connection. To connect

an external emulator, remove the isolation block JTAG jumpers and place the external emulator on the JTAG IN connector.

Hardware

Figure 8. JTAG IN Connector (J6)

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2.2.6 Using the XDS110 Debug Probe with a Different Target

The XDS110 debug probe on the LaunchPad development kit can interface to most Arm®Cortex®-M devices, not just the onboard target CC3235MODSF device. This functionality is enabled by the J2 10-pin

Cortex-M JTAG connector (see Figure 9) and a 10-pin cable, such as the FFSD-05-D-06.00-01-N (sold

separately from the LaunchPad development kit).

Figure 9. XDS110 OUT Connector (J2)

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Header J2 follows the Arm®Cortex®-M standard; however, pin 1 is not a voltage sense pin. The XDS110 outputs only 3.3-V JTAG signals. If another voltage level is needed, the user must provide level shifters to translate the JTAG signal voltages.

1. Remove jumpers on the JTAG signals on the isolation block, including RST, TMS, TCK, TDO, and TDI.

2. Plug the 10-pin cable into J2, and connect to an external target. a. J2 follows the Arm®Cortex®Debug Connector standard outlined in Cortex-M Debug Connectors.

3. Plug USB power into the LaunchPad development kit, or power it externally a. JTAG levels are 3.3-V ONLY

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2.2.7 Power Connections

The board accommodates various power methods, including through the onboard XDS110 as well as external or BoosterPack plug-in module power (see Figure 10).

Figure 10. LAUNCHCC3235MOD Power Block Diagram

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2.2.7.1 XDS110 USB Power

The most common power-supply scenario is from USB through the XDS110 debugger. This provides 5-V power from the USB and also regulates this power rail to 3.3 V for XDS110 operation and 3.3-V to the target side of the LaunchPad development kit. Power from the XDS110 is controlled by jumper J101. When the board is powered from the USB connector, ensure that the jumpers are placed on the following headers, shown in Figure 11.

Figure 11. Powering the CC3235MODSF LP from USB

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2.2.7.2 BoosterPack Plug-in Module and External Power Supply

Headers J19 and J20 are present on the board to supply external power directly when USB power is not available. Use the following precautions before using the board with an external power supply.

1. Remove the USB cable.

2. Ensure that jumpers are only placed on the headers shown in Figure 12.

3. Use a jumper wire to connect VBAT and BRD.

4. Plug in the external power supply on J20 with the correct polarity.

Figure 12. Powering the CC3235MODSF LP from an External Power Supply

Hardware

The OPAMP EN and LED EN jumpers are also available to remove any current draw from the onboard OpAmp and LEDs being driven by the GPIOs, see Table 2.

Reference Use Comments

J19 5-V power input Used to power the board from an external 5-V supply J20 3.3-V power input Used to power the board from an external 3.3-V supply. J21 OPAMP EN If uninstalled, the power supply to the operational amplifier is cut off. This can

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Table 2. External Supply Connections and Enable Jumpers

be used to enable low-power measurements.

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Table 2. External Supply Connections and Enable Jumpers (continued)

Reference Use Comments

J26 LED EN If uninstalled, the LEDs connected to the GPIO are disabled; this can be used

2.2.8 Reset Pullup Jumper

Table 3 lists the reset pullup jumper.

Reference Use Comments

J13 RESET pullup Install this jumper to enable the pullup resistor on the nRESET pin of the

2.2.9 Clocking

All of the required clocks are inside the module. There is no need to supply any external clock.

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to enable low-power measurements.

Table 3. Reset Pullup Jumper

device, when the board is powered from an external supply.

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2.2.10 I2C Connection

The board features an accelerometer and a temperature sensor for the out-of-box demo. These are connected to the I2C bus, and can be isolated using the jumpers provided (shown as yellow jumpers J23 and J24 in Figure 13).

Hardware

Figure 13. I2C Connections

By removing J23 and J24, the accelerometer and the temperature sensors are isolated from the I2C bus. This measure also removes the I2C pullup resistors from the sensor side of the circuit, and therefore any connection to the circuit requires the user to install external pullup resistors.

Table 4 lists the I2C jumper definitions.

Reference Use Comments

J23 I2C SCL Populated: CC3235MOD SCL connected to onboard sensors with pullup

J24 I2C SDA Populated: CC3235MOD SDA connected to onboard sensors with pullup

2.2.10.1 Default I2C Addresses

Table 5 lists the default I2C addresses of the onboard sensors.

Table 5. Default I2C Addresses (of Onboard Sensors)

Sensor Type Reference Designator on LP Part Number (Manufacturer) Default Slave Address (Hex)

Temperature (Digital ) U10 TMP116 (TI) 0x49 Accelerometer (Triaxial) U11 BMA280 (Bosch) 0x30

Table 4. I2C Jumper Definitions

Open: CC3235MOD SCL disconnected from onboard sensors

Open: CC3235MOD SDA disconnected from onboard sensors

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Hardware

2.2.11 Sense on Power (SOP)

The CC3235MODx device can be set to operate in four different modes based on the state of the sense on power (SOP) lines. The SOP lines are pins 23, 24, and 34 on the CC3235MODx module. Table 6 shows the state of the device and Figure 14 shows the SOP jumpers.

Binary Value Function

100 Flash programming 000 Functional mode + 4-wire JTAG 001 Functional mode + SWD 010 Functional mode + flash

NOTE: SOP[2:0] corresponds to J18 on the LaunchPad design.

Figure 14. SOP Jumpers (Default Setting Shown)

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Table 6. SOP[2:0]

NOTE: Placing no jumpers on the block ensures that the line is pulled low using 100K pull down

resistors. Placing the jumper pulls the pin high using a 10K resistor.

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2.2.12 Push-Buttons and LED Indicators

Table 7 lists the push-button definitions.

Table 7. Push-Button Definitions

Reference Use Comments

SW1 RESET This is used to reset the CC3235MOD device. This signal is also output on the

SW2 GPIO_13 When pushed, GPIO_13 is pulled to VCC. SW3 GPIO_22 When pushed, GPIO_22 is pulled to VCC. SW4 Factory default Pressing this button and toggling RESET restores the factory default image on

Table 8 lists the LED indicators.

Reference Color Use Comments

D1,D2 Green and Red Debug Indicates the state of the JTAG

D3 Yellow nRESET Indicates the state of the NRESET

D4 Red Power Indicates when the 3.3-V power is

D7 RGB GPIO_09 Glows when the GPIO is logic-1.

RGB GPIO_10 RGB GPIO_11

D8 Red Factory Reset Indicates that the push-button for

(1)

GPIO_10 and GPIO_11 are also used as I2C. Whenever the pullups are enabled, the LEDs glow by default without configuring the GPIOs.

Hardware

20-pin connector to reset any external BoosterPack which may be stacked. The reset can be isolated using the RST jumper at the isolation block.

the serial flash. This can be used to recover a corrupted serial flash, provided the s-flash was programmed with a recovery image.

Table 8. LED Indicators

emulator. For TI use only.

pin. If this LED is on, the device is functional.

supplied to the board.

(1)

Glows when the GPIO is logic-1. Glows when the GPIO is logic-1.

the factory reset is pressed.

2.3 Electrical Characteristics

For electrical characteristics of the CC3235MODx modules, see CC3235MODx SimpleLink™ Wi-Fi

CERTIFIED®Dual-Band Wireless MCU Module data sheet.

2.4 Antenna Characteristics

The CC3235MODSM2MOB and the CC3235MODSF12MOB reference design detail the use of an onboard antenna. For more information on the antenna VSWR, efficiency, and electrical characteristics, see

M830520.

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Hardware

2.5 BoosterPack™ Header Pin Assignment

The BoosterPack header pinout specification is at Build Your Own BoosterPack. Also see the BoosterPack Pinout Standard. The CC3235MODSF LaunchPad follows this standard, with the exception of naming. (P1:P4 is used instead of J1:J4.). See Figure 15 for the

CC3235MODSF LaunchPad pin-mapping assignments and functions.

Figure 15. LAUNCHCC3235MOD BoosterPack™ Header Pin Assignments

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NOTE: RESET output is an open-drain-type output and can only drive the pin low. The pullup ensures that the line is pulled back high when the

button is released. No external BoosterPack can drive this pin low.

All the signals are referred to by the pin number in the SDK; Figure 15 shows the default mappings. Some of the pins are repeated across the connector. For instance, pin 62 is available on P1 and P4, but only P1 is connected by default. The signal on P4 is marked with an asterisk (*) to signify that it is not connected by default. The signal can be routed to the pin by using a 0-Ω resistor in the path. For the exact resistor placement, see the CC3235MODSF SimpleLinkTMWi-Fi®Wireless MCU LaunchPad Board Design Files.

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3 Layout Guidelines

The integrator of the CC3235MODx modules must comply with the PCB layout recommendations described in the following subsections to preserve and minimize the risk with regulatory certifications for FCC, ISED/IC, ETSI/CE, and MIC. Also, TI recommends that customers follow the guidelines described in this section to achieve similar performance.

3.1 LAUNCHCC3235MOD Board Layout

The reference layout consists of a four-layer design. Figure 16 shows the LAUNCHCC3235MOD top layer.

Figure 16. LAUNCHCC3235MOD Top Layer

Layout Guidelines

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Layout Guidelines

Figure 17 shows the LAUNCHCC3235MOD first inner layer.

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Figure 17. LAUNCHCC3235MOD First Inner Layer

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Figure 18 shows the LAUNCHCC3235MOD second inner layer.

Layout Guidelines

Figure 18. LAUNCHCC3235MOD Second Inner Layer

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Layout Guidelines

Figure 19 shows the LAUNCHCC3235MOD bottom layer.

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Figure 19. LAUNCHCC3235MOD Bottom Layer

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3.2 General Layout Recommendations

Ensure that the following general layout recommendations are followed:

• Have a solid ground plane and ground vias under the module for stable system and thermal

dissipation.

• Do not run signal traces underneath the module on a layer where the module is mounted.

3.3 RF Layout Recommendations

The RF section of this wireless module gets top priority in terms of layout. It is very important for the RF section to be laid out correctly to ensure optimum performance from the module. A poor layout can cause low-output power, EVM degradation, sensitivity degradation, and mask violations.

Figure 20 shows the RF placement and routing of the CC3235MODSF module.

Figure 20. RF Section Layout

Layout Guidelines

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Layout Guidelines

Use the following RF layout recommendations for the CC3235MODx module:

• RF traces must have 50-Ω impedance.

• RF trace bends must be made with gradual curves, and 90 degree bends must be avoided.

• RF traces must not have sharp corners.

• There must be no traces or ground under the antenna section.

• RF traces must have via stitching on the ground plane beside the RF trace on both sides.

• RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge

of the PCB product in consideration of the product enclosure material and proximity.

For optimal RF performance, ensure the copper cut out on the top layer under the RF-BG pin (pin 31) is as shown in Figure 21.

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Figure 21. Top Layer Copper Pullback on RF Pads

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3.4 Antenna Placement and Routing

The antenna is the element used to convert the guided waves on the PCB traces to the free space electromagnetic radiation. The placement and layout of the antenna are the keys to increased range and data rates. Table 9 provides a summary of the recommended antennas to use with the CC3235MODx module.

SR NO. GUIDELINES

1 Place the antenna on an edge or corner of the PCB. 2 Ensure that no signals are routed across the antenna elements on all the layers of the PCB.

5 Ensure that the antenna impedance is 50 Ω because the module is rated to work only with a 50-Ω system. 6 In case of printed antenna, ensure that the simulation is performed with the solder mask in consideration. 7 Ensure that the antenna has a near omnidirectional pattern.

Most antennas, including the chip antenna used on the LaunchPad, require ground clearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers as well.

Ensure that there is provision to place matching components for the antenna. These must be tuned for best return loss when the complete board is assembled. Any plastics or casing must also be mounted while tuning the antenna because this can impact the impedance.

The feed point of the antenna is required to be grounded. This is only for the antenna type used on the CC3235MODx LaunchPad. See the specific antenna data sheets for the recommendations.

Layout Guidelines

Table 9. Antenna Guidelines

3.5 Transmission Line Considerations

The RF signal from the module is routed to the antenna using a Coplanar Waveguide with ground (CPWG) structure. CPW-G structure offers the maximum amount of isolation and the best possible shielding to the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional shielding. Figure 22 shows a cross section of the coplanar waveguide with the critical dimensions.

Figure 22. Coplanar Waveguide (Cross Section)

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Layout Guidelines

Figure 23 shows the top view of the coplanar waveguide with GND and via stitching.

The recommended values for the PCB are provided for 2-layer boards in Table 10 and for 4-layer boards in Table 11.

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Figure 23. CPW With GND and Via Stitching (Top View)

Table 10. Recommended PCB Values for 2-Layer Board

(L1 to L2 = 42.1 mils)

PARAMETER VALUE UNIT

W 26 mils S 5.5 mils H 42.1 mils Er (FR-4 substrate) 4.2 F/m

Table 11. Recommended PCB Values for 4-Layer Board

(L1 to L2 = 16 mils)

PARAMETER VALUE UNITS

W 21 mils S 10 mils H 16 mils Er (FR-4 substrate) 4.5 F/m

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4 Operational Setup and Testing

A compatible BoosterPack can be stacked on top of the LaunchPad using the two, 20-pin connectors. The connectors do not have a key to prevent the misalignment of the pins or reverse connection. Ensure that the VCC and 5-V pins are aligned with the BoosterPack header pins. On the CC3235MODSF LaunchPad, a small white symbol is provided near pin 1 (see Figure 24) to orient all BoosterPacks.

Figure 24. Pin 1 Marking on LaunchPad (3V3 Mark)

Operational Setup and Testing

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Operational Setup and Testing

4.1 Measuring the CC3235MOD Current Draw

To measure the current draw of the CC3235MOD device using a multimeter, use the VBAT jumper on the J101 isolation block. The current draw measured in this mode includes only the CC3235MOD device, Serial Flash, any current drawn through the BoosterPack plug-in module headers. However, if a GPIO of the CC3235MOD is driving a high current load like the LED, then that is also included in this measurement.

4.1.1 Low-Current Measurement with USB Power (<1 mA)

See the following instructions to measure ultra-low power when powering with a USB cable (see ).

1. Remove the VBAT jumper in the J101 isolation block, and attach an ammeter across this jumper.

2. Consider the effect that the backchannel UART and any circuitry attached to the CC3235MOD may

have on current draw. Consider disconnecting these at the siolation jumper block, or at least consider their current sinking and sourcing capability in the final measurement.

3. Begin target execution and set the device to low-power modes (LPDS or hibernate).

4. Measure the current. Remember that if the current levels are fluctuating, it may be difficult to get a

stable measurement. It is easier to measure quiescent states.

4.1.2 Active Current Measurements

See the following instructions to measure active power.

1. Remove the VBAT jumper (J18).

2. Solder a 0.1-Ω resistor on a wire which can be connected to a voltmeter/oscilloscope. Or, attach a

jumper across J18 so that it can be used with a current probe.

3. Measure the voltage across the resistor using an oscilloscope with a differential probe. For the current

probe, coil the wire around the sensor several times for good sensitivity.

• An ammeter can also be used for this measurement, but the results may be erroneous due to the switching nature of the current

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4.2 RF Connections

4.2.1 AP Connection Testing

By default, the board ships with the 2.4 GHz and 5 GHz RF signals routed to the onboard chip antenna, as shown in Figure 25.

Figure 25. Using Onboard Antenna (Default Condition)

Operational Setup and Testing

A U.FL connector J17 provides a way to test in the lab using a compatible cable. Alternatively, trackpads for an SMA connector J15 are provided onboard to replace the J17 U.FL connector for testing conducted measurements. A rework must be performed before these connectors can be used; this involves swapping the position of a resistor. Figure 26 shows the modified board.

Figure 26. Board Modified for External Antenna Connections (Measure 2.4 GHz or 5 GHz)

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Operational Setup and Testing

4.3 Design Files

4.3.1 Hardware Design Files

Schematics can be found in Section 7.2.All design files, including schematics, layout, Bill of Materials (BOM), Gerber files, and documentation are available for download from LAUNCHCC3235MOD.

4.4 Software

All design files, including firmware patches, software example projects, and documentation are available from the CC3235 Software Development Kit. Inside of the SDK, a set of very simple CC3235 code examples can be found that demonstrates how to use the entire set of CC3235 peripherals. When starting a new project or adding a new peripheral, these examples serve as a great starting point.

5 Development Environment Requirements

The following software examples with the LaunchPad require an integrated development environment (IDE) that supports the CC3235MOD.

The CC313x and CC323x SimpleLink™ Wi-Fi®Embedded Programming User's Guide has detailed information about software environment setup with examples. See this document for further details on the software sample examples.

5.1 CCS

CCS 6.0 or higher is required. When CCS is launched, and a workspace directory is chosen, use Project → Import Existing CCS Eclipse Project. Direct it to the desired demo project directory containing main.c.

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5.2 IAR

IAR 6.70 or higher is required. To open the demo in IAR, choose File → Open → Workspace…, and direct it to the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is within this file.

The subdirectory also has an *.ewp project file; this file can be opened into an existing workspace, using

Project → Add-Existing-Project….

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6 Additional Resources

6.1 CC3235MODx Product Page

For more information on the CC3235MOD device, visit the CC3235MOD product page, which includes the

CC3235MODx SimpleLink™ Wi-Fi®Wireless and Internet-of-Things Solution, a Single-Chip Wireless MCU data sheet and key documents such as the CC32xx SimpleLink™ Wi-Fi® and Internet-of-Things Technical Reference Manual.

6.2 Download CCS, IAR

Although the files can be viewed with any text editor, more can be done with the projects if they are opened with a development environment such as Code Composer Studio (CCS), IAR, or Energia. CCS and IAR are each available in a full version, or a free, code-size-limited version. The full out-of-box demo cannot be built with the free version of CCS or IAR (IAR Kickstart), due to the code-size limit. To bypass this limitation, a code-size-limited CCS version is provided that has most functionality integrated into a library. The code built into the library is able to be viewed by the user, but it cannot be edited. For full functionality, download the full version of either CCS or IAR.

6.3 SimpleLink™ Academy for CC3235 SDK

The SimpleLink™ Academy is a collection of curated training modules developed by TI subject matter experts to help developers get up and running as quickly as possible with a SimpleLink MCU device and its SDK. The training is delivered using TI Resource Explorer, which offers a powerful cloud-enabled environment that includes background information, interactive exercises, code snippets, quizzes, and more.

Experience the SimpleLink™ Academy now using the TI Resource Explorer at dev.ti.com.

Additional Resources

Figure 27. CC32xx SimpleLink™ Academy

6.4 TI E2E Community

Search the forums at e2e.ti.com. If you cannot find your answer, post your question to the community!

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Assembly Drawing and Schematics

7 Assembly Drawing and Schematics

7.1 Assembly Drawing

Figure 28. LAUNCHCC3235MOD Top-Layer Assembly Drawing

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PD0/AIN15/C0O/I2C7SCL/SSI2XDAT1/T0CCP0

PD1/AIN14/C1O/I2C7SDA/SSI2XDAT0/T0CCP1

PD2/AIN13/C2O/I2C8SCL/SSI2FSS/T1CCP0

PD3/AIN12/I2C8SDA/SSI2CLK/T1CCP1

PE3/AIN0/U1DTR

PE2/AIN1/U1DCD

PE1/AIN2/U1DSR

PE0/AIN3/U1RTS

PC7/C0-/EPI0S4/U5TX

PC6/C0+/EPI0S5/U5RX

PC5/C1+/EPI0S6/RTCCLK/U7TX

PC4/C1-/EPI0S7/U7RX

PH0/EPI0S0/U0RTS

PH1/EPI0S1/U0CTS

PH2/EPI0S2/U0DCD

PH3/EPI0S3/U0DSR

PA0/CAN0RX/I2C9SCL/T0CCP0/U0RX

PA1/CAN0TX/I2C9SDA/T0CCP1/U0TX

PA2/I2C8SCL/SSI0CLK/T1CCP0/U4RX

PA3/I2C8SDA/SSI0FSS/T1CCP1/U4TX

PA4/I2C7SCL/SSI0XDAT0/T2CCP0/U3RX

PA5/I2C7SDA/SSI0XDAT1/T2CCP1/U3TX

PA6/EPI0S8/I2C6SCL/SSI0XDAT2/T3CCP0/U2RX/USB0EPEN

PA7/EPI0S9/I2C6SDA/SSI0XDAT3/T3CCP1/U2TX/USB0EPEN/USB0PFLT

PF0/EN0LED0/M0PWM0/SSI3XDAT1/TRD2

PF1/EN0LED2/M0PWM1/SSI3XDAT0/TRD1

PF2/M0PWM2/SSI3FSS/TRD0

PF3/M0PWM3/SSI3CLK/TRCLK

PF4/EN0LED1/M0FAULT0/SSI3XDAT2/TRD3

PG0/EN0PPS/EPI0S11/I2C1SCL/M0PWM4

PG1/EPI0S10/I2C1SDA/M0PWM5

PB2/EPI0S27/I2C0SCL/T5CCP0/USB0STP

PB3/EPI0S28/I2C0SDA/T5CCP1/USB0CLK

PB0/CAN1RX/I2C5SCL/T4CCP0/U1RX/USB0ID

PB1/CAN1TX/I2C5SDA/T4CCP1/U1TX/USB0VBUS

PC3/SWO/TDO

PC2/TDI

PC1/SWDIO/TMS

PC0/SWCLK/TCK

100

PB5/AIN11/I2C5SDA/SSI1CLK/U0RTS

120

PB4/AIN10/I2C5SCL/SSI1FSS/U0CTS

121

PE4/AIN9/SSI1XDAT0/U1RI

123

PE5/AIN8/SSI1XDAT1

124

PD4/AIN7/SSI1XDAT2/T3CCP0/U2RX

125

PD5/AIN6/SSI1XDAT3/T3CCP1/U2TX

126

PD6/AIN5/SSI2XDAT3/T4CCP0/U2RTS/USB0EPEN

127

PD7/AIN4/NMI/SSI2XDAT2/T4CCP1/U2CTS/USB0PFLT

128

PQ0/EPI0S20/SSI3CLK

PQ1/EPI0S21/SSI3FSS

PQ2/EPI0S22/SSI3XDAT0

PK0/AIN16/EPI0S0/U4RX

PK1/AIN17/EPI0S1/U4TX

PK2/AIN18/EPI0S2/U4RTS

PK3/AIN19/EPI0S3/U4CTS

PQ3/EPI0S23/SSI3XDAT1

PK7/EPI0S24/I2C4SDA/M0FAULT2/RTCCLK/U0RI

PK6/EN0LED1/EPI0S25/I2C4SCL/M0FAULT1

PK5/EN0LED2/EPI0S31/I2C3SDA/M0PWM7

PK4/EN0LED0/EPI0S32/I2C3SCL/M0PWM6

PM7/T5CCP1/TMPR0/U0RI

PM6/T5CCP0/TMPR1/U0DSR

PM5/T4CCP1/TMPR2/U0DCD

PM4/T4CCP0/TMPR3/U0CTS

PM3/EPI0S12/T3CCP1

PM2/EPI0S13/T3CCP0

PM1/EPI0S14/T2CCP1

PM0/EPI0S15/T2CCP0

PL0/EPI0S16/I2C2SDA/M0FAULT3/USB0D0

PL1/EPI0S17/I2C2SCL/PHA0/USB0D1

PL2/C0O/EPI0S18/PHB0/USB0D2

PL3/C1O/EPI0S19/IDX0/USB0D3

PL4/EPI0S26/T0CCP0/USB0D4

PL5/EPI0S33/T0CCP1/USB0D5

PL7/T1CCP1/USB0DM

PL6/T1CCP0/USB0DP

PQ4/DIVSCLK/U1RX

102

PP2/EPI0S29/U0DTR/USB0NXT

103

PP3/EPI0S30/RTCCLK/U0DCD/U1CTS/USB0DIR

104

PP4/U0DSR/U3RTS/USB0D7

105

PP5/I2C2SCL/U3CTS/USB0D6

106

PN0/U1RTS

107

PN1/U1CTS

108

PN2/EPI0S29/U1DCD/U2RTS

109

PN3/EPI0S30/U1DSR/U2CTS

110

PN4/EPI0S34/I2C2SDA/U1DTR/U3RTS

111

PN5/EPI0S35/I2C2SCL/U1RI/U3CTS

112

PJ0/EN0PPS/U3RX

116

PJ1/U3TX

117

PP0/C2+/SSI3XDAT2/U6RX

118

PP1/C2-/SSI3XDAT3/U6TX

119

TM4C1294NCPDTI3R

U1A

VDD

VDDA8GNDA

VDD

GND

VDD

GND

VDD

GND

VBAT

VDD

GND

VDDC

VDD

101

VDD

113

GND

114

VDDC

115

VDD

122

TM4C1294NCPDTI3R

U1C

33.0R2

33.0R4

33.0R6

33.0R7

33.0R8

33.0R9

33.0R10

XDS_UART_RX XDS_UART_TX

XDS_JTAG_TCK XDS_JTAG_TMS XDS_JTAG_TDO XDS_JTAG_TDI

ITCK ITMS ITDI ITDO

330k

R11

VBUS_USB1

220k

R12

0.01uF

GND

Red

220

R15

LED0

Green

LED1

220

R14

GND

1.0kR16

1.0kR17

1.0kR18

1.0kR20

VCC_LDO_3V3

GND

XDSET_P XDSET_N

51R23

VCC_LDO_3V3

1uF

GND

0.01uFC50.01uFC60.01uFC70.1uFC80.1uFC90.1uF

C10

GND

0.01uF

C14

1uF

C15

GND

2.2uF

C16

0.1uF

C17

1uF

C18

GND

VCC_LDO_3V3

TM4C HOST MCU FOR EMULATION

XDSET_P XDSET_N

0R3

XDSET_ID

100R5 VBUS_USB1

0.1uF

GND

ID -> PK[7:4] =0x07

XDS_JTAG_TCK XDS_JTAG_TMS XDS_JTAG_TDO

XDS_JTAG_TDI

XDS_nRESET

XDSET_ID

VCC_LDO_3V3

1.0k

VCC_BRD

1 2 3 4 5 6 7 8 9 10

1.0k

R13

VCC_LDO_3V3

1 2 3 4 5 6 7 8 9 10

P55_GPIO_01

P57_GPIO_02

1.0k

R19

R22

R21

P01_GPIO_10 P02_GPIO_11

TP1

1 2 3 4 5 6 7 8

9 10 11 12 13 14

VBAT_CC

GND

GND GND

GND

WAKE

HIB

XOSC0

XOSC1

RST

OSC0

OSC1

EN0RXIN

EN0RXIP

EN0TXON

EN0TXOP

VREFA+

RBIAS

TM4C1294NCPDTI3R

U1B

10k

R24

VCC_LDO_3V3

100

R25

IRSTN

GND

VREFA

4.87k

R27

GND

16MHz

22pF

C11

22pF

GND

VCC_LDO_3V3

1.0k

R26

123

LM4040B25IDBZR

0.01uF

C12

1uF

C13

GND

VREFA

VCC_LDO_3V3

GND

ITMS

ITCK

ITDO

ITDI

IRSTN

1 2 3 4 5 6

CMP-0075101-1

DNP

XDS_JTAG_TMS XDS_JTAG_TCK XDS_JTAG_TDO XDS_JTAG_TDI

XDS_CC_nRESET

P20_JTAG_TMS P19_JTAG_TCK P17_JTAG_TDO P16_JTAG_TDI CC_nRESET

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7.2 Schematics

Assembly Drawing and Schematics

Figure 29. Schematics (1 of 5)

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100k

R31

0.01uF

C21

GND

10 ohm

VBUS_USB1

GND

D1+

D1-

GND

D2+

D2-

GND

TPD4S010DQAR

GND

USB-INTERFACE

XDSET_N

XDSET_P

XDSET_ID

VCC_Buffer VCC_LDO_3V3

VCCA

DIR

GND

VCCB

SN74LVC1T45DCKR

0.1uF

C20

XDS_nRESET

GND

GNDGND

0.1uF

C19

100k

R28

GND

12 34 56 78 910

61301021121

10k R29

XDS_JTAG_TDI XDS_JTAG_TDO XDS_JTAG_TCK XDS_JTAG_TMS

P19_JTAG_TCK P20_JTAG_TMS

CC_nRESET

P17_JTAG_TDO

P16_JTAG_TDI

GND

VCC_Buffer

Yellow

XDS_UART_RX

P55_GPIO_01

LP_GPIO_01

VCC_Buffer VCC_LDO_3V3

33.0

R34

VCCA

DIR

GND

VCCB

SN74LVC1T45DCKR

0.1uF

C22

0.1uF

C23

100k

R33

123

J11

XDS_UART_TX

P57_GPIO_02

LP_GPIO_02

VCC_Buffer VCC_LDO_3V3

0.1uF

C29

0.1uF

C30

VCCA

DIR

GND

VCCB

SN74LVC1T45DCKR

GND

GNDGND

GND

J12

33.0

R37

GND

to Host-MCUto Targ et

10uF

C24

100uF

C27

100uF

C28

10uF

C26

270

R35

J10

J7 J8

2.2uH

22uF

C25

100k

R36

CHECK LAYOUT GUIDE FROM DATASHEET

POWER MANAGEMENT

TPS62162DSGR

PGND

VIN

AGND

VOS

VBUS_USB1 VCC_MCU_5V

VCC_LDO_3V3 VCC_BRD VCC_Buffer

VBAT_CC

GND

GND GND GND GNDGND GND

VOLTA GE TRANSLATORS

Red

XDS_CC_nRESET

Q1 BSS138

100

R32

VBUS

D-

D+

GND

678

11109

SW1

390

R30

Assembly Drawing and Schematics

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Figure 30. Schematics (2 of 5)

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P50_GPIO_00 P55_GPIO_01 P57_GPIO_02 P58_GPIO_03 P59_GPIO_04 P60_GPIO_05 P61_GPIO_06 P62_GPIO_07 P63_GPIO_08 P64_GPIO_09 P01_GPIO_10 P02_GPIO_11 P03_GPIO_12 P04_GPIO_13

P07_GPIO_16 P08_GPIO_17 P15_GPIO_22 P18_GPIO_28 P53_GPIO_30

P05_GPIO_14 P06_GPIO_15

RF_ABG

P20_JTAG_TMS

P19_JTAG_TCK

P17_JTAG_TDO

P16_JTAG_TDI

J13

VBAT_CC

CC_nRESET

100k

R47

DNP

GND

0R45

0R46

P17_GPIO_24

P16_GPIO_23

0.1uF

C31

0.1uF

C32

0.1uF

C33

GND GND GND

VBAT_CC

J16

VCC_BRD

1 2 3 4 5 6

J18

SOP1

100kR44

VBAT_CC

SO/SIO1

WP/SIO2

GND

SI/SIO0

SCLK

RESET/SIO3

VCC

MX25R6435FM2IL0

DNP

GND

R39

DNP

R38

DNP

R40

DNP

R41

DNP

R42

DNP

R43

DNP

VCC_BRD VBAT_CC

0.1uF

C34

GND

1 2 3 4 5 6

J14

TC2050-IDC-NL-FP

DNP

GND

P21_GPIO_25

10k

R52

GND

2.2k

R51

OUTPUT ONLY

10k

R49

CC3235MOD TA RGET EXTERNAL FLASH

GANG PROGRAMMING CONNECTOR

SOP JUMPERS

SOP0

GND

345

M830520

Feed

GND GND GND

GND

345

J15

DNP

GND

GNDGND

RF SECTION

RF_ABG

0.5pF

C40

DNP

GND

J17

SPI_MISO

SPI_CS_IN

SPI_CLK

SPI_MOSI

SPI_CS_IN

P17_JTAG_TDO

P16_JTAG_TDI

P19_JTAG_TCK

SOP2

SOP0 SOP1 SOP2

SPI_MISO

SPI_MOSI

SPI_CLK

SPI_CS_IN

SPI_CLK

SPI_MISO

SPI_MOSI

CC_nRESET

0.5pF

C36

DNP

0.5pF

C37

DNP

0.5pF

C38

DNP

GND

GPIO10

GPIO11

GPIO14

GPIO15

GPIO16

GPIO17

GPIO12

GPIO13

GPIO22

JTAG_TDI

FLASH_SPI_MISO

FLASH_SPI_CS_IN

FLASH_SPI_CLK

GND

FLASH_SPI_MOSI

JTAG_TDO

GPIO28

JTAG_TCK

JTAG_TMS

SOP2

SOP1

GND

RF_ABG

GND

SOP0

RESET

VBAT_RESET

VBAT1

GND

VBAT2

GPIO30

GND

GPIO0

GPIO01

GPIO02

GPIO03

GPIO04

GPIO05

GPIO06

GPIO07

GPIO08

GPIO09

GND

CC3235MODSF12MOBR

CC1

1pF

C39

4.7nH

C35

8.2pF

R50

8.2pF

R48

DNP

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Assembly Drawing and Schematics

Figure 31. Schematics (3 of 5)

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P17_GPIO_24

P02_GPIO_11

P01_GPIO_10

P16_GPIO_23

SENS_I2C_SCL

SENS_I2C_SDA

I2C BUS SELECTION

0R130

0R134

DNP

0R137

0R139

DNP

J23

J24

SWITCHES & FACTORY RESET

LP_RESET_OUTCC_nRESET

VCC_BRD

100k

R142

CDBU00340

LED INDICAT ORS

P02_GPIO_11

P01_GPIO_10

P64_GPIO_09

GND GND GND

GND

Q5 BSS138

Q6 BSS138

Q7 BSS138

J26 J27 J28

100k

R150

100k

R151

100k

R152

TEMP SENSOR

VCC_BRD

GND

R125

R128

R132

DNP

R136

R135

SENS_I2C_SDA

SENS_I2C_SCL

0.1uF

C46

GND

ACCELEROMETER

P04_GPIO_13

SENS_I2C_SDA

SENS_I2C_SCL

VCC_BRD

0.1uF

C48

0.1uF

C47

R129

DNP

R131

0R138

0R141

R133

DNP

R124

GND

P04_GPIO_13 P15_GPIO_22

GND

1.0k

R148

1.0k

R149

10k

R155

10k

R156

GND GND

SOP1 SOP0

VCC_BRDVCC_BRD

3.3k

R126

3.3k

R127

VCC_BRD VCC_BRD VCC_BRD

J25

100k

R144

Q3A BSS84DW-7-F

Q3B

413

SW4 EVQ-PSD02K

1.0k

R154

Q4 FDN358P

Red

270

R153

VCC_BRD VCC_BRD

VCC_BRD

GND

GND GND

SCL

GND

ALERT

ADD0

V+

SDA

PAD

TMP116AIDRVR

U10

SDO

SDX

VDDIO

INT1

INT2

VDD

GNDIO

GND

CSB

SCX

U11

BMA280

R140

SW2

SW3

R147

110

R146

R145

42536

19-337/R6GHBHC-A01/2T

10k

R143

Assembly Drawing and Schematics

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Figure 32. Schematics (4 of 5)

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R105

DNP

R104

FDN358P

DNP

TP2

GND GND

GND

VCC_MCU_5V VBAT_CC

+3.3V

Analog_In

LP_UART_RX

LP_UART_TX

GPIO !

Analog In

SPI_CLK

GPIO !

I2C_SCL

I2C_SDA

+5V

GND

Analog_In

Analog_In/I2S_WS

Analog_In/I2S_SCLK

Analog_Out/I2S_SDout

Analog_Out/I2S_SDin

VCC_MCU_5V

GND

GPIO !

Timer_Cap/GPIO !

PWM/GPIO !

GPIO !

SPI_CS/GPIO !

SPI_MISO

SPI_MOSI

RST

GPIO

GPIO !

PWM/GPIO !

GND

R57

DNP

R58

VBAT_CC

VCC_BRD

0R61

DNP

0R64 0R65 0R68 0R69 0R71 0R72

0R74

DNP

0R75 0R78 0R79 0R82 0R83 0R86 0R87 0R90 0R91

0R97

DNP

0R100

DNP

ANA_IN1 ANA_IN4 ANA_IN2 ANA_IN3

P63_GPIO_08 P53_GPIO_30 P64_GPIO_09 P50_GPIO_00

ANA_IN2

P04_GPIO_13 P03_GPIO_12 P61_GPIO_06

ANA_IN3

P05_GPIO_14 P62_GPIO_07 P01_GPIO_10 P02_GPIO_11

P16_GPIO_23 P17_GPIO_24

AlternateI2C

0R60

DNP

0R62

DNP

0R63

0R66

DNP

0R67

0R70

DNP

0R73

DNP

0R76

DNP

0R77

0R80

DNP

0R81

0R84

DNP

0R85 0R88 0R89 0R92 0R93

0R53

0R54

0R95

DNP

0R98

DNP

0R101

DNP

Alternate RTS

Alternate CTS

For Antenna diversity

0R96

DNP

0R99

DNP

SWAP MOSI/MISO

0R94

DNP

P60_GPIO_05

0R102

DNP

0R103

DNP

P03_GPIO_12 P04_GPIO_13

P58_GPIO_03& P50_GPIO_00 can alsobe used for ANTSEL

COEX_SW_OUT& CC_COEX_BLE_IN routedto ANTSEL onDiversity Board

100k

R55

100k

R56

GNDGND

P58_GPIO_03

P50_GPIO_00

P17_GPIO_24 P64_GPIO_09 P21_GPIO_25 P18_GPIO_28 P62_GPIO_07 P60_GPIO_05 P16_GPIO_23 P17_GPIO_24

P02_GPIO_11 P01_GPIO_10

P62_GPIO_07

P50_GPIO_00

P61_GPIO_06

0R59

DNP

P59_GPIO_04

LP_RESET_OUT P07_GPIO_16 P06_GPIO_15 P21_GPIO_25

P08_GPIO_17

LP_GPIO_01

P18_GPIO_28

P15_GPIO_22

P06_GPIO_15 P07_GPIO_16

P59_GPIO_04/ DIO 12 onCC2640R2LP

(COEX_WAKEUP)

J21

VCC_BRD VCC_OPAMP

ADC DRIVER

ANA_IN1

GND

LP_GPIO_02

0.01uF

C41

VCC_OPAMP

576k

R110

422k

R113

GND

OPA4342EA/250

U9A

OPA4342EA/250

U9B

OPA4342EA/250

U9C

OPA4342EA/250

U9D

0R106

DNP

470

R111

0.01uF

C43

ANA_IN2

VCC_OPAMP

576k

R119

422k

R123

GND

R115

DNP

470

R120

0.01uF

C45

P58_GPIO_03

ANA_IN4

VCC_OPAMP

576k

R108

422k

R112

R107

DNP

470

R109

0.01uF

C42

ANA_IN3

VCC_OPAMP

576k

R116

422k

R122

R114

DNP

470

R117

0.01uF

C44

P60_GPIO_05

P59_GPIO_04

GND

J22

GND

BOOSTER PACK INTERFACE

R121

DNP

R118

1 2 3

J19

1 2 3

J20

CC_COEX_SW_OUT

CC_COEX_BLE

CC_COEX_WAKEUP

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Assembly Drawing and Schematics

Figure 33. Schematics (5 of 5)

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Revision History

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Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (February 2019) to A Revision .................................................................................................. Page

• Added last paragraph to Section 1.6.2 ................................................................................................. 8

• Added Section 6.3 ....................................................................................................................... 41

Revision History

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User's Guide

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Manual Information to the End User

1 The OEM integrator must be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end user manual must include all required regulatory information and warnings as shown in this manual.

2 RF Function and Frequency Range

The CC3235MODSM2MOB and CC3235MODSF12MOB devices are designed to operate in the WLAN

2.4-GHz and 5-GHz band. The CC3235MODSM2MOB and CC3235MODSF12MOB devices support the following channels dependent on the region of operation:

• FCC and IC: Ch 1 to 11 (2142 MHz to 2462 MHz) and 36 to 161 (5180 MHz to 5805 MHz)

• EU: Channels 1 through 13 (2142 MHz to 2472 MHz) and 36 to 136 (5180 MHz to 5680 MHz)

• JP: Channels 1 through 13 (2142 MHz to 2472 MHz) and 36 to 136 (5180 MHz to 5680 MHz) Note that the CC3235MODx devices do not support determination of its region through any external

mechanism. The region is set by the application SW, or at the time of programming of the device. The end user is unable to change the region of operation at any time.

NOTE: The maximum RF power transmitted in each WLAN 2.4 GHz band is 19 dBm (EIRP power).

The maximum RF power transmitted in each WLAN 5 GHz band is 18.8 dBm (EIRP power).

3 FCC and IC Certification and Statement

This device is intended for OEM integrators under the following conditions:

• The antenna must be installed so 20 cm of space is maintained between the antenna and the users.

• The transmitter module may not be colocated with any other transmitter of antenna.

• To comply with FCC and IC regulations limiting maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile exposure condition must not exceed:

– +2.5 dBi in WLAN 2.4 GHz – +4.5 dBi in WLAN 5 GHz

In the event that these conditions cannot be met (for example, certain laptop configurations or colocation with another transmitter), then the FCC and IC authorization is no longer considered valid and the FCC and IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and IC authorization.

3.1 FCC

The TI CC3235MODx modules are certified for FCC as a single-modular transmitter. The module is an FCC-certified radio module that carries a modular grant.

You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:

• This device may not cause harmful interference.

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FCC and IC Certification and Statement

• This device must accept any interference received, including interference that may cause undesired operation of the device.

FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. this equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from the one the receiver is connected to.

• Consult the dealer or an experienced radio or TV technician for help.

The antennas listed in Table 12 of this document were verified in the compliance testing. Use only the antennas listed in Table 12 . A separate approval is required for all other operating configurations, including different antenna configurations

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CAUTION

3.2 CAN ICES-3(B) and NMB-3(B) Certification and Statement

The TI CC3235MODx modules are certified for IC as a single-modular transmitter. The TI CC3235MODx modules meet IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC regarding certified modules in authorized equipment.

This device complies with Industry Canada license-exempt RSS standards. Operation is subject to the following two conditions:

• This device may not cause interference.

• This device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.

L'exploitation est autorisée aux deus conditions suivantes:

• L'appareil ne doit pas produire de brouillage.

• L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage ests susceptible d'en compromettre lu fonctionnement.

Manual Information to the End User

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IC RF Radiation Exposure Statement:

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body.

Déclaration d'exposition aux radiations:

Cut équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps.

This radio transmitter (451I-CC3235MOD) has been approved by Industry Canada to operated with the antenna types listed in Table 12 of this document with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

3.3 End Product Labeling

This module is designed to comply with the FCC statement, FCC ID: Z64-CC3220MOD. The host system using this module must display a visible label indicating the following text:

• Contains FCC ID: Z64-CC3235MOD This module is designed to comply with the IC statement, IC: 451I-CC3220MOD. The host system

using this module must display a visible label indicating the following text:

• Contains IC: 451I-CC3235MOD This module is designed to comply with JP statement 201-190033. The host system using this module

must display a visible label indicating the following text:

• Contains transmitter module with certificate module 201-190033

FCC and IC Certification and Statement

CAUTION

3.4 Device Classifications

Because host devices vary widely with design features and configurations, module integrators shall reference the following guidelines regarding device classification and simultaneous transmission, and seek guidance from their preferred regulatory test lab to determine how regulatory guidelines will impact the device compliance. Proactive management of the regulatory process will minimize unexpected schedule delays and costs due to unplanned testing activities.

The module integrator must determine the minimum distance required between their host device and the body of the user. The FCC provides device classification definitions to assist in making the correct determination. Note that these classifications are guidelines only; strict adherence to a device classification may not satisfy the regulatory requirement as near-body device design details may vary widely. The user-preferred test lab will be able to assist in determining the appropriate device category for the host product and if a KDB or PBA must be submitted to the FCC.

Note, the module that the user is using has been granted modular approval for mobile applications. Portable applications may require further RF exposure (SAR) evaluations. It is also likely that the host and module combination will need to undergo testing for FCC Part 15, regardless of the device classification. The preferred test lab of the user will be able to assist in determining the exact tests which are required on the host and module combination.

3.5 FCC Definitions

Portable: (§2.1093)— A portable device is defined as a transmitting device designed to be used so that

the radiating structures of the device is or are within 20 centimeters of the body of the user.

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FCC and IC Certification and Statement

Mobile: (§2.1091) (b)— A mobile device is defined as a transmitting device designed to be used in other

than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter’s radiating structures and the body of the user or nearby persons. Per §2.1091d(d)(4) In some cases (for example, modular or desktop transmitters), the potential conditions of use of a device may not allow easy classification of that device as either Mobile or Portable. In these cases, applicants are responsible for determining minimum distances for compliance for the intended use and installation of the device based on evaluation of either specific absorption rate (SAR), field strength, or power density, whichever is most appropriate.

3.6 Simultaneous Transmission Evaluation

This module has not been evaluated or approved for simultaneous transmission as it is impossible to determine the exact multi-transmission scenario that a host manufacturer may choose. Any simultaneous transmission condition established through module integration into a host product must be evaluated per the requirements in KDB447498D01(8) and KDB616217D01,D03 (for laptop, notebook, netbook, and tablet applications).

These requirements include, but are not limited to:

• Transmitters and modules certified for mobile or portable exposure conditions can be incorporated in mobile host devices without further testing or certification when:

– The closest separation among all simultaneous transmitting antennas is > 20 cm

– Antenna separation distance and MPE compliance requirements for ALL simultaneous transmitting

antennas have been specified in the application filing of at least one of the certified transmitters within the host device. In addition, when transmitters certified for portable use are incorporated in a mobile host device, the antennas must be > 5 cm from all other simultaneous transmitting antennas

• All antennas in the final product must be at least 20 cm from users and nearby persons.

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4 EU Certification and Statement

4.1 RF Exposure Information (MPE)

This device has been tested and meets applicable limits for Radio Frequency (RF) exposure. To comply with the RF exposure requirements, this module must be installed in a host platform that is intended to be operated in a minimum of 20-cm separation distance to the user.

4.2 Simplified DoC Statement

4.2.1 CC3235MODx

Hereby, Texas Instruments declares that the radio equipment type CC3235MODSM2MOB and CC3235MODSF12MOB are in compliance with Directive 2014/53/EU.

The full text of the EU declarations of conformity are available at:

• CC3220MODSM2MOB EC Declaration of Conformity (DoC)

• CC3220MODSF12MOB EC Declaration of Conformity (DoC)

• CC3220MODASM2MON EC Declaration of Conformity (DoC)

• CC3220MODASF12MON EC Declaration of Conformity (DoC)

4.2.2 LAUNCHCC3235MOD

Hereby, Texas Instruments declares that the radio equipment type LAUNCHCC3235MOD is in compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity are available at LAUNCHCC3220MODASF EC

Declaration of Conformity (DoC).

Manual Information to the End User

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Waste Electrical and Electronic Equipment (WEEE)

This symbol means that according to local laws and regulations your product and/or battery shall be disposed of separately from household waste. When this product reaches its end of life, take it to a collection point designated by local authorities. Proper recycling of your product will protect human health and the environment.

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4.3 Waste Electrical and Electronic Equipment (WEEE)

4.4 OEM and Host Manufacturer Responsibilities

OEM and host manufacturers are ultimately responsible for the compliance of the host and module. The final product must be reassessed against all of the essential requirements of the RED before it can be placed on the EU market. This includes reassessing the transmitter module for compliance with the radio and EMF essential requirements of the RED. This module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment.

4.5 Antenna Specifications

In all cases, assessment of the final product must be met against the Essential requirements of RE Directive Article 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3 requirements.

1. The antennas listed in Table 12 were verified in the conformity testing, and for compliance the antenna shall not be modified. A separate approval is required for all other operating configurations, including different antenna configurations.

2. If any other simultaneous transmission radio is installed in the host platform together with this module, or above restrictions cannot be kept, a separate RF exposure assessment and CE equipment certification is required.

EU Certification and Statement

5 CC3235MODx Approved Antennas

Table 12. CC3235MODx Approved Antennas

Antenna Information

Brand Antenna Type Model 2.4-GHz Gain 5-GHz Gain

1 Pulse Chip W3078 1.7 4.3 2 Yageo ANT5320LL04R2455A2.17 3.51

3 Ethertronics M830520 1 2.6 4 PCB 1000423 -0.6 4.5 5 Laird CAF94504 2 4 6 CAF94505 2 4 7 LSR Dipole 001-0012 2 2 8 080-0013 2 2 9 080-0014 2 2 10 PIFA 001-0016 2.5 3 11 001-0021 2.5 3

SWRU548A–February 2019

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Texas Instruments orporated CC3235MOD User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

CC3235MODSF SimpleLink™ Wi-Fi®and IoT Solution With MCU LaunchPad™ Hardware

Table of Contents

1 Introduction

1.1 CC3235MODSF LaunchPad™

1.2 LAUNCHCC3235MOD Key Features

1.3 What's Included

1.3.1 Kit Contents

1.3.2 Software Examples

1.4 REACH Compliance

1.5 Regulatory Compliance

1.6 First Steps: Out-of-Box Experience

1.6.1 Connecting to the Computer

1.6.2 Running the Out-of-Box Experience

1.7 Next Steps: Looking into the Provided Code

1.8 Trademarks

2 Hardware

2.1 Block Diagram

2.2 Hardware Features

2.2.1 Key Benefits

2.2.2 XDS110-Based Onboard Debug Probe

2.2.3 Debug Probe Connection: Isolation Jumper Block

2.2.4 Application (or "Backchannel") UART

2.2.5 JTAG Headers

2.2.6 Using the XDS110 Debug Probe with a Different Target

2.2.7 Power Connections

2.2.7.1 XDS110 USB Power

2.2.7.2 BoosterPack Plug-in Module and External Power Supply

2.2.8 Reset Pullup Jumper

2.2.9 Clocking

2.2.10 I2C Connection

2.2.10.1 Default I2C Addresses

2.2.11 Sense on Power (SOP)

2.2.12 Push-Buttons and LED Indicators

2.3 Electrical Characteristics

2.4 Antenna Characteristics

2.5 BoosterPack™ Header Pin Assignment

3 Layout Guidelines

3.1 LAUNCHCC3235MOD Board Layout

3.2 General Layout Recommendations

3.3 RF Layout Recommendations

3.4 Antenna Placement and Routing

3.5 Transmission Line Considerations

4 Operational Setup and Testing

4.1 Measuring the CC3235MOD Current Draw

4.1.1 Low-Current Measurement with USB Power (<1 mA)

4.1.2 Active Current Measurements

4.2 RF Connections

4.2.1 AP Connection Testing

4.3 Design Files

4.3.1 Hardware Design Files

4.4 Software

5 Development Environment Requirements

5.1 CCS

5.2 IAR

6 Additional Resources

6.1 CC3235MODx Product Page

6.2 Download CCS, IAR

6.3 SimpleLink™ Academy for CC3235 SDK

6.4 TI E2E Community

7 Assembly Drawing and Schematics

7.1 Assembly Drawing

7.2 Schematics

Revision History

2 RF Function and Frequency Range

3 FCC and IC Certification and Statement

3.1 FCC

3.2 CAN ICES-3(B) and NMB-3(B) Certification and Statement

3.3 End Product Labeling

3.4 Device Classifications

3.5 FCC Definitions

3.6 Simultaneous Transmission Evaluation

4 EU Certification and Statement

4.1 RF Exposure Information (MPE)

4.2 Simplified DoC Statement

4.2.1 CC3235MODx

4.2.2 LAUNCHCC3235MOD