EVM User’s Guide
Date (Version)
Author
Approved by
Description
Initial Release
CC3100MOD Boosterpack™ (Evaluation board) User
Guide
ECS Applications
Table 1. Document Change Log
TI Confidential – Strictly Private 2
EVM User’s Guide
Contents
Getting Started .......................................................................................................................... 4
1 Introduction ....................................................................................................................... 4
1.1 CC3100MOD BOOST 4
1.2 CC3100MOD Module 4
2 Hardware description ........................................................................................................ 5
2.1 Block Diagram 6
2.2 Hardware Features of the evaluation board 6
2.3 Connector and jumper descriptions 7
2.3.1 Push buttons and LEDs 7
2.3.2 Jumper settings 7
2.3.3 2x20 pin connector assignment 9
2.4 Power 10
3 Connecting to the PC using EMUBOOST ...................................................................... 11
3.1 CC31XXEMUBOOST 11
3.2 Mating the boards 12
3.3 Jumper settings on the EMUBOOST 12
4 Connecting to a Launchpad .......................................................................................... 14
4.1 Launchpad current limitation 14
5 PCB information .............................................................................................................. 15
5.1 Layout information 15
5.2 Antenna pattern 17
5.3 Schematics 18
5.4 Bill of materials 20
TI Confidential – Strictly Private 3
Getting Started
1 Introduction
1.1 CC3100MOD BOOST
Introducing the CC3100MOD Booster pack compatible with all TI Launchpads for adding
WIFI capability to embedded systems.
The CC3100MODBOOST Booster Pack is an easy-to-use evaluation module for the
CC3100 WIFI device. It contains everything needed to start developing a WIFI solution on
TI Launchpad. This board is also designed to interface with another board named
CC3100EMUBOOST (FTDI based Emulation and debug board) to provide an interface to
the PC for development using SimpleLink™ Studio (TI provided application and source
code to develop WIFI based software on a PC)
The CC3100MOD module integrates the complete RF, digital baseband, and power
management needed to provide WIFI access to any embedded system using a 8,16 ot 32
bit Microcontrollers.
Rapid prototyping is a snap thanks to the 40-pin headers and a wide variety of
Launchpads available. These connectors provide stackability to ensure that other
booster-packs like Audio, LCD, sensors etc. can be mounted on top or bottom of this
booster-pack.
EVM User’s Guide
1.2 CC3100MOD Module
The CC3100MOD module is a second-generation SimpleLink™ Wi-Fi self-contained
network processor module that dramatically simplifies the implementation of Internet
connectivity. The CC3100MOD module is an ideal solution for embedded applications
using low-cost and low-power microcontrollers with reduced board space and faster
development times.
Fully integrated module with serial flash, Crystal and RF filter. Only needs power
supply and a serial interface to operate.
802.11 b/g/n Station With Fully Integrated Radio, Baseband, and MAC
802.11 Transceiver Mode
IPv4 TCP/IP Stack
8 Simultaneous TCP, UDP, or RAW Sockets
ARP, ICMP, DHCP, DNS, mDNS
TLS 1.2/SSL 3.0 With On-Chip Accelerat ors
Throughput UDP: 16 Mbps, TCP: 12 Mbps
Interfaces With 8-, 16-, and 32-bit MCU over an SPI Interface with up to 24-MHz
Clock
TI Confidential – Strictly Private 4
nHIB
nRESET
(Optional)
Micro USB Conn
(Power only)
3.3V Dc/Dc
CC3100
Chip
Antenna
OOB
U.FL
Conn
PWR
SEL
20 pin LP
Connector
20 pin LP
Connector
CC3100MOD
2 Hardware description
EVM User’s Guide
Figure 1 : CC3100MODBOOST evaluation board with the CC3100MOD Module
TI Confidential – Strictly Private 5
2.1 Block Diagram
CC3100MOD
2x20 headers
Micro
USB
3.3V
LDO
Chip
Antenna
Jumper
Murata
Conn
Diode
Mux
5V
5V
3.3V
Current
Meas
J6
J8
U.FL
Conn
Vcc
LED
Indicators
SPI/UART/GPIO
Push
Buttons
EVM User’s Guide
Figure 2 : CC3100MODBOOST Block diagram
2.2 Hardware Features of the evaluation board
• CC3100MOD module with fully integrated solution.
2x20 pin stackable connectors
• On-board chip antenna with option for U.FL based conducted testing.
• Power from on-board LDO using USB OR 3.3V from MCU Launchpad
• Push buttons (3x), LEDs (2x)
• Jumper for current measurement with provision to mount 0.1R resistor for measurement
with voltmeter
• 2 Layer PCB with 6mil spacing and track width.
TI Confidential – Strictly Private 6
Reference
Usage
Comments
demo.
time.
Reference
Colour
Usage
Comments
provided to the board
functional.
the device is in hibernate state.
Reference
Usage
Comments
devices. For e.g. CC3100HZ
J8
Power selection
Choose the power supply from the
2.3 Connector and jumper descriptions
2.3.1 Push buttons and LEDs
Push buttons
SW1 OOB Demo This is used as an input for the OOB
SW2 RESET The use of this pin is optional. This is
EVM User’s Guide
used to reset the CC3100 device which
can also be accomplished using the
nHIB button. The RESET completely
erases the CC3100 RAM including the
LEDs
D5 RED PWR Indication Glows when the 3.3V power is
D1 Yellow nRESET This LED is used to indicate the
D6 Green nHIB This LED indicates the stated of
2.3.2 Jumper settings
J21 USB connector For powering the booster pack when
stated of nRESET pin. If this LED
is glowing, the device is
nHIB pin. When the LED is OFF,
mated with a Launchpad. This is
mandatory to use when using “Z”
TI Confidential – Strictly Private 7
EVM User’s Guide
Lauchpad or the on-board USB.
3.3V LDO
33K resistor.
Launchpad.
production line tests.
the lab.
J8 (1-2) power from MCU Launchpad
J8 (2-3) power from on-board USB using
J6 Current
measurement
For Hibernate and LPDS currents
connect a ammeter across J26 : Range
(< 500uA)
For Active current, mount a 0.1 Ohm
resistor on R42 and measure the voltage
across the 0.1 Ohm resistor using a
voltmeter. Range (< 50mV peak-peak)
J5 OOB Demo Closed : GPIO_12 is hard pulled to Vcc
Open : GPIO_12 is pulled to GND using
J10, J9 Booster pack header 2x10 pins each connected to the
J3 RF Test Murata connector (MM8030-2610) for
J2 RF Test U.FL connector for conducted testing in
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EVM User’s Guide
P1
P3
VCC(3.3V)
+5V
UN
-USED
GND
UART1_TX
NC
UART1_RX
NC
nHIB
NC
UNUSED
NC
SPI_CLK
NC
UN
-USED
NC
UN
-USED
NC
UN
-USED
NC
P4
P2
NC
GND
NC
IRQ
NC
SPI_CS
UART1_CTS
NC
UART1_RTS
nRESET
NC
SPI_MOSI
NWP_LOG_TX
SPI_MISO
WLAN_LOG_TX
NC
NC
NC
NC
NC
P4 P2P1 P3
Pin No
Signal Name
Direction
Pin No
Signal Name
Direction
P1.1
VCC(3.3V)
IN
P2.1
GND
IN
P1.2
UN-USED
NA
P2.2
IRQ
OUT
P1.3
UART1_TX
OUT
P2.3
SPI_CS
IN
P1.4
UART1_RX
IN
P2.4
UN-USED
NA
P1.5
nHIB
IN
P2.5
nRESET
IN
P1.6
UNUSED
NA
P2.6
SPI_MOSI
IN
P1.7
SPI_CLK
IN
P2.7
SPI_MISO
OUT
P1.8
UN-USED
NA
P2.8
UN-USED
NA
P1.9
UN-USED
NA
P2.9
UN-USED
NA
P1.10
UN-USED
NA
P2.10
UN-USED
NA
2.3.3 2x20 pin connector assignment
The signal assignment on the 2x20 pin connector is shown below. The convention of J1..J4
is replaced with P1…P4 to avoid confusion with the actual board reference.
Outer row connectors
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EVM User’s Guide
Pin No
Signal Name
Direction
Pin No
Signal Name
Direction
P3.1
+5V
IN
P4.1
UN-USED
OUT
P3.2
GND
IN
P4.2
UN-USED
OUT
P3.3
UN-USED
NA
P4.3
UN-USED
NA
P3.4
UN-USED
NA
P4.4
UART1_CTS
IN
P3.5
UN-USED
NA
P4.5
UART1_RTS
OUT
P3.6
UN-USED
NA
P4.6
UN-USED
NA
P3.7
UN-USED
NA
P4.7
NWP_LOG_TX
OUT
P3.8
UN-USED
NA
P4.8
WLAN_LOG_TX
OUT
P3.9
UN-USED
NA
P4.9
UN-USED
IN
P3.10
UN-USED
NA
P4.10
UN-USED
OUT
Inner row connectors
Note :
All signals are 3.3V COMS logic levels and is referred w.r.t. CC3100MOD. For e.g.
UART1_TX is an output from the CC3100MOD.
For the SPI lines, the CC3100MOD always acts like a slave.
2.4 Power
The board is designed to accept power from a mated Launchpad or from the
CC3100EMUBOOST board. Some of the launchpads are not capable of sourcing the
peak current requirements of the WIFI. In such a case the USB connector on the
CC3100MODBOOST can be used to aid the peak current. The use of schottky diodes
ensure that the load sharing happens between the USB connectors on the Launchpad
and the Boosterpack without any board modifications.
Also the 3.3V power can be sourced from the Launchpad or from the 3.3V LDO on the
board. This is done by using the jumper J8. In the case where the Launchpad is not able
to source the 3.3V upto 350mA, then the J8 needs to be configured to work from the onboard LDO
2.4.1 Power from the Launchpad or CC3100EMUBOOST
The most common scenario will be to power the CC3100MODBOOST from the ma te d
Launchpad. In this case the Launchpad provides 3.3V to the Booster-pack for its
operation. In addition to the 3.3V the Launchpad provides a 5V from the USB which is
used to drive a 3.3V LDO on the Booster-pack. This LDO sources the 3.3V used for the
top die flash used on development models.
TI Confidential – Strictly Private 10
Port No
Port Type
Usage
Comments
1
D2XX
SPI port for SL Studio
IRQ
programming
4
VCP
NWP
Network processor logger
3 Connecti ng to the PC using EMUBOOST
3.1 CC31XXEMUBOOST
3.1.1 Overview
The CC31XXEMUBOOST is designed to connect the CC3100MODBOOST pack to a PC
using USB connection. This is used to update the firmware on the BP using the
“SL_Prog” utility and also in software development using “SL_Studio”.
3.1.2 Hardware details
EVM User’s Guide
The board has two FTDI ICs to enumerate multiple COM and D2XX ports. The details of
the ports are given below
Ports available on J6
2 D2XX GPIO for SL Studio Control the nRESET, nHIB,
3 VCP COM port for flash
TI Confidential – Strictly Private 11
EVM User’s Guide
output. TX only
Port No
Port Type
Usage
Comments
only.
2
VCP
MAC logger
MAC logger output. TX only
No
Jumper settings
Notes
1
J4 (short)
Provide 3.3V to the Booster pack
Note : On the PC only two of the four ports would be visible on the Device Manager. The
D2XX ports are not listed under the “Ports” tab.
The first COM port in the list usually is used for the flash programming.
Ports available on J5
1 VCP RT3 Used for TI internal debug
3.1.3 Driver requirements
The FTDI Debug board requires the user to install the associated drivers on a PC. This
package is available as part of the SDK release and would be located at [InstallPath]\cc3100-sdk\tools\cc31xx_board_drivers\.
The install path is usually C:\ti\cc3100SDK
3.2 Mating the boards
The image above shows the connection of the CC3100MODBOOST to the
CC3100EMUBOOST Board. The connectors should be aligned carefully considering that
it does not have a polarity protection. The pin-1 of the connectors are marked on the
board using a small triangle marking and these should be aligned while mating.
Caution :
Align the pin-1 of the boards together using the triangle marking on the PCB. An incorrect
mating can destroy the boards permanently.
Ensure that none of the header pins are bent before mating the two boards. Jumper
settings on the CC3100BOOST
3.3 Jumper settings on the EMUBOOST
The following table specifies the jumpers to be installed while mating with the FTDI board.
TI Confidential – Strictly Private 12
2
J22 (short)
Provide 5.0V to the Booster pack
3
J3 (1-2)
Route the NWP logs to the Dual port also
The rest of the jumpers can remain open.
With these done, the EMUBOOST would resemble the board in the next section
EVM User’s Guide
TI Confidential – Strictly Private 13
4 Connecting to a Launchpad
The CC3100MOD Booster pack can be directly connected to a compatible Launchpad
using the standard 2x20 pin connectors. The jumper settings needed for this connection
is the same as that needed for the EMUBOOST board as described in the previous
section.
Please ensure that the Pin1 of the 2x20 pins are aligned correctly before mating. The
mated setup is as per the picture below. (Note the USB cable is connected to the Booster
Pack directly to power it only. For debugging, the USB cable on the Launchpad is also
required)
4.1 Launchpad current limitat i on
Some of the launchpads including the MSP430FRAM launchpads do not provide enough
current to power the CC3100MOD booster pack. The booster pack can consume upto
400mA peak from the 3.3V and hence it may be needed to power is separately.
EVM User’s Guide
For this a USB connector is provided on the Booster Pack to provide the 3.3V separately.
The power supply jumpers shall be configured as below when the power is supplied from
the on-board USB connector.
Important: Since there are two power sources in this setup it is important to follow the power-up
sequence.
Note : Always power the Booster Pack before powering the Launchpad. Failure to follow this
sequence may end up damaging the booster-pack permanently.
TI Confidential – Strictly Private 14
5 PCB information
5.1 Layout information
EVM User’s Guide
Figure 3 : Layer-1
TI Confidential – Strictly Private 15
EVM User’s Guide
Figure 4 : Layer-2
TI Confidential – Strictly Private 16
5.2 Antenna pattern
The antenna used on the evaluation platform is a chip antenna from Taiyo Yuden
(AH316M245001-T). The below figures depict the radiation patter from this chip antenna.
Note that the radiation pattern is influenced by presence of any metal parts nearby.
EVM User’s Guide
TI Confidential – Strictly Private 17
5.3 Schematics
EVM User’s Guide
TI Confidential – Strictly Private 18
EVM User’s Guide
TI Confidential – Strictly Private 19
5.4 Bill of materials
Qty Description PCB Footprint Part Number Manufacturer Mfr. PN
Part Ref eren ce
2 CAP CER 100nF 10% 10V SMD 0402 GP/HF X5R 0.5mm C-0402S0 202.00008.015 Murata GRM155R61A104KA01D C15 C27
14 RES C SMD 0402 0ohm 5% GP/HF C-0402S0 251.00681.025 Yageo RC0402JR-070RL
R15 R22 R29 R36 R37 R38 R44 R46 R48 R65 R66 R73 R81 R82
1 RES C SMD 0402 100ohm 5% GP /HF R-0402S0 251.00004.005 Yageo RC0402JR-07100RL
R12
6 RES C SMD 0402 100K ohm 1% GP /HF r-0402s0 261.00840.025 Yageo RC0402FR-07100KL R4 R6 R7 R75 R80 R111
2 CAP CER 100uF 20% 6.3V SMD 1210 GP/HF X5R 2.5mm C-1210 205.00025.005 MURATA GRM32ER60J107ME20L C65 C66
3 RES C SMD 0402 10K ohm 1% GP /HF r-0402s0 261.00839.035 Yageo RC0402FR-0710KL R8 R209 R210
2 CAP CER 10nF 10% 50V SMD 0402 GP/HF X7R T=0.5mm C-0402S0 202.01141.015 MURATA GRM155R71H103KA88D C3 C7
1 CAP CER 10pF + - 0.25pF 50V SMD 0402 GP/HF NPO 0. 5mm C-0402S0 202.00035.005
WALSIN 0402N100C500LT
C67
1 CAP CER 1. 0pF +-0.25pF 50V SMD 0402 G P /HF NPO T = 0.55mm C-0402S0 202.00021.005
WALSIN 0402N1R0C500LT
C64
1 EU-GP RES C S MD 0402 150Kohm 1% GP/HF r-0402s0 261.00013.005 TA-I RM04FTN1503 R13
3 SW TACT 50mA 12V SMD ST GP/HF SW-1BT002S1 182.00083.005
FOXCONN 1BT002-0120L-7H
SW1 SW2 SW3
2 RES C SMD 0402 1K ohm 1% GP /HF r-0402s0 261.00835.025 Yageo RC0402FR-071KL R9 R20
1 CAP CER 1uF 10% 6.3V SMD 0402 GP/HF X5R 0.5mm C-0402S0 202.00059.035 MURATA GRM155R60J105KE19D C47
1 CN-GP IND W W 1uH 20% 1.4A 0. 044ohm SMD GP/ L-S3X3A 132.00816.005 MURATA LQH3NPN1R0MM0L L1
1 2.4G WI FI chip antenna ANT-S3_2X1_6-2A JSAH316M245001 Taiyo_Yuden AH316M245001-T
ANT1
1 RES C SMD 0402 2.4Mohm 5% GP/HF R-0402S0 251.00691.005 TA-I RM04JTN245 R11
1 CN-GP CA P CE R 22pF 5% 50V SMD 0402 GP/HF N C-0402S0 202.01137.035
MURATA GRM1555C1H220JA01D
C23
1 CN-GP CA P CE R 22uF 20% 6.3V SMD 0805 GP/HF C-0805 204.00611.005 MURATA GRM21BR60J226ME39L C4
0 CN-GP CA P CE R 22uF 20% 6.3V SMD 0805 GP/HF C-0805 204.00621.005 TDK C2012X5R0J226MT C4
1 CAP CER 2. 2uF 10% 16V SMD 0805 GP/HF X7R T=1.25mm C-0805 204.00625.015 MURATA GRM21BR71C225KA12L C17
0 CAP CER 2. 2uF 10% 16V SMD 0805 GP/HF X7R T=1.25mm C-0805 204.00625.005 WALS IN 0805B225K160CT C17
2 RES C SMD 0402 270ohm 5% GP /HF R-0402S0
251.00025.025 Yageo/Phycomp. RC0402JR-07270RL
R71 R72
1 RES C SMD 0402 3.3Kohm 5% GP/HF r-0402s0 251.00027.005 TA-I RM04JTN332 R78
1 IND C 3.6nH 0.3nH 300mA 0.2ohm Q=8 SMD 0402 G P /HF l-0402s0 130.01491.005 TAIYO HK10053N6S-T L4
1 RES C SMD 0402 330ohm 1% GP /HF R-0402S0 261.00040.025 Yageo/Phycomp. RC0402FR-07330RL R205
2 RES C SMD 0402 33K ohm 1% GP /HF R-0402S0 261.01048.005
TA-I RM04FTN3302
R77 R84
1 EU-GP RES C S MD 0402 39Kohm 1% GP/HF R-0402S0 261.00868.005 TA-I RM04FTN3902 R21
1 RES C SMD 0402 430K ohm 1% GP R-0402S0 261.01419.005 WALSIN WR04X4303FTL R5
1 BEAD C 60ohm 25% 4A 0.02ohm SMD 0603 GP/ HF L-0603S0 151.00402.005
CHILISIN UPB160808T-600Y-N
FB17
1 HEADER PIN 3P 2.54mm DIP MALE ST GP CN-3X1-2_54 341.00543.005
CVILUX
CH31032V200 J8
1 HEADER RF 1*1P ORT D0.5/D2.0mm SMD MALE ST GP /HF CJ-RF-S3_1X3-3 341.00021.005 FOXCONN KK23017-01-7F J2
1 IC DC-DC 2.5~5. 5V SMD QFN16 GP TLV62090RGT R tqfn-3x3-16eshs1 029.00431.005 TI TLV62090RGTR U1
3 DIODE SBD 40V 2A SMD SMA GP B240A-13-F DIODES M-D-SMAH2_3 112.00010.005
DIODES B240A-13-F
D3 D4 D8
2 cn-10x2-2_54c JSSSQ-110-03-G Samtec SSQ-110-03-G-D J9 J10
1 HEADER PIN 2*3P 2.54mm DIP MA LE ST G P cn-D3x2-2_54HD 341.00544.005
CVILUX CH81062V200
J4
2 HEADER PIN 1*2P 2.54mm DIP MA LE ST G P CN-D2X1-2_54S0 341.00391.005
CVILUX CH31022V202
J5 J6
1
LED CHIP 35mcd G 571nm 2P SMD 1.6*0.8mm GP/HF LTST-C190KG
LD-0603S0 123.00170.005
LITEON LTST-C190KGKT
D6
1
LED CHIP 60mcd O 605nm 2P SMD 1.6*0.8mm GP/HF LTST-C190KF
LD-0603A 123.00171.005
LITEON LTST-C190KFKT
D1
1 LED CHIP 45~180mcd R 624~638nm 2P SMD 1.6*0.8mm GP/HF LD-0603S0 123.00172.005
LITEON LTST-C190KRKT
D5
1 CONN MI CRO USB B 5PIN 0.65mm SMD FEM ALE RT GP CJ-USBSUA-160M3B-L2AT 342.00757.005
POWERWAY SUA-160M3B-L2E-TR1
J7
1 HEADER RF 1*1P ORT D=0.5/1.35mm SMD FEM ALE ST GP CN-MM8030S0 341.00454.005 MURATA MM8030-2610RJ3 J3
2 MOSFET N-CH 50V 200MA SOT-23 sot-23b 104.00459.005 On Semi BSS138LT3G Q7 Q8
5 CONN JUMPER 2P 2.54m m FEMALE RT GP 340.00013.005 FOXCONN SJ2520H-A0
1 PCB 2L OSP REV.025 8PCS GP/HF 43.18*50.8mm 95.1200T00 307.00587.025 ZHENDING/APCB 307.00587.025
PCB
1 Module, 802. 11bgn 1x1, 17.5mmx20.5mm LGA T77H533.00 FOXCONN T77H533.00
U11
0.2 CN-GP SOLDER PASTE S3X58 M500 GP/HF 591.00046.005 KOKI S3X58-M500
0 CN-GP SOLDER PASTE S01X7C58-M500 GP/HF 591.00056.005 KOKI S01X7C58-M500
EVM User’s Guide
TI Confidential – Strictly Private 20
EVM User’s Guide
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
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documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
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This kit is designed to allow product developers to evaluate electronic components, circuitry, or software assoc i ated with the kit
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operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interf erence
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
TI Confidential – Strictly Private 21
EVM User’s Guide
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromett re le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisi r le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication sat is f ais ant e. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan are NOT certified by
TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs:
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
SPACER
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
SPACER
4 EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRIT ICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALU A T IO NS OF LIFE SUPPORT APPL IC ATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
TI Confidential – Strictly Private 22
EVM User’s Guide
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI , and any ot her appl icabl e requirem ents and employ reasonable and customary
safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unint ended and/or inacc urate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identifi ed using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with t he
dangers and application risks associated with handling electrical mechanical components , systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liabil ity t o ensure that any interfaces (el ect ronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, st at e, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availabilit y and function of EVMs, TI attempts to be as
accurate as possible. However, TI does not warrant the acc uracy of EVM descriptions, EVM availability or other inform ation on its
websites as
accurate, complete, reliable, current, or error-free.PACER
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGA RDI NG SUCH ITEMS , INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS O R OTHER INTE LLECT UAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING I N THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MA DE, CONCE IVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESE NT ATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES,
LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS
OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDE R STAT UTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDE R, RE GARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
TI Confidential – Strictly Private 23
EVM User’s Guide
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAI D TO T I FO R THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAG ES ARE CLA IMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of
EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not
in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of
Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relati ng to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive
reliefin any United States or foreign court.
spacer
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
TI Confidential – Strictly Private 24
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