![](/html/43/43c7/43c710e7b0f61a64028114db281ec8327ccf30996c1f541ce88b33661894cff3/bg1.png)
AMPAK Technology Inc.
Advanced Module Packaging Solution
正基科技股份有限公司
CC2564MODNEM
User manual
Revision History
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
i
Doc. NO:
![](/html/43/43c7/43c710e7b0f61a64028114db281ec8327ccf30996c1f541ce88b33661894cff3/bg2.png)
Contents
1. CC2564MODN evaluation module introduction ....................................................... 1
2. PIN Description/ Operating Ratings
3. Federal Communication Commission Interference Statement ................................ 6
4. Industry Canada statement ......................................................................................... 7
/ Operating temperature ................................. 3
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information i
Doc. NO:
![](/html/43/43c7/43c710e7b0f61a64028114db281ec8327ccf30996c1f541ce88b33661894cff3/bg3.png)
1. CC2564MODN evaluation module introduction
CC2564MODN evaluation module (EM) likes as figure1. That is designed for
Bluetooth 2.1+EDR application. The bottom views like as figure2. It is also
designed for TI’s MSP430 experimenter board. It is subject to provide a convenient
environment for customer’s verification on Bluetooth function. There are
controller pins on evaluation board which describes as below.
Figure1. Top view of CC2564MODNEM
AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
1