Texas Instruments Incorporated AN-1996 User's Guide

DIMM
1 2 3
6 5 4
VIN
LM3410
C
1
R
1
D
1
LEDs
L
1
R
2
C
2
C
3
R
5
C
4
R
4
D
2
R
3
D
3
1

1 Introduction

This evaluation board showcases the LM3410X as a boost LED driver. It is designed to drive four, on­board LEDs (V input voltage of 3.3 V-5.5 V. The switching frequency of the LM3410X converter is 1.6MHz allowing the use of small surface mount inductors and chip capacitors. This evaluation board also features the PWM capability of the LM3410 by enabling the user to apply a periodic pulse signal to the DIM terminal of varying duty cycle.
This is a 2-layer board using the bottom layer as a ground plane. A schematic and layout are shown below along with measured performance characteristics. A bill of materials is also provided that describes the parts used on this evaluation board. The above restrictions for the input voltage are valid only for the evaluation board as shipped with the evaluation board schematic shown in Figure 1.
Operating Conditions:
VIN= 3.3 V to 5.5 V
V
I
VFx 4 + VFB≊ 2.8 V x 4 + 0.190 V 11.4 V
OUT
190 mA
LED
User's Guide
SNVA410A–April 2010–Revised May 2013
AN-1996 LM3410X 190mA, LED Driver 6-Pin LLP
Evaluation Board
= 11.4 V) in series at an average LED current (I
OUT
) of 190mA. The circuit can accept an
LED
Figure 1. Schematic
All trademarks are the property of their respective owners.
SNVA410A–April 2010–Revised May 2013 AN-1996 LM3410X 190mA, LED Driver 6-Pin LLP Evaluation Board
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
1
Setting the LED Current
Pin Name Function
1 PGND Power ground pin. Place PGND and output capacitor GND close together. 2 V
3 DIM 4 FB Feedback pin. Connect FB to external resistor divider to set output voltage.
5 AGND Signal ground pin. Place the bottom resistor of the feedback network as close as possible to this pin & pin 4. 6 SW Output switch. Connect to the inductor, output diode.
DAP GND
IN
Part ID Part Value Manufacturer Part Number
U1 2.8A ISWLED Driver TI LM3410X
C1, Input Cap 10µF, 6.3 V, X5R TDK C2012X5R0J106M
C2, Output Cap 2.2µF, 25 V, X7R TDK C3225X7R1E225K
C3, Input Cap Placeholder (not stuffed) - -
C4, Output Cap 4.7µF, 25 V, X7R TDK C3225X7R1E475K
D1, Catch Diode 0.4 VfSchottky, 500mA ON Semiconductor MBR0530T1G
D2 15 V Zener Diode Central Semiconductor CMHZ4702 D3 0.4 VfSchottky, 500mA ON Semiconductor MBR0530T1G L1 3.3µH, 5.4A Coilcraft DO3316P-332 R1 1, 1% Vishay CRCW12061R00FNEA R2 Placeholder (not stuffed) - ­R3 100, 1% Vishay CRCW0603100RFKEA R4 Placeholder (not stuffed) - ­R5 6.8k, 1% Vishay CRCW08056K80FKEA
J1 Jumper Samtec TSW-102-07-T-S
SH-J1 Jumper shunt Tyco Electronics 2-382811-1
LEDs 700mA, Vf≊ 3.4 V Cree XPEWHT-L1-0000-008E5
www.ti.com
Table 1. Pin Descriptions
Supply voltage for power stage, and input supply voltage. Dimming & shutdown control input. Logic high enables operation. Duty Cycle from 0 to 100%. Do not allow
this pin to float or be greater than VIN+ 0.3 V.
Signal & Power ground. Connect to pin 1 and pin 5 on top layer. Place 4-6 vias from DAP to bottom layer GND plane.
Table 2. Bill of Materials

2 Setting the LED Current

The default forward current I setting resistors R1 and R4 can be changed according to the following equation:
I
= (VFB)/(R1 || R4)
LED
The feedback voltage VFBis regulated at 0.190 V typically. The resistors R1 and R4 should be rated to handle the power dissipation of the LED current.

3 PWM Dimming

The default set-up of the DIM terminal is to enable PWM dimming. If PWM dimming is not required, then the DIM pin can be tied to VINthrough a resistor, R2, using the existing 0805 sized resistor footprint. This enables the LM3410 whenever VINis applied and allows the set I continuously. A recommended value for R2 is 100k.
A periodic pulse signal at different frequencies and/or duty cycle can be applied to the evaluation board's DIM terminal for PWM dimming. The voltage measured at the DIM package lead must not be higher than
0.3 V above VINfor proper operation. Diode D3 and resistor R5 have been placed in the circuit to clamp the signal at the DIM lead to no greater than 0.3 V above VIN. Although not recommended, a PWM signal can therefore be applied to the evaluation board DIM terminal with a peak voltage greater than VIN.
2
AN-1996 LM3410X 190mA, LED Driver 6-Pin LLP Evaluation Board SNVA410A–April 2010–Revised May 2013
delivered to the LED array is 190mA. To adjust this value, the current
LED
current to flow through the LEDs
LED
Copyright © 2010–2013, Texas Instruments Incorporated
Submit Documentation Feedback
200 180 160 140 120 100
80 60 40 20
0
0 10 20 30 40 50 60 70 80 90 100
DUTY CYCLE (%)
I
LED
(mA)
1 kHz
500 Hz
100 Hz
DUTY CYCLE (%)
I
LED
(mA)
200 180 160 140 120 100
80 60 40 20
0
0 10 20 30 40 50 60 70 80 90 100
100 Hz
500 Hz
1 kHz
www.ti.com

4 Over-Voltage Protection

The evaluation board includes over-voltage protection (OVP) circuitry, in the combination of zener diode D4 and resistor R3, to protect the LM3410 device in a situation where the output load is suddenly removed from the rest of the converter (i.e. an LED goes open). A header (J1) on the board allows the user to activate the OVP function by removing the associated jumper. The switching voltage at the SW pin will then be clamped to approximately the zener diode voltage of 18 V. Current will then flow through D4, R3 and sense resistor R1. This generates a voltage greater than 0.190 V at the FB pin that forces the LM3410’s internal switching power FET to turn off, thereby, preventing an over-voltage condition at the SW pin and damaging the LM3410.

5 Typical Performance Characteristics

Over-Voltage Protection
TA= +25°C, V
Figure 2. PWM Dimming, VIN= 3.3 V Figure 3. PWM Dimming, VIN= 5.5 V
= 11.4 V, unless otherwise specified.
OUT
SNVA410A–April 2010–Revised May 2013 AN-1996 LM3410X 190mA, LED Driver 6-Pin LLP Evaluation Board
Submit Documentation Feedback
3
Copyright © 2010–2013, Texas Instruments Incorporated
I
LED
(mA)
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-1.0
-2.0
-3.0
-4.0
-5.0
-6.0
500
400
300
200
100
0
-100.00 100.000µ 300.00 500.00
V
DIM
100 Ps/DIV
0
2
1
3
V
DIM
(V)
I
LED
I
LED
(mA)
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-1.0
-2.0
-3.0
-4.0
-5.0
-6.0
500
400
300
200
100
0
-100.00 60.000µ 220.00 380.00 540.00
V
DIM
100 Ps/DIV
0
2
1
3
V
DIM
(V)
I
LED
I
LED
(mA)
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-1.0
-2.0
-3.0
-4.0
-5.0
-6.0
500
400
300
200
100
0
0 0 0 0 0
V
DIM
1 ms/DIV
0
2
1
3
V
DIM
(V)
I
LED
INPUT VOLTAGE (V)
EFFICIENCY
(%)
100
95
90
85
80
3.0 3.5 4.0 4.5 5.0 5.5
Typical Performance Characteristics
Figure 4. Efficiency vs. Input Voltage, Figure 5. 500Hz PWM Dimming,
I
= 190 mA 50% Duty Cycle, VIN= 3.3 V
LED
www.ti.com
4
Figure 6. 500Hz PWM Dimming (Rising Edge), Figure 7. 500Hz PWM Dimming (Falling Edge)
AN-1996 LM3410X 190mA, LED Driver 6-Pin LLP Evaluation Board SNVA410A–April 2010–Revised May 2013
50% Duty Cycle, VIN= 3.3 V 50% Duty Cycle, VIN= 3.3 V
Copyright © 2010–2013, Texas Instruments Incorporated
Submit Documentation Feedback
DIMM
1 2 3
6 5 4
VIN
LM3410
C
1
R
1
D
1
LEDs
L
1
R
2
C
2
C
3
R
5
C
4
R
4
D
2
R
3
D
3
J
1
VPWR
C
5
www.ti.com
Two Power Supply Design with 12 V > V
PWR
> 5.5 V
6 Two Power Supply Design with 12 V > V
The evaluation board can be modified to allow the user to derive the power from an input supply that is larger than 5.5 V. In Figure 8, two separate supplies are needed. VINmust be between 3.3 V minimum to
5.5 V maximum, but V V
. Power-down should be in the reverse order.
PWR
can be as great as 12 V. The recommended power-up sequence is VINthen
VPWR
PWR
> 5.5 V
Figure 8. Two Power Supply Schematic
Table 3. Bill of Materials (BOM) - Two Power Supply Design
Part ID Part Value Manufacturer Part Number
U1 2.8A ISWLED Driver TI LM3410X
C1, VIN, Input Cap 10µF, 6.3 V, X5R TDK C2012X5R0J106M
C2, Output Cap 2.2µF, 25 V, X7R TDK C3225X7R1E225K
C3, Input Cap Placeholder (not stuffed) - -
C4, Output Cap 4.7µF, 25 V, X7R TDK C3225X7R1E475K
C5, V
, Input Cap 10µF, 25 V, X5R TDK C3225X5R1E106M
PWR
D1, Catch Diode 0.4 VfSchottky, 500mA ON Semiconductor MBR0530T1G
D2 15 V Zener Diode Central Semiconductor CMHZ4702 D3 0.4 VfSchottky, 500mA ON Semiconductor MBR0530T1G L1 3.3µH, 5.4A Coilcraft DO3316P-332 R1 1, 1% Vishay CRCW12061R00FNEA R2 Placeholder (not stuffed) - ­R3 100, 1% Vishay CRCW0603100RFKEA R4 Placeholder (not stuffed) - ­R5 6.8k, 1% Vishay CRCW08056K80FKEA J1 Jumper Samtec TSW-102-07-T-S
SH-J1 Jumper shunt Tyco Electronics 2-382811-1
LEDs 700mA, Vf≊ 3 .4 V Cree XPEWHT-L1-0000-008E5
SNVA410A–April 2010–Revised May 2013 AN-1996 LM3410X 190mA, LED Driver 6-Pin LLP Evaluation Board
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
5
PCB Layout

7 PCB Layout

www.ti.com
Figure 9. Top Layer
Figure 10. Bottom Layer
6
AN-1996 LM3410X 190mA, LED Driver 6-Pin LLP Evaluation Board SNVA410A–April 2010–Revised May 2013
Copyright © 2010–2013, Texas Instruments Incorporated
Submit Documentation Feedback
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Loading...