Texas Instruments WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD Datasheet

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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021 SWRS152N – JUNE 2013 – REVISED APRIL 2021

WL18x1MOD, WL18x5MOD WiLink™ 8 Single-Band Combo Module –

Wi-Fi®,

Bluetooth

®, and

1 Features

• General – Integrates RF, power amplifiers (PAs), clock,

RF switches, filters, passives, and power management

– Quick hardware design with TI module

collateral and reference designs – Operating temperature: –20°C to +70°C – Small form factor: 13.3 × 13.4 × 2 mm – 100-pin MOC package – FCC, IC, ETSI/CE, and TELEC certified with

PCB, dipole, chip, and PIFA antennas

• Wi-Fi

• Bluetooth® and Bluetooth low energy

– WLAN baseband processor and RF transceiver

support of IEEE Std 802.11b, 802.11g, and

802.11n

– 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO

at 2.4 GHz for high throughput: 80 Mbps (TCP),

100 Mbps (UDP) – 2.4-GHz MRC support for extended range – Fully calibrated: production calibration not

required – 4-bit SDIO host interface support – Wi-Fi direct concurrent operation (multichannel,

multirole)

(WL183xMOD only) – Bluetooth 5.1 secure connection compliant and

CSA2 support (declaration ID: D032799) – Host controller interface (HCI) transport for

Bluetooth over UART – Dedicated audio processor support of SBC

encoding + A2DP

Bluetooth

Low Energy (LE)

– Dual-mode Bluetooth and Bluetooth low energy – TI's Bluetooth and Bluetooth low energy

certified stack

• Key benefits – Reduces design overhead

– Differentiated use cases by configuring

WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other WiFi devices on different RF channel (Wi-Fi networks)

– Best-in-class Wi-Fi with high-performance

audio and video streaming reference applications with up to 1.4× the range versus one antenna

– Different provisioning methods for in-home

devices connectivity to Wi-Fi in one step

– Lowest Wi-Fi power consumption in connected

idle (< 800 µA)

– Configurable wake on WLAN filters to only

wake up the system

– Wi-Fi and Bluetooth single antenna coexistence

2 Applications

• Internet of things (IoT)

• Multimedia

• Home electronics

• Home appliances and white goods

• Industrial and home automation

• Smart gateway and metering

• Video conferencing

• Video camera and security

3 Description

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and

Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz

module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux® and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

Device Information

PART NUMBER PACKAGE BODY SIZE

WL1801MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm

WL1805MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm

WL1831MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm

WL1835MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm

(1) For more information, see Section 12.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

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(1)

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VIO

ZigBee

COEX

MAC/PHY

32.768 kHz

WLAN_SDIO

BT_UART

WRF1

BTRF

BG2

BG1

MAC/PHY

BT_EN

WLAN_EN

VBAT

RF_ANT1

RF_ANT2

26M XTAL

2.4-GHz SPDT

WRF2

Interface

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

4 Functional Block Diagram

Figure 4-1 shows a functional block diagram of the WL1835MOD variant.

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NOTE: Dashed lines indicate optional configurations and are not applied by default.

Figure 4-1. WL1835MOD Functional Block Diagram

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1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Functional Block Diagram.............................................. 2

5 Revision History.............................................................. 3

6 Device Comparison......................................................... 4

6.1 Related Products........................................................ 4

7 Terminal Configuration and Functions..........................5

7.1 Pin Attributes...............................................................6

8 Specifications.................................................................. 9

8.1 Absolute Maximum Ratings........................................ 9

8.2 ESD Ratings............................................................... 9

8.3 Recommended Operating Conditions.........................9

8.4 External Digital Slow Clock Requirements................10

8.5 Thermal Resistance Characteristics for MOC

100-Pin Package......................................................... 10

8.6 WLAN Performance: 2.4-GHz Receiver

Characteristics.............................................................11

8.7 WLAN Performance: 2.4-GHz Transmitter Power.... 12

8.8 WLAN Performance: Currents.................................. 13

8.9 Bluetooth Performance: BR, EDR Receiver

Characteristics—In-Band Signals................................13

8.10 Bluetooth Performance: Transmitter, BR ............... 15

8.11 Bluetooth Performance: Transmitter, EDR..............15

8.12 Bluetooth Performance: Modulation, BR.................15

8.13 Bluetooth Performance: Modulation, EDR.............. 16

8.14 Bluetooth low energy Performance: Receiver

Characteristics – In-Band Signals............................... 16

8.15 Bluetooth low energy Performance: Transmitter

Characteristics.............................................................16

8.16 Bluetooth low energy Performance: Modulation

Characteristics.............................................................17

8.17 Bluetooth BR and EDR Dynamic Currents............. 17

8.18 Bluetooth low energy Currents................................17

8.19 Timing and Switching Characteristics..................... 18

9 Detailed Description......................................................26

9.1 WLAN Features........................................................ 27

9.2 Bluetooth Features....................................................27

9.3 Bluetooth Low Energy Features................................28

9.4 Device Certification................................................... 28

9.5 Module Markings.......................................................30

9.6 Test Grades...............................................................30

9.7 End Product Labeling................................................31

9.8 Manual Information to the End User......................... 31

10 Applications, Implementation, and Layout............... 32

10.1 Application Information........................................... 32

11 Device and Documentation Support..........................38

11.1 Device Support........................................................38

11.2 Support Resources................................................. 41

11.3 Trademarks............................................................. 41

11.4 Electrostatic Discharge Caution..............................41

11.5 Glossary..................................................................41

12 Mechanical, Packaging, and Orderable

Information.................................................................... 42

12.1 TI Module Mechanical Outline................................ 42

12.2 Tape and Reel Information......................................42

12.3 Packaging Information............................................ 45

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from November 1, 2017 to April 26, 2021 Page

• Updated the numbering format for tables, figures and cross-references throughout the document...................1

• Updated to "Bluetooth 5.1 Secure Connection..." in Section 1 .......................................................................... 1

• Updated Section 6.1, Related Products .............................................................................................................4

• Updated "Bluetooth 4.2" to "Bluetooth 5.1" in Section 9.2 ...............................................................................27

• Updated "Bluetooth 4.2" to "Bluetooth 5.1" in Section 9.3 ...............................................................................28

• Deleted the sentence that began "Moreover, the module is also Wi-Fi certified..." in the first paragraph in

Section 9.4, Device Certification ......................................................................................................................28

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6 Device Comparison

The TI WiLink 8 module offers four footprint-compatible 2.4-GHz variants providing stand-alone Wi-Fi and Bluetooth combo connectivity. Table 6-1 compares the features of the module variants.

Table 6-1. TI WiLink™ 8 Module Variants

FEATURE

WLAN 2.4-GHz SISO

WLAN 2.4-GHz MIMO

WLAN 2.4-GHz MRC

Bluetooth ✓ ✓

(1) SISO: single input, single output; MIMO: multiple input, multiple output; MRC: maximum ratio combining, supported at 802.11 g/n.

(1)

WL1835MOD WL1831MOD WL1805MOD WL1801MOD

✓ ✓ ✓ ✓

✓ ✓

6.1 Related Products

For information about other devices in this family of products or related products, see the following links.

Wireless connectivity overview Lowest power and longest range across 14 wireless connectivity

standards

Sub-1 GHz SimpleLink™ wireless MCUs

Reference Designs for WL1835MOD Find reference designs leveraging the best in TI technology to solve

High performance, long range wireless and ultra-low power consumption

your system-level challenges

DEVICE

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PIN 19 - GND

PIN 17 - GND

PIN 20 - GND

PIN 23 - GND

PIN 24 - GND

PIN 28 - GND

PIN 29 - GND

PIN 30 - GND

PIN 31 - GND

PIN 18 - RF_ANT2

PIN 21 - RESERVED1

PIN 22 - RESERVED2

PIN 25 - GPIO4

PIN 26 - GPIO2

PIN 27 - GPIO1

PIN 32 - RF_ANT1

PIN 1 - GND

PIN 4 - GPIO10

PIN 5 - GPIO12

PIN 2 - GPIO11

PIN 3 - GPIO9

PIN 6 - WL_SDIO_CMD

PIN 8 - WL_SDIO_CLK

PIN 7 - GND

PIN 9 - GND

PIN 10 - WL_SDIO_D0

PIN 11 - WL_SDIO_D1

PIN 12 - WL_SDIO_D2

PIN 13 - WL_SDIO_D3

PIN 14 - WLAN_IRQ

PIN 15 - GND

PIN 16 - GND

PIN 33 - GND

PIN 40 - WLAN_EN

PIN 38 - VIO

PIN 39 - GND

PIN 37 - GND

PIN 41 - BT_EN

PIN 43 - BT_UART_DBG

PIN 46 - VBAT_IN

PIN 36 - EXT_32K

PIN 34 - GND

PIN 35 - GND

PIN 42 - WL_UART_DBG

PIN 44 - GND

PIN 45 - GND

PIN 47 - VBAT_IN

PIN 48 - GND

PIN 49 - GND

PIN 50 - BT_HCI_RTS

PIN 51 - BT_HCI_CTS

PIN 52 - BT_HCI_TX

PIN 53 - BT_HCI_RX

PIN 54 - GND

PIN 55 - GND

PIN 56 - BT_AUD_IN

PIN 57 - BT_AUD_OUT

PIN 58 - BT_AUD_FSYNC

PIN 60 - BT_AUD_CLK

PIN 59 - GND

PIN 61 - GND

PIN 63 - GND

PIN 62 - RESERVED3

PIN 64 - GND

GND

Pin 2 Indicator

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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

7 Terminal Configuration and Functions

Figure 7-1 shows the pin assignments for the 100-pin MOC package.

SWRS152N – JUNE 2013 – REVISED APRIL 2021

Figure 7-1. 100-Pin MOC Package (Bottom View)

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7.1 Pin Attributes

Table 7-1 describes the module pins.

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Table 7-1. Pin Attributes

(2)

DESCRIPTION

(3)

WLAN SDIO clock. Must be driven by the host.

Input sleep clock:

32.768 kHz

Mode setting: high = enable

Connect to 1.8-V external VIO

Power supply input, 2.9 to 4.8 V

Reserved for future use. NC if not used.

WLAN SDIO data bit

3. Changes state to PU at WL_EN or BT_EN assertion for card detects. Later disabled by software during initialization.

PIN NAME

PIN NO.

TYPE/

DIR

SHUTDOWN

STATE

(1)

AFTER

POWER

(1)

VOLTAGE

LEVEL

CONNECTIVITY

1801 1805 1831 1835

Clocks and Reset Signals

WL_SDIO_CLK 8 I Hi-Z Hi-Z 1.8 V v v v v

EXT_32K 36 ANA – v v v v

WLAN_EN 40 I PD PD 1.8 V v v v v

BT_EN 41 I PD PD 1.8 V x x v v

Power-Management Signals

VIO_IN 38 POW PD PD 1.8 V v v v v

VBAT_IN 46 POW VBAT v v v v

VBAT_IN 47 POW VBAT v v v v

TI Reserved

GPIO11 2 I/O PD PD 1.8 V v v v v

GPIO9 3 I/O PD PD 1.8 V v v v v

GPIO10 4 I/O PU PU 1.8 V v v v v

GPIO12 5 I/O PU PU 1.8 V v v v v

RESERVED1 21 I PD PD 1.8 V x x x x

RESERVED2 22 I PD PD 1.8 V x x x x

GPIO4 25 I/O PD PD 1.8 V v v v v

RESERVED3 62 O PD PD 1.8 V x x x x

WLAN Functional Block: Int Signals

WL_SDIO_CMD_1V8 6 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO command

WL_SDIO_D0_1V8 10 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 0

WL_SDIO_D1_1V8 11 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 1

WL_SDIO_D2_1V8 12 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 2

WL_SDIO_D3_1V8 13 I/O Hi-Z PU 1.8 V v v v v

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Table 7-1. Pin Attributes (continued)

(2)

DESCRIPTION

(3)

WLAN SDIO out-ofband interrupt line. Set to rising edge (active high) by default. (To extract the debug option WL_RS232_TX/RX interface out, pull up the IRQ line at power up before applying enable.)

2.4-GHz ANT2 TX, RX;

2.4-GHz secondary antenna MRC/MIMO only.

WL_RS232_RX (when WLAN_IRQ = 1 at power up)

WL_RS232_TX (when WLAN_IRQ = 1 at power up)

2.4-GHz WLAN main antenna SISO, Bluetooth

Option: Bluetooth logger

UART RTS to host. NC if not used.

UART CTS from host. NC if not used.

UART TX to host. NC if not used.

UART RX from host. NC if not used.

Bluetooth PCM/I2S bus. Data in. NC if not used.

Bluetooth PCM/I2S bus. Data out. NC if not used.

Bluetooth PCM/I2S bus. Frame sync. NC if not used.

Bluetooth PCM/I2S bus. NC if not used.

PIN NAME

PIN NO.

TYPE/

DIR

SHUTDOWN

STATE

(1)

AFTER

POWER

(1)

VOLTAGE

LEVEL

CONNECTIVITY

1801 1805 1831 1835

WL_IRQ_1V8 14 O PD 0 1.8 V v v v v

RF_ANT2

18 ANA – x v x v

GPIO2 26 I/O PD PD 1.8 V v v v v

GPIO1 27 I/O PD PD 1.8 V v v v v

RF_ANT1 32 ANA – v v v v

WL_UART_DBG 42 O PU PU 1.8 V v v v v Option: WLAN logger

Bluetooth Functional Block: Int Signals

BT_UART_DBG 43 O PU PU 1.8 V x x v v

BT_HCI_RTS_1V8 50 O PU PU 1.8 V x x v v

BT_HCI_CTS_1V8 51 I PU PU 1.8 V x x v v

BT_HCI_TX_1V8 52 O PU PU 1.8 V x x v v

BT_HCI_RX_1V8 53 I PU PU 1.8 V x x v v

BT_AUD_IN 56 I PD PD 1.8 V x x v v

BT_AUD_OUT 57 O PD PD 1.8 V x x v v

BT_AUD_FSYNC 58 I/O PD PD 1.8 V x x v v

BT_AUD_CLK 60 I/O PD PD 1.8 V x x v v

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Table 7-1. Pin Attributes (continued)

(2)

PIN NAME

PIN NO.

TYPE/

DIR

SHUTDOWN

STATE

(1)

AFTER

POWER

(1)

VOLTAGE

LEVEL

CONNECTIVITY

1801 1805 1831 1835

Ground Pins

GND 1 GND – v v v v

GND 7 GND – v v v v

GND 9 GND – v v v v

GND 15 GND – v v v v

GND 16 GND – v v v v

GND 17 GND – v v v v

GND 19 GND – v v v v

GND 20 GND – v v v v

GND 23 GND – v v v v

GND 24 GND – v v v v

GND 28 GND – v v v v

GND 29 GND – v v v v

GND 30 GND – v v v v

GND 31 GND – v v v v

GND 33 GND – v v v v

GND 34 GND – v v v v

GND 35 GND – v v v v

GND 37 GND – v v v v

GND 39 GND – v v v v

GND 44 GND – v v v v

GND 45 GND – v v v v

GND 48 GND – v v v v

GND 49 GND – v v v v

GND 54 GND – v v v v

GND 55 GND – v v v v

GND 59 GND – v v v v

GND 61 GND – v v v v

GND 63 GND – v v v v

GND 64 GND – v v v v

GND

G1 –

GND – v v v v

G36

DESCRIPTION

(3)

(1) PU = pullup; PD = pulldown; Hi-Z = high-impedance

(2) v = connect; x = no connect

(3) Host must provide PU using a 10-kΩ resistor for all non-CLK SDIO signals.

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8 Specifications

All specifications are measured at the module pins using the TI WL1835MODCOM8 evaluation board. All

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

measurements are performed with V unless otherwise indicated.

For level-shifting I/Os with the TI WL18x5MOD, see the Level Shifting WL18xx I/Os application report.

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

BAT

Input voltage to analog pins –0.5 2.1 V

Input voltage limits (CLK_IN) –0.5 VDD_IO V

Input voltage to all other pins –0.5 (VDD_IO + 0.5 V) V

Operating ambient temperature –20 70

Storage temperature, T

stg

= 3.7 V, VIO = 1.8 V, 25°C for typical values with matched RF antennas,

BAT

Note

(1)

MIN MAX UNIT

(2)

4.8

–0.5 2.1 V

(3)

–40 85 °C

°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Operating Conditions is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) 4.8 V cumulative to 2.33 years, including charging dips and peaks

(3) In the WL18xx system, a control mechanism exists to ensure Tj < 125°C. When Tj approaches this threshold, the control mechanism

manages the transmitter patterns.

8.2 ESD Ratings

VALUE

Electrostatic discharge

(ESD)

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001

Charged device model (CDM), per JEDEC specification JESD22-C101

(1)

(2)

±1000

±250

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

UNIT

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN TYP MAX UNIT

(1)

BAT

IH_EN

IL_EN

Tr,T

DC supply range for all modes 2.9 3.7 4.8 V

1.8-V I/O ring power supply voltage 1.62 1.8 1.95 V

I/O high-level input voltage 0.65 × VDD_IO VDD_IO V

I/O low-level input voltage 0 0.35 × VDD_IO V

Enable inputs high-level input voltage 1.365 VDD_IO V

Enable inputs low-level input voltage 0 0.4 V

High-level output voltage At 4 mA VDD_IO –0.45 VDD_IO V

Low-level output voltage At 4 mA 0 0.45 V

Input transitions time Tr,Tf from 10% to 90% (digital I/O)

Output rise time from 10% to 90% (digital pins)

Output fall time from 10% to 90% (digital pins)

(2)

1 10 ns

CL < 25 pF 5.3 ns

CL < 25 pF 4.9 ns

Ambient operating temperature –20 70 °C

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over operating free-air temperature range (unless otherwise noted)

Maximum power dissipation

WLAN operation 2.8 W

Bluetooth operation 0.2

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MIN TYP MAX UNIT

(1) 4.8 V is applicable only for 2.33 years (30% of the time). Otherwise, maximum V

must not exceed 4.3 V.

BAT

(2) Applies to all digital lines except PCM and slow clock lines.

8.4 External Digital Slow Clock Requirements

The supported digital slow clock is 32.768 kHz digital (square wave). All core functions share a single input.

CONDITION MIN TYP MAX UNIT

Input slow clock frequency 32768 Hz

Input slow clock accuracy (initial, temperature, and aging)

Tr, T

Input transition time (10% to 90%) 200 ns

Frequency input duty cycle 15% 50% 85%

VIH, VILInput voltage limits

Input impedance 1 MΩ

Input capacitance 5 pF

WLAN, Bluetooth ±250 ppm

Square wave, DC coupled

0.65 x VDD_IO VDD_IO V

0 0.35 x VDD_IO

8.5 Thermal Resistance Characteristics for MOC 100-Pin Package

THERMAL METRICS

(1)

Junction to free air

(3)

Junction to board 6.06

Junction to case

(4)

(°C/W)

16.6

5.13

peak

(2)

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application

Report.

(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [R

] value, which is based on

θJC

a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70°C is assumed.

(3) According to the JEDEC EIA/JESD 51 document

(4) Modeled using the JEDEC 2s2p thermal test board with 36 thermal vias

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8.6 WLAN Performance: 2.4-GHz Receiver Characteristics

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin.

PARAMETER CONDITION MIN TYP MAX UNIT

RF_ANT1 pin 2.4-GHz SISO

Operation frequency range 2412 2484 MHz

1 Mbps DSSS –96.3

2 Mbps DSSS –93.2

5.5 Mbps CCK –90.6

11 Mbps CCK –87.9

6 Mbps OFDM –92.0

9 Mbps OFDM –90.4

12 Mbps OFDM –89.5

18 Mbps OFDM –87.2

24 Mbps OFDM –84.1

36 Mbps OFDM –80.7

48 Mbps OFDM –76.5

54 Mbps OFDM –74.9

MCS0 MM 4K –90.4

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

Sensitivity: 20-MHz bandwidth. At < 10% PER limit

Maximum input level

Adjacent channel rejection: Sensitivity level +3 dB for OFDM; Sensitivity level +6 dB for 11b

MCS1 MM 4K –87.6

MCS2 MM 4K –85.9

MCS3 MM 4K –82.8

MCS4 MM 4K –79.4

MCS5 MM 4K –75.2

MCS6 MM 4K –73.5

MCS7 MM 4K –72.4

MCS0 MM 4K 40 MHz –86.7

MCS7 MM 4K 40 MHz –67.0

MCS0 MM 4K MRC –92.7

MCS7 MM 4K MRC –75.2

MCS13 MM 4K –73.7

MCS14 MM 4K –72.3

MCS15 MM 4K –71.0

OFDM –20.0 –10.0

DSSS –4.0 –1.0

2 Mbps DSSS 42.0

54 Mbps OFDM 2.0

dBm

dBmCCK –10.0 –6.0

dB11 Mbps CCK 38.0

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8.7 WLAN Performance: 2.4-GHz Transmitter Power

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin.

PARAMETER CONDITION

Output Power: Maximum RMS output power measured at 1 dB from IEEE spectral mask or EVM

Operation frequency range 2412 2484 MHz

Return loss –10.0 dB

Reference input impedance 50.0 Ω

(2)

MCS0 MM 40 MHz 14.8

MCS7 MM 40 MHz 11.3

(1)

MIN TYP MAX UNIT

RF_ANT1 Pin 2.4-GHz SISO

1 Mbps DSSS 17.3

2 Mbps DSSS 17.3

5.5 Mbps CCK 17.3

11 Mbps CCK 17.3

6 Mbps OFDM 17.1

9 Mbps OFDM 17.1

12 Mbps OFDM 17.1

18 Mbps OFDM 17.1

24 Mbps OFDM 16.2

36 Mbps OFDM 15.3

48 Mbps OFDM 14.6

54 Mbps OFDM 13.8

MCS0 MM 16.1

MCS1 MM 16.1

MCS2 MM 16.1

MCS3 MM 16.1

MCS4 MM 15.3

MCS5 MM 14.6

MCS6 MM 13.8

MCS7 MM

(3)

12.6

RF_ANT1 + RF_ANT2

MCS12 (WL18x5) 18.5

MCS13 (WL18x5) 17.4

MCS14 (WL18x5) 14.5

MCS15 (WL18x5) 13.4

RF_ANT1 + RF_ANT2

dBm

(1) Maximum transmitter power (TP) degradation of up to 30% is expected, starting from 80°C ambient temperature on MIMO operation

(2) Regulatory constraints limit TI module output power to the following:

• Channel 14 is used only in Japan; to keep the channel spectral shaping requirement, the power is limited: 14.5 dBm.

• Channels 1, 11 at OFDM legacy and HT 20-MHz rates: 12 dBm

• Channels 1, 11 at HT 40-MHz rates: 10 dBm

• Channel 7 at HT 40-MHz lower rates: 10 dBm

• Channel 5 at HT 40-MHz upper rates: 10 dBm

• All 11B rates are limited to 16 dBm to comply with the ETSI PSD 10 dBm/MHz limit.

• All OFDM rates are limited to 16.5 dBm to comply with the ETSI EIRP 20 dBm limit.

• For clarification regarding power limitation, see the WL18xx .INI File Application Report.

(3) To ensure compliance with the EVM conditions specified in the PHY chapter of IEEE Std 802.11™ – 2012:

• MCS7 20 MHz channel 12 output power is 2 dB lower than the typical value.

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• MCS7 20 MHz channel 8 output power is 1 dB lower than the typical value.

SWRS152N – JUNE 2013 – REVISED APRIL 2021

8.8 WLAN Performance: Currents

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin.

PARAMETER SPECIFICATION TYP (AVG) –25°C UNIT

Low-power mode (LPM) 2.4-GHz RX SISO20 single chain 49

2.4 GHz RX search SISO20 54

2.4-GHz RX search MIMO20 74

2.4-GHz RX search SISO40 59

2.4-GHz RX 20 M SISO 11 CCK 56

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

Receiver

Transmitter

2.4-GHz RX 20 M SISO 6 OFDM 61

2.4-GHz RX 20 M SISO MCS7 65

2.4-GHz RX 20 M MRC 1 DSSS 74

2.4-GHz RX 20 M MRC 6 OFDM 81

2.4-GHz RX 20 M MRC 54 OFDM 85

2.4-GHz RX 40-MHz MCS7 77

2.4-GHz TX 20 M SISO 6 OFDM 15.4 dBm 285

2.4-GHz TX 20 M SISO 11 CCK 15.4 dBm 273

2.4-GHz TX 20 M SISO 54 OFDM 12.7 dBm 247

2.4-GHz TX 20 M SISO MCS7 11.2 dBm 238

2.4-GHz TX 20 M MIMO MCS15 11.2 dBm 420

2.4-GHz TX 40 M SISO MCS7 8.2 dBm 243

8.9 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals

over operating free-air temperature range (unless otherwise noted)

PARAMETER

Bluetooth BR, EDR operation frequency range

Bluetooth BR, EDR channel spacing

Bluetooth BR, EDR input impedance

Bluetooth BR, EDR sensitivity Dirty TX on

Bluetooth EDR BER floor at sensitivity + 10 dB Dirty TX off (for 1,600,000 bits)

Bluetooth BR, EDR maximum usable input power

Bluetooth BR intermodulation Level of interferers for n = 3, 4, and 5 –36.0 –30.0 dBm

(2)

(1) (2)

CONDITION MIN TYP MAX UNIT

2402 2480 MHz

50 Ω

BR, BER = 0.1% –92.2

EDR2, BER = 0.01% –91.7

EDR3, BER = 0.01% –84.7

EDR2 1e-6

EDR3 1e-6

BR, BER = 0.1% –5.0

EDR3, BER = 0.1% –15.0

1 MHz

dBm

dBmEDR2, BER = 0.1% –15.0

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over operating free-air temperature range (unless otherwise noted)

PARAMETER

Bluetooth BR, EDR C/I performance Numbers show wanted signal-to-interfering-signal ratio. Smaller numbers indicate better C/I performances (Image frequency = –1 MHz)

Bluetooth BR, EDR RF return loss

(1) All RF and performance numbers are aligned to the module pin.

(2) Sensitivity degradation up to –3 dB may occur due to fast clock harmonics with dirty TX on.

(1) (2)

CONDITION MIN TYP MAX UNIT

BR, co-channel 10

EDR, co-channel EDR2 12

EDR3 20

BR, adjacent ±1 MHz –3.0

EDR, adjacent ±1 MHz, (image)

EDR2 –3.0

EDR3 2.0

BR, adjacent +2 MHz –33.0

EDR, adjacent +2 MHz EDR2 –33.0

EDR3 –28.0

BR, adjacent –2 MHz –20.0

EDR, adjacent –2 MHz EDR2 –20.0

EDR3 –13.0

BR, adjacent ≥Ι±3Ι MHz –42.0

EDR, adjacent ≥Ι±3Ι MHz EDR2 –42.0

EDR3 –36.0

–10.0 dB

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8.10 Bluetooth Performance: Transmitter, BR

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

over operating free-air temperature range (unless otherwise noted)

PARAMETER

BR RF output power

(2)

BR gain control range 30.0 dB

BR power control step 5.0 dB

BR adjacent channel power |M-N| = 2 –43.0 dBm

BR adjacent channel power |M-N| > 2 –48.0 dBm

(1) All RF and performance numbers are aligned to the module pin.

(2) Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command.

(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.

(1)

≥ 3 V

< 3 V

(3)

BAT

MIN TYP MAX UNIT

11.7

7.2

dBm

8.11 Bluetooth Performance: Transmitter, EDR

over operating free-air temperature range (unless otherwise noted)

PARAMETER

EDR output power

EDR gain control range 30 dB

EDR power control step 5 dB

EDR adjacent channel power |M-N| = 1 –36 dBc

EDR adjacent channel power |M-N| = 2 –30 dBm

EDR adjacent channel power |M-N| > 2 –42 dBm

(2)

(1)

≥ 3 V

< 3 V

(3)

BAT

MIN TYP MAX UNIT

7.2

5.2

dBm

(1) All RF and performance numbers are aligned to the module pin.

(2) Values reflect default maximum power. Maximum power can be changed using a VS command.

(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.

8.12 Bluetooth Performance: Modulation, BR

over operating free-air temperature range (unless otherwise noted)

CHARACTERISTICS

BR –20-dB bandwidth 925 995 kHz

BR modulation characteristics

BR carrier frequency drift One-slot packet –25 25 kHz

BR drift rate lfk+5 – fkl , k = 0 to max 15 kHz/50 µs

BR initial carrier frequency tolerance

(1) All RF and performance numbers are aligned to the module pin.

(2) Performance values reflect maximum power.

(3) Numbers include XTAL frequency drift over temperature and aging.

(1)

CONDITION

∆f1avg Mod data = 4 1s, 4 0s:

(2)

MIN TYP MAX UNIT

145 160 170 kHz

111100001111...

∆f2max ≥ limit for

Mod data = 1010101... 120 130 kHz at least 99.9% of all Δf2max

∆f2avg, ∆f1avg 85% 88%

Three- and five-slot

–35 35 kHz

packet

(3)

f0–fTX ±75 ±75 kHz

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8.13 Bluetooth Performance: Modulation, EDR

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over operating free-air temperature range (unless otherwise noted)

PARAMETER

EDR carrier frequency stability –5 5 kHz

EDR initial carrier frequency tolerance

EDR RMS DEVM

EDR 99% DEVM

EDR peak DEVM

(1) All RF and performance numbers are aligned to the module pin.

(2) Performance values reflect maximum power.

(3) Numbers include XTAL frequency drift over temperature and aging.

(1) (2)

CONDITION MIN TYP MAX UNIT

(3)

±75 ±75 kHz

EDR2 4% 15%

EDR3 4% 10%

EDR2 30%

EDR3 20%

EDR2 9% 25%

EDR3 9% 18%

8.14 Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals

over operating free-air temperature range (unless otherwise noted)

PARAMETER

Bluetooth low energy operation frequency range 2402 2480 MHz

Bluetooth low energy channel spacing 2 MHz

Bluetooth low energy input impedance 50 Ω

Bluetooth low energy sensitivity Dirty TX on

Bluetooth low energy maximum usable input power –5 dBm

Bluetooth low energy intermodulation characteristics

Bluetooth low energy C/I performance. Note: Numbers show wanted signal-to-interferingsignal ratio. Smaller numbers indicate better C/I performance. Image = –1 MHz

(1)

(3)

CONDITION

Level of interferers. For n = 3, 4, 5

(2)

MIN TYP MAX UNIT

–92.2

–36 –30

dBm

Low energy, co-channel 12

Low energy, adjacent ±1 MHz 0

Low energy, adjacent +2 MHz –38

Low energy, adjacent –2 MHz –15

Low energy, adjacent ≥ |±3| MHz –40

(1) All RF and performance numbers are aligned to the module pin.

(2) BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to the Bluetooth low energy test

specification.

(3) Sensitivity degradation of up to –3 dB can occur due to fast clock harmonics.

8.15 Bluetooth low energy Performance: Transmitter Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

Bluetooth low energy RF output power

Bluetooth low energy adjacent channel power |M-N| = 2 –51.0 dBm

Bluetooth low energy adjacent channel power |M-N| > 2 –54.0 dBm

(1) All RF and performance numbers are aligned to the module pin.

(2) Bluetooth low energy power is restricted to comply with the ETSI 10-dBm EIRP limit requirement.

(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.

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(1)

≥ 3 V

< 3 V

(3)

(2)

BAT

MIN TYP MAX UNIT

7.0

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dBm

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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

8.16 Bluetooth low energy Performance: Modulation Characteristics

SWRS152N – JUNE 2013 – REVISED APRIL 2021

over operating free-air temperature range (unless otherwise noted)

CHARACTERISTICS

(1)

CONDITION

∆f1avg Mod data = 4 1s, 4 0s:

Bluetooth low energy modulation characteristics

∆f2max ≥ limit for at least 99.9% of all Δf2max

∆f2avg, ∆f1avg 85% 90%

Bluetooth low energy carrier frequency drift

lf0 – fnl , n = 2,3 …. K –25 25 kHz

Bluetooth low energy drift rate lf1 – f0l and lfn – fn-5l , n = 6,7…. K 15 kHz/50 µs

Bluetooth low energy initial carrier frequency tolerance

fn – fTX ±75 ±75 kHz

(3)

(1) All RF and performance numbers are aligned to the module pin.

(2) Performance values reflect maximum power.

(3) Numbers include XTAL frequency drift over temperature and aging.

(2)

111100001111...

Mod data = 1010101...

MIN TYP MAX UNIT

240 250 260

kHz

195 215

8.17 Bluetooth BR and EDR Dynamic Currents

Current is measured at output power as follows: BR at 11.7 dBm; EDR at 7.2 dBm.

USE CASE

BR voice HV3 + sniff 11.6 mA

EDR voice 2-EV3 no retransmission + sniff 5.9 mA

Sniff 1 attempt 1.28 s 178.0 µA

EDR A2DP EDR2 (master). SBC high quality – 345 kbps 10.4 mA

EDR A2DP EDR2 (master). MP3 high quality – 192 kbps 7.5 mA

Full throughput ACL RX: RX-2DH5

Full throughput BR ACL TX: TX-DH5

Full throughput EDR ACL TX: TX-2DH5

Page scan or inquiry scan (scan interval is 1.28 s or 11.25 ms, respectively) 253.0 µA

Page scan and inquiry scan (scan interval is 1.28 s and 2.56 s, respectively) 332.0 µA

(3) (4)

(4)

(1) (2)

TYP UNIT

18.0 mA

50.0 mA

33.0 mA

(1) The role of Bluetooth in all scenarios except A2DP is slave.

(2) CL1P5 PA is connected to V

BAT

, 3.7 V.

(3) ACL RX has the same current in all modulations.

(4) Full throughput assumes data transfer in one direction.

8.18 Bluetooth low energy Currents

All current measured at output power of 7.0 dBm

USE CASE

Advertising, not connectable

Advertising, discoverable

Scanning

(3)

Connected, master role, 1.28-s connect interval

Connected, slave role, 1.28-s connect interval

(1) CL1p% PA is connected to V

(2) Advertising in all three channels, 1.28-s advertising interval, 15 bytes advertise data

(3) Listening to a single frequency per window, 1.28-s scan interval, 11.25-ms scan window

(4) Zero slave connection latency, empty TX and RX LL packets

(2)

(4)

, 3.7 V.

BAT

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(1)

TYP UNIT

131 µA

143 µA

266 µA

124 µA

132 µA

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WL18xx Top Level

Main DC2DC

BAT

VIO

DC2DC

Digital DC2DC

1.8 V

2.2 – 2.7 V

VBAT

VIO_IN

VBAT_IN_MAIN_DC2DC

VBAT_IN_PA_DC2DC

VBAT

MAIN_DC2DC_OUT

DIG_DC2DC_OUT

VDD_DIG

LDO_IN_DIG

PA_DC2DC_OUT

FB_IN_PA_DC2DC

1 V

>10 µs

5 5

60 µs

VBAT

VIO

EXT_32K

WLEN

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

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8.19 Timing and Switching Characteristics

8.19.1 Power Management

8.19.1.1 Block Diagram – Internal DC-DCs

The device incorporates three internal DC-DCs (switched-mode power supplies) to provide efficient internal supplies, derived from V

8.19.2 Power-Up and Shut-Down States

BAT

Figure 8-1. Internal DC-DCs

The correct power-up and shut-down sequences must be followed to avoid damage to the device.

While V

or VIO or both are deasserted, no signals should be driven to the device. The only exception is the

BAT

slow clock that is a fail-safe I/O.

While V

, VIO, and slow clock are fed to the device, but WL_EN is deasserted (low), the device is in

BAT

SHUTDOWN state. In SHUTDOWN state all functional blocks, internal DC-DCs, clocks, and LDOs are disabled.

To perform the correct power-up sequence, assert (high) WL_EN. The internal DC-DCs, LDOs, and clock start to ramp and stabilize. Stable slow clock, VIO, and V

are prerequisites to the assertion of one of the enable

BAT

signals.

To perform the correct shut-down sequence, deassert (low) WL_EN while all the supplies to the device (V VIO, and slow clock) are still stable and available. The supplies to the chip (V

and VIO) can be deasserted only

BAT

after both enable signals are deasserted (low).

Figure 8-2 shows the general power scheme for the module, including the power-down sequence.

NOTE: 1. Either VBAT or VIO can come up first.

NOTE: 2. VBAT and VIO supplies and slow clock (SCLK), must be stable prior to EN being asserted and at all times

NOTE: when the EN is active.

NOTE: 3. At least 60 µs is required between two successive device enables. The device is assumed to be in

NOTE: shutdown state during that period, meaning all enables to the device are LOW for that minimum duration.

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VBAT / VIO

input

EXT_32K

input

WL_EN

input

Main 1V8 DC2DC

TCXO_CLK_REQ

output

DIG DC2DC

SRAM LDO

Internal power stable = 5 ms

Top RESETZ

4.5 ms delay

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NOTE: 4. EN must be deasserted at least 10 µs before VBAT or VIO supply can be lowered (order of supply turn off

NOTE: after EN shutdown is immaterial).

NOTE: 5. EXT_32K - Fail safe I/O

SWRS152N – JUNE 2013 – REVISED APRIL 2021

Figure 8-2. Power-Up System

8.19.3 Chip Top-level Power-Up Sequence

Figure 8-3 shows the top-level power-up sequence for the chip.

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

Figure 8-3. Chip Top-Level Power-Up Sequence

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Indicates completion of firmware download

and internal initialization

Wake-up time

SLOWCLK

input

WL_EN

input

SDIO_CLK

input

WLAN_IRQ

output

TCXO

input

TCXO_CLK_REQ

output

TXCO_LDO

output

VBAT / VIO

input

NLCP

WLAN_IRQ

output

MCP

Host configures device to reverse WLAN_IRQ polarity

Wake-up time

Indicates completion of firmware download

and internal initialization

NLCP: trigger at rising edge

MCP: trigger at low level

Completion of Bluetooth firmware initialztion.

Initialization time

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

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8.19.4 WLAN Power-Up Sequence

Figure 8-4 shows the WLAN power-up sequence.

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Figure 8-4. WLAN Power-Up Sequence

8.19.5 Bluetooth-Bluetooth low energy Power-Up Sequence

Figure 8-5 shows the Bluetooth-Bluetooth low energy power-up sequence.

Figure 8-5. Bluetooth-Bluetooth low energy Power-Up Sequence

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THL

TLH

ISU

Valid

NotValid

ClockInput

DataInput

THL

TLH

Valid

NotValidNotValid

ClockInput

DataOutput

ODLY(max)

ODLY(min)

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SWRS152N – JUNE 2013 – REVISED APRIL 2021

8.19.6 WLAN SDIO Transport Layer

The SDIO is the host interface for WLAN. The interface between the host and the WL18xx module uses an SDIO interface and supports a maximum clock rate of 50 MHz.

The device SDIO also supports the following features of the SDIO V3 specification:

• 4-bit data bus

• Synchronous and asynchronous in-band interrupt

• Default and high-speed (HS, 50 MHz) timing

• Sleep and wake commands

8.19.6.1 SDIO Timing Specifications

Figure 8-6 and Figure 8-7 show the SDIO switching characteristics over recommended operating conditions and

with the default rate for input and output.

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

Figure 8-6. SDIO Default Input Timing

Figure 8-7. SDIO Default Output Timing

Table 8-1 lists the SDIO default timing characteristics.

Table 8-1. SDIO Default Timing Characteristics

(1)

clock

Clock frequency, CLK

DC Low, high duty cycle

TLH

THL

ISU

ODLY

(1) To change the data out clock edge from the falling edge (default) to the rising edge, set the configuration bit.

(2) Parameter values reflect maximum clock frequency.

Rise time, CLK

Fall time, CLK

Setup time, input valid before CLK ↑

Hold time, input valid after CLK ↑

Delay time, CLK ↓ to output valid

Capacitive load on outputs

(2)

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MIN MAX UNIT

0.0 26.0 MHz

40.0% 60.0%

10.0 ns

3.0 ns

2.0 ns

7.0 10.0 ns

15.0 pF

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THL

TLH

Valid

NotValid

ClockInput

DataInput

ISU

50%V

THL

TLH

Valid

NotValidNotValid

ClockInput

DataOutput

ODLY(max)

OH(min)

50%V

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

8.19.6.2 SDIO Switching Characteristics – High Rate

Figure 8-8 and Figure 8-9 show the parameters for maximum clock frequency.

Figure 8-8. SDIO HS Input Timing

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Figure 8-9. SDIO HS Output Timing

Table 8-2 lists the SDIO high-rate timing characteristics.

Table 8-2. SDIO HS Timing Characteristics

clock

DC Low, high duty cycle 40.0% 60.0%

TLH

THL

ISU

ODLY

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Clock frequency, CLK 0.0 52.0 MHz

Rise time, CLK 3.0 ns

Fall time, CLK 3.0 ns

Setup time, input valid before CLK ↑ 3.0 ns

Hold time, input valid after CLK ↑ 2.0 ns

Delay time, CLK ↑ to output valid 7.0 10.0 ns

Capacitive load on outputs 10.0 pF

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MIN MAX UNIT

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8.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)

The device includes a UART module dedicated to the Bluetooth shared-transport, host controller interface (HCI) transport layer. The HCI transports commands, events, and ACL between the Bluetooth device and its host using HCI data packets ack as a shared transport for all functional blocks except WLAN. Table 8-3 lists the transport mechanism for WLAN and bluetooth audio.

Table 8-3. Transport Mechanism

WLAN SHARED HCI FOR ALL FUNCTIONAL BLOCKS EXCEPT WLAN Bluetooth VOICE-AUDIO

WLAN HS SDIO Over UART Bluetooth PCM

The HCI UART supports most baud rates (including all PC rates) for all fast-clock frequencies up to a maximum of 4 Mbps. After power up, the baud rate is set for 115.2 Kbps, regardless of the fast-clock frequency. The baud rate can then be changed using a VS command. The device responds with a Command Complete Event (still at

115.2 Kbps), after which the baud rate change occurs.

HCI hardware includes the following features:

• Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions

• Receiver-transmitter underflow detection

• CTS, RTS hardware flow control

• 4 wire (H4)

Table 8-4 lists the UART default settings.

Table 8-4. UART Default Setting

PARAMETER VALUE

Bit rate 115.2 Kbps

Data length 8 bits

Stop bit 1

Parity None

8.19.7.1 UART 4-Wire Interface – H4

The interface includes four signals:

• TXD

• RXD

• CTS

• RTS

Flow control between the host and the device is byte-wise by hardware.

When the UART RX buffer of the device passes the flow-control threshold, the buffer sets the UART_RTS signal high to stop transmission from the host. When the UART_CTS signal is set high, the device stops transmitting on the interface. If HCI_CTS is set high in the middle of transmitting a byte, the device finishes transmitting the byte and stops the transmission.

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STR-Start-bit; D0..Dn - Data bits (LSB first); PAR - Parity bit (if used); STP - Stop-bit

STR D0 D1 D2 Dn PAR STP

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SWRS152N – JUNE 2013 – REVISED APRIL 2021

Figure 8-10 shows the UART timing.

Figure 8-10. UART Timing Diagram

Table 8-5 lists the UART timing characteristics.

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Table 8-5. UART Timing Characteristics

PARAMETER CONDITION MIN TYP MAX UNIT

Baud rate 37.5 4364 Kbps

Baud rate accuracy per byte Receive-transmit –2.5% 1.5%

Baud rate accuracy per bit Receive-transmit –12.5% 12.5%

t3 CTS low to TX_DATA on 0.0 2.0 µs

t4 CTS high to TX_DATA off Hardware flow control 1.0 bytes

t6 CTS high pulse duration 1.0 Bit

t1 RTS low to RX_DATA on 0.0 2.0 µs

t2 RTS high to RX_DATA off Interrupt set to 1/4 FIFO 16.0 bytes

Figure 8-11 shows the UART data frame.

Figure 8-11. UART Data Frame

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CLK

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8.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications

Figure 8-12 shows the Bluetooth codec-PCM (audio) timing diagram.

Figure 8-12. Bluetooth Codec-PCM (Audio) Master Timing Diagram

Table 8-6 lists the Bluetooth codec-PCM master timing characteristics.

Table 8-6. Bluetooth Codec-PCM Master Timing Characteristics

PARAMETER MIN MAX UNIT

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

clk

Cycle time 162.76

15625 (64 kHz) ns

(6.144 MHz)

High or low pulse duration 35% of T

min

clk

AUD_IN setup time 10.6

AUD_IN hold time 0

AUD_OUT propagation time 0 15

FSYNC_OUT propagation time 0 15

Capacitive loading on outputs 40 pF

Table 8-7 lists the Bluetooth codec-PCM slave timing characteristics.

Table 8-7. Bluetooth Codec-PCM Slave Timing Characteristics

PARAMETER MIN MAX UNIT

clk

Cycle time 81.38 (12.288 MHz) ns

High or low pulse duration 35% of T

min

clk

AUD_IN setup time 5

AUD_IN hold time 0

AUD_FSYNC setup time 5

AUD_FSYNC hold time 0

AUD_OUT propagation time 0 19

Capacitive loading on outputs 40 pF

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WPA Supplicant and Wi-Fi Driver

UART Driver

Bluetooth

Stack and Profiles

SDIO Driver

32 kHz

XTAL

VBAT

VIO

32 kHz

Enable

Wi-Fi

SDIO

Bluetooth

UART

Antenna 1

Wi-Fi and Bluetooth

Antenna 2

Wi-Fi

(Optional)

WL1835MOD

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

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9 Detailed Description

The WiLink 8 module is a self-contained connectivity solution based on WiLink 8 connectivity. As the eighthgeneration connectivity combo chip from TI, the WiLink 8 module is based on proven technology.

Figure 9-1 shows a high-level view of the WL1835MOD variant.

Figure 9-1. WL1835MOD High-Level System Diagram

Table 9-1, Table 9-2, and Table 9-3 list performance parameters along with shutdown and sleep currents.

Maximum TX power 1-Mbps DSSS 17.3 dBm

Minimum sensitivity 1-Mbps DSSS –96.3 dBm

Sleep current Leakage, firmware retained 160 µA

Connected IDLE No traffic IDLE connect 750 µA

RX search Search (SISO20) 54 mA

RX current (SISO20) MCS7, 2.4 GHz 65 mA

TX current (SISO20) MCS7, 2.4 GHz, +11.2 dBm 238 mA

Maximum peak current consumption during calibration

(1) System design power scheme must comply with both peak and average TX bursts.

(2) Peak current V

Maximum TX power GFSK 11.7 dBm

Minimum sensitivity GFSK –92.2 dBm

Sniff 1 attempt, 1.28 s (+4 dBm) 178 µA

Page or inquiry 1.28-s interrupt, 11.25-ms scan window (+4 dBm) 253 µA

A2DP MP3 high quality 192 kbps (+4 dBm) 7.5 mA

26 Submit Document Feedback

(1)

Table 9-1. WLAN Performance Parameters

WLAN

(2)

can hit 850 mA during device calibration.

BAT

• At wakeup, the WiLink 8 module performs the entire calibration sequence at the center of the 2.4-GHz band.

• After a link is established, calibration is performed periodically (every 5 minutes) on the specific channel tuned.

• The maximum VBAT value is based on peak calibration consumption with a 30% margin.

Bluetooth CONDITIONS SPECIFICATION (TYP) UNIT

Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

Table 9-2. Bluetooth Performance Parameters

CONDITIONS SPECIFICATION (TYP) UNIT

850 mA

www.ti.com

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

Table 9-3. Shutdown and Sleep Currents

PARAMETER POWER SUPPLY CURRENT TYP UNIT

Shutdown mode All functions shut down

WLAN sleep mode

Bluetooth sleep mode

VBAT 10

VIO 2

VBAT 160

VIO 60

VBAT 110

VIO 60

9.1 WLAN Features

The device supports the following WLAN features:

• Integrated 2.4-GHz power amplifiers (PAs) for a complete WLAN solution

• Baseband processor: IEEE Std 802.11b/g and IEEE Std 802.11n data rates with 20- or 40-MHz SISO and 20-MHz MIMO

• Fully calibrated system (production calibration not required)

• Medium access controller (MAC) – Embedded Arm® central processing unit (CPU)

– Hardware-based encryption-decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys – Requirements for Wi-Fi-protected access (WPA and WPA2.0) and IEEE Std 802.11i (includes hardware-

accelerated Advanced Encryption Standard [AES])

• New advanced coexistence scheme with Bluetooth and Bluetooth low energy wireless technology

• 2.4- GHz radio – Internal LNA and PA

– IEEE Std 802.11b, 802.11g, and 802.11n

• 4-bit SDIO host interface, including high speed (HS) and V3 modes

µA

9.2 Bluetooth Features

The device supports the following Bluetooth features:

• Bluetooth 5.1 secure connection as well as CSA2

• Concurrent operation and built-in coexisting and prioritization handling of Bluetooth and Bluetooth low energy wireless technology, audio processing, and WLAN

• Dedicated audio processor supporting on-chip SBC encoding + A2DP – Assisted A2DP (A3DP): SBC encoding implemented internally

– Assisted WB-speech (AWBS): modified SBC codec implemented internally

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www.ti.com

9.3 Bluetooth Low Energy Features

The device supports the following Bluetooth low energy features:

• Bluetooth 5.1 low energy dual-mode standard

• All roles and role combinations, mandatory as well as optional

• Up to 10 low energy connections

• Independent low energy buffering allowing many multiple connections with no affect on BR-EDR performance

9.4 Device Certification

The WL18MODGB modules from TI (test grades 01, 05, 31, and 35) are certified for FCC, IC, ETSI/CE, and Japan MIC. TI customers that build products based on the WL18MODGI device from TI can save on testing costs and time per product family. Table 9-4 shows the certification list for the WL18MODGI module.

Table 9-4. Device Certification

REGULATORY BODY SPECIFICATION ID (IF APPLICABLE)

FCC (USA) Part 15C + MPE FCC RF exposure Z64-WL18SBMOD

ISED (Canada) RSS-102 (MPE) and RSS-247 (Wi-Fi, Bluetooth) 451I-WL18SBMOD

EN300328 v2.1.1 (2.4-GHz Wi-Fi, Bluetooth) —

EN301893 v2.1.1 (5-GHz Wi-Fi) —

ETSI/CE (Europe)

MIC (Japan) Article 49-20 of ORRE 201-135370

EN62311:2008 (MPE) —

EN301489-1 v2.1.1 (general EMC) —

EN301489-17 v3.1.1 (EMC) —

EN60950-1:2006/A11:2009/A1:2010/A12:2011/A2:2013 —

9.4.1 FCC Certification and Statement

The WL18MODGB modules from TI are certified for the FCC as a single-modular transmitter. The modules are FCC-certified radio modules that carries a modular grant. Users are cautioned that changes or modifications not expressively approved by the party responsible for compliance could void the authority of the user to operate the equipment.

This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:

• This device may not cause harmful interference.

• This device must accept any interference received, including interference that may cause undesired operation of the device.

CAUTION

FCC RF Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter must not be colocated or operating with any other antenna or transmitter.

9.4.2 Innovation, Science, and Economic Development Canada (ISED)

The WL18MODGB modules from TI are certified for IC as a single-modular transmitter. The WL18MODGB modules from TI meet IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC regarding certified modules in authorized equipment. This device complies with Industry Canada licence-exempt RSS standards.

Operation is subject to the following two conditions:

• This device may not cause interference.

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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

• This device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.

L'exploitation est autorisée aux deux conditions suivantes:

• L'appareil ne doit pas produire de brouillage.

• L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

CAUTION

IC RF Radiation Exposure Statement:

To comply with IC RF exposure requirements, this device and its antenna must not be colocated or operating in conjunction with any other antenna or transmitter.

Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antenne ne doivent pas étre co-localisés ou fonctionnant en conjonction avec une autre antenne or transmitter.

9.4.3 ETSI/CE

The WL18MODGB modules conform to the EU Radio Equipment Directive. For further detains, see the full text of the EU Declaration of Conformity for the WL18MODGBWL18MODGB (test grade 01), WL18MODGB (test

grade 05), WL18MODGB (test grade 31), and WL18MODGI (test grade 35) devices.

9.4.4 MIC Certification

The WL18MODGB modules from TI are MIC certified against article 49-20 and the relevant articles of the Ordinance Regulating Radio Equipment. Operation is subject to the following condition:

• The host system does not contain a wireless wide area network (WWAN) device.

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Model: WL18 MODGB Test Grade:&& FCC ID: Z64

-WL18SBMOD

IC: 451I

WL18SBMOD

LTC: XXXXXXX

R 201-135370

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

9.5 Module Markings

Figure 9-2 shows the markings for the TI WiLink 8 module.

Figure 9-2. WiLink 8 Module Markings

Table 9-5 describes the WiLink 8 module markings.

Table 9-5. Description of WiLink™ 8 Module Markings

MARKING DESCRIPTION

WL18MODGB Model

&& Test grade (for more information, see Section 9.6)

Z64-WL18SBMOD FCC ID: single modular FCC grant ID

451I-WL18SBMOD IC: single modular IC grant ID

LTC (lot trace code): XXXXXXX LTC: Reserved for TI Use

201-135370 R: single modular TELEC grant ID

TELEC compliance mark

CE CE compliance mark

www.ti.com

9.6 Test Grades

To minimize delivery time, TI may ship the device ordered or an equivalent device currently available that contains at least the functions of the part ordered. From all aspects, this device will behave exactly the same as the part ordered. For example, if a customer orders device WL1801MOD, the part shipped can be marked with a test grade of 35, 05 (see Table 9-6).

30 Submit Document Feedback

Table 9-6. Test Grade Markings

MARK 1 WLAN Bluetooth

0& Tested –

3& Tested Tested

MARK 2 WLAN 2.4 GHz MIMO 2.4 GHz

&1 Tested –

&5 Tested Tested

Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

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SWRS152N – JUNE 2013 – REVISED APRIL 2021

9.7 End Product Labeling

These modules are designed to comply with the FCC single modular FCC grant, Z64- WL18SBMOD. The host system using this module must display a visible label indicating the following text:

Contains FCC ID: Z64-WL18SBMOD

These modules are designed to comply with the IC single modular FCC grant, IC: 451I-WL18SBMOD. The host system using this module must display a visible label indicating the following text:

Contains IC: 451I-WL18SBMOD

This module is designed to comply with the JP statement, 201-135370. The host system using this module must display a visible label indicating the following text:

Contains transmitter module with certificate number: 201-135370

9.8 Manual Information to the End User

The OEM integrator must be aware of not providing information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user's manual must include all required regulatory information and warnings as shown in this manual.

Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

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The value of antenna matching components is for WL1835MODCOM8B

WLAN/BT Enable Control. Connect to Host GPIO.

For Debug only

Connect to Host HCI Interface.

Connect to Host BT PCM Bus.

Connect to Host SDIO Interface.

For Debug only

ANT1- WL_2.4_IO2/BT

ANT2- WL_2.4_IO1

WL_IRQ_1V8

WL_SDIO_D3_1V8

WL_SDIO_CLK_1V8

WL_SDIO_D2_1V8

WL_SDIO_D1_1V8

WL_SDIO_D0_1V8

WL_SDIO_CMD_1V8

BT_HCI_RTS_1V8

BT_HCI_CTS_1V8

BT_AUD_CLK

BT_AUD_IN

BT_AUD_OUT

BT_AUD_FSYNC

WL_RS232_TX_1V8

WL_RS232_RX_1V8

BT_HCI_TX_1V8

BT_HCI_RX_1V8

BT_EN

WLAN_EN

SLOW_CLK

VBAT_IN

VIO_IN

0.1uF

0402

TP6

J6 U.FL-R-SMT(10)

U.FL

U1 WL1835MODGB

E-13.4X13.3-N100_0.75-TOP

GPIO93GPIO125GPIO112GPIO10

GND

VIO

VBAT

EXT_32K

BT_AUD_FSYNC

BT_AUD_IN

BT_AUD_OUT

BT_AUD_CLK

WL_SDIO_D2

WL_SDIO_CLK

WL_SDIO_D313WL_SDIO_D010WL_SDIO_D1

WL_SDIO_CMD

BT_HCI_RTS

BT_HCI_RX

BT_HCI_TX

BT_HCI_CTS

GND

GPIO_4

GPIO_2

GPIO_1

BT_EN_SOC

WLAN_IRQ

WLAN_EN_SOC

BT_UART_DBG

WL_UART_DBG

GND

G13

GND

G14

GND

G15

GND

G16

GND

G10

GND

G11

GND

G12

VBAT

GND

RF_ANT1

GND

RESERVED1

RESERVED2

GND

RESERVED3

GND

G17

GND

G18

GND

G19

GND

G20

GND

G21

GND

G22

GND

G23

GND

G24

GND

G25

GND

G26

GND

G27

GND

G28

GND

G29

GND

G30

GND

G31

GND

G32

GND

G33

GND

G34

GND

G35

GND

RF_ANT2

GND

GND45GND

GND

G36

OSC1 1V8 / 32.768kHz

OSC-3.2X2.5

VCC

OUT

GND

R20 NU

RES1005

TP10

TP7

TP2

TP13

TP5

TP8

C12 NU

0402

C5 10pF

0402

ANT2 ANT016008LCD2442MA1

ANT-N3-1.6X0.8MM-B

FEED

2.4G

C11

1.2pF

0402

C7 NU_10pF

0402

TP4

C1 1uF

0402

1.1nH

0402

0.1uF

0402

TP3

C6 10pF

0402

TP11

J5 U.FL-R-SMT(10)

U.FL

2.2pF

0402

C10 NU_0.3pF

0402

R6 0R

0402

ANT1 ANT016008LCD2442MA1

ANT-N3-1.6X0.8MM-A

FEED

2.4G

C13 8pF

0402

C8 NU_10pF

0402

1.5nH

0402

TP12

C2 10uF

0603

TP1

C14 4pF

0402

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

10 Applications, Implementation, and Layout

Note

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

10.1 Application Information

10.1.1 Typical Application – WL1835MODGB Reference Design

Figure 10-1 shows the TI WL1835MODGB reference design.

www.ti.com

32 Submit Document Feedback

Figure 10-1. TI Module Reference Schematics

Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

www.ti.com

SWRS152N – JUNE 2013 – REVISED APRIL 2021

Table 10-1 lists the bill materials (BOM).

Table 10-1. BOM

ITEM DESCRIPTION PART NUMBER PACKAGE REF. QTY MFR

1 TI WL1835 Wi-Fi / Bluetooth module WL1835MODGI 13.4 x 13.3 x 2.0 mm U1 1 TI

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

2 XOSC 3225 / 32.768 kHz / 1.8 V /

±50 ppm

3 Antenna / chip / 2.4 and 5 GHz / peak gain

> 5 dBi

6 Mini RF header receptacle U.FL-R-SMT-1 (10) 3.0 x 2.6 x 1.25 mm J5, J6 2 Hirose

7 Inductor 0402 / 1.1 nH / ±0.05 nH SMD LQP15MN1N1W02 0402 L1 1 Murata

8 Inductor 0402 / 1.5 nH / ±0.05 nH SMD LQP15MN1N5W02 0402 L2 1 Murata

9 Capacitor 0402 / 1.2 pF / 50 V / C0G /

±0.1 pF

10 Capacitor 0402 / 2.2 pF / 50 V / C0G /

±0.1 pF

11 Capacitor 0402 / 4 pF / 50 V / C0G /

±0.1 pF

12 Capacitor 0402 / 8 pF / 50 V / C0G /

±0.1 pF

13 Capacitor 0402 / 10 pF / 50 V / NPO / ±5% 0402N100J500LT 0402 C5, C6 2 Walsin

14 Capacitor 0402 / 0.1 µF / 10 V / X7R /

±10%

15 Capacitor 0402 / 1 µF / 6.3 V / X5R /

±10% / HF

16 Capacitor 0603 / 10 µF / 6.3 V / X5R /

±20%

7XZ3200005 3.2 x 2.5 x 1.0 mm OSC1 1 TXC

ANT016008LCD2442MA1 1.6 mm x 0.8 mm ANT1, ANT2 2 TDK

GJM1555C1H1R2BB01 0402 C11 1 Murata

GJM1555C1H1R2BB01 0402 C9 1 Murata

GJM1555C1H4R0BB01 0402 C14 1 Murata

GJM1555C1H8R0BB01 0402 C13 1 Walsin

0402B104K100CT 0402 C3, C4 1 Walsin

GRM155R60J105KE19D 0402 C1 1 Murata

C1608X5R0J106M 0603 C2 1 TDK

10.1.2 Design Recommendations

This section describes the layout recommendations for the WL1835 module, RF trace, and antenna.

Table 10-2 summarizes the layout recommendations.

Table 10-2. Layout Recommendations Summary

ITEM DESCRIPTION

Thermal

1 The proximity of ground vias must be close to the pad.

2 Signal traces must not be run underneath the module on the layer where the module is mounted.

3 Have a complete ground pour in layer 2 for thermal dissipation.

4 Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.

5 Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if possible.

6 Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting layer.

RF Trace and Antenna Routing

7 The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate.

8 The RF trace bends must be gradual with an approximate maximum bend of 45° with trace mitered. RF traces must not have sharp

corners.

9 RF traces must have via stitching on the ground plane beside the RF trace on both sides.

10 RF traces must have constant impedance (microstrip transmission line).

11 For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be

solid.

12 There must be no traces or ground under the antenna section.

13 RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The

proximity of the antenna to the enclosure and the enclosure material must also be considered.

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AntennasdistanceisHigherthan

halfwavelength.

Antennaplacementon

theedgeoftheboard.

Nosharpcorners.

Constant50OHMcontrol

impedanceRF Trace.

Antennasareorthogonal

toeachother.

76.00mm

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

www.ti.com

Table 10-2. Layout Recommendations Summary (continued)

ITEM DESCRIPTION

Supply and Interface

14 The power trace for V

15 The 1.8-V trace must be at least 18-mil wide.

16 Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance.

17 If possible, shield V

18 SDIO signals traces (CLK, CMD, D0, D1, D2, and D3) must be routed in parallel to each other and as short as possible (less than

12 cm). In addition, every trace length must be the same as the others. There should be enough space between traces – greater than 1.5 times the trace width or ground – to ensure signal quality, especially for the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signal traces. TI recommends adding ground shielding around these buses.

19 SDIO and digital clock signals are a source of noise. Keep the traces of these signals as short as possible. If possible, maintain a

clearance around them.

must be at least 40-mil wide.

BAT

traces with ground above, below, and beside the traces.

BAT

10.1.3 RF Trace and Antenna Layout Recommendations

Figure 10-2 shows the location of the antenna on the WL1835MODCOM8B board as well as the RF trace routing

from the WL1835 module (TI reference design). The Pulse multilayer antennas are mounted on the board with a specific layout and matching circuit for the radiation test conducted in FCC, CE, and IC certifications.

Note

For reuse of the regulatory certification, a trace of 1-dB attenuation is required on the final application board.

Follow these RF trace routing recommendations:

• RF traces must have 50-Ω impedance.

• RF traces must not have sharp corners.

• RF traces must have via stitching on the ground plane beside the RF trace on both sides.

• RF traces must be as short as possible. The antenna, RF traces, and module must be on the edge of the PCB product in consideration of the product enclosure material and proximity.

34 Submit Document Feedback

Figure 10-2. Location of Antenna and RF Trace Routing on the WL1835MODCOM8B Board

Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

Layer1

Layer2(SolidGND)

www.ti.com

10.1.4 Module Layout Recommendations

Figure 10-3 shows layer 1 and layer 2 of the TI module layout.

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

Figure 10-3. TI Module Layout

Follow these module layout recommendations:

• Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation.

• Do not run signal traces under the module on a layer where the module is mounted.

• Signal traces can be run on a third layer under the solid ground layer and beneath the module mounting.

• Run the host interfaces with ground on the adjacent layer to improve the return path.

• TI recommends routing the signals as short as possible to the host.

10.1.5 Thermal Board Recommendations

The TI module uses µvias for layers 1 through 6 with full copper filling, providing heat flow all the way to the module ground pads.

TI recommends using one big ground pad under the module with vias all the way to connect the pad to all ground layers (see Figure 10-4).

Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

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Module

COM8Board

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SWRS152N – JUNE 2013 – REVISED APRIL 2021

www.ti.com

Figure 10-4. Block of Ground Pads on Bottom Side of Package

Figure 10-5 shows via array patterns, which are applied wherever possible to connect all of the layers to the TI

module central or main ground pads.

Figure 10-5. Via Array Patterns

36 Submit Document Feedback

Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

Temp (degC)

Time

(SeC)

Meating

Preheat

Soldering

Cooling

T1 T2

www.ti.com

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

10.1.6 Baking and SMT Recommendations

10.1.6.1 Baking Recommendations

Follow these baking guidelines for the WiLink 8 module:

• Follow MSL level 3 to perform the baking process.

• After the bag is open, devices subjected to reflow solder or other high temperature processes must be mounted within 168 hours of factory conditions (< 30°C/60% RH) or stored at <10% RH.

• If the humidity indicator card reads >10%, devices require baking before they are mounted.

• If baking is required, bake devices for 8 hours at 125°C.

10.1.6.2 SMT Recommendations

Figure 10-6 shows the recommended reflow profile for the WiLink 8 module.

Figure 10-6. Reflow Profile for the WiLink 8 Module

Table 10-3 lists the temperature values for the profile shown in Figure 10-6.

Table 10-3. Temperature Values for Reflow Profile

ITEM TEMPERATURE (°C) TIME (s)

Preheat D1 to approximately D2: 140 to 200 T1: 80 to approximately 120

Soldering D2: 220 T2: 60 ±10

Peak temperature D3: 250 maximum T3: 10

Note

TI does not recommend the use of conformal coating or similar material on the WiLink 8 module. This coating can lead to localized stress on the WCSP solder connections inside the module and impact the device reliability. Care should be taken during module assembly process to the final PCB to avoid the presence of foreign material inside the module.

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11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.1.2 Development Support

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules.

11.1.2.1 Tools and Software

For a complete listing of development-support tools, visit the Texas Instruments WL18xx Wiki. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

Design Kits and Evaluation Modules

AM335x EVM (TMDXEVM3358)

AM437x Evaluation Module (TMDSEVM437X)

BeagleBone Black Development Board (BEAGLEBK)

WiLink 8 Module 2.4 GHz WiFi + Bluetooth COM8 EVM (WL1835MODCOM8B)

The AM335x EVM enables developers to immediately evaluate the AM335x processor family (AM3351, AM3352, AM3354, AM3356, and AM3358) and begin building applications, such as portable navigation, portable gaming, and home and building automation.

The AM437x EVM enables developers to immediately evaluate the AM437x processor family (AM4376, AM4377, AM4378, and AM4379 ) and begin building applications, such as portable navigation, patient monitoring, home and building automation, barcode scanners, and portable data terminals.

BeagleBone Black is a low-cost, open source, community-supported development platform for Arm Cortex-A8 processor developers and hobbyists. Boot Linux in under 10 seconds and get started on Sitara™ AM335x Arm Cortex-A8 processor development in less than 5 minutes using just a single USB cable.

The WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add Wi-Fi and Bluetooth technology (WL183x module only) to embedded applications based on TI's Sitara microprocessors. TI’s WiLink 8 Wi-Fi + Bluetooth modules are precertified and offer high throughput and extended range along with Wi-Fi and Bluetooth coexistence (WL183x modules only) in a power-optimized design. Drivers for the Linux and Android high-level operating systems (HLOSs) are available free of charge from TI for the Sitara AM335x microprocessor (Linux and Android version restrictions apply).

Note: The WL1835MODCOM8 EVM is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5-GHz band and extended temperature range, see the WL1837MODCOM8I EVM.

WL18XXCOM82SDMMC Adapter Board

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Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

The WiLink SDIO board is an SDMMC adapter board and an easy-touse connector between the WiLink COM8 EVM (WL1837MODCOM8i and WL1835MODCOM8B) and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO and provides a UART connection for Bluetooth technology over an FPC connector or wire cables. In addition, the adapter is a standalone evaluation platform using TI wireless PC debug tools for any WiLink module or chip

www.ti.com

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

solution with a PCB 100-pin edge connector. This board is designed for use with various platforms such as the TI Sitara AM335 and AM437.

TI Reference Designs

Find reference designs leveraging the best in TI technology to solve your system-level challenges.

TI WiLink 8 Wi-Fi/Bluetooth/ Bluetooth Smart Audio MultiRoom Cape Reference Design (TIDC-WL1837MODAUDIO-MULTIROOM-CAPE)

2.4-GHz Wi-Fi + Bluetooth Certified Antenna Design on WiLink 1835 Module (TIDCWL1835MODCOM8B)

Smart Home and Energy Gateway Reference Design (TIEPSMART-ENERGY-GATEWAY)

Streaming Audio Reference Design (TIDEP0009)

The TI WiLink 8 WL1837MOD audio cape is wireless a multi-room audio reference design used with BeagleBone Black featuring the TI Sitara (AM335x). The WLAN capability of the WiLink 8 device to capture and register precise arrival time of the connected AP beacon is used to achieve ultra-precise synchronization between multiple connected audio devices. The WiLink 8 module (WL1837MOD) offers integrated Wi-Fi/Bluetooth/Bluetooth Smart solution featuring 2.4-GHz MIMO and antenna diversity on the 5-GHz band. The WiLink 8 module offers a best-in-class audio solution featuring multi-room, Airplay® receiver, full audio stack streaming, support for online music services, and much more. This reference design enables customers to design their own audio boards with Wi-Fi/Bluetooth/Bluetooth Smart connectivity from our WiLink 8 module (WL1837MOD) and evaluate audio multi-room software.

The WiLink 1835 Module Antenna reference design combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way the module is certified. Customers can thus evaluate the performance of the module through embedded applications, such as home automation and the Internet of Things that make use of both Wi-Fi and Bluetooth/Bluetooth low energy functionalities found on the WiLink 1835 module. This antenna design is the same layout used during module certification, allowing customers to avoid repeated certification when creating their specific applications.

The Smart Home and Energy Gateway reference design provides example implementation for measurement, management and communication of energy systems for smart homes and buildings. This example design is a bridge between different communication interfaces, such as Wi-Fi, Ethernet, ZigBee or Bluetooth, that are commonly found in residential and commercial buildings. Because objects in homes and buildings are becoming more and more connected and no single RF standard dominates the market, the gateway design must be flexible to accommodate different RF standards. This example gateway addresses the problem by supporting existing legacy RF standards (Wi-Fi, Bluetooth) and newer RF standards ( ZigBee® and BLE).

The TIDEP0009 Streaming Audio reference design minimizes design time for customers by offering small form factor hardware and major software components, including streaming protocols and Internet radio services. With this reference design, TI offers a quick and easy transition path to the AM335x and WiLink 8 platform solution. This proven combination solution provides key advantages in this market category that helps bring your products to the next level.

Software

WiLink 8 Wi-Fi Driver for Linux OS (WILINK8-WIFI-NLCP)

Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

The NLCP package contains the install package, pre-compiled object and source of the TI Linux Open-Source Wi-Fi image to easily upgrade the default LINUX EZSDK release with the TI WiLink family NLCP Wi-Fi driver. The software is built with Linaro GCC 4.7 and can be added to Linux Software Development Kits (SDKs) that use similar toolchain on other platforms.

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Android Development Kit for Sitara Microprocessors (ANDROIDSDKSITARA)

Linux EZ Software Development Kit (EZSDK) for Sitara Processors (LINUXEZSDK-SITARA)

TI Dual-Mode Bluetooth Stack (TIBLUETOOTHSTACK-SDK)

Bluetooth Service Pack for WL18xx (WL18XX-BT-SP)

TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone with WL18xx and CC256x (TI-BTSTACK-LINUX-ADDON)

WiLink Wireless Tools for WL18XX Modules (WILINKBT_WIFI-WIRELESS_TOOLS)

Although originally designed for mobile handsets, the Android Operating System offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and production today.

Linux SDKs provide Sitara developers with an easy setup and quick outof-box experience that is specific to and highlights the features of TI's Arm processors. Launching demos, benchmarks, and applications is a snap with the included graphical user interface. The Sitara Linux SDK also allows developers to quickly start development of their own applications and easily add them to the application launcher, which can be customized by the developer.

TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth low energy and is comprised of single-mode and dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, provides simple command line sample applications to speed development and has MFI capability on request.

The Bluetooth service pack is composed of the following four files: BTS file (TIInit_11.8.32.bts), ILI file (TIInit_11.8.32.ili), XML (TIInit_11.8.32.xml), Release Notes Document, and License Agreement Note.

The Bluetooth Linux Add-On package contains the install package, precompiled object, and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM, or BeagleBone. The software is built with Linaro GCC 4.7 and can be added to Linux SDKs that use a similar toolchain on other platforms. The Bluetooth stack is fully qualified (QDID 69886 and QDID 69887), provides simple command line sample applications to speed development, and has MFI capability on request.

The WiLink Wireless Tools package includes the following applications: WLAN Real-Time Tuning Tool (RTTT), Bluetooth Logger, WLAN gLogger, Link Quality Monitor (LQM), HCITester Tool (BTSout, BTSTransform, and ScriptPad). The applications provide all of the capabilities required to debug and monitor WiLink WLAN/Bluetooth/Bluetooth low energy firmware with a host, perform RF validation tests, run pretest for regulatory certification testing, and debug hardware and software platform integration issues.

Development Tools

WiLink 8 Proprietary Wi-Fi Driver – QNX, WinCE, Nucleus RTOS Baseline (WILINK8WIFI-WAPI-MCP8, WILINK8WIFI-MCP8, WILINK8-WIFISIGMA-MCP8)

The MCP package contains the install package, precompiled object, and source of the proprietary Wi-Fi driver - QNX, Nucleus, WinCE as well as ThreadX, FreeRTOS, µC, MQX, RTX, and uITRON RTOS baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported through third party vendors. The WAPI package provides the WPA Supplicant patch to support WAPI security protocol. The Sigma package provides the required APIs for WL8 code to support automated Sigma certification testing.

11.1.3 Device Support Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These prefixes represent evolutionary stages of product development from engineering prototypes through fully qualified production devices.

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Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

X WL18XY

MOC

Prefix

X= Preproduction No Prefix = Production Device

WL18

XY Family

X = 0/3

Packaging

Package Designator

Model

R = Large Reel T = Small Reel

MOC = LGA Package

GB = 2.4 GHz Wi-Fi GI = 5 GHz Wi-Fi

Y = 1/5/7

MOD

Module

MOD = module

0 = WLAN only 3 = Bluetooth, WLAN

1 = 2.4 GHz SISO 5 = 2.4 GHz MIMO 7 = 2.4 GHz MIMO + 5 GHz

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SWRS152N – JUNE 2013 – REVISED APRIL 2021

Figure 11-1. Device Nomenclature

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

X Experimental, preproduction, sample or prototype device. Device may not meet all product qualification conditions and may not

fully comply with TI specifications. Experimental/Prototype devices are shipped against the following disclaimer: “This product is still in development and is intended for internal evaluation purposes.” Notwithstanding any provision to the contrary, TI makes no warranty expressed, implied, or statutory, including any implied warranty of merchantability of fitness for a specific purpose, of this device.

null Device is qualified and released to production. TI’s standard warranty applies to production devices.

11.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

11.3 Trademarks

WiLink™ and TI E2E™ are trademarks of Texas Instruments. Android™ is a trademark of Google, Inc. IEEE Std 802.11™ is a trademark of IEEE. Sitara™ is a trademark of TI. Wi-Fi® is a registered trademark of Wi-Fi Alliance. Bluetooth® is a registered trademark of Bluetooth SIG. Linux® is a registered trademark of Linus Torvalds. Arm® is a registered trademark of Arm Limited. Airplay® is a registered trademark of Apple Inc. ZigBee® is a registered trademark of ZigBee Alliance. All trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

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2 1

Pin 2 Ind ic at or

Bott om View

Side Vie w

Top View

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

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12 Mechanical, Packaging, and Orderable Information

12.1 TI Module Mechanical Outline

Figure 12-1 shows the mechanical outline for the device.

Figure 12-1. TI Module Mechanical Outline

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Table 12-1 lists the dimensions for the mechanical outline of the device.

Note

The TI module weighs 0.684 g typical.

Table 12-1. Dimensions for TI Module Mechanical Outline

MARKING MIN (mm) NOM (mm) MAX (mm) MARKING MIN (mm) NOM (mm) MAX (mm)

L (body size) 13.20 13.30 13.40 c2 0.65 0.75 0.85

W (body size) 13.30 13.40 13.50 c3 1.15 1.25 1.35

T (thickness) 1.80 1.90 2.00 d1 0.90 1.00 1.10

a1 0.30 0.40 0.50 d2 0.90 1.00 1.10

a2 0.60 0.70 0.80 e1 1.30 1.40 1.50

a3 0.65 0.75 0.85 e2 1.30 1.40 1.50

b1 0.20 0.30 0.40 e3 1.15 1.25 1.35

b2 0.65 0.75 0.85 e4 1.20 1.30 1.40

b3 1.20 1.30 1.40 e5 1.00 1.10 1.20

c1 0.20 0.30 0.40 e6 1.00 1.10 1.20

12.2 Tape and Reel Information

Emboss taping specification for MOC 100 pin.

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Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

5.00°

C0.5

Ao = Bo

Pin 1

2.20±0.7

100.00±1.5

330.00±2.0

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SWRS152N – JUNE 2013 – REVISED APRIL 2021

12.2.1 Tape and Reel Specification

Figure 12-2. Tape Specification

Table 12-2. Dimensions for Tape Specification

ITEM W E F P Po P2 Do T Ao Bo Ko

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

DIMENSION

(mm)

24.00

(±0.30)

1.75

(±0.10)

11.50

(±0.10)

20.00

(±0.10)

4.00

(±0.10)

2.00

(±0.10)

2.00

(±0.10)

0.35

(±0.05)

13.80

(±0.10)

13.80

(±0.10)

2.50

(±0.10)

Figure 12-3. Reel Specification

Table 12-3. Dimensions for Reel Specification

ITEM W1 W2

DIMENSION (mm) 24.4 (+1.5, –0.5) 30.4 (maximum)

Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

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572

360

370

856

616

1,243

250354

362

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

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12.2.2 Packing Specification

12.2.2.1 Reel Box

The reel is packed in a moisture barrier bag fastened by heat-sealing. Each moisture-barrier bag is packed into a reel box, as shown in Figure 12-4.

Figure 12-4. Reel Box

The reel box is made of corrugated fiberboard.

12.2.2.2 Shipping Box

Figure 12-5 shows a typical shipping box. If the shipping box has excess space, filler (such as cushion) is added.

Note

The size of the shipping box may vary depending on the number of reel boxes packed.

Figure 12-5. Shipping Box

The shipping box is made of corrugated fiberboard.

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12.3 Packaging Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

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12.3.1 PACKAGE OPTION ADDENDUM

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Orderable Device Status

WL1801MODGBMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 –20 to 70

WL1801MODGBMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 –20 to 70

WL1805MODGBMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 –20 to 70

WL1805MODGBMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 –20 to 70

WL1831MODGBMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 –20 to 70

WL1831MODGBMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 –20 to 70

WL1835MODGBMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 –20 to 70

WL1835MODGBMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 –20 to 70

(1)

Package Type

Package Drawing

Pins Package Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp (°C)

(3)

Op Temp (°C)

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS Compliance: This product has an RoHS exemption for one or more subcomponent(s). The product is otherwise considered Pb-Free (RoHS compatible) as defined above.

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided

by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider

certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

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Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance.

PACKAGE OUTLINE

4221006/B 10/2016

www.ti.com

QFM - 2.0 mm max height

QUAD FLAT MODULE

MOC0100A

0.08

0.1 C A B

0.05 C

SYMM

13.5

13.3

13.4

13.2

PIN 1

INDEX AREA

2 MAX

60X

0.8

0.7

60X

0.45

0.35

0.8

0.7 36X

1.05

0.95

56X

0.7

7.7

TYP

2X 9.8

2X 12.05

(1.4) TYP

7.7

TYP

2X 9.8

2X 11.95

(1.4) TYP

PIN 2

G7 G31

G36

G19

NOTES: (continued)

4. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271)

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, it is recommended that vias under paste be filled, plugged or tented.

EXAMPLE BOARD LAYOUT

4221006/B 10/2016

www.ti.com

QFM - 2.0 mm max height

MOC0100A

QUAD FLAT MODULE

SYMM

LAND PATTERN EXAMPLE

SCALE: 8X

2X (11.95)

(12.05)

(1.05) TYP

(1.4) TYP

60X (0.75)

60X (0.4)

56X (0.7)

(1.05) TYP (1.4) TYP

36X (1)

4X (0.75)

G13

G19

G25

G31

G12

G18

G24

G30

G36

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

0.05 MIN

ALL AROUND

SOLDER MASK OPENING

METAL UNDER SOLDER MASK

(R0.05) TYP

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations..

EXAMPLE STENCIL DESIGN

4221006/B 10/2016

www.ti.com

QFM - 2.0 mm max height

MOC0100A

QUAD FLAT MODULE

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

PADS 1, 17, 33, 49, G1-G36

90% PRINTED COVERAGE BY AREA

SCALE: 8X

4X (0.713)

36X (0.95)

SEE DETAIL A

DETAIL A

SCALE 20X

DETAIL B

SCALE 20X

SEE DETAIL B

SOLDER

PASTE

SOLDER MASK EDGE

METAL UNDER SOLDER MASK

SOLDER PASTE

2X (11.95)

G13

G19

G25

G31

(12.05)

(1.05) TYP

(1.4) TYP

60X (0.75)

60X (0.4)

56X (0.7)

(1.05) TYP (1.4) TYP

G12

G18

G24

G30

G36

METAL UNDER

SOLDER MASK

SOLDER

MASK EDGE

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Texas Instruments WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Features

2 Applications

3 Description

4 Functional Block Diagram

Table of Contents

5 Revision History

6 Device Comparison

6.1 Related Products

7 Terminal Configuration and Functions

7.1 Pin Attributes

8 Specifications

8.1 Absolute Maximum Ratings

8.2 ESD Ratings

8.3 Recommended Operating Conditions

8.4 External Digital Slow Clock Requirements

8.5 Thermal Resistance Characteristics for MOC 100-Pin Package

8.6 WLAN Performance: 2.4-GHz Receiver Characteristics

8.7 WLAN Performance: 2.4-GHz Transmitter Power

8.8 WLAN Performance: Currents

8.9 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals

8.10 Bluetooth Performance: Transmitter, BR

8.11 Bluetooth Performance: Transmitter, EDR

8.12 Bluetooth Performance: Modulation, BR

8.13 Bluetooth Performance: Modulation, EDR

8.14 Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals

8.15 Bluetooth low energy Performance: Transmitter Characteristics

8.16 Bluetooth low energy Performance: Modulation Characteristics

8.17 Bluetooth BR and EDR Dynamic Currents

8.18 Bluetooth low energy Currents

8.19 Timing and Switching Characteristics

8.19.1 Power Management

8.19.1.1 Block Diagram – Internal DC-DCs

8.19.2 Power-Up and Shut-Down States

8.19.3 Chip Top-level Power-Up Sequence

8.19.4 WLAN Power-Up Sequence

8.19.5 Bluetooth-Bluetooth low energy Power-Up Sequence

8.19.6 WLAN SDIO Transport Layer

8.19.6.1 SDIO Timing Specifications

8.19.6.2 SDIO Switching Characteristics – High Rate

8.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)

8.19.7.1 UART 4-Wire Interface – H4

8.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications

9 Detailed Description

9.1 WLAN Features

9.2 Bluetooth Features

9.3 Bluetooth Low Energy Features

9.4 Device Certification

9.4.1 FCC Certification and Statement

9.4.2 Innovation, Science, and Economic Development Canada (ISED)

9.4.3 ETSI/CE

9.4.4 MIC Certification

9.5 Module Markings

9.6 Test Grades

9.7 End Product Labeling

9.8 Manual Information to the End User

10 Applications, Implementation, and Layout

10.1 Application Information

10.1.1 Typical Application – WL1835MODGB Reference Design

10.1.2 Design Recommendations

10.1.3 RF Trace and Antenna Layout Recommendations

10.1.4 Module Layout Recommendations

10.1.5 Thermal Board Recommendations

10.1.6 Baking and SMT Recommendations

10.1.6.1 Baking Recommendations

10.1.6.2 SMT Recommendations

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

11.1.2 Development Support

11.1.2.1 Tools and Software

11.1.3 Device Support Nomenclature

11.2 Support Resources

11.3 Trademarks

11.4 Electrostatic Discharge Caution

11.5 Glossary

12 Mechanical, Packaging, and Orderable Information