Texas Instruments WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD Datasheet

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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021 SWRS152N – JUNE 2013 – REVISED APRIL 2021

WL18x1MOD, WL18x5MOD WiLink™ 8 Single-Band Combo Module –

Wi-Fi®,

Bluetooth

®, and

1 Features

• General – Integrates RF, power amplifiers (PAs), clock,

RF switches, filters, passives, and power management

– Quick hardware design with TI module

collateral and reference designs – Operating temperature: –20°C to +70°C – Small form factor: 13.3 × 13.4 × 2 mm – 100-pin MOC package – FCC, IC, ETSI/CE, and TELEC certified with

PCB, dipole, chip, and PIFA antennas

• Wi-Fi

• Bluetooth® and Bluetooth low energy

– WLAN baseband processor and RF transceiver

support of IEEE Std 802.11b, 802.11g, and

802.11n

– 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO

at 2.4 GHz for high throughput: 80 Mbps (TCP),

100 Mbps (UDP) – 2.4-GHz MRC support for extended range – Fully calibrated: production calibration not

required – 4-bit SDIO host interface support – Wi-Fi direct concurrent operation (multichannel,

multirole)

(WL183xMOD only) – Bluetooth 5.1 secure connection compliant and

CSA2 support (declaration ID: D032799) – Host controller interface (HCI) transport for

Bluetooth over UART – Dedicated audio processor support of SBC

encoding + A2DP

Bluetooth

Low Energy (LE)

– Dual-mode Bluetooth and Bluetooth low energy – TI's Bluetooth and Bluetooth low energy

certified stack

• Key benefits – Reduces design overhead

– Differentiated use cases by configuring

WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other WiFi devices on different RF channel (Wi-Fi networks)

– Best-in-class Wi-Fi with high-performance

audio and video streaming reference applications with up to 1.4× the range versus one antenna

– Different provisioning methods for in-home

devices connectivity to Wi-Fi in one step

– Lowest Wi-Fi power consumption in connected

idle (< 800 µA)

– Configurable wake on WLAN filters to only

wake up the system

– Wi-Fi and Bluetooth single antenna coexistence

2 Applications

• Internet of things (IoT)

• Multimedia

• Home electronics

• Home appliances and white goods

• Industrial and home automation

• Smart gateway and metering

• Video conferencing

• Video camera and security

3 Description

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and

Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz

module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux® and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

Device Information

PART NUMBER PACKAGE BODY SIZE

WL1801MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm

WL1805MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm

WL1831MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm

WL1835MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm

(1) For more information, see Section 12.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

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(1)

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VIO

ZigBee

COEX

MAC/PHY

32.768 kHz

WLAN_SDIO

BT_UART

WRF1

BTRF

BG2

BG1

MAC/PHY

BT_EN

WLAN_EN

VBAT

RF_ANT1

RF_ANT2

26M XTAL

2.4-GHz SPDT

WRF2

Interface

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

4 Functional Block Diagram

Figure 4-1 shows a functional block diagram of the WL1835MOD variant.

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NOTE: Dashed lines indicate optional configurations and are not applied by default.

Figure 4-1. WL1835MOD Functional Block Diagram

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1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Functional Block Diagram.............................................. 2

5 Revision History.............................................................. 3

6 Device Comparison......................................................... 4

6.1 Related Products........................................................ 4

7 Terminal Configuration and Functions..........................5

7.1 Pin Attributes...............................................................6

8 Specifications.................................................................. 9

8.1 Absolute Maximum Ratings........................................ 9

8.2 ESD Ratings............................................................... 9

8.3 Recommended Operating Conditions.........................9

8.4 External Digital Slow Clock Requirements................10

8.5 Thermal Resistance Characteristics for MOC

100-Pin Package......................................................... 10

8.6 WLAN Performance: 2.4-GHz Receiver

Characteristics.............................................................11

8.7 WLAN Performance: 2.4-GHz Transmitter Power.... 12

8.8 WLAN Performance: Currents.................................. 13

8.9 Bluetooth Performance: BR, EDR Receiver

Characteristics—In-Band Signals................................13

8.10 Bluetooth Performance: Transmitter, BR ............... 15

8.11 Bluetooth Performance: Transmitter, EDR..............15

8.12 Bluetooth Performance: Modulation, BR.................15

8.13 Bluetooth Performance: Modulation, EDR.............. 16

8.14 Bluetooth low energy Performance: Receiver

Characteristics – In-Band Signals............................... 16

8.15 Bluetooth low energy Performance: Transmitter

Characteristics.............................................................16

8.16 Bluetooth low energy Performance: Modulation

Characteristics.............................................................17

8.17 Bluetooth BR and EDR Dynamic Currents............. 17

8.18 Bluetooth low energy Currents................................17

8.19 Timing and Switching Characteristics..................... 18

9 Detailed Description......................................................26

9.1 WLAN Features........................................................ 27

9.2 Bluetooth Features....................................................27

9.3 Bluetooth Low Energy Features................................28

9.4 Device Certification................................................... 28

9.5 Module Markings.......................................................30

9.6 Test Grades...............................................................30

9.7 End Product Labeling................................................31

9.8 Manual Information to the End User......................... 31

10 Applications, Implementation, and Layout............... 32

10.1 Application Information........................................... 32

11 Device and Documentation Support..........................38

11.1 Device Support........................................................38

11.2 Support Resources................................................. 41

11.3 Trademarks............................................................. 41

11.4 Electrostatic Discharge Caution..............................41

11.5 Glossary..................................................................41

12 Mechanical, Packaging, and Orderable

Information.................................................................... 42

12.1 TI Module Mechanical Outline................................ 42

12.2 Tape and Reel Information......................................42

12.3 Packaging Information............................................ 45

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from November 1, 2017 to April 26, 2021 Page

• Updated the numbering format for tables, figures and cross-references throughout the document...................1

• Updated to "Bluetooth 5.1 Secure Connection..." in Section 1 .......................................................................... 1

• Updated Section 6.1, Related Products .............................................................................................................4

• Updated "Bluetooth 4.2" to "Bluetooth 5.1" in Section 9.2 ...............................................................................27

• Updated "Bluetooth 4.2" to "Bluetooth 5.1" in Section 9.3 ...............................................................................28

• Deleted the sentence that began "Moreover, the module is also Wi-Fi certified..." in the first paragraph in

Section 9.4, Device Certification ......................................................................................................................28

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6 Device Comparison

The TI WiLink 8 module offers four footprint-compatible 2.4-GHz variants providing stand-alone Wi-Fi and Bluetooth combo connectivity. Table 6-1 compares the features of the module variants.

Table 6-1. TI WiLink™ 8 Module Variants

FEATURE

WLAN 2.4-GHz SISO

WLAN 2.4-GHz MIMO

WLAN 2.4-GHz MRC

Bluetooth ✓ ✓

(1) SISO: single input, single output; MIMO: multiple input, multiple output; MRC: maximum ratio combining, supported at 802.11 g/n.

(1)

WL1835MOD WL1831MOD WL1805MOD WL1801MOD

✓ ✓ ✓ ✓

✓ ✓

6.1 Related Products

For information about other devices in this family of products or related products, see the following links.

Wireless connectivity overview Lowest power and longest range across 14 wireless connectivity

standards

Sub-1 GHz SimpleLink™ wireless MCUs

Reference Designs for WL1835MOD Find reference designs leveraging the best in TI technology to solve

High performance, long range wireless and ultra-low power consumption

your system-level challenges

DEVICE

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PIN 19 - GND

PIN 17 - GND

PIN 20 - GND

PIN 23 - GND

PIN 24 - GND

PIN 28 - GND

PIN 29 - GND

PIN 30 - GND

PIN 31 - GND

PIN 18 - RF_ANT2

PIN 21 - RESERVED1

PIN 22 - RESERVED2

PIN 25 - GPIO4

PIN 26 - GPIO2

PIN 27 - GPIO1

PIN 32 - RF_ANT1

PIN 1 - GND

PIN 4 - GPIO10

PIN 5 - GPIO12

PIN 2 - GPIO11

PIN 3 - GPIO9

PIN 6 - WL_SDIO_CMD

PIN 8 - WL_SDIO_CLK

PIN 7 - GND

PIN 9 - GND

PIN 10 - WL_SDIO_D0

PIN 11 - WL_SDIO_D1

PIN 12 - WL_SDIO_D2

PIN 13 - WL_SDIO_D3

PIN 14 - WLAN_IRQ

PIN 15 - GND

PIN 16 - GND

PIN 33 - GND

PIN 40 - WLAN_EN

PIN 38 - VIO

PIN 39 - GND

PIN 37 - GND

PIN 41 - BT_EN

PIN 43 - BT_UART_DBG

PIN 46 - VBAT_IN

PIN 36 - EXT_32K

PIN 34 - GND

PIN 35 - GND

PIN 42 - WL_UART_DBG

PIN 44 - GND

PIN 45 - GND

PIN 47 - VBAT_IN

PIN 48 - GND

PIN 49 - GND

PIN 50 - BT_HCI_RTS

PIN 51 - BT_HCI_CTS

PIN 52 - BT_HCI_TX

PIN 53 - BT_HCI_RX

PIN 54 - GND

PIN 55 - GND

PIN 56 - BT_AUD_IN

PIN 57 - BT_AUD_OUT

PIN 58 - BT_AUD_FSYNC

PIN 60 - BT_AUD_CLK

PIN 59 - GND

PIN 61 - GND

PIN 63 - GND

PIN 62 - RESERVED3

PIN 64 - GND

GND

Pin 2 Indicator

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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

7 Terminal Configuration and Functions

Figure 7-1 shows the pin assignments for the 100-pin MOC package.

SWRS152N – JUNE 2013 – REVISED APRIL 2021

Figure 7-1. 100-Pin MOC Package (Bottom View)

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7.1 Pin Attributes

Table 7-1 describes the module pins.

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Table 7-1. Pin Attributes

(2)

DESCRIPTION

(3)

WLAN SDIO clock. Must be driven by the host.

Input sleep clock:

32.768 kHz

Mode setting: high = enable

Connect to 1.8-V external VIO

Power supply input, 2.9 to 4.8 V

Reserved for future use. NC if not used.

WLAN SDIO data bit

3. Changes state to PU at WL_EN or BT_EN assertion for card detects. Later disabled by software during initialization.

PIN NAME

PIN NO.

TYPE/

DIR

SHUTDOWN

STATE

(1)

AFTER

POWER

(1)

VOLTAGE

LEVEL

CONNECTIVITY

1801 1805 1831 1835

Clocks and Reset Signals

WL_SDIO_CLK 8 I Hi-Z Hi-Z 1.8 V v v v v

EXT_32K 36 ANA – v v v v

WLAN_EN 40 I PD PD 1.8 V v v v v

BT_EN 41 I PD PD 1.8 V x x v v

Power-Management Signals

VIO_IN 38 POW PD PD 1.8 V v v v v

VBAT_IN 46 POW VBAT v v v v

VBAT_IN 47 POW VBAT v v v v

TI Reserved

GPIO11 2 I/O PD PD 1.8 V v v v v

GPIO9 3 I/O PD PD 1.8 V v v v v

GPIO10 4 I/O PU PU 1.8 V v v v v

GPIO12 5 I/O PU PU 1.8 V v v v v

RESERVED1 21 I PD PD 1.8 V x x x x

RESERVED2 22 I PD PD 1.8 V x x x x

GPIO4 25 I/O PD PD 1.8 V v v v v

RESERVED3 62 O PD PD 1.8 V x x x x

WLAN Functional Block: Int Signals

WL_SDIO_CMD_1V8 6 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO command

WL_SDIO_D0_1V8 10 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 0

WL_SDIO_D1_1V8 11 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 1

WL_SDIO_D2_1V8 12 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 2

WL_SDIO_D3_1V8 13 I/O Hi-Z PU 1.8 V v v v v

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Table 7-1. Pin Attributes (continued)

(2)

DESCRIPTION

(3)

WLAN SDIO out-ofband interrupt line. Set to rising edge (active high) by default. (To extract the debug option WL_RS232_TX/RX interface out, pull up the IRQ line at power up before applying enable.)

2.4-GHz ANT2 TX, RX;

2.4-GHz secondary antenna MRC/MIMO only.

WL_RS232_RX (when WLAN_IRQ = 1 at power up)

WL_RS232_TX (when WLAN_IRQ = 1 at power up)

2.4-GHz WLAN main antenna SISO, Bluetooth

Option: Bluetooth logger

UART RTS to host. NC if not used.

UART CTS from host. NC if not used.

UART TX to host. NC if not used.

UART RX from host. NC if not used.

Bluetooth PCM/I2S bus. Data in. NC if not used.

Bluetooth PCM/I2S bus. Data out. NC if not used.

Bluetooth PCM/I2S bus. Frame sync. NC if not used.

Bluetooth PCM/I2S bus. NC if not used.

PIN NAME

PIN NO.

TYPE/

DIR

SHUTDOWN

STATE

(1)

AFTER

POWER

(1)

VOLTAGE

LEVEL

CONNECTIVITY

1801 1805 1831 1835

WL_IRQ_1V8 14 O PD 0 1.8 V v v v v

RF_ANT2

18 ANA – x v x v

GPIO2 26 I/O PD PD 1.8 V v v v v

GPIO1 27 I/O PD PD 1.8 V v v v v

RF_ANT1 32 ANA – v v v v

WL_UART_DBG 42 O PU PU 1.8 V v v v v Option: WLAN logger

Bluetooth Functional Block: Int Signals

BT_UART_DBG 43 O PU PU 1.8 V x x v v

BT_HCI_RTS_1V8 50 O PU PU 1.8 V x x v v

BT_HCI_CTS_1V8 51 I PU PU 1.8 V x x v v

BT_HCI_TX_1V8 52 O PU PU 1.8 V x x v v

BT_HCI_RX_1V8 53 I PU PU 1.8 V x x v v

BT_AUD_IN 56 I PD PD 1.8 V x x v v

BT_AUD_OUT 57 O PD PD 1.8 V x x v v

BT_AUD_FSYNC 58 I/O PD PD 1.8 V x x v v

BT_AUD_CLK 60 I/O PD PD 1.8 V x x v v

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Table 7-1. Pin Attributes (continued)

(2)

PIN NAME

PIN NO.

TYPE/

DIR

SHUTDOWN

STATE

(1)

AFTER

POWER

(1)

VOLTAGE

LEVEL

CONNECTIVITY

1801 1805 1831 1835

Ground Pins

GND 1 GND – v v v v

GND 7 GND – v v v v

GND 9 GND – v v v v

GND 15 GND – v v v v

GND 16 GND – v v v v

GND 17 GND – v v v v

GND 19 GND – v v v v

GND 20 GND – v v v v

GND 23 GND – v v v v

GND 24 GND – v v v v

GND 28 GND – v v v v

GND 29 GND – v v v v

GND 30 GND – v v v v

GND 31 GND – v v v v

GND 33 GND – v v v v

GND 34 GND – v v v v

GND 35 GND – v v v v

GND 37 GND – v v v v

GND 39 GND – v v v v

GND 44 GND – v v v v

GND 45 GND – v v v v

GND 48 GND – v v v v

GND 49 GND – v v v v

GND 54 GND – v v v v

GND 55 GND – v v v v

GND 59 GND – v v v v

GND 61 GND – v v v v

GND 63 GND – v v v v

GND 64 GND – v v v v

GND

G1 –

GND – v v v v

G36

DESCRIPTION

(3)

(1) PU = pullup; PD = pulldown; Hi-Z = high-impedance

(2) v = connect; x = no connect

(3) Host must provide PU using a 10-kΩ resistor for all non-CLK SDIO signals.

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8 Specifications

All specifications are measured at the module pins using the TI WL1835MODCOM8 evaluation board. All

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

measurements are performed with V unless otherwise indicated.

For level-shifting I/Os with the TI WL18x5MOD, see the Level Shifting WL18xx I/Os application report.

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

BAT

Input voltage to analog pins –0.5 2.1 V

Input voltage limits (CLK_IN) –0.5 VDD_IO V

Input voltage to all other pins –0.5 (VDD_IO + 0.5 V) V

Operating ambient temperature –20 70

Storage temperature, T

stg

= 3.7 V, VIO = 1.8 V, 25°C for typical values with matched RF antennas,

BAT

Note

(1)

MIN MAX UNIT

(2)

4.8

–0.5 2.1 V

(3)

–40 85 °C

°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Operating Conditions is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) 4.8 V cumulative to 2.33 years, including charging dips and peaks

(3) In the WL18xx system, a control mechanism exists to ensure Tj < 125°C. When Tj approaches this threshold, the control mechanism

manages the transmitter patterns.

8.2 ESD Ratings

VALUE

Electrostatic discharge

(ESD)

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001

Charged device model (CDM), per JEDEC specification JESD22-C101

(1)

(2)

±1000

±250

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

UNIT

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN TYP MAX UNIT

(1)

BAT

IH_EN

IL_EN

Tr,T

DC supply range for all modes 2.9 3.7 4.8 V

1.8-V I/O ring power supply voltage 1.62 1.8 1.95 V

I/O high-level input voltage 0.65 × VDD_IO VDD_IO V

I/O low-level input voltage 0 0.35 × VDD_IO V

Enable inputs high-level input voltage 1.365 VDD_IO V

Enable inputs low-level input voltage 0 0.4 V

High-level output voltage At 4 mA VDD_IO –0.45 VDD_IO V

Low-level output voltage At 4 mA 0 0.45 V

Input transitions time Tr,Tf from 10% to 90% (digital I/O)

Output rise time from 10% to 90% (digital pins)

Output fall time from 10% to 90% (digital pins)

(2)

1 10 ns

CL < 25 pF 5.3 ns

CL < 25 pF 4.9 ns

Ambient operating temperature –20 70 °C

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over operating free-air temperature range (unless otherwise noted)

Maximum power dissipation

WLAN operation 2.8 W

Bluetooth operation 0.2

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MIN TYP MAX UNIT

(1) 4.8 V is applicable only for 2.33 years (30% of the time). Otherwise, maximum V

must not exceed 4.3 V.

BAT

(2) Applies to all digital lines except PCM and slow clock lines.

8.4 External Digital Slow Clock Requirements

The supported digital slow clock is 32.768 kHz digital (square wave). All core functions share a single input.

CONDITION MIN TYP MAX UNIT

Input slow clock frequency 32768 Hz

Input slow clock accuracy (initial, temperature, and aging)

Tr, T

Input transition time (10% to 90%) 200 ns

Frequency input duty cycle 15% 50% 85%

VIH, VILInput voltage limits

Input impedance 1 MΩ

Input capacitance 5 pF

WLAN, Bluetooth ±250 ppm

Square wave, DC coupled

0.65 x VDD_IO VDD_IO V

0 0.35 x VDD_IO

8.5 Thermal Resistance Characteristics for MOC 100-Pin Package

THERMAL METRICS

(1)

Junction to free air

(3)

Junction to board 6.06

Junction to case

(4)

(°C/W)

16.6

5.13

peak

(2)

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application

Report.

(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [R

] value, which is based on

θJC

a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70°C is assumed.

(3) According to the JEDEC EIA/JESD 51 document

(4) Modeled using the JEDEC 2s2p thermal test board with 36 thermal vias

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8.6 WLAN Performance: 2.4-GHz Receiver Characteristics

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin.

PARAMETER CONDITION MIN TYP MAX UNIT

RF_ANT1 pin 2.4-GHz SISO

Operation frequency range 2412 2484 MHz

1 Mbps DSSS –96.3

2 Mbps DSSS –93.2

5.5 Mbps CCK –90.6

11 Mbps CCK –87.9

6 Mbps OFDM –92.0

9 Mbps OFDM –90.4

12 Mbps OFDM –89.5

18 Mbps OFDM –87.2

24 Mbps OFDM –84.1

36 Mbps OFDM –80.7

48 Mbps OFDM –76.5

54 Mbps OFDM –74.9

MCS0 MM 4K –90.4

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

Sensitivity: 20-MHz bandwidth. At < 10% PER limit

Maximum input level

Adjacent channel rejection: Sensitivity level +3 dB for OFDM; Sensitivity level +6 dB for 11b

MCS1 MM 4K –87.6

MCS2 MM 4K –85.9

MCS3 MM 4K –82.8

MCS4 MM 4K –79.4

MCS5 MM 4K –75.2

MCS6 MM 4K –73.5

MCS7 MM 4K –72.4

MCS0 MM 4K 40 MHz –86.7

MCS7 MM 4K 40 MHz –67.0

MCS0 MM 4K MRC –92.7

MCS7 MM 4K MRC –75.2

MCS13 MM 4K –73.7

MCS14 MM 4K –72.3

MCS15 MM 4K –71.0

OFDM –20.0 –10.0

DSSS –4.0 –1.0

2 Mbps DSSS 42.0

54 Mbps OFDM 2.0

dBm

dBmCCK –10.0 –6.0

dB11 Mbps CCK 38.0

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8.7 WLAN Performance: 2.4-GHz Transmitter Power

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin.

PARAMETER CONDITION

Output Power: Maximum RMS output power measured at 1 dB from IEEE spectral mask or EVM

Operation frequency range 2412 2484 MHz

Return loss –10.0 dB

Reference input impedance 50.0 Ω

(2)

MCS0 MM 40 MHz 14.8

MCS7 MM 40 MHz 11.3

(1)

MIN TYP MAX UNIT

RF_ANT1 Pin 2.4-GHz SISO

1 Mbps DSSS 17.3

2 Mbps DSSS 17.3

5.5 Mbps CCK 17.3

11 Mbps CCK 17.3

6 Mbps OFDM 17.1

9 Mbps OFDM 17.1

12 Mbps OFDM 17.1

18 Mbps OFDM 17.1

24 Mbps OFDM 16.2

36 Mbps OFDM 15.3

48 Mbps OFDM 14.6

54 Mbps OFDM 13.8

MCS0 MM 16.1

MCS1 MM 16.1

MCS2 MM 16.1

MCS3 MM 16.1

MCS4 MM 15.3

MCS5 MM 14.6

MCS6 MM 13.8

MCS7 MM

(3)

12.6

RF_ANT1 + RF_ANT2

MCS12 (WL18x5) 18.5

MCS13 (WL18x5) 17.4

MCS14 (WL18x5) 14.5

MCS15 (WL18x5) 13.4

RF_ANT1 + RF_ANT2

dBm

(1) Maximum transmitter power (TP) degradation of up to 30% is expected, starting from 80°C ambient temperature on MIMO operation

(2) Regulatory constraints limit TI module output power to the following:

• Channel 14 is used only in Japan; to keep the channel spectral shaping requirement, the power is limited: 14.5 dBm.

• Channels 1, 11 at OFDM legacy and HT 20-MHz rates: 12 dBm

• Channels 1, 11 at HT 40-MHz rates: 10 dBm

• Channel 7 at HT 40-MHz lower rates: 10 dBm

• Channel 5 at HT 40-MHz upper rates: 10 dBm

• All 11B rates are limited to 16 dBm to comply with the ETSI PSD 10 dBm/MHz limit.

• All OFDM rates are limited to 16.5 dBm to comply with the ETSI EIRP 20 dBm limit.

• For clarification regarding power limitation, see the WL18xx .INI File Application Report.

(3) To ensure compliance with the EVM conditions specified in the PHY chapter of IEEE Std 802.11™ – 2012:

• MCS7 20 MHz channel 12 output power is 2 dB lower than the typical value.

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• MCS7 20 MHz channel 8 output power is 1 dB lower than the typical value.

SWRS152N – JUNE 2013 – REVISED APRIL 2021

8.8 WLAN Performance: Currents

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin.

PARAMETER SPECIFICATION TYP (AVG) –25°C UNIT

Low-power mode (LPM) 2.4-GHz RX SISO20 single chain 49

2.4 GHz RX search SISO20 54

2.4-GHz RX search MIMO20 74

2.4-GHz RX search SISO40 59

2.4-GHz RX 20 M SISO 11 CCK 56

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

Receiver

Transmitter

2.4-GHz RX 20 M SISO 6 OFDM 61

2.4-GHz RX 20 M SISO MCS7 65

2.4-GHz RX 20 M MRC 1 DSSS 74

2.4-GHz RX 20 M MRC 6 OFDM 81

2.4-GHz RX 20 M MRC 54 OFDM 85

2.4-GHz RX 40-MHz MCS7 77

2.4-GHz TX 20 M SISO 6 OFDM 15.4 dBm 285

2.4-GHz TX 20 M SISO 11 CCK 15.4 dBm 273

2.4-GHz TX 20 M SISO 54 OFDM 12.7 dBm 247

2.4-GHz TX 20 M SISO MCS7 11.2 dBm 238

2.4-GHz TX 20 M MIMO MCS15 11.2 dBm 420

2.4-GHz TX 40 M SISO MCS7 8.2 dBm 243

8.9 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals

over operating free-air temperature range (unless otherwise noted)

PARAMETER

Bluetooth BR, EDR operation frequency range

Bluetooth BR, EDR channel spacing

Bluetooth BR, EDR input impedance

Bluetooth BR, EDR sensitivity Dirty TX on

Bluetooth EDR BER floor at sensitivity + 10 dB Dirty TX off (for 1,600,000 bits)

Bluetooth BR, EDR maximum usable input power

Bluetooth BR intermodulation Level of interferers for n = 3, 4, and 5 –36.0 –30.0 dBm

(2)

(1) (2)

CONDITION MIN TYP MAX UNIT

2402 2480 MHz

50 Ω

BR, BER = 0.1% –92.2

EDR2, BER = 0.01% –91.7

EDR3, BER = 0.01% –84.7

EDR2 1e-6

EDR3 1e-6

BR, BER = 0.1% –5.0

EDR3, BER = 0.1% –15.0

1 MHz

dBm

dBmEDR2, BER = 0.1% –15.0

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over operating free-air temperature range (unless otherwise noted)

PARAMETER

Bluetooth BR, EDR C/I performance Numbers show wanted signal-to-interfering-signal ratio. Smaller numbers indicate better C/I performances (Image frequency = –1 MHz)

Bluetooth BR, EDR RF return loss

(1) All RF and performance numbers are aligned to the module pin.

(2) Sensitivity degradation up to –3 dB may occur due to fast clock harmonics with dirty TX on.

(1) (2)

CONDITION MIN TYP MAX UNIT

BR, co-channel 10

EDR, co-channel EDR2 12

EDR3 20

BR, adjacent ±1 MHz –3.0

EDR, adjacent ±1 MHz, (image)

EDR2 –3.0

EDR3 2.0

BR, adjacent +2 MHz –33.0

EDR, adjacent +2 MHz EDR2 –33.0

EDR3 –28.0

BR, adjacent –2 MHz –20.0

EDR, adjacent –2 MHz EDR2 –20.0

EDR3 –13.0

BR, adjacent ≥Ι±3Ι MHz –42.0

EDR, adjacent ≥Ι±3Ι MHz EDR2 –42.0

EDR3 –36.0

–10.0 dB

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8.10 Bluetooth Performance: Transmitter, BR

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 2013 – REVISED APRIL 2021

over operating free-air temperature range (unless otherwise noted)

PARAMETER

BR RF output power

(2)

BR gain control range 30.0 dB

BR power control step 5.0 dB

BR adjacent channel power |M-N| = 2 –43.0 dBm

BR adjacent channel power |M-N| > 2 –48.0 dBm

(1) All RF and performance numbers are aligned to the module pin.

(2) Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command.

(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.

(1)

≥ 3 V

< 3 V

(3)

BAT

MIN TYP MAX UNIT

11.7

7.2

dBm

8.11 Bluetooth Performance: Transmitter, EDR

over operating free-air temperature range (unless otherwise noted)

PARAMETER

EDR output power

EDR gain control range 30 dB

EDR power control step 5 dB

EDR adjacent channel power |M-N| = 1 –36 dBc

EDR adjacent channel power |M-N| = 2 –30 dBm

EDR adjacent channel power |M-N| > 2 –42 dBm

(2)

(1)

≥ 3 V

< 3 V

(3)

BAT

MIN TYP MAX UNIT

7.2

5.2

dBm

(1) All RF and performance numbers are aligned to the module pin.

(2) Values reflect default maximum power. Maximum power can be changed using a VS command.

(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.

8.12 Bluetooth Performance: Modulation, BR

over operating free-air temperature range (unless otherwise noted)

CHARACTERISTICS

BR –20-dB bandwidth 925 995 kHz

BR modulation characteristics

BR carrier frequency drift One-slot packet –25 25 kHz

BR drift rate lfk+5 – fkl , k = 0 to max 15 kHz/50 µs

BR initial carrier frequency tolerance

(1) All RF and performance numbers are aligned to the module pin.

(2) Performance values reflect maximum power.

(3) Numbers include XTAL frequency drift over temperature and aging.

(1)

CONDITION

∆f1avg Mod data = 4 1s, 4 0s:

(2)

MIN TYP MAX UNIT

145 160 170 kHz

111100001111...

∆f2max ≥ limit for

Mod data = 1010101... 120 130 kHz at least 99.9% of all Δf2max

∆f2avg, ∆f1avg 85% 88%

Three- and five-slot

–35 35 kHz

packet

(3)

f0–fTX ±75 ±75 kHz

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+ 35 hidden pages

Texas Instruments WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD Datasheet

1 Features

2 Applications

3 Description

4 Functional Block Diagram

Table of Contents

5 Revision History

6 Device Comparison

6.1 Related Products

7 Terminal Configuration and Functions

7.1 Pin Attributes

8 Specifications

8.1 Absolute Maximum Ratings

8.2 ESD Ratings

8.3 Recommended Operating Conditions

8.4 External Digital Slow Clock Requirements

8.5 Thermal Resistance Characteristics for MOC 100-Pin Package

8.6 WLAN Performance: 2.4-GHz Receiver Characteristics

8.7 WLAN Performance: 2.4-GHz Transmitter Power

8.8 WLAN Performance: Currents

8.9 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals

8.10 Bluetooth Performance: Transmitter, BR

8.11 Bluetooth Performance: Transmitter, EDR

8.12 Bluetooth Performance: Modulation, BR