Texas Instruments UCC5617DWPTR, UCC5617DWP Datasheet

18-Line SCSI Terminator (Reverse Disconnect)
UCC5617
FEATURES
Complies with SCSI, SCSI-2, SCSI-3 and FAST-20 Standards
2pF Channel Capacitance During Disconnect
• 110Termination
SCSI Hot Plugging Compliant, 10nA T ypical
+400mA Sinking Current for Active Negation
650mA Sourcing Current for Termination
Trimmed Impedance to 5%
DESCRIPTION
The UCC5617 provides 18 lines of active termination for a SCSI (Small Computers Systems Interface) parallel bus.The SCSI standard recommends and Fast-20 (Ultra) requires active termination at both ends of the cable.
Pin for pin compatible with the UC5609, the UCC5617 is ideal for high perfor­mance 5V SCSI systems, Termpwr 4.0V to 5.25V.During disconnect the sup­ply current is only 50µA typical, which makes the IC attractive for lower pow­ered systems.
The UCC5617 is designed with a low channel capacitance of 2pF, which elim­inates effects on signal integrity from disconnected terminators at interim points on the bus.
The power amplifier output stage allows the UCC5617 to source full termina­tion current and sink active negation current when all termination lines are actively negated.
The UCC5617, as with all Unitrode terminators, is completely hot pluggable and appears as high impedance at the terminating channels with TRMPWR=0V or open.
Internal circuit trimming is utilized, first to trim the 110impedance, and then most importantly, to trim the output current as close to the maximum SCSI-3 specification as possible, which maximizes noise margin in fast SCSI opera­tion.
Other features include thermal shutdown and current limit. This device is offered in low thermal resistance versions of the industry stan-
dard 28 pin wide body SOIC, TSSOP and PLCC.
4/97
BLOCK DIAGRAM
UDG-96073
Circuit Design Patented
2
UCC5617
ABSOLUTE MAXIMUM RATINGS
Tempwr . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+7V
Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to +7V
Regulator Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1A
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65°C to +150°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55°C to +150°C
Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .300°C
All currents are positive into, negative out of the specified terminal.Consult Packaging Section of Databook for thermal limitations and considerations of packages.
CONNECTION DIAGRAMS
PLCC-28 (Top View) QP Package
* DWP package pins 12 - 18 serve as both heatsink and signal ground.
SOIC-28 (Top View) DWP Package
DIL-24 (Top View) N Package
* N package for engineering samples only.
* DWP package pin 28 serves as signal ground;pins 7, 8, 9, 20, 21, 22 serve as heatsink/ground. Note:Drawings are not to scale.
TSSOP-28 (Top View) PWP Package
* PWP package pin 23 serves as signal ground;pins 7, 8, 9, 20, 21, and 22 serve as heatsink ground.
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