UCC5611
The power ampl ifier output stage allows the UCC5611 to
source full termination current and sink active negation
current when all termination lines are actively negated.
The UCC5611 is pin for pin compatible with Unitrode’s
other 18 line SCSI terminators, except that
DISCNCT is
now active low, allowing lower capacitance and lower
voltage upgrades to existing systems. The UCC5611, as
with all Uni trode terminators, is completely hot pluggable
and appears as high impeda nce at the terminating c hannels with V
TRMPWR
= 0V or open.
Internal circuit trimming is utilized, first to trim the 110
ohm terminati on impedan ce to a 7% tolera nce, and then
most importantly, to trim the output current to a 4% tolerance, as close to the max SCSI-3 spec as possible,
which maxi mizes noise margin in FAST-20 SCSI operation.
Other features include thermal shutdown and current
limit.
This device i s offered in low thermal resistance versions
of the ind ustry standard 28 pin wide body SOIC, 24 pin
wide body DIP and 28 pin PLCC.
ABSOLUTE MAXIMUM RATINGS
Termpwr Vo ltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V
Signal Line Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +7V
Regulator Output Current . . . . . . . . . . . . . . . . . . Self-regulating
Storage Temperature . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Operating Temperature . . . . . . . . . . . . . . . . . −55°C to +150°C
Lead Temperature (Soldering, 10 Sec.). . . . . . . . . . . . . +300°C
RECOMMENDED OPERATING CONDITIONS
Termpwr Voltage . . . . . . . . . . . . . . . . . . . . . . . . 2.75V to 5.25V
Signal Line Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +5V
Disconnect Input Voltage . . . . . . . . . . . . . . . . . . 0V to Termpwr
Description Continued
Unless otherwise sp ec ified all voltages are with respect to
Ground. Currents are positive into, negative out of the specified terminal.
Consult Packaging Section of Unitrode Integrated Circuits databook for thermal limitations and considerations of packages.
CONNECTION DIAGRAMS
PLCC-28 (Top View)
QP Package
* QP package pins 12 - 18 serve as both heatsink and signal
ground.
* DWP package pin 28 serves as signal ground; pins 7, 8, 9,
20, 21, 22 serve as heatsink/ground.
SOIC-28 (Top View)
DWP Package
Note: Drawings are not to scale.
DIL-24 (Top View)
N or J Package
2