Texas Instruments UCC3915PWPTR, UCC3915PWP, UCC3915N, UCC3915DPTR, UCC3915DP Datasheet
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UCC2915
UCC3915
SLUS198A - FEBRUARY 2000
FEATURES
•
Integrated 0.15 Ohm Power
MOSFET
•
7V to 15V Operation
•
Digital Programmable Current Limit
from 0A to 3A
•
100
A ICCwhen Disabled
•
Programmable ON Time
•
Programmable Start Delay
•
Fixed 2% Duty Cycle
•
Thermal Shutdown
•
Fault Output Indicator
•
Maximum Output Current can be set
to 1A above the Programmed Fault
Level or to a full 4A
• Power SOIC and TSSOP, Low
Thermal Resistance Packaging
DESCRIPTION
The UCC3915 Programmable Hot Swap Power Manager provides com
plete power management, hot swap capability, and circuit breaker functions.
The only external component required to operate the device, other than
power supply bypassing, is the fault timing capacitor, C
T
. All control and
housekeeping functions are integrated, and externally programmable.
These include the fault current level, maximum output sourcing current,
maximum fault time, and startup delay. In the event of a constant fault, the
Internal fixed 2% duty cycle ratio limits average output power.
The internal 4 bit DAC allows programming of the fault level current from 0
to 3A with 0.25A resolution. The IMAX control pin sets the maximum
sourcing current to 1A above the trip level or to a full 4A of output current
for fast output capacitor charging.
When the output current is below the fault level, the output MOSFET is
switched ON with a nominal ON resistance of 0.15
. When the output cur
rent exceeds the fault level, but is less than the maximum sourcing level,
the output remains switched ON, but the fault timer starts, charging CT.
Once CT charges to a preset threshold, the switch is turned OFF, and remains OFF for 50 times the programmed fault time. When the output current reaches the maximum sourcing level, the MOSFET transitions from a
switch to a constant current source.
6 7 8 9
1A
ABOVE
FAULT
OVER CURRENT
COMPARATOR
CURRENT FAULT
LEVEL 0–3 AMPS
10
H=4A
MAX
CURRENT
LEVEL
4A
ON TIME
CONTROL
2% DUTY
CYCLE
0–3A
0.25
RES
1113 1245
B3 B2 B1 B0
4BITDAC
GND
HEAT SINK
GND PINS
CT
CHARGE
PUMP
+
16
LINEAR CURRENT
AMPLIFIER
POWER
FET
2
3
V
OUT
REVERSE VOLTAGE
COMPARATOR
30mV
FAULT
THERMAL
SHUTDOWN
INTERNAL
BIAS
+
–
1
15
14
VOUT
VIN
CURRENT SENSE
H = OPEN
1.5V
SHTDWN
IMAX
*
*BODYDIODE
BLOCK DIAGRAM
15V Programmable Hot Swap Power Manager
UDG-99174
Note: Pin numbers refer to DIL-16 and SOIC-16 packages.
2
UCC2915
UCC3915
ABSOLUTE MAXIMUM RATINGS
VIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15.5 Volts
VOUT
VIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.3V
FAULT
Sink Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
FAULT
Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 to 8V
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self Limiting
TTL Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . .
0.3 to V
IN
Storage Temperature . . . . . . . . . . . . . . . . . . . 65 C to +150 C
Junction Temperature. . . . . . . . . . . . . . . . . . .
55 C to +150 C
Lead Temperature (Soldering, 10 sec.). . . . . . . . . . . . . +300
C
Currents are positive into, negative out of the specified termi
-
nal. Consult Packaging Section of Databook for thermal limita
-
tions and considerations of packages.
FAULT16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VOUT
VOUT
GND*
GND*
CT
IMAX
B0
SHTDWN
VIN
VIN
GND*
EGND*
B3
B2
B1
CONNECTION DIAGRAMS
*Pin 5 serves as lowest impedance to the electrical ground;
Pins 4, 12, and 13 serve as heat sink/ground. These pins
should be connected to large etch areas to help dissipate heat.
For N Package, pins 4, 12, and 13 are N/C.
(continued)
DESCRIPTION (cont.)
The UCC3915 can be put into sleep mode, drawing only
100
A of supply current. Other features include an open
drain Fault Output Indicator, Thermal Shutdown, Under
-
B3
N/C
N/C
GND*
GND*
FAULT
VIN
EGND*
GND*
GND*
VIN
N/C
GND*
SHTDWN
GND*
B2
GND*
GND*
CT
12
11
10
9
8
7
6
5
4
3
2
1
13
14
15
16
17
18
19
20
21
22
23
24
IMAX
VOUT
VOUT
B1 B0
*Pin 9 serves as lowest impedance to the electrical ground;
other GND pins serve as heat sink/ground. These pins should
be connected to large etch areas to help dissipate heat.
DIL-16, SOIC-16 (Top View)
N, DP Package
PWP-24 (Top View)
TSSOP Package
ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA = 40°C to +85°C for the
UCC2915 and 0°C to 70°C for the UCC3915, VIN = 12V, IMAX = 0.4V, SHTDWN
= 2.4V, TA=TJ.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Supply Section
Voltage Input Range 7.0 15.0 V
Supply Current 1.0 2.0 mA
Sleep Mode Current SHTDWN
= 0.2V, No load 100 150 A
Output Leakage SHTDWN
= 0.2V 20 A
Output Section
Voltage Drop I
OUT
= 1A (10V to 12V) 0.15 0.3 V
I
OUT
= 2A (10V to 12V) 0.3 0.6 V
I
OUT
= 3A (10V to 12V) 0.45 0.9 V
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