
02/99
FEATURES
• Integrated 0.15Ω Power MOSFET
• 7V to 15V Operation
• Digital Programmable Current Limit
from 0A to 3A
• Programmable ON Time
• Programmable Start Delay
• Fixed 2% Duty Cycle
• Thermal Shutdown
• Fault Output Indicator
• Maximum Output Current can be set
to 1A above the Programmed Fault
Level or to a full 4A
• Power SOIC and TSSOP, Low
Thermal Resistance Packaging
DESCRIPTION
The UCC39151 Programmable Hot Swap Power Manager provides complete power management, hot swap capability, and circuit breaker functions. The only external component required to operate the device, other
than power supply bypassing, is the fault timing capacitor, C
T
. All control
and housekeeping functions are integrated, and externally programmable.
These include the fault current level, maximum output sourcing current,
maximum fault time, and startup delay. In the event of a constant fault, the
Internal fixed 2% duty cycle ratio limits average output power.
The internal 4 bit DAC allows programming of the fault level current from
0A to 3A with 0.25A resolution. The IMAX control pin sets the maximum
sourcing current to 1A above the trip level or to a full 4A of output current
for fast output capacitor charging.
When the output current is below the fault level, the output MOSFET is
switched ON with a nominal ON resistance of 0.15Ω. When the output current exceeds the fault level, but is less than the maximum sourcing level,
the output remains switched ON, but the fault timer starts, charging CT.
Once CT charges to a preset threshold, the switch is turned OFF, and remains OFF for 50 times the programmed fault time. When the output current reaches the maximum sourcing level, the MOSFET transitions from a
switch to a constant current source.
(continued)
BLOCK DIAGRAM
UCC39151
15V Programmable Hot Swap Power Manager
UDG-94136-3
Note: Pin numbers refer to DIL-16 and SOIC-16 packages.

2
UCC39151
ABSOLUTE MAXIMUM RATINGS
VIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15.5 Volts
VOUT VIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.3V
FAULT Sink Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
FAULT Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 to 8V
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self Limiting
TTL Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 to V
IN
Storage Temperature . . . . . . . . . . . . . . . . . . . 65 C to +150 C
Junction Temperature. . . . . . . . . . . . . . . . . . . 55 C to +150 C
Lead Temperature (Soldering, 10 sec.). . . . . . . . . . . . . +300 C
Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages.
FAULT16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VOUT
VOUT
GND*
GND*
CT
IMAX
B0
SHTDWN
VIN
VIN
GND*
EGND*
B3
B2
B1
CONNECTION DIAGRAMS
*Pin 5 serves as lowest impedance to the electrical ground;
Pins 4, 12, and 13 serve as heat sink/ground. These pins
should be connected to large etch areas to help dissipate heat.
For N Package, pins 4, 12, and 13 are N/C.
DESCRIPTION (cont.)
The UCC39151 can be put into sleep mode, drawing
only 20mA of supply current. Other features include an
open drain Fault Output Indicator, Thermal Shutdown,
Undervoltage Lockout, 7V to 15V operation, and low
thermal resistance SOIC and TSSOP Power Packages.
B3
N/C
N/C
GND*
GND*
FAULT
VIN
EGND*
GND*
GND*
VIN
N/C
GND*
SHTDWN
GND*
B2
GND*
GND*
CT
12
11
10
9
8
7
6
5
4
3
2
1
13
14
15
16
17
18
19
20
21
22
23
24
IMAX
VOUT
VOUT
B1 B0
*Pin 9 serves as lowest impedance to the electrical ground;
other GND pins serve as heat sink/ground. These pins should
be connected to large etch areas to help dissipate heat.
DIL-16, SOIC-16 (Top View)
N, DP Package
PWP-24 (Top View)
TSSOP Package
ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA = 0°C to 70°C for the
UCC39151, VIN = 12V, IMAX = 0.4V, SHTDWN = 2.4V, TA= TJ.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Supply Section
Voltage Input Range 7.0 15.0 V
Supply Current 1.0 2.0 mA
Sleep Mode Current SHTDWN
= 0.2V, No load 100 150 µA
Output Leakage SHTDWN
= 0.2V 20 mA
Output Section
Voltage Drop I
OUT
= 1A (10V to 12V) 0.15 0.3 V
I
OUT
= 2A (10V to 12V) 0.3 0.6 V
I
OUT
= 3A (10V to 12V) 0.45 0.9 V
I
OUT
= 1A, VIN = 7V and 15V 0.2 0.4 V
I
OUT
= 2A, VIN = 7V and 15V 0.4 0.8 V
IOUT = 3A, VIN = 7V, 12V Max. 0.6 1.2 V