6
UCC1837
UCC2837
UCC3837
Fault time duration is controlled by the value of the timing
capacitor, CT, according to the following equation:
tC
V
I
CC
FAULT T T T
=• =•
−
•
=••
−
∆
15 0 5
36 10
278 10
6
3
..
.
(1)
Fig. 5 provides a plot of fault time vs. timing capacitance.
The fault time duration is set based upon the load capac
itance, load current, and the maximum output current.
The “on” or fault time must be of sufficient duration to
charge the load capacitance during a normal startup se
quence or when recovering from a fault. If not, the
charge accumulated on the output capacitance will be
depleted by the load during the “off” time. The cycle will
then repeat, preventing the output from turning on.
To determine the minimum fault time, assume a maxi
mum load current just less than the trip limit. This leaves
the difference between the IMAX and I
TRIP
values as the
current available to charge the output capacitance. The
minimum required fault time can then be calculated as
follows:
()
t
CV
II
FAULT
OUT OUT
MAX TRIP
min
=
•
−
(2)
The minimum timing capacitor can be calculated by sub
-
stituting equation (1) for t
FAULT
in equation (2) and solv
-
ing for CT.
()
()
C
CV
II
T
OUT OUT
MAX TRIP
min
.
=
•
•• −27 8 10
3
(3)
Switchmode protection offers significant heat sinking ad
-
vantages when compared to conventional, constant cur
rent solutions. Since the average power during a fault
condition is reduced as a function of the duty cycle, the
heat sink need only have adequate thermal mass to ab
sorb the maximum steady state power dissipation and
not the full short circuit power. With a 5.25V input and a
maximum output current of 5A, the power dissipated in
the MOSFET is given by:
()
PV V V I
IN SENSE OUT OUT
=− − •
(4)
()
()
PW
=−•−•=5255002335925....
Given that the thermal resistivity of the MOSFET is spec
ified as 1°C/W for the TO-220 package style and assum
ing an ambient temperature of 50°C and a case to heat
sink resistivity of θ
CS
= 0.3°C/W, the heat sink required
to maintain a 125°C junction temperature can be calcu
lated as follows:
()
TTP
J
A
JC CS SA
=+ + +θθθ
(5)
()
125 50 9 25 1 03=+ •++..θ
SA
θ
SA
C
W
≤°68.
Based on this analysis, any heatsink with a thermal resistivity of 6.8 °C/W or less should suffice. The current in
the circuit of Fig. 1, under short circuit conditions, will be
limited to 7A at a 3% duty cycle, resulting in a MOSFET
power dissipation of only:
()
()
()[]
PV I R I Duty
IN OUT SENSE OUT
=−•••
max
(6)
()
()[]
PW
=−• ••=5257 002 7 003107.. ..
Without switchmode protection, the short circuit power
dissipation would be 35.8W, almost four times the nomi
nal dissipation.
Using Printed Circuit Board Etch as a Sense Resistor
Unitrode Design Note DN-71 discusses the use of
printed circuit board copper etch as a low ohm sense re
sistor. This technique can easily be applied when using
the UCC3837. The application circuit shown in Fig. 1 can
be used as an example. This linear regulator is designed
with a 5A average load current, demanding a 20mΩ
sense resistor to result in a 100mV current sense com
parator signal for the UCC3837. The maximum ambient
temperature of the linear regulator is 70°C.
Using DN-71, a 1 ounce outer layer etch of 0.05 inches
wide and 1.57 inches long results in a resistance of
20mΩ at an ambient temperature of 70°C and an operat
ing current of 5A. Because the resistivity of copper is a
function of temperature, the current limit at lower temper
atures will be higher, as shown in Fig. 6.
0
5
10
15
20
25
30
0 0.2 0.4 0.6 0.8 1
CT (uF)
FAULT TIME (ms)
Figure 5. Fault time vs. timing capacitance.