User's Guide
SLVUB27–March 2017
UCC27423-4-5-Q1 EVM User’s Guide
This user’s guide describes the UCC27423-4-5-Q1 evaluation module (EVM). This document contains the
EVM schematic, bill of materials (BOM), assembly drawing, and top and bottom board layouts.
Contents
1 Introduction ................................................................................................................... 2
1.1 Related Documentation ............................................................................................ 2
1.2 UCC2742x-Q1 Applications ....................................................................................... 2
2 Schematic, Bill of Materials, and Layout ................................................................................. 2
2.1 UCC27423-4-5-Q1 EVM Schematic.............................................................................. 3
2.2 UCC27423-4-5-Q1 EVM Bill of Materials........................................................................ 4
2.3 Layout and Component Placement............................................................................... 5
3 EVM Test Points, Jumpers, and Connectors........................................................................... 10
3.1 EVM Test Points................................................................................................... 10
3.2 EVM Jumpers...................................................................................................... 10
3.3 EVM Input/Output Connectors................................................................................... 10
4 EVM Setup and Operation ............................................................................................... 11
4.1 Test Equipment.................................................................................................... 11
4.2 Recommended Test Setup and Operating Conditions....................................................... 11
4.3 EVM Setup With FETs............................................................................................ 12
5 Performance Data, Test Verfication Waveforms, and Typical Characteristic Curves............................. 13
5.1 Propagation Delay, Rise and Fall Times....................................................................... 13
5.2 Propagation Delay, Rise, and Fall Times Results ............................................................ 13
5.3 Typical Characteristic Curves.................................................................................... 14
1 UCC27423-4-5-Q1 EVM Schematic ...................................................................................... 3
2 Component Placement—Top Assembly.................................................................................. 5
3 Component Placement—Bottom Assembly.............................................................................. 5
4 Layout—Top.................................................................................................................. 5
5 Layout—Bottom.............................................................................................................. 5
6 Top Layer ..................................................................................................................... 6
7 Bottom Layer ................................................................................................................. 6
8 Top Solder Mask............................................................................................................. 7
9 Bottom Solder Mask......................................................................................................... 7
10 Ground Layer................................................................................................................. 8
11 Signal Layer .................................................................................................................. 8
12 Recommended Test Setup ............................................................................................... 11
13 EVM installation With FETs............................................................................................... 12
14 Switching Waveforms for (a) Inverting Driver and (b) Noninverting Driver ......................................... 13
15 UCC27423-Q1 Input Falling .............................................................................................. 14
16 UCC27423-Q1 Input Rising............................................................................................... 14
17 UCC27424-Q1 Input Falling .............................................................................................. 14
18 UCC27424-Q1 Input Rising............................................................................................... 14
19 UCC27425-Q1 Input Falling .............................................................................................. 14
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List of Figures
Copyright © 2017, Texas Instruments Incorporated
UCC27423-4-5-Q1 EVM User’s Guide
1
Introduction
20 UCC27425-Q1 Input Rising............................................................................................... 14
1 BOM .......................................................................................................................... 4
2 Test Points .................................................................................................................. 10
3 List of Onboard Jumpers .................................................................................................. 10
4 List of Input/Output Connectors .......................................................................................... 10
5 Recommended Operating Conditions ................................................................................... 12
6 EVM Test Results.......................................................................................................... 13
Trademarks
All trademarks are the property of their respective owners.
1 Introduction
The UCC27423-4-5-Q1 EVM is a high-speed dual MOSFET evaluation module that provides a test
platform for a quick and easy startup of the UCC2742x-Q1 driver. The EVM is powered by a single 4 V to
15 V external supply and features a comprehensive set of test points and jumpers. All of the devices have
separate input and output lines and all devices share a common ground. Enable (ENBL) functions are
provided to allow better control of the operation of the driver applications, driver signals of the devices can
be enabled or disabled through the same enable pin.
1.1 Related Documentation
For more information on the UCC27423-Q1, UCC27424-Q1, and UCC27425-Q1 devices refer to
UCC2742x-Q1 Dual 4-A High-Speed Low-Side MOSFET Drivers With Enable.
www.ti.com
List of Tables
1.2 UCC2742x-Q1 Applications
The UCC2742x-Q1 family of devices can be used in the following applications:
• Switch Mode Power Supplies
• DC-DC Converters
• Motor Controllers
• Class D Switching Amplifiers
2 Schematic, Bill of Materials, and Layout
This section provides a detailed description of the UCC27423-4-5-Q1 EVM schematic, bill of materials
(BOM), and layout.
2
UCC27423-4-5-Q1 EVM User’s Guide
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ENBA
1
INA
2
GND
3
INB
4
OUTB
5
VDD
6
OUTA
7
ENBB
8
PAD
9
U2
UCC27424QDGNRQ1
ENBA
1
INA
2
GND
3
INB
4
OUTB
5
VDD
6
OUTA
7
ENBB
8
U3
UCC27425QDRQ1
VCC
GND
0.1µF
C9
1µF
C7
GND
INA_25
ENBA
INB_25
ENBB
1800pF
C12
1800pF
C13
1
2
3
Q5
1
2
3
Q6
FET_VDD
FET_VDD
GND
10.0k
R17
GND
OUTB_25
OUTA_25
VCC
0.1µF
C8
1µF
C6
GND
INA_24
ENBA
INB_24
ENBB
1800pF
C10
1800pF
C11
1
2
3
Q3
1
2
3
Q4
FET_VDD
FET_VDD
GND
GND
OUTB_24
OUTA_24
GND
TP12
FET_OUTB
TP11
FET_OUTA
TP10
FET_OUTB
TP9
FET_OUTA
GND
TP14
GND
TP13
GND
TP15
1.0
R11
1.0
R13
1
2
3
J15
OUTA_24
1
2
3
J17
OUTB_24
GND GND
1.0
R12
1.0
R14
1
2
3
J16
OUTA_25
1
2
3
J18
OUTB_25
GND
1
2
J13
1
2
J14
GND
GND
INA_25
INB_25
0
R10
GND
10µF
C14
GND
10µF
C15
GND
GND
GND
GND
GND
10.0k
R18
10.0k
R16
10.0k
R15
ENBA
1
INA
2
GND
3
INB
4
OUTB
5
VDD
6
OUTA
7
ENBB
8
PAD
9
U1
UCC27423QDGNRQ1
1
234
5
J1
INA_24
1
234
5
J2
INB_24
50
R1
50
R2
GND
GND
1
234
5
J5
OUTA_24
1
234
5
J6
OUTB_24
50
R4
50
R5
GND
GND
VCC
0.1µF
C2
1µF
C1
GND
INA_23
ENBA
INB_23
ENBB
1800pF
C3
1800pF
C4
1
2
3
Q1
1
2
3
Q2
FET_VDD
FET_VDD
GND
GND
OUTB_23
OUTA_23
GND
TP6
FET_OUTA
TP7
FET_OUTB
TP1
ENBA
TP2
ENBB
FET_VDD
GND
TP5
GND
TP8
VCC
1.0
R7
1.0
R6
1
2
3
J10
INB_24
1
2
3
J7
1
2
3
J9
INA_24
GND
GND
GND
1
2
3
J11
OUTA_23
1
2
3
J12
OUTB_23
GND GND
TP3
TP4
ENBA
VCC
1
2
3
J8
GND
ENBB
VCC
1
2
J3
1
2
J4
GND
GND
INA_23
INB_23
0
R3
10µF
C5
GND
GND
GND
10.0k
R8
10.0k
R9
Input 4-15V
Copyright © 2017, Texas Instruments Incorporated
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2.1 UCC27423-4-5-Q1 EVM Schematic
Schematic, Bill of Materials, and Layout
UCC27423-4-5-Q1 EVM User’s Guide
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Figure 1. UCC27423-4-5-Q1 EVM Schematic
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Schematic, Bill of Materials, and Layout
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2.2 UCC27423-4-5-Q1 EVM Bill of Materials
Table 1. BOM
DESIGNATOR QUANTITY VALUE DESCRIPTION PACKAGE REFERENCE PART NUMBER MANUFACTURER
PCB1 1 Printed Circuit Board MSA022 Any
C1, C6, C7 3 1uF
C2, C8, C9 3 0.1uF
C3, C4, C10, C11, C12,
C13
H1, H2, H3, H4 4 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR) 3M
J3, J4, J13, J14 4 Header, 100mil, 2x1, Tin, TH Header, 2 PIN, 100mil, Tin PEC02SAAN
J7, J8, J9, J10, J11, J12,
J15, J16, J17, J18
SH-J1, SH-J2 2 1x2 Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 3M
TP3, TP4, TP5, TP8, TP13,
TP14, TP15
U1 1
U2 1
U3 1
C5, C14, C15 0 10uF
FID1, FID2, FID3 0
J1, J2, J5, J6 0 Jack, SMA, PCB, Gold, SMT SMA Jack CONSMA001-SMD-G Linx Technologies
Q1, Q2, Q3, Q4, Q5, Q6 0 30V
R1, R2, R4, R5 0 50 RES, 50, 1%, 0.1 W, 0603 0603 CRCW060350R0FKEA Vishay-Dale
R3, R10 0 0 RES, 0, 5%, 0.063 W, 0402 0402 RC0402JR-070RL Yageo America
R6, R7, R11, R12, R13,
R14
R8, R9, R15, R16, R17,
R18
TP6, TP7, TP9, TP10,
TP11, TP12
6 1800pF
10 Header, 100mil, 3x1, Gold, TH 3x1 Header TSW-103-07-G-S Samtec
7 PCB Pin, Swage Mount, TH PCB Pin(2505-2) 2505-2-00-44-00-00-07-0 Mill-Max
0 1.0 RES, 1.0, 5%, 0.063 W, 0402 0402 CRCW04021R00JNED Vishay-Dale
0 10.0k RES, 10.0 k, 1%, 0.25 W, 1206 1206 CRCW120610K0FKEA Vishay-Dale
0 PCB Pin, Swage Mount, TH PCB Pin(2505-2) 2505-2-00-44-00-00-07-0 Mill-Max
CAP, CERM, 1 µF, 100 V, ± 10%, X7R,
AEC-Q200 Grade 1, 1206
CAP, CERM, 0.1 µF, 50 V, ± 10%, X7R,
AEC-Q200 Grade 1, 0603
CAP, CERM, 1800 pF, 25 V, ± 10%, X7R,
AEC-Q200 Grade 1, 0603
Dual 4-A High-Speed Low-Side MOSFET
Drivers With Enable, DGN0008B
Dual 4-A High-Speed Low-Side MOSFET
Drivers With Enable, DGN0008B
Dual 4-A High-Speed Low-Side MOSFET
Drivers With Enable, D0008A
CAP, CERM, 10 µF, 50 V, ± 10%, X7S,
AEC-Q200 Grade 1, 1210
Fiducial mark. There is nothing to buy or
mount.
MOSFET, N-CH, 30 V, 3.7 A, AEC-Q101,
SOT-23
1206 CGA5L2X7R2A105K160AA TDK
0603 CGA3E2X7R1H104K080AA TDK
0603 GCJ216R71E182KA01D MuRata
Sullins Connector
Solutions
DGN0008B UCC27423QDGNRQ1 Texas Instruments
DGN0008B UCC27424QDGNRQ1 Texas Instruments
D0008A UCC27425QDRQ1 Texas Instruments
1210 CGA6P3X7S1H106K250AB TDK
Fiducial N/A N/A
SOT-23 BSR302NL6327HTSA1 Infineon Technologies
4
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2.3 Layout and Component Placement
Figure 2 and Figure 3 top and bottom assemblies of the printed circuit board (PCB) show the component
placement on the EVM.
Figure 4 and Figure 5 show the top and bottom layouts, Figure 6 and Figure 7 show the top and bottom
layers, and Figure 8 and Figure 9 show the top and bottom solder masks of the EVM.
Schematic, Bill of Materials, and Layout
Figure 2. Component Placement—Top Assembly Figure 3. Component Placement—Bottom Assembly
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Schematic, Bill of Materials, and Layout
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Figure 4. Layout—Top Figure 5. Layout—Bottom
6
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Schematic, Bill of Materials, and Layout
Figure 6. Top Layer Figure 7. Bottom Layer
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Schematic, Bill of Materials, and Layout
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Figure 8. Top Solder Mask Figure 9. Bottom Solder Mask
8
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Schematic, Bill of Materials, and Layout
Figure 10. Ground Layer Figure 11. Signal Layer
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UCC27423-4-5-Q1 EVM User’s Guide
9
EVM Test Points, Jumpers, and Connectors
3 EVM Test Points, Jumpers, and Connectors
This section describes the test points, jumpers, and connectors on the EVM as well as how to connect, set
up, and properly use the EVM. Each device has independent signal connections, but all devices have a
common VCC and ground.
3.1 EVM Test Points
Table 2 lists the test points and functional descriptions. All pins of the device are broken out to test points
on the EVM.
Table 2. Test Points
www.ti.com
Test Point
TP1 ENBA Enable driver A Internally pulled up, can be disabled when input is low
TP2 ENBB Enable driver B Internally pulled up, can be disabled when input is low
TP3 VCC Power supply Power supply for the device
TP4 FET_VDD Power supply Power supply for MOSFET
TP5, TP8, TP13-15 GND Ground Connected with ground
TP6, TP9, TP11 FET_OUTA MOSFET drain Connected with MOSFET drain
TP7, TP10, TP12 FET_OUTB MOSFET drain Connected with MOSFET drain
3.2 EVM Jumpers
Table 3 lists the jumpers on the UCC27423-4-5-Q1 EVM. As ordered, the EVM will have two jumpers
installed.
Jumper Device
J7 All ENBA to GND
J8 All ENBB to GND
Test Point
Silkscreen Label
Table 3. List of Onboard Jumpers
Default
Connection
Function Description
Description
Connect ENBA to GND to disable OUTA. Otherwise, connect ENBA to
VCC or leave it floating.
Connect ENBB to GND to disable OUTB. Otherwise, connect ENBB to
VCC or leave it floating.
3.3 EVM Input/Output Connectors
Table 4 lists the following 2-pin headers that are input/output connecters for each device.
Table 4. List of Input/Output Connectors
Jumper Part Number Description
J3
J4 INB device input (pin 2) and GND (pin 1)
J11 OUTA device output (pin 1) and GND (pin 2 and pin 3)
J12 OUTB device output (pin 1) and GND (pin 2 and pin 3)
J9
J10 INB device input (pin 1) and GND (pin 2 and pin 3)
J15 OUTA device output (pin 1) and GND (pin 2 and pin 3)
J17 OUTB device output (pin 1) and GND (pin 2 and pin 3)
J13
J14 INB device input (pin 2) and GND (pin 1)
J16 OUTA device output (pin 1) and GND (pin 2 and pin 3)
J18 OUTB device output (pin 1) and GND (pin 2 and pin 3)
10
UCC27423-4-5-Q1 EVM User’s Guide
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INA device input (pin 2) and GND (pin 1)
UCC27423-Q1
INA device input (pin 1) and GND (pin 2 and pin 3)
UCC27424-Q1
INA device input (pin 2) and GND (pin 1)
UCC27425-Q1
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DC
Source
1.8 nF
+
±
1.8 nF
ENBB
OUTA
VDD
OUTB
Signal
Generator
ENBA
INA
GND
INB
1
3
7
6
Noninverting
Inverting
Noninverting
VDD
4
8
2
Inverting
5
Oscilloscope
www.ti.com
4 EVM Setup and Operation
This section describes the functionality and operation of the UCC27423-4-5-Q1 EVM. For the electrical
characteristics of the device, refer to UCC2742x-Q1 Dual 4-A High-Speed Low-Side MOSFET Drivers
With Enable.
4.1 Test Equipment
The test equipment includes:
DC Power Supply — DC power supply capable of providing at least 4 V
Signal Generator — Digital signal generator capable of producing at least one single ended CMOS type
signal for PWM input (ENB input optional)
Oscilloscope — Oscilloscope with at least four channels of analog type capable of 100-MHz bandwidth
with high-impedance scope probes capable of handling 50 V
Voltmeter — Digital voltmeter capable of monitoring input DC voltages, or other nodes around the EVM
(the voltmeter can be omitted if the DC power supply monitors its own voltage and current levels)
Output Load — External output load such as a 1.8-nF capacitor
4.2 Recommended Test Setup and Operating Conditions
Figure 12 shows the EVM test setup. Table 5 lists the recommended operating conditions. The default
connection of the enable pins is connected to ground.
EVM Setup and Operation
NOTE: Remove all jumpers when testing the EVM.
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Figure 12. Recommended Test Setup
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UCC27423-4-5-Q1 EVM User’s Guide
11
EVM Setup and Operation
Table 5. Recommended Operating Conditions
PARAMETER MIN MAX UNIT
VDD Supply voltage 4 15 V
INA Input voltage
INB
ENA Enable voltage
ENB
T
J
Operating junction temperature –40 125 ℃
–2 15
0 15
4.3 EVM Setup With FETs
4.3.1 Test Preparation
The UCC27423-4-5-Q1 EVM board has no installed FETs or peripheral components. To test the EVM with
FETs, the user must install the FETs themself.
Figure 13 shows the FETs and peripheral components to be installed inside the red outlines. For detailed
descriptions of each of the components, see Table 1.
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V
V
12
UCC27423-4-5-Q1 EVM User’s Guide
Figure 13. EVM installation With FETs
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+5V
INPUT
16V
OUTPUT
0V
0V
10%
90%
10%
90%
(a)
90%
90%
10%
90%
(b)
INPUT
OUTPUT
10%
t
d1
t
d2
t
f
t
f
t
d1
t
f
t
f
t
d2
www.ti.com
Performance Data, Test Verfication Waveforms, and Typical Characteristic Curves
4.3.2 Power-Up Procedure
To power the EVM, follow these steps:
Step 1. Power the board with 5 V through VDD, and set the current limit below 1 A.
Step 2. Place a 5-V power supply between FET_VDD and GND, and set the current limit below 1 A.
Step 3. Connect the signal generator outputs to INA and INB and adjust the signal generator to
produce a signal between 2.75 V and 5.5 V at desired frequency and duty cycle.
Step 4. Remove the jumpers on J7 and J8.
Step 5. Use FET_OUTA and FET_OUTB with a scope to capture desired waveforms.
5 Performance Data, Test Verfication Waveforms, and Typical Characteristic Curves
5.1 Propagation Delay, Rise and Fall Times
Figure 14 shows the propagation delay, rise and fall times as measured on the EVM. Figure 14 also
shows the switching waveforms for inverting driver (a) and noninverting driver (b).
The 10% and 90% thresholds depict the dynamics of the bipolar output devices that dominate the power MOSFET
transition through the Miller regions of operation.
Figure 14. Switching Waveforms for (a) Inverting Driver and (b) Noninverting Driver
5.2 Propagation Delay, Rise, and Fall Times Results
The load capacitance testing condition is 1.8 nF, VDD = 5 V, and the driver signal voltage is set to 5 V
with f = 300 kHz, connected to INA and INB. Table 6 lists the EVM test results.
Part Number
UCC27423-Q1 27 ns 49 ns 21 ns 16 ns
UCC27424-Q1 40 ns 34 ns 19 ns 17 ns
UCC27425-Q1 41 ns 51 ns 17 ns 16 ns
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Delay Time, IN Rising
(IN to OUT)
Copyright © 2017, Texas Instruments Incorporated
Table 6. EVM Test Results
Delay Time, IN Falling
(IN to OUT)
Rise Time Fall Time
UCC27423-4-5-Q1 EVM User’s Guide
13
Time 10 ns/div, Amplitude 1 V/div
Driver Signal Input
Channel B Output
Channel A Output
Time 10 ns/div, Amplitude 1 V/div
Driver Signal Input
Channel B Output
Channel A Output
Time 10 ns/div, Amplitude 1 V/div
Driver Signal Input
Channel B Output
Channel A Output
Time 10 ns/div, Amplitude 1 V/div
Driver Signal Input
Channel B Output
Channel A Output
Time 10 ns/div, Amplitude 1 V/div
Driver Signal Input
Channel B Output
Channel A Output
Time 10 ns/div, Amplitude 1 V/div
Driver Signal Input
Channel B Output
Channel A Output
Performance Data, Test Verfication Waveforms, and Typical Characteristic Curves
5.3 Typical Characteristic Curves
Figure 15 through Figure 20 show the propagation delay, rise time, and fall time measurements on the
EVM.
Figure 15. UCC27423-Q1 Input Falling Figure 16. UCC27423-Q1 Input Rising
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Figure 17. UCC27424-Q1 Input Falling Figure 18. UCC27424-Q1 Input Rising
14
UCC27423-4-5-Q1 EVM User’s Guide
Figure 19. UCC27425-Q1 Input Falling Figure 20. UCC27425-Q1 Input Rising
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STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2 Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3 Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4 EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
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You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
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TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
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ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
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TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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