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UCC27423-Q1
User Manual
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Texas Instruments UCC27423-Q1, UCC27424-Q1, UCC27425-Q1 User Manual

User's Guide
SLVUB27–March 2017

UCC27423-4-5-Q1 EVM User’s Guide

Contents
1 Introduction ................................................................................................................... 2
1.1 Related Documentation ............................................................................................ 2
1.2 UCC2742x-Q1 Applications ....................................................................................... 2
2 Schematic, Bill of Materials, and Layout ................................................................................. 2
2.1 UCC27423-4-5-Q1 EVM Schematic.............................................................................. 3
2.2 UCC27423-4-5-Q1 EVM Bill of Materials........................................................................ 4
2.3 Layout and Component Placement............................................................................... 5
3 EVM Test Points, Jumpers, and Connectors........................................................................... 10
3.1 EVM Test Points................................................................................................... 10
3.2 EVM Jumpers...................................................................................................... 10
3.3 EVM Input/Output Connectors................................................................................... 10
4 EVM Setup and Operation ............................................................................................... 11
4.1 Test Equipment.................................................................................................... 11
4.2 Recommended Test Setup and Operating Conditions....................................................... 11
4.3 EVM Setup With FETs............................................................................................ 12
5 Performance Data, Test Verfication Waveforms, and Typical Characteristic Curves............................. 13
5.1 Propagation Delay, Rise and Fall Times....................................................................... 13
5.2 Propagation Delay, Rise, and Fall Times Results ............................................................ 13
5.3 Typical Characteristic Curves.................................................................................... 14
1 UCC27423-4-5-Q1 EVM Schematic ...................................................................................... 3
2 Component Placement—Top Assembly.................................................................................. 5
3 Component Placement—Bottom Assembly.............................................................................. 5
4 Layout—Top.................................................................................................................. 5
5 Layout—Bottom.............................................................................................................. 5
6 Top Layer ..................................................................................................................... 6
7 Bottom Layer ................................................................................................................. 6
8 Top Solder Mask............................................................................................................. 7
9 Bottom Solder Mask......................................................................................................... 7
10 Ground Layer................................................................................................................. 8
11 Signal Layer .................................................................................................................. 8
12 Recommended Test Setup ............................................................................................... 11
13 EVM installation With FETs............................................................................................... 12
14 Switching Waveforms for (a) Inverting Driver and (b) Noninverting Driver ......................................... 13
15 UCC27423-Q1 Input Falling .............................................................................................. 14
16 UCC27423-Q1 Input Rising............................................................................................... 14
17 UCC27424-Q1 Input Falling .............................................................................................. 14
18 UCC27424-Q1 Input Rising............................................................................................... 14
19 UCC27425-Q1 Input Falling .............................................................................................. 14
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List of Figures
Copyright © 2017, Texas Instruments Incorporated
UCC27423-4-5-Q1 EVM User’s Guide
1
Introduction
20 UCC27425-Q1 Input Rising............................................................................................... 14
1 BOM .......................................................................................................................... 4
2 Test Points .................................................................................................................. 10
3 List of Onboard Jumpers .................................................................................................. 10
4 List of Input/Output Connectors .......................................................................................... 10
5 Recommended Operating Conditions ................................................................................... 12
6 EVM Test Results.......................................................................................................... 13
Trademarks
All trademarks are the property of their respective owners.

1 Introduction

The UCC27423-4-5-Q1 EVM is a high-speed dual MOSFET evaluation module that provides a test platform for a quick and easy startup of the UCC2742x-Q1 driver. The EVM is powered by a single 4 V to 15 V external supply and features a comprehensive set of test points and jumpers. All of the devices have separate input and output lines and all devices share a common ground. Enable (ENBL) functions are provided to allow better control of the operation of the driver applications, driver signals of the devices can be enabled or disabled through the same enable pin.

1.1 Related Documentation

For more information on the UCC27423-Q1, UCC27424-Q1, and UCC27425-Q1 devices refer to
UCC2742x-Q1 Dual 4-A High-Speed Low-Side MOSFET Drivers With Enable.
www.ti.com
List of Tables

1.2 UCC2742x-Q1 Applications

The UCC2742x-Q1 family of devices can be used in the following applications:
• Switch Mode Power Supplies
• DC-DC Converters
• Motor Controllers
• Class D Switching Amplifiers

2 Schematic, Bill of Materials, and Layout

This section provides a detailed description of the UCC27423-4-5-Q1 EVM schematic, bill of materials (BOM), and layout.
2
UCC27423-4-5-Q1 EVM User’s Guide
Copyright © 2017, Texas Instruments Incorporated
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ENBA
1
INA
2
GND
3
INB
4
OUTB
5
VDD
6
OUTA
7
ENBB
8
PAD
9
U2
UCC27424QDGNRQ1
ENBA
1
INA
2
GND
3
INB
4
OUTB
5
VDD
6
OUTA
7
ENBB
8
U3
UCC27425QDRQ1
VCC
GND
0.1µF
C9
1µF
C7
GND
INA_25 ENBA
INB_25 ENBB
1800pF
C12
1800pF
C13
1
2
3
Q5
1
2
3
Q6
FET_VDD
FET_VDD
GND
10.0k
R17
GND
OUTB_25
OUTA_25
VCC
0.1µF
C8
1µF
C6
GND
INA_24 ENBA
INB_24 ENBB
1800pF
C10
1800pF
C11
1
2
3
Q3
1
2
3
Q4
FET_VDD
FET_VDD
GND
GND
OUTB_24
OUTA_24
GND
TP12
FET_OUTB
TP11
FET_OUTA
TP10
FET_OUTB
TP9
FET_OUTA
GND
TP14
GND
TP13
GND
TP15
1.0
R11
1.0
R13
1 2 3
J15
OUTA_24
1 2 3
J17
OUTB_24
GND GND
1.0
R12
1.0
R14
1 2 3
J16
OUTA_25
1 2 3
J18
OUTB_25
GND
1
2
J13
1
2
J14
GND
GND
INA_25
INB_25
0
R10
GND
10µF
C14
GND
10µF
C15
GND
GND
GND
GND
GND
10.0k
R18
10.0k
R16
10.0k
R15
ENBA
1
INA
2
GND
3
INB
4
OUTB
5
VDD
6
OUTA
7
ENBB
8
PAD
9
U1
UCC27423QDGNRQ1
1
234
5
J1
INA_24
1
234
5
J2
INB_24
50
R1
50
R2
GND
GND
1
234
5
J5
OUTA_24
1
234
5
J6
OUTB_24
50
R4
50
R5
GND
GND
VCC
0.1µF
C2
1µF
C1
GND
INA_23 ENBA
INB_23 ENBB
1800pF
C3
1800pF
C4
1
2
3
Q1
1
2
3
Q2
FET_VDD
FET_VDD
GND
GND
OUTB_23
OUTA_23
GND
TP6
FET_OUTA
TP7
FET_OUTB
TP1
ENBA
TP2
ENBB
FET_VDD
GND
TP5
GND
TP8
VCC
1.0
R7
1.0
R6
1 2 3
J10
INB_24
1 2 3
J7
1 2 3
J9
INA_24
GND
GND
GND
1 2 3
J11
OUTA_23
1 2 3
J12
OUTB_23
GND GND
TP3
TP4
ENBA
VCC
1 2 3
J8
GND
ENBB
VCC
1
2
J3
1
2
J4
GND
GND
INA_23
INB_23
0
R3
10µF
C5
GND
GND
GND
10.0k
R8
10.0k
R9
Input 4-15V
Copyright © 2017, Texas Instruments Incorporated
www.ti.com

2.1 UCC27423-4-5-Q1 EVM Schematic

Schematic, Bill of Materials, and Layout
UCC27423-4-5-Q1 EVM User’s Guide
3
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Figure 1. UCC27423-4-5-Q1 EVM Schematic
Copyright © 2017, Texas Instruments Incorporated
Schematic, Bill of Materials, and Layout
www.ti.com

2.2 UCC27423-4-5-Q1 EVM Bill of Materials

Table 1. BOM
DESIGNATOR QUANTITY VALUE DESCRIPTION PACKAGE REFERENCE PART NUMBER MANUFACTURER
PCB1 1 Printed Circuit Board MSA022 Any C1, C6, C7 3 1uF
C2, C8, C9 3 0.1uF C3, C4, C10, C11, C12,
C13 H1, H2, H3, H4 4 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR) 3M
J3, J4, J13, J14 4 Header, 100mil, 2x1, Tin, TH Header, 2 PIN, 100mil, Tin PEC02SAAN J7, J8, J9, J10, J11, J12,
J15, J16, J17, J18 SH-J1, SH-J2 2 1x2 Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 3M TP3, TP4, TP5, TP8, TP13,
TP14, TP15 U1 1
U2 1
U3 1
C5, C14, C15 0 10uF
FID1, FID2, FID3 0 J1, J2, J5, J6 0 Jack, SMA, PCB, Gold, SMT SMA Jack CONSMA001-SMD-G Linx Technologies Q1, Q2, Q3, Q4, Q5, Q6 0 30V R1, R2, R4, R5 0 50 RES, 50, 1%, 0.1 W, 0603 0603 CRCW060350R0FKEA Vishay-Dale
R3, R10 0 0 RES, 0, 5%, 0.063 W, 0402 0402 RC0402JR-070RL Yageo America R6, R7, R11, R12, R13,
R14 R8, R9, R15, R16, R17,
R18 TP6, TP7, TP9, TP10,
TP11, TP12
6 1800pF
10 Header, 100mil, 3x1, Gold, TH 3x1 Header TSW-103-07-G-S Samtec
7 PCB Pin, Swage Mount, TH PCB Pin(2505-2) 2505-2-00-44-00-00-07-0 Mill-Max
0 1.0 RES, 1.0, 5%, 0.063 W, 0402 0402 CRCW04021R00JNED Vishay-Dale
0 10.0k RES, 10.0 k, 1%, 0.25 W, 1206 1206 CRCW120610K0FKEA Vishay-Dale
0 PCB Pin, Swage Mount, TH PCB Pin(2505-2) 2505-2-00-44-00-00-07-0 Mill-Max
CAP, CERM, 1 µF, 100 V, ± 10%, X7R, AEC-Q200 Grade 1, 1206
CAP, CERM, 0.1 µF, 50 V, ± 10%, X7R, AEC-Q200 Grade 1, 0603
CAP, CERM, 1800 pF, 25 V, ± 10%, X7R, AEC-Q200 Grade 1, 0603
Dual 4-A High-Speed Low-Side MOSFET Drivers With Enable, DGN0008B
Dual 4-A High-Speed Low-Side MOSFET Drivers With Enable, DGN0008B
Dual 4-A High-Speed Low-Side MOSFET Drivers With Enable, D0008A
CAP, CERM, 10 µF, 50 V, ± 10%, X7S, AEC-Q200 Grade 1, 1210
Fiducial mark. There is nothing to buy or mount.
MOSFET, N-CH, 30 V, 3.7 A, AEC-Q101, SOT-23
1206 CGA5L2X7R2A105K160AA TDK
0603 CGA3E2X7R1H104K080AA TDK
0603 GCJ216R71E182KA01D MuRata
Sullins Connector Solutions
DGN0008B UCC27423QDGNRQ1 Texas Instruments
DGN0008B UCC27424QDGNRQ1 Texas Instruments
D0008A UCC27425QDRQ1 Texas Instruments
1210 CGA6P3X7S1H106K250AB TDK
Fiducial N/A N/A
SOT-23 BSR302NL6327HTSA1 Infineon Technologies
4
UCC27423-4-5-Q1 EVM User’s Guide
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2.3 Layout and Component Placement

Figure 2 and Figure 3 top and bottom assemblies of the printed circuit board (PCB) show the component
placement on the EVM.
Figure 4 and Figure 5 show the top and bottom layouts, Figure 6 and Figure 7 show the top and bottom
layers, and Figure 8 and Figure 9 show the top and bottom solder masks of the EVM.
Schematic, Bill of Materials, and Layout
Figure 2. Component Placement—Top Assembly Figure 3. Component Placement—Bottom Assembly
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UCC27423-4-5-Q1 EVM User’s Guide
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Schematic, Bill of Materials, and Layout
www.ti.com
Figure 4. Layout—Top Figure 5. Layout—Bottom
6
UCC27423-4-5-Q1 EVM User’s Guide
Copyright © 2017, Texas Instruments Incorporated
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