TEXAS INSTRUMENTS UCC1809-1, UCC1809-2, UCC2809-1, UCC2809-2, UCC3809-1 Technical data

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Economy Primary Side Controller
application
INFO
available
UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2
FEATURES
User Programmable Soft Start With
Active Low Shutdown User Programmable Maximum Duty
Cycle Accessible 5V Reference
Undervoltage Lockout
Operation to 1MHz
0.4A Source/0.8A Sink FET Driver
Low 100µA Startup Current
PART
NUMBER
UCCX809-1 10V 8V UCCX809-2 15V 8V
TURN ON
THRESHOLD
TURN OFF
THRESHOLD
DESCRIPTION
The UCC3809 family of BCDMOS economy low power integrated circuits contains all the control and drive circuitry required for off-line and isolated DC-to-DC fixed frequency current mode switching power supplies with minimal external parts count. Internally implemented circuits include
undervoltage lockout featuring startup current less than 100µA, a user ac cessible voltage reference, logic to ensure latched operation, a PWM com parator, and a totem pole output stage to sink or source peak current. The output stage, suitable for driving N-Channel MOSFETs, is low in the off state.
Oscillator frequency and maximum duty cycle are programmed with two resistors and a capacitor. The UCC3809 family also features full cycle soft start.
The family has UVLO thresholds and hysteresis levels for off-line and DC-to-DC systems as shown in the table to the left.
The UCC3809 and the UCC2809 are offered in the 8 pin SOIC (D), PDIP (N), TSSOP (PW), and MSOP (P) packages. The small TSSOP and MSOP packages make the device ideal for applications where board space and height are at a premium.
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TYPICAL APPLICATION DIAGRAM
R
V
IN
FEEDBACK
CURRENT
SENSE
START
SLOPE
COMP
DISABLE
NOISE
FILTER
C
T
RT1
RT2
FB
1
+5V
SS
2
C
SS
3
4
1V
6µA
0.5V
OSC
1V
– +
17.5V
REF
8
C
REF
V
– +
V
REF
UDG-99036
OUT
VDD
7
C
VDD
OUT
6
GND
5
+ –
– +
CLK
PWM LATC H
R
S
5V
REF
15/8V
+
10/8V
UVLO
Q
SLUS166B - NOVEMBER 1999 - REVISED NOVEMBER 2004
ABSOLUTE MAXIMUM RATINGS*
VDD...........................................19V
I
..........................................25mA
VDD
I
(tpw < 1µs and Duty Cycle < 10%)........–0.4A to 0.8A
OUT
RT1, RT2, SS ......................–0.3V to REF + 0.3V
I
.........................................–15mA
REF
Storage Temperature ...................–65°C to +150°C
Junction Temperature...................–55°C to +150°C
Lead Temperature (Soldering, 10 sec.) .............+300°C
* Values beyond which damage may occur.
All voltages are with respect to ground unless otherwise stated. Currents are positive into, negative out of the specified termi nal. Consult Packaging Section of Databook for thermal limita tions and considerations of packages.
UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2
CONNECTION DIAGRAM
SOIC-8, DIL-8 (Top View) D, N and J Packages
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TSSOP-8 (Top View) PW Package
FB
1
SS
2
RT1
3
RT2
4
REF
VDD
OUT
GND
8
7
6
5
MSOP-8 (Top View) P Package
1
FB
2
SS
3
RT1
4
RT2
REF
VDD
OUT
GND
8
7
6
5
ORDERING INFORMATION
Temperature Range Available Packages
UCC1809-X –55°C to +125°C J UCC2809-X –40°C to +85°C N, D, P, PW UCC3809-X 0°C to +70°C N, D, P, PW
ELECTRICAL CHARACTERISTICS: Unless otherwise specified, C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Supply Section
VDD Clamp I I
VDD
Starting (Note 1) 110 µA
I
VDD
Standby UCCx809-1, VDD = Start Threshold - 300mV 110 125 µA
I
VDD
Undervoltage Lockout Section
Start Threshold (UCCx809-1) 9.4 10.4 V UVLO Hysteresis (UCCx809-1) 1.65 V Start Threshold (UCCx809-2) 14.0 15.6 V UVLO Hysteresis (UCCx809-2) 6.2 V
Voltage Reference Section
Output Voltage I Line Regulation VDD = 10V to 15V 2 mV Load Regulation I
Comparator Section
I
FB
Comparator Threshold 0.9 0.95 1 V OUT Propagation Delay (No Load) V
= 10mA 16 17.5 19 V
VDD
No Load 600 900 µA
UCCx809-2, VDD = Start Threshold - 300mV 130 170 µA
= 0mA 4.75 5 5.25 V
REF
= 0mA to 5mA 2 mV
REF
Output Off –100 nA
= 0.8V to 1.2V at TR= 10ns 50 100 ns
FB
UCC 809
= 0.47 mF, VDD = 12V. TA=TJ.
VREF
UVLO OPTION
PACKAGE
TEMPERATURE RANGE
2
UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2
ELECTRICAL CHARACTERISTICS: Unless otherwise specified, C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Soft Start Section
I
SS
Low VDD = 7.5V, ISS = 200mA 0.2 V
V
SS
Shutdown Threshold 0.44 0.48 0.52 V
Oscillator Section
Frequency RT1 = 10k, RT2 = 4.32k, CT = 820pF 90 100 110 kHz Frequency Change with Voltage VDD = 10V to 15V 0.1 %/V
Peak Voltage 3.33 V
C
T
Valley Voltage 1.67 V
C
T
Peak to Peak Voltage 1.54 1.67 1.80 V
C
T
Output Section
Output V Output V Output Low Voltage During UVLO I Minimum Duty Cycle V Maximum Duty Cycle 70 % Rise Time C Fall Time C
Note 1. Ensured by design. Not 100% production tested.
Low I
SAT
High I
SAT
VDD = 16V, VSS = 0V; –40°Cto+85°C –4.9 –7.0 –9.1 mA VDD = 16V, V
= 80mA (dc) 0.8 1.5 V
OUT
= –40mA (dc), VDD – OUT 0.8 1.5 V
OUT
= 20mA (dc) 1.5 V
OUT
=2V 0 %
FB
= 1nF 35 ns
OUT
= 1nF 18 ns
OUT
SS = 0V; < –40°C; >+85°C –4.0 –7.0 –10.0 mA
= 0.47 mF, VDD = 12V. TA=TJ.
VREF
PIN DESCRIPTIONS
FB: This pin is the summing node for current sense
feedback, voltage sense feedback (by optocoupler) and slope compensation. Slope compensation is derived from the rising voltage at the timing capacitor and can be buffered with an external small signal NPN transistor. External high frequency filter capacitance applied from this node to GND is discharged by an internal 250W on resistance NMOS FET during PWM off time and offers effective leading edge blanking set by the RC time constant of the feedback resistance from current sense resistor to FB input and the high frequency filter capacitor capacitance at this node to GND.
GND: Reference ground and power ground for all functions.
OUT: This pin is the high current power driver output. A minimum series gate resistor of 3.9W is recommended to limit the gate drive current when operating with high bias voltages.
REF: The internal 5V reference output. This reference is buffered and is available on the REF pin. REF should be bypassed with a 0.47mF ceramic capacitor.
RT2: This pin connects to timing resistor RT2 and controls the negative ramp time of the internal oscillator (Tf = 0.74 · (C
+ 27pF) · RT2). The negative threshold
T
of the internal oscillator is sensed through inactive timing resistor RT1 which connects to pin RT1 and timing capacitor C
.
T
SS: This pin serves two functions. The soft start timing capacitor connects to SS and is charged by an internal
6µA current source. Under normal soft start SS is discharged to at least 0.4V and then ramps positive to 1V during which time the output driver is held low. As SS charges from 1V to 2V soft start is implemented by an increasing output duty cycle. If SS is taken below 0.5V, the output driver is inhibited and held low. The user accessible 5V voltage reference also goes low and I
VDD
< 100mA. VDD: The power input connection for this device. This
pin is shunt regulated at 17.5V which is sufficiently below the voltage rating of the DMOS output driver stage. VDD should be bypassed with a 1mF ceramic capacitor.
RT1: This pin connects to timing resistor RT1 and controls the positive ramp time of the internal oscillator (Tr = 0.74 · (C
+ 27pF) · RT1). The positive threshold of
T
the internal oscillator is sensed through inactive timing resistor RT2 which connects to pin RT2 and timing capacitor C
.
T
3
APPLICATION INFORMATION
UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2
OUT
+V
C19
C18
1%
R17
12.1K
C14
470pF
C13
0.1µ F
R15
750
R14
2
1
H11AV1
4
5
U4
10K
U3
TL431
1%
R16
12.1K
C17
C16
U2
MBR2535CTL
2
3W
R19
5.1K
C10
D3
0.22 µF
2K
R9
3W
R13
1.1K
OUT
–V
6.3V
330 µF
6.3V
330 µF
6.3V
330 µF
6.3V
330 µF
3
1
µF
C15
0.015
T1
SF24
Q2
80µH
2N2907A
5:1
Q3
IRF640
1K
10
R10
680
R11
R6
R8
3W
0.15
R7
15K
D2
1N5245
+VIN
D4
R5
C3
1µF
1N5240
470
C2
PGND1
150 µF
C1
27K
R12
UCC3809
150 µF
C7
0.47 µF
C9
0.1µ F
C8
1µF
8
7
REF
VDD
FB
SS
2
1
TP1
6
OUT
RT1
3
5
GND
RT2
4
U1
R3
12.1K
ON/OFF
R20
5.62K
R4
6.19K
R1
5.1k
D1
5231B
C6
330pF
C22
0.1µ F
Q4
R18
3.01K
2N2222A
C5
1nF
C4
0.01 µF
Q1
2N2222A
R2
1.1K
PGND1
–VIN
UDG-99179
Figure 1. Isolated 50W flyback converter utilizing the UCC3809. The switching frequency is 70kHz, Vin = -32V to
-72V, Vout = +5V, Iout = 0A to 10A
4
APPLICATION INFORMATION (cont.)
K
The Typical Application Diagram shows an isolated flyback converter utilizing the UCC3809. Note that the capacitors C
REF
and C tors for the reference and IC input voltage, respectively. Both capacitors should be low ESR and ESL ceramic, placed as close to the IC pins as possible, and returned directly to the ground pin of the chip for best stability. REF provides the internal bias to many of the IC func
tions and C
should be at least 0.47µF to prevent REF
REF
from drooping.
FB Pin
The basic premise of the UCC3809 is that the voltage sense feedback signal originates from an optocoupler that is modulated by an external error amplifier located on the secondary side. This signal is summed with the current sense signal and any slope compensation at the FB pin and compared to a 1V threshold, as shown in the Typical Application Diagram. Crossing this 1V threshold resets the PWM latch and modulates the output driver on-time much like the current sense comparator used in the UC3842. In the absence of a FB signal, the output will follow the programmed maximum on-time of the os­cillator.
When adding slope compensation, it is important to use a small capacitor to AC couple the oscillator waveform before summing this signal into the FB pin. By correctly selecting the emitter resistor of the optocoupler, the volt­age sense signal can force the FB node to exceed the 1V threshold when the output that is being compared ex ceeds a desired level. Doing so drives the UCC3809 to zero percent duty cycle.
Oscillator
are local decoupling capaci
VDD
UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2
reference) sensed through RT1. The R input to the oscil lator latch, R(OSC), is also level sensitive and resets the CLK signal low when CT crosses the 1.67V threshold,
­turning off Q2 and turning on Q1, initiating another charg ing cycle.
Figure 3 shows the waveforms associated with the oscil lator latch and the PWM latch (shown in the Typical Ap
-
plication Diagram). A high CLK signal not only initiates a discharge cycle for CT, it also turns on the internal NMOS FET on the FB pin causing any external capacitance used for leading edge blanking connected to this pin to be discharged to ground. By discharging any external capacitor completely to ground during the external switch’s off-time, the noise immunity of the converter is enhanced allowing the user to design in smaller RC com ponents for leading edge blanking. A high CLK signal also sets the level sensitive S input of the PWM latch, S(PWM), high, resulting in a high output, Q(PWM), as shown in Figure 3. This Q(PWM) signal will remain high until a reset signal, R(PWM) is received. A high R(PWM) signal results from the FB signal crossing the 1V thresh­old, or during soft start or if the SS pin is disabled.
Assuming the UVLO threshold is satisfied, the OUT sig­nal of the IC will be high as long as Q(PWM) is high and S(PWM), also referred to as CLK, is low. The OUT sig­nal will be dominated by the FB signal as long as the FB signal trips the 1V threshold while CLK is low. If the FB signal does not cross the 1V threshold while CLK is low, the OUT signal will be dominated by the maximum duty
­cycle programmed by the user. Figure 3 illustrates the
various waveforms for a design set up for a maximum duty cycle of 70%.
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The following equation sets the oscillator frequency:
[]FCTpFRTRT
=•+ •+
OS C
DRTCTpFF
=•• + 074 1 27.
MAX OS C
()
074 27 1 2
.
()
()
1
Referring to Figure 2 and the waveforms in Figure 3, when Q1is on, CT charges via the R
DS(on)
of Q1 and RT1. During this charging process, the voltage of CT is sensed through RT2. The S input of the oscillator latch, S(OSC), is level sensitive, so crossing the upper thresh old (set at 2/3 VREF or 3.33V for a typical 5.0V refer ence) sets the Q output (CLK signal) of the oscillator latch high. A high CLK signal results in turning off Q1 and turning on Q2. CT now discharges through RT2 and the R
DS(on)
of Q2. CT discharges from 3.33V to the lower
threshold (set at 1/3 VREF or 1.67V for a typical 5.0V
V
REF
Q1
3
RT1
4
-
CT
RT2
Q2
-
Figure 2. UCC3809 oscillator.
5
3.33V
1.67V
+ –
+ –
OSC
SQ
R
OS CILLAT OR
LATC H
CL
UDG-97195
APPLICATION INFORMATION (cont.)
CT
CHARGINGCTDISCHARG ING
3.33V
1.67V
CT
S(OSC)
R(OSC)
Q(OSC)=CLK
=S(P WM)
1V
FB
R(PWM)
UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2
Q(PWM)
OUT
FB S IG NAL DO MINAN T MAX. D UT Y CYCLE D O MINANT
Figure 3. Waveforms associated with the oscillator latch and the PWM latch.
The recommended value for CT is 1nF for frequencies in the 100 kHz or less range and smaller CT for higher fre
-
1000
quencies. The minimum recommended values of RT1 and RT2 are 10kand 4.32k, respectively. Using these
values maintains a ratio of at least 20:1 between the R
of the internal FETs and the external timing resis
DS(on)
tors, resulting in minimal change in frequency over tem perature. Because of the oscillator's susceptibility to
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100
capacitive coupling, examine the oscillator frequency by looking at the common RT1-RT2-CT node on the circuit
FREQUENCY [kHz]
board as opposed to looking at pins 3 and 4 directly. For good noise immunity, RT1 and RT2 should be placed as close to pins 3 and 4 of the IC as possible. CT should be returned directly to the ground pin of the IC with minimal stray inductance and capacitance.
10
100 1000 10000
Figure 4. Oscillator frequency vs. CT(RT1 = 10k, RT2 = 4.32k)
6
70%
ON
30% OFF
UDG-99037
CT [pF]
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