TEXAS INSTRUMENTS UCC1809-1, UCC1809-2, UCC2809-1, UCC2809-2, UCC3809-1, UCC3809-2 Technical data
Economy Primary Side Controller
application
INFO
available
UCC1809-1/-2
UCC2809-1/-2
UCC3809-1/-2
FEATURES
User Programmable Soft Start With
•
Active Low Shutdown
User Programmable Maximum Duty
•
Cycle
Accessible 5V Reference
•
Undervoltage Lockout
•
Operation to 1MHz
•
0.4A Source/0.8A Sink FET Driver
•
Low 100µA Startup Current
•
PART
NUMBER
UCCX809-110V8V
UCCX809-215V8V
TURN ON
THRESHOLD
TURN OFF
THRESHOLD
DESCRIPTION
The UCC3809 family of BCDMOS economy low power integrated circuits
contains all the control and drive circuitry required for off-line and isolated
DC-to-DC fixed frequency current mode switching power supplies with
minimal external parts count. Internally implemented circuits include
undervoltage lockout featuring startup current less than 100µA, a user ac
cessible voltage reference, logic to ensure latched operation, a PWM com
parator, and a totem pole output stage to sink or source peak current. The
output stage, suitable for driving N-Channel MOSFETs, is low in the off
state.
Oscillator frequency and maximum duty cycle are programmed with two
resistors and a capacitor. The UCC3809 family also features full cycle soft
start.
The family has UVLO thresholds and hysteresis levels for off-line and
DC-to-DC systems as shown in the table to the left.
The UCC3809 and the UCC2809 are offered in the 8 pin SOIC (D), PDIP
(N), TSSOP (PW), and MSOP (P) packages. The small TSSOP and
MSOP packages make the device ideal for applications where board
space and height are at a premium.
-
-
TYPICAL APPLICATION DIAGRAM
R
V
IN
FEEDBACK
CURRENT
SENSE
START
SLOPE
COMP
DISABLE
NOISE
FILTER
C
T
RT1
RT2
FB
1
+5V
SS
2
C
SS
3
4
1V
6µA
0.5V
OSC
1V
–
+
17.5V
REF
8
C
REF
V
–
+
V
REF
UDG-99036
OUT
VDD
7
C
VDD
OUT
6
GND
5
+
–
–
+
CLK
PWM
LATC H
R
S
5V
REF
–
15/8V
+
10/8V
UVLO
Q
SLUS166B - NOVEMBER 1999 - REVISED NOVEMBER 2004
ABSOLUTE MAXIMUM RATINGS*
VDD...........................................19V
I
..........................................25mA
VDD
I
(tpw < 1µs and Duty Cycle < 10%)........–0.4A to 0.8A
OUT
RT1, RT2, SS ......................–0.3V to REF + 0.3V
I
.........................................–15mA
REF
Storage Temperature ...................–65°C to +150°C
Junction Temperature...................–55°C to +150°C
Lead Temperature (Soldering, 10 sec.) .............+300°C
* Values beyond which damage may occur.
All voltages are with respect to ground unless otherwise stated.
Currents are positive into, negative out of the specified termi
nal. Consult Packaging Section of Databook for thermal limita
tions and considerations of packages.
UCC1809-1/-2
UCC2809-1/-2
UCC3809-1/-2
CONNECTION DIAGRAM
SOIC-8, DIL-8 (Top View)
D, N and J Packages
-
-
TSSOP-8 (Top View)
PW Package
FB
1
SS
2
RT1
3
RT2
4
REF
VDD
OUT
GND
8
7
6
5
MSOP-8 (Top View)
P Package
1
FB
2
SS
3
RT1
4
RT2
REF
VDD
OUT
GND
8
7
6
5
ORDERING INFORMATION
Temperature RangeAvailable Packages
UCC1809-X–55°C to +125°CJ
UCC2809-X–40°C to +85°CN, D, P, PW
UCC3809-X0°C to +70°CN, D, P, PW
ELECTRICAL CHARACTERISTICS: Unless otherwise specified, C
FB: This pin is the summing node for current sense
feedback, voltage sense feedback (by optocoupler) and
slope compensation. Slope compensation is derived
from the rising voltage at the timing capacitor and can be
buffered with an external small signal NPN transistor.
External high frequency filter capacitance applied from
this node to GND is discharged by an internal 250W on
resistance NMOS FET during PWM off time and offers
effective leading edge blanking set by the RC time
constant of the feedback resistance from current sense
resistor to FB input and the high frequency filter capacitor
capacitance at this node to GND.
GND: Reference ground and power ground for all
functions.
OUT: This pin is the high current power driver output. A
minimum series gate resistor of 3.9W is recommended to
limit the gate drive current when operating with high bias
voltages.
REF: The internal 5V reference output. This reference is
buffered and is available on the REF pin. REF should be
bypassed with a 0.47mF ceramic capacitor.
RT2: This pin connects to timing resistor RT2 and
controls the negative ramp time of the internal oscillator
(Tf = 0.74 · (C
+ 27pF) · RT2). The negative threshold
T
of the internal oscillator is sensed through inactive timing
resistor RT1 which connects to pin RT1 and timing
capacitor C
.
T
SS: This pin serves two functions. The soft start timing
capacitor connects to SS and is charged by an internal
6µA current source. Under normal soft start SS is
discharged to at least 0.4V and then ramps positive to 1V
during which time the output driver is held low. As SS
charges from 1V to 2V soft start is implemented by an
increasing output duty cycle. If SS is taken below 0.5V,
the output driver is inhibited and held low. The user
accessible 5V voltage reference also goes low and I
VDD
< 100mA.
VDD: The power input connection for this device. This
pin is shunt regulated at 17.5V which is sufficiently below
the voltage rating of the DMOS output driver stage. VDD
should be bypassed with a 1mF ceramic capacitor.
RT1: This pin connects to timing resistor RT1 and
controls the positive ramp time of the internal oscillator
(Tr = 0.74 · (C
+ 27pF) · RT1). The positive threshold of
T
the internal oscillator is sensed through inactive timing
resistor RT2 which connects to pin RT2 and timing
capacitor C
.
T
3
APPLICATION INFORMATION
UCC1809-1/-2
UCC2809-1/-2
UCC3809-1/-2
OUT
+V
C19
C18
1%
R17
12.1K
C14
470pF
C13
0.1µ F
R15
750
R14
2
1
H11AV1
4
5
U4
10K
U3
TL431
1%
R16
12.1K
C17
C16
U2
MBR2535CTL
2
3W
R19
5.1K
C10
D3
0.22 µF
2K
R9
3W
R13
1.1K
OUT
–V
6.3V
330 µF
6.3V
330 µF
6.3V
330 µF
6.3V
330 µF
3
1
µF
C15
0.015
T1
SF24
Q2
80µH
2N2907A
5:1
Q3
IRF640
1K
10
R10
680
R11
R6
R8
3W
0.15
R7
15K
D2
1N5245
+VIN
D4
R5
C3
1µF
1N5240
470
C2
PGND1
150 µF
C1
27K
R12
UCC3809
150 µF
C7
0.47 µF
C9
0.1µ F
C8
1µF
8
7
REF
VDD
FB
SS
2
1
TP1
6
OUT
RT1
3
5
GND
RT2
4
U1
R3
12.1K
ON/OFF
R20
5.62K
R4
6.19K
R1
5.1k
D1
5231B
C6
330pF
C22
0.1µ F
Q4
R18
3.01K
2N2222A
C5
1nF
C4
0.01 µF
Q1
2N2222A
R2
1.1K
PGND1
–VIN
UDG-99179
Figure 1. Isolated 50W flyback converter utilizing the UCC3809. The switching frequency is 70kHz, Vin = -32V to
-72V, Vout = +5V, Iout = 0A to 10A
4
APPLICATION INFORMATION (cont.)
K
The Typical Application Diagram shows an isolated
flyback converter utilizing the UCC3809. Note that the
capacitors C
REF
and C
tors for the reference and IC input voltage, respectively.
Both capacitors should be low ESR and ESL ceramic,
placed as close to the IC pins as possible, and returned
directly to the ground pin of the chip for best stability.
REF provides the internal bias to many of the IC func
tions and C
should be at least 0.47µF to prevent REF
REF
from drooping.
FB Pin
The basic premise of the UCC3809 is that the voltage
sense feedback signal originates from an optocoupler
that is modulated by an external error amplifier located
on the secondary side. This signal is summed with the
current sense signal and any slope compensation at the
FB pin and compared to a 1V threshold, as shown in the
Typical Application Diagram. Crossing this 1V threshold
resets the PWM latch and modulates the output driver
on-time much like the current sense comparator used in
the UC3842. In the absence of a FB signal, the output
will follow the programmed maximum on-time of the oscillator.
When adding slope compensation, it is important to use
a small capacitor to AC couple the oscillator waveform
before summing this signal into the FB pin. By correctly
selecting the emitter resistor of the optocoupler, the voltage sense signal can force the FB node to exceed the
1V threshold when the output that is being compared ex
ceeds a desired level. Doing so drives the UCC3809 to
zero percent duty cycle.
Oscillator
are local decoupling capaci
VDD
UCC1809-1/-2
UCC2809-1/-2
UCC3809-1/-2
reference) sensed through RT1. The R input to the oscil
lator latch, R(OSC), is also level sensitive and resets the
CLK signal low when CT crosses the 1.67V threshold,
turning off Q2 and turning on Q1, initiating another charg
ing cycle.
Figure 3 shows the waveforms associated with the oscil
lator latch and the PWM latch (shown in the Typical Ap
-
plication Diagram). A high CLK signal not only initiates a
discharge cycle for CT, it also turns on the internal NMOS
FET on the FB pin causing any external capacitance
used for leading edge blanking connected to this pin to
be discharged to ground. By discharging any external
capacitor completely to ground during the external
switch’s off-time, the noise immunity of the converter is
enhanced allowing the user to design in smaller RC com
ponents for leading edge blanking. A high CLK signal
also sets the level sensitive S input of the PWM latch,
S(PWM), high, resulting in a high output, Q(PWM), as
shown in Figure 3. This Q(PWM) signal will remain high
until a reset signal, R(PWM) is received. A high R(PWM)
signal results from the FB signal crossing the 1V threshold, or during soft start or if the SS pin is disabled.
Assuming the UVLO threshold is satisfied, the OUT signal of the IC will be high as long as Q(PWM) is high and
S(PWM), also referred to as CLK, is low. The OUT signal will be dominated by the FB signal as long as the FB
signal trips the 1V threshold while CLK is low. If the FB
signal does not cross the 1V threshold while CLK is low,
the OUT signal will be dominated by the maximum duty
cycle programmed by the user. Figure 3 illustrates the
various waveforms for a design set up for a maximum
duty cycle of 70%.
-
-
-
-
-
The following equation sets the oscillator frequency:
−
[]FCTpFRTRT
=•+ •+
OS C
DRTCTpFF
=•• +•074127.
MAXOS C
()
0742712
.
()
()
1
Referring to Figure 2 and the waveforms in Figure 3,
when Q1is on, CT charges via the R
DS(on)
of Q1 and
RT1. During this charging process, the voltage of CT is
sensed through RT2. The S input of the oscillator latch,
S(OSC), is level sensitive, so crossing the upper thresh
old (set at 2/3 VREF or 3.33V for a typical 5.0V refer
ence) sets the Q output (CLK signal) of the oscillator
latch high. A high CLK signal results in turning off Q1 and
turning on Q2. CT now discharges through RT2 and the
R
DS(on)
of Q2. CT discharges from 3.33V to the lower
threshold (set at 1/3 VREF or 1.67V for a typical 5.0V
V
REF
Q1
3
RT1
4
-
CT
RT2
Q2
-
Figure 2. UCC3809 oscillator.
5
3.33V
1.67V
+
–
+
–
OSC
SQ
R
OS CILLAT OR
LATC H
CL
UDG-97195
APPLICATION INFORMATION (cont.)
CT
CHARGINGCTDISCHARG ING
3.33V
1.67V
CT
S(OSC)
R(OSC)
Q(OSC)=CLK
=S(P WM)
1V
FB
R(PWM)
UCC1809-1/-2
UCC2809-1/-2
UCC3809-1/-2
Q(PWM)
OUT
FB S IG NAL DO MINAN TMAX. D UT Y CYCLE D O MINANT
Figure 3. Waveforms associated with the oscillator latch and the PWM latch.
The recommended value for CT is 1nF for frequencies in
the 100 kHz or less range and smaller CT for higher fre
-
1000
quencies. The minimum recommended values of RT1
and RT2 are 10kΩ and 4.32kΩ, respectively. Using these
values maintains a ratio of at least 20:1 between the
R
of the internal FETs and the external timing resis
DS(on)
tors, resulting in minimal change in frequency over tem
perature. Because of the oscillator's susceptibility to
-
-
100
capacitive coupling, examine the oscillator frequency by
looking at the common RT1-RT2-CT node on the circuit
FREQUENCY [kHz]
board as opposed to looking at pins 3 and 4 directly. For
good noise immunity, RT1 and RT2 should be placed as
close to pins 3 and 4 of the IC as possible. CT should be
returned directly to the ground pin of the IC with minimal
stray inductance and capacitance.
10
100100010000
Figure 4. Oscillator frequency vs. CT(RT1 = 10k,
RT2 = 4.32k)
6
70%
ON
30%
OFF
UDG-99037
CT [pF]
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