10/94
• Dual Power Operational Amplifiers
•±2A Output Current Guaranteed
• Precision Current Sense Amplifier
• Two Supply Monitoring Inputs
• Parking Function and Under-Voltage
Lockout
• Safe Operating Area Protect ion
• 3V to 35V Operation
Full Bridge Power Amplifier
UC3176
UC3177
FEATURES DESCRIPTION
The UC3176/7 family of full bridge power amplifiers is rated for a continuous output current of 2A. Intended for use in dem anding servo applications
such as disk head positioning, the onboard current sense amplifier can be
used to obtain precision control of load curren t, or where voltage mode
drive is required, a standard voltage feedback scheme can be used. Output stage protection includes foldback current l imiting and thermal shutdown, resulting in a very rugged device.
Auxiliary functions on this device i nclude a dual in put under-voltage comparator that can be programmed to respond to low voltage conditions on
two independent supplies. In response to an under-voltage condition the
power Op-Amps are inhibited and a high current, 100mA, open collector
drive output is activated. A separate Park/Inhibit command input.
The devices are o perational over a 3V to 35V supply range. Internal under-voltage lockout p rovides predictable power-up and power-down characteristics.
BLOCK DIAGRAM
Input Supply voltage, (+V IN). . . . . . . . . . . . . . . . . . . . . . . 40V
Park/Inhibit, UV1 and UV2 inputs (ze ner clamp ed)
Maximum forced voltage . . . . . . . . . . . . . . . . -0.3V to 10V
Maximum forced curr ent. . . . . . . . . . . . . . . . . . . . . ±10mA
Other I nput Volta ges . . . . . . . . . . . . . . . . . . . . . -0.3V to + V
IN
AlSINK and BlSINK Voltages. . . . . . . . . . . . . . . . . . -0.3V to 6V
Open Collector Out put Voltages. . . . . . . . . . . . . . . . . . . . 40V
A and B Output Curren ts (Continuo us)
Source . . . . . . . . . . . . . . . . . . . . . . . . . . Internally Limited
Sink. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5A
Total Supply Cu rr ent (Continuous). . . . . . . . . . . . . . . . . . . 4 A
Parking Drive Output Curr ent (Continu ous). . . . . . . . 200mA
Supply OK Output Current, UC3177 (Cont inuous ) . . . 30mA
Operating Jun ctio n Tem per atur e. . . . . . . . -55°C to +150°C
Power Dissipation at TC = +75°C
QP package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4W
Storage Temperature. . . . . . . . . . . . . . . . . -65°C to +150°C
Note 1: Unless otherwise indica te d, volta ges are re feren ce to
ground and curre nt s are posit ive in to, negat ive out of , the
specified terminals.
PARAMETER TEST CONDITION S MIN. TYP. MAX. UNITS
Input S u p pl y
Supply Curren t +V
IN = 12V
18 25 mA
+VIN = 35V
21 30 mA
UVOL Threshold +VIN low to high
2.8 3.0 V
Threshold Hyst er esis
220 300 mV
Power, Amplifier, A and B
Input Offset Voltage V
CM = 6V, VOUT = 6V
8mV
Input Bias Current VCM = 6V, Ex cept A+ Input
-500 -100 nA
Input Bias Cu rrent at A+/Refe rence Input (A+/Ref - BISINK)/36kohms; T J = 25°C
23 28 35 µA/V
Input Offset Cur ren t B Amp (UC3176 O nly) V CM = 6 V
200 nA
CMRR VCM = 1 to 33V, +VIN =35V, VOUT = 6V
70 100 dB
PSRR +VIN = 5 to 35V, VCM = 2.5V
70 100 dB
Large Signal Volta ge G ai n VOUT = 3V, w/IOUT = 1A to VOUT = 9V, w/ IOUT = -1A
1.5 4 V/m V
Thermal Fe edback +VIN = 20V, Pd = 20W at opp osit e output
25 200 µV/W
Saturation Voltage IOUT = -2A, High Side, TJ = 2 5°
1.9 V
CIOUT = 2A, Low Side, TJ = 25°C
1.6 V
Total VSAT at 2A, TJ = 25°C
3.5 3.7 V
Unity Gain Bandwidth
1MHz
Slew Rate
1V/µs
Dif fere ntial I
OUT
Sense Error Current IOUT(A) = -IOUT(B), / IOUT/- /AISINK - BISINK/
in Bridge Configur at ion IOUT ≤20 0mA
3.0 6.0 mA
IOUT ≤ 2A
5.0 10 mA
High Side Current Limiting =VIN - VOUT < 12V
-2.7 -2.0 A
UC3176
UC3177
ABSOLUTE MAXIMUM RATINGS (Note 1)
QP package:
Thermal Resistance Junct ion to Lea ds, θ
JL . . . . . . 15°C/W
Thermal Resistance Junct ion to Am bient , θ
JA . . . . 50°C/W
THERMAL DATA
PACKAGE PIN FUNCTION
FUNCTION PIN
+VIN 1
B Output 2
BI
SINK (S ense) 3
BI
SINK 4
N/C 5-7
B- Input 8
* 9
Park/Inhibit 10
Parking Drive 11
Gnd ( Heat Flow Pins) 12-18
UV1 19
UV2 20
Current Feedback 21
A+ Input 22
A- Input 23
N/C 24
AI
SINK 25
AI
SINK (Sense) 26
A Output 27
Gnd 28
*Pin 9: UC3176, B+ Input
UC3177, Supply OK
PLCC-28 (Top View)
QP Package
CONNECTION DIAG RAM
ELECTRICAL CHARACTERIST ICS :
Unless otherwise stated, specifications hold for TA = 0 to 70° C, +VIN = 12V, TA = TJ
.
2
PARAMETER TEST CONDITION S MIN. TYP. MAX. UNIT S
Current Sense Amplifier
Input Offset Voltage V
CM = 0V, A+/Ref at 6V
3mV
Ref = 2V to 20V, +VIN = 35, change with Re f
input voltage
600 µV/V
Thermal Gr adient Sensitivity +V IN = 20 V, Ref = 10V Pd = 20W @ A or B
outp ut
5.0 75 µV/W
PSRR Ref = 2.5V, +VIN = 5 to 35V
70 100 dB
Gain /AISINK - BISINK/ ≤ 0.5V
7.8 8 8.1 V/V
Slew Rate
2V/µS
3dB Bandwidth
1MHz
Max Output Current ISOURCE = +VIN - VOUT = 0.5V
2.5 3.5 mA
Output Saturation Voltage ISOURCE = 1.5mA, High Side
0.15 0.30 V
ISINK = 5mA, Low Side
1.4 1.7 V
Under-Vol t age Co m pa rat or
Threshold Voltage Low to High, other in put at 5V
1.44 1.50 1.56 V
Threshold Hyst er esis
50 70 80 mV
Input Cu rr ent Input = 2V, other input at 5 V
-2 -.05 µA
Supply OK V
SAT
(UC3177 Only) IOUT = 5mA
0.45 V
Supply OK Leakage ( UC3177 Only) VOUT = 35V
5 µA
Park/Inhibit
Park/Inhibit Thl’d
1.1 1.3 1.7 V
Park/Inhibit In put Current At threshold
60 100 µA
Parking Drive Satur at ion Volta ge I
OUT
= 100mA
0.3 0.7 V
Parking Drive Leakage V
OUT
= 35V
15 µA
Therma l Shu tdo wn
Shutdown Te mp era ture
165 °C
UC3176
UC3177
ELECTRICAL CHARACTERIST ICS :
Unless otherwise stated, specifications hold for TA = 0 to 70° C, +VIN = 12V, TA = TJ
.
Output Saturatio n Voltage
vs Current
Maximum Source Current
vs +V
IN - VOUT
Crossover Current Error
Characteristic
3
UC3176
UC3177
Transconduc tance (G O) =
I
L
V
S
=
R
F2
R
F1
×
1
8
R
S
with: R
SA = RSB and RF3 = RF4
Parking Current (IP) =
V
IN
− 1.5
R
P
+
R
L
where: RL = load resistance
Under-Volt age Thres ho lds, at Supplies
High to Low Threshold, (V
LH) = 1.425 (RA + RB)/RB
Low to High Threshold, (VHL) = 1.5 (RA + RB)/RB
APPLICATION AND OPERATION INFORMATION
DESIGN EQUATI ONS
WAVEFORMS FOR ABOV E APPLI CATIO N
UNITRODE INTEGRATED CIRCUITS
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. (603) 424-2410 • FAX (603) 424-3460
4
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICA TIONS IS UNDERSTOOD T O
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
Loading...