Texas Instruments UC3726DWPTR, UC3726DWP, UC3726N, UC2726N, UC2726DWPTR Datasheet

...
750mA Output Drive, Source or Sink
8 to 35V Operation
Transmits Drive Logic and Power
through Low Cost Transformer
Programmable Operating Frequency
Up to 750kHz Operation
Improved Output Control Algorithm
Minimizes Output Jitter
User Programmable Fault Timing Screens False Fault Signals
Shutdown Mode Disables On Chip Logic Reference for Low Standby Power
Optional External Biasing of Logic Circuitry can Reduce Overall Power Dissipation
The UC1726 Isolated Drive Transmitter, and its companion chip, the UC1727 Isolated High Side IGBT Driver, provide a unique solution to driv­ing isolated power IGBTs. They are particularly suited to drive the high side device s on a high voltage H-bridge. The UC1726 device transmits the drive logic and drive power, along with transferring and receiving fault information with the isolated gate circuit using a low cost pulse trans­former.
This drive system utilizes a duty cycle modulation technique that gives in­stantaneous response to the drive control transitions, and reliably passes steady state, or DC conditions. High frequency operation, up to 750kHz, allows the cost and size of the coupling transformer to be minimized.
The UC1726 can be powered from a single V
CC supply whi ch internally
generates a voltage reference for the logic circuitry. It can also be placed into a low power shutdown mode that disables the internal reference. The IC’s logic ci rcuitry can b e powered from an external suppl y, V
L, to mini-
mize overall power dissipation. Fault logic monitors the Isolated High Side IGBT Driver UC1727 for faults. Based on user defined timing, the UC1726 distinguishes valid faults, which it responds to by setting the fault latch pin. This also disables the gate drive information until the fault reset pin is toggled to a logic one.
The UC1726 opera te s ove r an 8 to 3 5 vo lt su ppl y range. The typical V
CC
voltage will be greater than 28 volts t o be compatible with the UC1727. The undervoltage lockout circuitry of the Isolated High Side IGBT Driver UC1727 locks out the drive information during its under voltage lockout.
Isolated Drive Transmitter
FEATURES
DESCRIPTION
BLOCK DIAGRA M
UC1726 UC2726 UC3726
7/95
UDG-94004-1
CONNECTION DIAGRAMS
UC1726 UC2726 UC3726
ABSOLUTE MAXI MUM RATING S
Supply Voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Source/ Sink Current (Pulsed). . . . . . . . . . . . . . . . . . . . . . 1.5A
Source/ S in k Curr ent (Continuous) . . . . . . . . . . . . . . . . . . 1.0A
Output Voltag e (pins 12, 14). . . . . . . . . . 0.3 to (V
CC + 0.3)V
C
F, FRESET, FAULT, SHTDWN,
F
LATCH, VL, PHI, RT . . . . . . . . . . . . . . . . . . . . . . . 0.3 to 6. 0V
C
T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 to 6.0V
Operating Junct ion Te mp era tu re (Not e 2) . . . . . . . . . . 150°C
Storage Temperature Range . . . . . . . . . . . . . 65°C to 150°C
Lead Temp era ture (Solder in g, 10 seconds). . . . . . . . . 300 °C
Note 1: All voltages are with res pect to GND ( Pin 2); all
currents are posit ive int o, negat ive ou t of part .
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +9 to +35.0V
Sink/Source Curre nt (each out put ). . . . . . . . . . . . . . . 0 to 750mA
Timing Resistor. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4k to 200k
Timing Capacitor (C
T). . . . . . . . . . . . . . . . . . . . . . . 75pF to 2.0nF
Timing Capacitor (C
F). . . . . . . . . . . . . . . . . . . . . . . 75pF to 3.0nF
Note 2: See Unitrod e Inte gra ted C ircuit s datab ook f or inform at ion
regarding thermal spe cifica tion s and limit ations of packages.
Note 3: Range over which the device is functional and par amet er
limits are guaranteed.
RECOMMENDED OPERATING CONDITIONS (Note 3)
DIL-16 (Top View) N Package
DIL-16 (Top View) SP Package
DIL-18 (Top View) J Package
SOIC-28 (Top View) DWP Package
PACKAGE PIN FUNCTION
FUNCTION PIN
GND 1 C
T 2
N/C 3-4 R
T 5
SHTDWN 6 V
L 7
V
CC 8
N/C 9 PV
CC 10
OUTB 11 PGND 12-18 GND 19 OUTA 20 PHI 21 F
LATCH 22
F
RESET 23
FAULT 24 N/C 2 5 C
F 26
N/C 2 7 N/C 2 8
PLCC-28 (Top View) QP Package
2
UC1726 UC2726 UC3726
PARAMETERS TEST CONDITIONS MIN TYP MAX UNITS
Retriggerable one shot
Initial Accuracy T
J = 25°C 1.400 1.600 1.800 µsec
Temperature Stability Over operating TJ 1.000 2.200 µsec Voltage Stability V
CC = 10 to 35V 0.2 %/V
Operating Freque ncy L
LOAD = 1.5mH 170 kHz
PHI Input (Control Input)
HIGH Input Voltage 2.0 V LOW Input Voltage 0.8 V HIGH Input Current 10 µA LOW Input Current -300 60 0 µA Delay to one shot 100 250 nsec Delay to Output C
T = 1.4V 250 nsec
Output Drivers
Output Low Le vel I
SINK = 20mA 0.3 0.5 V
I
SINK = 400mA 0.5 2.6 V
Output High Level I
SOURCE = 20mA 2.0 2.6 V
(volts below V
CC)ISOURCE = 400mA 2.0 2.9 V
Rise and Fall Times No load 30 60 nsec
Logic Voltage Reference
V
L - Logic Voltage Internal Voltage 4.20 4 .4 0 4.60 V
Logic Supply Current V
L = 4.75V to 5.25V, CT = 1.4V 13.0 20.0 mA
Shut Down Circuit
Logic Voltage - Off 0.5 V High Input Current V
IH = 2.4 -100 µA
Low Input Current V
IL = 0.4 -20 µA
Fault Logic
Fault Reset High Input Current V
IH = 2.4
±
5 µA
Fault Reset Low Input Current V
IL = 0.4 -10 µA
Fault High Input Cur rent V
IH = 2.4
±
5 µA
Fault Low Input Current V
IL = 0.4 -60 µA
Fault Pulse Width C
F = 330pF 3.0 µs
C
F = 2.2nF 17.0 µs
Fault Latch, V
OH ILOAD = 1mA, Volts below VL 1.3 1.8 V
Fault Latch, V
OL ILOAD = 1mA 0.25 0.5 V
Fault Latch, VOH ILOAD = 0, Volts below VL 0.3 V Fault Latch, V
OL ILOAD = 0 0.2 V
Fault Reset Pulse Width 500 ns
UVLO
Turn On Thresho ld 7.1 V
Total Supply Current
Supply Current C
T = 1.4V 22 40 mA
C
T = 1.4V, VL = 5.0V 12 20 mA
CT = 1.4V, Shutdown = 5.0V 2.5 mA
Unless otherwise stated, VCC = 20V, RT = 4.32k, CT = 330pF and CF = 2.2nF, no load on any output, and −55°C < T A < 1 25°C for the UC1726, −40°C < TA < 85°C for the UC2726, and 0°C < TA < 70°C for the UC3726, TA = T J.
ELECTRICAL CHARACTERISTICS:
3
UC1726 UC2726 UC3726
PIN DESCRIP TI ONS
CF: The timing input to the fault logic. A capacitor is
placed across the input of C
F and ground. The timing win-
dow is approximately t = 2.1C
FRT.
C
T: The connection to the timing capacitor that controls
the operating frequ ency. A capacitor to ground is repeti­tively charg ed during the one sh ot pulse width. It is dis­charged when a comparator senses zero current in the primary side of the transformer. The one shot pulse width is consequently determined by the time it takes to charge the capacitor from a threshold voltage of V
L/4 to VL/2.
This pin must be tied t o a capacitor. See Recommended Operating Conditions.
FAULT: This input t o the faul t logi c i nitiates th e user pro­grammable timer. This time interval, specified by the ca­pacitor on C
F, determines the validity of the fault. The pin
is tied to a low cost optocoupler, and is high until the UC1727 sends drive information from the PHI pin through the transformer while the FAULT pin stays low. Once this pin goes high, it must stay high during the entire fault win­dow to be a ccepted as a va li d fault. A valid fault sets the F
LATCH pin high and prevents the transmitting of gate
drive information until the F
RESET is toggled high. If fault
logic is not used, the FAULT pin must be grounded.
F
LATCH: A valid fault sets this pin to a logic one and pre-
vents the transmitting of gate drive information. The F
LATCH pin can only be reset by connecting the FRESET to
a logic 0.
F
RESET: The input to the fault logic that resets the fault
logic latch (F
LATCH) and enables drive transmit data. This
input must be low when powered up and stay low until af­ter the fault latch has been set.
GND: The signal and power ground for the device. The power ground of the output transistor is isolated on the chip from the subs trate groun d which biases the remain­der of the device.
OUTA: One output of the two totem pole outputs con­nected across the transformer primary winding. When PHI is high, the output toggles between 0.3V during the one shot charge time and approximately V
CC + 0.4V dur-
ing the remainder of the period. When PHI is low the out­put toggles between V
CC - 2V during the one shot charge
time and approximately 0.6V
CC during the remainder of
the period.
OUTB: One output of the two totem pole outputs con­nected across the transformer primary winding. When PHI is high, the output toggl es between V
CC - 2V during
the one shot charge time and approximately 0.6V
CC dur-
ing the remainder of the period. When PHI is low the out­put toggles between 0.3V during the one shot charge time and approximately V
CC + 0.4V during the remainder
of the period. PGND: This is the ground for the output transistors
bonded i n the 28 pin packag es. On the six teen pin pack­ages it is bonded separately to the GND pin.
PHI: A logic control input to the isolated gate drive that changes the outputs as described above. This changes the duty cycle of the voltage wave form applied across the transformer. The Isolated High Side IGBT Driver UC1727 senses the different duty cycles as different drive commands.
PV
CC: This is the input vol tage for the output transistors
on the 28 pin package. On the sixteen pin packages it is bonded separately to the V
CC pin.
R
T: The input that sets the CT and CF capacitor currents
with a resistor to ground . The voltage on R
T is approxi-
mately 0.3V
L. The resulting charge currents are: ICT =
IC
F = VL / 4RT.
SHTDWN: This input shuts down the internal reference. A TTL logic one puts the UC1726 into a low standby current mode. This input has a pull down resistor on the chip to guarantee proper operation when left open. If an external logic voltage i s applied to V
L, this shutdown feature can-
not be used without bringi ng the external voltage source to zero volts.
V
CC: The input voltage that biases the outputs and the in-
ternal reference. It can vary between 8V to 35V. This sup­ply pin will typically be greater than 28V to be compatible with the UC1727. In order to min imize pow er dissipation use an external logic supply, V
CC approximately 15V, and
a step up transformer (N = 2).
V
L: The logic supply pin that biases all circuits except for
the totem pole outputs. A bypass capacitor is recom­mended on thi s pin when lef t unconnected. The internal reference is approximately 4.4V. A 5.0V supply can be applied to thi s pin to assure minimum power dissipation. When an external supply higher than the V
L voltage is
applied to this pin, the internal reference turns off.
Refer to Typical Appli cati on on Page 5 and Applicatio n Note U- 143A "New Ch ip Pair Provi des Iso l ated Drive for High Voltage IGBTs"
4
UC1726 UC2726 UC3726
TYPICAL APPLICATIO N
UNITRODE INTEGRATED CIRCUITS 7 CONTINENTAL BLVD. • • MERRIMACK, NH 03054 TEL. (603) 424-2410 •• FAX (603) 424-3460
IF FAULT LOGIC NOT USED, GROUND FAULT PIN.
UDG-94006
The chip operating frequency is determined by the values of components connected to the R
T and CT pins. A resis-
tor connected between R
T and ground sets the charge
current to IC
T = VL / 4RT. The operating frequency varies
slightly depending on the V
CC and VL voltages. The fol-
lowing equations approximate the one shot pulse width at operating frequency when V
CC = 20V.
T
PW = 1.1RT(CT + 50pF)
F
O
=
1
3.3
R
T
(
C
T
+ 50pF)
The 50pF additional capacity represents internal chip ca­pacitance at the C
T input.
OPERATING FREQ UENCY :
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICA TIONS IS UNDERSTOOD T O BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
Loading...