TEXAS INSTRUMENTS TS3USB221A Technical data

1

10

2

9

3

8

4

7

V

CC

S

D+

D–

OE

1D+

1D–

2D+

2D–

GND

5

6

1

10

2

9

3

8

4

7

V

CC

S

D+

D–

OE

1D+

1D–

2D+

2D–

GND

5

6

TS3USB221A

www.ti.com

.......................................................................................................................................................................................... SCDS277 – NOVEMBER 2008

ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps)

1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE

1

FEATURES

• V

• 1.8-V Compatible Control-Pin Inputs

• Low-Power Mode When OE Is Disabled (1 µ A)

• r

• Δ r

• C

• Low Power Consumption (30 µ A Maximum)

• High Bandwidth (900 MHz Typical)

• Latch-Up Performance Exceeds 100 mA

• ESD Performance Tested Per JESD 22

• ESD Performance I/O to GND

Operation at 2.5 V to 3.3 V

CC

Accepts Signals Up to 5.5 V

I/O

= 6 Ω Maximum

ON

= 0.2 Ω Typical

ON

= 6 pF Typical

io(on)

Per JESD 78, Class II

– 7000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

– 12-kV Human-Body Model

RSE PACKAGE

(TOP VIEW)

RSE PACKAGE

(BOTTOM VIEW)

APPLICATIONS

• Routes Signals for USB 1.0, 1.1, and 2.0

DESCRIPTION

The TS3USB221A is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB221A integrates ESD protection cells on all pins, is available in a tiny µ QFN package (2.0 mm × 1.5 mm) and is charaterized over the free air temperature range from – 40 ° C to 85 ° C.

1

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

D−

D+

1D−

1D+

2D−

2D+

S OE

A

EN (see Note A)

B

Charge

Pump

V

CC

TS3USB221A

SCDS277 – NOVEMBER 2008 ..........................................................................................................................................................................................

www.ti.com

ORDERING INFORMATION

T

A

– 40 ° C to 85 ° C QFN – RSE Reel of 3000 TS3USB221ARSER LHR

(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging . (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com .

PACKAGE

(1) (2)

ORDERABLE PART NUMBER TOP-SIDE MARKING

PIN DESCRIPTION

NAME DESCRIPTION

OE Bus-switch enable

S Select input D Bus A

nD Bus B

TRUTH TABLE

S OE FUNCTION

X H Disconnect L L D = 1D H L D = 2D

BLOCK DIAGRAM

SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)

A. EN is the internal enable signal applied to the switch.

Product Folder Link(s): TS3USB221A

TS3USB221A

www.ti.com

ABSOLUTE MAXIMUM RATINGS

.......................................................................................................................................................................................... SCDS277 – NOVEMBER 2008

(1)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

V

CC

V

IN

V

I/O

I

IK

I

I/OK

I

I/O

T

stg

Supply voltage range – 0.5 4.6 V

(2) (3) (4)

(2) (3)

– 0.5 7 V – 0.5 7 V

Control input voltage range Switch I/O voltage range Control input clamp current VIN< 0 – 50 mA I/O port clamp current V ON-state switch current Continuous current through V

(5)

or GND ± 100 mA

CC

< 0 – 50 mA

I/O

Storage temperature range – 65 150 ° C

(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operating

conditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to ground, unless otherwise specified. (3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (4) VIand VOare used to denote specific conditions for V (5) IIand IOare used to denote specific conditions for I

.

I/O

.

I/O

PACKAGE THERMAL IMPEDANCE

over operating free-air temperature range (unless otherwise noted)

θ

JA

Package thermal impedance

(1) The package thermal impedance is calculated in accordance with JESD 51-7.

(1)

RSE package 243 ° C/W

± 120 mA

UNIT

RECOMMENDED OPERATING CONDITIONS

V

CC

V

IH

V

IL

V

I/O

T

A

Supply voltage 2.3 3.6 V

High-level control input voltage V

Low-level control input voltage V

Data input/output voltage 0 5.5 V Operating free-air temperature – 40 85 ° C

MIN MAX UNIT

V

= 2.3 V to 2.7 V 0.46 × V

CC

V

= 2.7 V to 3.6 V 0.46 × V

CC

V

= 2.3 V to 2.7 V 0.25 × V

CC

V

= 2.7 V to 3.6 V 0.25 × V

CC

CC CC

Product Folder Link(s): TS3USB221A

TS3USB221A

SCDS277 – NOVEMBER 2008 ..........................................................................................................................................................................................

ELECTRICAL CHARACTERISTICS

(1)

www.ti.com

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP

V

IK

I

I I

(low power 1 µ A

Control

IN

inputs

(3)

OZ

(OFF)

CC

mode)

Control One input at 1.8 V,

(4)

Δ I

CC

inputs Other inputs at V

C C

C

r

Δ r

r

Control

in

inputs

io(OFF) io(ON)

(5)

ON

ON(flat)

V

= 3.6 V, 2.7 V, II= – 18 mA – 1.8 V

CC

V

= 3.6 V, 2.7 V, 0 V, VIN= 0 V to 3.6 V ± 1 µ A

CC

V

= 3.6 V, 2.7 V, VIN= V

CC

VO= 0 V to 5.25 V, VI= 0 V, Switch OFF

V

I/O

V

= 0 V V

CC

V

= 3.6 V, 2.7 V, I

CC

VIN= V V

CC

VIN= V

V

CC

V

CC

V

CC

V

CC

V

CC

V

CC

or GND, Switch ON or OFF

CC

= 3.6 V, 2.7 V, Switch disabled,

or GND, OE in high state

CC

or GND

CC

= 3.3 V, 2.5 V, VIN= V = 3.3 V, 2.5 V, V

= 3.3 V, 2.5 V, V

= 3 V, 2.3 V Ω

I/O

V

I/O

V

CC

V

CC

I/O I/O

VI= 0 V, IO= 30 mA 3 6 VI= 2.4 V, IO= – 15 mA 3.4 6 VI= 0 V, IO= 30 mA 0.2 VI= 1.7, IO= – 15 mA 0.2 VI= 0 V, IO= 30 mA 1 VI= 1.7, IO= – 15 mA 1

or GND,

CC

= 0 V to 5.25 V ± 2 = 0 V to 3.6 V ± 2 µ A = 0 V to 2.7 V ± 1

= 0 V,

= 3.6 V 20 = 2.7 V 0.5

or 0 V 1.5 2.5 pF

CC

= V

or 0 V, Switch OFF 3.5 5 pF

CC

= V

or 0 V, Switch ON 6 7.5 pF

CC

(1) VINand IINrefer to control inputs. VI, VO, II, and IOrefer to data pins. (2) All typical values are at V (3) For I/O ports, the parameter IOZincludes the input leakage current.

= 3.3 V (unless otherwise noted), TA= 25 ° C.

CC

(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V (5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is

determined by the lower of the voltages of the two (A or B) terminals.

(2)

MAX UNIT

± 1 µ A

30 µ A

or GND.

CC

µ A

DYNAMIC ELECTRICAL CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V

PARAMETER TEST CONDITIONS TYP UNIT

X

TALK

O

IRR

BW Bandwidth ( – 3 dB) RL= 50 0.9 GHz

Crosstalk RL= 50 , f = 250 MHz – 40 dB OFF isolation RL= 50 , f = 250 MHz – 41 dB

= 3.3 V ± 10%, GND = 0 V

CC

Product Folder Link(s): TS3USB221A

TS3USB221A

www.ti.com

.......................................................................................................................................................................................... SCDS277 – NOVEMBER 2008

DYNAMIC ELECTRICAL CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V

PARAMETER TEST CONDITIONS TYP UNIT

X

TALK

O

IRR

BW Bandwidth (3 dB) RL= 50 0.9 GHz

Crosstalk RL= 50 , f = 250 MHz -39 dB OFF isolation RL= 50 , f = 250 MHz -40 dB

= 2.5 V ± 10%, GND = 0 V

CC

SWITCHING CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V

PARAMETER MIN TYP

t

pd

t

ON

t

OFF

t

SK(O)

t

SK(P)

Propagation delay

Line enable time ns

Line disable time ns

Output skew between center port to any other port Skew between opposite transitions of the same output (t

(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. (2) Specified by design (3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.

The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall

times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in

a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.

(2) (3)

= 3.3 V ± 10%, GND = 0 V

CC

(2)

PHL

(1)

0.25 ns S to D, nD 30 OE to D, nD 17 S to D, nD 12 OE to D, nD 10

0.1 0.2 ns

(2)

– t

)

PLH

0.1 0.2 ns

MAX UNIT

SWITCHING CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V

PARAMETER MIN TYP

t

pd

t

ON

t

OFF

t

SK(O)

t

SK(P)

Propagation delay

Line enable time ns

Line disable time ns

Output skew between center port to any other port Skew between opposite transitions of the same output (t

(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. (2) Specified by design (3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.

The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.

(2) (3)

= 2.5 V ± 10%, GND = 0 V

CC

S to D, nD 50 OE to D, nD 32 S to D, nD 23 OE to D, nD 12

(2)

PHL

(1)

MAX UNIT

0.25 ns

0.1 0.2 ns

(2)

– t

)

PLH

0.1 0.2 ns

Product Folder Link(s): TS3USB221A

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency (Hz)

–120

–100

–80

–60

–40

–20

0

Attenuation (dB)

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency (Hz)

–7

–6

–5

–4

–3

–2

–1

0

Gain (dB)

–120

–100

–80

–60

–40

–20

0

100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9

Frequency (Hz)

Attenuation (dB)

2.8

2.9

3.0

3.1

3.2

3.3

3.4

3.5

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

V (V)

IN

r ( )

on

Ω

V = 3 V

CC

V = 2.3 V

CC

2.8

2.9

3.0

3.1

3.2

3.3

3.4

3.5

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

V (V)

IN

r ( )

on

Ω

V = 3 V

CC

V = 2.3 V

CC

TS3USB221A

SCDS277 – NOVEMBER 2008 ..........................................................................................................................................................................................

www.ti.com

APPLICATION INFORMATION

Figure 1. Gain vs Frequency Figure 2. OFF Isolation vs Frequency

Figure 3. Crosstalk vs Frequency Figure 4. ronvs VIN(I

Figure 5. rONvs VIN(I

Product Folder Link(s): TS3USB221A

= – 15 mA)

OUT

= 30 mA)

OUT

Time ( 10 ) (s)X

–9

Differential Signal (V)

0.0

–0.5

0.5

–0.4

0.4

–0.3

0.3

–0.2

0.2

–0.1

0.1

0.0

0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0

Time ( 10 ) (s)X

–9

Differential Signal (V)

0.0

–0.5

0.5

–0.4

0.4

–0.3

0.3

–0.2

0.2

–0.1

0.1

0.0

0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0

Time ( 10 ) (s)X

–9

Differential Signal (V)

0.0

–0.5

0.5

–0.4

0.4

–0.3

0.3

–0.2

0.2

–0.1

0.1

0.0

0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0

TS3USB221A

www.ti.com

.......................................................................................................................................................................................... SCDS277 – NOVEMBER 2008

Figure 6. Eye Pattern: 480-Mbps USB Signal With No Figure 7. Eye Pattern: 480-Mbps USB Signal With Switch

Switch (Through Path) NC Path

Figure 8. Eye Pattern: 480-Mbps USB Signal With Switch

NO Path

Product Folder Link(s): TS3USB221A

C

L

(2)

R

L

V

IN

V

CC

GND

1D or 2D

V

OUT1

or V

OUT2

V

CTRL

1D or 2D

D

Logic

Input

(1)

V

+

V

COM

500 Ω

R

L

C

L

50 pFt

ON

TEST

V

+

500 Ω 50 pFt

OFF

50%

t

ON

t

OFF

50%

90% 90%

Logic

Input

(VI)

1.8 V

Switch

Output

(V

OUT1

or V

OUT2

)

0

C

L

(2)

R

L

S

(1)

All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.

(2)

CL includes probe and jig capacitance.

V

OH

V

OL

1D

2D

D

V

OUT1

V

IN

Channel OFF: 1D to D

Network Analyzer Setup Source Power = 0 dBm

(632-mV P-P at 50-W load) DC Bias = 350 mV

50 W

V

CC

GND

50 W

Network Analyzer

Source

Signal

V

CTRL

+

V

CTRL

= VCC or GND

S

TS3USB221A

SCDS277 – NOVEMBER 2008 ..........................................................................................................................................................................................

www.ti.com

PARAMETER MEASUREMENT INFORMATION

Figure 9. Turn-On (t

) and Turn-Off Time (t

ON

)

OFF

Figure 10. OFF Isolation (O

)

ISO

Product Folder Link(s): TS3USB221A

1D

2D

50 W

V

OUT1

V

IN

Channel ON: 1D to D

Network Analyzer Setup

Source Power = 0 dBm (632-mV P-P at 50-W load)

DC Bias = 350 mV

50 W

V

CC

GND

V

OUT2

Source Signal

Channel OFF: 2D to D

Network Analyzer

V

CTRL

+

V

CTRL

= VCC or GND

S

V

CC

GND

1D

V

CTRL

2D

D

50 W

V

OUT1

V

IN

Channel ON: 1D to D

Network Analyzer Setup

Source Power = 0 dBm (632-mV P-P at 50-W load)

DC Bias = 350 mV

Network Analyzer

Source

Signal

+

V

CTRL

= VCC or GND

S

400 mV

TS3USB221A

www.ti.com

.......................................................................................................................................................................................... SCDS277 – NOVEMBER 2008

PARAMETER MEASUREMENT INFORMATION (continued)

Figure 11. Crosstalk (X

)

TALK

Figure 12. Bandwidth (BW)

Figure 13. Propagation Delay

Product Folder Link(s): TS3USB221A

800mV

400mV

50%

50%50%

50%

OUTPUTSKEWt

SK(P)

PULSESKEWt

SK(P)

t = t t

SK(P) PHL PLH

| – |

t = t t

SK(O) PLH1 PLH2

| – | or | – |t t

PHL1 PHL2

Input

Output

Output2

Output1

V

OL

V

OL

V

OL

V

OH

V

OH

V

OH

t

PLH

t

SK(O)

t

SK(O)

t

PHL2

t

PLH2

t

PLH1

t

PHL1

t

PHL

V

CC

I

IN

r

on

+

VIN* V

OUT2

or V

OUT1

I

IN

W

GND

Channel ON

1D

V

CTRL

2D

D

V

IN

V

CTRL

= V

IH

or V

IL

V

OUT2

V

OUT1

+

S

TS3USB221A

SCDS277 – NOVEMBER 2008 ..........................................................................................................................................................................................

www.ti.com

PARAMETER MEASUREMENT INFORMATION (continued)

Figure 14. Skew Test

Figure 15. ON-State Resistance (r

on

)

Product Folder Link(s): TS3USB221A

Channel OFF

OFF-State Leakage Current

V

CTRL

= V

IH

or V

IL

V

CC

GND

1D

V

CTRL

2D

D

V

IN

V

OUT2

V

OUT1

+

S

V

CC

GND

V

BIAS

V

CTRL

V

CTRL

= VCC or GND

V

BIAS

= VCC or GND

Capacitance is measured at 1D, 2D, D, and S inputs during ON and OFF conditions.

Capacitance

Meter

V

IN

V

OUT2

V

OUT1

D

2D

1D

S

TS3USB221A

www.ti.com

.......................................................................................................................................................................................... SCDS277 – NOVEMBER 2008

PARAMETER MEASUREMENT INFORMATION (continued)

Figure 16. OFF-State Leakage Current

Figure 17. Capacitance

Product Folder Link(s): TS3USB221A

PACKAGE OPTION ADDENDUM

www.ti.com 16-Apr-2009

PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

TS3USB221ARSER ACTIVE QFN RSE 10 3000 Green (RoHS &

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

(3)

no Sb/Br)

TS3USB221ARSERG4 ACTIVE QFN RSE 10 3000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

15-Nov-2008

*All dimensions are nominal

Device Package

TS3USB221ARSER QFN RSE 10 3000 180.0 8.4 1.68 2.13 0.76 4.0 8.0 Q1

Type

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

15-Nov-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TS3USB221ARSER QFN RSE 10 3000 202.0 201.0 28.0

Pack Materials-Page 2

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

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TEXAS INSTRUMENTS TS3USB221A Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

APPLICATIONS

DESCRIPTION

BLOCK DIAGRAM

ABSOLUTE MAXIMUM RATINGS

PACKAGE THERMAL IMPEDANCE

RECOMMENDED OPERATING CONDITIONS

ELECTRICAL CHARACTERISTICS

DYNAMIC ELECTRICAL CHARACTERISTICS

DYNAMIC ELECTRICAL CHARACTERISTICS

SWITCHING CHARACTERISTICS

SWITCHING CHARACTERISTICS

APPLICATION INFORMATION

PARAMETER MEASUREMENT INFORMATION