DRC PACKAGE
(TOP VIEW
10
1
9
2
8
3
1D+
1D–
2D+
2D–
GND
6
5
7
4
V
CC
S
D+
D–
OE
10
1
9
2
8
3
1D+
1D–
2D+
2D–
GND
6
5
7
4
V
CC
S
D+
D–
OE
RSE PACKAGE
(TOP VIEW)
10
9
1
8
2
7
1D+
1D–
2D+
2D–
GND
4
5
3
6
V
CC
S
D+
D–
OE
RSE PACKAGE
(BOTTOMVIEW)
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
www.ti.com
1
FEATURES
• V
• V
Operation at 2.5 V and 3.3 V
CC
Accepts Signals up to 5.5 V
I/O
• 1.8-V Compatible Control-Pin Inputs
• Low-Power Mode When OE Is Disabled (1 µ A)
• r
• Δ r
• C
= 6 Ω Maximum
ON
= 0.2 Ω Typical
ON
= 6 pF Maximum
io(on)
• Low Power Consumption (30 µ A Maximum)
• ESD > 2000-V Human-Body Model (HBM)
• High Bandwidth (1.1 GHz Typical)
APPLICATIONS
• Routes Signals for USB 1.0, 1.1, and 2.0
DESCRIPTION/
ORDERING INFORMATION
The TS3USB221 is a high-bandwidth switch specially
designed for the switching of high-speed USB 2.0
signals in handset and consumer applications, such
as cell phones, digital cameras, and notebooks with
hubs or controllers with limited USB I/Os. The wide
bandwidth (1.1 GHz) of this switch allows signals to
pass with minimum edge and phase distortion. The
device multiplexes differential outputs from a USB
host device to one of two corresponding outputs. The
switch is bidirectional and offers little or no
attenuation of the high-speed signals at the outputs. It
is designed for low bit-to-bit skew and high
channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0
(480 Mbps).
TS3USB221
WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
– 40 ° C to 85 ° C
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
T
A
website at www.ti.com .
ORDERING INFORMATION
PACKAGE
QFN – RSE Reel of 3000 TS3USB221RSER L5O
SON – DRC Reel of 3000 TS3USB221DRCR ZWG
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
PIN DESCRIPTION
1
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NAME DESCRIPTION
OE Bus-switch enable
S Select input
Copyright © 2006 – 2008, Texas Instruments Incorporated
D−
D+
1D−
1D+
2D−
2D+
S
OE
A
EN (see Note A)
B
Charge
Pump
V
CC
TS3USB221
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
PIN
DESCRIPTION (continued)
NAME DESCRIPTION
D Bus A
nD Bus B
TRUTH TABLE
S OE FUNCTION
X H Disconnect
L L D = 1D
H L D = 2D
BLOCK DIAGRAM
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A. EN is the internal enable signal applied to the switch.
2 Submit Documentation Feedback Copyright © 2006 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TS3USB221
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
TS3USB221
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
V
IN
V
I/O
I
IK
I
I/OK
I
I/O
θ
JA
T
stg
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VIand VOare used to denote specific conditions for V
(5) IIand IOare used to denote specific conditions for I
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
V
CC
V
IH
V
IL
V
I/O
T
A
(1) All unused control inputs of the device must be held at V
Supply voltage range – 0.5 4.6 V
(2) (3) (4)
(2) (3)
– 0.5 7 V
– 0.5 7 V
Control input voltage range
Switch I/O voltage range
Control input clamp current VIN< 0 – 50 mA
I/O port clamp current V
ON-state switch current
Continuous current through V
Package thermal impedance
(5)
or GND ± 100 mA
CC
(6)
< 0 – 50 mA
I/O
DRC package 48.7
RSE package 243
Storage temperature range – 65 150 ° C
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
.
I/O
.
I/O
(1)
MIN MAX UNIT
Supply voltage 2.3 3.6 V
V
= 2.3 V to 2.7 V 0.46 × V
High-level control input voltage V
Low-level control input voltage V
CC
V
= 2.7 V to 3.6 V 0.46 × V
CC
V
= 2.3 V to 2.7 V 0.25 × V
CC
V
= 2.7 V to 3.6 V 0.25 × V
CC
CC
CC
Data input/output voltage 0 5.5 V
Operating free-air temperature – 40 85 ° C
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
CC
± 120 mA
° C/W
CC
CC
Copyright © 2006 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TS3USB221
TS3USB221
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
ELECTRICAL CHARACTERISTICS
(1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
V
IK
I
I
I
I
I
(low power 1 µ A
Control
IN
inputs
(3)
OZ
(OFF)
CC
CC
mode)
Control One input at 1.8 V,
(4)
Δ I
CC
inputs Other inputs at V
C
C
C
r
Δ r
r
Control
in
inputs
io(OFF)
io(ON)
(5)
on
on
on(flat)
V
= 3.6 V, 2.7 V, II= – 18 mA – 1.8 V
CC
V
= 3.6 V, 2.7 V, 0 V, VIN= 0 V to 3.6 V ± 1 µ A
CC
V
= 3.6 V, 2.7 V, VIN= V
CC
VO= 0 V to 3.6 V, VI= 0 V, Switch OFF
V
V
= 0 V µ A
CC
V
= 3.6 V, 2.7 V, I
CC
VIN= V
V
CC
VIN= V
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
or GND, Switch ON or OFF
CC
= 3.6 V, 2.7 V, Switch disabled
or GND ( OE in high state)
CC
or GND
CC
= 3.3 V, 2.5 V, VIN= 3.3 V or 0 V 1 2 pF
= 3.3 V, 2.5 V, V
= 3.3 V, 2.5 V, V
= 3 V, 2.3 V Ω
= 3 V, 2.3 V Ω
= 3 V, 2.3 V Ω
I/O
V
I/O
I/O
V
CC
V
CC
I/O
I/O
VI= 0 V, IO= 30 mA 6
VI= 2.4 V, IO= – 15 mA 6
VI= 0 V, IO= 30 mA 0.2
VI= 1.7, IO= – 15 mA 0.2
VI= 0 V, IO= 30 mA 1
VI= 1.7, IO= – 15 mA 1
or GND,
CC
= 0 V to 3.6 V ± 2
= 0 V to 2.7 V ± 1
= 0 V,
= 3.6 V 20
= 2.7 V 0.5
= 3.3 V or 0 V, Switch OFF 3 4 pF
= 3.3 V or 0 V, Switch ON 5 6 pF
(1) VINand IINrefer to control inputs. VI, VO, II, and IOrefer to data pins.
(2) All typical values are at V
(3) For I/O ports, the parameter IOZincludes the input leakage current.
= 3.3 V (unless otherwise noted), TA= 25 ° C.
CC
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V
(5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
(2)
MAX UNIT
± 1 µ A
30 µ A
or GND.
CC
µ A
DYNAMIC ELECTRICAL CHARACTERISTICS
over operating range, TA= – 40 ° C to 85 ° C, V
PARAMETER TEST CONDITIONS TYP
X
TALK
O
IRR
BW Bandwidth ( – 3 dB) RL= 50 Ω 1.1 GHz
(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
4 Submit Documentation Feedback Copyright © 2006 – 2008, Texas Instruments Incorporated
Crosstalk RL= 50 Ω , f = 250 MHz – 40 dB
OFF isolation RL= 50 Ω , f = 250 MHz – 41 dB
= 3.3 V ± 10%, GND = 0 V
CC
Product Folder Link(s): TS3USB221
(1)
UNIT
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
DYNAMIC ELECTRICAL CHARACTERISTICS
over operating range, TA= – 40 ° C to 85 ° C, V
PARAMETER TEST CONDITIONS TYP
X
TALK
O
IRR
Crosstalk RL= 50 Ω , f = 250 MHz – 39 dB
OFF isolation RL= 50 Ω , f = 250 MHz – 40 dB
BW Bandwidth ( – 3 dB) RL= 50 Ω 1.1 GHz
(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
SWITCHING CHARACTERISTICS
over operating range, TA= – 40 ° C to 85 ° C, V
PARAMETER MIN TYP
t
pd
t
ON
t
OFF
t
SK(O)
t
SK(P)
Propagation delay
Line enable time ns
Line disable time ns
Output skew between center port to any other port
Skew between opposite transitions of the same output (t
(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
(2) Specified by design
(3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
(2) (3)
= 2.5 V ± 10%, GND = 0 V
CC
= 3.3 V ± 10%, GND = 0 V
CC
S to D, nD 30
OE to D, nD 17
S to D, nD 12
OE to D, nD 10
(2)
PHL
(1)
MAX UNIT
0.25 ns
0.1 0.2 ns
(2)
– t
)
PLH
0.1 0.2 ns
TS3USB221
(1)
UNIT
SWITCHING CHARACTERISTICS
over operating range, TA= – 40 ° C to 85 ° C, V
PARAMETER MIN TYP
t
pd
t
ON
t
OFF
t
SK(O)
t
SK(P)
Propagation delay
Line enable time ns
Line disable time ns
Output skew between center port to any other port
Skew between opposite transitions of the same output (t
(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
(2) Specified by design
(3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
(2) (3)
= 2.5 V ± 10%, GND = 0 V
CC
S to D, nD 50
OE to D, nD 32
S to D, nD 23
OE to D, nD 12
(2)
PHL
(1)
MAX UNIT
0.25 ns
0.1 0.2 ns
(2)
– t
)
PLH
0.1 0.2 ns
Copyright © 2006 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TS3USB221
–120
–100
–80
–60
–40
–20
0
100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9
Frequency (Hz)
Attenuation (dB)
V = 2.5 V
CC
V = 3.3 V
CC
–7
–6
–5
–4
–3
–2
–1
0
100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9
Frequency (Hz)
Gain (dB)
V = 2.5 V
CC
V = 3.3 V
CC
–120
–100
–80
–60
–40
–20
0
100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9
Frequency (Hz)
Attenuation (dB)
V = 2.5 V
CC
V = 3.3 V
CC
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
V (V)
IN
r ( )
on
Ω
V = 2.3 V
CC
V = 3.0 V
CC
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
V (V)
IN
r
(
)
on
Ω
V = 2.3 V
CC
V = 3.0 V
CC
TS3USB221
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
APPLICATION INFORMATION
Figure 1. Gain vs Frequency Figure 2. OFF Isolation vs Frequency
Figure 3. Crosstalk vs Frequency Figure 4. ronvs VIN(I
6 Submit Documentation Feedback Copyright © 2006 – 2008, Texas Instruments Incorporated
Figure 5. ronvs VIN(I
Product Folder Link(s): TS3USB221
= – 15 mA)
OUT
= – 30 mA)
OUT