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TEXAS INSTRUMENTS
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TS3USB221
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TEXAS INSTRUMENTS TS3USB221 Technical data

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DRC PACKAGE
(TOP VIEW
10
1D+
1D–
2D+
2D–
GND
V
CC
S
D+
D–
OE
10
1D+
1D–
2D+
2D–
GND
V
CC
S
D+
D–
OE
RSE PACKAGE
(TOP VIEW)
10
1D+
1D–
2D+
2D–
GND
V
CC
S
D+
D–
OE
RSE PACKAGE
(BOTTOMVIEW)
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
www.ti.com
1

FEATURES

• V
• V
Operation at 2.5 V and 3.3 V
CC
Accepts Signals up to 5.5 V
I/O
• 1.8-V Compatible Control-Pin Inputs
• Low-Power Mode When OE Is Disabled (1 µ A)
• r
• Δ r
• C
= 6 Ω Maximum
ON
= 0.2 Ω Typical
ON
= 6 pF Maximum
io(on)
• Low Power Consumption (30 µ A Maximum)
• ESD > 2000-V Human-Body Model (HBM)
• High Bandwidth (1.1 GHz Typical)

APPLICATIONS

• Routes Signals for USB 1.0, 1.1, and 2.0

DESCRIPTION/ ORDERING INFORMATION

The TS3USB221 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1.1 GHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).
TS3USB221
WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
– 40 ° C to 85 ° C
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging . (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
T
A
website at www.ti.com .
ORDERING INFORMATION
PACKAGE
QFN – RSE Reel of 3000 TS3USB221RSER L5O SON – DRC Reel of 3000 TS3USB221DRCR ZWG
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
PIN DESCRIPTION
1
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NAME DESCRIPTION
OE Bus-switch enable
S Select input
Copyright © 2006 – 2008, Texas Instruments Incorporated
www.ti.com
D−
D+
1D−
1D+
2D−
2D+
S OE
A
EN (see Note A)
B
Charge
Pump
V
CC
TS3USB221 HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
PIN
DESCRIPTION (continued)
NAME DESCRIPTION
D Bus A
nD Bus B
TRUTH TABLE
S OE FUNCTION
X H Disconnect L L D = 1D H L D = 2D

BLOCK DIAGRAM

SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A. EN is the internal enable signal applied to the switch.
2 Submit Documentation Feedback Copyright © 2006 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TS3USB221
www.ti.com
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
TS3USB221

ABSOLUTE MAXIMUM RATINGS

(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
V
IN
V
I/O
I
IK
I
I/OK
I
I/O
θ
JA
T
stg
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
(2) All voltages are with respect to ground, unless otherwise specified. (3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (4) VIand VOare used to denote specific conditions for V (5) IIand IOare used to denote specific conditions for I (6) The package thermal impedance is calculated in accordance with JESD 51-7.

RECOMMENDED OPERATING CONDITIONS

V
CC
V
IH
V
IL
V
I/O
T
A
(1) All unused control inputs of the device must be held at V
Supply voltage range – 0.5 4.6 V
(2) (3) (4)
(2) (3)
– 0.5 7 V – 0.5 7 V
Control input voltage range Switch I/O voltage range Control input clamp current VIN< 0 – 50 mA I/O port clamp current V ON-state switch current Continuous current through V
Package thermal impedance
(5)
or GND ± 100 mA
CC
(6)
< 0 – 50 mA
I/O
DRC package 48.7 RSE package 243
Storage temperature range – 65 150 ° C
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
.
I/O
.
I/O
(1)
MIN MAX UNIT
Supply voltage 2.3 3.6 V
V
= 2.3 V to 2.7 V 0.46 × V
High-level control input voltage V
Low-level control input voltage V
CC
V
= 2.7 V to 3.6 V 0.46 × V
CC
V
= 2.3 V to 2.7 V 0.25 × V
CC
V
= 2.7 V to 3.6 V 0.25 × V
CC
CC CC
Data input/output voltage 0 5.5 V Operating free-air temperature – 40 85 ° C
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
CC
± 120 mA
° C/W
CC CC
Copyright © 2006 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TS3USB221
www.ti.com
TS3USB221 HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008

ELECTRICAL CHARACTERISTICS

(1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
V
IK
I
I
I
I I
(low power 1 µ A
Control
IN
inputs
(3)
OZ
(OFF)
CC
CC
mode)
Control One input at 1.8 V,
(4)
Δ I
CC
inputs Other inputs at V
C C
C
r
Δ r
r
Control
in
inputs
io(OFF) io(ON)
(5)
on
on
on(flat)
V
= 3.6 V, 2.7 V, II= – 18 mA – 1.8 V
CC
V
= 3.6 V, 2.7 V, 0 V, VIN= 0 V to 3.6 V ± 1 µ A
CC
V
= 3.6 V, 2.7 V, VIN= V
CC
VO= 0 V to 3.6 V, VI= 0 V, Switch OFF
V
V
= 0 V µ A
CC
V
= 3.6 V, 2.7 V, I
CC
VIN= V V
CC
VIN= V
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
or GND, Switch ON or OFF
CC
= 3.6 V, 2.7 V, Switch disabled
or GND ( OE in high state)
CC
or GND
CC
= 3.3 V, 2.5 V, VIN= 3.3 V or 0 V 1 2 pF = 3.3 V, 2.5 V, V
= 3.3 V, 2.5 V, V
= 3 V, 2.3 V Ω
= 3 V, 2.3 V Ω
= 3 V, 2.3 V Ω
I/O
V
I/O
I/O
V
CC
V
CC
I/O I/O
VI= 0 V, IO= 30 mA 6 VI= 2.4 V, IO= – 15 mA 6 VI= 0 V, IO= 30 mA 0.2 VI= 1.7, IO= – 15 mA 0.2 VI= 0 V, IO= 30 mA 1 VI= 1.7, IO= – 15 mA 1
or GND,
CC
= 0 V to 3.6 V ± 2 = 0 V to 2.7 V ± 1
= 0 V,
= 3.6 V 20 = 2.7 V 0.5
= 3.3 V or 0 V, Switch OFF 3 4 pF = 3.3 V or 0 V, Switch ON 5 6 pF
(1) VINand IINrefer to control inputs. VI, VO, II, and IOrefer to data pins. (2) All typical values are at V (3) For I/O ports, the parameter IOZincludes the input leakage current.
= 3.3 V (unless otherwise noted), TA= 25 ° C.
CC
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V (5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
(2)
MAX UNIT
± 1 µ A
30 µ A
or GND.
CC
µ A

DYNAMIC ELECTRICAL CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V
PARAMETER TEST CONDITIONS TYP
X
TALK
O
IRR
BW Bandwidth ( – 3 dB) RL= 50 Ω 1.1 GHz
(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
4 Submit Documentation Feedback Copyright © 2006 – 2008, Texas Instruments Incorporated
Crosstalk RL= 50 Ω , f = 250 MHz – 40 dB OFF isolation RL= 50 Ω , f = 250 MHz – 41 dB
= 3.3 V ± 10%, GND = 0 V
CC
Product Folder Link(s): TS3USB221
(1)
UNIT
www.ti.com
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008

DYNAMIC ELECTRICAL CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V
PARAMETER TEST CONDITIONS TYP
X
TALK
O
IRR
Crosstalk RL= 50 Ω , f = 250 MHz – 39 dB OFF isolation RL= 50 Ω , f = 250 MHz – 40 dB
BW Bandwidth ( – 3 dB) RL= 50 Ω 1.1 GHz
(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.

SWITCHING CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V
PARAMETER MIN TYP
t
pd
t
ON
t
OFF
t
SK(O)
t
SK(P)
Propagation delay
Line enable time ns
Line disable time ns
Output skew between center port to any other port Skew between opposite transitions of the same output (t
(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. (2) Specified by design (3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
(2) (3)
= 2.5 V ± 10%, GND = 0 V
CC
= 3.3 V ± 10%, GND = 0 V
CC
S to D, nD 30 OE to D, nD 17 S to D, nD 12 OE to D, nD 10
(2)
PHL
(1)
MAX UNIT
0.25 ns
0.1 0.2 ns
(2)
– t
)
PLH
0.1 0.2 ns
TS3USB221
(1)
UNIT

SWITCHING CHARACTERISTICS

over operating range, TA= – 40 ° C to 85 ° C, V
PARAMETER MIN TYP
t
pd
t
ON
t
OFF
t
SK(O)
t
SK(P)
Propagation delay
Line enable time ns
Line disable time ns
Output skew between center port to any other port Skew between opposite transitions of the same output (t
(1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. (2) Specified by design (3) The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
(2) (3)
= 2.5 V ± 10%, GND = 0 V
CC
S to D, nD 50 OE to D, nD 32 S to D, nD 23 OE to D, nD 12
(2)
PHL
(1)
MAX UNIT
0.25 ns
0.1 0.2 ns
(2)
– t
)
PLH
0.1 0.2 ns
Copyright © 2006 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TS3USB221
www.ti.com
–120
–100
–80
–60
–40
–20
0
100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9
Frequency (Hz)
Attenuation (dB)
V = 2.5 V
CC
V = 3.3 V
CC
–7
–6
–5
–4
–3
–2
–1
0
100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9
Frequency (Hz)
Gain (dB)
V = 2.5 V
CC
V = 3.3 V
CC
–120
–100
–80
–60
–40
–20
0
100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9
Frequency (Hz)
Attenuation (dB)
V = 2.5 V
CC
V = 3.3 V
CC
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
V (V)
IN
r ( )
on
Ω
V = 2.3 V
CC
V = 3.0 V
CC
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
V (V)
IN
r
(
)
on
Ω
V = 2.3 V
CC
V = 3.0 V
CC
TS3USB221 HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008

APPLICATION INFORMATION

Figure 1. Gain vs Frequency Figure 2. OFF Isolation vs Frequency
Figure 3. Crosstalk vs Frequency Figure 4. ronvs VIN(I
6 Submit Documentation Feedback Copyright © 2006 – 2008, Texas Instruments Incorporated
Figure 5. ronvs VIN(I
Product Folder Link(s): TS3USB221
= – 15 mA)
OUT
= – 30 mA)
OUT
www.ti.com
Time ( 10 ) (s)X
–9
Differential Signal (V)
0.0
–0.5
0.5
–0.4
0.4
–0.3
0.3
–0.2
0.2
–0.1
0.1
0.0
0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Time ( 10 ) (s)X
–9
Differential Signal (V)
0.0
–0.5
0.5
–0.4
0.4
–0.3
0.3
–0.2
0.2
–0.1
0.1
0.0
0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Time ( 10 ) (s)X
–9
Differential Signal (V)
0.0
–0.5
0.5
–0.4
0.4
–0.3
0.3
–0.2
0.2
–0.1
0.1
0.0
0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
TS3USB221
Figure 6. Eye Pattern: 480-Mbps USB Signal With No Figure 7. Eye Pattern: 480-Mbps USB Signal With Switch
Switch (Through Path) NC Path
Figure 8. Eye Pattern: 480-Mbps USB Signal With Switch
NO Path
Copyright © 2006 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TS3USB221
www.ti.com
C
L
(2)
R
L
V
IN
V
CC
GND
1D or 2D
V
OUT1
or V
OUT2
V
CTRL
1D or 2D
D
Logic
Input
(1)
V
+
V
COM
500 Ω
R
L
C
L
50 pFt
ON
TEST
V
+
500 Ω 50 pFt
OFF
50%
t
ON
t
OFF
50%
90% 90%
Logic
Input
(VI)
1.8 V
Switch
Output
(V
OUT1
or V
OUT2
)
0
C
L
(2)
R
L
S
(1)
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
(2)
CL includes probe and jig capacitance.
V
OH
V
OL
1D
2D
D
V
OUT1
V
IN
Channel OFF: 1D to D
Network Analyzer Setup Source Power = 0 dBm
(632-mV P-P at 50-W load) DC Bias = 350 mV
50 W
V
CC
GND
50 W
50 W
Network Analyzer
Source
Signal
V
CTRL
+
V
CTRL
= VCC or GND
S
TS3USB221 HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008

PARAMETER MEASUREMENT INFORMATION

Figure 9. Turn-On (t
Figure 10. OFF Isolation (O
8 Submit Documentation Feedback Copyright © 2006 – 2008, Texas Instruments Incorporated
) and Turn-Off Time (t
ON
OFF
)
ISO
Product Folder Link(s): TS3USB221
)
www.ti.com
1D
2D
50 W
50 W
V
OUT1
V
IN
Channel ON: 1D to D
Network Analyzer Setup
Source Power = 0 dBm (632-mV P-P at 50-W load)
DC Bias = 350 mV
50 W
V
CC
GND
V
OUT2
Source Signal
Channel OFF: 2D to D
Network Analyzer
V
CTRL
+
V
CTRL
= VCC or GND
S
V
CC
GND
1D
V
CTRL
2D
D
50 W
50 W
V
OUT1
V
IN
Channel ON: 1D to D
Network Analyzer Setup
Source Power = 0 dBm (632-mV P-P at 50-W load)
DC Bias = 350 mV
Network Analyzer
Source
Signal
+
V
CTRL
= VCC or GND
S
400 mV
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
PARAMETER MEASUREMENT INFORMATION (continued)
TS3USB221
WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
Figure 11. Crosstalk (X
Figure 12. Bandwidth (BW)
)
TALK
Copyright © 2006 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 9
Figure 13. Propagation Delay
Product Folder Link(s): TS3USB221
www.ti.com
800mV
800mV
400mV
400mV
50%
50%
50%
50%
50%
50%50%
50%
50%
OUTPUTSKEWt
SK(P)
PULSESKEWt
SK(P)
t = t t
SK(P) PHL PLH
| – |
t = t t
SK(O) PLH1 PLH2
| – | or | – |t t
PHL1 PHL2
Input
Input
Output
Output2
Output1
V
OL
V
OL
V
OL
V
OH
V
OH
V
OH
t
PLH
t
SK(O)
t
SK(O)
t
PHL2
t
PLH2
t
PLH1
t
PHL1
t
PHL
V
CC
I
IN
r
on
+
VIN* V
OUT2
or V
OUT1
I
IN
W
GND
Channel ON
1D
V
CTRL
2D
D
V
IN
V
CTRL
= V
IH
or V
IL
V
OUT2
V
OUT1
+
+
S
TS3USB221 HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 14. Skew Test
10 Submit Documentation Feedback Copyright © 2006 – 2008, Texas Instruments Incorporated
Figure 15. ON-State Resistance (r
on
)
Product Folder Link(s): TS3USB221
www.ti.com
Channel OFF
OFF-State Leakage Current
V
CTRL
= V
IH
or V
IL
V
CC
GND
1D
V
CTRL
2D
D
V
IN
V
OUT2
V
OUT1
+
+
+
S
V
CC
GND
V
BIAS
V
CTRL
V
CTRL
= VCC or GND
V
BIAS
= VCC or GND
Capacitance is measured at 1D, 2D, D, and S inputs during ON and OFF conditions.
Capacitance
Meter
V
IN
V
OUT2
V
OUT1
D
2D
1D
S
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 16. OFF-State Leakage Current
TS3USB221
WITH SINGLE ENABLE
SCDS220D – NOVEMBER 2006 – REVISED JANUARY 2008
Figure 17. Capacitance
Copyright © 2006 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): TS3USB221
PACKAGE OPTION ADDENDUM
www.ti.com
9-Jan-2008
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
TS3USB221DRCR ACTIVE SON DRC 10 3000 Green (RoHS &
no Sb/Br)
TS3USB221DRCRG4 ACTIVE SON DRC 10 3000 Green (RoHS &
no Sb/Br)
TS3USB221RSER ACTIVE QFN RSE 10 3000 Green (RoHS &
no Sb/Br)
TS3USB221RSERG4 ACTIVE QFN RSE 10 3000 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
Type
TS3USB221DRCR SON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TS3USB221RSER QFN RSE 10 3000 179.0 8.4 1.75 2.25 0.65 4.0 8.0 Q1
Package Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TS3USB221DRCR SON DRC 10 3000 346.0 346.0 29.0 TS3USB221RSER QFN RSE 10 3000 220.0 205.0 50.0
Pack Materials-Page 2
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