TPS799xxDDC
TSOT23-5
(TOPVIEW)
OUT
NR
IN
GND
EN
1
2
3
5
4
TPS799xxYZU
WCSP
(TOPVIEW)
C3 C1
B2
A3 A1
OUT
EN
IN
GND
NR
GND
TPS79901YZU
WCSP
(TOPVIEW)
OUT
EN
IN
FB
C3 C1
B2
A3 A1
TPS79901DDC
TSOT23-5
(TOPVIEW)
OUT
FB
IN
GND
EN
1
2
3
5
4
TPS799xxDRV
2mmx2mmSON-6
(TOPVIEW)
IN
N/C
EN
6
5
4
OUT
NR
GND
1
2
3
GND
TPS79901DRV
2mmx2mmSON-6
(TOPVIEW)
IN
N/C
EN
6
5
4
OUT
FB
GND
1
2
3
GND
TPS799xx
www.ti.com
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR
Low Dropout Linear Regulator
1
FEATURES DESCRIPTION
23
• 200mA Low Dropout Regulator with EN
• Low I Q: 40 µ A
• Multiple Output Voltage Versions Available:
– Fixed Outputs of 1.2V to 4.5V Using
Innovative Factory EEPROM Programming
– Adjustable Outputs from 1.20V to 6.5V
• High PSRR: 66dB at 1kHz
• Ultra-low Noise: 29.5 µ V
• Fast Start-Up Time: 45 µ s
• Stable with a Low-ESR, 2.0 µ F Typical Output
Capacitance
• Excellent Load/Line Transient Response
• 2% Overall Accuracy (Load/Line/Temp)
• Very Low Dropout: 100mV
• ThinSOT-23, WCSP, and 2mm × 2mm SON-6
Packages
RMS
SBVS056I – JANUARY 2005 – REVISED NOVEMBER 2007
The TPS799xx family of low-dropout (LDO)
low-power linear regulators offer excellent AC
performance with very low ground current. High
power-supply rejection ratio (PSRR), low noise, fast
start-up, and excellent line and load transient
response are provided while consuming a very low
40 µ A (typical) ground current. The TPS799xx is
stable with ceramic capacitors and uses an advanced
BiCMOS fabrication process to yield dropout voltage
typically 100mV at 200mA output. The TPS799xx
uses a precision voltage reference and feedback loop
to achieve overall accuracy of 2% over all load, line,
process, and temperature variations. It is fully
specified from TJ= – 40 ° C to +125 ° C and is offered in
low profile ThinSOT23, Wafer Chip-Scale (WCSP),
and 2mm × 2mm SON packages, ideal for wireless
handsets and WLAN cards.
APPLICATIONS
• Cellular Phones
• Wireless LAN, Bluetooth
• VCOs, RF
• Handheld Organizers, PDAs
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 Bluetooth is a registered trademark of Bluetooth SIG, Inc.
3 All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
®
Copyright © 2005 – 2007, Texas Instruments Incorporated
TPS799xx
SBVS056I – JANUARY 2005 – REVISED NOVEMBER 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
PRODUCT V
(1)
(2)
OUT
TPS799 xxyyyz XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable).
YYY is package designator.
Z is package quantity.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(2) Output voltages from 1.2V to 4.5V in 50mV increments are available through the use of innovative factory EEPROM programming;
minimum order quantities may apply. Contact factory for details and availability.
(3) For fixed 1.2V operation, tie FB to OUT.
ABSOLUTE MAXIMUM RATINGS
Over operating temperature range (unless otherwise noted).
PARAMETER TPS799xx UNIT
VINrange – 0.3 to +7.0 V
V
range – 0.3 to VIN+0.3 V
EN
V
range – 0.3 to VIN+0.3 V
OUT
Peak output current Internally limited
Continuous total power dissipation See Dissipation Ratings Table
Junction temperature range, T
Storage junction temperature range , T
ESD rating, HBM 2 kV
ESD rating, CDM 500 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
J
STG
(1)
– 55 to +150 ° C
– 55 to +150 ° C
(3)
DISSIPATION RATINGS
BOARD PACKAGE R
(1)
Low-K
(2)
High-K
(1)
Low-K
(2)
High-K
(1)
Low-K
(2)
High-K
DDC 90 ° C/W 280 ° C/W 3.6mW/ ° C 360mW 200mW 145mW
DDC 90 ° C/W 200 ° C/W 5.0mW/ ° C 500mW 275mW 200mW
YZU 27 ° C/W 255 ° C/W 3.9mW/ ° C 390mW 215mW 155mW
YZU 27 ° C/W 190 ° C/W 5.3mW/ ° C 530mW 295mW 215mW
DRV 20 ° C/W 140 ° C/W 7.1mW/ ° C 715mW 395mW 285mW
DRV 20 ° C/W 65 ° C/W 15.4mW/ ° C 1540mW 845mW 615mW
θ JC
R
θ JA
(1) The JEDEC low-K (1s) board used to derive this data was a 3in × 3in, two-layer board with 2-ounce copper traces on top of the board.
(2) The JEDEC high-K (2s2p) board used to derive this data was a 3in × 3in, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
2 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated
DERATING FACTOR
ABOVE TA= 25 ° C TA< 25 ° C TA= 70 ° C TA= 85 ° C
ELECTRICAL CHARACTERISTICS
Over operating temperature range (T
V
= VIN, C
EN
Typical values are at TJ= +25 ° C.
V
IN
V
FB
V
OUT
V
OUT
V
OUT
Δ V
%/ Δ V
OUT
Δ V
%/ Δ I
OUT
V
DO
V
DO
I
CL
I
GND
I
SHDN
I
FB
PSRR VIN= 3.85V, V
V
N
T
STR
V
EN(HI)
V
EN(LO)
I
EN(HI)
TSD Thermal shutdown temperature
T
UVLO
(1) Minimum VIN= V
(2) V
DO
OUT
= 2.2 µ F, C
= 0.01 µ F, unless otherwise noted. For TPS79901, V
NR
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input voltage range
Internal reference (TPS79901) 1.169 1.193 1.217 V
Output voltage range (TPS79901) V
Output accuracy Nominal TJ= +25 ° C – 1.0 +1.0 %
Output accuracy
Line regulation
IN
Load regulation 500 µ A ≤ I
OUT
(1)
Dropout voltage
(V
= V
IN
OUT(NOM)
Dropout voltage
(V
= V
IN
OUT(NOM)
Output current limit V
Ground pin current 500 µ A ≤ I
Shutdown current (I
Feedback pin current (TPS79901) – 0.5 0.5 µ A
Power-supply rejection ratio
C
NR
= 0.01 µ F, I
OUT
Output noise voltage
BW = 10Hz to 100kHz, V
Startup time
V
= 2.85V,
OUT
RL= 14 Ω , C
OUT
Enable high (enabled) 1.2 V
Enable low (shutdown) 0 0.4 V
Enable pin current, enabled V
J
Operating junction temperature – 40 +125 ° C
Under-voltage lock-out VINrising 1.90 2.20 2.65 V
Hysteresis VINfalling 70 mV
+ V
is not measured for devices with V
OUT
or 2.7V, whichever is greater.
DO
= – 40 ° C to +125 ° C), V
J
(1)
(1)
(2)
– 0.1V)
– 0.1V)
) V
GND
= 2.85V,
= 100mA
OUT
OUT
= 2.2 µ F
OUT(NOM)
Over VIN, V
I
, Temp 500 µ A ≤ I
OUT
V
< 3.3V I
OUT
V
≥ 3.3V I
OUT
OUT
V
OUT(NOM)
= 200mA 100 175 mV
OUT
= 200mA 90 160 mV
OUT
OUT
≤ 0.4V, 2.7V ≤ VIN≤ 6.5V 0.15 1.0 µ A
EN
f = 100Hz 70 dB
f = 1kHz 66 dB
f = 10kHz 51 dB
f = 100kHz 38 dB
C
= 0.01 µ F 10.5 x V
= 2.8V
NR
C
= none 94 x V
NR
C
= 0.001 µ F 45 µ s
NR
C
= 0.047 µ F 45 µ s
NR
C
= 0.01 µ F 50 µ s
NR
C
= none 50 µ s
NR
= VIN= 6.5V 0.03 1.0 µ A
EN
Shutdown, temperature increasing 165 ° C
Reset, temperature decreasing 145 ° C
< 2.8V because minimum VIN= 2.7V.
SBVS056I – JANUARY 2005 – REVISED NOVEMBER 2007
= V
IN
OUT(TYP)
+ 0.3V or 2.7V, whichever is greater; I
= 3.0V.
OUT
2.7 6.5 V
FB
+ 0.3V ≤ VIN≤ 6.5V
OUT
≤ 200mA
– 2.0 ± 1.0 +2.0 %
+ 0.3V ≤ VIN≤ 6.5V 0.02 %/V
≤ 200mA 0.002 %/mA
OUT
= 0.9 × V
OUT(NOM)
≤ 200mA 40 60 µ A
OUT
200 400 600 mA
OUT
OUT
6.5 – V
TPS799xx
= 1mA,
OUT
DO
V
µ V
RMS
µ V
RMS
V
IN
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 3
Thermal
Shutdown
UVLO
Current
Limit
2µA
Overshoot
Detect
500k
Quickstart
1.193V
Bandgap
IN
EN
NR
OUT
GND
400
Ω
Thermal
Shutdown
UVLO
Current
Limit
3.3M
Ω
Overshoot
Detect
500k
1.193V
Bandgap
IN
EN
FB
OUT
GND
400
Ω
TPS799xxDDC
TSOT23-5
(TOPVIEW)
OUT
NR
IN
GND
EN
1
2
3
5
4
TPS799xxYZU
WCSP
(TOPVIEW)
C3 C1
B2
A3 A1
OUT
EN
IN
GND
NR
GND
TPS79901YZU
WCSP
(TOPVIEW)
OUT
EN
IN
FB
C3 C1
B2
A3 A1
TPS79901DDC
TSOT23-5
(TOPVIEW)
OUT
FB
IN
GND
EN
1
2
3
5
4
TPS799xxDRV
2mmx2mmSON-6
(TOPVIEW)
IN
N/C
EN
6
5
4
OUT
NR
GND
1
2
3
GND
TPS79901DRV
2mmx2mmSON-6
(TOPVIEW)
IN
N/C
EN
6
5
4
OUT
FB
GND
1
2
3
GND
TPS799xx
SBVS056I – JANUARY 2005 – REVISED NOVEMBER 2007
FUNCTIONAL BLOCK DIAGRAMS
Figure 1. Fixed Voltage Versions Figure 2. Adjustable Voltage Versions
PIN CONFIGURATIONS
DEVICE INFORMATION
Table 1. PIN DESCRIPTIONS
TPS799xx
NAME DDC YZU DRV DESCRIPTION
IN 1 C3 6 Input supply.
GND 2 B2 3, Pad Ground. The pad must be tied to GND.
EN 3 A1 4
NR 4 A3 2 generated by the internal bandgap. This capacitor allows output noise to be reduced to very
FB 4 A3 2
OUT 5 C1 1
N/C — — 5 Not internally connected. This pin must either be left open, or tied to GND.
4 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator
into shutdown mode. EN can be connected to IN if not used.
Fixed voltage versions only; connecting an external capacitor to this pin bypasses noise
low levels.
Adjustable version only; this pin is the input to the control loop error amplifier, and is used to
set the output voltage of the device.
Output of the regulator. A small capacitor (total typical capacitance ≥ 2.0 µ F ceramic) is
needed from this pin to ground to assure stability.
2.5 3.5 4.5 5.5 6.5
VIN(V)
1.0
0.8
0.6
0.4
0.2
0
−
0.2
−
0.4
−
0.6
−
0.8
−
1.0
Change in V
OUT
(%)
7.5
I
OUT
= 100mA
TJ = +125°C
TJ = +85°C
TJ = −40°C
TJ = +25°C
0 50 100 150 200
I
OUT
(mA)
28.50
21.38
14.25
7.13
0
−
7.13
−
14.25
−
21.38
−
28.50
Change in V
OUT
(mV)
TJ = +125°C
TJ = +85°C
TJ = −40°C
TJ = +25°C
200
180
160
140
120
100
80
60
40
20
0
V
DO
(mV)
0 50 100 150 200
I
OUT
(mA)
TJ= +85_C
TJ=−40_C
TJ= +125_C
TJ= +25_C
TJ (° C)
2.0
1.5
1.0
0.5
0
−
0.5
−
1.0
−
1.5
−
2.0
Change in V
OUT
(%)
I
OUT
= 100mA
I
OUT
= 200mA
I
OUT
= 1mA
−40−
25 5 35 65 95 50 125
−
15 20 80 110
110
100
90
80
70
60
50
40
30
20
10
0
V
DO
(mV)
2.5 3.0 3.5 4.0 5.0 6.0 7.0 4.5 5.5 6.5
V
IN
(V)
I
OUT
= 200mA
TJ (° C)
200
180
160
140
120
100
80
60
40
20
0
V
DO
(mV)
5 35 65 95 50 125 20 80 110
I
OUT
= 100mA
I
OUT
= 200mA
I
OUT
= 1mA
−40−25−
15
Over operating temperature range (T
V
= VIN, C
EN
OUT
LOAD REGULATION LINE REGULATION
Figure 3. Figure 4.
= – 40 ° C to +125 ° C), V
J
= 2.2 µ F, C
NR
SBVS056I – JANUARY 2005 – REVISED NOVEMBER 2007
TYPICAL CHARACTERISTICS
= V
IN
OUT(TYP)
= 0.01 µ F, unless otherwise noted. For TPS79901, V
Typical values are at TJ= +25 ° C.
+ 0.3V or 2.7V, whichever is greater; I
TPS799xx
= 1mA,
= 3.0V.
OUT
OUT
OUTPUT VOLTAGE vs TPS799285 DROPOUT VOLTAGE vs
JUNCTION TEMPERATURE OUTPUT CURRENT
Figure 5. Figure 6.
TPS799285 DROPOUT VOLTAGE vs TPS79901 DROPOUT vs
JUNCTION TEMPERATURE INPUT VOLTAGE
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 5
Figure 7. Figure 8.
60
50
40
30
20
10
0
I
( A)
GND
m
2.5 3.0 4.5 5.5 6.5
V (V)
IN
7.0 3.5 4.0 5.0 6.0
I =200mA
OUT
V =2.85V
OUT
I =500 A
OUT
m
60
50
40
30
20
10
0
I
GND
(
µ
A)
VIN= 5.0V
VIN= 3.2V
VIN= 2.7V
(dropout)
V
OUT
= 2.85V
I
OUT
= 200mA
−40−
25 5 35 65 95 50 125
−
15 20 80 110
TJ (° C)
90
80
70
60
50
40
30
20
10
0
10 100 1k 10k
Frequency (Hz)
PSRR (dB)
100k 1M 10M
I
OUT
= 200mA
I
OUT
= 100mA
I
OUT
= 1mA
CNR= 0.01µF
C
OUT
= 2.2µF
TJ (° C)
600
500
400
300
200
100
0
I
GND
(nA)
VEN= 0.4V
VIN= 6.5V
VIN= 3.2V
−40−
25 5 35 65 95 50 125
−
15 20 80 110
90
80
70
60
50
40
30
20
10
0
10 100 1k 10k
Frequency (Hz)
PSRR (dB)
100k 1M 10M
I
OUT
= 100mA
I
OUT
= 1mA
I
OUT
= 200mA
CNR= 0.01µF
C
OUT
= 2.2µF
90
80
70
60
50
40
30
20
10
0
10 100 1k 10k
Frequency (Hz)
PSRR (dB)
100k 1M 10M
I
OUT
= 1mA
I
OUT
= 100mA
I
OUT
= 200mA
CNR= 0.01µF
C
OUT
= 2.2µF
TPS799xx
SBVS056I – JANUARY 2005 – REVISED NOVEMBER 2007
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (T
V
= VIN, C
EN
Typical values are at TJ= +25 ° C.
OUT
= 2.2 µ F, C
= 0.01 µ F, unless otherwise noted. For TPS79901, V
NR
GROUND PIN CURRENT vs TPS799285 GROUND PIN CURRENT vs
INPUT VOLTAGE JUNCTION TEMPERATURE
Figure 9. Figure 10.
= – 40 ° C to +125 ° C), V
J
= V
IN
OUT(TYP)
+ 0.3V or 2.7V, whichever is greater; I
= 3.0V.
OUT
= 1mA,
OUT
GROUND PIN CURRENT (DISABLED) vs TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
JUNCTION TEMPERATURE FREQUENCY (V
– V
IN
= 1.0V)
OUT
Figure 11. Figure 12.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (V
– V
IN
= 0.5V) FREQUENCY (V
OUT
– V
IN
= 0.25V)
OUT
6 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated
Figure 13. Figure 14.
90
80
70
60
50
40
30
20
10
0
10 100 1k 10k
Frequency (Hz)
PSRR (dB)
100k 1M 10M
I
OUT
= 1mA
I
OUT
= 200mA
CNR= 0.01µF
C
OUT
= 10.0µF
90
80
70
60
50
40
30
20
10
0
10 100 1k 10k
Frequency (Hz)
PSRR (dB)
100k 1M 10M
I
OUT
= 1mA
I
OUT
= 200mA
CNR= 0.01µF
C
OUT
= 10.0µF
90
80
70
60
50
40
30
20
10
0
10 100 1k 10k
Frequency (Hz)
PSRR (dB)
100k 1M 10M
I
OUT
= 200mA
CNR= None
C
OUT
= 10.0µF
I
OUT
= 1mA
90
80
70
60
50
40
30
20
10
0
PSRR (dB)
0.0 1.0 1.5 0.5 2.0 2.5
V
IN
−
V
OUT
(V)
3.0 3.5 4.0
0.1kHz
10kHz
1kHz
100kHz
1MHz
CNR= 0.01µF
C
OUT
= 2.2µF
90
80
70
60
50
40
30
20
10
0
0.0 1.0 1.5 0.5 2.0 2.5
V
IN
−
V
OUT
(V)
PSRR (dB)
3.0 3.5 4.0
0.1kHz
1kHz
10kHz
100kHz
1MHz
CNR= 0.01µF
C
OUT
= 2.2µF
90
80
70
60
50
40
30
20
10
0
0.0 1.0 1.5 0.5 2.0 2.5
V
IN
−
V
OUT
(V)
PSRR (dB)
3.0 3.5 4.0
0.1kHz
100kHz
1kHz
10kHz
1MHz
CNR= 0.01µF
C
OUT
= 2.2µF
Over operating temperature range (T
V
= VIN, C
EN
OUT
= 2.2 µ F, C
= 0.01 µ F, unless otherwise noted. For TPS79901, V
NR
Typical values are at TJ= +25 ° C.
TYPICAL CHARACTERISTICS (continued)
= – 40 ° C to +125 ° C), V
J
TPS799xx
SBVS056I – JANUARY 2005 – REVISED NOVEMBER 2007
= V
IN
OUT(TYP)
+ 0.3V or 2.7V, whichever is greater; I
= 3.0V.
OUT
= 1mA,
OUT
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (V
– V
IN
= 1.0V) FREQUENCY (V
OUT
– V
IN
= 0.25V)
OUT
Figure 15. Figure 16.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (V
– V
IN
= 1.0V) VIN– V
OUT
, I
OUT
= 1mA
OUT
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 7
Figure 17. Figure 18.
POWER-SUPPLY RIPPLE REJECTION vs POWER-SUPPLY RIPPLE REJECTION vs
VIN– V
, I
OUT
= 100mA VIN– V
OUT
Figure 19. Figure 20.
, I
OUT
= 200mA
OUT
200
180
160
140
120
100
80
60
40
20
0
0.01 0.1 1
C
NR
(nF)
10
I
OUT
= 1mA
C
OUT
= 2.2µF
Total Noise (
µ
Vrms)
35
30
25
20
15
10
5
0
0 5 10 15 20
C
OUT
(µF)
Total Noise (
µ
Vrms)
25
I
OUT
= 1mA
CNR= 0.01µF
20µs/div
20mV/div
20mV/div
1V/div
V
OUT
V
OUT
V
IN
I
OUT
= 150mA
dV
IN
dt
= 1V/µs
C
OUT
= 10µF
C
OUT
= 2.2µF
3.15V
4.15V
20 s/divm
100mV/div
100mV/div
100mA/div
V
OUT
V
OUT
I
OUT
C =2.2 F
OUT
m
C =10 F
OUT
m
V =3.35V
IN
150mA
1mA
10 s/divm
1V/div
4V/div
V
OUT
V
IN
0V
3.85V
R W
LOAD
=19
C =10 F
OUT
m
R W
LOAD
=19
C =2.2 F
OUT
m
10 s/divm
1V/div
5V/div
V
OUT
V
EN
R W
LOAD
=19
C =2.2 F
OUT
m
R W
LOAD
=19
C =10 F
OUT
m
V =3.85V
IN
TPS799xx
SBVS056I – JANUARY 2005 – REVISED NOVEMBER 2007
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (T
V
= VIN, C
EN
Typical values are at TJ= +25 ° C.
OUT
= 2.2 µ F, C
= 0.01 µ F, unless otherwise noted. For TPS79901, V
NR
TPS799285 TPS799285
TOTAL NOISE vs C
Figure 21. Figure 22.
= – 40 ° C to +125 ° C), V
J
NR
= V
IN
OUT(TYP)
+ 0.3V or 2.7V, whichever is greater; I
= 3.0V.
OUT
TOTAL NOISE vs C
OUT
= 1mA,
OUT
LINE TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE
TPS799285 TPS799285
Figure 23. Figure 24.
TPS799285
TURN-ON RESPONSE TPS799285
(V
= VIN) ENABLE RESPONSE
EN
8 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated
Figure 25. Figure 26.
50ms/div
Volts
7
6
5
4
3
2
1
0
−
1
V
IN
V
OUT
RL= 19
Ω
Over operating temperature range (T
V
= VIN, C
EN
OUT
= 2.2 µ F, C
= 0.01 µ F, unless otherwise noted. For TPS79901, V
NR
Typical values are at TJ= +25 ° C.
TYPICAL CHARACTERISTICS (continued)
= – 40 ° C to +125 ° C), V
J
TPS799xx
SBVS056I – JANUARY 2005 – REVISED NOVEMBER 2007
= V
IN
OUT(TYP)
+ 0.3V or 2.7V, whichever is greater; I
= 3.0V.
OUT
= 1mA,
OUT
POWER-UP/POWER-DOWN
TPS799285
Figure 27.
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 9
TPS79901
GND EN
FB
IN OUT
V
IN
V
OUT
R
1
C
FB
R
2
Optionalinputcapacitor.
Mayimprovesource
impedance,noise,orPSRR.
V =
OUT
´ 1.193
(R
1 2
+R )
R
2
V
EN
2.2 Fm
Ceramic
TPS799xx
GND EN NR
IN OUT
V
IN
V
OUT
Optional input capacitor.
May improve source
impedance, noise, or PSRR.
Optional bypass capacitor
to reduce output noise
and increase PSRR.
2.2mF
Ceramic
V
EN
TPS799xx
SBVS056I – JANUARY 2005 – REVISED NOVEMBER 2007
APPLICATION INFORMATION
The TPS799xx family of LDO regulators combines
the high performance required of many RF and
precision analog applications with ultra-low current
consumption. High PSRR is provided by a high gain,
high bandwidth error loop with good supply rejection
at very low headroom (V
– V
IN
). Fixed voltage
OUT
versions provide a noise reduction pin to bypass
noise generated by the bandgap reference and to
improve PSRR while a quick-start circuit fast-charges
this capacitor at startup. The combination of high
performance and low ground current also make the
TPS799xx an excellent choice for portable
applications. All versions have thermal and
over-current protection and are fully specified from
– 40 ° C to +125 ° C.
Figure 28 shows the basic circuit connections for
fixed voltage models. Figure 29 gives the connections
for the adjustable output version (TPS79901). R
R
can be calculated for any output voltage using the In most LDOs, the bandgap is the dominant noise
2
and
1
formula in Figure 29 . Sample resistor values for source. If a noise reduction capacitor (C
common output voltages are shown in Figure 29 . with the TPS799xx, the bandgap does not contribute
Input and Output Capacitor Requirements
Although an input capacitor is not required for
stability, it is good analog design practice to connect
a 0.1 µ F to 1 µ F low ESR capacitor across the input
supply near the regulator. This will counteract
reactive input sources and improve transient
response, noise rejection, and ripple rejection. A
higher-value capacitor may be necessary if large, fast
rise-time load transients are anticipated or the device
is located several inches from the power source. If
source impedance is not sufficiently low, a 0.1 µ F
input capacitor may be necessary to ensure stability.
The TPS799xx is designed to be stable with standard
ceramic capacitors of values 2.2 µ F or larger. X5R
and X7R type capacitors are best as they have
minimal variation in value and ESR over temperature.
Maximum ESR should be < 1.0 Ω . space
Feedback Capacitor Requirements
(TPS79901 only)
The feedback capacitor, C
required for stability. For a parallel combination of R
and R
equal to 250k Ω , any value from 3pF to 1nF
2
can be used. Fixed voltage versions have an internal
30pF feedback capacitor which is quick-charged at
start-up. The adjustable version does not have this
quick-charge circuit, so values below 5pF should be
used to ensure fast startup; values above 47pF can
be used to implement an output voltage soft-start.
Larger value capacitors also improve noise slightly.
The TPS79901 is stable in unity-gain configuration
(OUT tied to FB) without C
, shown in Figure 29 is
FB
.
FB
Output Noise
significantly to noise. Instead, noise is dominated by
the output resistor divider and the error amplifier
input. To minimize noise in a given application, use a
0.01 µ F noise reduction capacitor; for the adjustable
version, smaller value resistors in the output resistor
divider reduce noise. A parallel combination that
gives 2 µ A of divider current will have the same noise
performance as a fixed voltage version. To further
optimize noise, equivalent series resistance of the
output capacitor can be set to approximately 0.2 Ω .
This configuration maximizes phase margin in the
control loop, reducing total output noise by up to
10%.
space
space
space
1
) is used
NR
10 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated
Figure 28. Typical Application Circuit for
Fixed Voltage Versions
Figure 29. Typical Application Circuit for
Adjustable Voltage Version
V =xV
N OUT
10.5 Vm
RMS
V
TPS799xx
SBVS056I – JANUARY 2005 – REVISED NOVEMBER 2007
Noise can be referred to the feedback point (FB pin)
such that with C
= 0.01 µ F total noise is
NR
approximately given by Equation 1 :
The TPS79901 adjustable version does not have the
noise-reduction pin available, so ultra-low noise
operation is not possible. Noise can be minimized
according to the above recommendations.
Board Layout Recommendations to Improve
(1)
Startup
Fixed voltage versions of the TPS799xx use a
quick-start circuit to fast-charge the noise reduction
capacitor, C
Diagrams , Figure 1 ). This allows the combination of
very low output noise and fast start-up times. The NR
pin is high impedance so a low leakage C
must be used; most ceramic capacitors are
appropriate in this configuration.
Note that for fastest startup, V
first, then the enable pin (EN) driven high. If EN is
, if present (see Functional Block
NR
should be applied
IN
capacitor
NR
PSRR and Noise Performance tied to IN, startup will be somewhat slower. Refer to
To improve ac performance such as PSRR, output
noise, and transient response, it is recommended that
the board be designed with separate ground planes
for V
and V
IN
, with each ground plane connected
OUT
only at the GND pin of the device. In addition, the
ground connection for the bypass capacitor should
connect directly to the GND pin of the device.
Internal Current Limit
The TPS799xx internal current limit helps protect the
regulator during fault conditions. During current limit,
the output will source a fixed amount of current that is
largely independent of output voltage. For reliable
operation, the device should not be operated in
current limit for extended periods of time.
The PMOS pass element in the TPS799xx has a
built-in body diode that conducts current when the
voltage at OUT exceeds the voltage at IN. This
current is not limited, so if extended reverse voltage
operation is anticipated, external limiting may be
appropriate.
Shutdown
The enable pin (EN) is active high and is compatible
with standard and low voltage TTL-CMOS levels.
When shutdown capability is not required, EN can be
connected to IN.
Dropout Voltage
The TPS799xx uses a PMOS pass transistor to
achieve low dropout. When (V
the dropout voltage (V
), the PMOS pass device is
DO
in its linear region of operation and the input-to-output
resistance is the R
DS, ON
of the PMOS pass element.
Because the PMOS device behaves like a resistor in
dropout, V
will approximately scale with output
DO
current.
As with any linear regulator, PSRR and transient
response are degraded as (V
dropout. This effect is shown in Figure 18 through
Figure 20 in the Typical Characteristics section.
– V
IN
– V
IN
) is less than
OUT
) approaches
OUT
Figure 25 and Figure 26 in the Typical Characteristics
section. The quick-start switch is closed for
approximately 135 µ s. To ensure that C
is fully
NR
charged during the quick-start time, a 0.01 µ F or
smaller capacitor should be used.
Transient Response
As with any regulator, increasing the size of the
output capacitor will reduce over/undershoot
magnitude but increase duration of the transient
response. In the adjustable version, adding C
between OUT and FB will improve stability and
transient response. The transient response of the
TPS799xx is enhanced by an active pull-down that
engages when the output overshoots by
approximately 5% or more when the device is
enabled. When enabled, the pull-down device
behaves like a 350 Ω resistor to ground.
Under-Voltage Lock-Out (UVLO)
The TPS799xx utilizes an under-voltage lock-out
circuit to keep the output shut off until internal
circuitry is operating properly. The UVLO circuit has a
de-glitch feature so that it will typically ignore
undershoot transients on the input if they are less
than 50 µ s duration.
Minimum Load
The TPS799xx is stable and well-behaved with no
output load. To meet the specified accuracy, a
minimum load of 500 µ A is required. Below 500 µ A at
junction temperatures near +125 ° C, the output can
drift up enough to cause the output pull-down to turn
on. The output pull-down will limit voltage drift to 5%
typically but ground current could increase by
approximately 50 µ A. In typical applications, the
junction cannot reach high temperatures at light loads
since there is no appreciable dissipated power. The
specified ground current would then be valid at no
load in most applications.
FB
Copyright © 2005 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 11
P
D
+
ǒ
VIN*V
OUT
Ǔ
@ I
OUT
NOTES: A.Alllineardimensionsareinmillimeters.
B.Thisdrawingissubjecttochangewithoutnotice.
C.NanoStarä packageconfiguration.
NanoStarisatrademarkofTexasInstruments.
1,427
1,327
1,060
0,960
(d=0.30 0.05)±
0,625Max
TPS799xx
SBVS056I – JANUARY 2005 – REVISED NOVEMBER 2007
Thermal Information
Thermal Protection Power Dissipation
Thermal protection disables the output when the The ability to remove heat from the die is different for
junction temperature rises to approximately +165 ° C, each package type, presenting different
allowing the device to cool. When the junction considerations in the PCB layout. The PCB area
temperature cools to approximately +145 ° C the around the device that is free of other components
output circuitry is again enabled. Depending on power moves the head from the device to the ambient air.
dissipation, thermal resistance, and ambient Performance data for JEDEC low- and high-K boards
temperature, the thermal protection circuit may cycle are given in the Dissipation Ratings table. Using
on and off. This cycling limits the dissipation of the heavier copper will increase the effectiveness in
regulator, protecting it from damage due to removing heat from the device. The addition of plated
overheating. through-holes to heat-dissipating layers will also
Any tendency to activate the thermal protection circuit
indicates excessive power dissipation or an Power dissipation depends on input voltage and load
inadequate heatsink. For reliable operation, junction conditions. Power dissipation is equal to the product
temperature should be limited to +125 ° C maximum. of the output current time the voltage drop across the
To estimate the margin of safety in a complete design output pass element, as shown in Equation 2 :
(including heatsink), increase the ambient
temperature until the thermal protection is triggered;
use worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
+35 ° C above the maximum expected ambient
condition of your particular application. This
configuration produces a worst-case junction
temperature of +125 ° C at the highest expected
ambient temperature and worst-case load.
The internal protection circuitry of the TPS799xx has
been designed to protect against overload conditions.
It was not intended to replace proper heatsinking.
Continuously running the TPS799xx into thermal
shutdown will degrade device reliability.
improve the heatsink effectiveness.
Package Mounting
Solder pad footprint recommendations for the
TPS799xx are available from the Texas Instruments'
web site at www.ti.com .
(2)
12 Submit Documentation Feedback Copyright © 2005 – 2007, Texas Instruments Incorporated
Figure 30. YZU Wafer Chip-Scale Package Dimensions (in mm)
PACKAGE OPTION ADDENDUM
www.ti.com 12-May-2009
PACKAGING INFORMATION
Orderable Device Status
TPS79901DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
TPS79901DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
TPS79901DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
TPS79901DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
TPS79901DRVR ACTIVE SON DRV 6 3000 Green (RoHS &
TPS79901DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS &
TPS79901DRVT ACTIVE SON DRV 6 250 Green (RoHS &
TPS79901DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS &
TPS79901YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
TPS79901YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
TPS79912DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
TPS79912DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
TPS79912DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
TPS79912DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
TPS79912DRVR ACTIVE SON DRV 6 3000 Green (RoHS &
TPS79912DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS &
TPS79912DRVT ACTIVE SON DRV 6 250 Green (RoHS &
TPS79912DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS &
TPS79912YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
TPS79912YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
TPS79913DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
TPS79913DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
TPS79913DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
TPS79913DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
TPS79913YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 12-May-2009
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
TPS79913YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS79915DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS79915DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS79915DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79915DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79915YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
no Sb/Br)
TPS79915YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS799185DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS799185DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS799185DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS799185DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79918DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS79918DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS79918DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79918DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79918DRVR ACTIVE SON DRV 6 3000 Green (RoHS &
no Sb/Br)
TPS79918DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS &
no Sb/Br)
TPS79918DRVT ACTIVE SON DRV 6 250 Green (RoHS &
no Sb/Br)
TPS79918DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS &
no Sb/Br)
TPS79918YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
no Sb/Br)
TPS79918YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS799195DRVR ACTIVE SON DRV 6 3000 Green (RoHS &
no Sb/Br)
TPS799195DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS &
no Sb/Br)
TPS799195DRVT ACTIVE SON DRV 6 250 Green (RoHS &
no Sb/Br)
TPS799195DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS &
no Sb/Br)
TPS79919YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
no Sb/Br)
Lead/Ball Finish MSL Peak Temp
SNAGCU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
(3)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 12-May-2009
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
TPS79919YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS79920YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
no Sb/Br)
TPS79920YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS79921YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
no Sb/Br)
TPS79921YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS79925DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS79925DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS79925DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79925DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79925YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
no Sb/Br)
TPS79925YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS79926YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
no Sb/Br)
TPS79926YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS799275YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS &
no Sb/Br)
TPS799275YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS79927DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS79927DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS79927DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79927DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79927DRVR ACTIVE SON DRV 6 3000 Green (RoHS &
no Sb/Br)
TPS79927DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS &
no Sb/Br)
TPS79927DRVT ACTIVE SON DRV 6 250 Green (RoHS &
no Sb/Br)
TPS79927DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS &
no Sb/Br)
TPS79927YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
no Sb/Br)
TPS79927YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS799285DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish MSL Peak Temp
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
(3)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 12-May-2009
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
TPS799285DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS799285DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS799285DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS799285DRVR ACTIVE SON DRV 6 3000 Green (RoHS &
no Sb/Br)
TPS799285DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS &
no Sb/Br)
TPS799285DRVT ACTIVE SON DRV 6 250 Green (RoHS &
no Sb/Br)
TPS799285DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS &
no Sb/Br)
TPS799285YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS &
no Sb/Br)
TPS799285YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS79928DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS79928DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS79928DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79928DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79928DRVR ACTIVE SON DRV 6 3000 Green (RoHS &
no Sb/Br)
TPS79928DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS &
no Sb/Br)
TPS79928DRVT ACTIVE SON DRV 6 250 Green (RoHS &
no Sb/Br)
TPS79928DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS &
no Sb/Br)
TPS79928YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
no Sb/Br)
TPS79928YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS79930DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS79930DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
TPS79930DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79930DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
no Sb/Br)
TPS79930YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
no Sb/Br)
TPS79930YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
no Sb/Br)
TPS799315DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
(3)
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com 12-May-2009
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
TPS799315DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
(3)
no Sb/Br)
TPS799315DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS799315DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS799315YZUR ACTIVE DSBGA YZU 5 3000 Green (RoHS &
SNAGCU Level-1-260C-UNLIM
no Sb/Br)
TPS799315YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
SNAGCU Level-1-260C-UNLIM
no Sb/Br)
TPS79932YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
SNAGCU Level-1-260C-UNLIM
no Sb/Br)
TPS79932YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
SNAGCU Level-1-260C-UNLIM
no Sb/Br)
TPS79933DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79933DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79933DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79933DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79933DRVR ACTIVE SON DRV 6 3000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79933DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79933DRVT ACTIVE SON DRV 6 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79933DRVTG4 ACTIVE SON DRV 6 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79933YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
SNAGCU Level-1-260C-UNLIM
no Sb/Br)
TPS79933YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
SNAGCU Level-1-260C-UNLIM
no Sb/Br)
TPS79942DDCR ACTIVE SOT DDC 5 3000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79942DDCRG4 ACTIVE SOT DDC 5 3000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79942DDCT ACTIVE SOT DDC 5 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79942DDCTG4 ACTIVE SOT DDC 5 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79945YZUR ACTIVE DSBGA YZU 5 3000 Green(RoHS &
SNAGCU Level-1-260C-UNLIM
no Sb/Br)
TPS79945YZUT ACTIVE DSBGA YZU 5 250 Green (RoHS &
SNAGCU Level-1-260C-UNLIM
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com 12-May-2009
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS79901, TPS79918 :
Automotive: TPS79901-Q1 , TPS79918-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 6
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jun-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
TPS79901DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79901DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79901DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79901DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79901YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79901YZUR DSBGA YZU 5 3000 178.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79901YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79912DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79912DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79912DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79912DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79912YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79912YZUR DSBGA YZU 5 3000 178.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79912YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79913DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79913DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79913YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79913YZUR DSBGA YZU 5 3000 178.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jun-2009
Device Package
TPS79913YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79915DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79915DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79915YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79915YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS799185DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS799185DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79918DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79918DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79918DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79918DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79918YZUR DSBGA YZU 5 3000 178.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79918YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79918YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS799195DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS799195DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79919YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79919YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79920YZUR DSBGA YZU 5 3000 178.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79920YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79920YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79921YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79921YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79925DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79925DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79925YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79925YZUR DSBGA YZU 5 3000 178.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79925YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79926YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79926YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS799275YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS799275YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79927DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79927DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79927DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79927DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79927YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79927YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS799285DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS799285DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS799285DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS799285DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS799285YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jun-2009
Device Package
TPS799285YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79928DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79928DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79928DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79928DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79928YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79928YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79930DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79930DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79930YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79930YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS799315DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS799315DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS799315YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS799315YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79932YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79932YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79933DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79933DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79933DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79933DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS79933YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79933YZUR DSBGA YZU 5 3000 178.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79933YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79942DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79942DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS79945YZUR DSBGA YZU 5 3000 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79945YZUR DSBGA YZU 5 3000 178.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
TPS79945YZUT DSBGA YZU 5 250 180.0 8.4 1.09 1.42 0.81 4.0 8.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jun-2009
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS79901DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS79901DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS79901DRVR SON DRV 6 3000 195.0 200.0 45.0
TPS79901DRVT SON DRV 6 250 195.0 200.0 45.0
TPS79901YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79901YZUR DSBGA YZU 5 3000 217.0 193.0 35.0
TPS79901YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79912DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS79912DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS79912DRVR SON DRV 6 3000 195.0 200.0 45.0
TPS79912DRVT SON DRV 6 250 195.0 200.0 45.0
TPS79912YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79912YZUR DSBGA YZU 5 3000 217.0 193.0 35.0
TPS79912YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79913DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS79913DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS79913YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79913YZUR DSBGA YZU 5 3000 217.0 193.0 35.0
TPS79913YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79915DDCR SOT DDC 5 3000 195.0 200.0 45.0
Pack Materials-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jun-2009
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS79915DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS79915YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79915YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS799185DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS799185DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS79918DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS79918DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS79918DRVR SON DRV 6 3000 195.0 200.0 45.0
TPS79918DRVT SON DRV 6 250 195.0 200.0 45.0
TPS79918YZUR DSBGA YZU 5 3000 217.0 193.0 35.0
TPS79918YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79918YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS799195DRVR SON DRV 6 3000 195.0 200.0 45.0
TPS799195DRVT SON DRV 6 250 195.0 200.0 45.0
TPS79919YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79919YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79920YZUR DSBGA YZU 5 3000 217.0 193.0 35.0
TPS79920YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79920YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79921YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79921YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79925DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS79925DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS79925YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79925YZUR DSBGA YZU 5 3000 217.0 193.0 35.0
TPS79925YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79926YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79926YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS799275YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS799275YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79927DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS79927DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS79927DRVR SON DRV 6 3000 195.0 200.0 45.0
TPS79927DRVT SON DRV 6 250 195.0 200.0 45.0
TPS79927YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79927YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS799285DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS799285DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS799285DRVR SON DRV 6 3000 195.0 200.0 45.0
TPS799285DRVT SON DRV 6 250 195.0 200.0 45.0
TPS799285YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS799285YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79928DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS79928DDCT SOT DDC 5 250 195.0 200.0 45.0
Pack Materials-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jun-2009
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS79928DRVR SON DRV 6 3000 195.0 200.0 45.0
TPS79928DRVT SON DRV 6 250 195.0 200.0 45.0
TPS79928YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79928YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79930DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS79930DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS79930YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79930YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS799315DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS799315DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS799315YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS799315YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79932YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79932YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79933DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS79933DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS79933DRVR SON DRV 6 3000 195.0 200.0 45.0
TPS79933DRVT SON DRV 6 250 195.0 200.0 45.0
TPS79933YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79933YZUR DSBGA YZU 5 3000 217.0 193.0 35.0
TPS79933YZUT DSBGA YZU 5 250 190.5 212.7 31.8
TPS79942DDCR SOT DDC 5 3000 195.0 200.0 45.0
TPS79942DDCT SOT DDC 5 250 195.0 200.0 45.0
TPS79945YZUR DSBGA YZU 5 3000 190.5 212.7 31.8
TPS79945YZUR DSBGA YZU 5 3000 217.0 193.0 35.0
TPS79945YZUT DSBGA YZU 5 250 190.5 212.7 31.8
Pack Materials-Page 6
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