TPS763 Low-Power, 150-mA, Low-Dropout Linear Regulator
TPS763
1Features
1
•150-mA, low-dropout regulator
•Output voltage: 5 V, 3.8 V, 3.3 V, 3 V, 2.8 V,
2.7 V, 2.5 V, 1.8 V, 1.6 V, and variable
•Dropout voltage, typically 300 mV at 150 mA
•Thermal protection
•Overcurrent limitation
•Less than 2-µA quiescent current in shutdown
mode
•–40°C to 125°C operating junction temperature
range
•5-pin SOT-23 (DBV) package
2Applications
•Electricity meters
•Solar inverters
•HVAC systems
•Servo drives and motion control
•Sensor transmitters
TPS76350 Load Transient Response
3Description
The TPS763xx family of low-dropout (LDO) voltage
regulators offers the benefits of low-dropout voltage,
low-power operation, and miniaturized packaging.
These regulators feature low dropout voltages and
quiescent currents compared to conventional LDO
regulators.Offeredina5-pin,smalloutline
integrated-circuit SOT-23 package, the TPS763xx
series devices are ideal for cost-sensitive designs
and for applications where board space is at a
premium.
A combination of new circuit design and process
innovation has enabled the usual pnp pass transistor
to be replaced by a PMOS pass element. Because
the PMOS pass element behaves as a low-value
resistor, the dropout voltage is low—typically 300 mV
at 150 mA of load current (TPS76333)—and is
directly proportional to the load current. Because the
PMOS pass element is a voltage-driven device, the
quiescent current is low (140 µA maximum) and is
stable over the entire range of output load current
(0 mA to 150 mA). Intended for use in portable
systems such as laptops and cellular phones, the
low-dropout voltage feature and low-power operation
result in a significant increase in system battery
operating life.
The TPS763xx also features a logic-enabled sleep
mode to shut down the regulator, reducing quiescent
current to 1 µA maximum at TJ= 25°C.The
TPS763xx is offered in 1.6-V ,1.8-V, 2.5-V, 2.7-V,
2.8-V, 3-V, 3.3-V, 3.8-V, and 5-V fixed-voltage
versions and in a variable version (programmable
over the range of 1.5 V to 6.5 V).
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Device Information
PART NUMBERPACKAGEBODY SIZE (NOM)
TPS763xxSOT-23 (5)2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
Changes from Revision H (January 2004) to Revision IPage
•Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
•Deleted Legacy Applications and Non-Ceramic Capacitor Stability from Applications ......................................................... 1
•Added Electricity Meters, Solar Inverters, HVAC Systems, Servo Drives and Motion Control, and Sensor
Transmitters to Applications ................................................................................................................................................... 1
1INIInput supply voltage
2GND—Ground
3ENIEnable input
4NC/FB—/INo connection (fixed-voltage option only) or feedback voltage (TPS76301 only)
5OUTORegulated output voltage
I/ODESCRIPTION
6Specifications
TPS763
7Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Input voltage–0.310V
Voltage at EN–0.3VI+ 0.3V
Voltage on OUT, FB7V
Peak output currentInternally limited
Operating junction temperature, T
Storage temperature, T
stg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under RecommendedOperating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
J
(1)
MINMAXUNIT
–40150°C
–65150°C
8ESD Ratings
VALUEUNIT
V
Electrostatic discharge
(ESD)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
Charged-device model (CDM), per JEDEC specification JESD22-C101
(1)
(2)
±2000
±250
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
9Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MINMAXUNIT
V
I
I
O
T
J
Input voltage
Continuous output current0150mA
Operating junction temperature–40125°C
(1) To calculate the minimum input voltage for your maximum output current, use the following equation: V
IO= 1 mA to 100 mA2.4252.52.575
IO= 1 mA to 150 mA, TJ= 25°C2.4382.52.562
IO= 1 mA to 150 mA2.4072.52.593
IO= 1 mA to 100 mA, TJ= 25°C2.6462.72.754
IO= 1 mA to 100 mA2.6192.72.781
IO= 1 mA to 150 mA, TJ= 25°C2.6322.72.767
IO= 1 mA to 150 mA2.5992.72.801
IO= 1 mA to 100 mA, TJ= 25°C2.7442.82.856
IO= 1 mA to 100 mA2.7162.82.884
IO= 1 mA to 150 mA, TJ= 25°C2.732.82.87
IO= 1 mA to 150 mA2.6952.82.905
IO= 1 mA to 100 mA, TJ= 25°C2.9433.06
IO= 1 mA to 100 mA2.9133.09
IO= 1 mA to 150 mA, TJ= 25°C2.92533.075
IO= 1 mA to 150 mA2.88833.112
IO= 1 mA to 100 mA, TJ= 25°C3.2343.33.366
IO= 1 mA to 100 mA3.2013.33.399
IO= 1 mA to 150 mA, TJ= 25°C3.2183.33.382
IO= 1 mA to 150 mA3.1773.33.423
IO= 1 mA to 100 mA, TJ= 25°C3.7243.83.876
IO= 1 mA to 100 mA3.7053.83.895
IO= 1 mA to 150 mA, TJ= 25°C3.6863.83.914
IO= 1 mA to 150 mA3.6673.83.933
IO= 1 mA to 100 mA, TJ= 25°C4.87555.125
IO= 1 mA to 100 mA4.82555.175
IO= 1 mA to 150 mA, TJ= 25°C4.8555.15
IO= 1 mA to 150 mA4.855.2
(1)
(2)
(2)
(3)
+ 1 V, IO= 1 mA, EN = IN, and CO= 4.7 µF (unless
O(typ)
85100
(2)
140µV
60dB
0.50.81.5A
1.42V
0.51.2V
140
V
µA
µA
V
(1) Minimum IN operating voltage is 2.7 V or V
(2) Test conditions includes output voltage VO= 0 V (for variable device FB is shorted to VO), and pulse duration = 10 mS.
The TPS763xx devices uses a PMOS pass element to dramatically reduce both dropout voltage and supply
current over more conventional PNP pass element LDO designs. The PMOS pass element is a voltagecontrolled device that, unlike a PNP transistor, does not require increased drive current as output current
increases. Supply current in the TPS763xx is essentially constant from no-load to maximum load.
Current limiting and thermal protection prevent damage by excessive output current and/or power dissipation.
The device switches into a constant-current mode at approximately 1 A; further load reduces the output voltage
instead of increasing the output current. The thermal protection shuts the regulator off if the junction temperature
rises above 165°C. Recovery is automatic when the junction temperature drops approximately 25°C below the
high temperature trip point. The PMOS pass element includes a back diode that safely conducts reverse current
when the input voltage level drops below the output voltage level.
A logic low on the enable input, EN shuts off the output and reduces the supply current to less than 2 µA. EN
must be tied high in applications where the shutdown feature is not used.
12.2Functional Block Diagram
12.3Feature Description
12.3.1 Regulator Protection
The TPS763xx features internal current limiting and thermal protection. During normal operation, the TPS763xx
limits output current to approximately 800 mA. When current limiting engages, the output voltage scales back
linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure,
take care not to exceed the power dissipation ratings of the package. If the temperature of the device exceeds
165°C, thermal-protection circuitry shuts it down. Once the device has cooled down to below 140°C, regulator
operation resumes.
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
13.1Application Information
The TPS763xx low-dropout (LDO) regulators are part of a family of regulators which have been optimized for use
in battery-operated equipment and feature extremely low dropout voltages, low quiescent current (140 µA), and
an enable input to reduce supply currents to less than 2 µA when the regulator is turned off.
13.2Typical Application
Figure 20. Typical Application Circuit
13.2.1 Design Requirements
Although not required, TI recommends a 0.047-µF or larger ceramic bypass input capacitor, connected between
IN and GND and placed close to the TPS763xx, to improve transient response and noise rejection. A highervalue electrolytic input capacitor may be necessary if large, fast-rise-time load transients are anticipated and the
device is placed several inches from the power source. Follow the programming guidelines from Table 2.
Like all low dropout regulators, the TPS763xx requires an output capacitor connected between OUT and GND to
stabilize the internal loop control. The minimum recommended capacitance value is 4.7 µF and the ESR
(equivalent series resistance) must be between 0.3 Ω and 10 Ω. Capacitor values 4.7 µF or larger are
acceptable, provided the ESR is less than 10 Ω. Solid tantalum electrolytic, aluminum electrolytic, and multilayer
ceramic capacitors are all suitable, provided they meet the requirements described above. Most of the
commercially available 4.7 µF surface-mount solid tantalum capacitors, including devices from Sprague, Kemet,
and Nichico, meet the ESR requirements stated above (see Table 3).
The output voltage of the TPS76301 adjustable regulator is programmed using an external resistor divider as
shown in Figure 21. The output voltage is calculated using Equation 1.
where
•Vref = 1.192 V typical (the internal reference voltage)
•0.995 is a constant used to center the load regulator (1%)(1)
Resistors R1 and R2 must be chosen for approximately 7-µA divider current. Lower value resistors can be used
but offer no inherent advantage and waste more power. Higher values must be avoided as leakage currents at
FB increase the output voltage error. TI recommends choosing a design procedure of R2 = 169 kΩ to set the
divider current at 7 µA and then calculate R1 using Equation 2.
The TPS763xx pass element has a built-in back diode that safely conducts reverse currents when the input
voltage drops below the output voltage (for example, during power down). Current is conducted from the output
to the input and is not internally limited. If extended reverse voltage is anticipated, external limiting might be
appropriate.
13.2.3 Application Curves
Figure 22. Compensation Series Resistance (CSR)
vs Output Current
Figure 23. Compensation Series Resistance (CSR) vs
Specified regulator operation is assured to a junction temperature of 125°C; the maximum junction temperature
allowable to avoid damaging the device is 150°C. This restriction limits the power dissipation the regulator can
handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the
maximum allowable dissipation, P
P
.
D(max)
The maximum-power-dissipation limit is determined using Equation 3.
where
•TJmax is the maximum allowable junction temperature
•R
is the thermal resistance junction-to-ambient for the package, see Thermal Information
θJA
•TAis the ambient temperature(3)
The regulator dissipation is calculating using Equation 4.
Power dissipation resulting from quiescent current is negligible.
, and the actual dissipation, PD, which must be less than or equal to
D(max)
(4)
15Layout
15.1Layout Guidelines
•Place input and output capacitors as close to the device as possible.
•Use copper planes for device connections to optimize thermal performance.
•Place thermal vias around the device to distribute the heat.
16.1Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
16.2Community Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
16.3Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
16.4Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
16.5Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
17Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
TPS76301DBVRACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PAZI
TPS76301DBVRG4ACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PAZI
TPS76301DBVTACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PAZI
TPS76316DBVRACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBHI
TPS76316DBVRG4ACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBHI
TPS76316DBVTACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBHI
TPS76318DBVRACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBAI
TPS76318DBVRG4ACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBAI
TPS76318DBVTACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBAI
TPS76318DBVTG4ACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBAI
TPS76325DBVRACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBBI
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C)Device Marking
10-Dec-2020
Samples
(4/5)
TPS76325DBVRG4ACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBBI
TPS76325DBVTACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBBI
TPS76327DBVRACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBCI
TPS76327DBVTACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBCI
TPS76327DBVTG4ACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBCI
TPS76328DBVRACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBDI
TPS76328DBVTACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBDI
TPS76330DBVRACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBII
TPS76330DBVTACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBII
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable DeviceStatus
TPS76333DBVRACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBEI
TPS76333DBVRG4ACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBEI
TPS76333DBVTACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBEI
TPS76333DBVTG4ACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBEI
TPS76338DBVRACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBFI
TPS76338DBVTACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBFI
TPS76350DBVRACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBGI
TPS76350DBVRG4ACTIVESOT-23DBV53000RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBGI
TPS76350DBVTACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBGI
TPS76350DBVTG4ACTIVESOT-23DBV5250RoHS & GreenNIPDAULevel-1-260C-UNLIM-40 to 125PBGI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C)Device Marking
10-Dec-2020
(4/5)
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Samples
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
10-Dec-2020
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS763 :
Automotive: TPS763-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
2X (0.95)
(R0.05) TYP
SOLDER MASK
OPENING
5X (0.6)
5X (1.1)
PKG
1
2
3
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
METAL
METAL UNDER
SOLDER MASK
5
SYMM
(1.9)
4
SOLDER MASK
OPENING
EXPOSED METAL
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED METAL
0.07 MIN
ARROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
4214839/E 09/2019
www.ti.com
5X (0.6)
2X(0.95)
1
2
EXAMPLE STENCIL DESIGN
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
5
SYMM
(1.9)
(R0.05) TYP
3
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
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