IN1
IN2
IN3
EN1
SS1
EN2
SS2
EN3
IS1
SW 1
FB1
IS2
SW 2
FB2
OUT 3
FB3
DGN D
3A
BUC K1
3A
BUC K2
300mA
LDO
SS3
DGND
AGN D
DGND
TPS75003
+
+
V
CCAUX
2.5V @ 300m A
V
CCO
3.3V @ 3A
V
CCINT
1.2V @ 3A
V
CCAUX
5V_Input
Triple-Supply Power Management IC
for Powering FPGAs and DSPs
FEATURES DESCRIPTION
• Two 95% Efficient, 3A Buck Controllers and
One 300mA LDO
• Tested and Endorsed by Xilinx for Powering
the Spartan™-3, Spartan-3E and Spartan-3L
FPGAs
• Adjustable (1.2V to 6.5V for Bucks, 1.0V to
6.5V for LDO) Output Voltages on All
Channels
• Input Voltage Range: 2.2V to 6.5V
• Independent Soft-Start for Each Supply
• Independent Enable for Each Supply for
Flexible Sequencing
• LDO Stable with 2.2µF Ceramic Output Cap
• Small, Low-Profile 4.5mm x 3.5mm x 0.9mm
QFN Package
APPLICATIONS
• FPGA/DSP/ASIC Supplies
• Set-Top Boxes
• DSL Modems
• Plasma TV Display Panels
TPS75003
SBVS052D – OCTOBER 2004 – REVISED MARCH 2005
The TPS75003 is a complete power management
solution for FPGA, DSP and other multi-supply applications. The device has been tested with and meets
all of the Xilinx Spartan-3, Spartan-3E and
Spartan-3L start-up profile requirements, including
monotonic voltage ramp and minimum voltage rail
rise time. Independent Enables for each output allow
sequencing to minimize demand on the power supply
at start-up. Soft-start on each supply limits inrush
current during start-up. Two integrated buck controllers allow efficient, cost-effective voltage conversion
for both low and high current supplies such as core
and I/O. A 300mA LDO is integrated to provide an
auxiliary rail such as V
FPGA. All three supply voltages are offered in
user-programmable options for maximum flexibility.
The TPS75003 is fully specified from -40 ° C to +85 ° C
and is offered in a QFN package, yielding a highly
compact total solution size with high power dissipation capability.
on the Xilinx Spartan-3
CCAUX
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Spartan is a trademark of Xilinx, Inc.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated
TPS75003
SBVS052D – OCTOBER 2004 – REVISED MARCH 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION
PRODUCT V
(1)
OUT
Buck1: Adjustable
TPS75003 Buck2: Adjustable
LDO: Adjustable
(1) For the most current specifications and package information, see the Package Option Addendum located at the end of this document, or
see the TI website at www.ti.com .
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
V
range (IN1, IN2, IN3) -0.3 to +7.0 V
INX
V
range (EN1, EN2, EN3) -0.3 to V
ENX
V
range (SW1, SW2, SW3) -0.3 to V
SWX
V
range (IS1, IS2, IS3) -0.3 to V
ISX
V
range -0.3 to +7.0 V
OUT3
V
range (SS1, SS2, SS3) -0.3 to V
SSX
V
range (FB1, FB2, FB3) -0.3 to +3.3 V
FBX
Peak LDO output current (I
Continuous total power dissipation See Dissipation Ratings Table —
Junction temperature range, T
Storage temperature range -65 to +150 ° C
ESD rating, HBM 1 kV
ESD rating, CDM 500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
) Internally limited —
OUT3
J
(1)
TPS75003 UNIT
+0.3 V
INX
+0.3 V
INX
+0.3 V
INX
+0.3 V
INX
-55 to +150 ° C
DISSIPATION RATINGS
BOARD R
Reference
(1)
Layout
Θ JA
44 22.7mW/ ° C 2.27W 1.25W 0.91W
(1) Refer to PCB Layout section. Internal power dissipation limits are determined by LDO operation: P
2
DERATING FACTOR TA≤ 25 ° C TA= 70 ° C TA= 85 ° C
ABOVE TA= 25 ° C POWER RATING POWER RATING POWER RATING
= (V
– V
) x I
DISS
IN3
OUT3
.
OUT3
ELECTRICAL CHARACTERISTICS
V
= V
, V
= V
, V
= V
, V
= V
EN1
IN1
EN2
IN2
EN3
IN3
IN1
IN2
= 2.2V, V
TA= -40 ° C to +85 ° C, unless otherwise noted. Typical values are at TA= 25 ° C.
PARAMETER CONDITIONS MIN TYP MAX UNIT
Supply and Logic
V
INX
I
Q
I
SHDN
V
IH1, 2
V
IH3
V
ILX
I
ENX
Buck Controllers 1 and 2
V
OUT1,2
V
FB1,2
I
FB1,2
V
IS1,2
I
IS1,2
∆ V
/ ∆ V
OUT%
∆ V
/ ∆ I
OUT%
n
1,2
t
STR1,2
R
DS,ON1,2
I
SW1,2
t
ON
t
OFF
(1) To be in regulation, minimum V
components. Minimum V
(2) Maximum V
(3) Depends on external components.
Input Voltage Range (IN1, IN2,
(1)
IN3)
Quiescent Current, IQ= I
I
AGND
Shutdown Supply Current V
+
DGND
I
OUT1
EN1
Enable High, enabled
(EN1, EN2)
Enable High, enabled (EN3) 1.14 V
Enable Low, shutdown
(EN1, EN2, EN3)
Enable pin current (EN1, EN2,
EN3)
Adjustable Output Voltage
(2)
Range
Feedback Voltage (FB1, FB2) 1.220 V
Feedback Voltage Accuracy
(1)
(FB1, FB2)
Current into FB1, FB2 pins 0.01 0.5 µA
Reference Voltage for Current
Sense
Current into IS1, IS2 Pins 0.01 0.5 µA
Line Regulation
IN
Load Regulation 0.6 % / A
OUT
Efficiency
Startup Time
(1)
(3)
(3)
Gate Driver P-Channel and V
N-Channel MOSFET Ω
On-Resistance
Measured with the circuit in Figure 1 ,
V
OUT
Measured with the circuit in Figure 1 ,
30mA ≤ I
Measured with the circuit in Figure 1 ,
I
OUT
Measured with the circuit in Figure 1 ,
RL= 6 Ω , C
IN1,2
V
IN1,2
Gate Driver P-Channel and
N-Channel MOSFET Drive Current
Minimum On Time 1.36 1.55 1.84 µs
Minimum Off Time 0.44 0.65 0.86 µs
(or V
IN1
= V
IN3
is dependent on external components and will be less than VIN.
OUT
OUT3
) must be greater than V
IN2
+ V
or 2.2V, whichever is greater.
DO
= 3.0V, V
IN3
= I
= 0mA, I
OUT2
= V
= V
EN2
OUT3
OUT3
= 0V 0.05 3.0 µA
EN3
+ 0.5V ≤ VIN≤ 6.5V
≤ 2A
OUT
= 1A
= 100µF, C
OUT
> 2.5V 4
= 2.2V 6
OUT1,NOM
TPS75003
SBVS052D – OCTOBER 2004 – REVISED MARCH 2005
= 2.5V, C
= 1mA 75 150 µA
= 2.2nF
SS
(or V
OUT2,NOM
= C
OUT1
OUT2
= 47µF, C
2.2 6.5 V
1.4 V
0 0.3 V
0.01 0.5 µA
V
FBX
-2 +2 %
80 100 120 mV
0.1 % / V
94 %
5 ms
100 mA
) by an amount determined by external
= 2.2µF,
OUT3
INX
IN3
V
INX
V
V
V
3
TPS75003
SBVS052D – OCTOBER 2004 – REVISED MARCH 2005
ELECTRICAL CHARACTERISTICS (continued)
V
= V
, V
= V
, V
= V
, V
= V
EN1
IN1
EN2
IN2
EN3
IN3
IN1
IN2
= 2.2V, V
TA= -40 ° C to +85 ° C, unless otherwise noted. Typical values are at TA= 25 ° C.
PARAMETER CONDITIONS MIN TYP MAX UNIT
LDO
V
OUT3
V
FB3
∆ V
/ ∆ V
OUT%
∆ V
/ ∆ I
OUT%
V
DO
I
CL3
I
FB3
V
n
t
SD
UVLO
Output Voltage Range 1.0 6.5 - V
Feedback Pin Voltage 0.507 V
2.95V ≤ V
Feedback Pin Voltage Accuracy
Line Regulation
IN
Load Regulation 10mA ≤ I
OUT
Dropout Voltage
(V
= V
IN
(4)
(5)
OUT(NOM)
- 0.1)
Current Limit V
(4)
1mA ≤ I
V
OUT3
I
OUT3
OUT
Current into FB3 pin 0.03 0.1 µA
Output Noise 400 µV
Thermal Shutdown Temperature
for LDO
BW = 100Hz - 100kHz,
I
OUT3
Shutdown, Temp Increasing 175
Reset, Temp Decreasing 160
Under-Voltage Lockout Threshold VINRising 1.80 V
Under-Voltage Lockout Hysteresis VINFalling 100 mV
= 3.0V, V
IN3
≤ 6.5V
IN3
≤ 300mA
OUT3
+ 0.5V ≤ V
≤ 300mA 0.01 % / mA
OUT3
OUT3
≤ 6.5V 0.075 % / V
IN3
= 300mA 250 350 mV
= 0.9 x V
OUT(NOM)
= 300mA
= 2.5V, C
= C
OUT1
OUT2
= 47µF, C
-4.0 +4.0 %
375 600 1000 mA
= 2.2µF,
OUT3
DO
V
RMS
° C
(4) To be in regulation, minimum V
components. Minimum V
(5) V
does not apply when V
DO
IN3
(or V
IN1
= V
OUT3
+ V
OUT
) must be greater than V
IN2
+ V
or 2.2V, whichever is greater.
DO
< 2.2V.
DO
OUT1,NOM
(or V
OUT2,NOM
) by an amount determined by external
4
V
RE F1
Soft
Start
Control
Switch
Control
V
IS1
IS1
SW1
FB1
EN1
SS1
IN1
≤
3A Buck Controller
DGND
V
RE F2
Soft
Start
Control
Switch
Control
V
IS2
IS2
SW2
FB2
EN2
SS2
IN2
≤
3A Buck Controller
DGND
FB3
OUT3IN3
EN3
SS3
Thermal/
Current
Limit
300mA LDO
V
REF 3
AGND
TPS75003
TPS75003
SBVS052D – OCTOBER 2004 – REVISED MARCH 2005
DEVICE INFORMATION
Functional Block Diagram
5
IN3
OUT3
FB1
FB2
20
1
11
10
DGND
SS3
AGND
EN1
SS1
DGND
SW1
IN1
IS1
19
18
17
16
15
14
13
12
FB3
EN3
EN2
SS2
DGND
SW2
IN2
IS2
2
3
4
5
6
7
8
9
RHL PACKAGE
4.5mm x 3.5mm QFN
(TOP VIEW)
TPS75003
SBVS052D – OCTOBER 2004 – REVISED MARCH 2005
DEVICE INFORMATION (continued)
TERMINAL
NAME RHL
DGND 6, 15, PAD
AGND 18 Ground connection for LDO.
IN1 13 Input supply to BUCK1.
IN2 8 Input supply to BUCK2.
IN3 20 Input supply to LDO.
EN1 17
EN2 4 Same as EN1 but for BUCK2 controller.
EN3 3 Same as EN1 but for LDO.
SS1 16 slowing the ramp-up of current limit. This high-impedance pin is noise-sensitive; careful layout is
SS2 5 Same as SS1 but for BUCK2 regulator.
SS3 19
IS1 12 to an internal reference to set current limit. For a robust output start-up ramp, careful layout and
IS2 9 Same as IS1 but compared to IN2 and used for BUCK2 controller.
SW1 14 Gate drive pin for external BUCK1 P-channel MOSFET.
SW2 7 Same as SW1 but for BUCK2 controller.
FB1 11 Feedback pin. Used to set the output voltage of BUCK1 regulator.
FB2 10 Same as FB1 but for BUCK2 controller.
FB3 2 Same as FB1 but for LDO.
OUT3 1
TERMINAL FUNCTIONS
DESCRIPTION
Ground connection for BUCK1 and BUCK2 converters. Pins 6 and 15 should be connected to the back
side exposed pad by a short metal trace as shown in the PCB Layout section of this data sheet.
Driving the enable pin (ENx) high turns on BUCK1 regulator. Driving this pin low puts it into shutdown
mode, reducing operating current. The enable pin does not trigger on fast negative going transients.
Connecting a capacitor between this pin and ground increases start-up time of the BUCK1 regulator by
important. See Typical Characteristics, Applications and PCB Layout sections for details.
Connecting a capacitor from this pin to ground slows the start-up time of the LDO reference, therby
slowing output voltage ramp-up. See Applications section for details.
Current sense input for BUCK1 regulator. The voltage difference between this pin and IN1 is compared
bypassing are required. See Applications section for details.
Regulated LDO output. A small ceramic capacitor ( ≥ 2.2µF) is needed from this pin to ground to ensure
stability.
6
L1
5µH
Sumida
CDRH6D38−5R0
IN3
OUT3
FB1
FB2
20
1
11
10
DGND
SS3
AGND
EN1
SS1
DGND
SW1
IN1
IS1
19
18
17
16
15
14
13
12
FB3
EN3
EN2
SS2
DGND
SW2
IN2
IS2
2
3
4
5
6
7
8
9
R3
61.9k
Ω
R4
15.4k
Ω
EN3
EN2
V
IN
EN1
V
IN
1.5nF
1.5nF
0.01µF
R1
33m
Ω
10pF
100µF
Tantalum
100µF
Tantalum
Siliconix
Si2323DS
Siliconix
Si2323DS
Q2
L2
15µH
Sumida
CDRH8D43−150
V
CCINT
1.2V, 2A
Vishay
SS32
D2
0.1µF
1µF
V
CCAUX
2.5V, 300mA
10µF
0.1µF
R5
61.9k
Ω
ON Semiconductor
MBRM120
R6
36.5k
Ω
V
CCO
3.3V, 2A
R2
33m
Ω
100µF
V
IN
Q1
SBVS052D – OCTOBER 2004 – REVISED MARCH 2005
Typical Application Circuit for Powering the Xilinx Spartan-3 FPGA
TPS75003
Figure 1.
7
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
I
OUT
(A)
VIN= 3.3V
V
OUT
= 1.2V
TA= +85C
TA=−40C
TA= +25C
5
4
3
2
1
0
−
1
−
2
−
3
−
4
−
5
∆ V
OUT
(%)
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
I
OUT
(A)
VIN= 5V
V
OUT
= 3.3V
5
4
3
2
1
0
−
1
−
2
−
3
−
4
−
5
∆
V
OUT
(%)
TA= +85C
TA=−40C
TA= +25C
3.0
V
IN
(V)
5
4
3
2
1
0
−
1
−
2
−
3
−
4
−
5
∆
V
OUT
(
%)
V
OUT
= 3.3V
I
OUT
= 2A
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
TA= +85C
TA= +25C
TA=−40C
2.0
V
IN
(V)
5
4
3
2
1
0
−
1
−
2
−
3
−
4
−
5
∆
V
OUT
(
%)
V
OUT
= 1.2V
I
OUT
= 2A
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
TA=−40C
TA= +25C
TA= +85C
0 0.5 1.0 1.5 2.0 2.5 3.0
500
400
300
200
100
0
Switching F
requency(kHz)
I
OUT
(A)
V
OUT
= 1.2V
VIN= 3.3V
VIN= 5.0V
−
40C
+25C
+85C
600
500
400
300
200
100
0
Switching Frequency (kHz)
0.01 0.1 1.0 10
I
OUT
(A)
VIN= 5.0V
V
OUT
= 1.2V
VIN= 3.3V
V
OUT
= 1.2V
VIN= 5.0V
V
OUT
= 3.3V
V
OUT
= 1.2V
VIN= 2.2V
TPS75003
SBVS052D – OCTOBER 2004 – REVISED MARCH 2005
Buck Converter
BUCK LOAD REGULATION BUCK LOAD REGULATION
Figure 2. Figure 3.
TYPICAL CHARACTERISTICS
Measured using circuit in Figure 1
BUCK LINE REGULATION BUCK LINE REGULATION
Figure 4. Figure 5.
BUCK SWITCHING FREQUENCY vs I
, T
OUT
A
BUCK SWITCHING FREQUENCY vs I
OUT
8
Figure 6. Figure 7.