TEXAS INSTRUMENTS TPS735xx Technical data

Download

DRBPACKAGE

3mmx3mmSON

(TOPVIEW)

OUT

N/C

NR/FB

GND

N/C

GND

DRVPACKAGE

2mmx2mmSON

N/C

OUT

NR/FB

GND

(TOPVIEW)

查询"TPS73512"供应商

TPS735xx

www.ti.com

500mA, Low Quiescent Current, Ultra-Low Noise, High PSRR

Low Dropout Linear Regulator

FEATURES

• 500mA Low Dropout Regulator with EN

• Low IQ: 46μA

• Multiple Output Voltage Versions Available: – Fixed Outputs of 1.0V to 4.3V Using

Innovative Factory EEPROM Programming

– Adjustable Outputs from 1.25V to 6.0V

• High PSRR: 60dB at 1kHz

• Ultra-low Noise: 28μV

• Fast Start-Up Time: 45μs

• Stable with a Low-ESR, 2.0μF Typical Output Capacitance

• Excellent Load/Line Transient Response

• 2% Overall Accuracy (Load/Line/Temp, V

> 2.2V)

OUT

• Very Low Dropout: 280mV at 500mA

• 2mm × 2mm SON-6 and 3mm × 3mm SON-8 Packages

RMS

SBVS087H –JUNE 2008–REVISED NOVEMBER 2009

DESCRIPTION

The TPS735xx family of low-dropout (LDO), low-power linear regulators offers excellent ac performance with very low ground current. High power-supply rejection ratio (PSRR), low noise, fast start-up, and excellent line and load transient response are provided while consuming a very low 46μA (typical) ground current. The TPS735xx is stable with ceramic capacitors and uses an advanced BiCMOS fabrication process to yield a typical dropout voltage of 250mV at 500mA output. The TPS735xx uses a precision voltage reference and feedback loop to achieve overall accuracy of 2% (V all load, line, process, and temperature variations. It is fully specified from TJ= –40°C to +125°C and is offered in low-profile, 2mm x 2mm SON and 3mm × 3mm SON packages that are ideal for wireless handsets, printers, and WLAN cards.

> 2.2V) over

OUT

APPLICATIONS

• WiFi, WiMax

• Printers

• Cellular Phones, SmartPhones

• Handheld Organizers, PDAs

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

TPS735xx

SBVS087H –JUNE 2008–REVISED NOVEMBER 2009

查询"TPS73512"供应商

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

PRODUCT V

(1)

OUT

(2)

TPS735xx yyy z XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable).

YYY is package designator. Z is package quantity.

(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2) Output voltages from 1.0V to 3.6V in 50mV increments are available through the use of innovative factory EEPROM programming;

minimum order quantities may apply. Contact factory for details and availability.

ABSOLUTE MAXIMUM RATINGS

Over operating temperature range (unless otherwise noted).

PARAMETER TPS735xx UNIT

VINrange –0.3 to +7.0 V VENrange –0.3 to VIN+0.3 V V

range –0.3 to VIN+0.3 V

OUT

VFBrange –0.3 to VFB(TYP) +0.3 V Peak output current Internally limited Continuous total power dissipation See Dissipation Ratings Table Junction temperature range, T Storage temperature range , T ESD rating, HBM 2 kV ESD rating, CDM 500 V

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

STG

(1)

–55 to +150 °C –55 to +150 °C

DISSIPATION RATINGS

BOARD PACKAGE R

(1)

Low-K

High-K

(2)

(2) (3)

DRV 20°C/W 140°C/W 7.1mW/°C 715mW 395mW 285mW DRV 20°C/W 65°C/W 15.4mW/°C 1.54W 845mW 615mW DRB 1.2°C/W 40°C/W 25mW/°C 2.5W 1.38W 1.0W

θJC

θJA

(1) The JEDEC low-K (1s) board used to derive this data was a 3in × 3in (7,62cm × 7,62cm), two-layer board with 2-ounce (56,699g)

copper traces on top of the board.

(2) The JEDEC high-K (2s2p) board used to derive this data was a 3in × 3in (7,62cm × 7,62cm), multilayer board with 1-ounce (28,35g)

internal power and ground planes and 2-ounce (56,699g) copper traces on top and bottom of the board.

(3) The R

value of the DRB package is junction-to-pad; note that this is not junction-to-case (top center of IC package).

θJC

DERATING FACTOR

ABOVE TA= +25°C TA< +25°C TA= +70°C TA= +85°C

TPS735xx

www.ti.com

查询"TPS73512"供应商

ELECTRICAL CHARACTERISTICS

Over operating temperature range (TJ= –40°C to +125°C), VIN= V VEN= VIN, C Typical values are at TJ= +25°C.

OUT

ΔV

%/ ΔVINLine regulation

OUT

ΔV

%/ ΔI

OUT

GND

SHDN

PSRR VIN= 3.85V, V

STR

EN(HI)

EN(LO)

EN(HI)

UVLO

(1) Minimum VIN= V (2) VDOis not measured for devices with V

= 2.2μF, CNR= 0.01μF, unless otherwise noted. For TPS73501, V

OUT

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Input voltage range

(1)

Internal reference (TPS73501) 1.184 1.208 1.232 V Output voltage range (TPS73501) V Output accuracy Nominal TJ= +25°C –1.0 +1.0 %

+ 0.3V ≤ VIN≤ V

DRB package over VIN, I

, Temp

OUT

Output accuracy

(1)

DRV package over VIN, I

, Temp

OUT

(1)

Load regulation 500μA ≤ I

OUT

Dropout voltage (VIN= V

OUT(NOM)

(2)

– 0.1V)

Output current limit VIN= V

Ground pin current 500μA ≤ I Shutdown current (I

) VEN≤ 0.4V 0.15 1.0 μA

GND

OUT

1mA ≤ I

OUT

+ 0.3V ≤ VIN≤ 6.5V

OUT

1mA ≤ I

OUT

+ 0.3V ≤ VIN≤ V

OUT

VIN≤ 6.5V –2.0 ±1.0 +2.0 % 1mA ≤ I

OUT

+ 0.3V ≤ VIN≤ V

OUT

VIN≤ 6.5V –3.0 ±1.0 +3.0 % 1mA ≤ I

OUT

OUT(NOM)

OUT

= 500mA 280 500 mV

OUT

= 0.9 × V

OUT

OUT(NOM)

VIN≥ 2.7V

OUT

Feedback pin current (TPS73501) –0.5 0.5 μA

f = 100Hz 60 dB

Power-supply rejection ratio

= 2.85V,

CNR= 0.01μF, I

OUT

= 100mA

f = 1kHz 56 dB f = 10kHz 41 dB f = 100kHz 28 dB

Output noise voltage BW = 10Hz to 100kHz, V

Startup time, V 90% V

= 2.85V,

OUT

RL= 14Ω, C

OUT

= 0% to

OUT

= 2.2μF

OUT

= 2.8V

CNR= 0.01μF 11 x V CNR= none 95 x V CNR= none 45 μs CNR= 0.001μF 45 μs CNR= 0.01μF 50 μs

CNR= 0.047μF 50 μs Enable high (enabled) 1.2 V Enable low (shutdown) 0 0.4 V Enable pin current, enabled VEN= VIN= 6.5V 0.03 1.0 μA

Thermal shutdown temperature

Operating junction temperature –40 +125 °C

Shutdown, temperature increasing 165 °C

Reset, temperature decreasing 145 °C

Under-voltage lock-out VINrising 1.90 2.20 2.65 V Hysteresis VINfalling 70 mV

+ VDOor 2.7V, whichever is greater.

OUT

OUT(NOM)

< 2.8V because minimum VIN= 2.7V.

SBVS087H –JUNE 2008–REVISED NOVEMBER 2009

OUT(TYP)

+ 0.5V or 2.7V, whichever is greater; I

= 3.0V.

OUT

= 1mA,

2.7 6.5 V

6.0 V

≤ 500mA, V

OUT

> 6.5V

OUT

+ 3.0V,

OUT

+ 3.0V,

OUT

> 2.2V

≤ 2.2V

> 2.2V

–2.0 ±1.0 +2.0 %

–3.0 ±1.0 +3.0 %

+ 0.3V ≤ VIN≤ 6.5V 0.02 %/V

≤ 500mA 0.005 %/mA

OUT(NOM)

+ 0.9V, 800 1170 1720 mA

≤ 500mA 45 65 μA

OUT OUT

μV

RMS

μV

RMS

Thermal

Shutdown

UVLO

Current

Limit

3.3MW

Overshoot

Detect

500kW

1.208V

Bandgap

OUT

GND

400W

Thermal

Shutdown

UVLO

Current

Limit

2 Am

Overshoot

Detect

500kW

Quickstart

1.208V

Bandgap

(1)

OUT

GND

400W

NOTE(1): Fixedvoltageversionsbetween1.0Vto1.2Vhavea1.0Vbandgapcircuit

insteadofa1.208Vbandgapcircuit.

OUT

N/C

NR/FB

GND

N/C

GND

N/C

OUT

NR/FB

GND

TPS735xx

SBVS087H –JUNE 2008–REVISED NOVEMBER 2009

查询"TPS73512"供应商

FUNCTIONAL BLOCK DIAGRAMS

Figure 1. Fixed Voltage Versions Figure 2. Adjustable Voltage Versions

www.ti.com

DEVICE INFORMATION

PIN CONFIGURATIONS

DRB PACKAGE

3mm × 3mm SON-6

(TOP VIEW)

TPS735xx

NAME DRV DRB DESCRIPTION

IN 6 8 Input supply.

GND 3, Pad 4 Ground. The pad must be tied to GND.

EN 4 5

NR 2 3

FB 2 3

OUT 1 1

N/C 5 2, 6, 7 Not internally connected. This pin must either be left open, or tied to GND.

DRV PACKAGE

2mm × 2mm SON-6

(TOP VIEW)

PIN DESCRIPTIONS

Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into shutdown mode. EN can be connected to IN if not used.

Fixed voltage versions only; connecting an external capacitor to this pin bypasses noise generated by the internal bandgap. This allows output noise to be reduced to very low levels.

Adjustable version only; this is the input to the control loop error amplifier, and is used to set the output voltage of the device.

Output of the regulator. A small capacitor (total typical capacitance ≥ 2.0μF ceramic) is needed from this pin to ground to assure stability.

0.5

0.4

0.3

0.2

0.1

0.2

0.3

0.4

0.5

ChangeinV (%)

OUT

3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5

V (V)

TJ= 40 C- °

TJ=0 C°

TJ=+125 C°

TJ=+85 C°

TJ=+25 C°

I =100mA

OUT

0.5

0.4

0.3

0.2

0.1

0.2

0.3

0.4

0.5

ChangeinV (%)

OUT

3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5

V (V)

TJ= 40 C- °

TJ=0 C°

TJ=+125 C°

TJ=+85 C°

TJ=+25 C°

I =100mA

OUT

2.86

2.85

2.84

2.83

2.82

2.81

2.80

2.79

2.78

2.77

2.76

2.75

2.74

V (V)

OUT

0 50 100 150 200 250 300 350 400 450 500

Load(mA)

TJ= 40 C- °

TJ=+125 C°

TJ=+85 C°

Y-axisrangeis 2%of2.8V±

2.55

2.54

2.53

2.52

2.51

2.50

2.49

2.48

2.47

2.46

2.45

V (V)

OUT

0 50 100 150 200 250 300 350 400 450 500

Load(mA)

TJ= 40 C- °

TJ=+125 C°

TJ=+85 C°

TJ=0 C°

TJ=+25 C°

Y-axisrangeis 2%of2.5V±

500

450

400

350

300

250

200

150

100

I (na)

GND

-40 -25 -10 5 20 35 50 65 80 95 110 125

T ( )JC

VIN=6.5V

VEN=0.4V

VIN=5.0V

VIN=3.3V

I ( A)m

GND

0 50 100 150 200 250 300 350 400 450 500

I (mA)

OUT

TJ= 40 C- °

TJ=+125 C°

TJ=+85 C°

TJ=0 C°

TJ=+25 C°

TPS735xx

www.ti.com

查询"TPS73512"供应商

TYPICAL CHARACTERISTICS

Over operating temperature range (TJ= –40°C to +125°C), VIN= V

VEN= VIN,C

= 2.2μF, CNR= 0.01μF, unless otherwise noted. For TPS73501, V

OUT

+25°C.

TPS73501 LINE REGULATION TPS73525 LINE REGULATION

Figure 3. Figure 4.

TPS73501 LOAD REGULATION TPS73525 LOAD REGULATION

OUT(TYP)

SBVS087H –JUNE 2008–REVISED NOVEMBER 2009

+ 0.5V or 2.7V, whichever is greater; I

= 2.8V. Typical values are at TJ=

OUT

= 1mA,

Figure 5. Figure 6.

TPS73525 GROUND PIN CURRENT vs TPS73525 GROUND PIN CURRENT (DISABLE) vs

OUTPUT CURRENT TEMPERATURE

Figure 7. Figure 8.

400

350

300

250

200

150

100

V (mV)

0 50 100 150 200 250 300 350 400 450 500

I (mA)

OUT

TJ= 40 C- °

TJ=+125 C°

TJ=+85 C°

TJ=0 C°

TJ=+25 C°

10 100

10k 100k

10M

Frequency(Hz)

PSRR(dB)

C =2.2 F

OUT

C =0.01 FNRm

I =250mA

OUT

I =

100mA

OUT

I =

500mA

OUT

I =200mA

OUT

I =1mA

OUT

10 100

10k 100k

10M

Frequency(Hz)

PSRR(dB)

C =2.2 F

OUT

C =0.01 FNRm

I =200mA

OUT

I =

100mA

OUT

I =

500mA

OUT

I =250mA

OUT

I =1mA

OUT

10 100

10k 100k

10M

Frequency(Hz)

PSRR(dB)

C =10 F

OUT

C =0.01 FNRm

I =200mA

OUT

I =

100mA

OUT

I =

500mA

OUT

I =

200mA

OUT

I =1mA

OUT

TPS735xx

SBVS087H –JUNE 2008–REVISED NOVEMBER 2009

查询"TPS73512"供应商

TYPICAL CHARACTERISTICS (continued)

Over operating temperature range (TJ= –40°C to +125°C), VIN= V VEN= VIN,C

= 2.2μF, CNR= 0.01μF, unless otherwise noted. For TPS73501, V

OUT

OUT(TYP)

+25°C.

TPS73501 DROPOUT VOLTAGE vs POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY

OUTPUT CURRENT (VIN– V

Figure 9. Figure 10.

POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY

(VIN– V

= 0.5V) (VIN– V

OUT

+ 0.5V or 2.7V, whichever is greater; I

= 2.8V. Typical values are at TJ=

OUT

= 1.0V)

OUT

= 0.3V)

OUT

www.ti.com

= 1mA,

OUT

Figure 11. Figure 12.

TotalNoise( V )m

RMS

10 15 20 25

C ( F)m

OUT

I =1mA C =0.01 F

OUT

140

120

100

TotalNoise( V )m

RMS

0.01 0.1

C (nF)

I =1mA C =2.2 F

OUT

10 s/divm

OUT

C =10 F

OUT

C =2.2 F

OUT

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.5-

Voltage(V)

10 s/divm

OUT

C =2.2 F

OUT

C =10 F

OUT

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.5-

Voltage(V)

TPS735xx

www.ti.com

查询"TPS73512"供应商

TYPICAL CHARACTERISTICS (continued)

Over operating temperature range (TJ= –40°C to +125°C), VIN= V VEN= VIN,C +25°C.

= 2.2μF, CNR= 0.01μF, unless otherwise noted. For TPS73501, V

OUT

TPS73525 TPS73525

TOTAL NOISE vs C

Figure 13. Figure 14.

TPS73525

TURN-ON RESPONSE TPS73525

(VIN= VEN) EN RESPONSE OVER STABLE V

OUT(TYP)

SBVS087H –JUNE 2008–REVISED NOVEMBER 2009

+ 0.5V or 2.7V, whichever is greater; I

= 2.8V. Typical values are at TJ=

OUT

TOTAL NOISE vs C

OUT

= 1mA,

Figure 15. Figure 16.

10 s/divm

200mV/div

500mA/div

OUT

C =470 FOSCON

OUT

C =10 F

OUT

C =2.2 F

OUT

V =3.0V

500mA

1mA

10 s/divm

7.0

6.0

5.0

4.0

3.0

2.0

1.0

1.0-

Volts(V)

VIN=EN

OUT

R =5W

10 s/divm

50mV/div

0.5V/div

OUT

C =470 FOSCON

OUT

C =10 F

OUT

C =2.2 F

OUT

TPS735xx

SBVS087H –JUNE 2008–REVISED NOVEMBER 2009

查询"TPS73512"供应商

TYPICAL CHARACTERISTICS (continued)

Over operating temperature range (TJ= –40°C to +125°C), VIN= V VEN= VIN,C +25°C.

= 2.2μF, CNR= 0.01μF, unless otherwise noted. For TPS73501, V

OUT

TPS73525

POWER-UP/POWER-DOWN

(VIN= VEN) TPS73525 LOAD TRANSIENT RESPONSE

Figure 17. Figure 18.

TPS73525 LINE TRANSIENT RESPONSE

OUT(TYP)

+ 0.5V or 2.7V, whichever is greater; I

= 2.8V. Typical values are at TJ=

OUT

www.ti.com

= 1mA,

OUT

Figure 19.

GNDEN NR

IN OUT

TPS735xx

Optionalbypasscapacitor

toreduceoutputnoise

andincreasePSRR.

Optionalinputcapacitor.

Mayimprovesource

impedance,noise,orPSRR.

2.2 F Ceramic

OUT

GNDEN

IN OUT

Optionalinputcapacitor.

Mayimprovesource

impedance,noise,orPSRR.

TPS73501

2.2 F Ceramic

OUT

(R +R )

1 2

OUT

= ´ 1.208

TPS735xx

www.ti.com

查询"TPS73512"供应商

SBVS087H –JUNE 2008–REVISED NOVEMBER 2009

APPLICATION INFORMATION

The TPS735xx family of LDO regulators combines the high performance required of many RF and Although an input capacitor is not required for precision analog applications with ultra-low current stability, it is good analog design practice to connect consumption. High PSRR is provided by a high gain, a 0.1μF to 1μF low equivalent series resistance high bandwidth error loop with good supply rejection (ESR) capacitor across the input supply near the at very low headroom (VIN– V

). Fixed voltage regulator. The ground of this capacitor should be

OUT

versions provide a noise reduction pin to bypass connected as close as the ground of output capacitor; noise generated by the bandgap reference and to a capacitor value of 0.1μF is enough in this condition. improve PSRR while a quick-start circuit fast-charges When it is difficult to place these two ground points this capacitor at startup. The combination of high close together, a 1μF capacitor is recommended. performance and low ground current also make the This capacitor counteracts reactive input sources and TPS735xx an excellent choice for portable improves transient response, noise rejection, and applications. All versions have thermal and ripple rejection. A higher-value capacitor may be over-current protection and are fully specified from necessary if large, fast rise-time load transients are –40°C to +125°C. anticipated, or if the device is located several inches

Figure 20 shows the basic circuit connections for

fixed voltage models. Figure 21 gives the connections for the adjustable output version (TPS73501). R1and R2can be calculated for any output voltage using the The TPS735xx is designed to be stable with standard formula in Figure 21. ceramic output capacitors of values 2.2μF or larger.

Input and Output Capacitor Requirements

from the power source. If source impedance is not sufficiently low, a 0.1μF input capacitor may be necessary to ensure stability.

X5R and X7R type capacitors are best because they have minimal variation in value and ESR over temperature. Maximum ESR of the output capacitor should be < 1.0Ω, so output capacitor type should be either ceramic or conductive polymer electrolytic.

Figure 20. Typical Application Circuit for

Figure 21. Typical Application Circuit for

space space

Fixed Voltage Versions

Adjustable Voltage Versions

Feedback Capacitor Requirements (TPS73501 only)

The feedback capacitor, CFB, shown in Figure 21 is required for stability. For a parallel combination of R

and R2equal to 250kΩ, any value from 3pF to 1nF can be used. Fixed voltage versions have an internal 30pF feedback capacitor that is quick-charged at start-up. The adjustable version does not have this quick-charge circuit, so values below 5pF should be used to ensure fast startup; values above 47pF can be used to implement an output voltage soft-start. Larger value capacitors also improve noise slightly. The TPS73501 is stable in unity-gain configuration (OUT tied to FB) without CFB.

Output Noise

In most LDOs, the bandgap is the dominant noise source. If a noise reduction capacitor (CNR) is used with the TPS735xx, the bandgap does not contribute significantly to noise. Instead, noise is dominated by the output resistor divider and the error amplifier input. To minimize noise in a given application, use a

0.01μF noise reduction capacitor; for the adjustable version, smaller value resistors in the output resistor divider reduce noise. A parallel combination that gives 2μA of divider current has the same noise performance as a fixed voltage version. To further

V =xV

N OUT

11VmV

RMS

TPS735xx

SBVS087H –JUNE 2008–REVISED NOVEMBER 2009

查询"TPS73512"供应商

www.ti.com

optimize noise, equivalent series resistance of the As with any linear regulator, PSRR and transient output capacitor can be set to approximately 0.2Ω. response are degraded as (VIN– V

) approaches

OUT

This configuration maximizes phase margin in the dropout. This effect is shown in the Typical control loop, reducing total output noise by up to Characteristics section. 10%.

Noise can be referred to the feedback point (FB pin) such that with CNR= 0.01μF, total noise is given approximately by Equation 1:

Startup and Noise Reduction Capacitor

Fixed voltage versions of the TPS735xx use a quick-start circuit to fast-charge the noise reduction capacitor, CNR, if present (see the Functional Block

(1)

The TPS73501 adjustable version does not have the noise-reduction pin available, so ultra-low noise operation is not possible. Noise can be minimized according to the above recommendations.

Board Layout Recommendations to Improve PSRR and Noise Performance

Diagrams). This architecture allows the combination

of very low output noise and fast start-up times. The NR pin is high impedance so a low leakage C

capacitor must be used; most ceramic capacitors are appropriate in this configuration.

Note that for fastest startup, VINshould be applied first, then the enable pin (EN) driven high. If EN is tied to IN, startup is somewhat slower. Refer to the

Typical Characteristics section. The quick-start switch

To improve ac performance such as PSRR, output is closed for approximately 135μs. To ensure that noise, and transient response, it is recommended that CNRis fully charged during the quick-start time, a the board be designed with separate ground planes 0.01μF or smaller capacitor should be used. for VINand V only at the GND pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the GND pin of the device.

Internal Current Limit

, with each ground plane connected

OUT

Transient Response

As with any regulator, increasing the size of the

output capacitor reduces over/undershoot magnitude

but increases duration of the transient response. In

the adjustable version, adding CFBbetween OUT and The TPS735xx internal current limit helps protect the FB improves stability and transient response. The regulator during fault conditions. During current limit, transient response of the TPS735xx is enhanced by the output sources a fixed amount of current that is an active pull-down that engages when the output largely independent of output voltage. For reliable overshoots by approximately 5% or more when the operation, the device should not be operated in device is enabled. When enabled, the pull-down current limit for extended periods of time. device behaves like a 400Ω resistor to ground.

The PMOS pass element in the TPS735xx has a built-in body diode that conducts current when the voltage at OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is anticipated, external limiting may be appropriate.

Undervoltage Lock-Out (UVLO)

The TPS735xx utilizes an undervoltage lock-out

circuit to keep the output shut off until internal

circuitry is operating properly. The UVLO circuit has a

de-glitch feature so that it typically ignores

undershoot transients on the input if they are less

Shutdown than 50μs duration.

The enable pin (EN) is active high and is compatible with standard and low voltage TTL-CMOS levels. When shutdown capability is not required, EN can be connected to IN.

Minimum Load

The TPS735xx is stable and well-behaved with no

output load. To meet the specified accuracy, a

minimum load of 500μA is required. Below 500μA at

Dropout Voltage junction temperatures near +125°C, the output can

The TPS735xx uses a PMOS pass transistor to achieve low dropout. When (VIN– V

) is less than

OUT

the dropout voltage (VDO), the PMOS pass device is in its linear region of operation and the input-to-output resistance is the R

of the PMOS pass element.

DS, ON

Because the PMOS device behaves like a resistor in dropout, V

approximately scales with output

current.

drift up enough to cause the output pull-down to turn

on. The output pull-down limits voltage drift to 5%

typically but ground current could increase by

approximately 50μA. In typical applications, the

junction cannot reach high temperatures at light loads

because there is no appreciable dissipated power.

The specified ground current would then be valid at

no load in most applications.

VIN*V

OUT

@ I

OUT

TPS735xx

www.ti.com

查询"TPS73512"供应商

SBVS087H –JUNE 2008–REVISED NOVEMBER 2009

Thermal Information

Thermal Protection Power Dissipation

Thermal protection disables the output when the The ability to remove heat from the die is different for junction temperature rises to approximately +165°C, each package type, presenting different allowing the device to cool. When the junction considerations in the PCB layout. The PCB area temperature cools to approximately +145°C the around the device that is free of other components output circuitry is again enabled. Depending on power moves the heat from the device to the ambient air. dissipation, thermal resistance, and ambient Performance data for JEDEC low- and high-K boards temperature, the thermal protection circuit may cycle are given in the Dissipation Ratings table. Using on and off. This cycling limits the dissipation of the heavier copper increases the effectiveness in regulator, protecting it from damage as a result of removing heat from the device. The addition of plated overheating. through-holes to heat-dissipating layers also

Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an Power dissipation depends on input voltage and load inadequate heatsink. For reliable operation, junction conditions. Power dissipation is equal to the product temperature should be limited to +125°C maximum. of the output current time the voltage drop across the To estimate the margin of safety in a complete design output pass element, as shown in Equation 2: (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least +35°C above the maximum expected ambient condition of your particular application. This configuration produces a worst-case junction temperature of +125°C at the highest expected ambient temperature and worst-case load.

The internal protection circuitry of the TPS735xx has been designed to protect against overload conditions. It was not intended to replace proper heatsinking. Continuously running the TPS735xx into thermal shutdown degrades device reliability.

improves the heatsink effectiveness.

(2)

Note: When the device is used in a condition of

higher input and lower output voltages with the DRV

and DRB packages, PDexceeds the package rating

at room temperature. This equation shows an

example of the DRB package:

PD= (6.5V – 1.0V) × 500mA = 2.75W, which is greater than 2.5W at +25°C.

Package Mounting

Solder pad footprint recommendations for the

TPS735xx are available from the Texas Instruments

web site at www.ti.com.

TPS735xx

SBVS087H –JUNE 2008–REVISED NOVEMBER 2009

查询"TPS73512"供应商

www.ti.com

REVISION HISTORY

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (March, 2009) to Revision H Page

• Revised bullet point in Features list to show very low dropout of 280mV ............................................................................ 1

• Changed dropout voltage typical specification from 250mV to 280mV ................................................................................ 3

PACKAGE OPTION ADDENDUM

www.ti.com

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

(2)

Lead/

Ball Finish

MSL Peak Temp

TPS73501DRBR ACTIVE SON DRB 8 3000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR Purchase Samples

TPS73501DRBT ACTIVE SON DRB 8 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR Request Free Samples

TPS73512DRBR ACTIVE SON DRB 8 3000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR Purchase Samples

TPS73512DRBT ACTIVE SON DRB 8 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR Request Free Samples

TPS73515DRBR PREVIEW SON DRB 8 3000 TBD Call TI Call TI Samples Not Available TPS73515DRBT PREVIEW SON DRB 8 250 TBD Call TI Call TI Samples Not Available TPS73525DRBR ACTIVE SON DRB 8 3000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR Request Free Samples

TPS73525DRBRG4 ACTIVE SON DRB 8 3000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR Request Free Samples

TPS73525DRBT ACTIVE SON DRB 8 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR Purchase Samples

TPS73525DRBTG4 ACTIVE SON DRB 8 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR Purchase Samples

TPS73525DRVR ACTIVE SON DRV 6 3000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM Request Free Samples

TPS73525DRVT ACTIVE SON DRV 6 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM Purchase Samples

TPS73533DRBR ACTIVE SON DRB 8 3000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR Purchase Samples

TPS73533DRBT ACTIVE SON DRB 8 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR Request Free Samples

TPS73533DRVR ACTIVE SON DRV 6 3000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM Purchase Samples

TPS73533DRVT ACTIVE SON DRV 6 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM Request Free Samples

TPS73534DRBR ACTIVE SON DRB 8 3000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR Request Free Samples

TPS73534DRBT ACTIVE SON DRB 8 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR Purchase Samples

查询"TPS73512"供应商

PACKAGE OPTION ADDENDUM

www.ti.com

Addendum-Page 2

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

查询"TPS73512"供应商

PACKAGE MATERIALS INFORMATION

查询"TPS73512"供应商

www.ti.com 29-Sep-2010

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type

TPS73501DRBR SON DRB 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

TPS73501DRBT SON DRB 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

TPS73512DRBR SON DRB 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

TPS73512DRBT SON DRB 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

TPS73525DRBR SON DRB 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

TPS73525DRBT SON DRB 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

TPS73533DRBR SON DRB 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

TPS73533DRBT SON DRB 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

TPS73533DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2

TPS73533DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2

TPS73534DRBR SON DRB 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

TPS73534DRBT SON DRB 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

查询"TPS73512"供应商

www.ti.com 29-Sep-2010

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length(mm) Width (mm) Height (mm)

TPS73501DRBR SON DRB 8 3000 346.0 346.0 29.0

TPS73501DRBT SON DRB 8 250 190.5 212.7 31.8

TPS73512DRBR SON DRB 8 3000 346.0 346.0 29.0

TPS73512DRBT SON DRB 8 250 190.5 212.7 31.8

TPS73525DRBR SON DRB 8 3000 346.0 346.0 29.0

TPS73525DRBT SON DRB 8 250 190.5 212.7 31.8

TPS73533DRBR SON DRB 8 3000 346.0 346.0 29.0

TPS73533DRBT SON DRB 8 250 190.5 212.7 31.8

TPS73533DRVR SON DRV 6 3000 203.0 203.0 35.0

TPS73533DRVT SON DRV 6 250 203.0 203.0 35.0

TPS73534DRBR SON DRB 8 3000 346.0 346.0 29.0

TPS73534DRBT SON DRB 8 250 190.5 212.7 31.8

Pack Materials-Page 2

查询"TPS73512"供应商

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and www.ti.com/communications

DSP dsp.ti.com Computers and www.ti.com/computers

Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & www.ti.com/space-avionics-defense

RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Telecom

Peripherals

Defense

Wireless www.ti.com/wireless-apps

TEXAS INSTRUMENTS TPS735xx Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual