Texas Instruments TPS6021 Series, TPS60210EVM-167 User Manual

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August 2000 Power Management Products
Users Guide
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IMPORTANT NOTICE
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
Related Documentation From Texas Instruments
Preface
Read This First
About This Manual
This user’s guide describes the evaluation module (EVM) TPS60210EVM-167. This EVM helps to evaluate the performance of the regu­lated low-ripple charge pump dc/dc converter TPS60210. The EVM has the dimension of a 14-pin dual inline package and the board is a single-layer board. The board design is optimized for performance and space.
The user’s guide also documents the necessary changes to use the board for the other devices of the TPS6021x family.
How to Use This Manual
For more information about the EVM, please read Chapter 1, Description of the EVM. Chapter 2 includes the Physical Data and the Setup of the EVM.
Related Documentation From Texas Instruments
Data sheet of TPS60210/TPS6021 1/TPS60212/TPS60213 (literature number SL VS296)
Erich Bayer, Alexander Müller, Hans Schmeller, and Günter Sporer: Charge Pump Technology Optimized for Battery-Operated Systems, EE-Times Special Seminar Series, Analog & Mixed Signal Technology , Oct. 99
Brigitte Kormann: TPS6014x Charge Pump Evaluation Module Design Guide (literature number SLVU023)
Brigitte Kormann: TPS6010x/TPS6011x Charge Pump Application Report (literature number SLVA070)
Running Title—Attribute Reference
Contents
1 Description of the EVM 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Physical Data and Setup of the EVM 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Schematic of the EVM 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Layout of the EVM 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Setup of the EVM 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Evaluation Information 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures
2–1 Schematic of the EVM 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2 Placement of the Components 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 Single Layer of the EVM 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–4 Actual Size of the EVM, 17,9 mm × 10,2 mm 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
T ables
2–1 Bill of Material for the TPS60210 EVM 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2 Pin Assignment of the Board to a 14-Pin Dual-In-Line Socket 2-5. . . . . . . . . . . . . . . . . . . . . . .
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