Dual Synchronous, Step-Down Controller with 5-V and 3.3-V LDOs
Check for Samples: TPS51225, TPS51225B, TPS51225C
1
FEATURES
2
•Input Voltage Range: 5.5 V to 24 V
•Output Voltages: 5 V and 3.3 V (Adjustable•Netbook, Tablet Computers
Range ±10%)
•Built-in, 100-mA, 5-V and 3.3-V LDOs
•Clock Output for Charge-Pump
•±1% Reference Accuracy
•Adaptive On-time D-CAP™ Mode Control
Architecture with 300kHz/355kHz Frequency
Setting
•Auto-skip Light Load Operation (TPS51225/C)
•OOA Light Load Operation (TPS51225B)
•Internal 0.8-ms Voltage Servo Soft-Start
•Low-Side R
4500 ppm/°C Temperature Coefficient
•Built-in Output Discharge Function
•Separate Enable Input for Switchers
(TPS51225/B/C)
•Dedicated OC Setting Terminals
•Power Good Indicator
•OVP/UVP/OCP Protection
•Non-latch UVLO/OTP Protection
•20-Pin, 3 mm × 3 mm, QFN (RUK)
ORDERABLE
DEVICE NUMBER
TPS51225RUKRTape and Reel3000
TPS51225RUKTMini reel250
TPS51225BRUKRTape and Reel3000
TPS51225BRUKTMini reel250
TPS51225CRUKRTape and Reel3000
TPS51225CRUKTMini reel250
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Current Sensing Scheme with
DS(on)
ORDERING INFORMATION
ENABLEOUTPUT
FUNCTIONSUPPLY
EN1/ EN2Auto-skipVREG3
EN1/ EN2OOAVREG3
EN1/ EN2Auto-skipVREG3 & VREG5
SKIP MODEALWAYS ON-LDOPACKAGEQUANTITY
APPLICATIONS
•Notebook Computers
DESCRIPTION
TheTPS51225/B/Cisacost-effective,dualsynchronous buck controller targeted for notebook
system-power supply solutions. It provides 5-V and
3.3-V LDOs and requires few external components.
The 260-kHz VCLK output can be used to drive an
external charge pump, generating gate drive voltage
for the load switches without reducing the main
converter efficiency. The TPS51225/B/C supports
high efficiency, fast transient response and provides a
combined power-good signal. Adaptive on-time, DCAP™ control provides convenient and efficient
operation. The device operates with supply input
voltage ranging from 5.5 V to 24 V and supports
outputvoltagesof5.0Vand3.3V.The
TPS51225/B/C is available in a 20-pin, 3 mm × 3
mm, QFN package and is specified from –40°C to
85°C.
(1)
PLASTIC Quad
Flat Pack
(20 pin QFN)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2D-CAP, Out-of-Audio are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal unless otherwise noted
(3) Voltage values are with respect to SW terminals.
The main control loop of the switch mode power supply (SMPS) is designed as an adaptive on-time pulse width
modulation (PWM) controller. It supports a proprietary D-CAP™ mode. D-CAP™ mode does not require external
conpensation circuit and is suitable for low external component count configuration when used with appropriate
amount of ESR at the output capacitor(s).
At the beginning of each cycle, the synchronous high-side MOSFET is turned on, or enters the ON state. This
MOSFET is turned off, or enters the ‘OFF state, after the internal, one-shot timer expires. The MOSFET is turned
on again when the feedback point voltage, V
, decreased to match the internal 2-V reference. The inductor
VFB
current information is also monitored and should be below the overcurrent threshold to initiate this new cycle. By
repeating the operation in this manner, the controller regulates the output voltage. The synchronous low-side
(rectifying) MOSFET is turned on at the beginning of each OFF state to maintain a minimum of conduction loss.
The low-side MOSFET is turned off before the high-side MOSFET turns on at next switching cycle or when
inductor current information detects zero level. This enables seamless transition to the reduced frequency
operation during light-load conditions so that high efficiency is maintained over a broad range of load current.
Adaptive On-Time/ PWM Frequency Control
Bacause the TPS51225/B/C does not have a dedicated oscillator for control loop on board, switching cycle is
controlled by the adaptive on-time circuit. The on-time is controlled to meet the target switching frequency by
feed-forwarding the input and output voltage into the on-time one-shot timer. The target switching frequency is
varied according to the input voltage to achieve higher duty operation for lower input voltage application. The
switching frequency of CH1 (5-V output) is 300 kHz during continuous conduction mode (CCM) operation when
VIN= 20 V. The CH2 (3.3-V output) is 355 kHz during CCM when VIN= 20 V.
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Light Load Condition in Auto-Skip Operation (TPS51225/C)
The TPS51225/C automatically reduces switching frequency during light-load conditions to maintain high
efficiency. This reduction of frequency is achieved smoothly and without an increase in output voltage ripple. A
more detailed description of this operation is as follows. As the output current decreases from heavy-load
condition, the inductor current is also reduced and eventually approaches valley zero current, which is the
boundary between continuous conduction mode and discontinuous conduction mode. The rectifying MOSFET is
turned off when this zero inductor current is detected. As the load current further decreases, the converter runs in
discontinuous conduction mode and it takes longer and longer to discharge the output capacitor to the level that
requires the next ON cycle. The ON time is maintained the same as that in the heavy-load condition. In reverse,
when the output current increase from light load to heavy load, the switching frequency increases to the preset
value as the inductor current reaches to the continuous conduction. The transition load point to the light load
operation I
OUT(LL)
as shown in Equation 1.
where
•fSWis the PWM switching frequency(1)
Switching frequency versus output current during light-load conditions is a function of inductance (L), input
voltage (VIN) and output voltage (V
I
.
OUT(LL)
(i.e. the threshold between continuous and discontinuous conduction mode) can be calculated
), but it decreases almost proportional to the output current from the
Light-Load Condition in Out-of-Audio™ Operation (TPS51225B)
Out-of-Audio™ (OOA) light-load mode is a unique control feature that keeps the switching frequency above
acoustic audible frequencies toward a virtual no-load condition. During Out-of-Audio™ operation, the OOA
control circuit monitors the states of both MOSFETs and forces them to transition into the ON state if both of
MOSFETs are off for more than 40 μs. When both high-side and low-side MOSFETs are off for 40 µs during a
light-load condition, the operation mode is changed to FCCM. This mode change initiates the low-side MOSFET
on and pulls down the output voltage. Then, the high-side MOSFET is turned on and stops switching again.
Table 1. SKIP Mode Operation (TPS51225/B/C)
SKIP MODE OPERATION
TPS51225Auto-skip
TPS51225BOOA
TPS51225CAuto-skip
D-CAP™ Mode
From small-signal loop analysis, a buck converter using D-CAP™ mode can be simplified as shown in Figure 1.
SLUSAV0A –JANUARY 2012–REVISED JUNE 2012
The output voltage is compared with internal reference voltage after divider resistors, R1 and R2. The PWM
comparator determines the timing to turn onthe high-side MOSFET. The gain and speed of the comparator is
high enough to keep the voltage at the beginning of each ON cycle substantially constant. For the loop stability,
the 0dB frequency, ƒ0, defined in Equation 2 must be lower than 1/4 of the switching frequency.
As ƒ0is determined solely by the output capacitor characteristics, the loop stability during D-CAP™ mode is
determined by the capacitor chemistry. For example, specialty polymer capacitors have output capacitance in the
order of several hundred micro-Farads and ESR in range of 10 milli-ohms. These yield an f0value on the order
of 100 kHz or less and the loop is stable. However, ceramic capacitors have ƒ0at more than 700 kHz, which is
not suitable for this operational mode.
VREG3 is an always-on regulator (TPS51225/B), VREG3/VREG5 are always-on regulators (TPS51225C), when
the input voltage is beyond the UVLO threshold it turns ON. VREG5 is turned ON when either EN1 or EN2
enters the ON state. The VCLK signal initiates when EN1 enters the ON state (TPS51225/B/C). Enable states
are shown in Table 2 through Table 3.
The TPS51225/B/C operates an internal, 0.8-ms, voltage servo soft-start for each channel. When the ENx pin
becomes higher than the enable threshold voltage, an internal DAC begins ramping up the reference voltage to
the PWM comparator. Smooth control of the output voltage is maintained during start-up. When ENx becomes
lower than the lower level of threshold voltage, TPS51225/B/C discharges outputs using internal MOSFETs
through VO1 (CH1) and SW2 (CH2).
VREG5/VREG3 Linear Regulators
There are two sets of 100-mA standby linear regulators which output 5 V and 3.3 V, respectively. The VREG5
pin provides the current for the gate drivers. The VREG3 pin functions as the main power supply for the analog
circuitry of the device. VREG3 is an Always ON LDO and TPS51225C has Always ON VREG5. (see )
Add ceramic capacitors with a value of 1 µF or larger (X5R grade or better) placed close to the VREG5 and
VREG3 pins to stabilize LDOs.
The VREG5 pin switchover function is asserted when three conditions are present:
•CH1 internal PGOOD is high
•CH1 is not in OCL condition
•VO1 voltage is higher than VREG5-1V
In this switchover condition, three things occur:
•the internal 5-V, LDO regulator is shut off
•the VREG5 output is connected to VO1 by internal switchover MOSFET
•VREG3 input pass is changed from VIN to VO1
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VCLK for Charge Pump
The 260-kHz VCLK signal can be used in the charge pump circuit. The VCLK signal becomes available when
EN1. The VCLK driver is driven by VO1 voltage. In a design that does not require VCLK output, leave the VCLK
pin open.
Overcurrent Protection
TPS51225/B/C has cycle-by-cycle over current limiting control. The inductor current is monitored during the OFF
state and the controller maintains the OFF state during the inductor current is larger than the overcurrent trip
level. In order to provide both good accuracy and cost effective solution, TPS51225/B/C supports temperature
compensated MOSFET R
setting resistor, RCS. The CSx pin sources CS current (ICS) which is 10 µA typically at room temperature, and the
CSx terminal voltage (VCS= RCS× ICS) should be in the range of 0.2 V to 2 V over all operation temperatures.
The trip level is set to the OCL trip voltage (V
The inductor current is monitored by the voltage between GND pin and SWx pin so that SWx pin should be
connected to the drain terminal of the low-side MOSFET properly.The CS pin current has a 4500 ppm/°C
temperature slope to compensate the temperature dependency of the R
current sensing node so that GND should be connected to the source terminal of the low-side MOSFET.
As the comparison is done during the OFF state, V
current at the overcurrent threshold, I
In an overcurrent condition, the current to the load exceeds the current to the output capacitor thus the output
voltage tends to fall down. Eventually, it ends up with crossing the undervoltage protection threshold and
shutdown both channels.
sensing. The CSx pin should be connected to GND through the CS voltage
DS(on)
) as shown in Equation 3.
TRIP
. GND is used as the positive
DS(on)
sets the valley level of the inductor current. Thus, the load
TPS51225/B/C asserts the overvoltage protection (OVP) when VFBx voltage reaches OVP trip threshold level.
When an OVP event is detected, the controller changes the output target voltage to 0 V. This usually turns off
DRVH and forces DRVL to be on. When the inductor current begins to flow through the low-side MOSFET and
reaches the negative OCL, DRVL is turned off and DRVH is turned on. After the on-time expires, DRVH is turned
off and DRVL is turned on again. This action minimizes the output node undershoot due to LC resonance. When
the VFBx reaches 0V, the driver output is latched as DRVH off, DRVL on. The undervoltage protection (UVP)
latch is set when the VFBx voltage remains lower than UVP trip threshold voltage for 250 µs or longer. In this
fault condition, the controller latches DRVH low and DRVL low and discharges the outputs. UVP detection
function is enabled after 1.35 ms of SMPS operation to ensure startup.
Undervoltage Lockout (UVLO) Protection
TPS51225/B/C has undervoltage lock out protection at VIN, VREG5 and VREG3. When each voltage is lower
than their UVLO threshold voltage, both SMPS are shut-off. They are non-latch protections.
Over-Temperature Protection
TPS51225/B/C features an internal temperature monitor. If the temperature exceeds the threshold value
(typically 155°C), TPS51225/B/C is shut off including LDOs. This is non-latch protection.
The external components selection is relatively simple for a design using D-CAP™ mode.
Step 1. Determine the Value of R1 and R2
The recommended R2 value is between 10 kΩ and 20 kΩ. Determine R1 using Equation 5.
Step 2. Choose the Inductor
The inductance value should be determined to give the ripple current of approximately 1/3 of maximum output
current. Larger ripple current increases output ripple voltage, improves signal:noise ratio, and helps ensure stable
operation.
The inductor also needs to have low DCR to achieve good efficiency, as well as enough room above peak
inductor current before saturation. The peak inductor current can be estimated as shown in Equation 7.
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(5)
(6)
(7)
Step 3. Choose Output Capacitor(s)
Organic semiconductor capacitor(s) or specialty polymer capacitor(s) are recommended. Determine ESR to meet
required ripple voltage above. A quick approximation is as shown in Equation 8.
where
•D as the duty-cycle factor
•the required output ripple voltage slope is approximately 20 mV per tSW(switching period) in terms of VFB
terminal(8)
Good layout is essential for stable power supply operation. Follow these guidelines for an efficient PCB layout.
Placement
•Place voltage setting resistors close to the device pins.
•Place bypass capacitors for VREG5 and VREG3 close to the device pins.
Routing (Sensitive analog portion)
•Use small copper space for VFBx. There are short and narrow traces to avoid noise coupling.
•Connect VFB resistor trace to the positive node of the output capacitor. Routing inner layer away from power
traces is recommended.
•Use short and wide trace from VFB resistor to vias to GND (internal GND plane).
Routing (Power portion)
•Use wider/shorter traces of DRVL for low-side gate drivers to reduce stray inductance.
•Use the parallel traces of SW and DRVH for high-side MOSFET gate drive in a same layer or on adjoin
layers, and keep them away from DRVL.
•Use wider/ shorter traces between the source terminal of the high-side MOSFET and the drain terminal of the
low-side MOSFET
•Thermal pad is the GND terminal of this device. Five or more vias with 0.33-mm (13-mils) diameter connected
from the thermal pad to the internal GND plane should be used to have strong GND connection and help heat
dissipation.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Status
(1)
Package Type Package
Drawing
PinsPackage Qty
Eco Plan
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
(2)
Lead/
Ball Finish
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
MSL Peak Temp
(3)
Samples
(Requires Login)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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Addendum-Page 1
PACKAGE OPTION ADDENDUM
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