High Performance, Single-Synchronous Step-Down Controller
with Differential Voltage Feedback
1
FEATURES
23
• Differential Voltage Feedback
•DC Compensation for Accurate Regulation
•Wide Input Voltage Range: 3 V to 28 V
•Output Voltage Range: 0.5 V to 2.0 V with
Fixed Options of 1.05 V and 1.00 V
•Wide Output Load Range: 0 A to 20 A+
•Adaptive On-Time Modulation with Selectable
Control Architecture and Frequency
– D-CAP™ Mode at 300 kHz/400 kHz for Fast
Transient Response
– D-CAP2™ Mode at 500 kHz/670 kHz for
Ceramic Output Capacitor
•4700 ppm/°C, Low-Side R
•R
Accurate Current Sense Option
SENSE
•Internal, 1-ms Voltage Servo Softstart
•Built-In Output Discharge
•Power Good Output
•Integrated Boost Switch
•Built-In OVP/UVP/OCP
•Thermal Shutdown (Non-latched)
•3 mm × 3 mm, 16-Pin, QFN (RTE) Package
APPLICATIONS
•Notebook Computers
•I/O Supplies
Current Sensing
DS(on)
TPS51219
SLUSAG1B –MARCH 2011– REVISED OCTOBER 2011
DESCRIPTION
The TPS51219 is a small-sized single buck controller
with adaptive on-time control. It provides a choice of
control modes (D-CAP™ or D-CAP2™) to meet a
wide range of system requirements. It is designed for
tight DC regulation requirements such as the VCCIO
application for Intel®notebooks. The performance
and flexibility of the TPS51219 makes it suitable for
low output voltage, high current, PC system power
rails and similar point-of-load (POL) power supplies.
Differentialvoltagefeedbackandthevoltage
compensation function combine to provide high
precision power to load devices.
A small package, fixed voltage options and minimal
external component count saves cost and space,
while a dedicated EN pin and pre-set frequency
selections minimize design effort. The skip-mode at
light load condition, strong gate drivers, and low-side
FET R
operation over a broad load range. The external
resistorcurrent senseoption enablesaccurate
current sensing. The conversion input voltage (the
high-side FET drain voltage) ranges from 3 V to 28 V
and output voltage ranges from 0.5 V to 2.0 V. The
device requires an external 5-V supply.
The TPS51219 is available in a 16-pin, QFN package
and is specified for ambient temperature from -40°C
to 85°C.
current sensing provides high efficiency
DS(on)
1
2D-CAP, D-CAP2 are trademarks of Texas Instruments.
3Intel is a registered trademark of Intel.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
www.ti.com
ORDERING INFORMATION
T
A
PACKAGEPINS
–40°C to 85°CPlastic Quad Flat Pack (QFN)16
ORDERABLE DEVICEOUTPUTMINIMUM
NUMBERSUPPLYQUANTITY
TPS51219RTERTape and reel3000
TPS51219RTETMini-reel250
(1)
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VREF–0.33.6
Junction temperature range, T
Storage temperature range, T
J
STG
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal unless otherwise noted.
(3) Voltage values are with respect to the SW terminal.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
BST13IHigh-side MOSFET gate driver bootstrap voltage input. Connect a capacitor from the BST pin to the SW pin.
COMP5I
DH11OHigh-side MOSFET gate driver output.
DL10O Low-side MOSFET gate driver output.
EN14IEnable pin. 3.3-V I/O level, 100 ns de-bounce. Short to GND to disable the device.
GND7–Device analog ground; Connect to a quiet point on the system GND plane
GSNS3IVoltage sense return tied directly to the GND sense point of the load. Short to GND if remote sense is not used.
MODE15I
PGND8–
PGOOD16O Powergood signal open drain output. PGOOD goes high when the output voltage is within the target range.
REFIN2IOutput voltage setting pin. See the VREF and REFIN, Output Voltage section.
SW12I/O High-side MOSFET gate driver return. R
TRIP6Icurrent sensing if connected to GND through an OCL setting resistor. For R
VSNS4IVoltage sense line tied directly to the load voltage sense point.
VREF1O2.0-V ±0.8% voltage reference output.
V59I5V power supply input for internal circuits and MOSFET gate drivers.
Thermal
pad
I/ODESCRIPTION
Connection for the DC compensation integrator for improved load-line performance. Connect a capacitor from
this pin to the VSNS pin (when operating in D-CAP2 mode), or to the positive terminal of the output capacitor
(when operating in D-CAP mode). Connect directly to the VSNS pin without capacitor to disable the integrator
function.
Connect a resistor to GND to configure switching frequency, control mode and current sense scheme. (See
Table 2)
Synchronous low-side MOSFET gate driver return. Also serve as the current sensing input (+). Connect to the
GND pin as close as possible to the device.
current sensing input (–) when using R
DS(on)
Current sense comparator input (-) for resistor current sensing. Or overcurrent threshold setting pin for R
μA at room temperature, TC=4700ppm/°C, is sourced to set the trip voltage.
––Thermal pad. Connect directly to system GND plane with multiple vias.