Texas Instruments TPS51124RGER Schematic [ru]

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75 kΩ

PGOOD1

EN1

PGOOD2

EN2

TPS51124RGE

(QFN24)

13 14 15 16

VBST1

DRVL1

LL1

DRVH1

VBST2

DRVH2

LL2

DRVL2

6 5 4 3 2 1

VO1

1.05 V/10 A

IRF8113

IRF7821

VO2

1.5 V/10 A

IRF8113

IRF7821

Input Voltage

3 V to 28 V

6.8

R2 75

V5IN

4.5 V to 5.5 V

VO2

VO1

VFB2

TONSEL

GND

VFB1

PGND2

TRIP2

V5FILT

V5IN

TRIP1

PGND1

Power Good2

EN2

Power Good1

EN1

SGND

PGNDPGND

SGND

SGND PGND

PGND

73.2 kΩ

kΩ

28.7 kΩ

22 µF

2 x 330 µF

1 µH

10 µF

0.1 µF

4.7 Fμ

6.8 kΩ

1 Fμ

3.3Ω kΩ

0.1 µF

10 µF

1 µH

2 x 330 µF

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SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

TPS51124 Dual Synchronous Step-Down Controller for Low-Voltage Power Rails

1 Features 3 Description

• High Efficiency, Low-Power Consumption, Shutdowns to <1 μA

• Fixed Frequency Emulated On-Time Control, Frequency Selectable From Three Options

• D-CAP™ Mode Enables Fast Transient Response

• Auto-Skip Mode

• Less Than 1% Initial Reference Accuracy

• Low Output Ripple

• Wide Input Voltage Range: 3 V to 28 V

• Output Voltage Range: 0.76 V to 5.5 V

• Low-Side R

Loss-less Current Sensing

DS(ON)

• Adaptive Gate Drivers With Integrated Boost Diode

• Internal 1.2-ms Voltage-Servo Soft-Start

• Powergood Signals for Each Channel With Delay Timer

• Output Discharge During Disable, Fault

2 Applications

Notebook I/O and Low-Voltage System Bus

The TPS51124 is a dual, adaptive on-time D-CAP™ mode synchronous buck controller. The part enables system designers to cost effectively complete the suite of notebook power bus regulators with the absolute lowest external component count and lowest standby consumption. The fixed frequency emulated adaptive on-time control supports seamless operation between PWM mode at heavy load condition and reduced frequency operation at light load for high efficiency down to milliampere range. The main control loop for the TPS51124 uses the D-CAP mode that optimized for low ESR output capacitors such as POSCAP or SP-CAP promises fast transient response with no external compensation. Simple and separate power good signals for each channel allow flexibility of power sequencing. The part provides a convenient and efficient operation with supply input voltages (V5IN, V5FILT) ranging from 4.5 V to 5.5 V, conversion voltages (drain voltage for the synchronous high-side MOSFET) from 3 V to 28 V and output voltages from 0.76 V to 5.5 V.

The TPS51124 is available in 24-pin VQFN package specified from –40°C to 85°C ambient temperature range.

TPS51124

Device Information

(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

TPS51124 VQFN (24) 4.00 mm × 4.00 mm (1) For all available packages, see the orderable addendum at

the end of the datasheet.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

www.ti.com

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings .................................... 4

6.2 Recommended Operating Conditions...................... 4

6.3 Thermal Information.................................................. 4

6.4 Electrical Characteristics.......................................... 5

6.5 Typical Characteristics.............................................. 7

7 Detailed Description............................................ 10

7.1 Overview ................................................................. 10

7.2 Functional Block Diagram....................................... 10

7.3 Feature Description................................................. 11

7.4 Device Functional Modes........................................ 13

8 Application and Implementation........................ 14

8.1 Application Information............................................ 14

8.2 Typical Application.................................................. 14

9 Power Supply Recommendations...................... 18

10 Layout................................................................... 18

10.1 Layout Guidelines................................................. 18

10.2 Layout Example.................................................... 19

11 Device and Documentation Support................. 20

11.1 Third-Party Products Disclaimer ........................... 20

11.2 Trademarks........................................................... 20

11.3 Electrostatic Discharge Caution............................ 20

11.4 Glossary................................................................ 20

12 Mechanical, Packaging, and Orderable

Information........................................................... 20

4 Revision History

Changes from Revision B (September 2010) to Revision C Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1

Changes from Revision A (November 2005) to Revision B Page

• Changed From: pin 48 = PGND1 To: pin 18 = PGND1 in the Pin Out illustration................................................................. 3

• Updated the Function Block Diagram................................................................................................................................... 10

• Figure 19 - Removed the hysteretic symbol from the PWM component.............................................................................. 15

• Updated equation 9. Changed From: V

x 0.01 To: V

OUT

x 0.0132.................................................................................. 16

OUT

Changes from Original (November 2005) to Revision A Page

• Updated the the circut illustration, Pin 21 changed From DRVL1 To: DRVH1 and Pin 19 changed From: DRVH1 to

DRVL1.................................................................................................................................................................................... 1

• PG low hysteresis (PGOODx goes low) - deleted the Min -4% and Max -6% values ........................................................... 6

• PG high hysteresis (PGOODx goes low) - deleted the Min 4% and Max 6% values ............................................................ 6

• Hysteresis (recovery < 20 μs) - deleted the Min 8% and Max 12% values ........................................................................... 6

• Updated Figure 18, Pin 21 changed From DRVL1 To: DRVH1 and Pin 19 changed From: DRVH1 to DRVL1................. 14

Product Folder Links: TPS51124

PGOOD124

EN123

LL120DRVL1

DRVH121VBST1

PGND118 TRIP1

TRIP214 PGND213

V5FILT15

V5IN

VO1

VFB1

VFB2 5

VO2

TONSEL 4

GND

DRVL

DRVH

VBST

Thermal Pad

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5 Pin Configuration and Functions

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

24-Pin VQFN With Exposed Thermal Pad

RGE Package

Top View

Pin Functions

NAME NO.

DRVH1 21 DRVH2 10 DRVL1 19 DRVL2 12 EN1 23 EN2 8 GND 3 I Signal ground pin LL1 20 LL2 11 PGND1 18 PGND2 13 PGOOD1 24 Power Good window comparator open drain output for channel 1 and 2. Pull up with a resistor to 5 V, or

PGOOD2 7 TONSEL 4 I On-time selection pin. See Table 1.

TRIP1 17 Overcurrent trip point set input. Connect resistor from this pin to GND to set threshold for synchronous lowTRIP2 14 VBST1 22 Supply input for synchronous high-side MOSFET driver (Boost Terminal). Connect capacitor from this pin VBST2 9 VFB1 2

VFB2 5 VO1 1 VO2 6

V5FILT 15 I V5IN 16 I 5-V power supply input for FET gate drivers. Internally connected to VBSTx by PN diodes.

I/O DESCRIPTION

Synchronous high-side MOSFET driver outputs. LL node referenced floating drivers. The gate drive voltage

is defined by the voltage across VBST to LL node flying capacitor. Synchronous low-side MOSFET driver outputs. PGND referenced drivers. The gate-drive voltage is defined

by V5IN voltage.

I Channel 1 and channel 2 enable pins. Connect to 5 V or 3.3 V to turn on SMPS

Switch node connections for high-side drivers return. Also serve as input to current comparators and input

I/O

voltage monitor for on-time control circuitry. Ground returns for DRVL1 and DRVL2. Also serve as input of current comparators. Connect PGND1,

I/O

PGND2, and GND strongly together near the IC. Output discharge current flows through this pin, also.

O appropriate signal voltage. Current capability is 5 mA. PGOOD goes high 0.5 ms after VFB comes within

specified limits. Power bad, or the terminal goes low, is within 10 μs.

I side R

current comparator.

I to respective LL terminals. An internal PN diode is connected between V5IN to each of these pins. User

can add external Schottky diode if forward drop is critical to drive the MOSFET.

I SMPS voltage feedback inputs. Connect with feedback resistor divider.

Output connections to SMPS. These terminals serve two functions: On-time adjustment and output

discharge. 5-V power supply input for the entire control circuit except the MOSFET drivers. Connect RC low-pass filter

from V5IN to V5FILT.

sense. Voltage across this pin and GND is compared to voltage across PGND and LL at over-

DS(on)

Product Folder Links: TPS51124

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

6 Specifications

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6.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

VBST1, VBST2 –0.3 36

Input voltage V

Output voltage

Operating ambient temperature –40 85 °C

Junction temperature –40 125 °C

Storage temperature –55 150 °C

stg

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal unless otherwise noted

VBST1, VBST2 (wrt LLx) –0.3 6 V5IN, V5FILT, EN1, EN2, VFB1, VFB2, TRIP1, TRIP2, VO1,

VO2, TONSEL DRVH1, DRVH2 –1 36 DRVH1, DRVH2 (wrt LLx) –0.3 6 LL1, LL2 –2 30 V PGOOD1, PGOOD2, DRVL1, DRVL2 –0.3 6 PGND1, PGND2 –0.3 0.3

–0.3 6

6.2 Recommended Operating Conditions

over operating free-air temperature (unless otherwise noted)

MIN MAX UNIT

Supply input voltage V5IN, V5FILT 4.5 5.5 V

VBST1, VBST2 –0.1 34

Input voltage VBST1, VBST2 (wrt LLx) –0.1 5.5 V

EN1, EN2, VFB1, VFB2, TRIP1, TRIP2, VO1, VO2, TONSEL –0.1 5.5 DRVH1, DRVH2 –0.8 34 DRVH1, DRVH2 (wrt LLx) –0.1 5.5

Output voltage LL1, LL2 –1.8 28 V

PGOOD1, PGOOD2, DRVL1, DRVL2 –0.1 5.5 PGND1, PGND2 –0.1 0.1

TAOperating ambient temperature –40 85 °C

6.3 Thermal Information

TPS51124

THERMAL METRIC

θJA

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Junction-to-ambient thermal resistance 42.9 °C/W

(1)

Product Folder Links: TPS51124

VQFN UNIT

24 PINS

www.ti.com

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

6.4 Electrical Characteristics

over operating free-air temperature range, V5IN = V5FILT = 5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SUPPLY CURRENT

V5FILT

V5INSDN

V5FILTSD

V5FILT supply current EN1 = EN2 = 5 V, VFB1 = VFB2 = 0.77 V, 350 700 μA

V5IN shutdown current V5IN current, no load, EN1 = EN2 = 0 V 1 μA V5FILT shutdown current V5FILT current, no load, EN1 = EN2 = 0 V 1 μA

VFB VOLTAGE and DISCHARGE RESISTANCE

VFB

VFBSKIP

VFB

Dischg

VFB regulation voltage FB voltage, skip mode (f

VFB regulation voltage tolerance

VFB regulation shift in 0.758-V target for resistor divider. See PWM Operation of continuous conduction Detailed Description

VFB input current VFBx = 0.758 V, absolute value 0.02 0.1 μA VO discharge resistance ENx = 0 V, VOx = 0.5 V, TA= 25°C 10 20 Ω

OUTPUT: N-CHANEEL MOSFET GATE DRIVERS

DRVH

DRVL

DRVH resistance

DRVL resistance

Dead time

INTERNAL BST DIODE

FBST

VBSTLK

Forward voltage V VBST leakage current 0.1 1 μA

ON-TIME TIMER CONTROL AND INTERNAL SOFT START,

ON11

ON12

ON13

ON21

ON22

ON23

ON(MIN)

OFF(MIN)

CH1, 240-kHz setting VO1 = 1.5 V,TONSEL = GND, LL1 = 12 V 440 500 560 ns CH1, 300-kHz setting VO1 = 1.5 V, TONSEL = FLOAT, LL1 = 12 V 340 390 440 ns CH1, 360-kHz setting VO1 = 1.5 V,TONSEL = V5FILT, LL1 = 12 V 265 305 345 ns CH2, 300-kHz setting VO2 = 1.05 V, TONSEL = GND, LL2 = 12 V 235 270 305 ns CH2, 360-kHz setting VO2 = 1.05 V, TONSEL = FLOAT, LL2 = 12 V 180 210 240 ns CH2, 420-kHz setting VO2 = 1.05 V, TONSEL = V5FILT, LL2 = 12 V 120 150 180 ns CH2 On time VO2 = 0.76 V, TONSEL = V5FILT, LL2 = 28 V 80 110 140 ns CH1/CH2 Min. off time LL = –0.1 V, TA= 25°C, VFB = 0.7 V 435 ns

Internal SS time 0.85 1.2 1.40 ms

UVLO/LOGIC THRESHOLD

UV5VFILT

V5FILT UVLO threshold V

ENx threshold V

ENx input current Absolute value

V5FILT current, no load, LL1=LL2=0.5V

/10) 764 mV

PWM

TA= 25°C, bandgap initial accuracy –0.9% 0.9% TA= 0°C to 85°C TA= –40°C to 85°C

Source, V Sink, V

DRVHx-LLx

Source, V Sink, V

DRVLx–PGNDx

(1)

VBSTx–DRVHx

= 0.5 V 5 7 Ω

= 0.5 V 1.5 2.5 Ω

V5IN–DRVLx

= 0.5 V 4 6 Ω

= 0.5 V 1 2.0 Ω

DRVHx-low (DRVHx = 1 V) to DRVLx-on (DRVLx = 4 V), LL = –0.05 V,

DRVLx-low (DRVLx = 1 V) to DRVHx-on (DRVHx = 4 V), LL = –0.05 V,

V5IN–VBSTx

, IF= 10 mA, TA= 25°C 0.7 0.8 0.9 V

VBST = 34 V, LL = 28 V, VOx = 5.5 V, TA= 25°C

Internal soft start, time from ENx > 3 V to VFBx regulation value = 735 mV

Wake up 3.7 4.0 4.3 Hysteresis 0.2 0.3 0.4 Wake up 1.0 1.3 1.5 Hysteresis 0.2

(2)

TPS51124

–1.3% 1.3% –1.6% 1.6%

758 mV

10 20 50 ns

30 40 60 ns

0.02 0.1 μA

(1) Specified by design. Not production tested. (2) Ensured by design. Not production tested.

Product Folder Links: TPS51124

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

Electrical Characteristics (continued)

over operating free-air temperature range, V5IN = V5FILT = 5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

(2)

Fast

TONSEL

TONSEL threshold Medium

TONSEL input current μA

CURRENT SENSE

TRIP

OCLoff

Rtrip

TRIP source current VTRIPx < 0.3 V, TA= 25°C 9 10 11 μA I

temperature On the basis of 25°C

ITRIP

TRIP

coeffficent C OCP compensation offset –10 0 10 mV Zero cross detection VPGNDx-LLx voltage, PGOODx = Hi

comparator offset Current limit threshold V

setting range

POWERGOOD COMPARATOR

THPG

PGMAX

PGDEL

PG threshold

PG sink current PGOODx = 0.5 V 2.5 5.0 mA PG delay Delay for PG in 400 510 620 μs

OUTPUT UNDERVOLTAGE AND OVERVOLTAGE PROTECTION

OVP

OVPDEL

UVP

UVPDEL

UVPEN

Output OVP trip threshold OVP detect 110% 115% 120% Output OVP prop delay 1.5 μs Output UVP trip threshold Hysteresis (recovery < 20 μs) 10% Output UVP delay 20 32 40 μs Output UVP enable delay After 1.7 × Tss, UVP protection engaged 1.4 2 2.4 ms

THERMAL SHUTDOWN

SDN

Thermal shutdown threshold

(2)

Slow TONSEL=0V, current out of the pin TONSEL=5V, current in to the pin

(2)

TRIPx-GND

– V

PGNDx-LLx

= 60 mV

) voltage,

voltage, all temperatures

(2)

PG in from lower (PGOODx goes hi) 92.5% 95% 97.5% PG low hysteresis (PGOODx goes low) –5% PG in from higher (PGOODx goes hi) 102.5

PG high hysteresis (PGOODx goes low) 5%

Shutdown temperature Hysteresis

(2)

V5FIL

T –0.3

V5FILT V

–1.0

1 1

4200

0.5 mV

30 200 mV

105% 107.5%

160

www.ti.com

0.5

ppm/°

°C

Product Folder Links: TPS51124

100

200

300

400

500

0 5 10 15 20 25

− SwitchingFrequency − kHz

CH1

CH2

VI− InputVoltage V−

TONSEL=GND

100

120

140

−50 0 50 100 150

OVP

UVP

− OVP/UVP Threshold − %

OVP

UVP

TJ − Junction Temperature − 5C

0.2

0.4

0.6

0.8

−50 0 50 100 150

V5INSDN

− Shutdown Current − Aµ

TJ − Junction Temperature − 5C

−50 0 50 100 150

TRIP

− Trip Source Current − Aµ

TJ − Junction Temperature − 5C

0.2

0.4

0.6

0.8

−50 0 50 100 150

V5FLTSDN

− Shutdown Current − Aµ

TJ − Junction Temperature − 5C

100

200

300

400

500

−50 0 50 100 150

V5FILT

− Supply Current − Aµ

TJ − Junction Temperature − 5C

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6.5 Typical Characteristics

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

Figure 1. V5FILT Supply Current vs Junction Temperature

Figure 3. V5IN Shutdown Current vs Junction Temperature

Figure 2. V5FILT Shutdown Current vs Junction

Temperature

Figure 4. Trip Source Current vs Junction Temperature

(1) The data of Figure 6–Figure 8 are measured from the Typical Application Circuit of Figure 18 and Table 2.

Figure 5. OVP/UVP Threshold vs Junction Temperature

Figure 6. Switching Frequency (Slow) vs Input Voltage

Product Folder Links: TPS51124

(1)

100

200

300

400

500

0.001 0.01 0.1 1 10

CH2

CH1

TONSEL = V5FILT

IO − Output Current − A

− Switching Frequency − kHz

1.025

1.050

1.075

1.1

0.001 0.01 0.1 1 10

VI = 21 V

VI = 12 V

VI = 7 V

1.05 V TONSEL = FLOAT

OUT1

− Output Voltage − V

OUT1

− Output Current − A

100

200

300

400

500

0.001 0.01 0.1 1 10

CH2

CH1

TONSEL = GND

IO − Output Current − A

− Switching Frequency − kHz

100

200

300

400

500

0.001 0.01 0.1 1 10

CH2

CH1

TONSEL = FLOAT

IO − Output Current − A

− Switching Frequency − kHz

100

200

300

400

500

0 5 10 15 20 25

CH1

CH2

TONSEL=FLOAT

− SwitchingFrequency − kHz

VI− InputVoltage − V

100

200

300

400

500

0 5 10 15 20 25

CH1

CH2

TONSEL=V5FILT

− SwitchingFrequency − kHz

VI− InputVoltage − V

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

Typical Characteristics (continued)

Figure 7. Switching Frequency (MED) vs Input Voltage Figure 8. Switching Frequency (Fast) vs Input Voltage

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Figure 9. Switching Frequency (Slow) vs Output Voltage

Figure 11. Switching Frequency (Fast) vs Output Voltage

(1)

Figure 10. Switching Frequency (MED) vs Output Voltage

Figure 12. 1.05-V Output Voltage vs Output Current

Product Folder Links: TPS51124

100

0.001 0.01 0.1 1 10

VI=21V

VI=7V

1.5V TONSEL=FLOAT

OUT2

− OutputCurrent − A

VI=12V

− Efficiency − %

1.425

1.450

1.475

1.500

1.525

1.550

1.575

0 5 10 15 20 25

1.5 V TONSEL = FLOAT

OUT2

− Output Voltage − V

VI − Input Voltage − V

IO = 0 A

IO = 5 A

100

0.001 0.01 0.1 1 10

VI=21V

VI=7V

1.05V TONSEL=FLOAT

OUT1

− OutputCurrent − A

VI=12V

− Efficiency − %

1.425

1.450

1.475

1.500

1.525

1.550

1.575

0.001 0.01 0.1 1 10

VI = 21 V

VI = 12 V

VI = 7 V

1.5 V TONSEL = FLOAT

OUT2

− Output Voltage − V

OUT2

− Output Current − A

1.025

1.050

1.075

1.1

0 5 10 15 20 25

1.05 V TONSEL = FLOAT

OUT1

− Output Voltage − V

VI − Input Voltage − V

IO = 0 A

IO = 5 A

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Typical Characteristics (continued)

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

Figure 13. 1.5-V Output Voltage vs Output Current

(1)

Figure 14. 1.05-V Output Voltage vs Input Voltage

Figure 15. 1.5-V Output Voltage vs Input Voltage Figure 16. 1.05-V Efficiency vs Output Current

(1) The data of Figure 13–Figure 16 are measured from the Typical Application Circuit of Figure 18 and Table 2 (1) The data of Figure 17–Figure 22 are measured from the Typical Application Circuit of Figure 18 and Table 2

Figure 17. 1.5-V Efficiency vs Output Current

Product Folder Links: TPS51124

(1)

Ref −30/10%

Ref +15%

Ref

758 mV

SSx

VFBx

TRIPx

10 µA

GND

LLx

PGNDx

LLx

VOx

LLx

PGNDx

LLx

ONx

OCP

PWM

Ref +5/10%

Ref −5/10%

Control Logic

Shot

On/Off Time Minimum On/Off Light Load, OVP/UVP, Discharge Control

PGNDx

Delay

XCON

T ONSEL

Sdn

Fault

DRVLx

V5IN

LLx

DRVHx

VBSTx

THOK

V5OK

PGNDx

PGOODx

V5IN

4 V/3.7 V

V5OK

THOK

BGR

V5FIL T

VO1

VBST1

DRVH1

LL1

DRVL1

PGND1

Switcher Controller

V5DRV

Ref

Fault

Sdn

ON1

SS1

ANALOG/SUB GND

EN/SS

Control

TRIP1

VFB1

PGOOD1

EN1

EN2

GND

PGOOD2

VFB2

TRIP2

SS2

ON2

Sdn

Fault

Ref

V5DRV

Switcher Controller

VO2

VBST2

DRVH2

LL2LL2

DRVL2

PGND2

1 V

T ONSEL

4 V

Frequency Control

FAST

SLOW

160 °C/

150 °C

MID

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

www.ti.com

7 Detailed Description

7.1 Overview

The TPS51124 is a cost-effective, dual-synchronous buck controller targeted for notebook I/O and low voltage system bus supply solutions. With D-CAP™ control mode implemented, compensation network can be removed. Besides, the fast transient response also reduced the output capacitance.

7.2 Functional Block Diagram

Product Folder Links: TPS51124

OUT(LL)

2 L ƒ

VIn* V

OUT

TPS51124

www.ti.com

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

7.3 Feature Description

7.3.1 PWM Operation

The main control loop of the switching mode power supply (SMPS) is designed as an adaptive on-time pulse width modulation (PWM) controller. It supports a proprietary D-CAP Mode. D-CAP Mode uses an internal compensation circuit and is suitable for low external component-count configuration, with appropriate amount of ESR at the output capacitor(s). The output voltage is monitored at a feedback point voltage. The reference voltage at the feedback point is a combination of a fixed 0.750-V precision reference and a synchronized, precision 15-mV ramp signal. Lower output voltages in notebook systems (e.g., 1.05 V, 1.5 V) require extremely low output ripple. By providing a ramp signal, the TPS51124 is easier to use in low-output ripple systems. The combination of the precision ramp and reference yield an effective target reference of 0.758 V. The accuracy of this effective reference remains 1.3% over line and temperature.

At the beginning of each cycle, the synchronous high-side MOSFET is turned on, or becomes ON state. This MOSFET is turned off, or becomes OFF state, after the internal one-shot timer expires. This one shot is determined by the converter’s input voltage, VIN, and the output voltage, VOUT, to keep the frequency fairly constant over the input voltage range; hence, it is called adaptive on-time control (see PWM Frequency and Adaptive On-time Control). The high-side MOSFET is turned on again when feedback information indicates insufficient output voltage, and inductor current information indicates a below-the-over-current limit condition. Repeating operation in this manner, the controller regulates the output voltage. The synchronous low-side MOSFET is turned on each OFF state to keep the conduction loss at a minimum. The low-side MOSFET is turned off when the inductor current information detects zero level. This enables seamless transition to the reduced frequency operation at light-load conditions so that high efficiency is kept over a broad range of load current.

7.3.2 Light-Load Condition

TPS51124 automatically reduces switching frequency at light-load conditions to maintain high efficiency. This reduction of frequency is achieved smoothly and without increase of Vout ripple or load regulation. Detail operation is described as follows. As the output current decreases from heavy-load condition, the inductor current is also reduced, and eventually comes to the point that its valley touches zero current, which is the boundary between continuous conduction and discontinuous conduction modes. The low-side MOSFET is turned off when this zero inductor current is detected. As the load current is further decreased, the converter runs in discontinuous conduction mode and it takes longer and longer to discharge the output capacitor to the level that requires the next ON cycle. The ON time is kept the same as that in the heavy-load condition. In reverse, when the output current increases from light load to heavy load, the switching frequency increases to the preset value as the inductor current reaches the continuous conduction. The transition load point to the light-load operation, I

OUT(LL)

(i.e., the threshold between continuous and discontinuous conduction mode) can be calculated as follows;

(1)

where f is the PWM switching frequency. Switching frequency versus output current in the light-load condition is a function of L, f, Vin, and Vout, but it

decreases almost proportional to the output current from the I

OUT(LL)

given in Equation 1.

It should be noted that in the PWM control path, there is a small ramp. This ramp is transparent in normal, continuous conduction mode and does not measurably affect the regulation voltage. However, in discontinuous, light-load mode, an upward shift in regulation voltage of about 0.75% will be observed. The variation of this shift minimally affects the reference tolerance. Therefore, the reference value in skip mode is 0.764 V ±1.3% over line and temperature.

Product Folder Links: TPS51124

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

www.ti.com

Feature Description (continued)

7.3.3 Low-Side Driver

The low-side driver is designed to drive high current low R represented by its internal resistances, which are 4 Ω for V5IN to DRVLx, and 1 Ω for DRVLx to PGNDx. A dead time to prevent shoot through is internally generated between high-side MOSFET off to low-side MOSFET on, and low-side MOSFET off to high-side MOSFET on. A 5-V bias voltage is delivered from V5IN supply. The instantaneous drive current is supplied by an input capacitor connected between V5IN and GND. The average drive current is equal to the gate charge at Vgs = 5 V times switching frequency. This gate drive current, as well as the high-side gate drive current times 5 V, makes the driving power that needs to be dissipated from TPS51124 package.

7.3.4 High-Side Driver

The high-side driver is designed to drive high-current, low R floating driver, 5-V bias voltage is delivered from V5IN supply. The average drive current is also calculated by the gate charge at Vgs = 5 V times switching frequency. The instantaneous drive current is supplied by the flying capacitor between VBSTx and LLx pins. The drive capability is represented by its internal resistances, which are 5 Ω for VBSTx to DRVHx and 1.5 Ω for DRVHx to LLx.

7.3.5 PWM Frequency and Adaptive On-Time Control

TPS51124 employs adaptive on-time control scheme and does not have a dedicated oscillator on board. However, the part runs with pseudo-constant frequency by feed-forwarding the input and output voltage into the on-time one-shot timer. The frequencies are set by TONSEL terminal connection as Table 1. The on-time is controlled inverse proportional to the input voltage and proportional to the output voltage so that the duty ratio is kept as VOUT/VIN technically with the same cycle time. Although the TPS51124 does not have a pin connected to VIN, the input voltage is monitored at LLx pin during the ON state. This helps pin count reduction to make the part compact without sacrificing its performance.

N-channel MOSFET(s). The drive capability is

DS(on)

N-channel MOSFET(s). When configured as a

DS(on)

Table 1. TONSEL Connection and Switching Frequency Table

(Frequencies Are Approximate)

TONSEL CONNECTION SWITCHING FREQUENCY

CH1 CH2

GND 240 kHz 300 kHz

FLOAT (Open) 300 kHz 360 kHz

V5FILT 360 kHz 420 kHz

7.3.6 Powergood

The TPS51124 has the powergood output for both switcher channels. The powergood function is activated after soft start has finished. If the output voltage becomes within ±5% of the target value, internal comparators detect power good state and the power good signal becomes high after a 510-μs internal delay. During start-up, this internal delay starts after 1.7 times internal soft-start time to avoid a glitch of powergood signal. If the feedback voltage goes outside of ±10% of the target value, the powergood signal becomes low after 10-μs internal delay.

Also note that if the feedback voltage goes +10% above target value and the powergood signal flags low, then the loop attempts to correct the output by turning on the low-side driver (forced PWM mode). After the feedback voltage returns to be within +5% of the target value and the powergood signal goes high, the controller returns back to auto-skip mode.

7.3.7 Output Discharge Control

TPS51124 discharges the output when ENx is low, or the controller is turned off by the protection functions (OVP, UVP, UVLO, and thermal shutdown). TPS51124 discharges outputs using an internal, 10-Ω MOSFET which is connected to VOx and PGNDx. The external low-side MOSFET is not turned on for the output discharge operation to avoid the possibility of causing negative voltage at the output. Output discharge time constant is a function of the output capacitance and the resistance of the internal discharge MOSFET. This discharge ensures that, on restart, the regulated voltage always starts from zero volts. In case a SMPS is restarted before discharge completion, discharge is terminated and the switching resumes after the reference level, ramped up by an internal DAC, comes back to the remaining output voltage.

Product Folder Links: TPS51124

ocl

+ V

tripńRDS(on)

) I

ripple

ń2 +

trip

DS(on)

)

2 L ƒ

VIN* V

OUT

trip

(mV) + R

trip

(kW) 10 (mA)

TPS51124

www.ti.com

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

7.3.8 Current Protection

TPS51124 has cycle-by-cycle over-current limiting control. The inductor current is monitored during the OFF state and the controller keeps the OFF state during the inductor current is larger than the over-current trip level. In order to provide both good accuracy and cost effective solution, TPS51124 supports temperature compensated MOSFET R resistor, R

. TRIPx terminal sources 10-μA Itrip current and the trip level is set to the OCL trip voltage V

trip

sensing. TRIPx pin should be connected to GND through the trip voltage setting

DS(on)

trip

below.

(2)

The trip level should be in the range of 30 mV to 200 mV over all operational temperatures. The inductor current is monitored by the voltage between PGNDx pin and LLx pin so that LLx pin should be connected to the drain terminal of the low-side MOSFET. Itrip has 4200 ppm/°C temperature slope to compensate the temperature dependency of the R connected to the source terminal of the low-side MOSFET. As the comparison is done during the OFF state, V sets the valley level of the inductor current. Thus, the load current at over-current threshold, I

. PGNDx is used as the positive current sensing node so that PGNDx should be

DS(on)

, can be

ocl

trip

calculated as follows;

(3)

In an over-current condition, the current to the load exceeds the current to the output capacitor; thus, the output voltage tends to fall off (droop). Eventually, it ends up crossing the under-voltage protection threshold and shuts down.

7.3.9 Over and Undervoltage Protection

TPS51124 monitors a resistor divided feedback voltage to detect over and under voltage. When the feedback voltage becomes higher than 115% of the target voltage, the OVP comparator output goes high and the circuit latches as the high-side MOSFET driver OFF and the low-side MOSFET driver ON.

Also, the TPS51124 monitors VOx voltage directly and if it becomes greater than 5.75 V, the TPS51124 turns off the top MOSFET driver, and shuts off both drivers of the other channel.

When the feedback voltage becomes lower than 70% of the target voltage, the UVP comparator output goes high and an internal UVP delay counter begins counting. After 32 μs, TPS51124 latches OFF both top and bottom MOSFET drivers, and shuts off both drivers of the other channel. This function is enabled after 1.7 times soft-start delay time, approximately 2 ms, to ensure start-up properly.

7.3.10 UVLO Protection

TPS51124 has V5FILT under-voltage lock-out protection (UVLO). When the V5FILT voltage is lower than UVLO threshold voltage, the TPS51124 is shut off. This is non-latch protection.

7.3.11 Thermal Shutdown

TPS51124 monitors its own temperature. If the temperature exceeds the threshold value (typically 160°C), the switchers are shut off as both DRVH and DRVL at low; the output discharge function is enabled. TPS51124 is shut off. This is non-latch protection.

7.4 Device Functional Modes

7.4.1 Enable and Soft-Start

The TPS51124 has dedicated ENx pin to enable/disable each channel. When the ENx pin is low, the corresponding channel is disabled; When the ENx pin becomes high, an internal 1.2-ms, voltage servo begins ramping up the reference voltage to the PWM comparator, the output voltage of corresponding channel will ramp up accordingly. By this mean, smooth control of the output voltage is maintained during start-up.

As TPS51124 shares one voltage servo with both channels, if ENx pin is set to high while another channel is starting up, soft start is postponed until another channel soft start has completed. If both of EN1 and EN2 are set high at a same time, both channels start up at same time.

Product Folder Links: TPS51124

75 kΩ

PGOOD1

EN1

PGOOD2

EN2

TPS51124RGE

(QFN24)

13 14 15 16

VBST1

DRVL1

LL1

DRVH1

VBST2

DRVH2

LL2

DRVL2

6 5 4 3 2 1

VO1

1.05 V/10 A

IRF8113

IRF7821

VO2

1.5 V/10 A

IRF8113

IRF7821

Input Voltage

3 V to 28 V

6.8

R2 75

V5IN

4.5 V to 5.5 V

VO2

VO1

VFB2

TONSEL

GND

VFB1

PGND2

TRIP2

V5FILT

V5IN

TRIP1

PGND1

Power Good2

EN2

Power Good1

EN1

SGND

PGNDPGND

SGND

SGND PGND

PGND

73.2 kΩ

kΩ

28.7 kΩ

22 µF

2 x 330 µF

1 µH

10 µF

0.1 µF

4.7 Fμ

6.8 kΩ

1 Fμ

3.3Ω kΩ

0.1 µF

10 µF

1 µH

2 x 330 µF

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

www.ti.com

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TPS51124 is typically used as a dual-synchronous buck controller, which convert an input voltage ranging from 3V to 28 V, to output voltage ranging 0.76 V to 5.5 V, targeted for notebook I/O and low voltage system bus supply solutions.

8.2 Typical Application

Figure 18. Typical Application Circuit

Table 2. Typical Application Circuit Components

SYMBOL SPECIFICATION MANUFACTURER PART NUMBER

C1 330 μF, 2.5 V, 15 mΩ SANYO 2R5TPE330MF C4 330 μF, 2.5 V, 18 mΩ SANYO 2R5TPE330MI

L1, L2 1 μH, 2 mΩ TOKO FDA1254-1R0M C3, C6 10 μF, 25 V TDK C3225X5R1E106 Q1, Q3 30 V, 13 mΩ International Rectifier IRF7821 Q2, Q4 30 V, 7 mΩ International Rectifier IRF8113

Product Folder Links: TPS51124

Vripple +

Vout

0.758

10 [mV]

2p ESR Co

ESR

0.758V

Control

Logic

And

Driver

VIN

VFB

DRVH

DRVL

PWM

Switching Modulator

Voltage Divider

Output Capacitor

−

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SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

8.2.1 Design Requirements Table 3. Design Parameters

PARAMETER VALUE

Input voltage range 3 V to 28 V Channel 1 output voltage 1.05 V Channel 1 output current 10 A Channel 2 output voltage 1.5 V Channel 2 output current 10 A

8.2.2 Detailed Design Procedure

Figure 19 shows a simplified buck converter system using D-CAP Mode.

TPS51124

Figure 19. Simplifying the Modulator

The output voltage is compared with an internal reference voltage after divider resistors, R1 and R2. The PWM comparator determines the timing to turn on the high-side MOSFET. The gain and speed of the comparator is high enough to keep the voltage at the beginning of each on cycle (or the end of off cycle) substantially constant. The DC output voltage may have line regulation due to ripple amplitude that slightly increases as the input voltage increase.

For the loop stability, the 0-dB frequency, f0, defined in Equation 4 needs to be lower than 1/4 of the switching frequency.

(4)

As f0is determined solely by the output capacitor’s characteristics, loop stability of D-CAP Mode is determined by the capacitor’s chemistry. For example, specialty polymer capacitors (SP-CAP) have Co in the order of several 100 μF and ESR in range of 10 mΩ. These make f0in the order of 100 kHz or less and the loop is stable. However, ceramic capacitors have f0at more than 700 kHz, which is not suitable for this operational mode.

Although D-CAP Mode provides many advantages such as ease-of-use, minimum external components configuration, and extremely short response time, a sufficient amount of feedback signal needs to be provided by an external circuit to reduce jitter level. This is due to not employing an error amplifier in the loop. The required signal level is approximately 10 mV at the comparing point (VFB terminal). This gives Vripple at the output node as shown in the following equation.

(5)

Product Folder Links: TPS51124

TONSEL = FLOAT

OUT1

(50 mV/div)

IIND1 (5 A/div)

OUT1

(5 A/div)

t − Time − 20 ms/div

TONSEL = FLOAT

OUT2

(50 mV/div)

IIND2 (5 A/div)

OUT2

(5 A/div)

t − Time − 20 ms/div

OUT

x 0.0132

ripple

OUT

(max)

30 [m ]WESR = =

IND(peak)

trip

DS(on)

)

L ƒ

IN(max)

* V

OUT

IN(max)

L +

IND(ripple)

IN(max)

* V

OUT

IN(max)

OUT(max)

IN(max)

* V

OUT

IN(max)

R1 +

out

* 0.758

0.758

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

The output capacitor's ESR should meet this requirement. The external components selection is much simpler in D-CAP Mode.

1. Determine the value of R1 and R2. Recommended R2 value is from 10 kΩ to 100 kΩ. Determine R1 using the following equation.

2. Choose inductor. The inductance value should be determined to give the ripple current of approximately 1/4 to 1/2 of maximum

output current. Larger ripple current increases the output ripple voltage, improves S/N ratio, and contributes to a stable operation.

The inductor also needs to have low DCR to achieve good efficiency, as well as enough room above peak inductor current before saturation. The peak inductor current can be estimated as follows.

3. Choose output capacitor(s). Organic semiconductor capacitor(s) or specialty polymer capacitor(s) are recommended. Determine ESR to

meet the required ripple voltage indicated previously. A quick approximation is shown here:

www.ti.com

(6)

(7)

(8)

8.2.3 Application Curves

Figure 20. 1.05-V Load Transient Response

(9)

Figure 21. 1.5-V Load Transient Response

Product Folder Links: TPS51124

t Time −1ms/div−

EN1

(5V/div)

VO1(1V/div)

PGOOD1(5V/div)

DRVL1(5V/div)

t − Time − 1 ms/div

EN2 (5 V/div)

VO2 (1 V/div)

PGOOD2 (5 V/div)

DRVL2 (5 V/div)

t − Time − 500 ms/div

EN1 (5 V/div)

VO1 (0.5 V/div)

PGOOD1 (5 V/div)

t − Time − 500 ms/div

EN2 (5 V/div)

VO2 (0.5 V/div)

PGOOD2 (5 V/div)

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TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

Figure 22. 1.05-V Start-Up Waveforms

Figure 24. 1.05-V Discharge Waveforms

Figure 23. 1.5-V Start-Up Waveforms

Figure 25. 1.5-V Discharge Waveforms

(1) The data of Figure 23–Figure 25 are measured from the Typical Application Circuit of Figure 18 and Table 2

(1)

Product Folder Links: TPS51124

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

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9 Power Supply Recommendations

The TPS51124 is designed to operate from input supply voltage in the range of 3V to 28 V, make sure power supply voltage in this range.

10 Layout

10.1 Layout Guidelines

Certain points must be considered before starting a layout using the TPS51124.

• Connect RC low-pass filter from V5IN to V5FILT, 1-μF and 3.3-Ω are recommended. Place the filter capacitor close to the IC, within 12 mm (0.5 inch) if possible.

• Connect the over-current setting resistors from TRIPx to GND, and as close as possible to the IC. The trace from TRIPx to resistor, and resistor to GND, should avoid coupling to high-voltage switching node.

• The discharge path (VOx) should have a dedicated trace to the output capacitor(s), separate from the output voltage sensing trace. Use 1,5-mm (60 mils) or wider trace, with no loops. Tie the feedback-current-setting resistor (the resistor between VFBx to GND) close to the IC’s GND. The trace from this resistor to VFBx pin should be short and thin. Place on the component side and avoid vias between this resistor and the IC.

• Connections from the drivers to the respective gate of the high-side or the low-side MOSFET should be as short as possible to reduce stray inductance. Use 0,65-mm (25 mils) or wider trace.

• All sensitive analog traces and components such as VOx, VFBx, GND, ENx, PGOODx, TRIPx, V5FILT, and TONSEL should be placed away from high-voltage switching nodes such as LLx, DRVLx, DRVHx, or VBSTx nodes to avoid coupling. Use internal layer(s) as ground plane(s) and shield the feedback trace from power traces and components.

• Gather ground terminal of VIN capacitor(s), Vout capacitor(s), and source of low-side MOSFETs as close as possible. GND (signal ground) and PGNDx (power ground) should be connected strongly together near the IC. PCB trace defined as LLx node, which connects to source of high-side MOSFET, drain of low-side MOSFET and high-voltage side of the inductor, should be as short and wide as possible.

• In order to effectively remove heat from the package, prepare thermal land and solder to the package’s thermal pad. Two by two or more vias with a 0,33-mm (13 mils) diameter connected from the thermal land to the internal ground plane should be used to help dissipation. Do NOT connect PGNDx to this thermal land underneath the package.

Product Folder Links: TPS51124

www.ti.com

10.2 Layout Example

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

Figure 26. Layout Example

Product Folder Links: TPS51124

TPS51124

SLVS616C –NOVEMBER 2005–REVISED DECEMBER 2014

www.ti.com

11 Device and Documentation Support

11.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Trademarks

D-CAP is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: TPS51124

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

TPS51124RGER ACTIVE VQFN RGE 24 3000 Green (RoHS

TPS51124RGERG4 ACTIVE VQFN RGE 24 3000 Green (RoHS

TPS51124RGET ACTIVE VQFN RGE 24 250 Green (RoHS

TPS51124RGETG4 ACTIVE VQFN RGE 24 250 Green (RoHS

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

& no Sb/Br)

Lead/Ball Finish

(6)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TPS

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

51124

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

5-Nov-2014

Samples

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

5-Nov-2014

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Nov-2014

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

TPS51124RGER VQFN RGE 24 3000 330.0 12.4 4.3 4.3 1.1 8.0 12.0 Q2

TPS51124RGET VQFN RGE 24 250 180.0 12.4 4.3 4.3 1.1 8.0 12.0 Q2

Type

Package

Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Nov-2014

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS51124RGER VQFN RGE 24 3000 370.0 355.0 55.0

TPS51124RGET VQFN RGE 24 250 195.0 200.0 45.0

Pack Materials-Page 2

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Texas Instruments TPS51124RGER Schematic [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Features 3 Description

2 Applications

Table of Contents

4 Revision History

5 Pin Configuration and Functions

6 Specifications

6.1 Absolute Maximum Ratings

6.2 Recommended Operating Conditions

6.3 Thermal Information

6.4 Electrical Characteristics

6.5 Typical Characteristics

7 Detailed Description

7.1 Overview

7.2 Functional Block Diagram

7.3 Feature Description

7.3.1 PWM Operation

7.3.2 Light-Load Condition

7.3.3 Low-Side Driver

7.3.4 High-Side Driver

7.3.5 PWM Frequency and Adaptive On-Time Control

7.3.6 Powergood

7.3.7 Output Discharge Control

7.3.8 Current Protection

7.3.9 Over and Undervoltage Protection

7.3.10 UVLO Protection

7.3.11 Thermal Shutdown

7.4 Device Functional Modes

7.4.1 Enable and Soft-Start

8 Application and Implementation

8.1 Application Information

8.2 Typical Application

8.2.1 Design Requirements Table 3. Design Parameters

8.2.2 Detailed Design Procedure

8.2.3 Application Curves

9 Power Supply Recommendations

10 Layout

10.1 Layout Guidelines

10.2 Layout Example

11 Device and Documentation Support

11.1 Third-Party Products Disclaimer

11.2 Trademarks

11.3 Electrostatic Discharge Caution

11.4 Glossary

12 Mechanical, Packaging, and Orderable Information