Texas Instruments TPS3890-Q1 Datasheet

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Temperature (qC)

Accuracy (%)

-50 -25 0 25 50 75 100 125

-0.75

-0.5

-0.25

0.25

0.5

0.75

D001

Unit 1 Unit 2

Unit 3 Unit 4

Unit 5 Avg

TPS389012-Q1

RESET

VDD

GND

SENSE

1.8 V

Microcontroller

1.2 V

CORE

I/O

RESET

GND

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TPS3890-Q1

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

TPS3890-Q1

Low Quiescent Current, 1% Accurate Supervisor with Programmable Delay

1 Features

• Qualified for Automotive Applications

• AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: -40°C to 125°C

Ambient Operating Temperature Range – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C4B

• Power-On-Reset (POR) Generator with Adjustable Delay Time: 25 μs to 30 s

• Very Low Supply Current: 2.1 μA (Typical)

• High Threshold Accuracy: 1% (max)

• Precision Hysteresis

• Fixed and Adjustable Threshold Voltages: – Fixed Thresholds for Standard Rails:

1.2 V to 5 V

– Adjustable Down to 1.15 V

• Manual Reset (MR) Input

• Open-Drain RESET Output

• Temperature Range: –40°C to +125°C

• Package: 1.5-mm × 1.5-mm WSON

2 Applications

• Infotainment Head Unit

• Hybrid/Digital Cluster

• External Amplifier

• ADAS Camera

• Automotive Gateway

Typical Application Circuit

3 Description

The TPS3890-Q1 is a precision voltage supervisor with low-quiescent current that monitors system voltages as low as 1.15 V, asserting an open-drain RESET signal when the SENSE voltage drops below a preset threshold or when the manual reset (MR) pin drops to a logic low. The RESET output remains low for the user-adjustable delay time after the SENSE voltage and manual reset (MR) return above the respective thresholds. The TPS3890-Q1 family uses a precision reference to achieve 1% threshold accuracy. The reset delay time can be user-adjusted between 25 μs and 30 s by connecting the CT pin to an external capacitor. The TPS3890-Q1 has a very low quiescent current of 2.1 μA and is available in a small 1.5-mm × 1.5-mm package, making the device well-suited for battery-powered and spaceconstrained applications. The device is fully specified over a temperature range of –40°C to +125°C (TJ).

Device Information

PART NUMBER PACKAGE BODY SIZE (NOM)

TPS3890-Q1 WSON (6) 1.50 mm × 1.50 mm (1) For all available packages, see the orderable addendum at

the end of the data sheet.

SPACE SPACE SPACE SPACE SPACE SPACE SPACE

Accuracy vs Temperature

ITN

(1)

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPS3890-Q1

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

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1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Device Comparison Table..................................... 3

6 Pin Configuration and Functions......................... 3

7 Specifications......................................................... 4

7.1 Absolute Maximum Ratings...................................... 4

7.2 ESD Ratings ............................................................ 4

7.3 Recommended Operating Conditions....................... 4

7.4 Thermal Information.................................................. 4

7.5 Electrical Characteristics........................................... 5

7.6 Timing Requirements................................................ 5

7.7 Typical Characteristics.............................................. 7

8 Detailed Description............................................ 11

8.1 Overview................................................................. 11

8.2 Functional Block Diagram....................................... 11

8.3 Feature Description................................................. 11

8.4 Device Functional Modes........................................ 14

9 Application and Implementation ........................ 15

9.1 Application Information............................................ 15

9.2 Typical Application ................................................. 15

10 Power Supply Recommendations ..................... 16

11 Layout................................................................... 17

11.1 Layout Guidelines ................................................. 17

11.2 Layout Example .................................................... 17

12 Device and Documentation Support................. 18

12.1 Device Support .................................................... 18

12.2 Documentation Support ....................................... 18

12.3 Receiving Notification of Documentation Updates 18

12.4 Community Resources.......................................... 18

12.5 Trademarks........................................................... 19

12.6 Electrostatic Discharge Caution............................ 19

12.7 Glossary................................................................ 19

13 Mechanical, Packaging, and Orderable

Information........................................................... 19

4 Revision History

Changes from Revision A (October 2017) to Revision B Page

• Added Automotive features ................................................................................................................................................... 1

• Added new voltage options to Device Comparison Table...................................................................................................... 3

Changes from Original (March 2017) to Revision A Page

• Added TPS389050L-Q1 to Device Comparison Table .......................................................................................................... 3

Product Folder Links: TPS3890-Q1

1SENSE

2GND

3MR 4 VDD

5 CT

6 RESET

Not to scale

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5 Device Comparison Table

TPS3890-Q1

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

PART NUMBER NOMINAL SUPPLY VOLTAGE NEGATIVE THRESHOLD (V

TPS389001-Q1 Adjustable 1.15 V 1.157 V TPS389012-Q1 1.2 V 1.15 V 1.157 V TPS389015-Q1 1.5 V 1.44 V 1.449 V TPS389018-Q1 1.8 V 1.73 V 1.740 V TPS389025-Q1 2.5 V 2.40 V 2.414 V TPS389030-Q1 3.0 V 2.89 V 2.907 V

TPS389033-Q1 3.3 V 3.17 V 3.189 V TPS389033G-Q1 3.3 V 3.06 V 3.084 V TPS389033K-Q1 3.3 V 2.93 V 2.947 V

TPS389050-Q1 5.0 V 4.80 V 4.828 V TPS389050G-Q1 5.0 V 4.65 V 4.677 V

TPS389050L-Q1 5.0 V 4.40 V 4.425 V

6 Pin Configuration and Functions

DSE Package

6-Pin WSON

Top View

) POSITIVE THRESHOLD (V

ITN

ITP

)

Pin Functions

NO. NAME

1 SENSE I

2 GND — Ground 3 MR I Driving the manual reset pin (MR) low causes RESET to go low (assert). 4 VDD I Supply voltage pin. Good analog design practice is to place a 0.1-µF ceramic capacitor close to this pin.

5 CT —

6 RESET O

I/O DESCRIPTION

This pin is connected to the voltage to be monitored. When the voltage on SENSE falls below the negative threshold voltage V positive threshold voltage V

, RESET goes low (asserts). When the voltage on SENSE rises above the

ITN

, RESET goes high (deasserts).

ITP

The CT pin offers a user-adjustable delay time. Connecting this pin to a ground-referenced capacitor sets the RESET delay time to deassert. t

(sec) = CCT(µF) × 1.07 + 25 µs (nom).

PD(r)

RESET is an open-drain output that is driven to a low-impedance state when either the MR pin is driven to a logic low or the monitored voltage on the SENSE pin is lower than the negative threshold voltage (V RESET remains low (asserted) for the delay time period after both MR is set to a logic high and the SENSE input is above V

. A pullup resistor from 10 kΩ to 1 MΩ should be used on this pin.

ITP

Product Folder Links: TPS3890-Q1

ITN

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SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

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7 Specifications

7.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)

VDD –0.3 7 SENSE –0.3 7

Voltage

RESET –0.3 7 MR –0.3 7 V

Current RESET –20 20 mA

Operating junction, T

Temperature

Storage, T

stg

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

(ESD)

Electrostatic discharge

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

Human-body model (HBM), per AEC Q100-002 Charged-device model (CDM), per AEC Q100-011 ±750

(1)

MIN MAX UNIT

–0.3 7

–40 125 –40 125

°COperating ambient, T

–65 150

VALUE UNIT

(1)

±2000

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

SENSE

RESET

Power-supply voltage 1.5 5.5 V SENSE voltage 0 5.5 V RESET pin voltage 0 5.5 V RESET pin current –5 5 mA Input capacitor, VDD pin 0 0.1 µF Reset timeout capacitor, CT pin 0 26 µF Pullup resistor, RESET pin 1 1000 kΩ Junction temperature (free-air temperature) –40 25 125 ℃

7.4 Thermal Information

TPS3890-Q1

THERMAL METRIC

θJA

θJC(top)

θJB

θJC(bot)

Junction-to-ambient thermal resistance 321.3 °C/W Junction-to-case (top) thermal resistance 207.9 °C/W Junction-to-board thermal resistance 281.5 °C/W Junction-to-top characterization parameter 42.4 °C/W Junction-to-board characterization parameter 284.8 °C/W Junction-to-case (bottom) thermal resistance 142.3 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(1)

UNITDSE (WSON)

6 PINS

Product Folder Links: TPS3890-Q1

TPS3890-Q1

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SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

7.5 Electrical Characteristics

over the operating junction temperature range of –40°C to +125°C (TA= TJ), 1.5 V ≤ VDD≤ 5.5 V, and MR = VDD(unless otherwise noted); typical values are at VDD= 5.5 V and TJ= 25°C

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

POR

ITN

HYST

SENSE

LKG(OD)

(1) V

, V

Input supply voltage 1.5 5.5 V Power-on-reset voltage V

Supply current (into VDD pin)

SENSE input threshold voltage

ITP

accuracy Hysteresis

(1)

Input current

VDD= 3.3 V, I –40°C < TJ< 85°C

VDD= 3.3 V, I –40°C < TJ< 105°C

VDD= 3.3 V, I VDD= 5.5 V, I

–40°C < TJ< 85°C VDD= 5.5 V, I

–40°C < TJ< 105°C VDD= 5.5 V, I

V V

TPS389012-Q1

OL(max)

= 0.2 V, I

RESET

= 15 µA 0.8 V

RESET

= 0 mA,

2.09 3.72

= 0 mA,

= 0 mA 5.8

= 0 mA,

2.29 4

= 0 mA,

= 0 mA 6.5

–1% ±0.5% 1%

0.325% 0.575% 0.825%

= 5 V 8 µA

SENSE

= 5 V, TPS389001-Q1,

SENSE

10 100 nA

CT pin charge current 0.90 1.15 1.35 µA CT pin comparator threshold voltage 1.17 1.23 1.29 V CT pin pulldown resistance When RESET is deasserted 200 Ω Low-level input voltage (MR pin) 0.25 × V High-level output voltage 0.7 x V

Low-level output voltage

Open-drain output leakage

= [(V

HYST

ITP

– V

ITN

) / V

] × 100%.

ITN

VDD≥ 1.5 V, I

VDD≥ 4.5 V, I High impedance,

= V

SENSE

RESET

= 0.4 mA 0.25

RESET

= 2 mA 0.25

RESET

= 3 mA 0.3

RESET

= 5.5 V

4.5

5.2

250 nA

µA

V V

VVDD≥ 2.7 V, I

7.6 Timing Requirements

over the operating junction temperature range of –40°C to +125°C (TA= TJ), 1.5 V ≤ VDD≤ 5.5 V, MR = VDD, and 5% input overdrive

PD(f)

PD(r)

GI(SENSE)

GI(MR)

MRW

d(MR)

STRT

(1) Overdrive = | (VIN/ V

(1)

(unless otherwise noted); typical values are at VDD= 5.5 V and TJ= 25°C

MIN NOM MAX UNIT

SENSE (falling) to RESET propagation delay

CT= open, VDD= 3.3 V 18

CT= open, VDD= 5.5 V 8 SENSE (rising) to RESET propagation delay CT= open, VDD= 3.3 V 25 µs SENSE pin glitch immunity VDD= 5.5 V 9 µs MR pin glitch immunity VDD= 5.5 V 100 ns MR pin pulse duration to assert RESET 1 µs MR pin low to out delay 250 ns Startup delay 325 µs

– 1) × 100% |.

THRESH

Product Folder Links: TPS3890-Q1

µs

Time

0.8 V

ITP

ITN

0.7 V

0.3 V

SENSE

RESET

PD(r)

PD(f)

PD(r)

=SENSE Rising Propagation Delay

= Undeﬁned State

d(MR)

=SENSE Falling Propagation Delay

PD(f)

TPS3890-Q1

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

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Figure 1. Timing Diagram

Product Folder Links: TPS3890-Q1

Temperature (qC)

CT Current (PA)

-50 -25 0 25 50 75 100 125

1.05

1.1

1.15

1.2

D005

1.5 V

5.5 V

Hysteresis (%)

Frequency (%)

0.47 0.51 0.55 0.59 0.63 0.67

ITN

Accuracy (%)

Frequency (%)

-0.25 -0.15 -0.05 0.05 0.15 0.25

ITP

Accuracy (%)

Frequency (%)

-0.25 -0.15 -0.05 0.05 0.15 0.25

Temperature (qC)

Accuracy (%)

-50 -25 0 25 50 75 100 125

-0.75

-0.5

-0.25

0.25

0.5

0.75

D001

Unit 1 Unit 2

Unit 3 Unit 4

Unit 5 Avg

Temperature (qC)

Accuracy (%)

-50 -25 0 25 50 75 100 125

-0.75

-0.5

-0.25

0.25

0.5

0.75

D002

Unit 1 Unit 2

Unit 3 Unit 4

Unit 5 Avg

TPS3890-Q1

www.ti.com

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

7.7 Typical Characteristics

over the operating junction temperature range of –40°C to +125°C, 1.5 V ≤ VDD≤ 5.5 V, and MR = VDD(unless otherwise noted)

Figure 2. V

Accuracy vs Temperature Figure 3. V

ITN

Tested at VDD= 1.5 V and VDD= 5.5 V, total tests = 136,348

Figure 4. V

Accuracy Histogram

ITN

Accuracy vs Temperature

ITP

Tested at VDD= 1.5 V and VDD= 5.5 V, total tests = 136,348

Figure 5. V

Accuracy Histogram

ITP

Tested at VDD= 1.5 V and VDD= 5.5 V, total tests = 136,348

Figure 6. Hysteresis Histogram

Product Folder Links: TPS3890-Q1

Figure 7. CT Current vs Temperature

Temperature (qC)

Startup Delay (Ps)

-50 -25 0 25 50 75 100 125

100

200

300

400

500

600

D008

VCC = 1.5 V VCC = 3.3 V VCC = 5.5 V

Overdrive (%)

Propagation Delay (Ps)

1 10 100

D009

-40qC 0qC

25qC 85qC

125qC

Temperature (qC)

MR Threshold (V)

-50 -25 0 25 50 75 100 125

0.25

0.5

0.75

D006

Temperature (qC)

MR Threshold (V)

-50 -25 0 25 50 75 100 125

1.25

1.5

1.75

2.25

2.5

2.75

VDD (V)

Supply Current (PA)

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5

D004

-40qC 0qC

25qC 85qC

105qC 125qC

VDD (V)

Supply Current (PA)

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5

-40qC 0qC

25qC 85qC

105qC 125q

TPS3890-Q1

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

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Typical Characteristics (continued)

over the operating junction temperature range of –40°C to +125°C, 1.5 V ≤ VDD≤ 5.5 V, and MR = VDD(unless otherwise noted)

MR = V

Figure 8. Supply Current vs Power-Supply Voltage

Figure 9. Supply Current vs Power-Supply Voltage

MR = 0 V

VDD= 1.5 V

Figure 10. MR Threshold vs Temperature

Figure 12. Startup Delay vs Temperature

Product Folder Links: TPS3890-Q1

VDD= 5.5 V

Figure 11. MR Threshold vs Temperature

VDD= 5.5 V

Figure 13. Propagation Delay (t

PD(r)

) vs Overdrive

Temperature (qC)

SENSE Glitch Immunity (Ps)

-50 -25 0 25 50 75 100 125

D017

Overdrive=3% Overdrive=5% Overdrive=10%

Temperature (qC)

SENSE Glitch Immunity (Ps)

-50 -25 0 25 50 75 100 125

29.5

30.5

31.5

Overdrive=3% Overdrive=5% Overdrive=10%

Overdrive (%)

Propagation Delay (Ps)

1 10 100

D012

-40qC 0qC

25qC 85qC

125qC

Temperature (qC)

SENSE Glitch Immunity (Ps)

-50 -25 0 25 50 75 100 125

29.5

30.5

31.5

Overdrive=3% Overdrive=5% Overdrive=10%

Overdrive (%)

Propagation Delay (Ps)

1 10 100

D010

-40qC 0qC

25qC 85qC

125qC

Overdrive (%)

Propagation Delay (Ps)

1 10 100

D011

-40qC 0qC

25qC 85qC

125qC

TPS3890-Q1

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SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

Typical Characteristics (continued)

over the operating junction temperature range of –40°C to +125°C, 1.5 V ≤ VDD≤ 5.5 V, and MR = VDD(unless otherwise noted)

VDD= 1.5 V

Figure 14. Propagation Delay (t

VDD= 1.5 V

Figure 16. Propagation Delay (t

) vs Overdrive

PD(r)

) vs Overdrive

PD(f)

VDD= 5.5 V

Figure 15. Propagation Delay (t

) vs Overdrive

PD(f)

VDD= 5.5 V

Figure 17. Low-to-High Glitch Immunity vs Temperature

Figure 18. Low-to-High Glitch Immunity vs Temperature

VDD= 1.5 V

Figure 19. High-to-Low Glitch Immunity vs Temperature

Product Folder Links: TPS3890-Q1

VDD= 5.5 V

RESET

(mA)

(V)

0 1 2 3 4 5

0.2

0.4

0.6

0.8

1.2

1.4

1.6

-40qC 0qC

25qC 85qC

105qC 125qC

Temperature (qC)

SENSE Glitch Immunity (Ps)

-50 -25 0 25 50 75 100 125

D018

Overdrive=3% Overdrive=5% Overdrive=10%

RESET

(mA)

(V)

0 1 2 3 4 5

0.2

0.4

0.6

0.8

1.2

1.4

1.6

D015

-40qC 0qC

25qC 85qC

105qC 125qC

TPS3890-Q1

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

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Typical Characteristics (continued)

over the operating junction temperature range of –40°C to +125°C, 1.5 V ≤ VDD≤ 5.5 V, and MR = VDD(unless otherwise noted)

VDD= 1.5 V

Figure 20. High-to-Low Glitch Immunity vs Temperature

VDD= 1.5 V

Figure 22. Low-Level Output Voltage vs RESET Current

VDD= 5.5 V

Figure 21. Low-Level Output Voltage vs RESET Current

Product Folder Links: TPS3890-Q1

TPS389001-Q1

Adjustable Version

SENSE

RESET

GND

1.15 V

REF

Reset

Logic Timer

Fixed Voltage VersionAdjustable Voltage Version

SENSE

RESET

GND

1.15 V

REF

Reset

Logic

Timer

TPS3890-Q1

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SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

8 Detailed Description

8.1 Overview

The TPS3890-Q1 supervisory product family is designed to assert a RESET signal when either the SENSE pin voltage drops below V adjustable time after both the manual reset (MR) and SENSE voltages return above their respective thresholds.

8.2 Functional Block Diagram

or the manual reset (MR) is driven low. The RESET output remains asserted for a user-

ITN

8.3 Feature Description

The combination of user-adjustable reset delay time with a broad range of threshold voltages allow these devices to be used in a wide array of applications. Fixed negative threshold voltages (V to 3.17 V (see the Device Comparison Table for available options), and the adjustable device can be used to customize the threshold voltage for other application needs by using an external resistor divider. The CT pin allows the reset delay to be set between 25 μs and 30 s with the use of an external capacitor.

8.3.1 User-Configurable RESET Delay Time

The rising RESET delay time (t

) can be configured by installing a capacitor connected to the CT pin. The

PD(r)

TPS3890-Q1 uses a CT pin charging current (ICT) of 1.15 µA to help counter the effect of capacitor and boardlevel leakage currents that can be substantial in certain applications. The rising RESET delay time can be set to any value between 25 µs (no CCTinstalled) and 30 s (CCT= 26 µF).

The capacitor value needed for a given delay time can be calculated using Equation 1:

(sec) = CCT× VCT÷ ICT+ t

PD(r)

The slope of Equation 1 is determined by the time that the CT charging current (ICT) takes to charge the external capacitor up to the CT comparator threshold voltage (VCT). When RESET is asserted, the capacitor is discharged

PD(r)(nom)

through the internal CT pulldown resistor (RCT). When the RESET conditions are cleared, the internal precision current source is enabled and begins to charge the external capacitor and when the voltage on this capacitor reaches 1.22 V, RESET is deasserted. Note that in order to minimize the difference between the calculated RESET delay time and the actual RESET delay time, use a low-leakage type capacitor (such as a ceramic capacitor) and minimize parasitic board capacitance around this pin.

Product Folder Links: TPS3890-Q1

) can be factory set from 1.15 V

ITN

(1)

1.2 V 3.3 V

TPS389033-Q1

SEN SE VDDVDD S ENS E

I/OVCORE

GP IO

GNDGNDGND

CTCT

TPS389012-Q1 DSP

3.3 V

RESET

TPS3890-Q1

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

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Feature Description (continued)

8.3.2 Manual Reset (MR) Input

The manual reset (MR) input allows a processor or other logic circuits to initiate a reset. A logic low on MR causes RESET to assert. After MR returns to a logic high and SENSE is above V the user-defined reset delay. If MR is not controlled externally, then MR must be connected to VDD. Note that if the logic signal driving MR is not greater than or equal to VDD, then some additional current flows into VDD and out of MR and the difference is apparent when comparing Figure 8 and Figure 9.

Figure 23 shows how MR can be used to monitor multiple system voltages when only a single CT capacitor is

needed to set the RESET delay time.

, RESET is deasserted after

ITP

8.3.3 RESET Output

RESET remains high (deasserted) as long as SENSE is above the positive threshold (V signal (MR) is logic high. If SENSE falls below the negative threshold (V asserted, driving the RESET pin to a low impedance.

When MR is again logic high and SENSE is above V specified reset delay period (t state and uses a pullup resistor to hold RESET high. Connect the pullup resistor to the proper voltage rail to enable the outputs to be connected to other devices at the correct interface voltage level. RESET can be pulled up to any voltage up to 5.5 V, independent of the device supply voltage. To ensure proper voltage levels, give some consideration when choosing the pullup resistor values. The pullup resistor value is determined by VOL, the output capacitive loading, and the output leakage current (I

8.3.4 SENSE Input

The SENSE input can vary from ground to 5.5 V (7.0 V, absolute maximum), regardless of the device supply voltage used. The SENSE pin is used to monitor the critical voltage rail. If the voltage on this pin drops below V

, then RESET is asserted. When the voltage on the SENSE pin exceeds the positive threshold voltage,

ITN

RESET deasserts after the user-defined RESET delay time. The internal comparator has built-in hysteresis to ensure well-defined RESET assertions and deassertions even

when there are small changes on the voltage rail being monitored. The TPS3890-Q1 device is relatively immune to short transients on the SENSE pin. Glitch immunity is dependent

on threshold overdrive, as illustrated in Figure 19 for V cases, for noisy applications good analog design practice is to place a 1-nF to 10-nF bypass capacitor at the SENSE input to reduce sensitivity to transient voltages on the monitored signal.

Figure 23. Using MR to Monitor Multiple System Voltages

) or if MR is driven low, then RESET is

ITN

, a delay circuit is enabled that holds RESET low for a

). When the reset delay has elapsed, the RESET pin goes to a high-impedance

PD(r)

ITP

LKG(OD)

and Figure 18 for V

ITN

. Although not required in most

ITP

) and the manual reset

ITP

Product Folder Links: TPS3890-Q1

MON

TPS389001-Q1

SENSE

GND

RESET

VDD

TPS3890-Q1

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SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

Feature Description (continued)

The adjustable version (TPS389001-Q1) can be used to monitor any voltage rail down to 1.15 V using the circuit shown in Figure 24.

Figure 24. Using the TPS389001-Q1 to Monitor a User-Defined Threshold Voltage

The target threshold voltage for the monitored supply (V

ITx(MON)

) and the resistor divider values can be calculated

by using Equation 2 and Equation 3, respectively:

Equation 3 can be used to calculate either the negative threshold or the positive threshold by replacing V

either V

ITx(MON)

ITN

TOTAL

= V

ITx

or V

ITP

= R1+ R

× (1 + R1÷ R2) (2)

with

ITx

, respectively.

(3)

Resistors with high values minimize current consumption; however, the input bias current of the device degrades accuracy if the current through the resistors is too low. Therefore, choosing an R

value so that the current

TOTAL

through the resistor divider is at least 100 times larger than the SENSE input current is simplest. See the

Optimizing Resistor Dividers at a Comparator Input application report for more details on sizing input resistors.

8.3.4.1 Immunity to SENSE Pin Voltage Transients

The TPS3890-Q1 is immune to short voltage transient spikes on the input pins. Sensitivity to transients depends on both transient duration and overdrive (amplitude) of the transient. Overdrive is defined by how much VSENSE exceeds the specified threshold, and is important to know because the smaller the overdrive, the slower the response of the outputs (that is, undervoltage and overvoltage). Threshold overdrive is calculated as a percent of the threshold in question, as shown in Equation 4.

Overdrive = | (V

SENSE

/ V

– 1) × 100% | (4)

ITx

Figure 17 to Figure 20 illustrate the glitch immunity that the TPS3890-Q1 has versus temperature with three

different overdrive voltages. The propagation delay versus overdrive curves (Figure 13 to Figure 16) can be used to determine how sensitive the TPS3890-Q1 family of devices are across an even wider range of overdrive voltages.

Product Folder Links: TPS3890-Q1

TPS3890-Q1

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

8.4 Device Functional Modes

Table 1 summarizes the various functional modes of the device.

Table 1. Truth Table

VDD< V

POR

< VDD< V

POR

VDD≥ V VDD≥ V VDD≥ V

(1) When VDDfalls below V

DD(MIN) DD(MIN) DD(MIN) DD(MIN)

(1)

, undervoltage-lockout (UVLO) takes effect and RESET is held low until VDDfalls below V

DD(MIN)

MR SENSE RESET

— — Undefined — — L

L — L H V H V

SENSE SENSE

< V > V

ITN ITP

L H

POR

www.ti.com

8.4.1 Normal Operation (VDD> V

When VDDis greater than V

DD(min)

, the RESET signal is determined by the voltage on the SENSE pin and the

DD(min)

)

logic state of MR.

• MR high: when the voltage on VDD is greater than 1.5 V, the RESET signal corresponds to the voltage on the SENSE pin relative to the threshold voltage.

• MR low: in this mode, RESET is held low regardless of the voltage on the SENSE pin.

8.4.2 Above Power-On-Reset But Less Than V

When the voltage on VDD is less than the V

DD(min)

DD(min)(VPOR

voltage, and greater than the power-on-reset voltage (V

< VDD< V

DD(min)

)

POR

the RESET signal is asserted regardless of the voltage on the SENSE pin.

8.4.3 Below Power-On-Reset (VDD< V

When the voltage on VDD is lower thanV

)

POR

, the device does not have enough voltage to internally pull the

POR

asserted output low and RESET is undefined and must not be relied upon for proper device function.

Product Folder Links: TPS3890-Q1

1.8 V

TPS389018-Q1

VDD VDDSENSE

GNDGND

RESET

XRS

1 MW

Delfino MCU

1.5 nF

3.3 V

External Reset

TPS3890-Q1

www.ti.com

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

9.1 Application Information

The following sections describe in detail how to properly use this device, depending on the requirements of the final application.

9.2 Typical Application

A typical application for the TPS389018-Q1 is shown in Figure 25. The TPS389018-Q1 can be used to monitor the 1.8-V VDD rail required by the TI Delfino™ microprocessor family. The open-drain RESET output of the TPS389018-Q1 is connected to the XRS input of the microprocessor. A reset event is initiated when the VDD voltage is less than V

or when MR is driven low by an external source.

ITN

Figure 25. TPS3890-Q1 Monitoring the Supply Voltage for a Delfino Microprocessor

9.2.1 Design Requirements

The TPS3890-Q1 RESET output can be used to drive the reset (XRS) input of a microprocessor. The RESET pin of the TPS3890-Q1 is pulled high with a 1-MΩ resistor; the reset delay time is controlled by the CT capacitor and is set depending on the reset requirement times of the microprocessor. During power-up, XRS must remain low for at least 1 ms after VDD reaches 1.5 V for the C2000™ Delfino family of microprocessors. For 100-MHz operation, the Delfino TMS320F2833x microcontroller uses a supply voltage of 1.8 V that must be monitored by the TPS3890-Q1.

9.2.2 Detailed Design Procedure

The primary constraint for this application is choosing the correct device to monitor the supply voltage of the microprocessor. The TPS389018-Q1 has a negative threshold of 1.73 V and a positive threshold of 1.74 V, making the device suitable for monitoring a 1.8-V rail. The secondary constraint for this application is the reset delay time that must be at least 1 ms to allow the Delfino microprocessor enough time to startup up correctly. Because a minimum time is required, the worst-case scenario is a supervisor with a high CT charging current (ICT) and a low CT comparator threshold (VCT). For applications with ambient temperatures ranging from –40°C to +125°C, CCTcan be calculated using I

CT(Max)

, V

, and solving for CCTin Equation 1 such that the

CT(MIN)

minimum capacitance required at the CT pin is 1.149 nF. If standard capacitors with ±20% tolerances are used, then the CT capacitor must be 1.5 nF or larger to ensure that the 1-ms delay time is met.

A 0.1-µF decoupling capacitor is connected to the VDD pin as a good analog design practice and a 1-MΩ resistor is used as the RESET pullup resistor to minimize the current consumption when RESET is asserted. The MR pin can be connected to an external signal if desired or connected to VDD if not used.

Product Folder Links: TPS3890-Q1

Temperature (qC)

Startup Delay (Ps)

-50 -25 0 25 50 75 100 125

100

200

300

400

500

600

D008

VCC = 1.5 V VCC = 3.3 V VCC = 5.5 V

TPS3890-Q1

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

Typical Application (continued)

9.2.3 Application Curve

Figure 26. Startup Delay vs Temperature

10 Power Supply Recommendations

www.ti.com

These devices are designed to operate from an input supply with a voltage range between 1.5 V and 5.5 V. An input supply capacitor is not required for this device; however, if the input supply is noisy, then good analog practice is to place a 0.1-µF capacitor between the VDD pin and the GND pin. This device has a 7-V absolute maximum rating on the VDD pin. If the voltage supply providing power to VDD is susceptible to any large voltage transient that can exceed 7 V, additional precautions must be taken.

Product Folder Links: TPS3890-Q1

GND

RESET

VDD

SENSE

Vias used to connect pins for application-specific connections

TPS3890-Q1

www.ti.com

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

11 Layout

11.1 Layout Guidelines

Make sure that the connection to the VDD pin is low impedance. Good analog design practice is to place a

0.1-µF ceramic capacitor near the VDD pin. If a capacitor is not connected to the CT pin, then minimize parasitic

capacitance on this pin so the RESET delay time is not adversely affected.

11.2 Layout Example

The layout example in shows how the TPS3890-Q1 is laid out on a printed circuit board (PCB) with a userdefined delay.

Figure 27. Recommended Layout

Product Folder Links: TPS3890-Q1

TPS3890-Q1

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

www.ti.com

12 Device and Documentation Support

12.1 Device Support

12.1.1 Device Nomenclature

Table 2 shows how to decode the function of the device based on the part number, with TPS389033G-Q1 used

as an example.

Table 2. Device Naming Convention

DESCRIPTION NOMENCLATURE VALUE

(high-accuracy supervisor family)

TPS3890

(nominal rail voltage to be monitored)

(percent below nominal rail voltage for V

(automotive version)

ITN

)

— —

10 1.0 V 12 1.2 V 18 1.8 V 33 3.3 V 50 5.0 V

— 4%

G 7% K 11%

L 12%

— —

12.2 Documentation Support

12.2.1 Related Documentation

For related documentation see the following:

• Optimizing Resistor Dividers at a Comparator Input

• Sensitivity Analysis for Power Supply Design

• Getting Started With TMS320C28x Digital Signal Controllers

• TPS3890EVM-775 Evaluation Module User Guide

• C2000 Delfino Family of Microprocessors

• TMS320F2833x Digital Signal Controllers (DSCs)

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

Product Folder Links: TPS3890-Q1

TPS3890-Q1

www.ti.com

SBVS303B –MARCH 2017–REVISED FEBRUARY 2018

12.5 Trademarks

Delfino, C2000, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: TPS3890-Q1

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

TPS389001QDSERQ1 ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 2N TPS389012QDSERQ1 ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 2O TPS389015QDSERQ1 ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 2P TPS389018QDSERQ1 ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 2Q TPS389025QDSERQ1 ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 2R

TPS389030QDSERQ1 ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 2S TPS389033GQDSERQ1 ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 7V TPS389033KQDSERQ1 ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 7W

TPS389033QDSERQ1 ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 2T TPS389050GQDSERQ1 ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 7T

TPS389050LQDSERQ1 ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 7U

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead finish/ Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

10-Dec-2020

Samples

(4/5)

TPS389050QDSERQ1 ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 7S

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

10-Dec-2020

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TPS3890-Q1 :

Catalog: TPS3890

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 9-Mar-2018

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type

TPS389001QDSERQ1 WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TPS389012QDSERQ1 WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TPS389015QDSERQ1 WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TPS389018QDSERQ1 WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TPS389025QDSERQ1 WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TPS389030QDSERQ1 WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2

TPS389033GQDSERQ1 WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2

TPS389033KQDSERQ1 WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2

TPS389033QDSERQ1 WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2

TPS389050GQDSERQ1 WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2

TPS389050LQDSERQ1 WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2

TPS389050QDSERQ1 WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Quadrant

Pin1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 9-Mar-2018

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS389001QDSERQ1 WSON DSE 6 3000 183.0 183.0 20.0 TPS389012QDSERQ1 WSON DSE 6 3000 183.0 183.0 20.0 TPS389015QDSERQ1 WSON DSE 6 3000 183.0 183.0 20.0 TPS389018QDSERQ1 WSON DSE 6 3000 183.0 183.0 20.0 TPS389025QDSERQ1 WSON DSE 6 3000 183.0 183.0 20.0

TPS389030QDSERQ1 WSON DSE 6 3000 183.0 183.0 20.0 TPS389033GQDSERQ1 WSON DSE 6 3000 183.0 183.0 20.0 TPS389033KQDSERQ1 WSON DSE 6 3000 183.0 183.0 20.0

TPS389033QDSERQ1 WSON DSE 6 3000 183.0 183.0 20.0 TPS389050GQDSERQ1 WSON DSE 6 3000 183.0 183.0 20.0 TPS389050LQDSERQ1 WSON DSE 6 3000 183.0 183.0 20.0

TPS389050QDSERQ1 WSON DSE 6 3000 183.0 183.0 20.0

Pack Materials-Page 2

PACKAGE OUTLINE

PIN 1 INDEX AREA

0.8 MAX

SCALE 6.000

1.55

1.45

1.55

1.45

WSON - 0.8 mm max heightDSE0006A

PLASTIC SMALL OUTLINE - NO LEAD

SEATING PLANE

0.08 C (0.2) TYP

0.05

0.00

4220552/A 04/2021

2X 1

4X 0.5

0.6

0.4

0.7

0.5

PIN 1 ID

0.3

0.2

0.1 C A B

0.05

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

WSON - 0.8 mm max heightDSE0006A

PLASTIC SMALL OUTLINE - NO LEAD

6X (0.25)

4X 0.5

(R0.05) TYP

(0.8)

PKG

(1.6)

5X (0.7)

SYMM

LAND PATTERN EXAMPLE

SCALE:40X

0.05 MAX ALL AROUND

0.05 MIN ALL AROUND

SOLDER MASK OPENING

NON SOLDER MASK

METAL

PADS 4-6 DEFINED

METAL UNDER SOLDER MASK

SOLDER MASK

SOLDER MASK DETAILS

NOTES: (continued)

3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).

www.ti.com

SOLDER MASK OPENING

PADS 1-3 DEFINED

4220552/A 04/2021

EXAMPLE STENCIL DESIGN

WSON - 0.8 mm max heightDSE0006A

PLASTIC SMALL OUTLINE - NO LEAD

6X (0.25)

4X (0.5)

(R0.05) TYP

PKG

(0.8)

(1.6)

5X (0.7)

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:40X

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.

www.ti.com

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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.

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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Texas Instruments TPS3890-Q1 Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Features

2 Applications

3 Description

Table of Contents

4 Revision History

5 Device Comparison Table

6 Pin Configuration and Functions

7 Specifications

7.1 Absolute Maximum Ratings

7.2 ESD Ratings

7.3 Recommended Operating Conditions

7.4 Thermal Information

7.5 Electrical Characteristics

7.6 Timing Requirements

7.7 Typical Characteristics

8 Detailed Description

8.1 Overview

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 User-Configurable RESET Delay Time

8.3.2 Manual Reset (MR) Input

8.3.3 RESET Output

8.3.4 SENSE Input

8.3.4.1 Immunity to SENSE Pin Voltage Transients

8.4 Device Functional Modes

9 Application and Implementation

9.1 Application Information

9.2 Typical Application

9.2.1 Design Requirements

9.2.2 Detailed Design Procedure

9.2.3 Application Curve

10 Power Supply Recommendations

11 Layout

11.1 Layout Guidelines

11.2 Layout Example

12 Device and Documentation Support

12.1 Device Support

12.1.1 Device Nomenclature

12.2 Documentation Support

12.2.1 Related Documentation

12.3 Receiving Notification of Documentation Updates

12.4 Community Resources

12.5 Trademarks

12.6 Electrostatic Discharge Caution

12.7 Glossary

13 Mechanical, Packaging, and Orderable Information