Texas Instruments TPS3831A09DQNR, TPS3831E16DQNR, TPS3831G12DQNR, TPS3831G18DQNR, TPS3831G33DQNR Schematic [ru]

100

110

120

130

140

150

160

170

180

190

200

−40 −15 10 35 60 85
Temperature (°C)

Supply Current (nA)

VDD = 1.2 V
VDD = 3.3 V
VDD = 5.0 V
VDD = 6.5 V

G001

VDD

RESET

GND

TPS383xK33

RST

Microprocessor

3.3 V

C

0.1 F1m

MR

TPS3831

Only

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TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

TPS383x 150-nA, Ultralow Power, Supply Voltage Monitor

1 Features 3 Description

1

• Ultralow Supply Current: 150 nA (Typical)

• Operating Supply Voltage: 0.9 V to 6.5 V

• Valid Reset for VDD> 0.6 V

• Push-Pull RESET Output

• Factory-Trimmed Reset Threshold Voltages

• Temperature Range: –40°C to 85°C

• Packages: 1-mm × 1-mm X2SON or 3-Pin SOT23

2 Applications

• Portable and Battery-Powered Equipment

• Metering

• Industrial Equipment

• Cell Phones specified to have the correct output logic state for

• Glucose Monitors

• Tablets

• Wearables

The TPS3831 and TPS3839 devices (both referred to
as TPS383x) are ultralow current (150 nA, typical),
voltage supervisory circuits that monitor a single
voltage. Both devices initiate an active-low reset
signal whenever the VDDsupply voltage drops below
the factory-trimmed reset threshold voltage. The reset
output remains low for 200 ms (typical) after the V

DD

voltage rises above the threshold voltage and
hysteresis. These devices are designed to ignore fast
transients on the VDD pin. The TPS3831 device
includes a manual reset input that forces RESET low
when MR is low.

The ultralow current consumption of 150 nA makes
these voltage supervisors ideal for use in low-power
and portable applications. The TPS383x devices are

supply voltages down to 0.6 V.
The TPS383x devices feature precision factory-

trimmed threshold voltages and extremely low-power
operation. The TPS3831 device is available in a 4­pin, 1-mm × 1-mm (DQN) X2SON package. The
TPS3839 device is available in a 3-pin SOT23 (DBZ)
package or a 4-pin, 1-mm × 1-mm (DQN) X2SON
package.

Device Information

PART NUMBER PACKAGE

TPS3831 X2SON (4) 1.00 mm x 1.00 mm

TPS3839

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

SOT-23 (3) 2.92 mm x 2.37 mm
X2SON (4) 1.00 mm x 1.00 mm

(1)

PACKAGE SIZE

Typical Application Circuit Supply Current vs Temperature

1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

(NOM)

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

www.ti.com

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Device Options....................................................... 4

6 Pin Configuration and Functions......................... 5

7 Specifications......................................................... 6

7.1 Absolute Maximum Ratings...................................... 6

7.2 ESD Ratings.............................................................. 6

7.3 Recommended Operating Conditions....................... 6

7.4 Thermal Information.................................................. 6

7.5 Electrical Characteristics........................................... 7

7.6 Timing Requirements................................................ 8

7.7 Typical Characteristics.............................................. 9

8 Detailed Description............................................ 11

8.1 Overview ................................................................. 11

8.2 Functional Block Diagram....................................... 11

8.3 Feature Description................................................. 11

8.4 Device Functional Modes........................................ 12

9 Applications and Implementation ...................... 13

9.1 Application Information............................................ 13

9.2 Typical Application .................................................. 13

10 Power Supply Recommendations ..................... 15

11 Layout................................................................... 15

11.1 Layout Guidelines ................................................. 15

11.2 Layout Example .................................................... 15

12 Device and Documentation Support ................. 16

12.1 Device Support...................................................... 16

12.2 Documentation Support ........................................ 16

12.3 Related Links ........................................................ 16

12.4 Community Resources.......................................... 16

12.5 Trademarks ........................................................... 16

12.6 Electrostatic Discharge Caution............................ 16

12.7 Glossary ................................................................ 17

13 Mechanical, Packaging, and Orderable

Information........................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (February 2015) to Revision D Page

• Changed µA to nA in document title....................................................................................................................................... 1

• Added TPS3839G25 to document ......................................................................................................................................... 1

• Changed Applications section: moved Metering bullet to second in list, changed Tablets bullet, added Wearables bullet .. 1

• Changed first paragraph of Description section .................................................................................................................... 1

• Changed Device Information table: changed Package Size column heading and value of SOT-23 row ............................. 1

• Added TPS3839G25 row to Device Options table ................................................................................................................ 4

• Changed Thermal Information table ...................................................................................................................................... 6

• Changed V

IT–

and V

parameters in Electrical Characteristics table: changed test conditions, added TPS3839G25 rows 7

hys

Changes from Revision B (April 2013) to Revision C Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

• Changed title of data sheet ................................................................................................................................................... 1

• Changed Operating Supply Voltage bullet from 0.6 V to 0.9 V.............................................................................................. 1

• Changed last sentence of Description section ...................................................................................................................... 1

• Changed front page figure ..................................................................................................................................................... 1

• Added MR parameter to Absolute Maximum Ratings ........................................................................................................... 6

• Changed condition statement for Electrical Characteristics .................................................................................................. 7

• Changed V

parameter symbol to V

(VO)

............................................................................................................................. 7

POR

• Changed Figure 1................................................................................................................................................................... 8

• Changed Functional Block Diagram; added hysteresis symbol to op amp.......................................................................... 11

• Deleted Typical Application Circuit figure............................................................................................................................. 13

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TPS3831, TPS3839

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Changes from Revision A (September 2012) to Revision B Page

• Changed VDDtest conditions for high-level output voltage parameter................................................................................... 7

Changes from Original (June 2012) to Revision A Page

• Changed data sheet status from product preview to production data.................................................................................... 1

SBVS193D –JUNE 2012–REVISED JULY 2015

Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 3

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

5 Device Options

www.ti.com

PRODUCT PACKAGE-LEAD

TPS3831A09 0.9 X2SON-4 DQN
TPS3831G12 1.1 X2SON-4 DQN
TPS3831E16 1.52 X2SON-4 DQN
TPS3831G18 1.67 X2SON-4 DQN
TPS3831L30 2.63 X2SON-4 DQN
TPS3831K33 2.93 X2SON-4 DQN
TPS3831G33 3.08 X2SON-4 DQN
TPS3831K50 4.38 X2SON-4 DQN

TPS3839A09 0.9

TPS3839G12 1.1

TPS3839E16 1.52

TPS3839G18 1.67

TPS3839G25 2.325 SOT23-3 DBZ

TPS3839L30 2.63

TPS3839K33 2.93

TPS3839G33 3.08

TPS3839K50 4.38

(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

THRESHOLD PACKAGE
VOLTAGE (V) DESIGNATOR

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

SOT23-3 DBZ

X2SON-4 DQN

(1)

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GND

RESET

1

2

3

VDD

VDD

GND

RESET

NC

1

2

3

4

Thermal

Pad

VDD

GND

RESET

MR

1

2

3

4

Thermal

Pad

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6 Pin Configuration and Functions

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

TPS3831 DQN Package

1-mm × 1-mm X2SON

Top View

TPS3839 DQN Package

1-mm × 1-mm X2SON

Top View

TPS3839 DBZ Package

SOT23-3

Top View

Pin Functions

PIN

NO.

NAME

TPS3839 TPS3839 TPS3831

(SOT23-3) (X2SON) (X2SON)

GND 1 3 3 — Ground

MR N/A N/A 2 I After the MR pin is deasserted, the RESET output deasserts after the

NC N/A 2 N/A — No internal connection.

RESET 2 1 1 O

Thermal pad N/A Available Available —
VDD 3 4 4 I Supply voltage

I/O DESCRIPTION

Manual reset. Pull this pin to a logic low to assert the RESET output.
reset delay (td) elapses.

Active-low reset output. RESET has a push-pull output drive and is
capable of directly driving input pins. RESET is low as long as V
remains below the factory threshold voltage, and until the delay time
(td) elapses after VDDrises above the threshold voltage.

Connect to ground or to a floating copper plane for mechanical
stability.

DD

Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 5

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted

Voltage

Current RESET pin –10 10 mA

Temperature

(2)

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) As a result of the low dissipated power in this device, the junction temperature is assumed to be equal to the ambient temperature.

VDD, RESET –0.3 7 V
MR –0.3 VDD+ 0.3 V

Operating ambient, T
Storage, T

stg

A

7.2 ESD Ratings

V

(ESD)

Electrostatic discharge V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
Charged device model (CDM), per JEDEC specification JESD22-C101

(1)

MIN MAX UNIT

–40 85
–65 150

°C

VALUE UNIT

(1)

(2)

±2000

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

V

DD

V

MR

V

RESET

I

RESET

Input supply voltage 0.9 6.5 V
Manual reset pin voltage 0 V

DD

V
RESET pin voltage 0 6.5 V
RESET pin current 0 8 mA

7.4 Thermal Information

TPS3839

THERMAL METRIC

(1)

DBZ (SOT23-3) DQN (X2SON)

3 PINS 4 PINS

R

θJA

R

θJC(top)

R

θJB

ψ

JT

ψ

JB

R

θJC(bot)

Junction-to-ambient thermal resistance 346.6 216.1 °C/W
Junction-to-case (top) thermal resistance 124.4 161.7 °C/W
Junction-to-board thermal resistance 78.9 162.1 °C/W
Junction-to-top characterization parameter 11.5 5.1 °C/W
Junction-to-board characterization parameter 77.3 161.7 °C/W
Junction-to-case (bottom) thermal resistance N/A 123.0 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TPS3831,

TPS3839

UNIT

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TPS3831, TPS3839

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SBVS193D –JUNE 2012–REVISED JULY 2015

7.5 Electrical Characteristics

At TA= –40°C to 85°C, 0.9 V < VDD< 6.5 V, and C1 = 0.1 µF, unless otherwise noted. Typical values are at 25°C.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

V
V
I

DD

V

V

V
V
R

V

V

Input supply voltage 0.9 6.5 V

DD

Minimum VDDvoltage for valid output IOL= 1 µA 0.6 V

(POR)

Supply current (into VDD pin) Output not connected 150 500 nA

VDD= 0.9 V to 1.2 V, IOL= 120 µA 0.4

Low-level output voltage (RESET pin) VDD= 1.2 V to 2.8 V, IOL= 0.5 mA 0.4 V

OL

VDD= 2.8 V to 6.5 V, IOL= 2 mA 0.4
VDD= 0.9 V to 1.2 V, IOH= –50 µA VDD– 0.4

High-level output voltage (RESET pin) VDD= 1.2 V to 3.3 V, IOH= –0.5 mA VDD– 0.4 V

OH

VDD= 3.3 V to 6.5 V, IOH= –2 mA VDD– 0.4

Low-level input voltage (MR pin) 0.3V

IL

High-level input voltage (MR pin) 0.7V

IH

MR pin pullup resistance 10 20 30 kΩ

MR

DD

Negative-going input threshold accuracy TA= 25°C ±1%

TPS383xA09 0.874 0.9 0.914
TPS383xG12 1.073 1.1 1.117
TPS383xE16 1.482 1.52 1.543
TPS383xG18 1.628 1.67 1.695

Negative-going threshold voltage TPS3839G25 2.267 2.325 2.360 V

IT–

TPS383xL30 2.564 2.63 2.669
TPS383xK33 2.857 2.93 2.974
TPS383xG33 3.003 3.08 3.126
TPS383xK50 4.271 4.38 4.446
TPS383xA09 54
TPS383xG12 11
TPS383xE16 15
TPS383xG18 17

Hysteresis voltage TPS383xL30 26 mV

hys

TPS3839G25 23
TPS383xK33 29
TPS383xG33 31
TPS383xK50 44

DD

V
V

Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 7

Time

V

IT-

+ V

HYS

V

IT-

0.7V

DD

0.3V

DD

MR

VDD

0.6 V

RESET

t

d

t

d

t

d

td= Reset Delay

= Undefined State

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

7.6 Timing Requirements

At TA= –40°C to 85°C, 0.9 V < VDD< 6.5 V, and C1 = 0.1 µF, unless otherwise noted. Typical values are at 25°C.

MIN TYP MAX UNIT

t

d

t

PD_VDD

t

PD_MR

RESET delay time (power-up delay) 120 200 350 ms
Propagation delay, VDDfalling (power-down delay) 20 µs
Propagation delay from MR low to RESET low 46 ns

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Figure 1. MR and VDD Reset Timing

8 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated

0.5

1.5

2.5

3.5

0 2 4 6 8 10

IOH (mA)

V

OH

(V)

TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C

VDD = 3.3 V

G005

2

2.5

3

3.5

4

0 2 4 6 8 10 12

IOH (mA)

V

OH

(V)

TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C

VDD =4.0 V

G006

−1

−0.8

−0.6

−0.4

−0.2

0

0.2

−40 −15 10 35 60 85
Temperature (°C)

Change in V

IT–

(%)

TPS3839A09
TPS3839K50

G003

0.8

1

1.2

1.4

1.6

1.8

0 0.5 1 1.5 2 2.5 3 3.5

IOH (mA)

V

OH

(V)

TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C

VDD = 1.8 V

G004

100

110

120

130

140

150

160

170

180

190

200

−40 −15 10 35 60 85
Temperature (°C)

Supply Current (nA)

VDD = 1.2 V
VDD = 3.3 V
VDD = 5.0 V
VDD = 6.5 V

G001

180

190

200

210

220

−40 −15 10 35 60 85
Temperature (°C)

Reset Delay Time (ms)

TPS3839K33

G002

www.ti.com

7.7 Typical Characteristics

At TA= 25°C and C1= 0.1 µF, unless otherwise noted.

Figure 2. Supply Current vs Temperature Figure 3. Reset Delay vs Temperature

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

Figure 4. Threshold Voltage vs Temperature Figure 5. VOHvs IOHand Temperature for VDD= 1.8 V

Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 9

Figure 6. VOHvs IOHand Temperature for VDD= 3.3 V Figure 7. VOHvs IOHand Temperature for VDD= 4.0 V

0

0.2

0.4

0.6

0.8

1

1.2

1.4

0 2 4 6 8 10

IOL (mA)

V

OL

(V)

TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C

VDD = 4.0 V

G009

10

15

20

25

30

35

40

45

50

0 5 10 15 20 25 30 35

VDD voltage drop below V

IT−

(%)

Minimum Pulse Duration Trigger Reset (µs)

Reset Occurs Above Line

G010

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

0 1 2 3 4 5

IOL (mA)

V

OL

(V)

TA = −40°C
TA = 0°C
TA = +25°C
TA = +25°C

VDD = 1.8 V

G007

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

0 2 4 6 8 10

IOL (mA)

V

OL

(V)

TA = −40°C
TA = 0°C
TA = +25°C
TA = +85°C

VDD = 3.3 V

G008

TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

Typical Characteristics (continued)

At TA= 25°C and C1= 0.1 µF, unless otherwise noted.

Figure 8. VOLvs IOLand Temperature for VDD= 1.8 V Figure 9. VOLvs IOLand Temperature for VDD= 3.3 V

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Figure 10. VOLvs IOLand Temperature for VDD= 4.0 V Figure 11. Maximum Pulse Duration vs Percent of

10 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated

Threshold Overdrive