TEXAS INSTRUMENTS TPS3307 Technical data

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1 2 3 4

8 7 6 5

SENSE1 SENSE2 SENSE3

GND

V

DD

MR RESET RESET

D OR DGN PACKAGE

(TOP VIEW)

SENSE 1

SENSE 2 RESET

TPS3307−33

SENSE 3

V

DD

GND

100nF

RESET

V

DD

GND

3.3V5V2.5V

470kΩ

620kΩ

• Applications using DSPs,

Microcontrollers or Microprocessors

w Industrial Equipment w Programmable Controls w Automotive Systems w Portable/Battery Powered Equipment w Intelligent Instruments

w Wireless Communication Systems w Notebook/Desktop Computers

MSP430C325

TPS3307-18 , TPS3307-25 , TPS3307-33

SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006

TRIPLE PROCESSOR SUPERVISORS

FEATURES

• Triple Supervisory Circuits for DSP and

Processor-Based Systems

• Power-On Reset Generator With Fixed Delay

Time of 200ms, No External Capacitor Needed

• Temperature-Compensated Voltage Reference

• Maximum Supply Current of 40 µ A

• Supply Voltage Range: 2V to 6V

• Defined RESET Output From V

• MSOP-8 and SO-8 Packages

• Temperature Range : – 40 ° C to +85 ° C

TYPICAL APPLICATIONS

Figure 1 lists some of the typical applications for the TPS3307 family, and a schematic diagram for a

processor-based system application. This application uses TI part numbers TPS3307-33 and MSP430C325 .

≥ 1.1V

DD

Figure 1. Applications Using the TPS3307 Family

DESCRIPTION

The TPS3307 family is a series of micropower supply voltage supervisors designed for circuit initialization primarily in DSP and processor-based systems, which require more than one supply voltage.

The product spectrum of the TPS3307-xx is designed for monitoring three independent supply voltages:

3.3V/1.8V/adj, 3.3V/2.5V/adj or 3.3V/5V/adj. The adjustable SENSE input allows the monitoring of any supply voltage >1.25V.

The various supply voltage supervisors are designed to monitor the nominal supply voltage as shown in the following supply voltage monitoring table .

PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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TPS3307-18 , TPS3307-25 , TPS3307-33

SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006

During power-on, RESET is asserted when the supply voltage V

becomes higher than 1.1V. Thereafter, the

DD

supply voltage supervisor monitors the SENSE n inputs and keeps RESET active as long as SENSE n remain below the threshold voltage V

.

IT+

An internal timer delays the return of the RESET output to the inactive state (high) to ensure proper system reset. The delay time, t When the voltage at any SENSE input drops below the threshold voltage V

= 200ms, starts after all SENSE n inputs have risen above the threshold voltage V

d (typ)

, the RESET output becomes

IT–

active (low) again. The TPS3307-xx family of devices incorporates a manual reset input, MR. A low level at MR causes RESET to

become active. In addition to the active-low RESET output, the TPS3307-xx family includes an active-high RESET output.

The devices are available in either 8-pin MSOP or standard 8-pin SO packages. The TPS3307-xx devices are characterized for operation over a temperature range of –40 ° C to +85 ° C.

SUPPLY VOLTAGE MONITORING

DEVICE

TPS3307-18 3.3V 1.8V User defined 2.93V 1.68V 1.25V TPS3307-25 3.3V 2.5V User defined 2.93V 2.25V 1.25V TPS3307-33 5V 3.3V User defined 4.55V 2.93V 1.25V

(1) The actual sense voltage has to be adjusted by an external resistor divider according to the application requirements.

T

A

–40 ° C to +85 ° C TPS3307-25D TPS3307-25DGN TIAAQ TPS3307-25Y

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com .

NOMINAL SUPERVISED VOLTAGE THRESHOLD VOLTAGE (TYP)

SENSE1 SENSE2 SENSE3 SENSE1 SENSE2 SENSE3

AVAILABLE OPTIONS

PACKAGED DEVICES

SMALL OUTLINE

(D)

TPS3307-18D TPS3307-18DGN TIAAP TPS3307-18Y

TPS3307-33D TPS3307-33DGN TIAAR TPS3307-33Y

PowerPAD™

µ -SMALL OUTLINE

(DGN)

(1)

MARKING CHIP FORM

DGN PACKAGE (Y)

(1) (1) (1)

Function/Truth Tables

MR SENSE1 > V

L X H 0 0 0 L H H 0 0 1 L H H 0 1 0 L H H 0 1 1 L H H 1 0 0 L H H 1 0 1 L H H 1 1 0 L H H 1 1 1 H L

(1) X = Don't care

IT1

(1)

SENSE2 > V

(1)

X

IT2

SENSE3 > V

IT3

X L H

RESET RESET

.

IT+

2

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_

+

_

+

_ +

R4

R2

R1

R3

Reference

Voltage

of 1.25V

RESET

Logic + Timer

Oscillator

14 kΩ

V

DD

MR

SENSE 1

SENSE 2

GND

SENSE 3

RESET

TPS3307

t

d

t

d

t

d

RESET Because of SENSE Below V

IT

RESET Because of MR

RESET Because of SENSE Below V

IT–

RESET Because of SENSE Below V

IT–

SENSEn

V

(nom)

V

IT–

MR

1

0

1

0

RESET

t

Functional Block Diagram

Timing Diagram

TPS3307-18 , TPS3307-25 , TPS3307-33

SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006

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56

48

TPS3307Y

(1) (2) (3)

(5)

(6)

CHIP THICKNESS: 10 TYPICAL BONDING PADS: 4 × 4 MINIMUM T

J

max = 150°C

TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS

(4)

(7)

(8)

TPS3307-18 , TPS3307-25 , TPS3307-33

SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006

TPS3307Y Chip Information

These chips, when properly assembled, display characteristics similar to those of the TPS3307. Thermal compression or ultrasonic bonding may take place on the doped aluminium bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform.

TERMINAL

NAME NO.

GND 4 Ground MR 7 I Manual reset RESET 5 O Active-low reset output RESET 6 O Active-high reset output SENSE1 1 I Sense voltage input 1 SENSE2 2 I Sense voltage input 2 SENSE3 3 I Sense voltage input 3 V

DD

I/O DESCRIPTION

8 Supply voltage

Table 2. Terminal Functions

4

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TPS3307-18 , TPS3307-25 , TPS3307-33

SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006

Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted).

Supply voltage, V MR pin –0.3V to V All other pins Maximum low output current, I Maximum high output current, I Input clamp current, IIK(VI< 0 or VI> VDD) ± 20mA Output clamp current, IOK(V Continuous total power dissipation See Dissipation Rating Table Operating free-air temperature range, T Storage temperature range, T Soldering temperature +260 ° C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to GND. For reliable operation the device must not be operated at 7V for more than t = 1000h

continuously.

(2)

DD

(2)

OL

OH

< 0 or VO> VDD) ± 20mA

O

stg

(1)

UNIT

7V

+0.3V

DD

–0.3V to 7V

5mA

–5mA

A

–40 ° C to +85 ° C

–65 ° C to +150 ° C

Dissipation Rating Table

PACKAGE

DGN 2.14W 17.1mW/ ° C 1.37W 1.11W

D 725mW 5.8mW/ ° C 464mW 377mW

TA≤ +25 ° C DERATING FACTOR TA= +70 ° C TA= +85 ° C

POWER RATING ABOVE TA= +25 ° C POWER RATING POWER RATING

Recommended Operating Conditions

At specified temperature range.

MIN MAX UNIT

Supply voltage, V Input voltage at MR and SENSE3, V Input voltage at SENSE1 and SENSE2, V High-level input voltage at MR, V Low-level input voltage at MR, V

DD

I

IH

IL

Input transition rise and fall rate at MR, ∆ t/ ∆ V 50 ns/V Operating free-air temperature range, T

A

2 6 V 0 V

0.7 x V

0 (V

DD

+0.3)V

DD

–40 +85 ° C

+ 0.3 V

DD

/1.25V V

IT

0.3 × V

V V

DD

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TPS3307-18 , TPS3307-25 , TPS3307-33

SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006

Electrical Characteristics

Over recommended operating free-air temperature range (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

V

= 2V to 6V, IOH= –20 µ A V

DD

V

High-level output voltage V

OH

Low-level output voltage V

OL

Power-up reset voltage

(1)

VSENSE3 V

= 3.3V, IOH= –2mA V

DD

V

= 6V, IOH= –3mA V

DD

V

= 2V to 6V, IOL= 20 µ A 0.2

DD

= 3.3V, IOL= 2mA 0.4 V

DD

V

= 6V, IOL= 3mA 0.4

DD

V

≥ 1.1V, IOL= 20 µ A 0.4 V

DD

= 2V to 6V, TA= 0 ° C to +85 ° C 1.22 1.25 1.28

DD

VSENSE1, VSENSE2

IT–

Negative-going input threshold

(2)

voltage

V

= 2V to 6V,

VSENSE3 1.22 1.25 1.29 V

DD

TA= –40 ° C to +85 ° C

V

VSENSE1, VSENSE2

V

= 1.25V 10

IT–

V

= 1.68V 15

IT–

V

I

I C

(1) The lowest supply voltage at which RESET becomes active. tr, V (2) To ensure best stability of the threshold voltage, a bypass capacitor (ceramic 0.1 µ F) should be placed close to the supply terminals.

Hysteresis at VSENSEn input V

hys

MR MR = 0.7 × V

High-level input current

H

SENSE1 VSENSE1 = V SENSE2 VSENSE2 = V SENSE3 VSENSE3 = V

Low-level input current

L

Supply current 40 µ A

DD

Input capacitance VI= 0V to V

i

MR MR = 0V, V SENSEn VSENSE1,2,3 = 0V –25 25 nA

= 2.25V 20 mV

IT–

V

= 2.93V 30

IT–

V

= 4.55V 40

IT–

V

= 6V –130 –180

DD,

DD

= 6V 5 8 µ A

DD

= 6V 6 9

DD

= 6V –430 –600 µ A

DD

≥ 15 µ s/V

DD

– 0.2V

DD

– 0.4V V

DD

– 0.4V

DD

1.64 1.68 1.72

2.20 2.25 2.30 V

2.86 2.93 3

4.46 4.55 4.64

1.64 1.68 1.73

2.20 2.25 2.32

2.86 2.93 3.02

4.46 4.55 4.67

–25 25 nA

V

10 pF

6

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Timing Requirements

At V

= 2V to 6V, RL= 1M Ω , CL= 50pF, TA= +25 ° C.

DD

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

t

Pulse width

w

SENSEn V MR VIH= 0.7 × VDD, VIL= 0.3 × V

Switching Characteristics

At V

= 2V to 6V, RL= 1M Ω , CL= 50pF, TA= +25 ° C.

DD

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

t

d

t

PHL

t

PLH

t

PHL

t

PLH

Delay time 140 200 280 ms Propagation (delay) time, MR to RESETMR to

high-to-low level output RESET Propagation (delay) time, MR to RESETMR to

low-to-high level output RESET Propagation (delay) time, SENSEn to RESET

high-to-low level output SENSEn to RESET Propagation (delay) time, SENSEn to RESET

low-to-high level output SENSEn to RESET

TPS3307-18 , TPS3307-25 , TPS3307-33

SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006

= V

SENSEnL

IT–

– 0.2V, V

SENSEnH

= V

+0.2V 6 µ s

IT+

DD

V

I(SENSEn)

MR ≥ 0.7 × VDD. See Timing Diagram.

V

I(SENSEn)

VIH= 0.7 × VDD, VIL= 0.3 × V

VIH= V MR ≥ 0.7 × V

≥ V

+0.2V, VIL= V

IT+

+ 0.2V,

IT+

+ 0.2V,

IT+

DD

IT–

100 ns

DD

– 0.2V,

200 500 ns

1 5 µ s

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4

0

−6

−10

−0.5 0 0.5 1 2.5 3 3.5

− Supply Current −

8

14

18

4 5 6 7

16

12 10

6

2

−2

−4

−8

1.5 2 4.5 5.5 6.5

I

DD

Aµ

VDD − Supply Voltage − V

SENSEn = V

DD

MR = Open TA = 25°C

TPS3307−33

C

1

0.999

0.997

0.995

−40 −15 10 35

Normalized Input Threshold Voltage − VIT(TA), VIT(25 )

1.002

1.003

1.005

60 85

VDD = 2V MR = Open

1.004

1.001

0.998

0.996

°

TA − Free-Air Temperature − °C

5 4

2

0

0 100 200 300 400 500 600

− Minimum Pulse Duration at

7

9

10

700 800 900 1000

8

6

3

1

SENSE − Threshold Overdrive − mV

t

w

V

sense −

sµ

VDD = 6V MR = Open

−400

−500

−700

−900

−1−0.5 0 1 1.5 2.5 3

− Input Current −

−200

−100

100

3.5 4 5.5 6.5

0

−300

−600

−800

0.5 2

4.5

5 6

VI − Input Voltage at MR

− V

I

Aµ

VDD = 6V TA = 25°C

TPS3307-18 , TPS3307-25 , TPS3307-33

SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006

Typical Characteristics

NORMALIZED SENSE THRESHOLD VOLTAGE SUPPLY CURRENT

vs vs

FREE-AIR TEMPERATURE AT V

DD

Figure 2. Figure 3.

INPUT CURRENT MINIMUM PULSE DURATION AT SENSE

vs vs

INPUT VOLTAGE AT MR THRESHOLD OVERDRIVE

SUPPLY VOLTAGE

8

Figure 4. Figure 5.

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1

0.5

0

0 −0.5 −1 −1.5 −2 −2.5 −3

− High-Level Output Voltage − V

1.5

2

2.5

−3.5 −4 −5 −6−4.5 −5.5

IOH − High-Level Output Current − mA

V

OH

85°C

−40°C

VDD = 2V MR = Open

− High-Level Output Voltage − V

IOH − High-Level Output Current − mA

V

OH

3.5 3

2

0

0 −5 −10 −15 −20 −25 −30

4.5

6

6.5

−35 −40 −45 −50

85°C

−40°C

5.5 5

4

2.5

1.5 1

0.5

VDD = 6V MR = Open

85°C

−40°C

VDD = 2V MR = Open

1

0.5

0

0 0.5 1 1.5 2 3 3.5

− Low-Level Output Voltage − V

1.5

2

2.5

4 4.5 5.5 62.5 5

IOL − Low-Level Output Current − mA

V

OL

3.5 3

1.5

0

0 5 10 15 20 30 35

4.5

5.5

6.5

40 50 55 60

85°C

−40°C

VDD = 6V MR = Open

− Low-Level Output Voltage − V

IOL − Low-Level Output Current − mA

V

OL

6

5

4

2.5 2

1

0.5

25 45

Typical Characteristics (continued)

TPS3307-18 , TPS3307-25 , TPS3307-33

SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006

HIGH-LEVEL OUTPUT VOLTAGE HIGH-LEVEL OUTPUT VOLTAGE HIGH-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT CURRENT

LOW-LEVEL OUTPUT VOLTAGE LOW-LEVEL OUTPUT VOLTAGE

LOW-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT CURRENT

vs vs

Figure 6. Figure 7.

vs vs

Figure 8. Figure 9.

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PACKAGE OPTION ADDENDUM

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PACKAGING INFORMATION

Orderable Device Status

TPS3307-18D ACTIVE SOIC D 8 75 Green (RoHS &

TPS3307-18DG4 ACTIVE SOIC D 8 75 Green (RoHS &

TPS3307-18DGN ACTIVE MSOP-

TPS3307-18DGNG4 ACTIVE MSOP-

TPS3307-18DGNR ACTIVE MSOP-

TPS3307-18DGNRG4 ACTIVE MSOP-

TPS3307-18DR ACTIVE SOIC D 8 2500 Green (RoHS &

TPS3307-18DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

TPS3307-25D ACTIVE SOIC D 8 75 Green (RoHS &

TPS3307-25DG4 ACTIVE SOIC D 8 75 Green (RoHS &

TPS3307-25DGN ACTIVE MSOP-

TPS3307-25DGNG4 ACTIVE MSOP-

TPS3307-25DGNR ACTIVE MSOP-

TPS3307-25DGNRG4 ACTIVE MSOP-

TPS3307-25DR ACTIVE SOIC D 8 2500 Green (RoHS &

TPS3307-25DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

TPS3307-33D ACTIVE SOIC D 8 75 Green (RoHS &

TPS3307-33DG4 ACTIVE SOIC D 8 75 Green (RoHS &

TPS3307-33DGN ACTIVE MSOP-

TPS3307-33DGNG4 ACTIVE MSOP-

TPS3307-33DGNR ACTIVE MSOP- DGN 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

(1)

Package

Type

Power

PAD

Power

PAD

Power

PAD

Power

PAD

Power

PAD

Power

PAD

Power

PAD

Power

PAD

Power

PAD

Power

PAD

Package Drawing

DGN 8 80 Green (RoHS &

DGN 8 2500 Green (RoHS &

DGN 8 80 Green (RoHS &

DGN 8 2500 Green (RoHS &

DGN 8 80 Green (RoHS &

Pins Package

Qty

Eco Plan

no Sb/Br)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

18-Sep-2008

(3)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

TPS3307-33DGNRG4 ACTIVE MSOP-

TPS3307-33DR ACTIVE SOIC D 8 2500 Green (RoHS &

TPS3307-33DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(1)

Package

Type

Power

PAD

Power

PAD

Package Drawing

DGN 8 2500 Green (RoHS &

Pins Package

Qty

Eco Plan

no Sb/Br)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

18-Sep-2008

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TPS3307-18, TPS3307-33 :

Automotive: TPS3307-18-Q1

•

Enhanced Product: TPS3307-18-EP, TPS3307-33-EP

•

Military: TPS3307-18M

•

NOTE: Qualified Version Definitions:

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

•

Enhanced Product - Supports Defense, Aerospace and Medical Applications

•

Military - QML certified for Military and Defense Applications

•

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 17-Apr-2009

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type

TPS3307-18DGNR MSOP-

Power

TPS3307-18DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

TPS3307-25DGNR MSOP-

Power

TPS3307-25DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

TPS3307-33DGNR MSOP-

Power

TPS3307-33DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

PAD

Package Drawing

Pins SPQ Reel

Diameter

(mm)

DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 17-Apr-2009

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS3307-18DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0

TPS3307-18DR SOIC D 8 2500 346.0 346.0 29.0

TPS3307-25DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0

TPS3307-25DR SOIC D 8 2500 346.0 346.0 29.0

TPS3307-33DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0

TPS3307-33DR SOIC D 8 2500 346.0 346.0 29.0

Pack Materials-Page 2

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TEXAS INSTRUMENTS TPS3307 Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

TYPICAL APPLICATIONS

DESCRIPTION

Function/Truth Tables

TPS3307Y Chip Information

Absolute Maximum Ratings

Dissipation Rating Table

Recommended Operating Conditions

Electrical Characteristics

Timing Requirements

Switching Characteristics

Typical Characteristics